US2706175A - Apparatus for electroplating the inner surface of a tubular article - Google Patents

Apparatus for electroplating the inner surface of a tubular article Download PDF

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Publication number
US2706175A
US2706175A US148424A US14842450A US2706175A US 2706175 A US2706175 A US 2706175A US 148424 A US148424 A US 148424A US 14842450 A US14842450 A US 14842450A US 2706175 A US2706175 A US 2706175A
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United States
Prior art keywords
anode
end wall
tube
electrolyte
tubular article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US148424A
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English (en)
Inventor
Licharz Carl Elmar
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Electro Metal Hardening Co S A Tanger
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Individual
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Publication of US2706175A publication Critical patent/US2706175A/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

  • An ob ect of the invention is to provide an arrangement for electroplating the inner surface of a tubular article by means of which the circulating electrolyte used for the electroplating of the article serves also as cooling means for the anode.
  • Another object of the invention is to provide an arrangement for electroplating the inner surface of a tubular article by means of which a high quality of electroplating may be obtained.
  • a further object of the invention is to improve on arrangements for electroplating the inner surface of tubular articles as now ordinarily made.
  • the walls c of a hollow cylindrical tube to be internally chrominum plated are connected to a cathode current conductor k.
  • the tube is hermetically sealed by means of rigid end wall means or covers 1 consisting of suitable insulating material which is resistant against the chromic acid bath.
  • the covers I also serve to carry the anode e disposed with its axis centrally in the tube.
  • the anode e consists of an internal, hollow lead tube 1 through which the electrolyte enters at m.
  • the lead tube 1 is surrounded by a copper tube g which in turn is provided with a lead cover h.
  • the electrolyte flowing through the hollow interior of the anode is in contact exclusively with the lead tube 1, and the electrolyte within the tube only comes into contact with the outer lead cover h of the anode.
  • the flow of the circulating electrolyte from the interior of the anode e to the chamber between the anode and the tube 0 takes place through passage means or apertures b arranged in the anode e in substantial proximity to the lower cover I.
  • apertures b also extend through the intermediate copper tube g of the anode it is necessary to provide the apertures with a protective coating, preferably of lead. This protective coating can be applied either electrolytically, by spraying or in any other suitable way.
  • the electrolyte flows downwardly from the inlet m through the lead tube 1 which forms the internal passage of the anode e, through the apertures b at the lower end of the anode into the chamber between the anode and the tube e; the electrolyte then flows upwardly and is removed through the outlet tube d in the upper cover.
  • the supply of electric current to the anode e is effected in the embodiment shown by way of conductors i which are directly connected to the copper tube g which projects beyond the outer lead cover b. In this way the current is caused to fiow mainly through the copper which has a high conductance whereby heat ing of the anode is reduced as much as possible.
  • the fresh electrolyte flowing through the interior of the anode exerts, a cooling effect upon the anode.
  • a long anode it is preferable to arrange the supply of electric current at each end of the anode thereby securing uniform current distribution.
  • the chromium plating of the internal surface of the tube is performed with the tube disposed vertically.
  • This method United States Patent 0 2,706,175 Patented Apr. 12, 1955 'ice has proved to be particularly advantageous as the removal of hydrogen produced by the electrolysis, is facilitated, the hydrogen being discharged together with the outflowing electrolyte through the outlet tube d.
  • the chromium plating method according to the invention is applied to horizontally disposed tubes of greater dimensions a greater number of apertures is preferably provided in the anode, these apertuers being preferably evenly distributed over the whole length of the anode.
  • the electrolyte discharged through the outlet tube d flows to a container (not shown) where chromic acid is added as necessary in order to maintain the concentration of chromium in the electrolyte.
  • the regenerated electrolyte is thereafter recirculated from the container to the interior of the anode by means of a pump built of chromic acid resistive material.
  • the internal plating obtained by the process according to the invention is preferably freed from confined hydrogen and I have found that this may, for example be effected by subjecting the interior of the tube to a high vacuum, for example 0.001 Torricelli; the treatment may for example be carried out for about one hour when the greater part of the hydrogen will have been removed. Any residual hydrogen may if desired, be removed by subjecting the tube to slow heating, the temperature being kept below the annealing point of the metal.
  • An arrangement for electroplating the inner surface of a tubular article comprising in combination: a hollow anode having a closed end and an open end for connection with the electrolyte supplying means, first end Wall means having its major surface transverse to the longitudinal axis of said anode and being connected to said anode adjacent said closed end thereof, second end wall means having its major surface transverse to the longitudinal axis of said anode and being connected to said anode adjacent said open end thereof, said first and said second end wall means being arranged to receive therebetween the tubular article to be electroplated and tightly closing the open ends of said article so as to form with said tubular article and said anode a chamber for receiving an eloctrolyte from the interior of said anode, said anode having a smooth outer wall and being provided with passage means intermediate said first and second end wall means and arranged only in substantial proximity to said first end Wall means and extending from the inside of said anode to the outside thereof for conveying electrolyte in substantial proximity to said first end wall
  • anode includes a copper tube having a length greater than the distance between the insides of said end wall means, a lead tube covering the inside of and being connected to said copper tube, said lead tube having a length at least equalling the length of said copper tube, and a lead coating covering the outside of said copper tube between the insides of said first and second end wall means, the passage means extending through said anode having a lead coating throughout the length of said last mentioned passage means thereby preventing electrolyte passing therethrough from contacting said copper tube.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US148424A 1949-03-18 1950-03-08 Apparatus for electroplating the inner surface of a tubular article Expired - Lifetime US2706175A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE281450X 1949-03-18

Publications (1)

Publication Number Publication Date
US2706175A true US2706175A (en) 1955-04-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
US148424A Expired - Lifetime US2706175A (en) 1949-03-18 1950-03-08 Apparatus for electroplating the inner surface of a tubular article

Country Status (6)

Country Link
US (1) US2706175A (ja)
BE (1) BE494578A (ja)
CH (1) CH281450A (ja)
DE (1) DE830860C (ja)
FR (1) FR1023810A (ja)
GB (1) GB667227A (ja)

Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2978799A (en) * 1954-05-19 1961-04-11 Benteler Werke Ag Internally and externally coppercoated steel tubes and their manufacture
US3483097A (en) * 1968-01-08 1969-12-09 Gen Motors Corp Method for coating inside surfaces of cavities
US3905885A (en) * 1973-06-13 1975-09-16 United States Steel Corp Method for the electrolytic conditioning of metal tubes
US4294670A (en) * 1979-10-29 1981-10-13 Raymond Louis W Precision electroplating of metal objects
US4853099A (en) * 1988-03-28 1989-08-01 Sifco Industries, Inc. Selective electroplating apparatus
US4931150A (en) * 1988-03-28 1990-06-05 Sifco Industries, Inc. Selective electroplating apparatus and method of using same
US20020102853A1 (en) * 2000-12-22 2002-08-01 Applied Materials, Inc. Articles for polishing semiconductor substrates
US20020119286A1 (en) * 2000-02-17 2002-08-29 Liang-Yuh Chen Conductive polishing article for electrochemical mechanical polishing
US20030209448A1 (en) * 2002-05-07 2003-11-13 Yongqi Hu Conductive polishing article for electrochemical mechanical polishing
US20040020788A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Contacts for electrochemical processing
US20040023610A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040023495A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Contacts for electrochemical processing
US20040082289A1 (en) * 2000-02-17 2004-04-29 Butterfield Paul D. Conductive polishing article for electrochemical mechanical polishing
US20040082288A1 (en) * 1999-05-03 2004-04-29 Applied Materials, Inc. Fixed abrasive articles
US20040121708A1 (en) * 2000-02-17 2004-06-24 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20040134792A1 (en) * 2000-02-17 2004-07-15 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040163946A1 (en) * 2000-02-17 2004-08-26 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20050000801A1 (en) * 2000-02-17 2005-01-06 Yan Wang Method and apparatus for electrochemical mechanical processing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US20050161341A1 (en) * 2000-02-17 2005-07-28 Applied Materials, Inc. Edge bead removal by an electro polishing process
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US20060030156A1 (en) * 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US20060032749A1 (en) * 2000-02-17 2006-02-16 Liu Feng Q Contact assembly and method for electrochemical mechanical processing
US20060057812A1 (en) * 2004-09-14 2006-03-16 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US20060070872A1 (en) * 2004-10-01 2006-04-06 Applied Materials, Inc. Pad design for electrochemical mechanical polishing
US20060073768A1 (en) * 2004-10-05 2006-04-06 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US20060172671A1 (en) * 2001-04-24 2006-08-03 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
WO2006087743A1 (en) * 2005-02-21 2006-08-24 Aerotecnica Coltri S.P.A. Anode for an apparatus for the galvanic coating of the running surfaces of cylinders
US20060219663A1 (en) * 2005-03-31 2006-10-05 Applied Materials, Inc. Metal CMP process on one or more polishing stations using slurries with oxidizers
US20060229007A1 (en) * 2005-04-08 2006-10-12 Applied Materials, Inc. Conductive pad
US20070099552A1 (en) * 2001-04-24 2007-05-03 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US20070096315A1 (en) * 2005-11-01 2007-05-03 Applied Materials, Inc. Ball contact cover for copper loss reduction and spike reduction
US20070298186A1 (en) * 2006-06-21 2007-12-27 Kyung Jun Yang Method and apparatus for plating threaded portion of high pressure gas cylinder
US20080108288A1 (en) * 2000-02-17 2008-05-08 Yongqi Hu Conductive Polishing Article for Electrochemical Mechanical Polishing
US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
US20080293343A1 (en) * 2007-05-22 2008-11-27 Yuchun Wang Pad with shallow cells for electrochemical mechanical processing
US20080311235A1 (en) * 2005-01-21 2008-12-18 Slafer Dennis W Replication Tools and Related Fabrication Methods and Apparatus
EP2180088A1 (de) 2008-10-22 2010-04-28 Enthone, Inc. Verfahren zur galvanischen Abscheidung von Hartchromschichten
US7833389B1 (en) * 2005-01-21 2010-11-16 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US20160032476A1 (en) * 2014-07-29 2016-02-04 Min Aik Precision Industrial Co., Ltd. Electroplating equipment capable of gold-plating on a through hole of a workpiece
US9307648B2 (en) 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US10682805B2 (en) 2006-02-27 2020-06-16 Microcontinuum, Inc. Formation of pattern replicating tools
US10879595B2 (en) 2013-05-17 2020-12-29 Microcontinuum, Inc. Tools and methods for producing nanoantenna electronic devices

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE939362C (de) * 1953-06-04 1956-02-23 Wilhelm Meyer Verfahren und Vorrichtung zum Innenverchromen
DE959776C (de) * 1953-07-08 1957-03-14 Wolfram Ruff Dr Ing Anordnung zum Hartverchromen von Leichtmetallmotorenzylindern
FR2565323B1 (fr) * 1984-05-30 1986-10-17 Framatome Sa Procede de protection contre la corrosion d'un tube de generateur de vapeur et dispositif pour la mise en oeuvre de ce procede
US4686013A (en) * 1986-03-14 1987-08-11 Gates Energy Products, Inc. Electrode for a rechargeable electrochemical cell and method and apparatus for making same
GB8719816D0 (en) * 1987-08-21 1987-09-30 Sb Plating Ltd Electro-plating techniques

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB190403087A (en) * 1904-02-08 1904-12-08 Henry Maurice Wilton P Johnson Improvements relating to Apparatus for Amalgamating and Coating Metals or Alloys of Metals with Metals or Alloys of Metals by the Aid of Electricity
US914856A (en) * 1908-02-10 1909-03-09 Otto Meyer Electrolytic apparatus.
US1809826A (en) * 1927-09-06 1931-06-16 Chromium Corp Process of electrodepositing chromium
US1886218A (en) * 1927-06-29 1932-11-01 Western Cartridge Co Gun barrel and process of finishing the same
US1927162A (en) * 1931-02-27 1933-09-19 Research Corp Electroplating
US1982009A (en) * 1931-11-30 1934-11-27 Paul E Mckinney Means for electroplating the interior surfaces of hollow articles
FR825071A (fr) * 1937-04-27 1938-02-23 Appareil pour doubler les cylindres et paliers de machines
US2332569A (en) * 1940-03-08 1943-10-26 Flannery Bolt Co Hollow stay bolt
US2431948A (en) * 1943-11-01 1947-12-02 Gen Motors Corp Apparatus for electrodepositing metal on bearing shells and the like
US2475586A (en) * 1943-04-09 1949-07-12 Thompson Prod Inc Method of electropolishing the internal surface of a hollow valve

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB190403087A (en) * 1904-02-08 1904-12-08 Henry Maurice Wilton P Johnson Improvements relating to Apparatus for Amalgamating and Coating Metals or Alloys of Metals with Metals or Alloys of Metals by the Aid of Electricity
US914856A (en) * 1908-02-10 1909-03-09 Otto Meyer Electrolytic apparatus.
US1886218A (en) * 1927-06-29 1932-11-01 Western Cartridge Co Gun barrel and process of finishing the same
US1809826A (en) * 1927-09-06 1931-06-16 Chromium Corp Process of electrodepositing chromium
US1927162A (en) * 1931-02-27 1933-09-19 Research Corp Electroplating
US1982009A (en) * 1931-11-30 1934-11-27 Paul E Mckinney Means for electroplating the interior surfaces of hollow articles
FR825071A (fr) * 1937-04-27 1938-02-23 Appareil pour doubler les cylindres et paliers de machines
US2332569A (en) * 1940-03-08 1943-10-26 Flannery Bolt Co Hollow stay bolt
US2475586A (en) * 1943-04-09 1949-07-12 Thompson Prod Inc Method of electropolishing the internal surface of a hollow valve
US2431948A (en) * 1943-11-01 1947-12-02 Gen Motors Corp Apparatus for electrodepositing metal on bearing shells and the like

Cited By (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2978799A (en) * 1954-05-19 1961-04-11 Benteler Werke Ag Internally and externally coppercoated steel tubes and their manufacture
US3483097A (en) * 1968-01-08 1969-12-09 Gen Motors Corp Method for coating inside surfaces of cavities
US3905885A (en) * 1973-06-13 1975-09-16 United States Steel Corp Method for the electrolytic conditioning of metal tubes
US4294670A (en) * 1979-10-29 1981-10-13 Raymond Louis W Precision electroplating of metal objects
US4853099A (en) * 1988-03-28 1989-08-01 Sifco Industries, Inc. Selective electroplating apparatus
US4931150A (en) * 1988-03-28 1990-06-05 Sifco Industries, Inc. Selective electroplating apparatus and method of using same
US20040082288A1 (en) * 1999-05-03 2004-04-29 Applied Materials, Inc. Fixed abrasive articles
US7014538B2 (en) 1999-05-03 2006-03-21 Applied Materials, Inc. Article for polishing semiconductor substrates
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040023610A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040023495A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Contacts for electrochemical processing
US20040082289A1 (en) * 2000-02-17 2004-04-29 Butterfield Paul D. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US20040121708A1 (en) * 2000-02-17 2004-06-24 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20040134792A1 (en) * 2000-02-17 2004-07-15 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040163946A1 (en) * 2000-02-17 2004-08-26 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20050000801A1 (en) * 2000-02-17 2005-01-06 Yan Wang Method and apparatus for electrochemical mechanical processing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US20050133363A1 (en) * 2000-02-17 2005-06-23 Yongqi Hu Conductive polishing article for electrochemical mechanical polishing
US20050161341A1 (en) * 2000-02-17 2005-07-28 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7569134B2 (en) 2000-02-17 2009-08-04 Applied Materials, Inc. Contacts for electrochemical processing
US20020119286A1 (en) * 2000-02-17 2002-08-29 Liang-Yuh Chen Conductive polishing article for electrochemical mechanical polishing
US20050284770A1 (en) * 2000-02-17 2005-12-29 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6988942B2 (en) 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US20070111638A1 (en) * 2000-02-17 2007-05-17 Applied Materials, Inc. Pad assembly for electrochemical mechanical polishing
US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
US20060032749A1 (en) * 2000-02-17 2006-02-16 Liu Feng Q Contact assembly and method for electrochemical mechanical processing
US20040020788A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Contacts for electrochemical processing
US7278911B2 (en) 2000-02-17 2007-10-09 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20080108288A1 (en) * 2000-02-17 2008-05-08 Yongqi Hu Conductive Polishing Article for Electrochemical Mechanical Polishing
US7344431B2 (en) 2000-02-17 2008-03-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7207878B2 (en) 2000-02-17 2007-04-24 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7285036B2 (en) 2000-02-17 2007-10-23 Applied Materials, Inc. Pad assembly for electrochemical mechanical polishing
US7137868B2 (en) 2000-02-17 2006-11-21 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US20060231414A1 (en) * 2000-02-17 2006-10-19 Paul Butterfield Contacts for electrochemical processing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US20060217049A1 (en) * 2000-12-22 2006-09-28 Applied Materials, Inc. Perforation and grooving for polishing articles
US20070066200A9 (en) * 2000-12-22 2007-03-22 Applied Materials, Inc. Perforation and grooving for polishing articles
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US20020102853A1 (en) * 2000-12-22 2002-08-01 Applied Materials, Inc. Articles for polishing semiconductor substrates
US7311592B2 (en) 2001-04-24 2007-12-25 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20060172671A1 (en) * 2001-04-24 2006-08-03 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US20070066201A1 (en) * 2001-04-24 2007-03-22 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20070099552A1 (en) * 2001-04-24 2007-05-03 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20030209448A1 (en) * 2002-05-07 2003-11-13 Yongqi Hu Conductive polishing article for electrochemical mechanical polishing
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
US10546722B2 (en) 2004-01-21 2020-01-28 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US9307648B2 (en) 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US20060030156A1 (en) * 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US20060057812A1 (en) * 2004-09-14 2006-03-16 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US20060260951A1 (en) * 2004-09-14 2006-11-23 Liu Feng Q Full Sequence Metal and Barrier Layer Electrochemical Mechanical Processing
US7446041B2 (en) 2004-09-14 2008-11-04 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US20060070872A1 (en) * 2004-10-01 2006-04-06 Applied Materials, Inc. Pad design for electrochemical mechanical polishing
US20060073768A1 (en) * 2004-10-05 2006-04-06 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US9395623B2 (en) 2005-01-21 2016-07-19 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US8062495B2 (en) 2005-01-21 2011-11-22 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US10546607B2 (en) 2005-01-21 2020-01-28 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US20080311235A1 (en) * 2005-01-21 2008-12-18 Slafer Dennis W Replication Tools and Related Fabrication Methods and Apparatus
US20110064838A1 (en) * 2005-01-21 2011-03-17 Microcontinuum, Inc. Replication tools and related fabrication methos and apparatus
US7833389B1 (en) * 2005-01-21 2010-11-16 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US7828943B2 (en) 2005-02-21 2010-11-09 Aerotecnica Coltri S.P.A. Anode for an apparatus for the galvanic coating of the running surfaces of cylinders
WO2006087743A1 (en) * 2005-02-21 2006-08-24 Aerotecnica Coltri S.P.A. Anode for an apparatus for the galvanic coating of the running surfaces of cylinders
US20080264782A1 (en) * 2005-02-21 2008-10-30 Aerotecnica Coltri S.P.A. Anode for an Apparatus for the Galvanic Coating of the Running Surfaces of Cylinders
US20060219663A1 (en) * 2005-03-31 2006-10-05 Applied Materials, Inc. Metal CMP process on one or more polishing stations using slurries with oxidizers
US20060229007A1 (en) * 2005-04-08 2006-10-12 Applied Materials, Inc. Conductive pad
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070096315A1 (en) * 2005-11-01 2007-05-03 Applied Materials, Inc. Ball contact cover for copper loss reduction and spike reduction
US10682805B2 (en) 2006-02-27 2020-06-16 Microcontinuum, Inc. Formation of pattern replicating tools
US20070298186A1 (en) * 2006-06-21 2007-12-27 Kyung Jun Yang Method and apparatus for plating threaded portion of high pressure gas cylinder
US20080293343A1 (en) * 2007-05-22 2008-11-27 Yuchun Wang Pad with shallow cells for electrochemical mechanical processing
WO2010048404A1 (en) * 2008-10-22 2010-04-29 Enthone Inc. Method for galvanic deposition of hard chrome layers
CN102257184B (zh) * 2008-10-22 2014-01-15 恩索恩公司 硬铬层的电沉积方法
US20110198226A1 (en) * 2008-10-22 2011-08-18 Enthone Inc. Method for deposition of hard chrome layers
KR20110075028A (ko) * 2008-10-22 2011-07-05 엔쏜 인코포레이티드 경질 크롬 층의 갈바니 침착 방법
EP2180088A1 (de) 2008-10-22 2010-04-28 Enthone, Inc. Verfahren zur galvanischen Abscheidung von Hartchromschichten
US10879595B2 (en) 2013-05-17 2020-12-29 Microcontinuum, Inc. Tools and methods for producing nanoantenna electronic devices
US20160032476A1 (en) * 2014-07-29 2016-02-04 Min Aik Precision Industrial Co., Ltd. Electroplating equipment capable of gold-plating on a through hole of a workpiece
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Also Published As

Publication number Publication date
DE830860C (de) 1952-02-07
FR1023810A (fr) 1953-03-24
CH281450A (de) 1952-03-15
BE494578A (ja)
GB667227A (en) 1952-02-27

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