GB988921A - Apparatus for the treatment of semiconductor assemblies - Google Patents
Apparatus for the treatment of semiconductor assembliesInfo
- Publication number
- GB988921A GB988921A GB1585/64A GB158564A GB988921A GB 988921 A GB988921 A GB 988921A GB 1585/64 A GB1585/64 A GB 1585/64A GB 158564 A GB158564 A GB 158564A GB 988921 A GB988921 A GB 988921A
- Authority
- GB
- United Kingdom
- Prior art keywords
- glands
- treatment
- alloying
- semi
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 230000000712 assembly Effects 0.000 title abstract 3
- 238000000429 assembly Methods 0.000 title abstract 3
- 210000004907 gland Anatomy 0.000 abstract 6
- 238000005275 alloying Methods 0.000 abstract 5
- 238000007789 sealing Methods 0.000 abstract 5
- 238000001816 cooling Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000003779 heat-resistant material Substances 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000012858 resilient material Substances 0.000 abstract 1
- 230000002000 scavenging effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Furnace Details (AREA)
Abstract
A treatment chamber for semi-conductor assemblies, has sealing glands for the inlet and outlet tubes, each gland comprising at least three annular sealing members of resilient material spaced along the tubes. The semi-conductor assemblies are placed in cylindrical containers which effect a seal with the inner <FORM:0988921/C6-C7/1> periphery of the annular members whereby they may be treated in a shielding gas or under vacuum. The treatment may be alloying; soldering connecting wires or electrodes; gas-diffusion process for the production of small pn-junctions; or testing the sealing of semi-conductor components housed in sealed casings. Alloying: loading; The containers 5, which may be alloying forms containing a semi-conductor crystal and alloying metal, are fed from a shoot 20, Fig. 4, to a tube 21 where they are elevated past a detent 24 by a camoperated plunger 22, and so pass through the glands into the treatment chamber. The chamber may have a pair of angle section guide rails 4, Figs. 1, 2 (not shown), arranged to hold the alloying forms in stable fashion between them. An electric current may be passed through the rails to provide heating. Sealing glands. The inlet and outlet tubes may comprise a series of glands A-F, Fig. 3 (not shown), and may be provided with a scavenging section between them when the treatment is carried out in an inert gas, or an evacuating section when the treatment is carried out in vacuum. A cooling section G may be provided to protect the glands from heat in the treatment chamber, or the sealing members may be made of a resilient heat resistant material such as P.T.F.E.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES83275A DE1180069B (en) | 1963-01-16 | 1963-01-16 | Device for the production of semiconductor components, in particular alloy device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB988921A true GB988921A (en) | 1965-04-14 |
Family
ID=7510910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1585/64A Expired GB988921A (en) | 1963-01-16 | 1964-01-14 | Apparatus for the treatment of semiconductor assemblies |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3290738A (en) |
| CH (1) | CH420068A (en) |
| DE (1) | DE1180069B (en) |
| GB (1) | GB988921A (en) |
| NL (1) | NL302915A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3396955A (en) * | 1965-10-04 | 1968-08-13 | Basic Products Corp | Diffusion furnace with transport means |
| US3658310A (en) * | 1970-03-04 | 1972-04-25 | Atomic Energy Authority Uk | Furnaces |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2422439A (en) * | 1943-01-29 | 1947-06-17 | American Electro Metal Corp | Method of manufacturing composite structural materials |
| US2933787A (en) * | 1956-10-09 | 1960-04-26 | Motorola Inc | Alloying apparatus for transistors |
| BE567500A (en) * | 1957-05-20 | |||
| US2959829A (en) * | 1957-09-09 | 1960-11-15 | Joseph B Brennan | Casting method and apparatus |
| NL255713A (en) * | 1959-10-10 |
-
0
- NL NL302915D patent/NL302915A/xx unknown
-
1963
- 1963-01-16 DE DES83275A patent/DE1180069B/en active Pending
-
1964
- 1964-01-06 CH CH2864A patent/CH420068A/en unknown
- 1964-01-08 US US336535A patent/US3290738A/en not_active Expired - Lifetime
- 1964-01-14 GB GB1585/64A patent/GB988921A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1180069B (en) | 1964-10-22 |
| CH420068A (en) | 1966-09-15 |
| NL302915A (en) | |
| US3290738A (en) | 1966-12-13 |
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