US3743978A - Coated ferrite rf filters - Google Patents
Coated ferrite rf filters Download PDFInfo
- Publication number
- US3743978A US3743978A US00088042A US3743978DA US3743978A US 3743978 A US3743978 A US 3743978A US 00088042 A US00088042 A US 00088042A US 3743978D A US3743978D A US 3743978DA US 3743978 A US3743978 A US 3743978A
- Authority
- US
- United States
- Prior art keywords
- filter
- barium titanate
- substrate
- dielectric
- ferrite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
- H01R13/7197—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with filters integral with or fitted onto contacts, e.g. tubular filters
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/215—Frequency-selective devices, e.g. filters using ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
Definitions
- a coating of barium titanate is applied to a ferrite substrate.
- the RF filter is an extruded tube of ferrite coated with barium titanate. The tube is used as an RF filter for a connector pin.
- a thin strip of ferrite is coated with barium titanate. This forms a filter strip for use on circuit boards or for use as a high capacity lossy power bus.
- This invention relates to low pass RF filters and more particularly to a layer of dielectric material deposited on a ferrite substrate to form a filter.
- Low pass RF filters are used extensively in electrical circuits to suppress stray radio frequency noise.
- Lumped impedance filters perform well at the lower frequencies but resonances limit their utility as the frequency is increased.
- these type filters are large in size compared to the circuits with which they are used.
- RF filters of the type disclosed in U.S. Pat. No. 3,275,953 Coda et al. were developed and used as feed through filters or on connector pins. These filters are small and have good insertion loss characteristics at high frequencies.
- they include an inner sleeve of ferrite coated with a metal layer and an outer metallized ceramic sleeve, usually barium titanate. Therefore, they require several fabrication steps.
- the capacity is limited by the thickness'to which the outer sleeve can be made, usually 8 to 10 mils minimum.
- This invention concerns an RF filter in which a thin coating of dielectric material is laid down on a ferrite substrate.
- a layer approximately 2 mils thick of barium titanate is laid down on the ferrite substrate to produce an electrical filter.
- the filter produced in this manner has low cost because fewer fabrication steps are involved. Also, the electrical properties are better than prior art filters.
- the impedance is completely distributed and the filter has a high capacity.
- the filter is an extruded tube of ferrite upon which a layer of barium titanate has been deposited. These filters are used for connector pins.
- the filter is a thin strip of ferrite upon which a barium titanate layer has been deposited. These are used as filter strips, or filtered buses, for circuit boards.
- FIG. 1 depicts a prior art type of filter for a connector pin
- FIG. 2 depicts a filter for a connector pin constructed in accordance with the present invention
- FIG. 3a shows the insertion loss versus frequency for the prior art filter and for the filter of this invention
- FIG. 3b shows the attenuation versus frequency for the prior art filter and for the filter of this invention
- FIG. 4 shows the equivalent circuit of a prior art type filter
- FIG. 5 shows the filter of the present invention in place on a connector pin
- FIG. 6 shows the invention embodied in a filter strip for a circuit board
- FIGS. 7-9 show modifications of the filter strip.
- the inner sleeve includes an extruded ferrite tube 1 with metal plating 2.
- the outer sleeve includes barium titanate 3 with the metal plate 4.
- the two sleeves are joined together by conductive epoxy or by soldering. It will be appreciated that the fabrication process includes extruding two sleeves, two steps of plating, one for each sleeve, and the step of joining the two sleeves together.
- the extruded ferrite. tube 5 is coated with the barium titanate layer 6.
- Barium titanate may be laid down on ferrite with several known techniques. Electrophoretic deposition is a particularly good technique for coating barium titanate on a ferrite tube. The electrophoretic deposition described in Senderoff et al. U.S. Pat. No. 2,843,541 may be used to lay down the barium titanate layer. After the barium titanate has been deposited on the ferrite, the device is metal plated, the metal plating being indicated at 7. Gaps 8 and 9 are left in the metal plating to isolate the ground and center pin electrodes.
- the filter of this invention also has improved electrical characteristics over prior art filters. This can best be shown by an example. Two filters were constructed, one in accordance with the prior art and one in accordance with this invention. The filters were 0.1 inches in diameter by 0.465 inches long. The capacity of the prior art filter was 6,000 LF. The capacity of the filter of this invention was 5,000 puF. The insertion loss versus frequency of the filters as measured in a 50 ohm system is shown in FIG. 3a. This response for both filters is good. Note, however, that the attenuation of the two filters, shown in FIG. 36, is quite different and that the prior art filter actually shows an undesirable gain between 5 and I0 megahertz. This gain is the result of the shunt capacity resonating with the filter series inductance.
- Another advantage of this invention is that it is possible to get an extremely thin film of barium titanate, about 2 to 4 mils being common. This thin film gives a much higher capacity per unit length of filter and for a given dielectric constant there is more attenuation per unit length than in a conventional filter.
- FIG. 5 shows one of the filters constructed in accordance with the invention in place on a connector pin.
- the filter 13 is positioned over the connector pin 14.
- a ground plane 15 is snapped onto the filter to provide the ground connection.
- the noise attenuation is approximately 60 db at 100 megahertz. That is, the noise power is reduced by a factor of 10.
- FIG. 6 shows an embodiment of the invention in which a coated strip of ferrite is used as a filter strip for a circuit board.
- the strip of ferrite 16 has a layer of barium titanate 17 deposited thereon.
- the strip has a metal plating 18 on one side and a metal plating 19 on the other side.
- the metal plating 19 is soldered to the ground plane 20 of the circuit board.
- the circuit components 21 and 22 are connected to the RF filter strip by the leads 23 and 24 respectively. These leads are soldered to the metal plating 18.
- the invention provides good filtering for components connected to the metal plating 18 which may be a DC bus.
- the metal plating 18 which may be a DC bus.
- the lossy bus will isolate the components. Also, it will prevent noise from other sources from entering the power bus and possibly causing a malfunction.
- a '25 inch wide bus bar was constructed of the form shown in FIG. 6.
- the attenuation was 90 db per centimeter at 100 megahertz.
- the power of the noise was attenuated by a factor of 10.
- barium titanate has been described as a particularly good dielectric material, other dielectric materials with lower dielectric constants may be deposited on the ferrite as a means of controlling the cut off frequency of the filter.
- a filter with a 2 mil epoxy coating resulted in a filter with a cut off frequency (frequency at which insertion loss is 3db) of 50 megahertz, whereas the equivalent filter with barium titanate had a cut off at 2 megahertz.
- the ferrite 25 has coatings of barium titanate 26 and 27 on both sides. Conductive metal platings 28 and 29 are applied over the barium titanate.
- Such a filter strip has a higher breakdown voltage. However, it would also have lower attenuation for a given thickness of barium titanate.
- the layers 30, 31, and 32 are conductive metal coatings.
- Layers 33 and 34 are ferrite and layers 35 and 36 are barium titanate.
- the metal 31 may be the conductor and the metal coatings 30 and 32 the ground. This embodiment has a higher capacity and loss per unit length.
- the filter strip includes a single ground conductor 36, a ferrite 37 and a barium titanate layer 38. Laid down on this are a plurality of metal conduction strips 39-42. This embodiment can be used where multiple circuits are required.
- the substrate may, in accordance with a further aspect of the invention, be constructed of other materials.
- a doped semiconducting ceramic material for the substrate. It is well known that the normally high resistivity of barium titanates can be greatly reduced by the introduction of proper additives.
- the resulting semiconductive barium titanates produced by known methods of treatment referred to in U.S. Pat. No. 3,268,783 to Osamu Saburi, are termed controlled valency semiconductive barium titanates.
- semiconductive ceramic material can be produced via valency control and can be carried out upon members of the family of materials generically designated by E M O wherein E is an alkaline earth element material selected from the group consisting of barium, magnesium, calcium, strontium, lead and mixtures thereof, M is a metal chosen from the group consisting of titanium, tin, and zirconium, and O is of course oxygen.
- E is an alkaline earth element material selected from the group consisting of barium, magnesium, calcium, strontium, lead and mixtures thereof
- M is a metal chosen from the group consisting of titanium, tin, and zirconium
- O is of course oxygen.
- Barium titanate is one member of the aforesaid family of materials.
- the additives used for valence control may comprise a material A selected from the group consisting of yttrium, actinium, thorium, antimony, bismuth, the members of the rare earth elements, and mixtures thereof, or a material B taken from the group consisting of vanadium, niobium, tantalum, selenium, tellurium, tungsten, and mixtures thereof.
- the total amount of additive should be between 0.01 atomic percent to 0.50 atomic percent of the host material, the alkaline earth material B being the host with additive A, and the metal M being the host in the case of additive B.
- the semiconductive plate 3 is an illustration of a semiconductive barium titanate substrate in a capacitor device.
- the substrate may consist of a semiconducting ceramic, such as the aforementioned semiconductive barium titanate, which is then coated with a suitable dielectric material to produce a filter, the coating being deposited in the same manner as in the case of the ferrite substrate above.
- a semiconducting barium titanate sleeve coated with a low conductivity titanate forms a large lossy capacitor.
- Such a device does not have the loss characteristics associated with the magnetic ferrite and it is not as effective as the ferrite device at high frequencies.
- the filter constructed with a semiconducting ceramic substrate is quite satisfactory and can be inexpensively manufactured.
- a unitary low pass filter element for mounting on a conductor of a low frequency transmission line to attenuate high frequencies thereon comprising,
- a unitary low pass filter strip for mounting on a circuit board provided with a ground plane conductor comprising,
- one of said platings being connected to one terminal of a low frequency source and load, and the other plating being in conductive engagement with the ground plane conductor.
- a unitary low pass filter element for mounting on a conductor of a low frequency transmission line to attenuate high frequencies thereon comprising,
- a substrate of ferrite in the form of a sleeve secured to the outer surface of the tubular member, in intimate engagement therewith,
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US88350169A | 1969-12-09 | 1969-12-09 | |
US8804270A | 1970-11-09 | 1970-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3743978A true US3743978A (en) | 1973-07-03 |
Family
ID=26778097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00088042A Expired - Lifetime US3743978A (en) | 1969-12-09 | 1970-11-09 | Coated ferrite rf filters |
Country Status (6)
Country | Link |
---|---|
US (1) | US3743978A (de) |
BE (1) | BE774939R (de) |
DE (1) | DE2154163C3 (de) |
FR (1) | FR2113619A6 (de) |
GB (1) | GB1304510A (de) |
NL (1) | NL7114344A (de) |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2617272A1 (de) * | 1975-04-21 | 1976-11-04 | Amp Inc | Elektrischer verbinder |
DE2617273A1 (de) * | 1975-04-28 | 1976-11-11 | Amp Inc | Elektrischer verbinder |
US4020430A (en) * | 1975-04-28 | 1977-04-26 | Amp Incorporated | Filtered connector assembly with composite ground plane |
US4212510A (en) * | 1978-11-14 | 1980-07-15 | Amp Incorporated | Filtered header |
US4215326A (en) * | 1978-01-16 | 1980-07-29 | Amp Incorporated | Filtered adapter |
US4267536A (en) * | 1977-09-30 | 1981-05-12 | Amp Incorporated | Stepped pin potted filter assembly |
US4296390A (en) * | 1980-04-21 | 1981-10-20 | Amp Incorporated | Solderless filter mounting for header assemblies |
DE3109766A1 (de) * | 1980-03-13 | 1982-01-28 | TDK Electronics Co., Ltd., Tokyo | "geraetesteckdose" |
US4553114A (en) * | 1983-08-29 | 1985-11-12 | Amp Incorporated | Encapsulated printed circuit board filter |
EP0169053A2 (de) * | 1984-07-16 | 1986-01-22 | Nippondenso Co., Ltd. | HF-Filter für elektronische Instrumente |
DE3528498A1 (de) * | 1985-08-08 | 1987-02-19 | Albatron Elektronik Gmbh | Steckverbinder |
EP0214110A1 (de) * | 1985-08-27 | 1987-03-11 | Telefonaktiebolaget L M Ericsson | Verlustbehaftete Filteranordnung zur Unterdrückung von Radiofrequenzinterferenz auf eine Zweidrahtleitung |
EP0608050A1 (de) * | 1993-01-22 | 1994-07-27 | The Whitaker Corporation | Filterorgan mit verteiltem Element und Herstellungsverfahren |
US5497129A (en) * | 1994-06-27 | 1996-03-05 | General Motors Corporation | Filter elements having ferroelectric-ferromagnetic composite materials |
US5513065A (en) * | 1992-12-23 | 1996-04-30 | Panduit Corp. | Communication connector with capacitor label |
EP0732777A2 (de) * | 1995-03-14 | 1996-09-18 | AT&T IPM Corp. | Elektromagnetische Interferenz unterdrückende Verbinderleiste |
EP0795936A2 (de) * | 1996-03-14 | 1997-09-17 | Johnstech International Corporation | Störungsfreier Testsockel für integrierte Schaltungen |
US5856770A (en) * | 1992-07-20 | 1999-01-05 | General Motors Corporation | Filter with ferroelectric-ferromagnetic composite materials |
WO2001091291A1 (en) * | 2000-05-25 | 2001-11-29 | Advanced Filtering Systems Ltd. | Emi filters based on amorphous metals |
US20020050632A1 (en) * | 2000-08-31 | 2002-05-02 | Mark Tuttle | Magnetic shielding for integrated circuits |
US6758698B1 (en) | 1992-12-23 | 2004-07-06 | Panduit Corp. | Communication connector with capacitor label |
US11444397B2 (en) | 2015-07-07 | 2022-09-13 | Amphenol Fci Asia Pte. Ltd. | Electrical connector with cavity between terminals |
US11469554B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
US11522310B2 (en) | 2012-08-22 | 2022-12-06 | Amphenol Corporation | High-frequency electrical connector |
US11539171B2 (en) | 2016-08-23 | 2022-12-27 | Amphenol Corporation | Connector configurable for high performance |
US11715914B2 (en) | 2014-01-22 | 2023-08-01 | Amphenol Corporation | High speed, high density electrical connector with shielded signal paths |
US11757224B2 (en) | 2010-05-07 | 2023-09-12 | Amphenol Corporation | High performance cable connector |
US11757215B2 (en) | 2018-09-26 | 2023-09-12 | Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. | High speed electrical connector and printed circuit board thereof |
US11799246B2 (en) | 2020-01-27 | 2023-10-24 | Fci Usa Llc | High speed connector |
US11817655B2 (en) | 2020-09-25 | 2023-11-14 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Compact, high speed electrical connector |
US11942716B2 (en) | 2020-09-22 | 2024-03-26 | Amphenol Commercial Products (Chengdu) Co., Ltd. | High speed electrical connector |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE794865A (fr) * | 1969-12-09 | 1973-08-01 | Amp Inc | Filtre electrique dissipatif haute frequence |
DE3801328A1 (de) * | 1988-01-19 | 1989-07-27 | Asea Brown Boveri | Verfahren zur herstellung eines formkoerpers aus oxidkeramik |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2228798A (en) * | 1937-05-24 | 1941-01-14 | Company Le Conducteur Electr B | Manufacture of telephone cables |
US2443109A (en) * | 1943-05-01 | 1948-06-08 | Rca Corp | Super high frequency attenuator |
US2611094A (en) * | 1950-02-16 | 1952-09-16 | Harold B Rex | Inductance-capacitance resonance circuit |
US2782381A (en) * | 1946-01-30 | 1957-02-19 | Walter P Dyke | Filament voltage terminal for pulse transformer |
US3257629A (en) * | 1961-12-11 | 1966-06-21 | Sperry Rand Corp | Delay line utilizing strip line with magnetic loading and method of making same |
US3275953A (en) * | 1963-08-20 | 1966-09-27 | Erie Technological Prod Inc | Multiple pin connector having ferrite bead-capacitor filter |
US3380004A (en) * | 1959-01-20 | 1968-04-23 | Mcmillan Corp Of North Carolin | Aperiodic low-pass filter |
US3435387A (en) * | 1965-09-01 | 1969-03-25 | Allen Bradley Co | Solderless mounting filter connection |
US3447143A (en) * | 1966-06-30 | 1969-05-27 | Research Corp | Reciprocal ferrite phase shifters and memory system utilizing same |
US3456215A (en) * | 1964-09-02 | 1969-07-15 | Peter A Denes | High frequency low pass filter |
US3458837A (en) * | 1966-12-22 | 1969-07-29 | Bell Telephone Labor Inc | Filter element using ferromagnetic material loading |
US3566311A (en) * | 1969-05-02 | 1971-02-23 | Westinghouse Electric Corp | Reciprocal ferrite film phase shifter having latching conductor film |
US3588758A (en) * | 1969-04-28 | 1971-06-28 | Itt | Electrical connector filter having dielectric and ferromagnetic tubes bonded together with conductive electrode layers and having nonintegral connecting spring |
-
1970
- 1970-11-09 US US00088042A patent/US3743978A/en not_active Expired - Lifetime
-
1971
- 1971-10-15 GB GB4797971A patent/GB1304510A/en not_active Expired
- 1971-10-19 NL NL7114344A patent/NL7114344A/xx unknown
- 1971-10-29 DE DE2154163A patent/DE2154163C3/de not_active Expired
- 1971-11-04 BE BE774939A patent/BE774939R/xx active
- 1971-11-05 FR FR7139749A patent/FR2113619A6/fr not_active Expired
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2228798A (en) * | 1937-05-24 | 1941-01-14 | Company Le Conducteur Electr B | Manufacture of telephone cables |
US2443109A (en) * | 1943-05-01 | 1948-06-08 | Rca Corp | Super high frequency attenuator |
US2782381A (en) * | 1946-01-30 | 1957-02-19 | Walter P Dyke | Filament voltage terminal for pulse transformer |
US2611094A (en) * | 1950-02-16 | 1952-09-16 | Harold B Rex | Inductance-capacitance resonance circuit |
US3380004A (en) * | 1959-01-20 | 1968-04-23 | Mcmillan Corp Of North Carolin | Aperiodic low-pass filter |
US3257629A (en) * | 1961-12-11 | 1966-06-21 | Sperry Rand Corp | Delay line utilizing strip line with magnetic loading and method of making same |
US3275953A (en) * | 1963-08-20 | 1966-09-27 | Erie Technological Prod Inc | Multiple pin connector having ferrite bead-capacitor filter |
US3456215A (en) * | 1964-09-02 | 1969-07-15 | Peter A Denes | High frequency low pass filter |
US3435387A (en) * | 1965-09-01 | 1969-03-25 | Allen Bradley Co | Solderless mounting filter connection |
US3447143A (en) * | 1966-06-30 | 1969-05-27 | Research Corp | Reciprocal ferrite phase shifters and memory system utilizing same |
US3458837A (en) * | 1966-12-22 | 1969-07-29 | Bell Telephone Labor Inc | Filter element using ferromagnetic material loading |
US3588758A (en) * | 1969-04-28 | 1971-06-28 | Itt | Electrical connector filter having dielectric and ferromagnetic tubes bonded together with conductive electrode layers and having nonintegral connecting spring |
US3566311A (en) * | 1969-05-02 | 1971-02-23 | Westinghouse Electric Corp | Reciprocal ferrite film phase shifter having latching conductor film |
Cited By (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2617272A1 (de) * | 1975-04-21 | 1976-11-04 | Amp Inc | Elektrischer verbinder |
DE2617273A1 (de) * | 1975-04-28 | 1976-11-11 | Amp Inc | Elektrischer verbinder |
FR2309996A1 (fr) * | 1975-04-28 | 1976-11-26 | Amp Inc | Connecteur electrique comprenant au moins un filtre tubulaire |
US4020430A (en) * | 1975-04-28 | 1977-04-26 | Amp Incorporated | Filtered connector assembly with composite ground plane |
US4267536A (en) * | 1977-09-30 | 1981-05-12 | Amp Incorporated | Stepped pin potted filter assembly |
US4215326A (en) * | 1978-01-16 | 1980-07-29 | Amp Incorporated | Filtered adapter |
US4212510A (en) * | 1978-11-14 | 1980-07-15 | Amp Incorporated | Filtered header |
DE3109766A1 (de) * | 1980-03-13 | 1982-01-28 | TDK Electronics Co., Ltd., Tokyo | "geraetesteckdose" |
US4296390A (en) * | 1980-04-21 | 1981-10-20 | Amp Incorporated | Solderless filter mounting for header assemblies |
US4553114A (en) * | 1983-08-29 | 1985-11-12 | Amp Incorporated | Encapsulated printed circuit board filter |
EP0169053A2 (de) * | 1984-07-16 | 1986-01-22 | Nippondenso Co., Ltd. | HF-Filter für elektronische Instrumente |
EP0169053A3 (en) * | 1984-07-16 | 1986-12-30 | Nippondenso Co., Ltd. | High frequency filter for electric instruments |
US4935710A (en) * | 1984-07-16 | 1990-06-19 | Nippondenso Co., Ltd. | High frequency filter for electric instruments |
DE3528498A1 (de) * | 1985-08-08 | 1987-02-19 | Albatron Elektronik Gmbh | Steckverbinder |
EP0214110A1 (de) * | 1985-08-27 | 1987-03-11 | Telefonaktiebolaget L M Ericsson | Verlustbehaftete Filteranordnung zur Unterdrückung von Radiofrequenzinterferenz auf eine Zweidrahtleitung |
US5856770A (en) * | 1992-07-20 | 1999-01-05 | General Motors Corporation | Filter with ferroelectric-ferromagnetic composite materials |
US5513065A (en) * | 1992-12-23 | 1996-04-30 | Panduit Corp. | Communication connector with capacitor label |
US6758698B1 (en) | 1992-12-23 | 2004-07-06 | Panduit Corp. | Communication connector with capacitor label |
US5940959A (en) * | 1992-12-23 | 1999-08-24 | Panduit Corp. | Communication connector with capacitor label |
EP0608050A1 (de) * | 1993-01-22 | 1994-07-27 | The Whitaker Corporation | Filterorgan mit verteiltem Element und Herstellungsverfahren |
US5382928A (en) * | 1993-01-22 | 1995-01-17 | The Whitaker Corporation | RF filter having composite dielectric layer and method of manufacture |
US5497129A (en) * | 1994-06-27 | 1996-03-05 | General Motors Corporation | Filter elements having ferroelectric-ferromagnetic composite materials |
EP0732777A3 (de) * | 1995-03-14 | 1997-06-18 | At & T Corp | Elektromagnetische Interferenz unterdrückende Verbinderleiste |
EP0732777A2 (de) * | 1995-03-14 | 1996-09-18 | AT&T IPM Corp. | Elektromagnetische Interferenz unterdrückende Verbinderleiste |
EP0795936A2 (de) * | 1996-03-14 | 1997-09-17 | Johnstech International Corporation | Störungsfreier Testsockel für integrierte Schaltungen |
EP0795936A3 (de) * | 1996-03-14 | 1998-05-20 | Johnstech International Corporation | Störungsfreier Testsockel für integrierte Schaltungen |
WO2001091291A1 (en) * | 2000-05-25 | 2001-11-29 | Advanced Filtering Systems Ltd. | Emi filters based on amorphous metals |
US20020050632A1 (en) * | 2000-08-31 | 2002-05-02 | Mark Tuttle | Magnetic shielding for integrated circuits |
US6924168B2 (en) * | 2000-08-31 | 2005-08-02 | Micron Technology, Inc. | Method of forming a structure for supporting an integrated circuit chip |
US11757224B2 (en) | 2010-05-07 | 2023-09-12 | Amphenol Corporation | High performance cable connector |
US11901663B2 (en) | 2012-08-22 | 2024-02-13 | Amphenol Corporation | High-frequency electrical connector |
US11522310B2 (en) | 2012-08-22 | 2022-12-06 | Amphenol Corporation | High-frequency electrical connector |
US11715914B2 (en) | 2014-01-22 | 2023-08-01 | Amphenol Corporation | High speed, high density electrical connector with shielded signal paths |
US11444397B2 (en) | 2015-07-07 | 2022-09-13 | Amphenol Fci Asia Pte. Ltd. | Electrical connector with cavity between terminals |
US11955742B2 (en) | 2015-07-07 | 2024-04-09 | Amphenol Fci Asia Pte. Ltd. | Electrical connector with cavity between terminals |
US11539171B2 (en) | 2016-08-23 | 2022-12-27 | Amphenol Corporation | Connector configurable for high performance |
US11757215B2 (en) | 2018-09-26 | 2023-09-12 | Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. | High speed electrical connector and printed circuit board thereof |
US11799246B2 (en) | 2020-01-27 | 2023-10-24 | Fci Usa Llc | High speed connector |
US11817657B2 (en) | 2020-01-27 | 2023-11-14 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
US11469553B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed connector |
US11469554B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
US11942716B2 (en) | 2020-09-22 | 2024-03-26 | Amphenol Commercial Products (Chengdu) Co., Ltd. | High speed electrical connector |
US11817655B2 (en) | 2020-09-25 | 2023-11-14 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Compact, high speed electrical connector |
Also Published As
Publication number | Publication date |
---|---|
GB1304510A (de) | 1973-01-24 |
BE774939R (fr) | 1972-03-01 |
DE2154163B2 (de) | 1979-09-20 |
NL7114344A (de) | 1972-05-12 |
DE2154163C3 (de) | 1980-06-04 |
FR2113619A6 (de) | 1972-06-23 |
DE2154163A1 (de) | 1972-05-10 |
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