US3835434A - Ptc resistor package - Google Patents
Ptc resistor package Download PDFInfo
- Publication number
- US3835434A US3835434A US00366931A US36693173A US3835434A US 3835434 A US3835434 A US 3835434A US 00366931 A US00366931 A US 00366931A US 36693173 A US36693173 A US 36693173A US 3835434 A US3835434 A US 3835434A
- Authority
- US
- United States
- Prior art keywords
- package
- metal
- ptc resistor
- contact
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 49
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000010292 electrical insulation Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 9
- 238000009413 insulation Methods 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 239000005041 Mylar™ Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229920006334 epoxy coating Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
Definitions
- the body is sandwiched between two paddle-shaped metal plates making intimate electrical 52 us. 01. 338/22, 29/613 and thermal eenieet therewith
- the handle-shaped 51 hit. or H0lc 7/04 Portions of the Plates extend radially from the Package [58 Field or Search 338/22, 23, 24, 25; and serve as P yp terminals
- This assembly is 317/40 4 29/612 613 further sandwiched between broad thin layers of insulative material.
- This double sandwich structure is held [56] References Cited in the recess of a hat-shaped metal bracket to which UNITED STATES PATENTS the top insulation layer is adhered.
- the bottom insulation layer adheres to a metal disc that is approximately at;
- This invention relates to a thermally conducting package for a resistor component and more particularly to a package for a positive temperature coefficient (PTC) resistor.
- PTC positive temperature coefficient
- PTC resistor bodies normally consist of doped barium titanate bodies to which electrodes are attached.
- the resistance of the body remains relatively constant as the body temperature increases until the so-called anomaly temperature is reached.
- This anomaly temperature is a characterisitc of the particular PTC body employed and is a function of its formulation.
- a further increase in temperature causes the body resistance to increase sharply, typically three or four order of magnitude. It is well known to use such PTC resistors as temperature sensors or as self regulating heaters with a constant voltage applied.
- the need for intimate thermal connection between a PTC resistor and the machine or thing whose temperature is to be sensed or controlled, is much greater than for a simple electrical resistor or a resistive heating element.
- the goal is to keep the PTC resistor at the same temperature as the machine whereas for the simpler resistors the primary goal is to prevent the resistor from exceeding a temperature that will damage it.
- a PTC resistor body is metallized on two opposite and parallel surfaces, which surfaces have areas that taken together are greater than half the total surface area of the PTC body.
- the body is sandwiched between two electrodes making intimate electrical and thermal contact therewith.
- the electrodes are comprised of metal plates having extensions that exend radially from 0 the package and serve as electrical terminals that are capable of being connected by standard press-on type connectors.
- This assembly is further sandwiched between layers of insulative material.
- This electrically insulated double sandwich structure is contacted by a thermally conductive housing or bracket that may further comprise or may be itself the machine or thing whose temperature is to be sensed.
- the insulative layers provide electrical insulation, a broad thermal path, and a widely distributed mechanical connection between the PTC resistor body and the housing.
- This package is capable of being simply mounted to a flat surface in intimate thermal connection therewith.
- FIG. 1 a top view of a PTC resistor package, representing preferred embodiments of this invention.
- FIG. 2 is shown a sectional view of the package, taken in section 22 as indicated in FIG. 1.
- FIG. 3 is shown a sectional view of the package, taken in section 33 as indicated in FIG. 2.
- FIG. 1 is shown the top view of the PTC resistor package of this invention.
- FIG. 2 is shown in cross section the section 2-2 as indicated in FIG. 1.
- the PTC resistor body 10 has a cylindrical shape, and a top and bottom surface that are mutually parallel. These surfaces each have metallized films 11 and 12 deposited thereon.
- Adjacent to Him 12 is a ping-pong paddleshaped metal plate 14 whose circular portion is concentrically registered with the cylindrical body 10. Furthermore, this plate is flared, forming a shallow cup in which the body 10 is partially contained.
- a second paddle-shaped metal plate 13 having the same dimensions as plate 14, lies adjacent to the film 11 and is concentrically registered with the cylindrical body 10.
- the plates 13 and 14 are reflow soldered to the metallized surfaces of the PTC resistor body 10.
- Each metallized surface and adjacent plate comprises one of the electrodes of the PTC resistor.
- the handle or extended portion 18 of plate 14 extends away from the body radially, and the handle or extended portion 19 of plate 13 also extends away from the body radially but in the opposite direction.
- An insulative layer 16 adheres to the outer or bottom face (as shown in FIG. 2) of the bottom electrode being comprised of metallized surface 12 and metal plate 14. Similarly an insulative layer 15 adheres to the outer or top face of the top electrode being comprised of metallized surface 11 and metal plate 13.
- a metal disc 22 having a diameter greater than the circular portions of the metal plates 14 and 13 is adhered to the insulative layer 16.
- the disc 22 is registed or essentially centered with respect to the body and circular portions of plates 13 and 14. 3
- a formed metal bracket 21, having a hat-like shape in profile fits over the above described assembly.
- the top inside surface of the bracket 21 (as shown in FIG. 2) is adhered to the insulative layer 15.
- the assembly is so positioned in the concave region of the bracket 21 that disc 22 is substantially flush with the brim portions of the hat-shaped bracket.
- the disc protrude slightly beyond the flush position (downward as seen in FIG. 2), so that when the package is mounted to a machine, the disc is in good pressure contact with a flat surface of the machine being held so in attachment by the brim of the bracket.
- the bracket 13 is thus slightly bent to provide the needed compressive force.
- Holes, such as 23 and 24 may be provided in the brim of the bracket 21, facilitating the use of mounting fasteners.
- the extended portions 18 and 19 of plates 14 and 13, respectively, are designed to serve as the PTC resistor terminals. They are preformed so as to be suitable for I connecting with a standard-press-on type connector.
- FIG. 3 is shown a sectional view as indicated in FIG. 2 by section 3-3.
- the complete paddle shaped outline of the plate 14 is shown in FlG. 3 including its extended or handle portion 18 that serves as a terminal lead.
- the PTC resistor body is of a well known composition of doped barium titanate and has an anomaly temperature of about l25 C. It has a thickness of 0.25 inches and a diameter of 1.25 inches.
- lts top and bottom surfaces are metallized by applying palladium, zinc and silver as taught in U.S. letters Pat. No. 3,716,407 by M. Kahn, filed Sept. 23, 1969. These metallized surfaces are solder coated by applying solder to the heated body 10. A 60 percent tin 40 percent lead solder will be suitable when the package operating tem peratures will not exceed about 180 C.
- the metal plates are made of brass.
- the brass may be stamped from sheet metal stock of about 0.020 inch thickness and is coated at least on one side with solder.
- the flared perimeter may be formed in a die press leaving a shallow cavity whose diameter is equal to or slightly larger than the diameter of the PTC resistor body.
- the shallow cup-like cavity serves to register the plates 13 and 14 with the body 10.
- the plates are reflow solder connected to the metallized surface of the PTC body.
- the insulation layers consist of MYLAR having an adhesive coating on both sides.
- the MYLAR layer has a thickness of about 0.002 inch, but may be as thin as 0.0005 inch. (MYLAR is a tradename of the E. l. Du- Pont Co.)
- the bracket 21 and disc 22 are formed from 0.030 inch sheet aluminum and have smooth surfaces so as to avoid distortion of the adjacent insulative layers and so that the smooth bottom surface of the disc will provide good thermal contact to its mounting surface.
- the disc will contact the mounting surface first and when the bracket is fastened to the mounting surface, the bracket bends slightly, maintaining a spring pressure on the stack and the interface between the disc and the mounting surface.
- the insulative layer is bonded to the plate 13 and to the bracket 21 by means of an epoxy resin.
- insulative layer 16 is bonded to the plate 14 and the disc 22.
- the PT C resistor body 10 having a smooth coating of solder or other conductive metal on either side in regions 11 and 12, is registered and pressed within the cup-like cavities of the flared elements 13 and 14.
- the body 10 is not reflow soldered, in this second preferred embodiment, to plates 13 and 14, but rather is held in compression and in intimate electrical and thermal contact with the adjacent plates when the package is mounted to the flat surface of a machine. Electrically and thermally.
- conductive grease can be used to help assure intimate thermal contact between the PTC body 10 and the plates 13 and 14.
- Silicone grease being loaded with electrically conducting particles such as carbon or silver particles is used for this purpose.
- the terminals l8 and 19 are capable of withstanding the physical forces exerted when mechanical press-on type connectors are fastened thereto, by virtue of the bonded insulative layers and the high starting friction connection between the disc and mounting surface held in compression.
- the package of this invention provides an excellent thermal coupling between the electrically insulated PTC resistor body and a flat surface of a machine to which it may be mounted.
- the diameter to thickness ratio of the cylindrical body is made greater than 2, then over 50 percent of the total surface of the body is advantageously in direct thermal contact with the electrodes.
- the large contact areas of the insulation layers in turn provide a low resistance thermal path to the disc and the bracket.
- the bracket brim and the disc then provide large surface areas of contact with a mounting surface.
- This package presents a structure requiring a few simple well known steps in manufacture.
- the package is, furthermore, simple to mount and electrically connect.
- a key feature of the package of this invention is its simple rugged terminals, 18 and 19, that are suitable for connection by a normal quick disconnect or press-on type electrical connector.
- the large area of contact between the PTC resistor body 10 and the elements l3 and 14, broadly distribute the mechanical loading due to the large shear forces that may be exerted between these parts when a stiff connector is being pressed on a terminal. In addition some of this force is also shared by the large surface contact between the insulating layers and the metal elements. This force is passed on to the bracket and to the disc which is in compressed contact with a mounting surface.
- the insulative layers serve three important roles, providing collectively a low resistance thermal path, providing high electrical insulation resistance, and providing a widely dispersed mechanical connection.
- the insulative layers and 16 are in intimate thermal contact with the entire outer sides of the metal plates 13 and 14, respectively.
- the plates 13 and 14 may be substantially larger than the PTC body 10.
- the insulative layers 15 and 16 are correspondingly enlarged as is the bracket 21 and disc 22.
- the advantage of this construction is to further improve the thermal transfer efficiency by providing an even larger surface area and lower thermal resistance of the insulative layers 15 and 16.
- the layers are made thick enough to provide adequate electrical insulation between the metal plates and the bracket or disc. Typical voltages are 110 VAC and 220 VAC at 60Hz and typical plastic insulator materials can withstand more than 1,000 volts per mil.
- the insulation layers are made thin so as to minimize the thermal resistance between the electrodes and the bracket or disc.
- the insulave layers may be formed by applying a liquid insulative bonding material to the other sides of the plates, pressing the bracket and disc in place and curing the bonding material.
- the insulative layers may consist of a plastic tape having an adhesive applied to both sides, such as a B-stage epoxy coating. Upon suitable heating, such coatings first soften, then set and finally cure.
- a wide variety of insulative materials will be suitable for use as the insulative layers.
- a polyimide resin such as KAPTON will be effective especially for high temperatures. (KAPTON is a trademark of the E. l. Du- Pont Co.).
- a berylia or alumina layer could be used whereby its bonding to bracket 21, PTC body 10 and disc 22 could be achieved by metallizing the layers and refiow soldering thereto.
- the bracket, plates and disc may be made of sheet steel. Also the user has the option of varying the position of the terminal 19 relative to terminal 18 to suit his particular spacial requirements.
- the disc 22 may be conveniently omitted when the machine surface to which the package is to be mounted is properly flat and v smooth.
- the bottom insulating layer 16 (as seen in FIG. 2) will be made to lie in about the same plane with the brim portion of the bracket 21 such that both lie flush with the flat metal mounting surface of the machine.
- bracket and disc may be replaced by a single thermally conducting metal part, having a cavity into which the electrically insulated and electroded PTC resistor may be fitted. These two parallel faces of the cavity would lie in intimate thermal contact with the insulative layers of the resistor assembly. Further, this single thermally conductive housing or part may be an integral part of the machine whose temperature is to be controlled or monitored by the PTC resistor.
- a PTC resistor package comprising:
- a PTC resistor body having two essentially parallel surfaces, the area of said two parallel surfaces taken together being greater than half the total surface area of said PTC resistor body;
- first and second electrodes each lying adjacent to and in intimate thermal and electrical contact with essentially the entire area of one of said surfaces;
- first and second insulative layers lying adjacent to and in intimate thermal contact with the outer sides of said first and second electrodes, respectively;
- a metal housing having a cavity into which said PTC resistor body is fitted, said first and second insulative layers lying adjacent to and in intimate thermal contact with two inner faces, respectively, of said metal housing, such that said layers provide electrical insulation and intimate thermal contact between each of said electrodes and said housing;
- connectivemeans for mounting and making thermal connection between said housing to a flat surface or an object whose temperature is to be regulated or sensed.
- each of said electrodes is comprised of a metal film deposited on one of said parallel surfaces, and a metal plate lying adjacent thereto in intimate thermal and electrical contact with said film.
- the package of claim 3 further comprising a means for causing a compressive force between each said metal plate and said intimately contacting metal film, whereby said thermal and electrical contact is achieved therebetween.
- said metal housing is comprised of a sheet metal part having a hat shape in profile; and a sheet metal disc shaped part, said hat shaped part containing said body, the brim portions of said hat shaped part being approximately in the same plane as said disc shaped part, such that said package may be connected by said brim portion and thus mounted in intimate thermal contact with a flat portion of a machine.
- said means comrises said brim portion of said housing having a plurality of holes therein for fastener mounting to said flat surface of said object.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00366931A US3835434A (en) | 1973-06-04 | 1973-06-04 | Ptc resistor package |
| CA200,369A CA988627A (en) | 1973-06-04 | 1974-05-21 | Ptc resistor package |
| JP6277474A JPS5728922B2 (enExample) | 1973-06-04 | 1974-06-03 | |
| GB2476774A GB1457036A (en) | 1973-06-04 | 1974-06-04 | Resistors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00366931A US3835434A (en) | 1973-06-04 | 1973-06-04 | Ptc resistor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3835434A true US3835434A (en) | 1974-09-10 |
Family
ID=23445203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00366931A Expired - Lifetime US3835434A (en) | 1973-06-04 | 1973-06-04 | Ptc resistor package |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3835434A (enExample) |
| JP (1) | JPS5728922B2 (enExample) |
| CA (1) | CA988627A (enExample) |
| GB (1) | GB1457036A (enExample) |
Cited By (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3955170A (en) * | 1974-11-29 | 1976-05-04 | Texas Instruments Incorporated | Solid state switch |
| US3958208A (en) * | 1974-06-05 | 1976-05-18 | Texas Instruments Incorporated | Ceramic impedance device |
| US3976854A (en) * | 1974-07-31 | 1976-08-24 | Matsushita Electric Industrial Co., Ltd. | Constant-temperature heater |
| US4037082A (en) * | 1976-04-30 | 1977-07-19 | Murata Manufacturing Co., Ltd. | Positive temperature coefficient semiconductor heating device |
| US4037316A (en) * | 1974-09-23 | 1977-07-26 | General Electric Company | Method of assembling temperature responsive resistance member |
| FR2350032A1 (fr) * | 1976-04-30 | 1977-11-25 | Murata Manufacturing Co | Dispositif chauffant a semiconducteur a coefficient de temperature positif |
| US4147927A (en) * | 1975-04-07 | 1979-04-03 | U.S. Philips Corporation | Self-regulating heating element |
| US4164000A (en) * | 1977-08-31 | 1979-08-07 | General Electric Company | Relay-starter electrical device for a prime mover |
| US4230935A (en) * | 1978-02-14 | 1980-10-28 | Siemens Aktiengesellschaft | Immersion heater |
| US4241494A (en) * | 1978-11-13 | 1980-12-30 | General Electric Company | Method of assembling an electrical device |
| US4267635A (en) * | 1976-05-03 | 1981-05-19 | Texas Instruments Incorporated | Method of making a solid state electrical switch |
| US4324974A (en) * | 1978-08-16 | 1982-04-13 | Bosch-Siemens Hausgerage GmbH | Heating element assembly with a PTC electric heating element |
| US4327282A (en) * | 1978-10-21 | 1982-04-27 | Firma Fritz Eichenauer | Electrical resistance heating element |
| US4341949A (en) * | 1979-08-07 | 1982-07-27 | Bosch-Siemens Hausgerate Gmbh | Electrical heating apparatus with a heating element of PTC material |
| US4401885A (en) * | 1980-10-08 | 1983-08-30 | Nippon Valqua Kogyo Kabushiki Kaisha | Planar heat generating device |
| US4458137A (en) * | 1981-04-09 | 1984-07-03 | Rosemount Inc. | Electric heater arrangement for fluid flow stream sensors |
| DE3506759C1 (de) * | 1985-02-26 | 1986-09-18 | Türk & Hillinger GmbH, 7200 Tuttlingen | Selbstregelnder, elektrischer Heizkörper |
| US5058197A (en) * | 1990-04-02 | 1991-10-15 | Emerson Electric Co. | Heater apparatus for fluid medium in a hermetically sealed chamber |
| US5372427A (en) * | 1991-12-19 | 1994-12-13 | Texas Instruments Incorporated | Temperature sensor |
| WO1995007540A1 (de) * | 1993-09-09 | 1995-03-16 | Siemens Aktiengesellschaft | Limiter zur strombegrenzung |
| US5688424A (en) * | 1949-03-12 | 1997-11-18 | Murata Manufacturing Co., Ltd. | PTC thermistor |
| US5841111A (en) * | 1996-12-19 | 1998-11-24 | Eaton Corporation | Low resistance electrical interface for current limiting polymers by plasma processing |
| US5852397A (en) * | 1992-07-09 | 1998-12-22 | Raychem Corporation | Electrical devices |
| US5864281A (en) * | 1994-06-09 | 1999-01-26 | Raychem Corporation | Electrical devices containing a conductive polymer element having a fractured surface |
| US6150918A (en) * | 1995-05-03 | 2000-11-21 | Bc Components Holdings B.V. | Degaussing unit comprising one or two thermistors |
| US6172303B1 (en) | 1998-05-12 | 2001-01-09 | Yazaki Corporation | Electrical terminal with integral PTC element |
| US6292088B1 (en) | 1994-05-16 | 2001-09-18 | Tyco Electronics Corporation | PTC electrical devices for installation on printed circuit boards |
| US6411776B1 (en) * | 1997-06-18 | 2002-06-25 | Dbk Espana, S.A. | Electric heating device with emission of active substances |
| US6411191B1 (en) * | 2000-10-24 | 2002-06-25 | Eaton Corporation | Current-limiting device employing a non-uniform pressure distribution between one or more electrodes and a current-limiting material |
| US20020162214A1 (en) * | 1999-09-14 | 2002-11-07 | Scott Hetherton | Electrical devices and process for making such devices |
| US6640420B1 (en) | 1999-09-14 | 2003-11-04 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| US20060131068A1 (en) * | 2004-12-16 | 2006-06-22 | Rodriguez Edward T | Surface mounted resistor with improved thermal resistance characteristics |
| WO2008111101A1 (en) * | 2007-03-13 | 2008-09-18 | Rotfil S.R.L. | Cartridge heater |
| US20110183162A1 (en) * | 2004-03-15 | 2011-07-28 | Tyco Electronics Corporation | Surface Mountable PPTC Device with Integral Weld Plate |
| CN109424416A (zh) * | 2017-08-31 | 2019-03-05 | 现代自动车株式会社 | 用于电动车辆的冷却水加热装置 |
| US20190228887A1 (en) * | 2018-01-23 | 2019-07-25 | Biotronik Se & Co. Kg | Electrical resistor, in particular for medical implants |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125685U (ja) * | 1983-02-14 | 1984-08-24 | 柴田 貞之 | ホ−スの曲折防止補助具 |
| JPS63101336U (enExample) * | 1987-11-20 | 1988-07-01 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2769071A (en) * | 1953-04-10 | 1956-10-30 | Frank L Ward | Bridge balancing devices |
| US3121852A (en) * | 1960-04-18 | 1964-02-18 | Gen Motors Corp | Ohmic contacts on semiconductors |
| US3138686A (en) * | 1961-02-01 | 1964-06-23 | Gen Electric | Thermal switch device |
| US3697863A (en) * | 1971-01-04 | 1972-10-10 | Texas Instruments Inc | Overcurrent protection system and sensor used therewith |
| US3748439A (en) * | 1971-12-27 | 1973-07-24 | Texas Instruments Inc | Heating apparatus |
-
1973
- 1973-06-04 US US00366931A patent/US3835434A/en not_active Expired - Lifetime
-
1974
- 1974-05-21 CA CA200,369A patent/CA988627A/en not_active Expired
- 1974-06-03 JP JP6277474A patent/JPS5728922B2/ja not_active Expired
- 1974-06-04 GB GB2476774A patent/GB1457036A/en not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2769071A (en) * | 1953-04-10 | 1956-10-30 | Frank L Ward | Bridge balancing devices |
| US3121852A (en) * | 1960-04-18 | 1964-02-18 | Gen Motors Corp | Ohmic contacts on semiconductors |
| US3138686A (en) * | 1961-02-01 | 1964-06-23 | Gen Electric | Thermal switch device |
| US3697863A (en) * | 1971-01-04 | 1972-10-10 | Texas Instruments Inc | Overcurrent protection system and sensor used therewith |
| US3748439A (en) * | 1971-12-27 | 1973-07-24 | Texas Instruments Inc | Heating apparatus |
Cited By (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5688424A (en) * | 1949-03-12 | 1997-11-18 | Murata Manufacturing Co., Ltd. | PTC thermistor |
| US3958208A (en) * | 1974-06-05 | 1976-05-18 | Texas Instruments Incorporated | Ceramic impedance device |
| US3976854A (en) * | 1974-07-31 | 1976-08-24 | Matsushita Electric Industrial Co., Ltd. | Constant-temperature heater |
| US4037316A (en) * | 1974-09-23 | 1977-07-26 | General Electric Company | Method of assembling temperature responsive resistance member |
| US3955170A (en) * | 1974-11-29 | 1976-05-04 | Texas Instruments Incorporated | Solid state switch |
| US4147927A (en) * | 1975-04-07 | 1979-04-03 | U.S. Philips Corporation | Self-regulating heating element |
| US4037082A (en) * | 1976-04-30 | 1977-07-19 | Murata Manufacturing Co., Ltd. | Positive temperature coefficient semiconductor heating device |
| FR2350032A1 (fr) * | 1976-04-30 | 1977-11-25 | Murata Manufacturing Co | Dispositif chauffant a semiconducteur a coefficient de temperature positif |
| US4267635A (en) * | 1976-05-03 | 1981-05-19 | Texas Instruments Incorporated | Method of making a solid state electrical switch |
| US4164000A (en) * | 1977-08-31 | 1979-08-07 | General Electric Company | Relay-starter electrical device for a prime mover |
| US4230935A (en) * | 1978-02-14 | 1980-10-28 | Siemens Aktiengesellschaft | Immersion heater |
| US4324974A (en) * | 1978-08-16 | 1982-04-13 | Bosch-Siemens Hausgerage GmbH | Heating element assembly with a PTC electric heating element |
| US4327282A (en) * | 1978-10-21 | 1982-04-27 | Firma Fritz Eichenauer | Electrical resistance heating element |
| US4241494A (en) * | 1978-11-13 | 1980-12-30 | General Electric Company | Method of assembling an electrical device |
| US4341949A (en) * | 1979-08-07 | 1982-07-27 | Bosch-Siemens Hausgerate Gmbh | Electrical heating apparatus with a heating element of PTC material |
| US4401885A (en) * | 1980-10-08 | 1983-08-30 | Nippon Valqua Kogyo Kabushiki Kaisha | Planar heat generating device |
| US4458137A (en) * | 1981-04-09 | 1984-07-03 | Rosemount Inc. | Electric heater arrangement for fluid flow stream sensors |
| DE3506759C1 (de) * | 1985-02-26 | 1986-09-18 | Türk & Hillinger GmbH, 7200 Tuttlingen | Selbstregelnder, elektrischer Heizkörper |
| US5058197A (en) * | 1990-04-02 | 1991-10-15 | Emerson Electric Co. | Heater apparatus for fluid medium in a hermetically sealed chamber |
| US5372427A (en) * | 1991-12-19 | 1994-12-13 | Texas Instruments Incorporated | Temperature sensor |
| US7355504B2 (en) | 1992-07-09 | 2008-04-08 | Tyco Electronics Corporation | Electrical devices |
| US5852397A (en) * | 1992-07-09 | 1998-12-22 | Raychem Corporation | Electrical devices |
| US20040246092A1 (en) * | 1992-07-09 | 2004-12-09 | Graves Gregory A. | Electrical devices |
| US6651315B1 (en) | 1992-07-09 | 2003-11-25 | Tyco Electronics Corporation | Electrical devices |
| US5793278A (en) * | 1993-09-09 | 1998-08-11 | Siemens Aktiengesellschaft | Limiter for current limiting |
| WO1995007540A1 (de) * | 1993-09-09 | 1995-03-16 | Siemens Aktiengesellschaft | Limiter zur strombegrenzung |
| US6292088B1 (en) | 1994-05-16 | 2001-09-18 | Tyco Electronics Corporation | PTC electrical devices for installation on printed circuit boards |
| US5864281A (en) * | 1994-06-09 | 1999-01-26 | Raychem Corporation | Electrical devices containing a conductive polymer element having a fractured surface |
| US6211771B1 (en) | 1994-06-09 | 2001-04-03 | Michael Zhang | Electrical device |
| US6150918A (en) * | 1995-05-03 | 2000-11-21 | Bc Components Holdings B.V. | Degaussing unit comprising one or two thermistors |
| US5841111A (en) * | 1996-12-19 | 1998-11-24 | Eaton Corporation | Low resistance electrical interface for current limiting polymers by plasma processing |
| US6411776B1 (en) * | 1997-06-18 | 2002-06-25 | Dbk Espana, S.A. | Electric heating device with emission of active substances |
| US6172303B1 (en) | 1998-05-12 | 2001-01-09 | Yazaki Corporation | Electrical terminal with integral PTC element |
| US7343671B2 (en) | 1999-09-14 | 2008-03-18 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| US20020162214A1 (en) * | 1999-09-14 | 2002-11-07 | Scott Hetherton | Electrical devices and process for making such devices |
| US6640420B1 (en) | 1999-09-14 | 2003-11-04 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| US20040090304A1 (en) * | 1999-09-14 | 2004-05-13 | Scott Hetherton | Electrical devices and process for making such devices |
| US6854176B2 (en) | 1999-09-14 | 2005-02-15 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| US6411191B1 (en) * | 2000-10-24 | 2002-06-25 | Eaton Corporation | Current-limiting device employing a non-uniform pressure distribution between one or more electrodes and a current-limiting material |
| US8686826B2 (en) * | 2004-03-15 | 2014-04-01 | Tyco Electronics Corporation | Surface mountable PPTC device with integral weld plate |
| US20110183162A1 (en) * | 2004-03-15 | 2011-07-28 | Tyco Electronics Corporation | Surface Mountable PPTC Device with Integral Weld Plate |
| US7286358B2 (en) * | 2004-12-16 | 2007-10-23 | Stackpole Electronic Inc. | Surface mounted resistor with improved thermal resistance characteristics |
| US20060131068A1 (en) * | 2004-12-16 | 2006-06-22 | Rodriguez Edward T | Surface mounted resistor with improved thermal resistance characteristics |
| WO2008111101A1 (en) * | 2007-03-13 | 2008-09-18 | Rotfil S.R.L. | Cartridge heater |
| CN109424416A (zh) * | 2017-08-31 | 2019-03-05 | 现代自动车株式会社 | 用于电动车辆的冷却水加热装置 |
| US10625562B2 (en) * | 2017-08-31 | 2020-04-21 | Hyundai Motor Company | Cooling water heating apparatus for electric vehicle |
| CN109424416B (zh) * | 2017-08-31 | 2021-12-28 | 现代自动车株式会社 | 用于电动车辆的冷却水加热装置 |
| US20190228887A1 (en) * | 2018-01-23 | 2019-07-25 | Biotronik Se & Co. Kg | Electrical resistor, in particular for medical implants |
| US10964459B2 (en) * | 2018-01-23 | 2021-03-30 | Biotronik Se & Co. Kg | Electrical resistor, in particular for medical implants |
Also Published As
| Publication number | Publication date |
|---|---|
| CA988627A (en) | 1976-05-04 |
| GB1457036A (en) | 1976-12-01 |
| JPS5022249A (enExample) | 1975-03-10 |
| JPS5728922B2 (enExample) | 1982-06-19 |
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