US2960639A - Semi-conductor rectifier assemblies - Google Patents

Semi-conductor rectifier assemblies Download PDF

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Publication number
US2960639A
US2960639A US818187A US81818759A US2960639A US 2960639 A US2960639 A US 2960639A US 818187 A US818187 A US 818187A US 81818759 A US81818759 A US 81818759A US 2960639 A US2960639 A US 2960639A
Authority
US
United States
Prior art keywords
semi
rectifier
desiccant
ring
rectifier assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US818187A
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English (en)
Inventor
Tipple Peter Morland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne UK Ltd
Original Assignee
English Electric Valve Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by English Electric Valve Co Ltd filed Critical English Electric Valve Co Ltd
Application granted granted Critical
Publication of US2960639A publication Critical patent/US2960639A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Definitions

  • This invention relates to semi-conductor rectifier assemblies and more specifically to semi-conductor rectifier assemblies of the kind in which the rectifier propera germanium or a silicon rectifieris housed within an hermetically sealed, gas filled envelope.
  • a semi-conductor rectifier assembly comprises a rectifier proper mounted in an hermetically sealed envelope which also houses a body of solidified desiccant material.
  • a preferred desiccant material is aluminum sodium silicate which has been subject to molecular sieving and solidified. Such a body is comparatively free from liability to the formation of desiccant dust.
  • the body is a pre-cast ring or cylinder or solidified desiccant material.
  • the hermetically sealed envelope comprises metal parts which are brazed or otherwise fixed to one another (to complete the envelope) by a heating process involving the application of high temperature
  • the desiccant ring or cylinder is preferably positioned between the rectifier proper and the areas at which said parts are so fixed to one another so as to provide a measure of shielding of the said rectifier proper from vapours which may be produced by the high temperature heating process.
  • the assembly therein shown comprises a rectifier junction I mounted in the usual way on the customary heavy copper heat sink base 2 between the upper face of said base and the usual top piece 3.
  • the latter is of rectangular section being narrower in the direction at right angles to the plane of the paper than it is in the direction of said plane.
  • An hermetically sealed envelope is completed by means of metal members 4, 5, 6 and 7 and a glass ring 8.
  • the approximately cylindrical member 4 is welded to the top piece 3 near the bottom edge thereof; the approximately annular member 7 is welded to the underside of a top flange on the member 2; the parts and 6 are fused each at one end into opposite ends of the glass ring 8; and the remaining ends of the parts 4 and 5 and the remaining ends of the parts 6 and 7 are brazed together as shown in a final brazing operation to complete the enevlope.
  • An exhaust tube 9 enables the device to be pumped out and filled with a suitable dry gas.
  • a ring of solid desiccant material pre-cast to a desired shape, such as that shown, and made, for example, of molecular sieved aluminium sodium silicate pre-cast into the solid body, is provided at it). After pumping out and filling with gas, the tube is, of course, pinched off in the usual way.
  • the desiccant ring serves the important purpose of maintaining the interior of the envelope in a dry state during the life of the device. Careful research has shown that the maintenance of a high degree of dryness is very important to good performance, probably more important than the choice of the gas used.
  • Known gas filled rectifier assemblies have fallen far short of the desired maintenance of a high degree of dryness principally because it is in practice almost impossible to avoid the release, during the life of the device, of small quantities of water vapour occluded by metal surfaces inside the envelope. Accordingly, even though great care is taken in manufacture of a known device to ensure that the gas filling is dry when it is put into the envelope, it all too often happens that when the device has been in use some time the gas filling is no longer of the required dryness.
  • the ring 10 of solidified desiccant acts as a getter for water Vapour that may be released during the life of the device.
  • the fact that the ring is of solidified desiccant material eliminates or reduces to negligible proportions the risk of powdered desiccant coming near or in contact with the rectifier proper 1. There will therefore be, in general, no need to provide protective films surrounding the rectifying junction. Further, with the ring 10 positioned as shown, it acts as a shield to prevent brazing vapours produced during the final brazing operations of manufacture from reaching the rectifying junction.
  • the modification shown in Figure 2 will be largely self-evident from the figure.
  • the essential difference between the arrangement of Figure 2 and that of Figure 1 lies in the somewhat different shape and positioning of the solidified desiccant body which in Figure 2 is referenced to 10
  • the desiccant body 10- is a cylinder mounted with one end in a ring recess in the top face of the heat-sink base 2. It projects up between the parts 4 and 5 and as will be observed provides a high degree of protection of the rectifier proper 1 against possible vapours produced during the final brazing operations.
  • a semi-conductor rectifier assembly comprising a rectifier proper mounted in a hermetically sealed envelope having metal parts, areas of which have been fixed to one another by a process involving the application of high temperature heating, and wherein a pro-cast body of solidified desiccant material is positioned between the rectifier proper and said areas at which said parts are so fixed to one another.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Rectifiers (AREA)
US818187A 1958-07-02 1959-06-04 Semi-conductor rectifier assemblies Expired - Lifetime US2960639A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB21251/58A GB849860A (en) 1958-07-02 1958-07-02 Improvements in or relating to semi-conductor rectifier assemblies

Publications (1)

Publication Number Publication Date
US2960639A true US2960639A (en) 1960-11-15

Family

ID=10159766

Family Applications (1)

Application Number Title Priority Date Filing Date
US818187A Expired - Lifetime US2960639A (en) 1958-07-02 1959-06-04 Semi-conductor rectifier assemblies

Country Status (5)

Country Link
US (1) US2960639A (de)
DE (1) DE1100172B (de)
FR (1) FR1229159A (de)
GB (1) GB849860A (de)
NL (2) NL101704C (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3176382A (en) * 1961-02-06 1965-04-06 Motorola Inc Method for making semiconductor devices
US3198875A (en) * 1962-05-03 1965-08-03 Bbc Brown Boveri & Cie Housing for semi-conductor rectifier
US3216084A (en) * 1963-04-10 1965-11-09 Motorola Inc Semiconductor process control technique
US3218524A (en) * 1961-10-12 1965-11-16 Westinghouse Electric Corp Semiconductor devices
US3512050A (en) * 1967-11-29 1970-05-12 Gen Motors Corp High power semiconductor device
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1225771B (de) * 1962-03-17 1966-09-29 Telefunken Patent Halbleiterbauelement und Verfahren zu seiner Herstellung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2686279A (en) * 1949-09-28 1954-08-10 Rca Corp Semiconductor device
US2820931A (en) * 1953-04-27 1958-01-21 Sylvania Electric Prod Semiconductor devices and methods
US2858356A (en) * 1953-01-21 1958-10-28 Setchell Barton Thomas High voltage transformer assemblies

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE554903A (de) * 1951-06-08 1900-01-01

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2686279A (en) * 1949-09-28 1954-08-10 Rca Corp Semiconductor device
US2858356A (en) * 1953-01-21 1958-10-28 Setchell Barton Thomas High voltage transformer assemblies
US2820931A (en) * 1953-04-27 1958-01-21 Sylvania Electric Prod Semiconductor devices and methods

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3176382A (en) * 1961-02-06 1965-04-06 Motorola Inc Method for making semiconductor devices
US3218524A (en) * 1961-10-12 1965-11-16 Westinghouse Electric Corp Semiconductor devices
US3198875A (en) * 1962-05-03 1965-08-03 Bbc Brown Boveri & Cie Housing for semi-conductor rectifier
US3216084A (en) * 1963-04-10 1965-11-09 Motorola Inc Semiconductor process control technique
US3512050A (en) * 1967-11-29 1970-05-12 Gen Motors Corp High power semiconductor device
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring

Also Published As

Publication number Publication date
FR1229159A (fr) 1960-09-05
GB849860A (en) 1960-09-28
NL240675A (de)
DE1100172B (de) 1961-02-23
NL101704C (de)

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