NL7009641A - - Google Patents

Info

Publication number
NL7009641A
NL7009641A NL7009641A NL7009641A NL7009641A NL 7009641 A NL7009641 A NL 7009641A NL 7009641 A NL7009641 A NL 7009641A NL 7009641 A NL7009641 A NL 7009641A NL 7009641 A NL7009641 A NL 7009641A
Authority
NL
Netherlands
Application number
NL7009641A
Other versions
NL172806C (nl
NL172806B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7009641A publication Critical patent/NL7009641A/xx
Publication of NL172806B publication Critical patent/NL172806B/xx
Application granted granted Critical
Publication of NL172806C publication Critical patent/NL172806C/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49838—Assembling or joining by stringing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NL7009641A 1969-06-30 1970-06-30 Werkwijze voor het verbinden van metalen draden aan gemetalliseerde zones van een halfgeleiderelement. NL172806C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83748569A 1969-06-30 1969-06-30

Publications (3)

Publication Number Publication Date
NL7009641A true NL7009641A (https=) 1971-01-04
NL172806B NL172806B (nl) 1983-05-16
NL172806C NL172806C (nl) 1983-10-17

Family

ID=25274582

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7009641A NL172806C (nl) 1969-06-30 1970-06-30 Werkwijze voor het verbinden van metalen draden aan gemetalliseerde zones van een halfgeleiderelement.

Country Status (7)

Country Link
US (1) US3641660A (https=)
JP (1) JPS565062B1 (https=)
KR (1) KR780000596B1 (https=)
DE (2) DE2066210A1 (https=)
FR (1) FR2048054B1 (https=)
GB (1) GB1323331A (https=)
NL (1) NL172806C (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5080763A (https=) * 1973-11-14 1975-07-01
GB1592368A (en) * 1976-10-18 1981-07-08 Texas Instruments Inc Automated manipulative operation system
US4340166A (en) * 1978-11-22 1982-07-20 Kulicke & Soffa Industries, Inc. High speed wire bonding method
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
US5244140A (en) * 1991-09-30 1993-09-14 Texas Instruments Incorporated Ultrasonic bonding process beyond 125 khz
DE19617470B4 (de) * 1995-11-07 2006-02-02 Hesse & Knipps Gmbh Fadenzuführung
US5813590A (en) * 1995-12-18 1998-09-29 Micron Technology, Inc. Extended travel wire bonding machine
DE19831550B4 (de) * 1998-07-14 2013-08-14 Robert Bosch Gmbh Bondverfahren
US6520026B1 (en) * 1999-11-03 2003-02-18 International Business Machines Corporation Method for making and testing thermocompression bonds
US6651866B2 (en) 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
US20050051600A1 (en) * 2003-09-10 2005-03-10 Texas Instruments Incorporated Method and system for stud bumping
DE102004056702B3 (de) * 2004-04-22 2006-03-02 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL113327C (https=) * 1956-10-31 1900-01-01
US3006068A (en) * 1957-03-22 1961-10-31 Bell Telephone Labor Inc Twist-compression bonding of metallic and metallized surfaces
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3029348A (en) * 1959-10-02 1962-04-10 Western Electric Co Electro-optical servo system for coarse and fine positioning of transistors
NL269297A (https=) * 1960-10-06 1900-01-01
US3207904A (en) 1962-04-09 1965-09-21 Western Electric Co Electro-optical article positioning system
US3235945A (en) * 1962-10-09 1966-02-22 Philco Corp Connection of semiconductor elements to thin film circuits using foil ribbon
US3250452A (en) * 1963-01-29 1966-05-10 Kulicke And Soffa Mfg Company Nail head bonding apparatus for thermocompressively securing lead wire to semi-conductor devices
US3357090A (en) * 1963-05-23 1967-12-12 Transitron Electronic Corp Vibratory welding tip and method of welding
DE1439262B2 (de) * 1963-07-23 1972-03-30 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum kontaktieren von halbleiterbauelementen durch thermokompression
US3313464A (en) * 1963-11-07 1967-04-11 Western Electric Co Thermocompression bonding apparatus
US3286340A (en) * 1964-02-28 1966-11-22 Philco Corp Fabrication of semiconductor units
US3358897A (en) * 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
US3363818A (en) * 1965-03-04 1968-01-16 Basic Products Corp Spool mount for wire feed device
US3319859A (en) * 1965-03-04 1967-05-16 Basic Products Corp Capillary wire feed device
US3397451A (en) * 1966-04-06 1968-08-20 Western Electric Co Sequential wire and articlebonding methods
US3472443A (en) * 1966-04-12 1969-10-14 Fansteel Inc Weld tip guide and apparatus
US3430835A (en) * 1966-06-07 1969-03-04 Westinghouse Electric Corp Wire bonding apparatus for microelectronic components
US3442432A (en) 1967-06-15 1969-05-06 Western Electric Co Bonding a beam-leaded device to a substrate

Also Published As

Publication number Publication date
JPS565062B1 (https=) 1981-02-03
FR2048054B1 (https=) 1975-09-26
DE2032302A1 (de) 1971-02-25
FR2048054A1 (https=) 1971-03-19
GB1323331A (en) 1973-07-11
NL172806C (nl) 1983-10-17
KR780000596B1 (en) 1978-11-23
NL172806B (nl) 1983-05-16
US3641660A (en) 1972-02-15
DE2066210A1 (https=) 1986-03-20
DE2032302C2 (de) 1987-01-29

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Legal Events

Date Code Title Description
V4 Discontinued because of reaching the maximum lifetime of a patent