US3158503A - Metallizing holes - Google Patents

Metallizing holes Download PDF

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US3158503A
US3158503A US193985A US19398562A US3158503A US 3158503 A US3158503 A US 3158503A US 193985 A US193985 A US 193985A US 19398562 A US19398562 A US 19398562A US 3158503 A US3158503 A US 3158503A
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board
hole
paste
holes
silver
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US193985A
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Young Lawrence John
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YOUNG RES LAB Ltd
YOUNG RESEARCH LABORATORIES Ltd
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YOUNG RES LAB Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S285/00—Pipe joints or couplings
    • Y10S285/913—Interdigitating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Definitions

  • a method of producing a metallized hole in a board such as a printed circuit board, which method comprises aligning a hole of a first board with a hole which is to be metallized of a second board, introducing into the hole of the first board a flexible metallic paste, and thereafter transferring the paste from the hole of the first board to coat at least a substantial proportion of the wall of the hole of the second board.
  • the first and second boards are spaced apart by a small amount sutficient to allow a thin coating of the paste to overlie that face of the second board which is closest to the first board.
  • the spacing apart of the two boards may be effected as a result of the face of the second board having imparted thereto a printed circuit.
  • the metallic paste contains as metallic ingredients, silver particles or silver coated copper particles.
  • the metallic ingredient may be'in flake form.
  • Flexible metallic paste may comprise finelydivided metallic particles suspended or dispersed in a thickened organic solvent.
  • the flexible metallic pastes prefer-- ably has a consistency such as those pastes used for metallizing glass or ceramics.
  • a metallic paste comprising particles of finely-divided metal and organic constituents is cured at an elevated temperature to drive off at least a substantial proportion of the organic materials and leave the metal in a suitable condition for soldering purposes.
  • the paste may be heated at a temperature of from 80 to 120 C., and is preferably heated at a temperature of from 90 to 110 for from 30 mins. to one hour.
  • the transferring of the metallic paste from the first board to the second board is carried out by application of air pressure.
  • the powder is in a very fine state, i.e. it will pass a 200 B5. sieve; it is more preferred that the powder passes a 500 RS. sieve.
  • FIGURES l, 2 and 3 are sectional views through two boards showing various stages of metallizing a hole.
  • the method is illustrated with a printed circuit board on which a circuit has been formed.
  • One method of producing a printed circuit comprises applying to the surface of a board of electrical insulating material, such as a phenolic laminated board, a layer of a coldpressing adhesive corresponding at least to the desired circuit pattern, applying to the surface of the base a layer of finely-divided metal, applying pressure corresponding to the circuit pattern in order to compact the metal and to consolidate it with the adhesive and base, removing any uncompacted metal and thereafter heating the printed circuit for example at a temperature of 100 C., to set the adhesive.
  • the holes which are to be metallized are hot-punched in the board; the number of holes punched will vary depending on the desired circuit arrangement.
  • the board 11 having the hole 16 of /s" diameter punched therein is positioned over board 12 which carries printed circuit elements 3,158,503 Patented Nov. 24, 1964 13 so that the holes 16 and 17 in the first and second board respectively are in alignment.
  • the printed circuit element which may be for example 0.0015" thick, ensures that the first and second boards are spaced apart by a small amount sufficient to allow a thin coating of the paste to overlie that face of the second board which is closest to the first board.
  • FIGURE 2 shows the hole 16 of board 11 filled with silver paste 14. An excess of paste is initially applied to the upper surface of board 11 and the paste not required to fill the holes is wiped off and used again.
  • FIGURE 3 shows the silver paste 15 disposed around the inner surface of the hole 17 and also overlies the upper and lower surface of the board 12 over that part of the surface which is immediately adjacent to the hole. As the two boards 11 and 12 are spaced apart by the small distance owing to the presence of circuit elements 13, the silver paste is able to overlie some of the upper surface of the board 12. An excess of the silver paste passes through the hole which is metallized and can be collected in a tray beneath the second board for re-use.
  • compressed air e.g. air at a pressure of 4 to 5 lbs. per sq. inch
  • Finely divided silver powder passing a 500 13.8 Finely divided silver powder passing a 500 13.8.
  • a suitable silver paste having the silver powder dispersed in a substantially organic medium is obtained by thorough mixing of the above-mentioned ingredients.
  • the board is preferably clamped to a vibrating arm and vibrated for a few seconds. This assists in providing a desirably even coating of the silver paste.
  • the board 12 is then heated at a temperature of about C. for 30 minutes, when the major portion of the organic material in the paste is driven off and the silver is in the form of a hard coating to which circuit components such as condensers or resistors may readily be soldered.
  • holes in printed circuits which may be metallized by the method according to this invention, can vary in size over a wide range, for example, holes may be metallized having diameters from or up to A.
  • a third board may be used to assist the deposition of paste around the edge of the hole furthest from the first board and this third board is to be placed close to or touching the second board.
  • a method of producing a metallized hole through a board such as a printed circuit board, which method comprises aligning a hole of a first board with the hole which is to be metallized of a second board, introducing into the hole of the first board a flexible metallic paste and thereafter transferring the paste from the hole of the first board by directing a jet of a gaseous medium under pressure to the hole of the first board to blow the metallic paste out from said hole of the first board to pass into the hole of the second board thereby coating at least a substantial portion of the wall of the hole of the second board.
  • the metallic paste contains as metallic ingredient finely divided particles selected from the group consisting of silver and silver coated copper particles.
  • the flexible metallic paste comprises finely divided metallic particles dispersed in a thickened organic solvent.
  • the flexible metallic paste comprises particles of finely divided metal and a thickened organic solvent and the paste coating on said second board is heated at a temperature of from 80 to 120 C. to drive oil a substantial proportion of the volatile organic materials.

Description

Nov. 24, 1964 L. J. YOUNG 3,158,503
METALLIZING HOLES Filed May 11, 1962 minim Lvvavwfi LAWRENCE J. YOU/V6 gdma mm United States Patent Ofiice 3,158,503 METALLIZING HOLES Lawrence John Young, Woodbridge, Suffolk, England, assignor to Young Research Laboratories; Limited, London, England, a British 'compan I i Filed May 11,1962, Ser. No. 193,985 8 Claims. (Cl. 117 -212) The invention relates to methods of metallizing holes for example the holes of printed circuit boards.
According to the present invention, there is provided a method of producing a metallized hole in a board, such as a printed circuit board, which method comprises aligning a hole of a first board with a hole which is to be metallized of a second board, introducing into the hole of the first board a flexible metallic paste, and thereafter transferring the paste from the hole of the first board to coat at least a substantial proportion of the wall of the hole of the second board.
Preferably, the first and second boards are spaced apart by a small amount sutficient to allow a thin coating of the paste to overlie that face of the second board which is closest to the first board. The spacing apart of the two boards may be effected as a result of the face of the second board having imparted thereto a printed circuit.
It is preferred that the metallic paste contains as metallic ingredients, silver particles or silver coated copper particles. Alternatively, the metallic ingredient may be'in flake form. Flexible metallic paste may comprise finelydivided metallic particles suspended or dispersed in a thickened organic solvent. The flexible metallic pastes prefer-- ably has a consistency such as those pastes used for metallizing glass or ceramics. A metallic paste comprising particles of finely-divided metal and organic constituents is cured at an elevated temperature to drive off at least a substantial proportion of the organic materials and leave the metal in a suitable condition for soldering purposes. For example, the paste may be heated at a temperature of from 80 to 120 C., and is preferably heated at a temperature of from 90 to 110 for from 30 mins. to one hour.
Preferably the transferring of the metallic paste from the first board to the second board, is carried out by application of air pressure.
When the metallic paste contains powdered metal it is preferred that the powder is in a very fine state, i.e. it will pass a 200 B5. sieve; it is more preferred that the powder passes a 500 RS. sieve.
Following is a description by Way of example of one method of carrying the present invention into effect. The method is illustrated in the accompanying drawings in which FIGURES l, 2 and 3 are sectional views through two boards showing various stages of metallizing a hole.
In this example, the method is illustrated with a printed circuit board on which a circuit has been formed. One method of producing a printed circuit comprises applying to the surface of a board of electrical insulating material, such as a phenolic laminated board, a layer of a coldpressing adhesive corresponding at least to the desired circuit pattern, applying to the surface of the base a layer of finely-divided metal, applying pressure corresponding to the circuit pattern in order to compact the metal and to consolidate it with the adhesive and base, removing any uncompacted metal and thereafter heating the printed circuit for example at a temperature of 100 C., to set the adhesive.
After the curing of the adhesive, the holes which are to be metallized are hot-punched in the board; the number of holes punched will vary depending on the desired circuit arrangement. As shown in FIGURE 1, the board 11 having the hole 16 of /s" diameter punched therein, is positioned over board 12 which carries printed circuit elements 3,158,503 Patented Nov. 24, 1964 13 so that the holes 16 and 17 in the first and second board respectively are in alignment. The printed circuit element, which may be for example 0.0015" thick, ensures that the first and second boards are spaced apart by a small amount sufficient to allow a thin coating of the paste to overlie that face of the second board which is closest to the first board.
A fiowable metal paste in the form of a thick cream, containing silver powder was then wiped across the upper surface of board '11 with a rubber wiper, thus filling the holes in the upper board with the metallic paste. FIGURE 2 shows the hole 16 of board 11 filled with silver paste 14. An excess of paste is initially applied to the upper surface of board 11 and the paste not required to fill the holes is wiped off and used again.
The silver paste in the holes of the upper board is transferred by use of a jet or jets of compressed air (e.g. air at a pressure of 4 to 5 lbs. per sq. inch), the jet or jets is passed over the upper surface of board 11 and the flexible metallic paste is forced through the holes of the upper board into the holes of the lower board. FIGURE 3 shows the silver paste 15 disposed around the inner surface of the hole 17 and also overlies the upper and lower surface of the board 12 over that part of the surface which is immediately adjacent to the hole. As the two boards 11 and 12 are spaced apart by the small distance owing to the presence of circuit elements 13, the silver paste is able to overlie some of the upper surface of the board 12. An excess of the silver paste passes through the hole which is metallized and can be collected in a tray beneath the second board for re-use.
An example of a silver paste is as follows:
Finely divided silver powder passing a 500 13.8.
A suitable silver paste having the silver powder dispersed in a substantially organic medium is obtained by thorough mixing of the above-mentioned ingredients.
To smooth out the silver paste in the holes of the lower board, the board is preferably clamped to a vibrating arm and vibrated for a few seconds. This assists in providing a desirably even coating of the silver paste.
To cure or harden the paste, the board 12 is then heated at a temperature of about C. for 30 minutes, when the major portion of the organic material in the paste is driven off and the silver is in the form of a hard coating to which circuit components such as condensers or resistors may readily be soldered.
The holes in printed circuits which may be metallized by the method according to this invention, can vary in size over a wide range, for example, holes may be metallized having diameters from or up to A.
If desired a third board may be used to assist the deposition of paste around the edge of the hole furthest from the first board and this third board is to be placed close to or touching the second board.
I claim: p
l. A method of producing a metallized hole through a board, such as a printed circuit board, which method comprises aligning a hole of a first board with the hole which is to be metallized of a second board, introducing into the hole of the first board a flexible metallic paste and thereafter transferring the paste from the hole of the first board by directing a jet of a gaseous medium under pressure to the hole of the first board to blow the metallic paste out from said hole of the first board to pass into the hole of the second board thereby coating at least a substantial portion of the wall of the hole of the second board.
2. A method as claimed in claim 1 wherein the first and second boards are spaced apart by a small amount sufiicient to allow a thin coating of the paste to overlie that face of the second board which is closest to the first board.
3. A method as claimed in claim 1 wherein the metallic paste contains as metallic ingredient finely divided particles selected from the group consisting of silver and silver coated copper particles.
4. A method as claimed in claim 1 wherein the flexible metallic paste comprises finely divided metallic particles dispersed in a thickened organic solvent.
5. A method as claimed in claim 1 wherein the flexible metallic paste comprises particles of finely divided metal and a thickened organic solvent and the paste coating on said second board is heated at a temperature of from 80 to 120 C. to drive oil a substantial proportion of the volatile organic materials.
6. A method as claimed in claim 5 wherein the metallic paste is heated at a temperature of from 90 to 110 C. for from 30 minutes to one hour.
7. A method as claimed in claim 1 wherein the flexible metallic paste is a paste consisting essentially of:
- 4 Finely divided silver powder passing a 500 B.S.
sieve g 41.0 Spirit of turpentine cc l6 Dimethyl phthalate cc 2 Ethyl cellulose g 1.2 Rosin g- 0.3
8. A method is claimed in claim 1 wherein the gaseous medium is air.
References Cited in the file of this patent UNITED STATES PATENTS 2,345,227 White et al Mar. 28, 1944 2,848,359 Talmey Aug. 19, 1958 FOREIGN PATENTS 854,881 Great Britain Nov. 23, 1960 222,719 Austria Aug. 10, 1962 OTHER REFERENCES Printed Circuit Techniques, US. Dept. of Commerce, National Bureau of Standards Circular 468, Nov. 15, 1947, pp. 5-13.

Claims (1)

1. A METHOD OF PRODUCING A METALLIZED HOLE THROUGH A BOARD, SUCH AS A PRINTED CIRCUIT BOARD, WHICH METHOD COMPRISES ALIGNING A HOLE OF A FIRST BOARD WITH THE HOLE WHICH IS TO BE METALLIZED OF A SECOND BOARD, INTRODUCING INTO THE HOLE OF THE FIRST BOARD A FLEXIBLE METALLIC PASTE AND THEREAFTER TRANSFERRING THE PASTE FROM THE HOLE OF THE FIRST BOARD BY DIRECTING A JET OF A GASEOUS MEDIUM UNDER PRESSURE TO THE HOLE OF THE FIRST BOARD TO BLOW THE METALLIC PASTE OUT FROM SAID HOLE OF THE FIRST BOARD TO PASS INTO THE HOLE OF THE SECOND BOARD THEREBY COATING AT LEAST A SUBSTANTIAL PORTION OF THE WALL OF THE HOLE OF THE SECOND BOARD.
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3301175A (en) * 1964-07-15 1967-01-31 Process Res Company Method and apparatus for printing on electrical conductor devices
US3357856A (en) * 1964-02-13 1967-12-12 Electra Mfg Company Method for metallizing openings in miniature printed circuit wafers
US3407081A (en) * 1965-04-26 1968-10-22 Du Pont Noble metal paste compositions comprising novel liquid carriers
US4008300A (en) * 1974-10-15 1977-02-15 A & P Products Incorporated Multi-conductor element and method of making same
US4183137A (en) * 1977-02-15 1980-01-15 Lomerson Robert B Method for metalizing holes in insulation material
WO1981001494A1 (en) * 1979-11-16 1981-05-28 R Lomerson Method for metalizing holes in insulating material
US4301192A (en) * 1980-06-02 1981-11-17 Western Electric Co., Inc. Method for coating thru holes in a printed circuit substrate
US4383495A (en) * 1980-06-02 1983-05-17 Western Electric Company, Inc. Apparatus for coating surfaces of a substrate
GB2188570A (en) * 1986-03-14 1987-10-07 Boeing Co Method of bolt hole strengthening in a fibrous composite laminate
WO1988005959A1 (en) * 1987-02-04 1988-08-11 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
US4763399A (en) * 1986-03-14 1988-08-16 The Boeing Company Method of bolt hole strengthening in a fibrous composite laminate
US4964948A (en) * 1985-04-16 1990-10-23 Protocad, Inc. Printed circuit board through hole technique
US5389148A (en) * 1993-01-28 1995-02-14 Nordson Corporation Spray apparatus utilizing porous sheet
US20050191420A1 (en) * 2003-11-21 2005-09-01 Seiko Epson Corporation Coaoting apparatus and coating method using the same
US20150004359A1 (en) * 2013-06-27 2015-01-01 Heraeus Precious Metals North America Conshohocken LLP Platinum containing conductive paste

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2345227A (en) * 1943-02-03 1944-03-28 Joseph Dixon Crucible Co Adhesive applying mechanism
US2848359A (en) * 1955-06-20 1958-08-19 Gen Am Transport Methods of making printed electric circuits
GB854881A (en) * 1956-12-04 1960-11-23 Emi Ltd Improvements in or relating to methods of forming conducting coatings on walls extending into insulating supports
AT222719B (en) * 1961-01-24 1962-08-10 Medek & Schoerner Device for marking elongated rod-shaped bodies, such as cables, wires or the like.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2345227A (en) * 1943-02-03 1944-03-28 Joseph Dixon Crucible Co Adhesive applying mechanism
US2848359A (en) * 1955-06-20 1958-08-19 Gen Am Transport Methods of making printed electric circuits
GB854881A (en) * 1956-12-04 1960-11-23 Emi Ltd Improvements in or relating to methods of forming conducting coatings on walls extending into insulating supports
AT222719B (en) * 1961-01-24 1962-08-10 Medek & Schoerner Device for marking elongated rod-shaped bodies, such as cables, wires or the like.

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3357856A (en) * 1964-02-13 1967-12-12 Electra Mfg Company Method for metallizing openings in miniature printed circuit wafers
US3301175A (en) * 1964-07-15 1967-01-31 Process Res Company Method and apparatus for printing on electrical conductor devices
US3407081A (en) * 1965-04-26 1968-10-22 Du Pont Noble metal paste compositions comprising novel liquid carriers
US4008300A (en) * 1974-10-15 1977-02-15 A & P Products Incorporated Multi-conductor element and method of making same
US4183137A (en) * 1977-02-15 1980-01-15 Lomerson Robert B Method for metalizing holes in insulation material
WO1981001494A1 (en) * 1979-11-16 1981-05-28 R Lomerson Method for metalizing holes in insulating material
US4301192A (en) * 1980-06-02 1981-11-17 Western Electric Co., Inc. Method for coating thru holes in a printed circuit substrate
US4383495A (en) * 1980-06-02 1983-05-17 Western Electric Company, Inc. Apparatus for coating surfaces of a substrate
US4964948A (en) * 1985-04-16 1990-10-23 Protocad, Inc. Printed circuit board through hole technique
GB2188570A (en) * 1986-03-14 1987-10-07 Boeing Co Method of bolt hole strengthening in a fibrous composite laminate
US4763399A (en) * 1986-03-14 1988-08-16 The Boeing Company Method of bolt hole strengthening in a fibrous composite laminate
GB2188570B (en) * 1986-03-14 1989-11-15 Boeing Co Method of bolt hole strengthening in a fibrous composite laminate
US4724598A (en) * 1986-03-14 1988-02-16 The Boeing Company Method of bolt hole strengthening in a fibrous composite laminate
WO1988005959A1 (en) * 1987-02-04 1988-08-11 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
US5389148A (en) * 1993-01-28 1995-02-14 Nordson Corporation Spray apparatus utilizing porous sheet
US20050191420A1 (en) * 2003-11-21 2005-09-01 Seiko Epson Corporation Coaoting apparatus and coating method using the same
US7332034B2 (en) * 2003-11-21 2008-02-19 Seiko Epson Corporation Coating apparatus and coating method using the same
US20150004359A1 (en) * 2013-06-27 2015-01-01 Heraeus Precious Metals North America Conshohocken LLP Platinum containing conductive paste
US9892816B2 (en) * 2013-06-27 2018-02-13 Heraeus Precious Metals North America Conshohocken Llc Platinum containing conductive paste

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