US3808478A - Multiple feed-through capacitor and methods of making - Google Patents

Multiple feed-through capacitor and methods of making Download PDF

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Publication number
US3808478A
US3808478A US00383531A US38353173A US3808478A US 3808478 A US3808478 A US 3808478A US 00383531 A US00383531 A US 00383531A US 38353173 A US38353173 A US 38353173A US 3808478 A US3808478 A US 3808478A
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United States
Prior art keywords
protuberances
apertures
plate
capacitor
feed
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US00383531A
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English (en)
Inventor
H Winkler
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Stettner and Co
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Stettner and Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Definitions

  • a ceramic plate is formed with sleeve-like protuber- A 5 1972 G 2238594 ances with an internal aperture, the plate is metalized emany around the sleeve-like protuberances, and feedthrough conductors are placed through the apertures, [52] Cl 317/242 29/2542 47 the metallized coating around the protuberances and [51] Int Cl H01 3/28 the feedthrough conductor forming the capacitance; [58] Fieid 29/35 42 the metalized coating is removed from the zones sur- I 33/79 rounding the terminal ends of the openings, to provide ceramic insulation material between the feed-through [56] References Cited conductors and the metalized coating.
  • the metalized UNITED STATES PATENTS coating may be removed by grinding.
  • the present invention relates to a multiple feedthrough capacitor, particularly for use in electronics, for example to conduct feed-through conductors through shielded enclosures, and to a method of making such capacitors.
  • F eed-through capacitors particularly for multiple use are employed in electronics to permit passage of low frequency signals through the conductors, but to bypass high frequency signals, noise signals, or the like to chassis, or ground, by connecting the feed-through lead to a capacitor, the other side of which is connected to ground.
  • ceramic feed-through capacitors are used, the capacity of which depends on the dielectric material and may be in the range of, for example, about 400pF to 2,000pF.
  • feed-through capacitors, or the printed circuits are then connected together with a support block, or support plate on a carrier, for example a carrier plate to be sealed with respect to high frequency signals within the shielded housing.
  • a support block, or support plate on a carrier for example a carrier plate to be sealed with respect to high frequency signals within the shielded housing.
  • feed-through capacitors to be used with shielded housings are described in German disclosure document 1,439,298; a common socket is used in that construction, in which the feed-through conductors are metallically connected with one metal sheet, or layer, and the conductors are formed at the other ends as connecting pins, or with solder terminals.
  • Small ceramic tubes are used as the dielectric, the tubes being internally and externally silvered, the interior silver coating being soldered to the feed-through conductor.
  • the ceramic tube must be secured within a bore of the mounting block or strip by means of an adhesive first placed into the mounting hole. Thereafter, the ceramic tube must be connected to a metal lead, typically by a screw con- I nection, for example by screwing the outside silvered ceramic sleeve or tube into a metal holder with threads formed in openings therein; and tiny metal discs must then be used to provide contact between the silvered surface and the condenser connection on the said holding block, which, in turn, must be insulated by means of insulation discs or washers so that the feed-through conductor is securely separated from the outer metallic coating.
  • a metal lead typically by a screw con- I nection, for example by screwing the outside silvered ceramic sleeve or tube into a metal holder with threads formed in openings therein; and tiny metal discs must then be used to provide contact between the silvered surface and the condenser connection on the said holding block, which, in turn, must be insulated by means of insulation discs or washers
  • a ceramic plate is formed with sleeve-like protuberances, integral therewith, and at least the surface of the plate which has the sleeve-like protuberances is covered with metalized coating.
  • the sleevelike protuberances are formed with axial apertures, extending transverse to the major plane of the plate, through which the feed-through conductors extend.
  • the metalized coating is so applied that it does not extend to the zone immediately surrounding the exit openings of the apertures, in order to provide ceramic material, for insulation of the feed-through conductors, from the outer metalized coating.
  • the plate is entirely metalized, then the metal coating is reinforced, for example by dip soldering or the like, and the metal coating is removed by grinding from the region immediately surrounding the exit openings of the apertures through the sleeves.
  • the feed-through conductors may have any form, and they may broadly be termed wire means" although they may be shaped to be solder terminals, connecting pins or terminal connectors, or merely wires passing therethrough.
  • the apertures are also metalized at their inside, and the feed-throughconductors are then soldered to the interiorly extending metal coating.
  • the outer electrode, surrounding the sleeve, is common to all the feed-through capacitors, the inner electrode being formed by the wires passing through the apertures.
  • the capacitors can readily be assembled by merely passing the feed-through wires through the apertures, and, if necessary, dip soldering. Mass production is thus possible, as well as pre-assembly. A wide range of capacity can be provided.
  • FIG. 1 is a longitudinally sectional view through a feed-through capacitor, illustrating conductors (not sectionalized) in various position, to a greatly enlarged scale;
  • FIG. 2 is a topview of the FIG. 1;
  • FIG. 3 is a schematic illustration of a multiple feedthrough capacitor with different values of capacitance with various feed-through leads
  • FIGS. 4 and 5 are a bottom view and vertical section of a ceramic body for two capacitors, and illustrating a first step in the method of production;
  • FIGS. 6 and 7 are a bottom view and a section of the body of FIGS. 4 and 5, metalized, and illustrating a further step in the method of production;
  • FIGS. 8 and 9 are a bottom view and a section of the body of FIGS. 4 and 5 illustrating another step in the method of production, in which the metal coating is refeed-through capacitor of moved, by grinding, from the face surface of the protu-.
  • FIG. 10 is the finished capacitor, with feedthrough conductors, soldered to the inner metalized coating, in section;
  • FIGS. 11 and 13 are bottom views and 12 and 14 sectional views of FIGS. 11 and 13, respectively, illustrating geometrical arrangements of various types of multiple feed-through capacitors.
  • the feed-through capacitor of FIGS. 1 and 2 is made for six leads.
  • a shield wall or housing 1 is formed with a suitable opening, or a plurality of suitable openings through which the feed-through capacitor is inserted.
  • the feed-through capacitor itself, essentially, has a plate-like ceramic socket or body 2, which has integral protuberances 3 extending therefrom, in the form of sleeves.
  • Feed-through conductors 4 are inserted through apertures formed in the protuberances 3.
  • the protuberances 3 have an inner electrode 5 to which the feed-through conductors 4 are soldered.
  • a common outer electrode 6 covers thelower surface of the platelike body, as well as the sleeve-like protuberances, except for the end face 7 of the protuberances, and for the upper surface 8 of the plate-like body.
  • the entire surface of a fired ceramic body of the shape shown in FIG. 1 is chemically copper coated, or nickel coated by a reduction process. If necessary, the base metal layer can then be reinforced galvanically, or by dip soldering. At this stage of manufacture, the capacitor electrodes are short circuited. They are separated by grinding the metal coated ceramic body at the surface 8, and at the end surfaces 7 of the protuberances. The remainder will be an unmetalized ceramic surface, which forms the insulation part between the feedthrough conductors 4 and the remaining outer metalized coating.
  • the feed-through conductors 4 may be pushed through the opening, or, preferably, soldered. They may be smooth connecting wires, single or double ended terminal pins, solder connectors, solder eyes, or the like or may have any other desired suitable shape, for example be formed with a small upset as seen in FIG. 1 to limit the depths of insertion.
  • the wall thicknesses of the sleeve-like protuberances can be made of different size, or the openings can be made of different size, so that when the wall thickness is small, a higher capacity will be available, than with a thicker wall of dielectric material between inner metalized coating 5, or conductor 4, and the outer coating 6.
  • the capacitor block may also be made of ceramic material having different dielectric constants;
  • FIG. 3 illustrates a ceramic feed-through capacitor having dielectric materials 9, and 10, of dielectric constants of different values.
  • the masses of ceramic material are placed in a compression matrix, for example filled at the left side with a material having a dielectric constant of 2,000, and at the right side filled with a material having a dielectric constant of 9,000.
  • Such materials are known, which have different dielectric constants, but essentially similar firing characteristics. Thus, contraction upon cooling, sinter temperatures, vthermo expansion characteristics and the like of such materials may be similar, although of different dielectric constants, and when fired, a unitary block is produced, the individual capacitor sections of which, however, having different capacity.
  • FIGS. 4-10 illustrate steps in the manufacture.
  • a ceramic body 11 (which may have more than one ceramic material of different dielectric constant, see FIG. 3) is made and fired. It is then completely covered with a metal layer 12 (FIGS. 6, 7) and thereafter the top flat surface 13, and the end face surface 14 is ground, so
  • the feed-through conductors 17 are inserted in the openings and soldered, for example by dip soldering, to the interior electrode, that is, metal coating 16 within the apertures of the metal body.
  • FIGS. 11 and 12 show a fixed-element feed-through capacitor in a particularly compact arrangement, in which a ceramic plate 18 has aperturedprotuberances 20, offset with respect to each other, .for the separate feed-through capacitors.
  • FIGS. 13 and 14 illustrate a strip-form capacitor with a plate unit 19, from which sleeve-like, or tube-like protuberances 2l extend, to receive the feed-through conductors.
  • the shape of the sleeve-like protuberances can be selected as desired, for example circular (FIG. 11) or polygonal, for example square (FIG. 13).
  • the conductor means forming one electrode of the capacitor and said metal coating the other electrode thereof.
  • Capacitor according toclaim 1 wherein the conductor means comprises an inner sleeve forming a metal coating at the side wall of the aperture; an electrical wire means passing through said inner sleeves.
  • Capacitor according to claim 2 wherein the inner sleeve and the wire means are soldered together.
  • Capacitor according to claim 1 wherein the metal coating covers the outer surface of the plate from which said protuberances project.
  • Capacitor according to claim 1 wherein said ceramic plate is made of materials of different dielectrical constants, but of similar firing characteristics, and the different protuberances are located at zones of said different materials.
  • Method of making a feed-through capacitor of the type claimed in claim 1 comprising preparing a ceramic plate having protuberances projecting from the major plane of the plate, and apertures leading through said protuberances, the terminal ends of the apertures at the side of the protusaid apertures. 10. Method according to claim 8, further comprising the step of inserting electrical wire means into the apertures after said removal step. 1 11. Method according to claim 8, wherein said removal step comprises grinding off said conductive coating at least in the region of the end faces of said protuberances.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
US00383531A 1972-08-05 1973-07-30 Multiple feed-through capacitor and methods of making Expired - Lifetime US3808478A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2238594A DE2238594A1 (de) 1972-08-05 1972-08-05 Keramischer mehrfach-durchfuehrungskondensator

Publications (1)

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US3808478A true US3808478A (en) 1974-04-30

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US00383531A Expired - Lifetime US3808478A (en) 1972-08-05 1973-07-30 Multiple feed-through capacitor and methods of making

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US (1) US3808478A (enrdf_load_stackoverflow)
CA (1) CA989027A (enrdf_load_stackoverflow)
DE (1) DE2238594A1 (enrdf_load_stackoverflow)
ES (1) ES415832A1 (enrdf_load_stackoverflow)
FR (1) FR2195045B1 (enrdf_load_stackoverflow)
GB (1) GB1370877A (enrdf_load_stackoverflow)
IT (1) IT987636B (enrdf_load_stackoverflow)
NL (1) NL161293C (enrdf_load_stackoverflow)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112944U (enrdf_load_stackoverflow) * 1974-07-17 1976-01-30
US3967167A (en) * 1973-03-22 1976-06-29 Stettner & Co. Multiple miniature capacitor
US4153988A (en) * 1977-07-15 1979-05-15 International Business Machines Corporation High performance integrated circuit semiconductor package and method of making
US4514782A (en) * 1983-03-01 1985-04-30 Murata Manufacturing Co., Ltd. Multiple feedthrough-capacitor unit
US4758808A (en) * 1983-08-16 1988-07-19 Tdk Corporation Impedance element mounted on a pc board
US4814938A (en) * 1986-08-13 1989-03-21 Murata Manufacturing Co., Ltd. High voltage capacitor
US4872085A (en) * 1987-06-05 1989-10-03 Hitachi, Ltd. Through-type capacitor with improved anti-tracking performance
US4887185A (en) * 1987-12-17 1989-12-12 Murata Manufacturing Co., Ltd. Through type capacitor
US4901198A (en) * 1984-08-14 1990-02-13 Murata Manufacturing Co., Ltd. Through capacitor
US5635775A (en) * 1995-04-14 1997-06-03 Colburn; Richard H. Printed circuit board mount electro-magnetic interference suppressor
US6646858B2 (en) * 2001-11-09 2003-11-11 Filtec Filtertechnologie Fuer Die Electronikindustrie Gmbh Capacitor body and a filter plug including a capacitor formed with the capacitor body
US7187535B1 (en) * 2006-01-30 2007-03-06 Medtronic, Inc. Multipolar feedthrough assembly with customizable filter and method of manufacture
US20110084592A1 (en) * 2009-10-09 2011-04-14 Johan Joost Koning High voltage shielding arrangement
US20140043739A1 (en) * 2011-01-26 2014-02-13 Medtronic, Inc. Implantable Medical Devices and Related Connector Enclosure Assemblies Utilizing Conductors Electrically Coupled to Feedthrough Pins
US10286218B2 (en) 2009-07-31 2019-05-14 Medtronic, Inc. Connector enclosure assemblies of medical devices including an angled lead passageway
US11224753B1 (en) 2010-12-28 2022-01-18 Medtronic, Inc. Medical devices including connector enclosures with feedthrough passageways
US11253708B2 (en) 2018-05-24 2022-02-22 Medtronic, Inc. Machined features of enclosures for implantable medical devices
US12179028B2 (en) 2009-07-31 2024-12-31 Medtronic, Inc. Implantable medical device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2061618B (en) * 1979-08-15 1984-04-18 Tdk Electronics Co Ltd Through type high-withstand-voltage ceramic capacitor
GB2157890A (en) * 1984-04-18 1985-10-30 Standard Telephones Cables Ltd Feed through capacitor
DE4311124A1 (de) * 1993-04-05 1994-10-06 Siemens Matsushita Components Mehrfach-Durchführungskondensator

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2940058A (en) * 1958-02-20 1960-06-07 Erie Resistor Corp Multiple unit feed through filter
GB878205A (en) * 1960-01-06 1961-09-27 London Electrical Mfg Company Electrical capacitors
US3246215A (en) * 1963-09-27 1966-04-12 Packard Bell Electronics Corp Ceramic capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2940058A (en) * 1958-02-20 1960-06-07 Erie Resistor Corp Multiple unit feed through filter
GB878205A (en) * 1960-01-06 1961-09-27 London Electrical Mfg Company Electrical capacitors
US3246215A (en) * 1963-09-27 1966-04-12 Packard Bell Electronics Corp Ceramic capacitor

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967167A (en) * 1973-03-22 1976-06-29 Stettner & Co. Multiple miniature capacitor
JPS5112944U (enrdf_load_stackoverflow) * 1974-07-17 1976-01-30
US4153988A (en) * 1977-07-15 1979-05-15 International Business Machines Corporation High performance integrated circuit semiconductor package and method of making
US4514782A (en) * 1983-03-01 1985-04-30 Murata Manufacturing Co., Ltd. Multiple feedthrough-capacitor unit
US4758808A (en) * 1983-08-16 1988-07-19 Tdk Corporation Impedance element mounted on a pc board
US4901198A (en) * 1984-08-14 1990-02-13 Murata Manufacturing Co., Ltd. Through capacitor
US4814938A (en) * 1986-08-13 1989-03-21 Murata Manufacturing Co., Ltd. High voltage capacitor
US4872085A (en) * 1987-06-05 1989-10-03 Hitachi, Ltd. Through-type capacitor with improved anti-tracking performance
US4887185A (en) * 1987-12-17 1989-12-12 Murata Manufacturing Co., Ltd. Through type capacitor
US5635775A (en) * 1995-04-14 1997-06-03 Colburn; Richard H. Printed circuit board mount electro-magnetic interference suppressor
US6646858B2 (en) * 2001-11-09 2003-11-11 Filtec Filtertechnologie Fuer Die Electronikindustrie Gmbh Capacitor body and a filter plug including a capacitor formed with the capacitor body
US7187535B1 (en) * 2006-01-30 2007-03-06 Medtronic, Inc. Multipolar feedthrough assembly with customizable filter and method of manufacture
US11090499B2 (en) 2009-07-31 2021-08-17 Medtronic, Inc. Implantable medical device
US12179028B2 (en) 2009-07-31 2024-12-31 Medtronic, Inc. Implantable medical device
US11944826B2 (en) 2009-07-31 2024-04-02 Medtronic, Inc. Implantable medical device
US11806519B2 (en) 2009-07-31 2023-11-07 Medtronic, Inc. Machining of enclosures for implantable medical devices
US10286218B2 (en) 2009-07-31 2019-05-14 Medtronic, Inc. Connector enclosure assemblies of medical devices including an angled lead passageway
US10449373B2 (en) 2009-07-31 2019-10-22 Medtronic, Inc. Connector enclosure assemblies of medical devices including an angled lead passageway
US10646719B2 (en) 2009-07-31 2020-05-12 Medtronic, Inc. Implantable medical devices including baseplates having separate bodies of material thereon
US11051905B2 (en) 2009-07-31 2021-07-06 Medtronic, Inc. Implantable medical devices with enclosures including top and bottom end caps
US8624478B2 (en) * 2009-10-09 2014-01-07 Mapper Lithography Ip B.V. High voltage shielding arrangement of a charged particle lithography system
US20110084592A1 (en) * 2009-10-09 2011-04-14 Johan Joost Koning High voltage shielding arrangement
US11224753B1 (en) 2010-12-28 2022-01-18 Medtronic, Inc. Medical devices including connector enclosures with feedthrough passageways
US9597518B2 (en) 2011-01-26 2017-03-21 Medtronic, Inc. Implantable medical devices and related connector enclosure assemblies utilizing conductors electrically coupled to feedthrough pins
US9572993B2 (en) * 2011-01-26 2017-02-21 Medtronic, Inc. Implantable medical devices and related connector enclosure assemblies utilizing conductors electrically coupled to feedthrough pins
US20140043739A1 (en) * 2011-01-26 2014-02-13 Medtronic, Inc. Implantable Medical Devices and Related Connector Enclosure Assemblies Utilizing Conductors Electrically Coupled to Feedthrough Pins
US11253708B2 (en) 2018-05-24 2022-02-22 Medtronic, Inc. Machined features of enclosures for implantable medical devices
US12017079B2 (en) 2018-05-24 2024-06-25 Medtronic, Inc. Machined features of enclosures for implantable medical devices

Also Published As

Publication number Publication date
GB1370877A (en) 1974-10-16
NL161293C (nl) 1980-01-15
ES415832A1 (es) 1976-02-16
FR2195045B1 (enrdf_load_stackoverflow) 1976-11-12
IT987636B (it) 1975-03-20
FR2195045A1 (enrdf_load_stackoverflow) 1974-03-01
DE2238594A1 (de) 1974-02-21
CA989027A (en) 1976-05-11
NL7308959A (enrdf_load_stackoverflow) 1974-02-07

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