CH539258A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
CH539258A
CH539258A CH609772A CH609772A CH539258A CH 539258 A CH539258 A CH 539258A CH 609772 A CH609772 A CH 609772A CH 609772 A CH609772 A CH 609772A CH 539258 A CH539258 A CH 539258A
Authority
CH
Switzerland
Prior art keywords
heat pipe
pipe
heat
Prior art date
Application number
CH609772A
Other languages
German (de)
Inventor
Fischer Wilfried Dr Dipl-Phys
Gregor Dipl Phys Gammel
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH539258A publication Critical patent/CH539258A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Powder Metallurgy (AREA)
CH609772A 1971-04-27 1972-04-26 Heat pipe CH539258A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712120475 DE2120475A1 (en) 1971-04-27 1971-04-27 Heat pipe

Publications (1)

Publication Number Publication Date
CH539258A true CH539258A (en) 1973-07-15

Family

ID=5806009

Family Applications (1)

Application Number Title Priority Date Filing Date
CH609772A CH539258A (en) 1971-04-27 1972-04-26 Heat pipe

Country Status (4)

Country Link
US (1) US3840069A (en)
CH (1) CH539258A (en)
DE (1) DE2120475A1 (en)
NL (1) NL7205382A (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129181A (en) * 1977-02-16 1978-12-12 Uop Inc. Heat transfer surface
DE2919188C2 (en) * 1979-05-12 1986-10-30 Süddeutsche Kühlerfabrik Julius Fr. Behr GmbH & Co KG, 7000 Stuttgart Method for treating a surface of a metallic wall for the transfer of heat and its application
DE3613802A1 (en) * 1986-04-24 1987-10-29 Dornier System Gmbh INTEGRATED CAPILLARY EVAPORATOR AS A HEAT-RECOVERING ELEMENT OF A THERMAL CIRCUIT
US4765396A (en) * 1986-12-16 1988-08-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polymeric heat pipe wick
USH971H (en) * 1988-10-24 1991-10-01 The United States Of America As Represented By The Secretary Of The Air Force Regidized porous material and method
US4929414A (en) * 1988-10-24 1990-05-29 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks and arteries
US4885129A (en) * 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US5101560A (en) * 1988-10-24 1992-04-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making an anisotropic heat pipe and wick
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
ATE512462T1 (en) * 2001-08-28 2011-06-15 Advanced Materials Tech MICROELECTRONIC HEAT DISSIPATION HOUSING AND PRODUCTION PROCESS THEREOF
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
US20050247435A1 (en) * 2004-04-21 2005-11-10 Hul-Chun Hsu Wick structure of heat pipe
US20060243426A1 (en) * 2004-04-21 2006-11-02 Hul-Chun Hsu Wick Structure of Heat Pipe
US7011145B2 (en) * 2004-07-12 2006-03-14 Industrial Technology Research Institute Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device
US6997244B2 (en) * 2004-07-16 2006-02-14 Hsu Hul-Chun Wick structure of heat pipe
CA2574200A1 (en) * 2004-07-21 2006-01-26 Xiao Huang Hybrid wicking materials for use in high performance heat pipes
US20060175044A1 (en) * 2005-02-10 2006-08-10 Chin-Wei Lee Heat dissipating tube sintered with copper powders
CN100417908C (en) * 2005-09-16 2008-09-10 富准精密工业(深圳)有限公司 Heat tube and powder and method for sintering forming the same heat tube capillary structure
TWI317414B (en) * 2005-10-21 2009-11-21 Foxconn Tech Co Ltd Sintered heat pipe and method for manufacturing the same
CN100453956C (en) * 2005-11-01 2009-01-21 富准精密工业(深圳)有限公司 Sintering type heat pipe
US20080245510A1 (en) * 2005-11-04 2008-10-09 Delta Electronics, Inc. Heat dissipation apparatus, two-phase heat exchange device and manufacturing method thereof
CN101408301B (en) * 2007-10-10 2012-09-19 富准精密工业(深圳)有限公司 LED lamps with heat sink
AT521573B1 (en) * 2018-08-29 2020-12-15 Miba Emobility Gmbh Heat transfer device
CN111761049B (en) * 2019-04-01 2022-08-05 广州力及热管理科技有限公司 Metal paste for manufacturing capillary structure in uniform temperature plate
TWI708919B (en) * 2019-10-31 2020-11-01 建準電機工業股份有限公司 Temperature-uniformizing board and capillary thin film
EP4019252A1 (en) * 2020-12-23 2022-06-29 ABB Schweiz AG Heat-transfer device and method to produce such a device
CN221223475U (en) * 2021-04-28 2024-06-25 古河电气工业株式会社 Evaporation part structure and heat transport member provided with evaporation part structure
US20240240874A1 (en) * 2023-01-18 2024-07-18 Cisco Technology, Inc. Multiple wick section heatpipe for effective heat transfer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519067A (en) * 1967-12-28 1970-07-07 Honeywell Inc Variable thermal conductance devices
US3525670A (en) * 1968-12-17 1970-08-25 Atomic Energy Commission Two-phase fluid control system
US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3661202A (en) * 1970-07-06 1972-05-09 Robert David Moore Jr Heat transfer apparatus with improved heat transfer surface

Also Published As

Publication number Publication date
US3840069A (en) 1974-10-08
DE2120475A1 (en) 1972-11-02
NL7205382A (en) 1972-10-31

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Legal Events

Date Code Title Description
PL Patent ceased