US3551303A - Method for forming anodic oxide film on aluminum or aluminum alloy - Google Patents
Method for forming anodic oxide film on aluminum or aluminum alloy Download PDFInfo
- Publication number
- US3551303A US3551303A US663628A US3551303DA US3551303A US 3551303 A US3551303 A US 3551303A US 663628 A US663628 A US 663628A US 3551303D A US3551303D A US 3551303DA US 3551303 A US3551303 A US 3551303A
- Authority
- US
- United States
- Prior art keywords
- film
- thickness
- aluminum
- cracks
- anodic oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title description 23
- 239000010407 anodic oxide Substances 0.000 title description 22
- 229910052782 aluminium Inorganic materials 0.000 title description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title description 17
- 229910000838 Al alloy Inorganic materials 0.000 title description 8
- 230000003647 oxidation Effects 0.000 description 15
- 238000007254 oxidation reaction Methods 0.000 description 15
- 239000004020 conductor Substances 0.000 description 14
- 238000005452 bending Methods 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
Definitions
- a method for forming an anodic oxide film of a desired thickness on an aluminum or an aluminum alloy which has an improved withstand voltage when a bending stress is applied which comprises forming an anodic oxide film thinner than a desired thickness, cracking said film in a suitable manner, then conducting an anodic oxidation again and, if necessary, repeating said cracking and said anodic oxidation, whereby there is formed an anodic oxide film on an aluminum or an aluminum alloy.
- the present invention relates to a method for treating the surfaces of an aluminum and its alloy to obtain an insulating film which has a high bending resistance.
- an anodic oxide film obtained by conducting an anodic oxidation on an aluminum or its alloy is excellent in insulating property, it is used for a surface insulating material on a linear-or strip-type electrical conductor made of aluminum or aluminum alloy (this will be described as a conductor hereinafter).
- an anodic oxide film obtained by the generally known method for anodic oxidation does scarcely show flexibility and is cracked with an elongation of only 0.4-5 That is when a conductor having a surface subjected to anodic oxidation is 'bended with a curvature smaller than a certain value, a tensile stress comes to be applied on the film of outer surface, so that cracks occur running in the direction perpendicular to that of bending.
- the conductor having an anodic oxide film formed by the ordinary method has advantages that the thermal durability and the adhesive property of the film are excellent, it has a serious disadvantage that the withstand voltage of the film becomes lower when the conductor is bended with a curvature not larger than about 20 times as large as its diameter or thickness, so that with a smaller curvature than said value it can not be substantially employed.
- some methods for improving the fiexibility of film by varying electrolytes or electrolitic conditions for the anodic oxidation were not able to largely improve the resistance to bending.
- a crack density (the number of cracks per unit length in a bending direction breaking out in the outer surface of a conductor) is increased with the same film thickness and the same bending curvature.
- the present invention has been accomplished on the basis of this consideration and "ice the experimental result that with the same quality of film, the crack density is reduced with the same elongation rate, as the film thickness is increased.
- anodic oxide film whose bending resistance is improved, on an alurninum and an alurninum alloy.
- an anodic oxide film whose insulating property at the time of applying a tensile stress is improved, on an aluminum or an alurninum alloy, characterized by forming an anodic oxide film having a thickness thinner than a desired value on the surface of an aluminum or an aluminum alloy, then elongating said anodic oxide film so as to break out cracks over all region of said' film, then again conductng an anodic oxidation on said aluminum or aluminum alloy so as to increase the thickness of said whole anodic oxide film and, if necessary, repeating the above Operations, whereby an anodic oxide film of a desired thickness is formed.
- FIG. 1a shows schematically a state of crack formation in an anodic oxide film prepared in accordance with the present invention
- FIG. 1b shows schematically a state of crack formation in an anodic oxide film formed by the conventional method
- FIG. 2 shows graphically the results of experiment regarding the relation between the thickness of anodic oxide film and the density of cracks (the number of cracks per unit length in elongation direction) formed in the oxide film at the time of giving a predetermined elongation.
- d1 and dz mean sizes of the crack apertures respectively, where d1 d2. That is, dl in the case that a density of cracks formed in the film 2 is larger (FIG. la) is smaller than dz in the case of a smaller density (FIG. 1b).
- FIG. 2 shows the relation between the crack density and the thickness of film obtained from an experiment. This relation was obtained with a given quality and Shape of aluminum specimens, a given anodic oxidation condition and a given elongation rate of the film. The Variation of the thickness of the film was efiected by changing time or voltage for anodic oxidation.
- an anodic oxide film having a thickness of a When an anodic oxide film having a thickness of a is to be formed on a conductor, such a thickness should not be attained at a time, but at first a film having a thickness of b (where b a) should be formed. Then the film is elongated to produce cracks over all region of the film. After that, again an anodic oxidation is conducted and stopped when the thickness of film comes to be a. It has been found that the film formed in such a manner has a tendency that when elongated, cracks break out at the same points where the cracks were formed previously, and that density of the newly formed cracks is almost equal to that of cracks in the case of the film thickness of b.
- the film thickness b in order to increase the density of cracks, it is preferable to make the film thickness b as small as possible. If a difference between the film thickness b and the final film thickness a is too large, however, after forming the film subsequently up to the thickness of a, cracks break out by elongating the film at points independent of those, where cracks Were formed at the time of the film thickness of b, only in the same state as in the case a film of a in thickness is formed from the beginning at a setting. In other words, the density of cracks does not become m but l. Therefore, there is a limitation in a ratio of the film thickness of b to that of a.
- a film of cl in thickness is formed and cracked.
- the crack density at this time is designated as nl.
- an anodic oxidation is conducted again to make the fihn thickness C2 of about 5 times as large as cl, followed by breaking out cracks again.
- the density of cracks does not become n2, but nl.
- the thickness of the film is increased to C3, c., with reaching finally a.
- the thus produced film shows, in spite of the thickness of a, a density of cracks formed by its elongation almost equal to that in the case of the film thickness of C1, that is, nl.
- liquids such as sulfuric acid, oxalic acid, phosphoric acid, chromic acid and sulfamic acid forming a porous film are suitable. Further, liquids such as boric acid and ammonium borate may be employed. In this case increasing of the film thickness is eifected by increasing a forming voltage.
- methods for breaking out cracks that is, methods for elongating a film
- the conductor, on the surface of which a film is formed is rolled on rolls of a suitable diameter having smooth surfaces or having ribbed surfaces
- a rapid temperature change is applied to the conductor having a film formed by using a difference between the thermal expansion coefiicient of aluminum or aluminum alloy and that of anodic oxide film (for example, at a temperature range of -30, C., the thermal expansion coeflicient of aluminum is 24.5 10-6/ C., while that of the film is 4.5 10 6/ C).
- Crack formation may be carried out in air after taking out a conductor from a electrolytic bath and washing the same with water, but it can be also conducted in the electrolytic bath. In the latter, only one of the electrolytic bath is required and water-washing is not necessary more than once after all the anodic oxidations are finished.
- Example An anodic oxidation was conducted on an aluminum foil of 100p. in thickness and 85 mm. in width having an aluminum purity of 99.4% in a 10% sulfuric acid solution at a current density of 0.8 a./dm.2 to form a film on the surface.
- the final film thickness was made to 10a.
- the sample A in which a film of 10a in thickness was formed at a time
- the sample B in which a film of 10a in thickness was formed by re- Peating a process ef anodic oxidaton and crack forma- TABLE 2.
- -RESULTS OF BENDING-RESISTANCE TESTS As is clear from Table 2, the anodic oxide film prepared in accordance with the present invention shows an extremely smaller reduction of its insulating characteristic at the time of application of a tensile stress comparing with that in accordance with the conventional process. Moreover, the method of the present invention can be easily carried out with an ordinary apparatus for anodic oxidation and, therefore, has an extremely large advantage in the industry.
- a method for forming an anodically oxidized film on the surface of aluminum or an alloy thereof comprising the steps of elongating an anodically oxidized film formed on the surface of aluminum or an alloy thereof to break out cracks over the whole regions of said film, and then anodically oxidizing the resultant film to increase the film thickness to break out further cracks when the film is again elongated, said increased film thickness being in the range of less than 10 times the thickness of the initially formed film and repeating said process a plurality of times to form a film having a density of cracks of more than 60 cracks/ mm. broken out in the direction of elongation.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photoreceptors In Electrophotography (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5910866 | 1966-09-05 | ||
JP6469966 | 1966-09-30 | ||
JP8341866 | 1966-12-16 | ||
JP1353267 | 1967-03-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3551303A true US3551303A (en) | 1970-12-29 |
Family
ID=27456014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US663628A Expired - Lifetime US3551303A (en) | 1966-09-05 | 1967-08-28 | Method for forming anodic oxide film on aluminum or aluminum alloy |
Country Status (4)
Country | Link |
---|---|
US (1) | US3551303A (de) |
CH (1) | CH490508A (de) |
DE (1) | DE1621114C3 (de) |
GB (1) | GB1169647A (de) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4177299A (en) * | 1978-01-27 | 1979-12-04 | Swiss Aluminium Ltd. | Aluminum or aluminum alloy article and process |
US5158663A (en) * | 1991-08-12 | 1992-10-27 | Joseph Yahalom | Protective coatings for metal parts to be used at high temperatures |
US5202013A (en) * | 1991-10-15 | 1993-04-13 | Alcan International Limited | Process for coloring metal surfaces |
US20100001629A1 (en) * | 2007-05-16 | 2010-01-07 | Eden J Gary | Arrays of microcavity plasma devices and electrodes with reduced mechanical stress |
US8362699B2 (en) | 2007-10-25 | 2013-01-29 | The Board Of Trustees Of The University Of Illinois | Interwoven wire mesh microcavity plasma arrays |
US8404558B2 (en) | 2006-07-26 | 2013-03-26 | The Board Of Trustees Of The University Of Illinois | Method for making buried circumferential electrode microcavity plasma device arrays, and electrical interconnects |
US8547004B2 (en) | 2010-07-27 | 2013-10-01 | The Board Of Trustees Of The University Of Illinois | Encapsulated metal microtip microplasma devices, arrays and fabrication methods |
US8968668B2 (en) | 2011-06-24 | 2015-03-03 | The Board Of Trustees Of The University Of Illinois | Arrays of metal and metal oxide microplasma devices with defect free oxide |
US9659737B2 (en) | 2010-07-29 | 2017-05-23 | The Board Of Trustees Of The University Of Illinois | Phosphor coating for irregular surfaces and method for creating phosphor coatings |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2714394C3 (de) * | 1977-02-03 | 1981-01-15 | Schweizerische Aluminium Ag, Chippis (Schweiz) | Verwendung von Aluminium oder Aluminiumlegierungen mit darauf anodisch erzeugten Oxidschichten für den Thermotransferdruck |
DE59009223D1 (de) * | 1989-03-16 | 1995-07-20 | Alusuisse Lonza Services Ag | Verfahren zur Erzeugung einer strukturierten Oberfläche auf einem Gegenstand aus Aluminium oder einer Aluminiumlegierung. |
EP3445896B1 (de) | 2016-04-18 | 2023-10-18 | Fokker Aerostructures B.V. | Verfahren zur anodisierung eines artikels aus aluminium oder einer legierung davon |
-
1967
- 1967-08-24 GB GB39080/67A patent/GB1169647A/en not_active Expired
- 1967-08-28 US US663628A patent/US3551303A/en not_active Expired - Lifetime
- 1967-09-05 DE DE1621114A patent/DE1621114C3/de not_active Expired
- 1967-09-05 CH CH1239067A patent/CH490508A/de not_active IP Right Cessation
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4177299A (en) * | 1978-01-27 | 1979-12-04 | Swiss Aluminium Ltd. | Aluminum or aluminum alloy article and process |
US5158663A (en) * | 1991-08-12 | 1992-10-27 | Joseph Yahalom | Protective coatings for metal parts to be used at high temperatures |
EP0531183A2 (de) * | 1991-08-18 | 1993-03-10 | Joseph Yahalom | Schutzbeschichtungen für Metallteile, die bei hohen Temperaturen verwendet werden |
EP0531183B1 (de) * | 1991-08-18 | 1998-04-01 | Joseph Yahalom | Schutzbeschichtungen für Metallteile, die bei hohen Temperaturen verwendet werden |
US5202013A (en) * | 1991-10-15 | 1993-04-13 | Alcan International Limited | Process for coloring metal surfaces |
US8404558B2 (en) | 2006-07-26 | 2013-03-26 | The Board Of Trustees Of The University Of Illinois | Method for making buried circumferential electrode microcavity plasma device arrays, and electrical interconnects |
US8159134B2 (en) | 2007-05-16 | 2012-04-17 | The Board Of Trustees Of The University Of Illinois | Arrays of microcavity plasma devices and electrodes with reduced mechanical stress |
EP2153454A4 (de) * | 2007-05-16 | 2011-02-23 | Univ Illinois | Arrays von mikrokavitäts-plasmageräten und elektroden mit reduzierter mechanischer belastung |
EP2153454A1 (de) * | 2007-05-16 | 2010-02-17 | The Board Of Trustees Of The University Of Illinois | Arrays von mikrokavitäts-plasmageräten und elektroden mit reduzierter mechanischer belastung |
US20100001629A1 (en) * | 2007-05-16 | 2010-01-07 | Eden J Gary | Arrays of microcavity plasma devices and electrodes with reduced mechanical stress |
US8535110B2 (en) | 2007-05-16 | 2013-09-17 | The Board Of Trustees Of The University Of Illinois | Method to manufacture reduced mechanical stress electrodes and microcavity plasma device arrays |
US8362699B2 (en) | 2007-10-25 | 2013-01-29 | The Board Of Trustees Of The University Of Illinois | Interwoven wire mesh microcavity plasma arrays |
US8547004B2 (en) | 2010-07-27 | 2013-10-01 | The Board Of Trustees Of The University Of Illinois | Encapsulated metal microtip microplasma devices, arrays and fabrication methods |
US8870618B2 (en) | 2010-07-27 | 2014-10-28 | The Board Of Trustees Of The University Of Illinois | Encapsulated metal microtip microplasma device and array fabrication methods |
US9659737B2 (en) | 2010-07-29 | 2017-05-23 | The Board Of Trustees Of The University Of Illinois | Phosphor coating for irregular surfaces and method for creating phosphor coatings |
US8968668B2 (en) | 2011-06-24 | 2015-03-03 | The Board Of Trustees Of The University Of Illinois | Arrays of metal and metal oxide microplasma devices with defect free oxide |
US9579624B2 (en) | 2011-06-24 | 2017-02-28 | The Board Of Trustees Of The University Of Illinois | Gas reactor devices with microplasma arrays encapsulated in defect free oxide |
Also Published As
Publication number | Publication date |
---|---|
GB1169647A (en) | 1969-11-05 |
DE1621114B2 (de) | 1977-07-28 |
DE1621114A1 (de) | 1971-05-13 |
DE1621114C3 (de) | 1978-03-23 |
CH490508A (de) | 1970-05-15 |
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