US3697296A - Electroless gold plating bath and process - Google Patents
Electroless gold plating bath and process Download PDFInfo
- Publication number
- US3697296A US3697296A US122538A US3697296DA US3697296A US 3697296 A US3697296 A US 3697296A US 122538 A US122538 A US 122538A US 3697296D A US3697296D A US 3697296DA US 3697296 A US3697296 A US 3697296A
- Authority
- US
- United States
- Prior art keywords
- gold
- plating
- alkali metal
- plating bath
- cyanoborohydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title abstract description 43
- 229910052737 gold Inorganic materials 0.000 title abstract description 39
- 239000010931 gold Substances 0.000 title abstract description 39
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract description 32
- 238000000034 method Methods 0.000 title description 23
- -1 CYANOBOROHYDRIDE Chemical compound 0.000 abstract description 29
- 229910052783 alkali metal Inorganic materials 0.000 abstract description 20
- 239000000126 substance Substances 0.000 abstract description 12
- 230000003197 catalytic effect Effects 0.000 abstract description 11
- 239000007864 aqueous solution Substances 0.000 abstract description 10
- 239000004615 ingredient Substances 0.000 abstract description 10
- 239000002738 chelating agent Substances 0.000 abstract description 9
- 239000003638 chemical reducing agent Substances 0.000 abstract description 6
- 150000002344 gold compounds Chemical class 0.000 abstract description 5
- 150000003464 sulfur compounds Chemical class 0.000 abstract description 5
- 150000001340 alkali metals Chemical class 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 18
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 15
- BEOOHQFXGBMRKU-UHFFFAOYSA-N sodium cyanoborohydride Chemical compound [Na+].[B-]C#N BEOOHQFXGBMRKU-UHFFFAOYSA-N 0.000 description 11
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000011975 tartaric acid Substances 0.000 description 4
- 235000002906 tartaric acid Nutrition 0.000 description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- SGXDXUYKISDCAZ-UHFFFAOYSA-N N,N-diethylglycine Chemical compound CCN(CC)CC(O)=O SGXDXUYKISDCAZ-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- SQWDWSANCUIJGW-UHFFFAOYSA-N cobalt silver Chemical compound [Co].[Ag] SQWDWSANCUIJGW-UHFFFAOYSA-N 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Definitions
- a gold chemical plating bath for depositing gold on a catalytic surface which is an aqueous solution having a pH of 1.5 to 5 and contains as essential ingredients a soluble gold compound and an alkali metal cyanoborohydride as the reducing agent.
- ingredients are a chelating agent and an organic monovalent or divalent sulfur compound.
- Plating is preferably carried out at a temperature of 80 to 90 C.
- This invention relates to gold plating and more particularly to electroless gold plating baths and processes for the deposition of gold from such baths.
- electroless gold processes have been employed.
- electroless gold processes There have been a number of electroless gold processes described in the art and W. Goldie in Metallic Coating of Plastics, vol. I, Middlesex, England, Electrochemical Publications Ltd., 1968, pp. 99-103, describes a number of processes.
- formaldehyde formaldehyde
- sodium hypophosphite has been used as a reducing agent with citrates used as a complexing agent.
- Hydrazine, N,N-diethylglycine, citric acid and tartaric acid have also been used.
- some have considered some of these processes not to be true electroless gold processes (R. F. Bunshah, Techniques of Materials Preparation and Handling, part 3, pp. 1372-74, 1968) but to be immersion or displacement gold processes which are limited in the thickness and electrical resistance of the gold deposit obtained.
- a gold chemical plating bath comprising an aqueous solution having a pH within the range of about 1.5 to 5, said solution containing as essential ingredients a. soluble gold compound and an alkali metal cyanoborohydride.
- a process of chemically plating a catalytic surface with gold comprising contacting said surface with an aqueous solution having a pH within the range of about 1.5 to 5 at a temperature within the range of 25 C. up to the boiling point of the solution, said solution containing as essential ingredients a soluble gold compound and an alkali metal cyanoborohydride.
- Plating is accomplished by initially forming an aqueous plating solution having a pH of 1.5 to 5, preferably 2 to 4, which contains a soluble gold compound and an alkali metal cyanoborohydride.
- Gold can then be chemically deposited in uniform layers from such a solution on articles which have catalytic surfaces.
- concentrations of the components in the solution in addition to temperature of operation and other factors which lead to optimum plating conditions.
- gold can be plated chemically from a simple aqueous solution by reducing gold ions on a catalytic surface where the reduction is brought about by an alkali metal cyanoborohydride.
- catalytic surface refers to the surface of any object which contains in whole or in part a material which promotes on its surface the reduction of gold ions. Such surfaces are readily known to those skilled in the art and include iron, steel, nickel, copper, silver, cobalt, platinum and palladium metals. Surfaces of glass, ceramics and plastics are, in general, noncatalytic but are rendered catalytic by known sensitization techniques or by bonding foils of catalytic metals to the noncatalytic surfaces.
- An alkali metal cyanoborohydride is used in the solution as the gold ion reducing agent.
- Sodium cyanoborohydride is commercially available and, thus, is preferred although potassium cyanoborohydride is also suitable.
- the concentration of the cyanoborohydride in the aqueous solution is important to the rate of plating, but not determinative as to operativeness since the presence of minute amounts permits the plating of gold. High concentrations of cyanoborohydride such as a saturated aqueous solution also permit plating. As a practical matter, it is preferred to use the cyanoborohydride at a concentration of 0.1 to 10 grams per liter. A most preferred concentration is 0.1 to 5 grams per liter, and, generally, 0.25 to 2 grams per liter is adequate.
- Gold ions are introduced into the aqueous solution by adding a desired amount of water-soluble gold salt such as the sulfate, chloride, acetate, formate or alkali metal gold cyanide.
- concentration of the gold ions in solution is not critical and may vary over a wide range. As a practical matter, as little as possible should be used as long as an adequate plating rate is maintained. The rate of plating is slightly increased with increases in the concentration of gold ions. An initial concentration of from 0.02 to 0.5 gram mole per liter of salt is preferred.
- the aqueous solution contain a chelating agent to tie up trace amounts of undesirable materials or impurities and also to buffer the pH.
- chelating agents for electroless plating baths are well known and any one or a combination may be used.
- suitable chelating agents are citric acid, tartaric acid, glycolic acid and their alkali metal salts.
- the borates are also useful chelating agents. The amount added is essentially 1 mole for each mole of gold ion present in solution.
- Another optional ingredient which can be added to the solution to increase its shelf life and stability is an organic monovalent or divalent sulfur compound.
- Suitable divalent compounds are disclosed in US. Pat. 3,234,- 031 issued toEberhard Zirngiebl and Henry Gunter on Feb. 8, 1966. Only small amounts of sulfur compound need be added. For example, 0.001 to grams per liter can be used, but usually there is no improvement to be gained from the higher concentrations. Thus, it is preferred to use a concentration of 0.01 to 1 gram per liter.
- the bath In conducting the actual plating operation to deposit gold on a catalytic surface, it is preferred to operate the bath at a temperature of 80 to 95 C., since the rate of plating increases with temperature. While this range is preferred, plating will occur at lower or higher temperatures; thus, the temperature can range between 25 C. up to the boiling point of the solution, but will usually be above 40 C. v
- EXAMPLE 1 An aqueous plating bath was prepared containing 7 g./l. potassium gold cyanide and 30 g./l. citric acid, and 2 g./l. sodium cyanoborohydride. The pH of the bath was 3.5. It was. found that above pH 5 there was no reduction to gold and below pH 1.5 the bath was unstable. The bath .was used to plate copper and nickel foil (2.54 cm. X 7.62 cm.) at 90 C. The plating rate was constant at0.1 mil/hour over a test period of 6 hours. There was gas evolution from the work piece observed and there was a weight increase of 58 mg. during the test period.
- a ceramic chip sensitized with palladium according to known procedures was also plated and was checked for electrical resistance during the plating operation. The electrical resistance was reduced from 127 ohms per square to 0.4 ohm per square after a coating of 0.1 mil in thickness was applied. Similar baths were prepared with 1,4 and 5 g./l. of sodium cyanoborohydride, respectively, and similar results were obtained.
- EXAMPLE 2 An aqueous plating bath of pH 4 was prepared containing 10 g./l. gold chloride and 30 g./l. tartaric acid, and 2 g./l. sodium cyanoborohydride. A copper foil (2.54 cm. x 7.62 cm.) was plated in the bath at 90 C. with a plating rate of 0.05 mil/hour over a test period of 6 hours. The weight increase was 30 mg. Similar baths were prepared with.1,4 and 5 g./l. of sodium cyanoborohydride, respectively, and similar results were obtained.
- EXAMPLE 3 An aqueous plating bath of pH 3.5 was prepared containing 10 g./l. potassium gold cyanide, 30 g./l. citric acid, 0.01 g./l. thiodiglycolic acid, and 2 g./l. sodium cyanoborohydride. Copper foil (2.54 cm. X 7.62 cm.) was plated as in Example 1 and gold was deposited on the copper with no decomposition of the baths after continuously plating over a period of 24 hours. Similar baths were prepared with 1,4 and 5 g./1. of sodium cyanoborohydride, respectively, and similar results were obtained. Similar results were obtained when 0.01 g./l. of mercapto acetic acid was used in place of the thiodiglycolic acid in the bath containing 2 g./l. sodium cyanoborohydride.
- a gold chemicalv plating bath comprising an aqueous 4 solution having a pH within the range of about 1.5 to 5, said solution containing as essential ingredients a watersoluble salt of gold and an alkali metal cyanoborohydride.
- water-soluble gold salt is an alkali metal gold cyanide or a gold salt of a mineral or aliphatic acid
- the water-soluble gold salt is an alkali metal gold cyanide or a gold salt of a mineral or aliphatic acid.
- alkali metal cyanoborohydride is sodium cyanoborohydride present at a concentration ;of 0.25 to 2 grams per liter.
- a process of chemically plating a catalytic surface with gold comprising contacting said surface with an aqueous solution having a pH within the range of about 1.5 to 5 at a temperaturewithin the range of 25 C. up to the boiling point of the solution, said solution containing as essential ingredients a water-soluble salt of gold and an alkali metal cyanoborohydride.
- alkali metal cyanoborohydride is sodium cyanoborohydride present at a concentration of 0.1 to 5 grams per liter.
- the chemical plating bath of claim 16 wherein the chelating agent is citric acid, tartaric acid, and glycolic acid.
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12253871A | 1971-03-09 | 1971-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3697296A true US3697296A (en) | 1972-10-10 |
Family
ID=22403281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US122538A Expired - Lifetime US3697296A (en) | 1971-03-09 | 1971-03-09 | Electroless gold plating bath and process |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3697296A (enrdf_load_stackoverflow) |
| CA (1) | CA969703A (enrdf_load_stackoverflow) |
| DE (1) | DE2211439A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2128781B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1321963A (enrdf_load_stackoverflow) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3857724A (en) * | 1971-08-20 | 1974-12-31 | Ibm | Primer for electroless plating |
| JPS5093234A (enrdf_load_stackoverflow) * | 1973-12-24 | 1975-07-25 | ||
| US3917885A (en) * | 1974-04-26 | 1975-11-04 | Engelhard Min & Chem | Electroless gold plating process |
| US4091128A (en) * | 1976-10-08 | 1978-05-23 | Ppg Industries, Inc. | Electroless gold plating bath |
| US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
| US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
| US4804559A (en) * | 1985-10-14 | 1989-02-14 | Hitachi, Ltd. | Electroless gold plating solution |
| US4830668A (en) * | 1986-11-24 | 1989-05-16 | W. C. Heraeus Gmbh | Acidic bath for electroless deposition of gold films |
| EP0369545A1 (en) * | 1988-11-15 | 1990-05-23 | H.B.T. Holland Biotechnology B.V. | Process for the preparation of elemental sols |
| US5470381A (en) * | 1992-11-25 | 1995-11-28 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating solution |
-
1971
- 1971-03-09 US US122538A patent/US3697296A/en not_active Expired - Lifetime
-
1972
- 1972-02-24 CA CA135,518A patent/CA969703A/en not_active Expired
- 1972-03-09 DE DE19722211439 patent/DE2211439A1/de active Pending
- 1972-03-09 GB GB1110872A patent/GB1321963A/en not_active Expired
- 1972-03-09 FR FR7208258A patent/FR2128781B1/fr not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3857724A (en) * | 1971-08-20 | 1974-12-31 | Ibm | Primer for electroless plating |
| JPS5093234A (enrdf_load_stackoverflow) * | 1973-12-24 | 1975-07-25 | ||
| US3917885A (en) * | 1974-04-26 | 1975-11-04 | Engelhard Min & Chem | Electroless gold plating process |
| US4091128A (en) * | 1976-10-08 | 1978-05-23 | Ppg Industries, Inc. | Electroless gold plating bath |
| US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
| US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
| US4804559A (en) * | 1985-10-14 | 1989-02-14 | Hitachi, Ltd. | Electroless gold plating solution |
| US4880464A (en) * | 1985-10-14 | 1989-11-14 | Hitachi, Ltd. | Electroless gold plating solution |
| US4830668A (en) * | 1986-11-24 | 1989-05-16 | W. C. Heraeus Gmbh | Acidic bath for electroless deposition of gold films |
| EP0369545A1 (en) * | 1988-11-15 | 1990-05-23 | H.B.T. Holland Biotechnology B.V. | Process for the preparation of elemental sols |
| US5470381A (en) * | 1992-11-25 | 1995-11-28 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating solution |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2128781B1 (enrdf_load_stackoverflow) | 1975-10-24 |
| CA969703A (en) | 1975-06-24 |
| GB1321963A (en) | 1973-07-04 |
| FR2128781A1 (enrdf_load_stackoverflow) | 1972-10-20 |
| DE2211439A1 (de) | 1972-09-21 |
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