US3771107A - Conductive metal powder connector - Google Patents

Conductive metal powder connector Download PDF

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Publication number
US3771107A
US3771107A US00206830A US3771107DA US3771107A US 3771107 A US3771107 A US 3771107A US 00206830 A US00206830 A US 00206830A US 3771107D A US3771107D A US 3771107DA US 3771107 A US3771107 A US 3771107A
Authority
US
United States
Prior art keywords
connector
electrical
powder
socket
powder bed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00206830A
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English (en)
Inventor
K Forster
W Wheeler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of US3771107A publication Critical patent/US3771107A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/44—Means for preventing access to live contacts
    • H01R13/447—Shutter or cover plate
    • H01R13/453—Shutter or cover plate opened by engagement of counterpart
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the structure can function as a female con- 1l./1963, Vol. 6, No. 6, p. 39.
  • ABSTRACT nector for establishing an electrical contact between the connector and a male pin of a circuit module inserted into the connector.
  • Various other connector devices comprise a female type connector socket-filled with a liquid substance containing metal particles in suspension or other type of conductive fluent material.
  • Such socket type connectors are adapted to receive a male connector tip into conductive engagement with the fluentmaterial'.
  • the electrical characteristics vary from one device to the other.
  • electrical connection devices comprising socket carrier receptacles utilizing submicron diameter nickel/gold particulate powders compacted to form a powder bed having controlled and predetermined volume fraction characteristics.
  • the connected devices comprise one or more electrically conductive sockets loded with conductive metal powder and retained therein by an elastomeric encapsulating element or membrane.
  • the membrane is bonded to the socket carrier.
  • the female socket configurations are adapted to receive the protruding pin elements of a printed circuit card or printed circuit board, or the like.
  • the compacting or volumetric displacement of the powder particulate is according to empirically determined standards and thereby produces reliably good electrical interconnections.
  • the hardware can be fabricated to provide an interposer type interconnecting device enabling printed circuit board to printed circuit board, or printed circuit card to printed circuit board interconnections.
  • the sockets can be fabricated into printed circuit boards to accept the circuit module pins for mounting and electrical interconnection functions.
  • Another object of the invention is to provide an improved female electrical connector device that may be made in very small sizes which provides an efficient low impedance electrical connection with a pluggably detachable cooperating male connector element.
  • Another object of the invention is to provide an electrical interconnection device that is protected from the external environmental elements.
  • a still further object of the invention is to provide an improved female electrical connector device which is extremely versatile in its applications and which has controllable insertion and withdrawal forces and makes it especially adaptable for use in muIti-pin connector arrangements.
  • FIG. 1 is a fragmentary sectional view of a socket in a printed circuit board electrical connector constructed in accordance with the present invention
  • FIG. 2 is a fragmentary sectional view of an interposer type electrical connector constructed in accordance with the present invention
  • FIG. 3 is the design interconnection geometry for an electrical connector construction in accordance with the present invention.
  • FIG. 4 is a diagrammatic showing of the current paths through a typical interposer type electrical connector device.
  • FIG. 1 there is shown an improved electrical connector apparatus in accordance with the present invention and fabricated as a socket in a printed circuit board female type connector adapted to receive the electrical connecting pins of a circuit module.
  • the structure comprises a printed circuit board 10 having one or more tubular shaped sockets 11.
  • the board 10 is usually of a dielectric material such as epoxy glass, or the like.
  • the sockets 11 are of conductive material such as copper, or gold plated copper, or the like, and may be formed in the board by conventional electrochemical processes.
  • the sockets 11 are usually electrically interconnected with other circuitry on the board (not shown) and fabricated by conventional and wellknown printed circuit techniques.
  • the sockets 11 are filled with a conductive submicron diameter size gold plated nickel material powder particulate and compacted to form the powder bed 12.
  • the powder beds 12 are contained in the sockets 11 by means of an elastomeric encapsulating membrane 13.
  • the membrane 13 When the module is detached from the printed circuit board 10, the membrane 13 functions to provided a wiping action to remove the powder particulates from the surface of the pins 14.
  • the elastomeric membrane 13 should have a relatively low coefficient of sliding friction and provide an easy deformation of the resilient surfaces.
  • the electrical connection' is designed to be fully separable.
  • FIG. 2 there is a fragmentary showing of an interposer or socket carrier 20 having sockets 21.
  • the sockets 21 are filled with conductive metal particulate and compacted to form the powder beds 22.
  • the powder beds 22 are retained in the sockets 21 by elastomeric encapsulating membranes 23.
  • the membranes 23 are bonded to each side of the socket carrier 20.
  • the mating elements are printed circuit cards 24 fabricated of dielectric material and support the pins 25 which are soldered to the printed circuit patterns 26, 27, and 28 that are on the external surfaces of the printed circuit cards 24.
  • the interposer or socket carrier member 20 can be fabricated to accommodate various area array connector pin configurations.
  • the encapsulating membranes 23 are adapted to yieldably receive the male type connector pins 25 of the printed circuit cards 24, the pins being insertable through the membranes 23 into the powder beds 22 to establish an electrical connection between the pins 25 and the sockets 21.
  • the conductivity of the powder beds is contingent upon the volume fraction.
  • the volume fraction may be defined as the ratio of the volume of the conductive powder to the volume of the spatial region to be occupied by the powder, defined as:
  • the true density is determined as follows:
  • powder bed compaction characteristics are often defined by rheologists in the following manner:
  • FIG. 3 is the design interconnection geometry for an electrical connector construction in accordance with the present invention, where:
  • D1 is the connector pin diameter D2 is the socket diameter- Hm is the encapsulating membrane thickness C is the powder bed clearance L is the effective pin length Hs is the socket length Hb is the printed circuit board thickness.
  • the total connector resistance may be expressed as a summation of the principal conduction paths; that is, R total R pin socket R powder bed where:
  • FIG. 4 is an illustration of the current flow paths through the interposer type connection. Although the actual conduction path is complex, the principal current flow is radial from the pins to the conductive powder to the plated socket holes. A dual current path exists with the interposer design principles and the, current flow reverses in the next increment from the plated socket to the pin via the powder bed.
  • Metal alloys 9 10" ohm CM Metal powders p 10 to l0" ohm CM Metal filled polymers p 10* to l0 ohm CM Conductive organics p 10 ohm CM Dielectrics The following is a brief theory summary of the resistance through a sphere (submicron metal ball) according to R. Holm, Electric Contacts, 4th Edition, Springer-Verlago Resistance through a sphere is as follows:
  • R [1/(1/R1)+(1/R2) (1/ ")l for parallel resistor networks.
  • each socket containing a powder bed of conductive metal powder particulates wherein the powder bed is volume fraction compacted within the socket in a range of from -30 percent;
  • a sealing membrane of resilient deformable material attached to the socket carrier and overlying the socket opening and being adapted to yieldably receive a male connector pin and admit the connector pin for forcible insertion into the powder bed and conductively engage therewith.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
US00206830A 1971-12-10 1971-12-10 Conductive metal powder connector Expired - Lifetime US3771107A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20683071A 1971-12-10 1971-12-10

Publications (1)

Publication Number Publication Date
US3771107A true US3771107A (en) 1973-11-06

Family

ID=22768158

Family Applications (1)

Application Number Title Priority Date Filing Date
US00206830A Expired - Lifetime US3771107A (en) 1971-12-10 1971-12-10 Conductive metal powder connector

Country Status (14)

Country Link
US (1) US3771107A (it)
JP (1) JPS4865485A (it)
AU (1) AU460244B2 (it)
BR (1) BR7208675D0 (it)
CA (1) CA973622A (it)
CH (1) CH544419A (it)
DE (1) DE2259673C3 (it)
ES (1) ES408613A1 (it)
FI (1) FI57855C (it)
FR (1) FR2164156A5 (it)
GB (1) GB1374889A (it)
IT (1) IT967747B (it)
NL (1) NL7216226A (it)
SE (1) SE389771B (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097319A (en) * 1991-03-21 1992-03-17 Harris Corporation Cover with through terminals for a hermetically sealed electronic package

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4005476A1 (de) * 1990-01-18 1991-07-25 Bodo D Sperling Elektrische kontakt steckverbindung
DE4413573C1 (de) * 1994-04-19 1995-06-01 Kostal Leopold Gmbh & Co Kg Vorrichtung zur Übertragung von elektrischem Strom zwischen zumindest zwei relativ zueinander beweglichen Kontaktstellen
DE19636119A1 (de) 1996-09-06 1998-03-12 Teves Gmbh Alfred Steckverbindung zur Herstellung eines feuchtigkeitsdichten elektrischen Übergangs
DE102014105320B4 (de) 2014-04-14 2018-10-25 Krohne Messtechnik Gmbh Verfahren zum Vergießen eines Feldgeräts

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2772134A (en) * 1953-05-29 1956-11-27 Westinghouse Electric Corp Apparatus for manufacturing discharge lamps
US3127230A (en) * 1964-03-31 Electrical connector device
US3158420A (en) * 1963-12-24 1964-11-24 Le Roy O Olson Underwater electrical connector
US3395383A (en) * 1967-12-13 1968-07-30 Smith Corp A O Pulse circuit and releasable conductor connector therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3127230A (en) * 1964-03-31 Electrical connector device
US2772134A (en) * 1953-05-29 1956-11-27 Westinghouse Electric Corp Apparatus for manufacturing discharge lamps
US3158420A (en) * 1963-12-24 1964-11-24 Le Roy O Olson Underwater electrical connector
US3395383A (en) * 1967-12-13 1968-07-30 Smith Corp A O Pulse circuit and releasable conductor connector therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM Technical Bulletin, Horchos, Test Socket, 11/1963, Vol. 6, No. 6, p. 39. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097319A (en) * 1991-03-21 1992-03-17 Harris Corporation Cover with through terminals for a hermetically sealed electronic package

Also Published As

Publication number Publication date
FI57855B (fi) 1980-06-30
CH544419A (de) 1973-11-15
DE2259673C3 (de) 1974-10-31
FI57855C (fi) 1980-10-10
IT967747B (it) 1974-03-11
AU460244B2 (en) 1975-04-24
ES408613A1 (es) 1975-10-16
FR2164156A5 (it) 1973-07-27
CA973622A (en) 1975-08-26
JPS4865485A (it) 1973-09-08
GB1374889A (en) 1974-11-20
DE2259673A1 (de) 1973-06-20
DE2259673B2 (de) 1974-03-28
AU4840972A (en) 1974-05-16
BR7208675D0 (pt) 1973-09-13
SE389771B (sv) 1976-11-15
NL7216226A (it) 1973-06-13

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