US2812406A - Electrical contact - Google Patents
Electrical contact Download PDFInfo
- Publication number
- US2812406A US2812406A US413633A US41363354A US2812406A US 2812406 A US2812406 A US 2812406A US 413633 A US413633 A US 413633A US 41363354 A US41363354 A US 41363354A US 2812406 A US2812406 A US 2812406A
- Authority
- US
- United States
- Prior art keywords
- percent
- alloy
- gold
- contacts
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 52
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 43
- 229910052763 palladium Inorganic materials 0.000 claims description 26
- 229910052697 platinum Inorganic materials 0.000 claims description 18
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 16
- 229910052741 iridium Inorganic materials 0.000 claims description 16
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052703 rhodium Inorganic materials 0.000 claims description 16
- 239000010948 rhodium Substances 0.000 claims description 16
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 16
- 229910052707 ruthenium Inorganic materials 0.000 claims description 16
- 229910052762 osmium Inorganic materials 0.000 claims description 15
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 description 45
- 239000000956 alloy Substances 0.000 description 45
- 229910052751 metal Inorganic materials 0.000 description 43
- 239000002184 metal Substances 0.000 description 43
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 42
- 229910052737 gold Inorganic materials 0.000 description 42
- 239000010931 gold Substances 0.000 description 42
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 33
- 229910052709 silver Inorganic materials 0.000 description 31
- 239000004332 silver Substances 0.000 description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000005755 formation reaction Methods 0.000 description 13
- 229910001020 Au alloy Inorganic materials 0.000 description 10
- 239000003353 gold alloy Substances 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 8
- 239000000843 powder Substances 0.000 description 6
- 239000010953 base metal Substances 0.000 description 5
- -1 e. g. Substances 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000011835 investigation Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000012332 laboratory investigation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
Definitions
- This invention relates generally to electrical contacts and more particularly to electrical contacts used to make and break circuits wherein circuit interruptions due to malfunctioning of contacts must be kept to a minimum.
- An object of this invention is to reduce to a minimum circuit interruptions due to contact failure.
- a further object of this invention is to improve circuit performance most efficiently and at the least cost, thereby resulting in the reduction of maintenance cost on contact actuating devices and their associated circuitry.
- a feature of this invention is a single combinational contact which will properly make and break circuits regardless of whether or not they carry current or have a potential thereon.
- a specific feature of this invention is a contact comprising an exposed layer of an alloy including by weight at least 50 percent gold and a negligible amount of metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium and osmium and an unexposed layer of an alloy thereunder including by weight at least 50 percent metal of said group or 50 percent silver or some combination thereof.
- the base metals e. g., copper, nickel, etc.
- the base metals are generally inexpensive as well as resistant to erosion and to other deleterious effects of arcing. Even so, the formation of oxide and/ or sulfide films on their surfaces with the resulting large increase in contact resistance has always made them a poor choice for general contact use, I such as in telephone systems. however, that these films are only likely to prove objectionable when the relative movement between contacts is small.
- the platinum-group metals which I include platinum, palladium, iridium, rhodium, ruthenium and osmium, when used as contact material will continue to provide a low resistive .circuit path as they do not suffer from the formation of oxide or sulfide films on their surfaces.
- the platinum group metals do have the disadvantage of being relatively expensive.
- Gold electrically speaking, has been recognized in the prior art for many years as an excellent contact material. As is the case with the platinum-group metals, gold provides a dependable low resistive circuit path which is not affected by surface film formations. However, gold, as compared with the platinum group metals, is subject to excessive deterioration from mechanical wear as well as electrical erosion. Its use on contacts making or breaking appreciable amounts of current (say greater than 0.4 ,amperewhas been found generally unsatisfactory. The
- Silver has also been used for many years as a contact material. It, too, provides a low resistive path but has as an inherent disadvantage a propensity to tarnish when exposed to the atmosphere. This increases the resistance of a circuit path and more importantly precludes silver contacts from being used satisfactorily in many talking circuits because of the so-called tarnish noise.
- brown powder designates a circuit with no voltage differential between the contacts during closure and no current flowing between the contacts during opening, i. e., a circuit producing little or no arcing when opened or closed. Investigation of Wet circuit contacts of this group (those interposed in circuits which are on opening or closing) show little or no evidence of this brown powder formation.
- this brown powder is an organic deposit of good insulating properties which forms on dry circuit platinum group metal contacts when operated in the presence of organic materials. Though it is not certain by what process this organic deposit forms, there is good evidence to show that it is the result of organic vapors in the atmosphere becoming adsorbed on the surface of the platinum group metal.
- the friction between the mating contact surfaces (when the electromagnetic devices operate or release) combined with what appears to be a catalytic action of platinum group metals transforms the adsorbed vapors into the finely divided solid organic deposit.
- the collection of quantities of this organic deposit on mating surfaces causes circuit opens and occasionally produces variable-resistance contacts which create undesirable noise in telephone circuits. This organic deposit causes circuit opens in a manner similar to those caused by the presence of dust on contact surfaces; thus, contact opens that for years have been attributed to dust may well have been due, in many cases, to the presence of an organic deposit.
- Figs. 1 and 2 of the drawing illustrate two structural configurations which this improved combinational contact may take.
- a predominantly gold alloy layer 1 covers a predominantly platinum group or silver metal base layer 2 which is attached to a relay spring 3.
- Fig. 2 shows a predominantly gold alloy cap 4 covering a predominantly platinum group or silver metal base 5 which is, in turn, afiixed to a relay spring 6.
- the gold alloy overlay layer or cap may be affixed to the platinum or silver base in any convenient manner, and similarly, the base may be attached to the relay spring in any desired fashion.
- a number of predominantly gold alloys can be used satisfactorily as an overlay material. While fine or pure gold will work satisfactorily from the standpoint of not encouraging the formation of organic deposits, its mechanical wear properties are so poor that it has been found advantageous to alloy it with other metals.
- a particular alloy including by weight 70 percent gold and percent silver has been found to work well. This alloy is disclosed in Patent 1,673,267 issued June 12, 1928 to R. A. Price, wherein it is shown as a mount wire .for a filament in an electric lamp.
- Alloys comprising predominant percentages of gold with the remainder of the metal selected from a group consisting of silver, copper, nickel and other base metals are also satisfactory as overlay alloys provided the percentages of these elements alloyed with goldare kept low enough to prevent the formation of objectionable oxide or sulfide films on the surface of the gold alloy.
- any predominantly gold alloy as described above has been found satisfactory as an overlay over a metal base including metal from the platinum group or silver.
- a silver or silver alloy base is employed for contacts, however, the noise requirement of the circuit must be considered. Because long distances are spanned and intricate switching systems are employed by most American telephone installations, noise requirements are more stringent than those found in European installations. Fortunately, most talking circuits are dry circuits. Most of them close through the gold overlay and are little affected by the silver base. Wet circuits ordinarily are not talking circuits and silver-caused tarnish noise is not objectionable thereon. Quite often if the circuit requirements are not too high, the cost advantage of a silver base as compared to a platinum group metal base may outweigh the small increase in noise level which accompanies the use of a silver base.
- the thickness of the 70 percent gold and 30 percent silver alloy overlay be at least .0005 of an inch thick.
- the thickness of the gold alloy overlay should be between one and one and onehalf mils.
- An electrical contact comprising an overlay cap of alloy including by weight at least 50 percent gold and not more than 5 percent metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium, and osmium, said cap covering an alloy including by weight at least 50 percent metal of said group.
- An electrical contact comprising an exposed layer of an alloy including by weight 70 percent gold and 30 percent silver and a layer of palladium thereunder.
- An electrical contact comprising an exposed layer of an alloy including by weight 70 percent gold and 30 percent silver and a layer of silver thereunder.
- An electrical contact comprising an exposed layer of alloy between one and one and one-half mils thick including by weight 70 percent gold and 30 percent silver and a layer of palladium thereunder.
- An electrical contact comprising an exposed layer of alloy at ,least one mil thick including by weight at least '50 percent gold and not more than 5 percent metal selected from the group consisting of platinum, palladium, iridium, rhodium, ruthenium, and osmium and a layer of alloy thereunder including by weight at least 50 percent metal of said group and the remainder nickel.
- An electrical contact comprising an overlay cap of a metallic alloy at ;least one mil thick including by weight at least 50 percent gold and not more than 5 percent metal selected'from the group consisting of platinum,
- said cap covering a metallic alloy including by weight at least 50 percent silver.
- An electrical contact comprising an exposed layer of alloy including by weight 70 percent gold and 30 percent silver and a layer of alloy thereunder. including by weight at least 50 percent metal selected from a group consisting of platinum, palladium, iridium, rhodium, ruthenium, and osmium.
- An electrical contact comprising an exposed layer of alloy including by weight 72 percent gold, 26.2 percent silver, and 1.8 percent nickel and a layer of alloy thereunder including by Weight at least 50 percent metal selected from a group consisting of platinum, palladium, iridium, rhodium, ruthenium and osmium.
- a pair of cooperating electrical make-and-break contacts each of said contacts comprising an exposed layer of alloy including by weight at least 50 percent gold and not more than percent metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium, and osmium, and a layer of alloy thereunder including by weight at least 50 percent metal of said group, said exposed layers of said contacts cooperating with each other.
- each contact comprising an alloy cap at least .0005 inch thick and including by weight 70 percent gold and 30 percent silver, said cap covering an alloy including by weight at least 50 percent palladium and the remainder nickel, said caps of said contacts cooperating with each other.
- An electrical contact comprising an exposed layer of alloy including by weight at least 50 percent gold and a negligible amount of metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium and osmium and a layer of alloy thereunder including by weight at least 50 percent metal of said group.
- An electrical contact comprising an exposed layer of alloy including by weight at least 50 percent gold and a negligible amount of metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium and osmium and a layer of alloy thereunder including by Weight at least 50 percent silver.
- An electrical contact comprising an exposed layer of alloy including by weight 50 to 100 percent gold, 0 to 35 percent silver, and 0 to 6 percent metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium andosmium and a layer of alloy thereunder including by weight at least 50 percent metal of said group.
- An electrical contact comprising, in combination, an exposed layer not less than .001 inch thick of an alloy including by weight 7 2 percent gold, 26.2 percent silver,
- An electrical contact comprising an exposed layer of alloy including by weight 91.7 percent gold and 8.3 percent silver and a layer of alloy thereunder including by weight at least 50 percent metal selected from the group consisting of platinum, palladium, iridium, rhodium, ruthenium and osmium.
- An electrical contact comprising an exposed layer of an alloy including by weight 91.7 percent gold and 8.3 percent silver and a layer of silver thereunder.
- a pair of cooperating electrical make-and-break contacts each of said contacts comprising an exposed layer of alloy at least .0005 inch thick and including by weight at least 50 percent gold and a negligible amount of metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium and osmium and a layer of alloy thereunder including by weight at least 50 percent metal of said group, said exposed layers of said contacts cooperating with each other.
- a pair of cooperating electrical make-and-break contacts each of said contacts comprising an exposed layer of alloy at least .0005 inch thick and including by weight at least 50 percent gold and a negligible amount of metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium and osmium and a layer of alloy thereunder including by weight at least 50 percent silver, said exposed layers of said contacts cooperating with each other.
- a pair of cooperating electrical make-and-break contacts each of said contacts comprising an exposed layer of alloy at least .0005 inch thick and including by weight 50 to percent gold, 0 to 35 percent silver, and 0 to 6 percent metal from the group consisting of platinum, palladium, iridium, rhodium, ruthenium and osmium and a layer of alloy thereunder including by weight at least 50 percent metal of said group, said exposed layers of said contacts cooperating with each other.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Contacts (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE536121D BE536121A (en, 2012) | 1954-03-02 | ||
NL193594D NL193594A (en, 2012) | 1954-03-02 | ||
NL92647D NL92647C (en, 2012) | 1954-03-02 | ||
US413633A US2812406A (en) | 1954-03-02 | 1954-03-02 | Electrical contact |
FR1118924D FR1118924A (fr) | 1954-03-02 | 1955-01-07 | Perfectionnements aux contacts électriques |
DEW15742A DE1078774B (de) | 1954-03-02 | 1955-01-14 | Elektrischer Kontakt |
GB5701/55A GB765273A (en) | 1954-03-02 | 1955-02-25 | Electrical contacts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US413633A US2812406A (en) | 1954-03-02 | 1954-03-02 | Electrical contact |
Publications (1)
Publication Number | Publication Date |
---|---|
US2812406A true US2812406A (en) | 1957-11-05 |
Family
ID=23638008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US413633A Expired - Lifetime US2812406A (en) | 1954-03-02 | 1954-03-02 | Electrical contact |
Country Status (6)
Country | Link |
---|---|
US (1) | US2812406A (en, 2012) |
BE (1) | BE536121A (en, 2012) |
DE (1) | DE1078774B (en, 2012) |
FR (1) | FR1118924A (en, 2012) |
GB (1) | GB765273A (en, 2012) |
NL (2) | NL92647C (en, 2012) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3002074A (en) * | 1959-06-08 | 1961-09-26 | Daystrom Inc | Relay contact system |
US3041118A (en) * | 1960-07-25 | 1962-06-26 | Gen Electric | Electric contact element |
US3086285A (en) * | 1957-11-05 | 1963-04-23 | Engelhard Ind Inc | Electrical contacts |
US3229357A (en) * | 1961-07-05 | 1966-01-18 | Schlatter Ag | Process and apparatus for manufacturing contact blades |
US3249728A (en) * | 1962-08-01 | 1966-05-03 | Nippon Electric Co | Reed switch having multi-layer diffused contacts |
US3251121A (en) * | 1962-08-07 | 1966-05-17 | Bell Telephone Labor Inc | Method of making reed-type switch contacts |
US3331040A (en) * | 1963-05-13 | 1967-07-11 | Int Standard Electric Corp | Miniature diaphragm relay |
DE1764233B1 (de) * | 1968-04-27 | 1971-05-06 | Heraeus Gmbh W C | Elektrischer schwachstromkontakt |
US3649795A (en) * | 1969-05-01 | 1972-03-14 | William Ralph Byrne | Electrical contacts |
JPS49100164U (en, 2012) * | 1972-12-19 | 1974-08-29 | ||
US3885115A (en) * | 1972-11-15 | 1975-05-20 | Bunker Ramo | Switch-over contact |
JPS5569913A (en) * | 1979-10-16 | 1980-05-27 | Matsushita Electric Works Ltd | Method of manufacturing contactor |
US4641002A (en) * | 1978-07-19 | 1987-02-03 | Gesellschaft Fuer Kernenerg Ieverwertung In Schiffbau Und Schiffahat Gmbh | Electrical contact |
WO1996026526A1 (en) * | 1995-02-24 | 1996-08-29 | Mabuchi Motor Co., Ltd. | Sliding contact material, clad composite material, commutator employing said material and direct current motor employing said commutator |
US5598629A (en) * | 1991-12-04 | 1997-02-04 | Siemens Aktiengesellschaft | Process for making contact with a silver contact base |
US20040238338A1 (en) * | 2001-08-03 | 2004-12-02 | Joachim Ganz | Electric contact |
WO2007019390A3 (en) * | 2005-08-03 | 2007-03-29 | Ccmi Corp | Enhancement of surface-active solid-phase heterogeneous catalysts |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2604291C3 (de) * | 1976-02-04 | 1981-08-20 | Siemens AG, 1000 Berlin und 8000 München | Werkstoffanordnung für elektrische Schwachstromkontakte |
DE2940772C2 (de) | 1979-10-08 | 1982-09-09 | W.C. Heraeus Gmbh, 6450 Hanau | Elektrischer Schwachstromkontakt |
WO1983002195A1 (en) * | 1981-12-10 | 1983-06-23 | Anderton, David, James | Light duty corrosion resistant contacts |
DE3345162C1 (de) * | 1983-12-14 | 1984-11-15 | Degussa Ag, 6000 Frankfurt | Werkstoffe für Schwachstromkontakte |
DE19809450A1 (de) * | 1998-03-06 | 1999-09-23 | Inovan Stroebe | Elektrisches Mehrlagen-Kontaktprofil |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US937284A (en) * | 1909-02-24 | 1909-10-19 | Western Electric Co | Alloy. |
US1561247A (en) * | 1923-09-07 | 1925-11-10 | Western Electric Co | Metallic composition |
US2241262A (en) * | 1939-10-26 | 1941-05-06 | Baker & Co Inc | Electrical contact |
US2300286A (en) * | 1941-05-08 | 1942-10-27 | Fansteel Metallurgical Corp | Electrical contact |
US2600175A (en) * | 1946-09-11 | 1952-06-10 | Metals & Controls Corp | Electrical contact |
US2735907A (en) * | 1956-02-21 | Moisture |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH113777A (de) * | 1924-08-14 | 1926-02-01 | Bell Telephone Mfg | Metallegierung für elektrische Kontakte usw. |
DE727512C (de) * | 1939-11-30 | 1942-11-05 | Heraeus Gmbh W C | Elektrischer Kontakt |
DE762506C (de) * | 1942-11-21 | 1954-04-29 | Degussa | Hochsalzsaeurebestaendige Apparateteile |
DE858898C (de) * | 1944-05-31 | 1952-12-11 | Heraeus Gmbh W C | Goldlegierung |
-
0
- NL NL193594D patent/NL193594A/xx unknown
- NL NL92647D patent/NL92647C/xx active
- BE BE536121D patent/BE536121A/xx unknown
-
1954
- 1954-03-02 US US413633A patent/US2812406A/en not_active Expired - Lifetime
-
1955
- 1955-01-07 FR FR1118924D patent/FR1118924A/fr not_active Expired
- 1955-01-14 DE DEW15742A patent/DE1078774B/de active Pending
- 1955-02-25 GB GB5701/55A patent/GB765273A/en not_active Expired
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2735907A (en) * | 1956-02-21 | Moisture | ||
US937284A (en) * | 1909-02-24 | 1909-10-19 | Western Electric Co | Alloy. |
US1561247A (en) * | 1923-09-07 | 1925-11-10 | Western Electric Co | Metallic composition |
US2241262A (en) * | 1939-10-26 | 1941-05-06 | Baker & Co Inc | Electrical contact |
US2300286A (en) * | 1941-05-08 | 1942-10-27 | Fansteel Metallurgical Corp | Electrical contact |
US2600175A (en) * | 1946-09-11 | 1952-06-10 | Metals & Controls Corp | Electrical contact |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3086285A (en) * | 1957-11-05 | 1963-04-23 | Engelhard Ind Inc | Electrical contacts |
US3002074A (en) * | 1959-06-08 | 1961-09-26 | Daystrom Inc | Relay contact system |
US3041118A (en) * | 1960-07-25 | 1962-06-26 | Gen Electric | Electric contact element |
US3229357A (en) * | 1961-07-05 | 1966-01-18 | Schlatter Ag | Process and apparatus for manufacturing contact blades |
US3249728A (en) * | 1962-08-01 | 1966-05-03 | Nippon Electric Co | Reed switch having multi-layer diffused contacts |
US3251121A (en) * | 1962-08-07 | 1966-05-17 | Bell Telephone Labor Inc | Method of making reed-type switch contacts |
US3331040A (en) * | 1963-05-13 | 1967-07-11 | Int Standard Electric Corp | Miniature diaphragm relay |
DE1764233B1 (de) * | 1968-04-27 | 1971-05-06 | Heraeus Gmbh W C | Elektrischer schwachstromkontakt |
US3649795A (en) * | 1969-05-01 | 1972-03-14 | William Ralph Byrne | Electrical contacts |
US3885115A (en) * | 1972-11-15 | 1975-05-20 | Bunker Ramo | Switch-over contact |
JPS49100164U (en, 2012) * | 1972-12-19 | 1974-08-29 | ||
US4641002A (en) * | 1978-07-19 | 1987-02-03 | Gesellschaft Fuer Kernenerg Ieverwertung In Schiffbau Und Schiffahat Gmbh | Electrical contact |
JPS5569913A (en) * | 1979-10-16 | 1980-05-27 | Matsushita Electric Works Ltd | Method of manufacturing contactor |
US5598629A (en) * | 1991-12-04 | 1997-02-04 | Siemens Aktiengesellschaft | Process for making contact with a silver contact base |
US5799771A (en) * | 1991-12-04 | 1998-09-01 | Siemens Aktiengesellschaft | Contact with a silver contact base and process for making the same |
WO1996026526A1 (en) * | 1995-02-24 | 1996-08-29 | Mabuchi Motor Co., Ltd. | Sliding contact material, clad composite material, commutator employing said material and direct current motor employing said commutator |
US20040238338A1 (en) * | 2001-08-03 | 2004-12-02 | Joachim Ganz | Electric contact |
US7015406B2 (en) * | 2001-08-03 | 2006-03-21 | Ami Doduco Gmbh | Electric contact |
WO2007019390A3 (en) * | 2005-08-03 | 2007-03-29 | Ccmi Corp | Enhancement of surface-active solid-phase heterogeneous catalysts |
US9339808B2 (en) | 2005-08-03 | 2016-05-17 | Ccmi Corporation | Enhancement of surface-active solid-phase heterogeneous catalysts |
Also Published As
Publication number | Publication date |
---|---|
DE1078774B (de) | 1960-03-31 |
NL193594A (en, 2012) | |
NL92647C (en, 2012) | |
BE536121A (en, 2012) | |
GB765273A (en) | 1957-01-09 |
FR1118924A (fr) | 1956-06-13 |
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