US3580820A - Palladium-nickel alloy plating bath - Google Patents
Palladium-nickel alloy plating bath Download PDFInfo
- Publication number
- US3580820A US3580820A US695576A US3580820DA US3580820A US 3580820 A US3580820 A US 3580820A US 695576 A US695576 A US 695576A US 3580820D A US3580820D A US 3580820DA US 3580820 A US3580820 A US 3580820A
- Authority
- US
- United States
- Prior art keywords
- palladium
- nickel
- bath
- salt
- nickel alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title abstract description 25
- 229910000990 Ni alloy Inorganic materials 0.000 title abstract description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical class [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 65
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical class [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 38
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract description 10
- 229940124530 sulfonamide Drugs 0.000 abstract description 5
- 238000013019 agitation Methods 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910021529 ammonia Inorganic materials 0.000 abstract description 3
- 150000003456 sulfonamides Chemical class 0.000 abstract description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 abstract description 2
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 description 33
- 229910052759 nickel Inorganic materials 0.000 description 19
- -1 aromatic sulfonamide Chemical class 0.000 description 12
- 150000003839 salts Chemical class 0.000 description 11
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 9
- 229910052708 sodium Inorganic materials 0.000 description 9
- 239000011734 sodium Substances 0.000 description 9
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 235000011114 ammonium hydroxide Nutrition 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 150000002815 nickel Chemical class 0.000 description 6
- NJPKYOIXTSGVAN-UHFFFAOYSA-K trisodium;naphthalene-1,3,6-trisulfonate Chemical compound [Na+].[Na+].[Na+].[O-]S(=O)(=O)C1=CC(S([O-])(=O)=O)=CC2=CC(S(=O)(=O)[O-])=CC=C21 NJPKYOIXTSGVAN-UHFFFAOYSA-K 0.000 description 5
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 4
- 229910001453 nickel ion Inorganic materials 0.000 description 4
- 150000002940 palladium Chemical class 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 3
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 3
- 235000011130 ammonium sulphate Nutrition 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- PSZYNBSKGUBXEH-UHFFFAOYSA-M naphthalene-1-sulfonate Chemical compound C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-M 0.000 description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 241000080590 Niso Species 0.000 description 2
- 241000933336 Ziziphus rignonii Species 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 2
- 239000013535 sea water Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QDHHCQZDFGDHMP-UHFFFAOYSA-N Chloramine Chemical compound ClN QDHHCQZDFGDHMP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- IDAGXRIGDWCIET-SDFKWCIISA-L disodium;(2s,3s,4s,5r)-2,3,4,5-tetrahydroxyhexanedioate Chemical compound [Na+].[Na+].[O-]C(=O)[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O IDAGXRIGDWCIET-SDFKWCIISA-L 0.000 description 1
- YGSZNSDQUQYJCY-UHFFFAOYSA-L disodium;naphthalene-1,5-disulfonate Chemical compound [Na+].[Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1S([O-])(=O)=O YGSZNSDQUQYJCY-UHFFFAOYSA-L 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Definitions
- a palladium-nickel alloy plating bath is formed of a solution of palladium salt and a nickel salt in ammonia and a brightener in the nature of a sulfonate or a sulfonamide is added to the bath in which a metal is plated for approximately 30 minutes at a pH in the range of 7.5, temperature in the range of 30 C., and cathode current density in the range of 1 a./dm. without agitation.
- the present invention relates to a palladium-nickel alloy plating bath.
- the palladium content in the codeposited layer can be established on any point within the range of 30% and 90% by adjusting the composition of the bath or plating condition, that the so-plated surface obtained shows sufiicient brightness and corrosion-resistance and that accordingly this bath for plating satisfies said object of the invention.
- the first composition of the bath for plating comprises monosalt such as palladium chloride PdCl and complex salt such as palladous amino chloride Pd(NH Cl are used as supply sources for palladium.
- monosalt such as palladium chloride PdCl
- complex salt such as palladous amino chloride Pd(NH Cl) are used as supply sources for palladium.
- nickel nickel sulfate NiSo -7H O', nickel chloride NiCl '6H O etc. are used.
- the palladium and nickel salts are converted into the form of amino complex salt.
- Ammonium salt of inorganic acid or organic acid such as ammonium sulfate and ammonium citrate may be added.
- a combination of 20 g./l. of palladium and 10 g./l. of nickel produce alloy deposited layer comprising palladium in the amount of and alloy deposited layer composed of 60% of palladium is obtained with a combination of 10 g./l. of palladium and 10 g./l. of nickel. It is not only the concentration ratio of palladium and nickel that afiects the composition of the alloy deposited layer. Nevertheless other conditions such as pH of the bath, the temperature and cathode current density involve negligible problems because it is easy to keep these conditions constant during plating operation and except the pH of the bath the remaining conditions may be relatively varied without adversely affecting the desired results. Therefore desired the codeposited layer can be obtained if essentially the concentration of palladium and nickel in the bath and ratio thereof are controlled within the ranges defined.
- sulfo compositions such as naphthalenesulfonate or aromatic sulfonamide
- a bright plating can be obtained.
- Discovery of these brighteners gave the bath great practical value. Examples of naphthalenesulfonate that can be used are given in the following.
- aromatic sulionamide examples are:
- composition and internal stress of the deposited layer show no noticeable change by this bright plating. Satisfactory results can be obtained when said bath is operated at pH 7-10, temperature 15-40 C., cathode current density 0.5-1.5 ampere/dm using palladium or graphite anode.
- concentration of palladium and nickel must be estimated by chemical analysis and always controlled properly. Supplies of deposition metal is elfectuated by adding said salt directly in the bath. While continuing plating the ammonium salt is gradually accumulated in the bath but it has no deleterious effect.
- the pH is adjusted by adding ammonia water and dilute sulphuric acid. Generally, lowering of pH tends to enlarge the deposition potential of nickel and increase the nickel content in the deposited layer.
- palladium content in the deposited layer is not comprised within 30% and 90% owing to improper composition of the bath or plating condition.
- the palladium content in the codeposited layer goes far from the range of 30 to 90%, solid solution of palladium and nickel is not formed completely and when applied thick plating plated surface loses its brightness and is easy to crack.
- Other plating conditions are the same with that of conventional method. There are no restriction as to the kind of the base metals.
- EXAMPLE 1 A bath containing 20 g. of palladous amine chloride Pd(NH Cl 50 cc. of 28% ammonia water and 700 cc. of water was prepared. Then added ammonium sulfate of 50 g., nickel sulfate NiSO -7H O of 50 g. and water sufficient enough to form 1000 cc. of the bath.
- a brass test piece was plated in said bath for 30 minutes at pH of 7.5, temperature 30 C., cathode current density 1 a./-dm. without agitation.
- Alloy comprising palladium in 60% and nickel in 40% with white bright surface was obtained from this bath and deposited layer well adhered to the base.
- EXAMPLE 2 Added 10 g. of sodium 1,3,6-naphthalene trisulfonate to the bath of Example 1, and plated for 30 minutes under the same condition with Example 1.
- EXAMPLE 3 A bath containing 40 g. of palladous ammine chloride Pd(NH Cl 50 cc. of 28% ammonia water and 700 cc.
- a brass test piece was plated in said bath for 30 minutes at pH of 8.8, temperature 30 C., cathode current density 1 a./dm. without agitation.
- a palladium-nickel alloy plating bath having a pH of 7 to 10 composed of ammonia water containing 5 to 30 g./1. of palladium ions, and 5 to 30 g./ l. of nickel ions and an alkali metal naphthalenesulfonate in an amount effective for obtaining a bright palladium-nickel alloy electrodeposited layer in which palladium content is within 30 to thereof.
- a palladium-nickel alloy plating bath having a pH of 7 to 10 composed of ammonia water containing 5 to 30 g./l. of palladium ions, 5 to 30 g./l. of nickel ions and a member of a group consisting of sodium tit-naphthalenesulfonate, sodium fl-naphthalene-sulfonate, sodium 1,5- naphthalene-disulfonate, and sodium 1,3,6-naphthalenetrisulfonate in an amount effective for obtaining a bright palladium-nickel alloy electrodeposited layer in which palladium content thereof is within 30 to 90%.
- a palladium-nickel alloy plating bath having a pH of 7 to 10 composed of aqueous ammonia containing in solution a palladium amine complex salt incorporating 5 to 30 g./ 1. of palladium ions, a nickel amine complex salt incorporating 5 to 30 g./l. of nickel ions and, as brightener, an effective amount of sodium 1,3,6-naphthalenetrisulfonate whereby a bright palladium-nickel alloy electrodeposited layer having a palladium content between 30 and 90% may be obtained.
- a palladium-nickel alloy plating bath having a pH of 7 to 10 composed of aqueous ammonia containing in solution a salt incorporating 5 to 30 g./l. of palladium ions present in the form of palladium-amine chloride and a salt incorporating 5 to 30 g./l.
- nickel ions present in the form of a member of a group selected from an amine nickel sulphate and an amine nickel chloride and a brightener comprising a member of a group consisting of sodium a-naphthalene-sulfonate, sodium ,B-naphthalene-sulfonate, sodium 1,S-naphthalenedisulfonate, sodium 1,3,6- naphthalene-trisulfonate in an amount effective for obtaining a palladium-nickel alloy electrodeposited layer in which the palladium content is within 30 to 90% thereof.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP186867A JPS4733176B1 (enrdf_load_stackoverflow) | 1967-01-11 | 1967-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3580820A true US3580820A (en) | 1971-05-25 |
Family
ID=11513510
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US695576A Expired - Lifetime US3580820A (en) | 1967-01-11 | 1968-01-04 | Palladium-nickel alloy plating bath |
| US136588A Expired - Lifetime US3677909A (en) | 1967-01-11 | 1971-04-22 | Palladium-nickel alloy plating bath |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US136588A Expired - Lifetime US3677909A (en) | 1967-01-11 | 1971-04-22 | Palladium-nickel alloy plating bath |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US3580820A (enrdf_load_stackoverflow) |
| JP (1) | JPS4733176B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1143178A (enrdf_load_stackoverflow) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USB435844I5 (enrdf_load_stackoverflow) * | 1974-01-23 | 1975-01-28 | ||
| US4098656A (en) * | 1976-03-11 | 1978-07-04 | Oxy Metal Industries Corporation | Bright palladium electroplating baths |
| US4100039A (en) * | 1976-11-11 | 1978-07-11 | International Business Machines Corporation | Method for plating palladium-nickel alloy |
| US4224115A (en) * | 1975-12-03 | 1980-09-23 | Mitsubishi Denki Kabushiki Kaisha | Process for forming electrode on semiconductor device |
| US4297177A (en) * | 1980-09-19 | 1981-10-27 | American Chemical & Refining Company Incorporated | Method and composition for electrodepositing palladium/nickel alloys |
| DE3108508A1 (de) * | 1981-03-06 | 1982-09-16 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Bad zur galvanischen abscheidung einer palladium/nickel-legierung |
| US4392921A (en) * | 1980-12-17 | 1983-07-12 | Occidental Chemical Corporation | Composition and process for electroplating white palladium |
| US4428802A (en) | 1980-09-19 | 1984-01-31 | Kabushiki Kaisha Suwa Seikosha | Palladium-nickel alloy electroplating and solutions therefor |
| DE3400139A1 (de) * | 1983-01-07 | 1984-07-12 | Omi International Corp., Warren, Mich. | Galvanisches bad fuer die schnellabscheidung von palladium und ein verfahren zur galvanischen schnellabscheidung von palladium |
| US4487665A (en) * | 1980-12-17 | 1984-12-11 | Omi International Corporation | Electroplating bath and process for white palladium |
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
| US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
| US5976344A (en) * | 1996-05-10 | 1999-11-02 | Lucent Technologies Inc. | Composition for electroplating palladium alloys and electroplating process using that composition |
| US20090038950A1 (en) * | 2007-07-20 | 2009-02-12 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
| US20110147225A1 (en) * | 2007-07-20 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH572989A5 (enrdf_load_stackoverflow) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp | |
| JPS5254369A (en) * | 1975-10-29 | 1977-05-02 | Mitsubishi Electric Corp | Schottky barrier semiconductor device |
| JPS5615656A (en) * | 1979-07-18 | 1981-02-14 | Nissan Shoji Kk | Preservation of formed rice |
| JPS5760090A (en) * | 1980-09-29 | 1982-04-10 | Nisshin Kasei Kk | Supplying method for palladium to palladium-nickel alloy plating solution |
| DE3108467C2 (de) * | 1981-03-06 | 1983-05-26 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verwendung eines Acetylenamins und/oder eines Aminoalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung |
| DE3108466C2 (de) * | 1981-03-06 | 1983-05-26 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verwendung eines Acetylenalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung |
| IT1152087B (it) * | 1981-09-11 | 1986-12-24 | Langbein Pfanhauser Werke Ag | Procedimento per aumentare la resistenza alla corrosione di una lega palladio-nickel depositata galvanicamente |
| EP0083488A3 (en) * | 1981-12-31 | 1985-11-06 | O'Hara, James Brian | Method of producing printed circuits |
| JPS6051992U (ja) * | 1983-09-19 | 1985-04-12 | 株式会社 ダイケイ | 串刺し米飯加工食品 |
| GB2168381B (en) * | 1984-12-12 | 1988-03-09 | Stc Plc | Gold plated electrical contacts |
| US4741818A (en) * | 1985-12-12 | 1988-05-03 | Learonal, Inc. | Alkaline baths and methods for electrodeposition of palladium and palladium alloys |
| JPS63110227A (ja) * | 1986-10-27 | 1988-05-14 | Sanyo Electric Co Ltd | スチロ−ル樹脂成形品 |
| JP6663335B2 (ja) * | 2016-10-07 | 2020-03-11 | 松田産業株式会社 | パラジウム−ニッケル合金皮膜及びその製造方法 |
-
1967
- 1967-01-11 JP JP186867A patent/JPS4733176B1/ja active Pending
-
1968
- 1968-01-04 US US695576A patent/US3580820A/en not_active Expired - Lifetime
- 1968-01-10 GB GB1474/68A patent/GB1143178A/en not_active Expired
-
1971
- 1971-04-22 US US136588A patent/US3677909A/en not_active Expired - Lifetime
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USB435844I5 (enrdf_load_stackoverflow) * | 1974-01-23 | 1975-01-28 | ||
| US3925170A (en) * | 1974-01-23 | 1975-12-09 | American Chem & Refining Co | Method and composition for producing bright palladium electrodepositions |
| US4224115A (en) * | 1975-12-03 | 1980-09-23 | Mitsubishi Denki Kabushiki Kaisha | Process for forming electrode on semiconductor device |
| US4098656A (en) * | 1976-03-11 | 1978-07-04 | Oxy Metal Industries Corporation | Bright palladium electroplating baths |
| US4100039A (en) * | 1976-11-11 | 1978-07-11 | International Business Machines Corporation | Method for plating palladium-nickel alloy |
| US4428802A (en) | 1980-09-19 | 1984-01-31 | Kabushiki Kaisha Suwa Seikosha | Palladium-nickel alloy electroplating and solutions therefor |
| US4297177A (en) * | 1980-09-19 | 1981-10-27 | American Chemical & Refining Company Incorporated | Method and composition for electrodepositing palladium/nickel alloys |
| US4392921A (en) * | 1980-12-17 | 1983-07-12 | Occidental Chemical Corporation | Composition and process for electroplating white palladium |
| US4487665A (en) * | 1980-12-17 | 1984-12-11 | Omi International Corporation | Electroplating bath and process for white palladium |
| DE3108508A1 (de) * | 1981-03-06 | 1982-09-16 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Bad zur galvanischen abscheidung einer palladium/nickel-legierung |
| DE3400139A1 (de) * | 1983-01-07 | 1984-07-12 | Omi International Corp., Warren, Mich. | Galvanisches bad fuer die schnellabscheidung von palladium und ein verfahren zur galvanischen schnellabscheidung von palladium |
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
| US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
| US5976344A (en) * | 1996-05-10 | 1999-11-02 | Lucent Technologies Inc. | Composition for electroplating palladium alloys and electroplating process using that composition |
| US20090038950A1 (en) * | 2007-07-20 | 2009-02-12 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
| US20110147225A1 (en) * | 2007-07-20 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
| US9435046B2 (en) | 2007-07-20 | 2016-09-06 | Rohm And Haas Electronics Llc | High speed method for plating palladium and palladium alloys |
Also Published As
| Publication number | Publication date |
|---|---|
| US3677909A (en) | 1972-07-18 |
| GB1143178A (en) | 1969-02-19 |
| JPS4733176B1 (enrdf_load_stackoverflow) | 1972-08-23 |
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