BE494578A - - Google Patents

Info

Publication number
BE494578A
BE494578A BE494578DA BE494578A BE 494578 A BE494578 A BE 494578A BE 494578D A BE494578D A BE 494578DA BE 494578 A BE494578 A BE 494578A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE494578A publication Critical patent/BE494578A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
BE494578D 1949-03-18 BE494578A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE281450X 1949-03-18

Publications (1)

Publication Number Publication Date
BE494578A true BE494578A (xx)

Family

ID=20307024

Family Applications (1)

Application Number Title Priority Date Filing Date
BE494578D BE494578A (xx) 1949-03-18

Country Status (6)

Country Link
US (1) US2706175A (xx)
BE (1) BE494578A (xx)
CH (1) CH281450A (xx)
DE (1) DE830860C (xx)
FR (1) FR1023810A (xx)
GB (1) GB667227A (xx)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE939362C (de) * 1953-06-04 1956-02-23 Wilhelm Meyer Verfahren und Vorrichtung zum Innenverchromen
DE959776C (de) * 1953-07-08 1957-03-14 Wolfram Ruff Dr Ing Anordnung zum Hartverchromen von Leichtmetallmotorenzylindern
NL106722C (xx) * 1954-05-19
US3483097A (en) * 1968-01-08 1969-12-09 Gen Motors Corp Method for coating inside surfaces of cavities
US3905885A (en) * 1973-06-13 1975-09-16 United States Steel Corp Method for the electrolytic conditioning of metal tubes
US4294670A (en) * 1979-10-29 1981-10-13 Raymond Louis W Precision electroplating of metal objects
FR2565323B1 (fr) * 1984-05-30 1986-10-17 Framatome Sa Procede de protection contre la corrosion d'un tube de generateur de vapeur et dispositif pour la mise en oeuvre de ce procede
US4686013A (en) * 1986-03-14 1987-08-11 Gates Energy Products, Inc. Electrode for a rechargeable electrochemical cell and method and apparatus for making same
GB8719816D0 (en) * 1987-08-21 1987-09-30 Sb Plating Ltd Electro-plating techniques
US4853099A (en) * 1988-03-28 1989-08-01 Sifco Industries, Inc. Selective electroplating apparatus
US4931150A (en) * 1988-03-28 1990-06-05 Sifco Industries, Inc. Selective electroplating apparatus and method of using same
KR20010020807A (ko) * 1999-05-03 2001-03-15 조셉 제이. 스위니 고정 연마재 제품을 사전-조절하는 방법
US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7374644B2 (en) * 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303662B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7303462B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7670468B2 (en) * 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7344432B2 (en) * 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7137879B2 (en) * 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
US9307648B2 (en) 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US7833389B1 (en) * 2005-01-21 2010-11-16 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US20060030156A1 (en) * 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US7084064B2 (en) * 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
WO2006039436A2 (en) * 2004-10-01 2006-04-13 Applied Materials, Inc. Pad design for electrochemical mechanical polishing
US7520968B2 (en) * 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
WO2006078918A2 (en) * 2005-01-21 2006-07-27 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
DE602005007271D1 (de) * 2005-02-21 2008-07-10 Aerotecnica Coltri S P A Anode für eine vorrichtung zur galvanischen beschichtung der laufflächen von zylindern
US20060219663A1 (en) * 2005-03-31 2006-10-05 Applied Materials, Inc. Metal CMP process on one or more polishing stations using slurries with oxidizers
US7427340B2 (en) * 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070096315A1 (en) * 2005-11-01 2007-05-03 Applied Materials, Inc. Ball contact cover for copper loss reduction and spike reduction
CA2643510C (en) 2006-02-27 2014-04-29 Microcontinuum, Inc. Formation of pattern replicating tools
KR100828571B1 (ko) * 2006-06-21 2008-05-13 양경준 고압가스용기 나사부 도금 방법 및 도금 장치
US20080293343A1 (en) * 2007-05-22 2008-11-27 Yuchun Wang Pad with shallow cells for electrochemical mechanical processing
EP2180088B2 (de) * 2008-10-22 2019-06-12 MacDermid Enthone Inc. Verfahren zur galvanischen Abscheidung von Hartchromschichten
US9589797B2 (en) 2013-05-17 2017-03-07 Microcontinuum, Inc. Tools and methods for producing nanoantenna electronic devices
TWM491679U (zh) * 2014-07-29 2014-12-11 Min Aik Prec Ind Co Ltd 可對加工件穿孔鍍金的電鍍設備

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB190403087A (en) * 1904-02-08 1904-12-08 Henry Maurice Wilton P Johnson Improvements relating to Apparatus for Amalgamating and Coating Metals or Alloys of Metals with Metals or Alloys of Metals by the Aid of Electricity
US914856A (en) * 1908-02-10 1909-03-09 Otto Meyer Electrolytic apparatus.
US1886218A (en) * 1927-06-29 1932-11-01 Western Cartridge Co Gun barrel and process of finishing the same
US1809826A (en) * 1927-09-06 1931-06-16 Chromium Corp Process of electrodepositing chromium
US1927162A (en) * 1931-02-27 1933-09-19 Research Corp Electroplating
US1982009A (en) * 1931-11-30 1934-11-27 Paul E Mckinney Means for electroplating the interior surfaces of hollow articles
DE670804C (de) * 1937-04-27 1939-01-26 Ladislav Partsch Vorrichtung zum Ausbuechsen von Maschinenzylindern und Maschinenlagern
US2332569A (en) * 1940-03-08 1943-10-26 Flannery Bolt Co Hollow stay bolt
US2475586A (en) * 1943-04-09 1949-07-12 Thompson Prod Inc Method of electropolishing the internal surface of a hollow valve
US2431948A (en) * 1943-11-01 1947-12-02 Gen Motors Corp Apparatus for electrodepositing metal on bearing shells and the like

Also Published As

Publication number Publication date
US2706175A (en) 1955-04-12
DE830860C (de) 1952-02-07
FR1023810A (fr) 1953-03-24
CH281450A (de) 1952-03-15
GB667227A (en) 1952-02-27

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