US3290738A - Apparatus for producing semiconductor devices - Google Patents

Apparatus for producing semiconductor devices Download PDF

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Publication number
US3290738A
US3290738A US336535A US33653564A US3290738A US 3290738 A US3290738 A US 3290738A US 336535 A US336535 A US 336535A US 33653564 A US33653564 A US 33653564A US 3290738 A US3290738 A US 3290738A
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Prior art keywords
sealing lips
alloying
molds
container
processing zone
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Expired - Lifetime
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US336535A
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English (en)
Inventor
Klima Karl Gerhardt
Noss Kornelius
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Siemens and Halske AG
Siemens Corp
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Siemens Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Definitions

  • An alloying apparatus of this type used in mass production includes a furnace through which the semiconductor devices are fed continuously.
  • Bodies of alloying systems consisting of semiconductor crystals and alloying metals, which are housed in capsular alloying or contact molds serving mainly to mechanically protect the sensitive semiconductor crystals, are thus fed through the furnaces.
  • Molds of this type are described for example in US. Patent No. 2,960,419. They are generally cylindrical but may also be in the form of prismatic bodies which are passed through the apparatus. They consist of ICC paratus is provided with a special drive mechanism for displacing the bodies which operates advantageosuly by simply pushing up one body after another into a heating region of the apparatus.
  • the treatment container or alloying furnace is provided with a system of straight guides engaging the outer surfaces of the mold bodies and extending from the inlet to the outlet for the molds.
  • the molds enter the apparatus at a point vertically below the point at which they emerge from the apparatus, and are advanced by being pushed from the bottom to the top of the apparatus.
  • At least three cylindrical or prismatic bodies of equal cross section are conveyed guidingly one directly behind the other through an air-tight treatment zone such as for example a container that has been evacuated or filled with protective .gas, and which has moreover been heated.
  • an air-tight treatment zone such as for example a container that has been evacuated or filled with protective .gas, and which has moreover been heated.
  • These bodies are superimposed face to face in columnar form and at least one of them serves as a container for semiconductors, semiconductor alloying systems or similar intermediate or partly manufactured semiconductor products that are to be processed.
  • FIG. 1 shows partly schematically. and partly in section an alloying furnace for the continuous processing of semiconductor devices constructed in accordance with our invention
  • FIG. 2 is a sectional view taken along the line II II The lips have protective flow of gas.
  • the container 2 is either evacuated or scavenged by a Evacuation pumps or devices for producing the protective gas flows or instruments for controlling evacuation or feeding of the protective gas flow or for controlling the temperature (all not shown) are provided in a manner well known in the art and form no part of our invention. Lines for feeding protective gas streams or evacuating the container 2 should be directly connected to the container 2 and not to the containers 1 and 3 which serve solely as locking or gating devices.
  • the middle container 2 is internallyprovided with at least two guide rails 4 that are formed of conductive, heatresistant material such as molybdenum or any suitable heat-conducting substance simultaneously acting as means for heating the container 2.
  • the guide rails 4 are accordingly connected to an electric power source 25 of suitable intensity for heating the furnace (container 2) substantially along its entire length. 'By providing suitable branching of the electric current or by suitably varying the electrically effective cross section of the rails 4, the temperature field in the interior of the furnace can be adjusted as desired.
  • tubular containers 1 and 3 which serve as locks or gates for the alloying molds 5 are shown in FIG. 1 as being of similar construction, the structural elements of both being mere mirror image arrangements of each other as viewed from the middle container 2.
  • the containers 1 and 3 serve primarily to prevent penetration of atmospheric air into the middle container 2 as much as possible so that the supply of protective gas or the vacuum provided in the middle container 2 is adequate for producing the necessary atmospheric or vacuum conditions, respectively, that are required in the interior of the container 2 during the operation of the apparatus.
  • the container 1 and the container 3 accordingly as aforesaid, include several ringshaped members 30 that are tightly pressed against each other, thereby sandwiching between themselves the outer edges of a plurality of sealing lips 13.
  • the inner wall surfaces of these ring-shaped members 30 simultaneously serve as guides for the molds 5 that are passed through them. If the :molds are to be preheated or after-heated in addition to being heated in the container 2, the ringshaped bodies can be made of electrically conductive material which can be heated in containers 1 and 3 in the same manner as the guides 4 of container 2.
  • the sealing lips 13 consist of elastic material, however preheating or after-heating is not recommended where the elastic material is of an organic nature, such as rubber, silicon rubber, and like materials which lend themselves very well for sealing purposes.
  • the two containers 1 and 3 serving as locks or gates for the container 2 are not heated.
  • the sealing lips 13 are in the shape of fiat rings and are made of resilient, heat-resistant material or of elastic, smoothly sliding synthetic material, such as Teflon or rubber.
  • the central openings of the sealing lips 13 must be somewhat smaller in diameter than the cross section of the alloying molds 5 and must correspond also to their The sealing lips 13 consequently fit tightly against the peripheral surface of the alloying molds 5 as the latter pass through the central openings of the lips in the longitudinally extending direction of the apparatus.
  • the locking or gating process occurs as the alloying molds 5 which are inserted into the inlet 10 of the lower container 1, reach one or more of the antechambers 11 that are filled with the protective gas.
  • the antechambers and their sealing lips 13, respectively, provide a scavenging lock or gate which prevents the escape of the protective gas. Since the heat treatment inside the furnace chamber 2 is carried out in a protective gas atmosphere, it is sufficient to provide several, i.e. at least three, scavenging chambers 11 in container 1 and a similar number accordingly, if desired, in container 3.
  • a stream of hydrogen gas or inert gas is employed in a scavenging process within the chambers 11.
  • the scavenging chambers 11 are connected in series with respect to the gas flow by a tube system 12 disposed in such a manner that the protective gas first enters the innermost of the chambers 11 and subsequently flows through all of the chambers until it finally reaches the outermost antechamber 11 adjacent the inlet 10. After the oxygen of the air in the-antechambers 11 has been displaced by the protective gas, the alloying molds 5 continue to advance upwardly until they enter the furnace chamber 2 proper through a sealing lock or gate system which also consists of one or more sealing lips (not shown), when the heat treatment in chamber 2 is carried out with the same protective gas.
  • a pre-evacuation stage 15 and an additional fine evacuation stage 17 are provided accordingly in contaniers 1 and 3 which serve as inlet or outlet lock, in opposite sequences, respectively.
  • the alloying molds 5 After the alloying molds 5 leave the innermost of the scavenging chambers 11 they enter the pre-evacuation chamber 15 through a sealing lock comprised of a plurality of sealing lips 14 arranged one above the other in a manner similar to those of the scavenging lock.
  • a pressure of approximately 10 torr is effected by a vacuum pump (not shown) in the pre-evacuation chamber 15.
  • the alloying molds 5 are then advanced upwardly into a chamber 17 which provides fine evacuation of the alloying molds and in which a pressure of approximately 10- torr is maintained by continuous pumping.
  • the alloying molds 5 pass through another sealing lock 16 also provided with sealing lips (not shown).
  • the pressure in the fine evacuation stage 17 corresponds approximately to the pressure in the middle container 2 which is also maintained by continuous evacuation.
  • a cooling stage 19 for protecting the sensitive material of the sealing rings from the heat generated in the middle container 2.
  • the cooling stage consists of a cooling coil through which a liquid coolant is pumped.
  • an additional lock 18 is provided with corresponding sealing lips (not shown).
  • the alloying molds are discharged from the furnace container 2 through a system of locks in container 3 whose to the height of a single mold each time.
  • container construction corresponds to that of the container 1, however, the various corresponding elements in container 3 are arranged opposite to those of container 1 so that the alloying molds emerging from the furnace chamber into the container 3 pass through the corresponding separate chambers in reverse sequence until they reach the outlet of container 3.
  • the scavenging lock at the outlet of container 3 may be omitted.
  • FIG. 4 there is shown a device for mechanically feeding alloying molds 5 through an inlet lock of the container 1, the device being suitably mounted directly below the inlet to the container 1.
  • the alloying molds 5 are delivered by a conveyor chute 20 or by any other suitable conveyor means such as a rotary conveyor table, into a vertically extending tube 21 leading directly to the inlet of container 1.
  • a plunger 22 retractable at predetermined equal intervals permits each alloying mold 5 successively to enter the tube 21 and subsequently raises it together with the previously inserted column of alloying molds 5 by pushing upwardly thereon to a distance equal
  • the plunger 22 is accordingly retracted periodically by a rotating eccentric cam 23 in cooperation with a tension spring 24 which permits an alloying mold at a time to slide in front of the upper end face of the plunger.
  • a blocking device 25 consisting of a resiliently mounted pin prevents the alloying molds 5 from dropping back downwardly when the plunger 22 is retracted.
  • a column of alloying molds preferably not containing semiconductor crystals is inserted in the guides 4 of the apparatus or in lieu thereof one or more auxiliary bodies having a cross section substantially the same as that of the alloying molds is inserted in a like manner.
  • the column of alloying molds or auxiliary bodies thus completely fills the tubular containers from the inlet 10 of the container 1 to the outlet of the container 3.
  • the middle container 2 is subsequently placed under vacuum or filled with a protective gas atmosphere as desired.
  • thermocontacts distributed along the rail system 4.
  • the alloying molds which are preferably blank molds .at first; i.e., without semiconductor devices, are inserted in the apparatus, the gas or vacuum conditions in the containers 1 and 3 are then adjusted, and subsequently the corresponding conditions in the interior of container 2 are adjusted. While the gas or vacuum conditions in container 2 are being adjusted, the rails 4 can be heated. After the temperature and gas or vacuum conditions have been adjusted-in all of the containers 1, 2, 3, additional alloying molds containing semiconductor devices that are to be treated are then inserted into the container 1 gradually at appropriate intervals by the feeding mechanism illustrated in FIG. 4. The period during which the individual molds 5 are in the furnace container 2, and thereby the actual treatment time for each of the molds, is
  • the scavenging locks are formed by the scavenging chambers 11 adjacent the inlet 10 of thecontainer 1, while the locks 14, 16 and 18 constitute the so-called sealing locks.
  • the characteristics of these types of locks are as follows:
  • All of the locks have sealing lips that are spaced at predetermined distances from one another depending upon the height of the alloying molds.
  • the relationship of the height of the alloying molds to the spacing of the sealing lips is such that at least one of the sealing lips should be closely engaged by the peripheral surface of one of the alloying molds. If the alloying molds proper are gas-tight, the interchange of gas between both sides of the particular sealing lips that engage the alloying molds is thus prevented. However, if the alloying mold is not gas-tight (a characteristic of the alloying mold which is exploited by the scavenging locks to permit communication between one antechamber 13 and the next), gas flows through the alloying mold and consequently penetrates from one side of the sealing lip in engagement therewith to the other side thereof.
  • the individual sealing lips are fiat rings or washers made of springy, heat-resistant material such as heat-resistant metal or elastic synthetic material that is mechanically resistant such as Teflon or silicon rubber.
  • the sealing lips may also consist of natural caoutchouc or rubber.
  • the central openings of the sealing lips which provide passage for the alloying molds 5 are somewhat smaller than the cross section of the alloying molds and correspond substantially to their outline so that the inner edge of the sealing lips lies tightly against the alloying molds 5 as they pass through the central opening of the sealing lips in an axial direction.
  • both in containers 1 and 3 at least two of the sealing lips should have a smaller spacing between them than the distance or height of a single alloying mold.
  • one of the sealing lips is always closed by one of the alloying molds.
  • the sealing locks solely utilize the sealing ability of the sealing lips.
  • suitably constructed molds substantially completely prevent gas exchange between both sides of corresponding sealing lips thatare in engagement with the molds or compel the gas exchange to take place within the alloying molds.
  • a further construction is exemplified by the scavenging locks which, as shown in FIG. 3, comprise scavenging chambers 11, formed by adjacent rings between which sealing lips 13 are secured.
  • This duct system when in operation, is scavenged by a protective gas transversely to the in the duct system 12 shown in FIG. 3.
  • the gas exchange occurs through the alloying mold when the flow resistance of the duct system which connects the scavenging chambers is sufficiently high, as shown for example
  • the recommended spacing of the corresponding sealing lips is such that they will be half the height of a single alloying mold or a multiple of that amount.
  • the force of the gas flow in the scavenging lock causes entrainment of atmospheric gases that are inside the antechambers 11 and their consequent displacement.
  • the duct system which forms part of the scavenging chambers can be suitably provided also with relief pressure valves that will permit transport of the gas by the duct system to the next succeeding scavenging chamber while the scavenging openings (provided in the alloying molds) are momentarily closed by the sealing lips.
  • FIG. 3 is also shown a vacuum lock 15, 17 which permits advancement of the alloying molds through one or more pressure stages into the treatment container 2 which has a different gas pressure or is evacuated, or such a vacuum lock excludes the alloying molds from such heat treatment container. Consequently, at least one sealing lock must be associated with the evacuation lock, and at least one of the sealing lips of each pressure stage must simultaneously lie closely against the peripheral surface of an alloying mold that is present in the particular pressure stage. It is therefore expedient to arrange the sealing lips directly behind one another so as to increase the flow resistance in the spaces on both sides of such a sealing lip.
  • the aforementioned flood locks are a combination of vacuum and scavenging locks, having the advantage of being more effective than ordinary scavenging locks for keeping the treatment Zone in container 2 free from undesirable instrusion of atmospheric gas.
  • Such flood locks are therefore preferably employed for holding devices that are adapted to receive the material that is to be treated which are so closely fitted as to have only very small clearances, so that the desired atmosphere can be fed to the material to be treated only through small ducts, in other words, are employed when the desired purity of the atmosphere cannot be obtained by normal scavenging process.
  • the scavenging locks are flooded with fresh gas and the process is repeated one or more additional times before the alloying molds are advanced into the container 2. This process is analogous to decanting.
  • the invention was described in the foregoing essentially in relation to an alloying furnace through which molds are continuously fed.
  • the alloying molds can also be employed for otherwise processing semiconductor materials or workpieces required for producing semiconductor devices.
  • the apparatus constructed in accordance with our invention may also be used to advantage, requiring no changes as to the construction of the containers 1 and 3 which serve as inlet and outlet locks, whereas in the interior of the treatment container 2 proper the atmospheric and temperature conditions necessary for the particular treatment process are to be provided.
  • the described apparatus constructed in accordance with our invention may also be used for so called contact bonding processes in which a connecting wire or an electrode are soldered or welded to a semiconductor element without forming an alloy therewith (ohmic contact).
  • An apparatus constructed in accordance with the invention may also be used in so-called gas diffusion processes by osmosis for the production of p-n transitions in semiconductor crystals.
  • a special treatment gas may be employed in container 2 that is suitable for this purpose and pure protective gas can be used for scavenging purposes.
  • Another suitable application of the apparatus constructed in accordance with our invention is its employment for so-called density testing of transistors or other semiconductor devices which have been previously placed in sealed housings or encapsulations.
  • the encapsulated transistor should in such a case be placed in treatment capsules or containers which correspond to the alloying molds 5. These encapsulated transistors are then fed through the aforementioned locks into highly evacuated (IO- torr) container 2, or removed from the same respectively.
  • the container 2 is in turn connected to a device such as a mass spectograph which can detect the existence of gas escaping through leaks in the encapsulated transistors, if such. are present, into the container 2, the gas having been previously fed into the interior of the transistor housing of the encapsulated transistor before closing the same.
  • an airtight processing zone having an aligned inlet and outlet, guide means mounted in said processing zone and defining a path therethrough for a column of at least three superimposed mold members of which at least one member contains semiconductor material to be proc essed in said processing zone, at least three spaced annular sealing lips of resilient material aligned with said inlet and outlet respectively, said sealing lips being airtightly connected at their peripheries so as to define an airtight passage communicating with said processing zone, means for aligning the superimposed mold members with said annular sealing lips and said processing zone path, and means for successively displacing the mold members through said annular sealing lips and said processing zone path, the spacing between said sealing lips being predetermined in relation to the dimension of each mold member in the direction of displacement so that at least one of the mold members is sealingly engaged by at least one of said annular sealing lips at said inlet and outlet as the mold members are displaced through said annular sealing lips.
  • said guide means comprise a plurality of straight guides extending from said inlet to said outlet and slidingly engageable by said mold members.
  • said plurality of straight guides comprise at least two guide rails of electrically conductive, heat-resistant material, heatable along their entire length when electrically energized.
  • An apparatus including electrically conductive means for connecting said rails in series with an electric power source.
  • An apparatus including electrically conductive means for connecting said rails in parallel with an electric power source.
  • An apparatus including means electrically connected to said rails for providing a varied current density therein when said rails are energized so that predetermined heat gradients are formed in said rails.
  • said chamber being partly defined by a pair of opposed annular sealing lips of resilient material aligned with said inlet and outlet, at least three spaced additional annular sealing lips of resilient material aligned with said inlet and outlet respectively, said adidti-onal sealing lips being airtightly connected at their peripheries so as to define an airtight passage communicating with said chamber and said processing zone, means for aligning with said annular sealing lips at least three superimposed mold members, at least one of which contains semiconductor material to be processed in said processing zone and means for displacing the mold members through said annular sealing lips, said chambers and said processing zone, the spacing between said additional sealing lliPS being predetermined in relation to the dimension of each mold member in the direction of displacement so that at least one of the mold members is sealingly engaged by at least one of said additional annular sealing lips at said inlet and outlet as the mold members are displaced through said additional annular
  • the middle container comprising an airtight processing zone having an alignedinlet and outlet
  • the end containers comprising a plurality of coaxially aligned rings and at least three spaced annular sealing lips of resilient material aligned with said inlet and outlet respectively, said rings being pressed against each other, sandwiching said sealing lips airtightly between them at their peripheries so as to define an airtight passage communicating with said processing zone, means for aligning with said annular sealing lips at least three superimposed mold members, at least one of which contains semiconductor material to be processed in said processing zone, and means for successively displacing the mold members through said annular sealing lips and said processing zone, the spacing between said sealing lips being predetermined in relation to the dimension of each mold member in the direction of displacement so that at least one of the mold members is sealingly engaged by at least one of said annular sealing lips at said inlet and outlet as the mold members are displaced through said annular sealing lips.
  • said sealing lips being airtightly connected at their peripheries so as to define an airtight passage communicating with said processing zone, feeder means for supplying the mold members to a location below said lower inlet in which they are aligned with said vertically aligned containers, means located at said lower inlet for advancing the mold members through said aligned containers, said means comprising a cam-operated piston successively displacing the mold members through said annular sealing lips and said processing zone, the spacing between said sealing lips being predetermined in relation to the dimension of each mold member in the direction of displacement so that at least one of the mold members is sealingly engaged by at least one of said annular sealing lips at said inlet and outlet as the mold members are displaced through said annular sealing lips.
  • said guiding means comprise a plurality of substantially straight guides extending through said processing zone from said inlet to said outlet for slidable engagement :by the column of mold members.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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US336535A 1963-01-16 1964-01-08 Apparatus for producing semiconductor devices Expired - Lifetime US3290738A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES83275A DE1180069B (de) 1963-01-16 1963-01-16 Vorrichtung zum Herstellen von Halbleiter-bauelementen, insbesondere Legierungs-vorrichtung

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US3290738A true US3290738A (en) 1966-12-13

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US336535A Expired - Lifetime US3290738A (en) 1963-01-16 1964-01-08 Apparatus for producing semiconductor devices

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US (1) US3290738A (en, 2012)
CH (1) CH420068A (en, 2012)
DE (1) DE1180069B (en, 2012)
GB (1) GB988921A (en, 2012)
NL (1) NL302915A (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396955A (en) * 1965-10-04 1968-08-13 Basic Products Corp Diffusion furnace with transport means
US3658310A (en) * 1970-03-04 1972-04-25 Atomic Energy Authority Uk Furnaces

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2422439A (en) * 1943-01-29 1947-06-17 American Electro Metal Corp Method of manufacturing composite structural materials
US2933787A (en) * 1956-10-09 1960-04-26 Motorola Inc Alloying apparatus for transistors
US2959829A (en) * 1957-09-09 1960-11-15 Joseph B Brennan Casting method and apparatus
US3025156A (en) * 1957-05-20 1962-03-13 Commissariat Energie Atomique Method and apparatus for continuously treating powder compositions such as powder metals

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL256703A (en, 2012) * 1959-10-10

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2422439A (en) * 1943-01-29 1947-06-17 American Electro Metal Corp Method of manufacturing composite structural materials
US2933787A (en) * 1956-10-09 1960-04-26 Motorola Inc Alloying apparatus for transistors
US3025156A (en) * 1957-05-20 1962-03-13 Commissariat Energie Atomique Method and apparatus for continuously treating powder compositions such as powder metals
US2959829A (en) * 1957-09-09 1960-11-15 Joseph B Brennan Casting method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396955A (en) * 1965-10-04 1968-08-13 Basic Products Corp Diffusion furnace with transport means
US3658310A (en) * 1970-03-04 1972-04-25 Atomic Energy Authority Uk Furnaces

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Publication number Publication date
NL302915A (en, 2012)
GB988921A (en) 1965-04-14
DE1180069B (de) 1964-10-22
CH420068A (de) 1966-09-15

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