US3667661A - Apparatus for use in the manufacture of semi-conductor devices - Google Patents

Apparatus for use in the manufacture of semi-conductor devices Download PDF

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Publication number
US3667661A
US3667661A US26734A US3667661DA US3667661A US 3667661 A US3667661 A US 3667661A US 26734 A US26734 A US 26734A US 3667661D A US3667661D A US 3667661DA US 3667661 A US3667661 A US 3667661A
Authority
US
United States
Prior art keywords
slice
diaphragms
diaphragm
semi
scribed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US26734A
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English (en)
Inventor
Francis Louis Farmer
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Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of US3667661A publication Critical patent/US3667661A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Definitions

  • the apparatus for cracking previously scribed semi-conductor slices includes a base 11 including a chamber 12 closed at one end by a rubber diaphragm 13.
  • the apparatus further includes a movable platen 14 which is movable towards and away from the base 11, and which is provided, in its face presented to the diaphragm 13, with a recess 15.
  • the recess 15 is closed by a second rubber diaphragm 16 which is movable with the movable platen 14.
  • Means (not shown) is provided for pumping air into the chamber 11, and since the chamber 11 is closed by the diaphragm 13, then when the air pressure within the chamber 12 increases the diaphragm 13 will be distended towards the movable platen 14 and will assume a domed configuration.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
US26734A 1969-05-01 1970-04-08 Apparatus for use in the manufacture of semi-conductor devices Expired - Lifetime US3667661A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2218069 1969-05-01

Publications (1)

Publication Number Publication Date
US3667661A true US3667661A (en) 1972-06-06

Family

ID=10175251

Family Applications (1)

Application Number Title Priority Date Filing Date
US26734A Expired - Lifetime US3667661A (en) 1969-05-01 1970-04-08 Apparatus for use in the manufacture of semi-conductor devices

Country Status (3)

Country Link
US (1) US3667661A (enrdf_load_stackoverflow)
JP (1) JPS4844051B1 (enrdf_load_stackoverflow)
GB (1) GB1297954A (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0363548A1 (en) * 1988-10-10 1990-04-18 International Business Machines Corporation Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils
US5759918A (en) * 1995-05-18 1998-06-02 Obsidian, Inc. Method for chemical mechanical polishing
EP0989593A3 (en) * 1998-09-25 2002-01-02 Canon Kabushiki Kaisha Substrate separating apparatus and method, and substrate manufacturing method
US20020174958A1 (en) * 2001-05-25 2002-11-28 Kazutaka Yanagita Separating apparatus and processing method for plate memeber
US6488565B1 (en) 2000-08-29 2002-12-03 Applied Materials, Inc. Apparatus for chemical mechanical planarization having nested load cups
US6527031B1 (en) 1998-11-06 2003-03-04 Canon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
US6629539B1 (en) 1998-11-06 2003-10-07 Canon Kabushiki Kaisha Sample processing system
US6672358B2 (en) 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
US6833312B2 (en) 2001-05-25 2004-12-21 Canon Kabushiki Kaisha Plate member separating apparatus and method
US20060143908A1 (en) * 2004-12-22 2006-07-06 Pierre-Luc Duchesne An automated dicing tool for semiconductor substrate materials
US20180128278A1 (en) * 2016-09-26 2018-05-10 Fluid Handling Llc. Multi-stage impeller produced via additive manufacturing

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3006314A1 (de) * 1980-02-20 1981-09-03 Robert Bosch Gmbh, 7000 Stuttgart Brecheinrichtung
DE10007642C2 (de) * 2000-02-19 2002-03-14 Bosch Gmbh Robert Verfahren zum Trennen von Substraten im Nutzenformat mit vorgegebenen Sollbruchstellen
DE10345964B4 (de) * 2003-10-02 2016-02-11 Hans-Joachim Weitzel Gmbh & Co. Kg Granulat, Verfahren zu seiner Herstellung und Verwendung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3493155A (en) * 1969-05-05 1970-02-03 Nasa Apparatus and method for separating a semiconductor wafer
US3507426A (en) * 1968-02-23 1970-04-21 Rca Corp Method of dicing semiconductor wafers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3507426A (en) * 1968-02-23 1970-04-21 Rca Corp Method of dicing semiconductor wafers
US3493155A (en) * 1969-05-05 1970-02-03 Nasa Apparatus and method for separating a semiconductor wafer

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0363548A1 (en) * 1988-10-10 1990-04-18 International Business Machines Corporation Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils
US4995539A (en) * 1988-10-10 1991-02-26 Heinz Richard Method and apparatus for cleaving wafers
US5759918A (en) * 1995-05-18 1998-06-02 Obsidian, Inc. Method for chemical mechanical polishing
US5851136A (en) * 1995-05-18 1998-12-22 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5938884A (en) * 1995-05-18 1999-08-17 Obsidian, Inc. Apparatus for chemical mechanical polishing
EP0989593A3 (en) * 1998-09-25 2002-01-02 Canon Kabushiki Kaisha Substrate separating apparatus and method, and substrate manufacturing method
US6629539B1 (en) 1998-11-06 2003-10-07 Canon Kabushiki Kaisha Sample processing system
US20050045274A1 (en) * 1998-11-06 2005-03-03 Kazutaka Yanagita Sample separating apparatus and method, and substrate manufacturing method
US6527031B1 (en) 1998-11-06 2003-03-04 Canon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
US7579257B2 (en) 1998-11-06 2009-08-25 Canon Kabuhsiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
US6672358B2 (en) 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
US20040045679A1 (en) * 1998-11-06 2004-03-11 Canon Kabushiki Kaisha Sample processing system
US6971432B2 (en) 1998-11-06 2005-12-06 Canon Kabushiki Kaisha Sample processing system
US6488565B1 (en) 2000-08-29 2002-12-03 Applied Materials, Inc. Apparatus for chemical mechanical planarization having nested load cups
US6833312B2 (en) 2001-05-25 2004-12-21 Canon Kabushiki Kaisha Plate member separating apparatus and method
US6867110B2 (en) 2001-05-25 2005-03-15 Canon Kabushiki Kaisha Separating apparatus and processing method for plate member
US6946052B2 (en) 2001-05-25 2005-09-20 Canon Kabushiki Kaisha Separating apparatus and processing method for plate member
US20040221963A1 (en) * 2001-05-25 2004-11-11 Canon Kabushiki Kaisha Separating apparatus and processing method for plate member
US20020174958A1 (en) * 2001-05-25 2002-11-28 Kazutaka Yanagita Separating apparatus and processing method for plate memeber
US20060143908A1 (en) * 2004-12-22 2006-07-06 Pierre-Luc Duchesne An automated dicing tool for semiconductor substrate materials
US7559446B2 (en) * 2004-12-22 2009-07-14 International Business Machines Corporation Automated dicing tool for semiconductor substrate materials
US20180128278A1 (en) * 2016-09-26 2018-05-10 Fluid Handling Llc. Multi-stage impeller produced via additive manufacturing

Also Published As

Publication number Publication date
GB1297954A (enrdf_load_stackoverflow) 1972-11-29
JPS4844051B1 (enrdf_load_stackoverflow) 1973-12-22

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