US3641660A - The method of ball bonding with an automatic semiconductor bonding machine - Google Patents

The method of ball bonding with an automatic semiconductor bonding machine Download PDF

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Publication number
US3641660A
US3641660A US3641660DA US3641660A US 3641660 A US3641660 A US 3641660A US 3641660D A US3641660D A US 3641660DA US 3641660 A US3641660 A US 3641660A
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wire
needle
bonding
ball
bond
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Anthony L Adams
Gerald A Yearsley
Marion I Simmons
Billy P Yager
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Texas Instruments Inc
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Texas Instruments Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49838—Assembling or joining by stringing

Definitions

  • the wire is payed out to the bonding needle from a spool supported by an air bearing. After the ball is formed, reverse torque is applied to the spool to pull the ball up against the end of the bonding needle. After the ball bond, forward torque is applied to pay out the wire, and the wire is positively fed through the needle by an airstream. After the stitch bond is completed and the ball reformed by the flame, reverse torque is again applied to the spool to draw the ball up against the end of the needle preparatory to the next bonding cycle.
  • wire and bonding needle are heated to a bonding tem- C. so that the pressure of the needle produces a bond.
  • the needle is manipulated with the aid of a microscope and micromanipulator.
  • the wire passes upwardly through the 'needle and between a pair of resilient pressure pads to a supply spool. The pressure pads tend to tension the wire as it is pulled.
  • the needle is raised which pulls the wire from the needle.
  • the needle is then moved over and down until the edge of the lead is pressed against and bonded to the lead. This is called the stitch bond. As the needle is again raised, the wire is pulled from the needleby the stitch bond.
  • FIG. I is a plan view of a typical workpiece for the method and apparatus of the present invention.
  • FIGS. 2a-2d are simplified side elevational views of the workpiece of FIG. 1 which illustrate the method of the present invention
  • FIG. 6 is an enlarged side view of a portion of FIG. 3, in cluding a portion of the structure broken away in FIG. 3;
  • FIG. 11 is a top view of the bonding head of F IG. 10;
  • FIG. 14a is a ruth table for the counter of the circuit of FIG. 14;
  • FIG. 18 is a timing diagram which illustrates the operation of the bonding machine of FIG. 3.
  • a transistor header 10 includes a transistor chip 12 which is alloyed to a flattened head on a metal pin or lead 14.
  • the lead 14 together with similar leads l6 and 18 are held in a glass header 20.
  • Lead wires 24a and 24b extend from the expanded base and emitter contacts to the leads l6 and 18, respectively.
  • the transistor 12 is typically gold and are 0.001 inch in diameter.
  • the present invention is concerned with a method and apparatus for bonding the lead wires 24a and 24b between the respective expanded contacts on the transistor 12 and the leads 16 and 18. It is to be understood, however, that the method and apparatus of the present invention can be used to bond wires to any surfaces of any semiconductor device.
  • FIGS. 2a-2d illustrate the method of the present invention for bonding the lead wire 24a to the transistor 12 and lead 18.
  • the semiconductor chip 12 is first positioned at a work station, then the bonding mechanism centered on a predetermined axis 26 of the chip by an electrooptical servosystem hereafter described.
  • the bonding needle 28 is positioned well out of the field of view of the optical device during positioning of the bonding mechanism, the position being illustrated by dotted outline 28a.
  • the wire 24 extends through the hypodermic needle to a supply spool (not illustrated in FIGS. 2a-2d).
  • the wire 24 is maintained under tension by reverse torque on the spool, and ball 25 formed by passing the wire through a flame prevents the wire from being withdrawn from the needle.
  • the needle 28 is then raised and translated so that the point is moved along dotted path 32 (FIG. 2b) and lowered at a second predetermined position relative to the axis 26 selected so as to press the edge of the wire 24 against the upper surface of the lead 18.
  • the torque on the supply spool is reversed as the needle is moved along path 32, and the wire is positively payed out through the needle 28 by means of a jet of air to eliminate tension on the wire and bond, and thus permit the needle to be moved at a high rate of speed without breaking the bond or the wire.
  • the pressure of the needle on the lead 18 forms a stitch bond 33.
  • the needle 28 is raised to pay out a length of the wire 24c as shown in FIG. 2c, then the wire 24 is clamped relative to the needle 28. As the needle 28 continues to rise, the wire is broken at the point where weakened by the stitch bond 33. The needle 28 then proceeds along path 34 so that the length of wire 24c passes through a flame 36 which forms a new ball 27 as illustrated in FIG. 2d. After passing the flame 36, the wire is unclamped so that reverse torque on the wire spool draws the ball 27 up against the tip of the needle 28, and the needle proceeds on to the initial position represented at 28a in FIG. 2a.
  • the positive feeding of the wire 24 insures that a length of wire is protruding from the end of the needle so that a stitch bond can be made whether or not a ball bond is achieved.
  • the forward torque on the spool is maintained until such time as the wire is clamped in the step of FIG. 2c so that a premature failure of the wire 24 after the stitch bond or a failure to accomplish a stitch bond will not result in the wire being withdrawn from the needle.
  • the clamp is maintained until the wire is passed through the flame 36 and a new ball 27 will be formed preparatory to the next cycle.
  • the second table member can be moved to any X-, Y-coordinate position relative to support 52, and thus constitutes what is commonly referred to as an X-Y table.
  • the system 74 compares the pattern within the optical field of view, i.e., the semiconductor chip 12, with an identical reference pattern and produces a positive or negative X-error signal and a positive or negative Y-error signal which indicates the direction the eye must be moved along the X- and Y-axes to align the reference pattern with the scanned pattern.
  • the X- and Y-error signals are used to control operation of the X- and Y-stepping motors 60 and 68 and thus automatically align the electro-optical eye 74 along the predetermined optical axis 26 (see FIG. 2a) of the semiconductor chip 12 mounted on the header 10 (see FIG. 3) by the circuitry illustrated in FIG. 13 which is hereafter described in detail.
  • the header 10 is supported by a chuck 40 carried on an indexing chain which positions the header generally at the work station so that the semiconductor device will be positioned within the field of view of the optical aligning system.
  • the X-Y table member 62 also supports a bonding mechanism indicated generally by the reference numeral 80, which will now be described.
  • a platform 82 is slidably mounted on the base plate 84 of the X-Y table member 62 by crossed roller slides 86 and 88 (see FIG. 3) for movement in what is hereafter termed the H direction.
  • the platform 82 is driven in the H direction by an H" stepping motor 92 which is mounted on a depending leg 94 of the table 62 and which drives a shaft 98.
  • the shaft 98 is journaled in the legs 100 and 102 of the table 62.
  • a double acting disk-shaped cam 96 is mounted on shaft 98 and engages cam followers 104 and 106 which are mounted on the plate 82 by brackets 108 and 110.
  • Cam 96 is sometimes hereafter referred to as the H cam.
  • the X-Y table member 62 is automatically aligned with an optical axis on the transistor device 12 by the electro-optic eye 74 and servo system including X- and Y-motors 60 and 68 which is hereafter described.
  • the slide 112 from which the bonder mechanism 80 depends constitutes, together with platform 82, an H-V table which effects translation of the needle-28 through the various positions depicted in FIGS. 2a-2d.
  • the housing of micrometer 156 is mounted by bracket 168 on plate 82, and the rod 170 is connected to bracket 172 on the horizontal leg of the L-shaped member 116.
  • a dove-tailed key 174 is mounted on the bottom of the L- shaped bracket 116 and rides in a keyway 176 in the plate 82. After adjustment in the Y" direction, the bracket 116 can be secured in place by screws 178 which pass through elongated openings in the L-shaped bracket 116 and are threaded into the horizontal plate 82.
  • the wire supply spool 184 rotates at a relatively slow rate. If, however, the wire should break for any reason, the air through the jets 200 will soon causethe spool 184 to rotate at a high rate in the reverse direction. Alternate dark and light segments 205 and 206 on the rim of the spool 184 permit this catastrophic failure to be sensed so that operation will be terminated.
  • Separate fiber optical bundles 208 and 210 are combined and directed toward the portion of the rim having the light and dark areas 205 and 206. Light is directed through the bundle 208 onto the rim and the reflected light returned through bundle 210 to a photodetector.
  • the sleeve 240 is held in a bore in the arm 142 by a setscrew 242.
  • a compression spring 244 is disposed between the end of the sleeve 240 and a keeper 246 and biases the jaw 266 open whenever the solenoid 236 is not energized.
  • the needle 28 is mounted on an electrical heating assembly 256 which in turn is suspended from the tubular support 258 which passes through the bracket 228 and is connected to the cap 260 on the sleeve 240.
  • a flame assembly for forming a new ball on the end of the wire after each stitch bond is indicated generally by the reference numeral 261 in FIG. 5.
  • This assembly includes an arm 262 which contains the necessary plumbing to provide combustible gases to a nozzle 264.
  • the arm 262 is supported by the X-Y table member 62 and moves with the table member.
  • the nozzle 264 is pivoted between the operative position shown in solid outline, and an inoperative position shown in dotted outline 264a by means of a solenoid 464 shown only in FIG. 13.
  • the nozzle directs the gases onto an electric igniter 266 which is continuously energized during operation.
  • the nozzle 264 is moved from the inoperative position 264a to the operative position 264 when the solenoid is energized.
  • the position of the igniter 266 is also illustrated in FIGS. 4 and 11.
  • the scanning eye 74 produces an X-axis error signal on channel 330 which is applied to the X-servoamplifier, and a Y- error signal on channel 332 which is applied to the Y-servoamplifier 328.
  • the servoamplifier 326 produces a logic signal on channel 334 indicating the direction in which the X-motor must rotate in order to align the reference image in the scanning eye 74, and thus the XY table 62 on which it is fixed, with the semiconductor device 12.
  • This logic signal is routed through the normally closed contacts of limit switches 71 and 73 and through one pole of a double-pole, three-position manual log switch 336a to the X motor drive circuit 338.
  • the driver circuit 338 is illustrated in FIG. 14 and is essentially a four step reversible counter comprised ofJ and K flipflops FF and FF having logic outputs T,, C,, T and C
  • the logic input for determining the direction in which the X-motor is driven is applied to input 344.
  • the stepping pulses are applied to input 346.
  • NAND-gates 348356 perform the necessary logic to cause flip-flops FF and FF to complement in a sequence as successive pulses applied at input 346 to cause the outputs to assume the logic states indicated in the truth table of FIG. 14a.
  • the input 344 is at a logic I, the counter steps in the forward direction, and when the input 344 is at a logic 0, the counter steps in the reverse direction.
  • the X-Y table 62 can be manually actuated to move in either the positive or negative direction along the X-axis by throwing the switch 336 to either the upper or lower contact, respectively.
  • pole 336a When the switch is thrown upwardly, pole 336a is connected to the positive voltage indicating a logic I" level, causing the counter of the motor driver circuit to step in the forward direction each time that a low-speed pulse from the divide-by-IO counter 322 is applied to input 346 through the lower pole 336b.
  • logic input 344 is connected to ground, which is a logic 0," and the X-motor driver complements in the reverse direction as the pulses from the divide-bylO counter 322 are still input through the lower pole 336b.
  • the Y-stepping motor 68 is operated the same as the X- stepping motor 60 by the servoamplifier 328, reversing limit switches 75 and 77, three-position, double-pole switch 384, and a Y-motor driver 386, all of which are identical to the corresponding components described in connection with the X- stepping motor.
  • Pulses to the motor control 392 are derived from a second clock 396 which is operated at 2.4 kHz. and a divide-by-five counter 398 (see FIG. 13). These pulses are received on line 400 (see FIG. 17) and these are applied to inputs of a pair of NAND-gates 402 and 404.
  • the outputs of gates 402 and 404 are OR wired to a common output 452.
  • the logic signal on output 406 from V-cam enable I decoder 315 is applied to an input of gate 408.
  • the output of gate 408 is connected to inputs of gates 402 and 410.
  • the other input to gate 410 is connected through a resistor 412 to a positive voltage supply, and to output line 414 of the V-cam position sensor 416, which is shown in detail in FIG. 15 and will presently be described.
  • the output 414 approaches ground potential, which is a logic level.
  • the base of transistor 442 and hence the output 414 becomes sufficiently positive to represent a logic 1 level.
  • the diode 438 operates in the same manner to produce a logic 0" level on output 424 when the diode is illuminated by light passing through aperture 434, and a logic 1" level when the photodiode is dark.
  • V-cam enable I decoder 315 detects the appropriate count on the master counter 304, line 406 momentarily goes to a logic "0 level, thus producing a logic 1" level at the output of gate 408 which enables gate 402. Then as the clock pulse line 400 swings from logic 0 from logic 1 to logic 0." This causes the driver circuit 388 to step the V cam motor and move the V-cam until the photodisk 138 blocks light to photodiode 436. This causes output 414 to go to a logic 1" level, which coupled with the logic l fed back from the output of gate 408 causes the output of gate 410 to go to a logic 0 level, which latches the output of gate 408 at a logic l level.
  • Air through the jet 202 to produce forward torque on the wire spool is controlled by a solenoid 460 which is energized by the wire spool forward decoder 309.
  • Air to the cavity 254 of the wire feed mechanism is controlled by solenoid 462 which is energized by the wire feed decoder 310.
  • the wire clamp solenoid 236 is energized by an output from the wire clamp decoder 312.
  • the flame nozzle 264 is moved from the inactive position to the active position by solenoid 464, which is energized by the flame active decoder 313.
  • the holddown solenoid 152 is energized by the holddown decoder 314. Provision is made to manually selectively energize each of the five solenoids as represented by pushbuttons 466-470 and the bank of diodes 472.
  • the diodes 474 connected in parallel with the various solenoids protect the circuit from inductive pulses.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
US3641660D 1969-06-30 1969-06-30 The method of ball bonding with an automatic semiconductor bonding machine Expired - Lifetime US3641660A (en)

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US83748569A 1969-06-30 1969-06-30

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JP (1) JPS565062B1 (https=)
KR (1) KR780000596B1 (https=)
DE (2) DE2066210A1 (https=)
FR (1) FR2048054B1 (https=)
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US3973713A (en) * 1973-11-14 1976-08-10 Hitachi, Ltd. Wire bonding system
DE2746814A1 (de) * 1976-10-18 1978-04-20 Texas Instruments Inc Anordnung zur automatischen ausfuehrung einer folge von arbeitsgaengen an einem werkstueck
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
US4340166A (en) * 1978-11-22 1982-07-20 Kulicke & Soffa Industries, Inc. High speed wire bonding method
EP0072113A1 (en) * 1981-08-03 1983-02-16 Texas Instruments Incorporated Apparatus and method for forming aluminum balls for ball bonding
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
US5244140A (en) * 1991-09-30 1993-09-14 Texas Instruments Incorporated Ultrasonic bonding process beyond 125 khz
US6134777A (en) * 1998-07-14 2000-10-24 Robert Bosch Gmbh Bonding method
US6196445B1 (en) * 1995-12-18 2001-03-06 Micron Technology, Inc. Method for positioning the bond head in a wire bonding machine
US6520026B1 (en) * 1999-11-03 2003-02-18 International Business Machines Corporation Method for making and testing thermocompression bonds
US6651866B2 (en) 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
US20050051600A1 (en) * 2003-09-10 2005-03-10 Texas Instruments Incorporated Method and system for stud bumping
US20050247760A1 (en) * 2004-04-22 2005-11-10 Semikron Elektronik Gmbh Method for securing electronic components to a substrate
US20090091006A1 (en) * 2007-10-04 2009-04-09 Rex Warren Pirkle Dual Capillary IC Wirebonding

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Publication number Priority date Publication date Assignee Title
DE19617470B4 (de) * 1995-11-07 2006-02-02 Hesse & Knipps Gmbh Fadenzuführung

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US3973713A (en) * 1973-11-14 1976-08-10 Hitachi, Ltd. Wire bonding system
DE2746814A1 (de) * 1976-10-18 1978-04-20 Texas Instruments Inc Anordnung zur automatischen ausfuehrung einer folge von arbeitsgaengen an einem werkstueck
FR2368073A1 (fr) * 1976-10-18 1978-05-12 Texas Instruments Inc Dispositif de manipulation automatique d'une piece par rapport a un outil
US4340166A (en) * 1978-11-22 1982-07-20 Kulicke & Soffa Industries, Inc. High speed wire bonding method
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
EP0072113A1 (en) * 1981-08-03 1983-02-16 Texas Instruments Incorporated Apparatus and method for forming aluminum balls for ball bonding
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5244140A (en) * 1991-09-30 1993-09-14 Texas Instruments Incorporated Ultrasonic bonding process beyond 125 khz
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
US6276594B1 (en) * 1995-12-18 2001-08-21 Micron Technology, Inc. Method for positioning the bond head in a wire bonding machine
US6196445B1 (en) * 1995-12-18 2001-03-06 Micron Technology, Inc. Method for positioning the bond head in a wire bonding machine
US6223967B1 (en) 1995-12-18 2001-05-01 Micron Technology, Inc. Extended travel wire bonding machine
US6253991B1 (en) 1995-12-18 2001-07-03 Micron Technology, Inc. Extended travel wire bonding machine
US6253990B1 (en) * 1995-12-18 2001-07-03 Micron Technology, Inc. Method for positioning the bond head in a wire bonding machine
US6321970B1 (en) * 1995-12-18 2001-11-27 Micron Technology, Inc. Wire bonding machine
US6134777A (en) * 1998-07-14 2000-10-24 Robert Bosch Gmbh Bonding method
US6520026B1 (en) * 1999-11-03 2003-02-18 International Business Machines Corporation Method for making and testing thermocompression bonds
US6651866B2 (en) 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
US20050051600A1 (en) * 2003-09-10 2005-03-10 Texas Instruments Incorporated Method and system for stud bumping
US20050247760A1 (en) * 2004-04-22 2005-11-10 Semikron Elektronik Gmbh Method for securing electronic components to a substrate
US8662377B2 (en) * 2004-04-22 2014-03-04 Semikron Elektronik Gmbh & Co., Kg Method for securing electronic components to a substrate
US20090091006A1 (en) * 2007-10-04 2009-04-09 Rex Warren Pirkle Dual Capillary IC Wirebonding
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding

Also Published As

Publication number Publication date
JPS565062B1 (https=) 1981-02-03
FR2048054B1 (https=) 1975-09-26
DE2032302A1 (de) 1971-02-25
FR2048054A1 (https=) 1971-03-19
GB1323331A (en) 1973-07-11
NL172806C (nl) 1983-10-17
KR780000596B1 (en) 1978-11-23
NL7009641A (https=) 1971-01-04
NL172806B (nl) 1983-05-16
DE2066210A1 (https=) 1986-03-20
DE2032302C2 (de) 1987-01-29

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