CH539258A - Wärmerohr - Google Patents
WärmerohrInfo
- Publication number
- CH539258A CH539258A CH609772A CH609772A CH539258A CH 539258 A CH539258 A CH 539258A CH 609772 A CH609772 A CH 609772A CH 609772 A CH609772 A CH 609772A CH 539258 A CH539258 A CH 539258A
- Authority
- CH
- Switzerland
- Prior art keywords
- heat pipe
- pipe
- heat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712120475 DE2120475A1 (de) | 1971-04-27 | 1971-04-27 | Wärmerohr |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH539258A true CH539258A (de) | 1973-07-15 |
Family
ID=5806009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH609772A CH539258A (de) | 1971-04-27 | 1972-04-26 | Wärmerohr |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3840069A (de) |
| CH (1) | CH539258A (de) |
| DE (1) | DE2120475A1 (de) |
| NL (1) | NL7205382A (de) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4129181A (en) * | 1977-02-16 | 1978-12-12 | Uop Inc. | Heat transfer surface |
| DE2919188C2 (de) * | 1979-05-12 | 1986-10-30 | Süddeutsche Kühlerfabrik Julius Fr. Behr GmbH & Co KG, 7000 Stuttgart | Verfahren zur Behandlung einer Oberfläche einer metallischen Wand für die Übertragung von Wärme und dessen Anwendung |
| DE3613802A1 (de) * | 1986-04-24 | 1987-10-29 | Dornier System Gmbh | Integrierter kapillarverdampfer als waermeaufnehmendes element eines thermalkreislaufs |
| US4765396A (en) * | 1986-12-16 | 1988-08-23 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polymeric heat pipe wick |
| US4885129A (en) * | 1988-10-24 | 1989-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks |
| US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
| USH971H (en) * | 1988-10-24 | 1991-10-01 | The United States Of America As Represented By The Secretary Of The Air Force | Regidized porous material and method |
| US4929414A (en) * | 1988-10-24 | 1990-05-29 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks and arteries |
| US4883116A (en) * | 1989-01-31 | 1989-11-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ceramic heat pipe wick |
| US5386143A (en) * | 1991-10-25 | 1995-01-31 | Digital Equipment Corporation | High performance substrate, electronic package and integrated circuit cooling process |
| US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US6896039B2 (en) * | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| ES2371726T3 (es) * | 2001-08-28 | 2012-01-09 | Advanced Materials Technologies Pte. Ltd. | Conjunto microelectrónico avanzado de disipación de calor y método para su fabricación. |
| US6981543B2 (en) * | 2001-09-20 | 2006-01-03 | Intel Corporation | Modular capillary pumped loop cooling system |
| US6994152B2 (en) * | 2003-06-26 | 2006-02-07 | Thermal Corp. | Brazed wick for a heat transfer device |
| US20050247435A1 (en) * | 2004-04-21 | 2005-11-10 | Hul-Chun Hsu | Wick structure of heat pipe |
| US20060243426A1 (en) * | 2004-04-21 | 2006-11-02 | Hul-Chun Hsu | Wick Structure of Heat Pipe |
| US7011145B2 (en) * | 2004-07-12 | 2006-03-14 | Industrial Technology Research Institute | Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device |
| US6997244B2 (en) * | 2004-07-16 | 2006-02-14 | Hsu Hul-Chun | Wick structure of heat pipe |
| US7828046B2 (en) * | 2004-07-21 | 2010-11-09 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
| US20060175044A1 (en) * | 2005-02-10 | 2006-08-10 | Chin-Wei Lee | Heat dissipating tube sintered with copper powders |
| CN100417908C (zh) * | 2005-09-16 | 2008-09-10 | 富准精密工业(深圳)有限公司 | 热管、烧结成型该热管毛细结构的粉体及方法 |
| TWI317414B (en) * | 2005-10-21 | 2009-11-21 | Foxconn Tech Co Ltd | Sintered heat pipe and method for manufacturing the same |
| CN100453956C (zh) * | 2005-11-01 | 2009-01-21 | 富准精密工业(深圳)有限公司 | 烧结式热管 |
| US20080245510A1 (en) * | 2005-11-04 | 2008-10-09 | Delta Electronics, Inc. | Heat dissipation apparatus, two-phase heat exchange device and manufacturing method thereof |
| CN101408301B (zh) * | 2007-10-10 | 2012-09-19 | 富准精密工业(深圳)有限公司 | 带有散热装置的发光二极管灯具 |
| AT521573B1 (de) * | 2018-08-29 | 2020-12-15 | Miba Emobility Gmbh | Wärmetransportvorrichtung |
| CN111761049B (zh) * | 2019-04-01 | 2022-08-05 | 广州力及热管理科技有限公司 | 一种用于制作均温板中毛细结构的金属浆料 |
| TWI708919B (zh) * | 2019-10-31 | 2020-11-01 | 建準電機工業股份有限公司 | 均溫板及其毛細薄片 |
| EP4019252A1 (de) * | 2020-12-23 | 2022-06-29 | ABB Schweiz AG | Wärmeübertragungsvorrichtung und verfahren zur herstellung einer solchen vorrichtung |
| WO2022230922A1 (ja) * | 2021-04-28 | 2022-11-03 | 古河電気工業株式会社 | 蒸発部構造及び蒸発部構造を備えた熱輸送部材 |
| US20240240874A1 (en) * | 2023-01-18 | 2024-07-18 | Cisco Technology, Inc. | Multiple wick section heatpipe for effective heat transfer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3519067A (en) * | 1967-12-28 | 1970-07-07 | Honeywell Inc | Variable thermal conductance devices |
| US3525670A (en) * | 1968-12-17 | 1970-08-25 | Atomic Energy Commission | Two-phase fluid control system |
| US3613778A (en) * | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
| US3661202A (en) * | 1970-07-06 | 1972-05-09 | Robert David Moore Jr | Heat transfer apparatus with improved heat transfer surface |
-
1971
- 1971-04-27 DE DE19712120475 patent/DE2120475A1/de active Pending
-
1972
- 1972-04-20 US US00245821A patent/US3840069A/en not_active Expired - Lifetime
- 1972-04-21 NL NL7205382A patent/NL7205382A/xx unknown
- 1972-04-26 CH CH609772A patent/CH539258A/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE2120475A1 (de) | 1972-11-02 |
| NL7205382A (de) | 1972-10-31 |
| US3840069A (en) | 1974-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |