US3471379A - Tin plating baths - Google Patents

Tin plating baths Download PDF

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Publication number
US3471379A
US3471379A US521803A US3471379DA US3471379A US 3471379 A US3471379 A US 3471379A US 521803 A US521803 A US 521803A US 3471379D A US3471379D A US 3471379DA US 3471379 A US3471379 A US 3471379A
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US
United States
Prior art keywords
bath
tin
baths
electroplating
brightening agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US521803A
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English (en)
Inventor
Cornelis Johannes Schoot
Johannes Jacobus Ponjee
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US Philips Corp
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US Philips Corp
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Publication date
Application filed by US Philips Corp filed Critical US Philips Corp
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Publication of US3471379A publication Critical patent/US3471379A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • C25D3/32Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Definitions

  • Electroplating bath for providing a bright tin deposit containing an anion, a non-ionic surfactant, tin ions and as a brightening agent, a carbonyl compound such as a heterocyclic or aromatic carbonyl compound with the carbonyl group directly attached to the ring.
  • This invention relates to improvements in electroplating baths for obtaining bright tin deposits.
  • Electroplating baths for the deposition of tin are well known. However, most of these baths suffer from the fact that the resultant tin deposits have a dull appearance which is unsuitable for many purposes. To brighten the tin deposits it was necessary to heat the deposit for a critical period of time and temperature.
  • a principal object then of our invention is to provide an improved electroplating bath for the deposition of bright tin deposits. This and other objects of our invention will be apparent from the description that follows.
  • an acid electroplating bath containing bivalent tin ions, at least one anion selected from the group consisting of sulfate, benzenesulfonate and fluoborate ions, a reducing agent, a non-ionic surfactant and as a brightening agent a carbonyl compound selected from the group consisting of aromatic andv heterocyclic ring containing aldehydes wherein the carbonyl group is directly attached to an aromatic or aromatic ring and a, ,8 olefinically unsaturated carbonyl compounds.
  • the electroplating baths of our invention have the advantages of readily providing bright tin deposits even on work pieces having sharp edges or small apertures, allowing the electroplating to be carried out in a drum and permitting current densities of a factor of up to 1000.
  • baths of our invention have'the decided-- advantage of being particularly stable.
  • the bright tin deposits are immediately obtained.
  • the tin-plated objects when removed from the bath, are coated with a thin brown-black layer which is readily removed by rinsing in a dilute alkali solution.
  • the surfactant be a non-ionic surfactant as we have found that ionic surfactants do not 3,471,379 Patented Oct. 7, 1969 form a bright tin deposit over a wide range of current densities.
  • both the carbonyl compound and the surfactant be employed as the surfactant alone does not provide bright tin deposits and the carbonyl compounds alone provide bright tin deposits only in a very restricted range of current densities (about 5 to 20 A./cm.
  • the carbonyl compounds alone are not satisfactory for work pieces having sharp edges or plating carried out in a drum where the current density varies by a factor of or more.
  • the carbonyl compounds employed must be free of ionizable substituents and substituents reducible in the bath.
  • undesirable substituents are nitro, sulfonic acid, carboxylic acid, amino groups and substituted amino groups.
  • the at, 3 olefinically unsaturated carbonyl compound is a compound of the formula:
  • R2 R3 R4 wherein each of the symbols R R and R is a hydrogen atom, an aromatic, heterocyclic or aliphatic group or such a group wholly or partly hydrogenated, having, as the case may be, non-ionizable substituents or substituents not reducible in this medium, R is hydrogen, an alkyl group or an esterified carboxylic group or wherein the combination v I ll R13 is,.for example not in tautomeric relationship to form it. t,
  • the carbonyl compounds themselves or derivatives of the carbonyl compounds which are converted by hydrolysis in the bath into the carbonyl compounds may be employed.
  • brightening compounds Only small quantities of the carbonyl compounds (hereinafter called brightening compounds) are required. Thus quantities as small as about 25 mgs. per litre of bath liquid or even less are frequently sufficient. The upper limit is determined only by economic reasons and the solubility of the brightening agent.
  • concentration of the non-ionic surfactant may vary considerably usually from about 0.1 g. to 10 g. per litre of bath liquid.
  • non-ionic surfactants examples include Detergents and Emulsifiers 1963 Annual. John W. McCutcheon, -Inc., Morristown, New
  • Example 1 An aqueous tin-plating bath of the following composition was prepared:
  • An acid electroplating bath for depositing bright deposits of tin, said bath comprising an aqueous solution containing tin ions, at least one anion selected from the group consisting of sulfate, benzenesulfonate and fluoroborate ions, a reducing agent, a non-ionic surfactant and as the sole brightening agent at least about 25 mg. per liter of a carbonyl compound selected from the group consisting of A -dihydro-o-tolylaldehyde, A -dihydrobenzaldehyde, 3-formyl, 5,6-dihydro-2,6-dimethylpyrane and 2-benzalcyclohexanone.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US521803A 1965-02-13 1966-01-20 Tin plating baths Expired - Lifetime US3471379A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6501841A NL128321C (fr) 1965-02-13 1965-02-13

Publications (1)

Publication Number Publication Date
US3471379A true US3471379A (en) 1969-10-07

Family

ID=19792365

Family Applications (1)

Application Number Title Priority Date Filing Date
US521803A Expired - Lifetime US3471379A (en) 1965-02-13 1966-01-20 Tin plating baths

Country Status (9)

Country Link
US (1) US3471379A (fr)
AT (1) AT259965B (fr)
BE (1) BE676396A (fr)
DE (1) DE1496940B2 (fr)
ES (1) ES322902A1 (fr)
FR (1) FR1468083A (fr)
GB (1) GB1141283A (fr)
NL (1) NL128321C (fr)
SE (1) SE309141B (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634212A (en) * 1970-05-06 1972-01-11 M & T Chemicals Inc Electrodeposition of bright acid tin and electrolytes therefor
US3755096A (en) * 1971-07-01 1973-08-28 M & T Chemicals Inc Bright acid tin plating
US3769182A (en) * 1970-10-22 1973-10-30 Conversion Chem Corp Bath and method for electrodepositing tin and/or lead
US3875029A (en) * 1974-02-19 1975-04-01 R O Hull & Company Inc Plating bath for electrodeposition of bright tin and tin-lead alloy
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4242182A (en) * 1978-07-21 1980-12-30 Francine Popescu Bright tin electroplating bath
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production
US20050211561A1 (en) * 1999-08-06 2005-09-29 Ibiden Co., Ltd. Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
CN103898570A (zh) * 2012-12-27 2014-07-02 罗门哈斯电子材料有限公司 锡或锡合金电镀液

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL151449B (nl) * 1966-09-14 1976-11-15 Philips Nv Werkwijze voor de bereiding van een zuur bad voor het elektrolytisch neerslaan van tin.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE299792C (fr) * 1917-03-15
US2870070A (en) * 1957-07-17 1959-01-20 United States Steel Corp Electrodeposition of tin and electrolyte therefor
GB842898A (en) * 1956-01-16 1960-07-27 Ingeborg Geldbach Method of electrolytically depositing smooth layers of tin
US3361652A (en) * 1963-08-28 1968-01-02 Max Schlotter Dr Ing Electrodeposition of bright tin

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE299792C (fr) * 1917-03-15
GB842898A (en) * 1956-01-16 1960-07-27 Ingeborg Geldbach Method of electrolytically depositing smooth layers of tin
US2870070A (en) * 1957-07-17 1959-01-20 United States Steel Corp Electrodeposition of tin and electrolyte therefor
US3361652A (en) * 1963-08-28 1968-01-02 Max Schlotter Dr Ing Electrodeposition of bright tin

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634212A (en) * 1970-05-06 1972-01-11 M & T Chemicals Inc Electrodeposition of bright acid tin and electrolytes therefor
US3769182A (en) * 1970-10-22 1973-10-30 Conversion Chem Corp Bath and method for electrodepositing tin and/or lead
US3755096A (en) * 1971-07-01 1973-08-28 M & T Chemicals Inc Bright acid tin plating
US3875029A (en) * 1974-02-19 1975-04-01 R O Hull & Company Inc Plating bath for electrodeposition of bright tin and tin-lead alloy
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4242182A (en) * 1978-07-21 1980-12-30 Francine Popescu Bright tin electroplating bath
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production
US20050211561A1 (en) * 1999-08-06 2005-09-29 Ibiden Co., Ltd. Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
US20080230263A1 (en) * 1999-08-06 2008-09-25 Ibiden Co., Ltd. Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
US7812262B2 (en) 1999-08-06 2010-10-12 Ibiden Co., Ltd. Multilayer printed circuit board
US7993510B2 (en) * 1999-08-06 2011-08-09 Ibiden Co., Ltd. Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
CN103898570A (zh) * 2012-12-27 2014-07-02 罗门哈斯电子材料有限公司 锡或锡合金电镀液
US20140183050A1 (en) * 2012-12-27 2014-07-03 Rohm And Haas Electronic Materials Llc Tin or tin alloy plating liquid
US9926637B2 (en) 2012-12-27 2018-03-27 Rohm And Haas Electronic Materials Llc Tin or tin alloy plating liquid

Also Published As

Publication number Publication date
SE309141B (fr) 1969-03-10
BE676396A (fr) 1966-08-11
DE1496940B2 (de) 1971-04-15
NL128321C (fr)
GB1141283A (en) 1969-01-29
DE1496940A1 (de) 1970-10-01
AT259965B (de) 1968-02-12
FR1468083A (fr) 1967-02-03
ES322902A1 (es) 1966-11-16
NL6501841A (fr) 1966-08-15

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