US3415732A - Open channel flow high speed plating - Google Patents

Open channel flow high speed plating Download PDF

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Publication number
US3415732A
US3415732A US446536A US44653665A US3415732A US 3415732 A US3415732 A US 3415732A US 446536 A US446536 A US 446536A US 44653665 A US44653665 A US 44653665A US 3415732 A US3415732 A US 3415732A
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United States
Prior art keywords
impeller
channel
tank
flow
electroplating
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US446536A
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English (en)
Inventor
Joseph S Komjathy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motors Liquidation Co
Original Assignee
General Motors Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Motors Corp filed Critical General Motors Corp
Priority to US446536A priority Critical patent/US3415732A/en
Priority to GB13011/66A priority patent/GB1077594A/en
Priority to DE19661496807 priority patent/DE1496807A1/de
Priority to BE679326A priority patent/BE679326A/xx
Priority to FR57030A priority patent/FR1475331A/fr
Application granted granted Critical
Publication of US3415732A publication Critical patent/US3415732A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor

Definitions

  • An open channel flow electroplating apparatus including a flow channel and means for inducing highly uniform rapid flow of electrolyte through the channel, the means including a high volume-low pressure delivery centrifugal impeller in a log spiral enclosure for circulating electrolyte at a rate of about 0.5-4 feet per second.
  • This invention relates to electroplating, and more particularly to an apparatus for high speed electroplating in an open, conventional electroplating tank.
  • the plater is confronted with a number of problems when he is required to plate a higher production volume than his equipment can produce.
  • the plating rate of conventional electroplating machines is inherently limited. Increased current density deposition cannot be used to appreciably step up production. Moreover, increased thickness in deposits can only be attained at a loss in production rate. For these reasons, increased production or thickness has to be achieved by the purchase of additional new equipment or larger new equipment. The new equipment is costly enough, itself. However, it requires so much additional floor space that quite frequently plant expansion costs must also be incurred.
  • FIGURE 1 shows a perspective view of a conventional electroplating tank modified in accordance with the invention
  • FIGURE 2 shows a diagrammatic, horizontal, sectional view of an apparatus of the type shown in FIGURE 1;
  • FIGURE 3 shows a diagrammatic, sectional view along the line 3-3 of FIGURE 2;
  • FIGURE 4 shows a perspective view of another embodiment of the invention shown in FIGURE 1.
  • the invention comprehends an apparatus for rapidly but uniformly recirculating electroplating solution around a central baflle in an open, conventional, rectangular plat- 3,415,732 Patented Dec. 10, 1968 ing tank.
  • the baffle provides an elongated, annular electroplating solution flow channel within the tank.
  • a high volume-low pressure, centrifugal impeller housed in a log spiral enclosure at one end of the baflie produces rapid, uniform electroplating solution flow in the channel.
  • Turning vanes at the opposite end of the battle insure uniform solution flow throughout the length of the channel.
  • FIGURE 1 A central baffle 10 is disposed within the rectangular tank 12. The ends of the bafile 10 do not extend to the end walls of tank 12 thereby providing an annular electroplating solution flow channel 14 within the tank.
  • a wire screen 20 closely spaced from the outlet 22 of impeller housing 18 aids to stabilize the solution flow so that it is uniform even close to impeller housing outlet 22.
  • the turning vanes 24 at the opposite end of the central bafiie insure uniform electroplating solution flow throughout the channel by stabilizing the flow around the adjacent end of the central bafile.
  • the turning vanes 24 can be adjusted by rods 26 and 28 to accurately control solution flow.
  • the inlet (not shown) for the vertically mounted, centrifugal impeller 16 is on the underside of the impeller.
  • An impeller housing inlet 30 is located in the side of the impeller housing 18 below the plane of the impeller 16 for return flow of the electroplating solution. Inlet 30 can be in the lower wall 32 of the impeller housing 18, should it be desired.
  • An appropriate work conveyor system not shown, is used to move work pieces 44 through the tank 12.
  • the work pieces 44 are suspended from racks38 which are, in turn, suspended from the cathode bus bars 40a.
  • Anodes 36 are suspended from anode bus bars 40b.
  • My invention primarily contemplates modifying existing open plating tanks of conventional electroplating machines so that high speed plating can be accomplished in them without further extensive machine modification. Consequently, the invention is primarily intended for use with a rectangular tank from a conventional electroplating machine. However, the invention can be used with open electroplating tanks of generally any shape, including square, L-sha-ped, ovulate, circular and the like.
  • the central baffle 10 preferably extends directly from the bottom of the tank to above the level of the electroplating solution in the tank. If it did not substantially so extend, losses in recirculation efliciency and elfectiveness in the solution flow uniformity would result.
  • the baflie is appropriately shorter in length than the tank, of course, to provide adequate circulation around the end of the bafile.
  • Impeller 16 must be a vertically mounted, high volumelow pressure impeller capable of producing uniform flow substantially throughout the channel 14 at a velocity of about 0.5-4 feet per second. However, a velocity of l3 feet per second is preferred. I have found that to get maximum utilization of channel length one must use an impeller delivering at least 90% of the volume recirculated in the tank at a pressure below about 20 inches of water and preferably below about 6l2 inches of water.
  • the impeller 16 not only must have a high deliverylow pressure characteristic but also must deliver electrolyte to the channel in a uniform distribution.
  • the height-to-diameter ratio of the impeller must be about 0.4.
  • the impeller diameter must be within about 10% of the channel width. If the channel depth-twidth ratio exceeds about 1.5, more than one impeller is necessary to get uniform distribution. For each whole number added to this ratio, a corresponding number of additional impellers should be used.
  • Each of the impellers can be housed in separate log spiral enclosures, or all of them housed in one enclosure, as one chooses.
  • the impellers are vertically spaced from one another, of course, to permit electroplating solution to enter each impeller inlet. As previously indicated, the impeller inlet is located on the lower side of each impeller to prevent impeller starvation, and thereby insure uniform circulation in the system.
  • the log spiral housing 18 for the impeller 16 is necessary to obtain uniform delivery. Moreover, it is also of importance in obtaining efiicient impeller delivery.
  • the housing 18 is preferably positioned within the tank 12 in such a manner as to generally prevent recirculation of the electrolyte in the channel 14 without going through the housing. Best control of uniformity in solution flow is thereby achieved.
  • impeller housing assembly If the impeller housing assembly is not extremely closely fitted, or sealed in place, it can be much more easily installed, adjusted and replaced. Moreover, such a construction offers an ancillary advantage in that it facilitates use of commercially available impeller housing assemblies from a variety of sources.
  • the impeller housing inlet 30 for return flow of electroplating solution to the impeller 16 can be of any configuration but preferably short and wide. However, inlet 30 should be located below the plane of impeller 16, since the impeller inlet (not shown) is on the lower side of the impeller.
  • the housing inlet 30 should have an area which is suflicient to prevent starvation of the impeller. Generally, a housing inlet area about equal to the impeller inlet area can be used. If more than one impeller is used, as in FIGURES 2 and 3, the two impellers should be vertically spaced from one another so that the upper impeller 16 is not starved.
  • the housing inlet 30 for the upper impeller 16 should be located between the two impellers 16 and 16 on the housing wall.
  • the housing inlet 30 for the lower impeller 16', or when only one impeller is used, can be either in the housing side wall or in the bottom 32 of the housing. If in the bottom, the housing should, of course, be spaced somewhat from the bottom of the tank.
  • the outlet 22 for the log spiral impeller housing 18 should have a width which is substantially the same as, within about of, the channel width in order to obtain maximum utilization of the channel for plating.
  • an outlet width within only about 25% of the channel width.
  • the height of the housing outlet is principally dictated by the impeller height, inlet opening height, plus nominal clearances for the components involved, since the upper and lower walls of the impeller housing are generally parallel.
  • the housing is positioned so that the electroplating solution exiting the housing outlet is directed parallel to the channel wall, to stabilize solution fiow in the shortest channel distance.
  • flow stabilizing means such as one or more metal screens, sets of vanes, louvers, or the like, can be used.
  • the screens should be at least 70% open. The stabilizing means effectively extends the length of the plating area in the channel by permitting satisfactory plating closer to the housing outlet.
  • the turning vanes 24 at the end of the baflie opposite to the impeller housing can be of any type which will facilitate uniform flow of the solution around the end of the bafile, for return back to the impeller.
  • These vanes can be fixed or movable. They can be flat, arcuate or of any other configuration which would facilitate uniform solution flow.
  • the duct extension 34 is an extension of the impeller housing outlet 22 shown in FIGURE 1.
  • the duct crosssectional dimensions should, therefore, be dictated by the preferred housing outlet 22 dimensions explained in connection with FIGURE 1.
  • turning vanes can also be used in the duct extension 34 if it is desired, especially if the offset is so large so to form an L-shaped tank. Otherwise, the apparatus shown in FIGURE 4 is the same as described in connection with FIGURES 1-3. With the impeller housing assembly being offset, plating racks can be lifted from the tank and moved out of the tank area over the duct 34 without encountering any obstruction.
  • An apparatus for open channel flow electroplating which comprises a generally annular electroplating solution flow channel adapted to contain electrodes and means in said channel to induce highly uniform rapid flow of electroplating solution around said channel, said uniform flow-inducing means including at least one vertically mounted centrifugal impeller which provides relatively high volume-low pressure delivery, the impeller diameter being within about 25% of the width of said channel and its height-to-diameter ratio being about 0.4, the impeller inlet being on the impellers lower side, and a log spiral enclosure for said impeller having an outlet which is of a dimension substantially the same as the channel width directing fluid flow along the length of the channel.
  • An apparatus for open channel flow electroplating which comprises a tank, a central baffle in said tank forming a generally annular electroplating solution flow channel adapted to contain electrodes, means in said channel at one end of said bafile to induce highly uniform rap-id flow of electroplating solution around said channel, and turning vanes in said channel to maintain uniform solution flow, said uniform flow-inducing means including at least one vertically mounted centrifugal impeller which provides relatively high volume-low pressure delivery, the impeller diameter being wtihin about 25% of the width of said channel and its height-to-diameter ratio being about 0.4, the impeller inlet being on the impellers lower side, and a log spiral enclosure for said impeller having an outlet which is of a dimension substantially the same as the channel width directing solution flow along the length of the channel.
  • An apparatus for open channel flow electroplating which comprises an elongated tank, a central baffle in said tank producing an elongated annular electroplating solution flow channel adapted to contain electrodes, means in said channel at one end of said baflie to induce rapid flow of electroplating solution around said channel and highly uniform flow along the length of said tank, and means at the other end of said tank to facilitate uniform solution flow around the other end of said bafiie, said uniform flow-inducing means including at least one vertically mounted centrifugal impeller which provides relatively high volume-low pressure delivery, the impeller diameter being within about of the width of said channel and its height-to-diameter ratio being about 0.4, the impeller inlet being on the impellers lower side, and a log spiral enclosure for said impeller having an outlet which is of a dimension substantially the same as the channel width.
  • An apparatus for open channel flow electroplating which comprises a generally rectangular tank, a central bathe in said tank extending along the length thereof producing an elongated annular electroplating solution flow channel adapted to contain electrodes, means in said channel at one end of said tank to induce flow of electroplating solution around said channel at a rate of about 0.5-4 feet per second and highly uniform flow along substantially the whole length of the elongated portions of said channel, and turning vanes in said channel at the other end of said baflie to facilitate uniform solution flow around the end of said bafl'le, said uniform flow-inducing means consisting of at least one vertically mounted impeller which provides a relatively high volume-low pressure delivery, the impeller diameter being within 10% of the width of said channel, the impeller height-to-diameter ratio being about 0.4, the impeller inlet being located on its lower side, one such impeller for a channel depth-to-width ratio up to about 1.5 and for each whole number added to this ratio a corresponding number of additional such impellers added, and
  • An apparatus for open channel flow electroplating which comprises a generally rectangular tank, a central baflle in said tank extending along the length thereof producing an elongated annular electroplating solution flow channel adapted to contain electrodes, :an impeller assembiy in said channel at one end of said tank for recirculating electroplating solution around said channel at a rate of about 0.5-4 feet per second with highly uniform flow along substantially the whole length of the elongated portions of said channel, and turning vanes in the channel at the other end of said tank to facilitate uniform solution fiow around the end of said baffle, said impeller assembly consisting of at least one vertically mounted, high volume-low pressure impeller, the impeller diameter being within 10% of the width of said channel, the impeller height-to-diameter ratio being about 0.4, the impeller inlet being located on its lower side, one such impeller for channel depth-to-width ratios up to about 1.5 and for each whole number added to this ratio a corresponding number of additional such impellers, the total number of impellers
  • An apparatus for open channel flow electroplating which comprises an elongated tank, a central bathe in said tank extending along the length thereof producing an elongated annular electroplating solution flow channel adapted to contain electrodes, an impeller assembly in said channel, means at one end of said tank for recirculating electroplating solution around said channel at a rate of about 1-3 feet per second with highly uniform flow along substantially the Whole length of the elongated portions of said channel, said assembly delivering at least 90% of the volume recirculated in said channel at a pressure less than about 12 inches of water, said impeller assembly consisting of at least one high volumelow pressure vertically mounted impeller, the impeller diameter being within 10% of the Width of said channel, the impeller height-to-diameter ratio being about 0.4, the impeller inlet being located on its lower side, one such impeller for channel depth-to-width ratios up to about 1.5 and for each whole number added to this ratio a corresponding number of additional such. impellers, a log spiral impeller enclosure having an

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
US446536A 1965-04-08 1965-04-08 Open channel flow high speed plating Expired - Lifetime US3415732A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US446536A US3415732A (en) 1965-04-08 1965-04-08 Open channel flow high speed plating
GB13011/66A GB1077594A (en) 1965-04-08 1966-03-24 Electroplating apparatus
DE19661496807 DE1496807A1 (de) 1965-04-08 1966-04-02 Vorrichtung zum Elektroplattieren
BE679326A BE679326A (forum.php) 1965-04-08 1966-04-08
FR57030A FR1475331A (fr) 1965-04-08 1966-04-08 Appareil de galvanoplastie

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US446536A US3415732A (en) 1965-04-08 1965-04-08 Open channel flow high speed plating

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US3415732A true US3415732A (en) 1968-12-10

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US (1) US3415732A (forum.php)
BE (1) BE679326A (forum.php)
DE (1) DE1496807A1 (forum.php)
GB (1) GB1077594A (forum.php)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139429A (en) * 1978-06-15 1979-02-13 Dart Industries Inc. Electrolytic cell
US4960500A (en) * 1988-08-10 1990-10-02 Epner R L Waste metal extraction apparatus
US5282934A (en) * 1992-02-14 1994-02-01 Academy Corporation Metal recovery by batch electroplating with directed circulation
US5514258A (en) * 1994-08-18 1996-05-07 Brinket; Oscar J. Substrate plating device having laminar flow
CN103342184A (zh) * 2013-07-15 2013-10-09 苏州天华有色金属制品有限公司 一种进液均匀的箱体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2512328A (en) * 1946-06-28 1950-06-20 Armco Steel Corp Continuous electroplating device
US2519945A (en) * 1946-01-25 1950-08-22 Gen Electric Electroplating apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2519945A (en) * 1946-01-25 1950-08-22 Gen Electric Electroplating apparatus
US2512328A (en) * 1946-06-28 1950-06-20 Armco Steel Corp Continuous electroplating device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139429A (en) * 1978-06-15 1979-02-13 Dart Industries Inc. Electrolytic cell
FR2428689A1 (fr) * 1978-06-15 1980-01-11 Dart Ind Inc Cellule et procede de placage electrolytique
US4960500A (en) * 1988-08-10 1990-10-02 Epner R L Waste metal extraction apparatus
US5282934A (en) * 1992-02-14 1994-02-01 Academy Corporation Metal recovery by batch electroplating with directed circulation
US5514258A (en) * 1994-08-18 1996-05-07 Brinket; Oscar J. Substrate plating device having laminar flow
CN103342184A (zh) * 2013-07-15 2013-10-09 苏州天华有色金属制品有限公司 一种进液均匀的箱体

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BE679326A (forum.php) 1966-09-16
DE1496807A1 (de) 1969-07-17
GB1077594A (en) 1967-08-02

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