US20110064838A1 - Replication tools and related fabrication methos and apparatus - Google Patents
Replication tools and related fabrication methos and apparatus Download PDFInfo
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- US20110064838A1 US20110064838A1 US12/947,132 US94713210A US2011064838A1 US 20110064838 A1 US20110064838 A1 US 20110064838A1 US 94713210 A US94713210 A US 94713210A US 2011064838 A1 US2011064838 A1 US 2011064838A1
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- support cylinder
- sleeve
- pattern
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- cylinder
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- 230000010076 replication Effects 0.000 title claims abstract description 85
- 238000004519 manufacturing process Methods 0.000 title description 18
- 239000000758 substrate Substances 0.000 claims description 83
- 230000033001 locomotion Effects 0.000 claims description 12
- 230000006835 compression Effects 0.000 claims description 8
- 238000007906 compression Methods 0.000 claims description 8
- 206010007134 Candida infections Diseases 0.000 claims 1
- 208000007027 Oral Candidiasis Diseases 0.000 claims 1
- 241000287411 Turdidae Species 0.000 claims 1
- 201000003984 candidiasis Diseases 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 118
- 230000003287 optical effect Effects 0.000 abstract description 34
- 238000004070 electrodeposition Methods 0.000 abstract description 11
- 238000013500 data storage Methods 0.000 abstract description 7
- 230000000295 complement effect Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 52
- 230000008569 process Effects 0.000 description 51
- 229920002120 photoresistant polymer Polymers 0.000 description 47
- 239000000463 material Substances 0.000 description 45
- 239000012530 fluid Substances 0.000 description 41
- 229920000642 polymer Polymers 0.000 description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 239000007788 liquid Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 238000000926 separation method Methods 0.000 description 15
- 238000000151 deposition Methods 0.000 description 14
- 238000000059 patterning Methods 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 12
- 230000008021 deposition Effects 0.000 description 11
- 238000013519 translation Methods 0.000 description 10
- 239000002904 solvent Substances 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 8
- 238000005323 electroforming Methods 0.000 description 8
- 238000004049 embossing Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 230000008602 contraction Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004630 atomic force microscopy Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000001127 nanoimprint lithography Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- 229910001215 Te alloy Inorganic materials 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G13/00—Electrographic processes using a charge pattern
- G03G13/26—Electrographic processes using a charge pattern for the production of printing plates for non-xerographic printing processes
- G03G13/32—Relief printing plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0053—Moulding articles characterised by the shape of the surface, e.g. ribs, high polish
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/04—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould
- B29C41/042—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould by rotating a mould around its axis of symmetry
- B29C41/045—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould by rotating a mould around its axis of symmetry the axis being placed vertically, e.g. spin casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/08—Coating a former, core or other substrate by spraying or fluidisation, e.g. spraying powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/14—Dipping a core
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0276—Replicating a master hologram without interference recording
- G03H1/028—Replicating a master hologram without interference recording by embossing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/265—Apparatus for the mass production of optical record carriers, e.g. complete production stations, transport systems
Definitions
- Optical data storage media including compact discs (CDs) and digital video discs (DVDs) typically contain physical relief structures that are used by an optical read/write head to obtain position and tracking information, error correction, conveying data content, etc. These relief structures are created during the manufacturing process of the particular optical medium and typically include very fine modulations on a surface of the optical medium.
- the surface modulations are often in the form of pits, bumps, grooves, or lands, etc., and can include features with submicron-scale down to nanometer-scale dimensions.
- preformatting The process of incorporating such features into the substrate of the optical medium during manufacturing is variously referred to as “preformatting” or “replication.”
- the benefits of preformatting include very efficient utilization of the optical medium (e.g., disc) surface, which in turn allows higher storage capacity and enhanced performance compared to media without such formatting.
- the standard process for incorporating such information structures into the surface of optical disc substrates is injection molding, wherein pellets of a polymeric material, usually polycarbonate, are melted and injected into a mold containing an insert, or stamper, which has the mirror image of the desired pattern on its surface and against which the melted polymeric substrate material is brought into contact. Cooling of the mold allows the polymer material to solidify, at which point the substrate disc, now having the information formed into its surface, is removed.
- the molded features typically contain various format and header addressing information to help locate the user data, and additionally may contain other features, including those relating to prerecorded information, often referred to as read-only memory (ROM) information.
- ROM read-only memory
- Such roll-to-roll (R2R) processes have involved a rotary or step-and-repeat replication process, either of which utilizes a replication tool whose surface contains the mirror image of the desired pattern, and which is used to create multiple replicas of the tool pattern.
- embossing tools used in the R2R processes can be created, including direct etching on the external surface of the tool, or use of a flat substrate that is attached to the outer surface of a support member, patterned or patterned after mounting. See, for example, U.S. Pat. No. 5,521,030 and U.S. Pat. No. 5,147,763. It is further known that such tooling can be formed from discrete elements, whereby several substrates containing a pattern to be replicated can be joined, as in the form of a mosaic pattern, for example, and thereby increase the size of the tool.
- a discontinuity such as a seam that is made by the replication tool can often cause mechanical problems during the replication process, and techniques known in the art have been developed to reduce the seam, including careful piecing of the segments, grinding, polishing, etc.
- techniques known in the art have been developed to reduce the seam, including careful piecing of the segments, grinding, polishing, etc.
- such techniques are not acceptable, for example micropatterns that require a pattern without interruption for long distances, such as lenticules for photographic films and preformatted recording tape. See E. H. Land, “An Introduction to Polavision,” Photogr. Sci. Eng. 21: 225 (1977).
- the present disclosure is directed to methods and apparatus that substantially or altogether eliminate the shortcomings, limitations and disadvantages described previously. Certain embodiments of the present disclosure are directed to durable replication tools having a cylindrical surface that includes a seamless surface patterns for the formation or replication of predetermined continuous and seamless patterns useful for pre-formatting a desired recording substrate.
- Such replication tools may include a seamless cylindrical substrate (“SCS”) holding a desired three-dimensional relief pattern.
- SCS seamless cylindrical substrate
- the three-dimensional relief pattern of the SCS is complimentary or substantially complimentary to a three-dimensional relief pattern formed on a selected surface of a support cylinder.
- the recording substrate can be rigid or flexible.
- the recording substrate can include a layer of liquid polymer that can be cured or hardened to receive or hold a complimentary pattern based on the predetermined seamless pattern of the replication tool.
- inventions of the present disclosure are directed to related methods and apparatus for fabricating such seamless replication tools, including chemical deposition cells, fluid delivery systems, centralizing fixtures, and differential thermal expansion/contraction methods/apparatus.
- Exemplary embodiments of continuous and seamless durable replication tools as described herein may provide the capability of forming a continuous pattern capable of having features with critical dimensions down to the micron and nanometer regimes on a substrate of arbitrary length, e.g., a substrate for preformatted tape, and the like.
- FIG. 1 is a schematic drawing depicting a cross section of a support cylinder having a photosensitive layer on an inner surface, in accordance with an embodiment of the present disclosure
- FIG. 2 is a schematic drawing depicting a cross section of a further embodiment for applying a liquid to an internal surface of a support cylinder;
- FIG. 3 is a schematic drawing depicting a cross section of a further embodiment for vacuum deposition of a recording layer on a inner surface of a support cylinder;
- FIG. 4A is a schematic drawing depicting a cross section of a further embodiment including a movable radiation source for recording information-bearing features on an inner surface of a support cylinder;
- FIG. 4B is a schematic drawing depicting a cross section of a further embodiment including a movable radiation source for recording information-bearing features on an outer surface of a support cylinder;
- FIG. 5 is a schematic drawing depicting a cross section of a further embodiment for the application of a photoresist developer to an internal surface of a support cylinder;
- FIG. 6 is a schematic drawing depicting a cross section of a further embodiment for vacuum deposition of a layer on an internal patterned surface of a support cylinder;
- FIG. 7A is a schematic drawing depicting a cross section of a further embodiment in which an electrochemical deposition cell is utilized for making durable pattern replication tools having a negative-relief replica of a pattern formed on an inner surface of a support cylinder;
- FIG. 7B is a schematic drawing depicting a cross section of an electrochemical deposition cell similar to that of FIG. 7A for making durable pattern replication tools having a negative-relief replica of a pattern formed on an external surface of a support cylinder, in accordance with a further embodiment;
- FIG. 8A is a schematic drawing depicting a cross section of a further embodiment for applying a liquid such as polymer to an internal patterned surface of the support cylinder;
- FIG. 8B is a schematic drawing depicting a cross section of a further embodiment for curing a layer such as a polymer applied to an internal patterned surface of the support cylinder, for example as shown in FIG. 8A ;
- FIG. 8C is a schematic drawing depicting a cross section of a further embodiment according to an embodiment for applying a liquid such as a polymer to an external patterned surface of a support cylinder;
- FIG. 8D is a schematic drawing depicting a cross section of a further embodiment for curing a layer such as a polymer applied to an external patterned surface of the support cylinder, for example as shown in FIG. 8C ;
- FIG. 9A is a schematic drawing depicting a cross section of a further embodiment used for chemically stripping a photoresist layer applied to an internal surface of a support cylinder;
- FIG. 9B is a schematic drawing depicting a cross section of a further embodiment used in the removal for of a replication tool sleeve from a support sleeve or patterning fixture;
- FIG. 10A is a schematic drawing depicting a cross section of a further embodiment for separating an internal replica from a patterning fixture by differential thermal expansion/contraction.
- FIG. 10B is a schematic drawing depicting apparatus of FIG. 10A with the internal replica mounted on a centralizing fixture and partially separated from the outer fixture;
- FIG. 11 is a schematic drawing depicting a cross section of a replication tool including a support fixture, in accordance with a further embodiment
- FIG. 12 is a diagram depicting a method of fabricating a seamless replication tool, in accordance with a further embodiment of the present disclosure.
- FIG. 13 is a process flow chart for formation of replication tools for cases of external and internal master drums, or replication tools, in accordance with further embodiments of the disclosure.
- Embodiments of the present disclosure are directed to pattern replication tools, or master drums, and related fabrication methods and apparatus useful for making and copying seamless cylindrical substrates (“SCS”).
- Formation of a replication tool can include the use of a cylindrical surface that includes a seamless surface patterns for the formation or replication of predetermined continuous and seamless patterns useful for pre-formatting a desired recording substrate.
- the cylindrical surface may be a selected inner or outer radial surface of a support cylinder.
- Such master drums, or replication tools can provide the ability to relatively quickly and inexpensively make copies of one or more master patterns used in the manufacturing of recording media.
- the replication tools can have one or more desired or predetermined three-dimensional relief patterns that are suitable for imprinting or embossing the relief pattern(s) in various media including optical storage media.
- the relief patterns of the replication tools are formed as three-dimensional patterns that are complementary, or substantially complimentary, to relief patterns of a selected surface of a support cylinder.
- the selected surface of a support cylinder can be the inner or outer radial surface relative to the longitudinal axis of the cylinder.
- the relief patterns themselves can be predetermined, pseudorandom, or random, and the surfaces can be seamless.
- a relief pattern may be formed by suitable techniques including, but not limited to, direct writing contact or projection lithography, physical contact with another pattern, or other suitable techniques.
- the relief pattern(s) of the support cylinder can be formed or recorded in a substrate material that has been applied to the selected surface of the support cylinder.
- Exemplary embodiments of continuous and seamless durable replication tools as described herein may provide the capability of forming a continuous pattern with features having critical dimensions down to the micron and nanometer regime on a substrate of arbitrary length, e.g., a substrate for preformatted optical tape, and the like.
- Further embodiments of the present disclosure are directed to apparatus for fabricating such seamless master drums or replication tools. Certain embodiments are directed to systems that utilize a radiation source to record a desired relief pattern on a radiation-sensitive layer on a selected surface of a support cylinder. Further embodiments of the present disclosure are directed to chemical deposition cells for plating a support cylinder having a relief pattern and forming a durable tool sleeve having a complimentary relief pattern.
- Exemplary embodiments of the present disclosure are directed to techniques for applying requisite materials to the internal or external surface of a support cylinder prior to pattern formation, and, where required, developing this layer after pattern exposure.
- Coated materials for pattern formation may include, but are not limited to, photoresists, metals, alloys, compounds, and polymeric layers.
- FIG. 1 is a schematic drawing depicting a cross section of a support cylinder having a recording layer on an inner surface, in accordance with an embodiment 100 of the present disclosure.
- the support cylinder 101 forms a bore 103 , and may be made of a suitable strong and rigid material such as glass, metal, plastic, etc. In preferred embodiments, the cylinder is devoid of surface seams, i.e., is seamless, or substantially so.
- a selected surface of the support cylinder 101 e.g., the inner surface as shown, may be coated with a layer of suitable material to form a substrate 102 that can be used for recording a desired or predetermined relief pattern.
- substrate 102 includes a radiation-sensitive material such as a light-sensitive polymer (such as Shipley AZ photoresist, or the like).
- distance “A” is representative of a portion of substrate 102 that has substantially uniform thickness when compared to the thickness of the substrate 102 along the overall length “B” of the support cylinder 101 .
- Distance B (or overall length) of the cylinder 101 may be made longer than the desired final length of the uniform section A to take into account any coating thickness non-uniformity at the top and bottom areas of the cylinder, e.g., section 150 .
- the non-uniform sections of the cylinder may be removed and discarded leaving a support cylinder with substrate 102 of substantially uniform thickness along the length of the cylinder.
- Substrate 102 can be applied by any of a number of techniques, including but not limited to dipping the cylinder 101 in a bath or reservoir of the substrate material, drawing the cylinder 101 out of such a bath, draining the bath at a desired rate, spraying substrate material onto one end of the support cylinder 101 , and/or spinning the support cylinder 101 to spread the substrate material, etc.
- At least one of the layers or surfaces of the support cylinder includes a material or substrate that is sensitive to the application of incident energy (e.g., actinic radiation, electrons, ions, or heat, and the like).
- the radiation-sensitive material can include one or more layers or regions of photoresist, such as those used for typically used in optical or e-beam lithography.
- Suitable photoresists can be of the positive or negative types. Positive photoresists are weakened by exposure to the incident energy, facilitating a “positive” pattern resulting from removal of the exposed (and thus weakened) areas of the resist. Conversely, negative photoresists are strengthened by the incident energy, facilitating a “negative” pattern resulting from removal of the unexposed areas of the resist.
- so-called Shipley photoresists may be used, though other suitable types may likewise be used.
- the substrate material 102 may be applied to the top rim of the support cylinder (preferably below the edge to prevent dripping) in sufficient quantity to form a continuous liquid film covering the inner surface of the cylinder, then allowed to drain down by gravity.
- the thickness and uniformity of the substrate material e.g., photoresist
- the thickness and uniformity of the substrate material may be controlled, for example, by control of the viscosity of the coating fluid (adjusted by the use of one or more diluents), the evaporation rate of the diluent(s), among other factors.
- pre-bake and other steps typically used with photoresists may be followed in order to prepare the resist for subsequent exposure.
- a substrate 102 can include an ablative material, such as a polymer, metal, or alloy (e.g., tellurium or a tellurium alloy) that can be vaporized or physically deformed by the action of the incident energy (e.g., optical radiation).
- the substrate 102 or pattern forming layer(s) can include a soft polymeric or metallic material that may be deformed by the action of a precision stylus (atomic force microscopy “AFM”, etc.) or cutting tool or by suitable techniques including thermal embossing, chemical embossing, imprint lithography, or self-assembly, etc.
- FIG. 1 indicates that layer 102 is located on the inner surface of the support cylinder 101
- the desired pattern may be formed on the outside surface of similar support cylinders in other embodiments.
- the support cylinder may be used directly as a production pattern replication tool in a manufacturing process, e.g., for pre-formatting optical recording media.
- Replication tools may also be formed from a replica of an original or master patterned tool.
- FIG. 2 is a schematic drawing depicting a cross section of an apparatus 200 for applying a fluid, e.g., a liquid such a suitable substrate material, to a selected surface of a support cylinder 201 , in accordance with further embodiments.
- a fluid e.g., a liquid such a suitable substrate material
- the cylinder 201 may be made from a suitably strong and rigid material, e.g., glass, metal, plastic, etc.
- the apparatus 200 can include opposed first and seconds ends 220 , 221 for holding the support cylinder 201 .
- the first end 220 includes a first passageway 270 that is configured to receive a fluid 211 from a fluid supply, e.g., supply reservoir 210 , possibly via external piping or passageways 272 .
- a manifold 213 may be configured within the bore 203 of the cylinder 201 for receiving fluid 211 from the first end 220 .
- Manifold 213 includes one or more orifices suitable for the distribution (shown as fluid spray 214 ) of the fluid 211 to a selected surface (e.g., the inner surface) of the support cylinder 201 .
- the second end 221 may include one or more orifices to receive accumulated fluid 215 used for the coating of the cylinder surface.
- the second end 221 also includes a second passageway 271 that is configured to convey fluid 211 for removal from the support cylinder 201 , possibly via external piping 273 .
- FIG. 2 Also shown in FIG. 2 are a pair of cylindrical wall 222 , 223 that act as holding means for holding the support cylinder 201 relative to the first and second ends 220 , 221 .
- the pair of cylindrical walls 222 , 223 are disposed substantially along the same cylindrical surface, each one of the pair located at opposite ends of the support cylinder 201 , with each wall having a lateral surface adapted to receive the support cylinder 201 .
- Other suitable holding means may be used for support of the support cylinder, e.g., gasket configurations, etc.
- the fluid delivery apparatus 200 may also include a delivery manifold 213 that is connected to one end, e.g., end 220 , with a suitable number and configuration of orifices to deliver the fluid 211 to a surface of the support cylinder 201 to form a substrate 202 .
- height “A” is representative of a portion of substrate 202 that has substantially uniform thickness when compared to the thickness of the substrate 202 along the fluid application height “B” including portions of holding means, e.g., bracketing cylindrical walls 222 , 223 .
- fluid 211 may be directed to a desired location, e.g., a suitable reservoir 212 .
- the fluid (e.g., liquid) applied to the support cylinder 201 with the apparatus 200 may be selected as desired.
- a photoresist polymeric material may be selected for some applications.
- liquids including suitable polymers may be used to impart a planarizing effect on the cylinder 201 . Planarization may be achieved by applying a suitable liquid (e.g., polymer) to even uneven surface features, thus reducing or eliminating the effects of scratches, roughness due to intrinsic crystal structure, and/or mechanical surface roughness.
- multiple liquid application steps may be performed using apparatus 200 .
- apparatus 200 may be used with a first liquid 211 to apply a first coating that primarily planarizes and reduces defects in the selected surface of the cylinder 201 and a second, subsequent coating including a photosensitive layer in then applied on the first planarizing layer.
- FIG. 3 is a schematic drawing depicting a cross section an apparatus 300 for vacuum deposition of a recording layer or substrate 302 on a inner surface of a support cylinder 301 , in accordance with a further embodiment.
- the apparatus 300 includes a vacuum chamber 320 in which the support cylinder 301 can be placed.
- a sputter cathode or evaporation wire 330 may be positioned through the bore 303 formed by the support cylinder 301 .
- the configuration of the evaporation wire 330 and support cylinder 301 facilitates uniform coating of the inner surface of the cylinder 301 with a desired material.
- the apparatus of FIG. 3 may be used to uniformly coat a metal, alloy, compound, polymer, photopolymer, etc., layer to the inside surface of the cylinder 301 .
- the uniformity of the deposit may be improved by the rotation and/or translation of the cylinder 301 and/or source (e.g., sputter cathode), as well as by using appropriate aperture shields during the deposition process (not shown).
- source e.g., sputter cathode
- method/apparatus analogous to that shown in FIG. 3 may be used to coat an external surface of a cylinder in order to form an externally-patterned cylinder.
- FIG. 4A is a schematic drawing depicting a cross section of an apparatus 400 A including a movable radiation source for recording information-bearing features on an inner surface of a support cylinder 401 , in accordance with a further embodiment.
- the apparatus (or system) 400 A can include a movable radiation head assembly 409 disposed within the bore 403 of the support cylinder.
- the head assembly 409 can include a radiation source for recording a desired pattern, e.g., information-bearing features, on a substrate 402 that has been applied to the inside surface of the support cylinder 401 .
- One or more centralizing end bells, or disks, 406 , 407 may be present for holding the head assembly within the cylinder 401 .
- One or more support members may be present to support the support cylinder 401 , and may be connected to the one or more end bells 406 , 407 .
- a support member in the form of a central shaft 451 extending through bearings 452 , 453 may be used in exemplary embodiments.
- a motor 414 may be present for rotation of the shaft 451 .
- the bearings 452 , 453 may be air bearings in exemplary embodiments.
- the apparatus 400 A may include a frame, e.g., track 408 and legs 410 , 411 , to support movement of the radiation source 409 relative to the cylinder 401 .
- the frame is located within the bore 403 of the cylinder 401 .
- the track 408 can be parallel or substantially parallel to the support shaft 451 .
- the movable head assembly 409 can include an actuator 416 (e.g., a linear actuator) configured to move the radiation source along the track 408 .
- the radiation source used for assembly 409 may be a light source of any suitable wavelength and degree of coherence.
- ion sources and/or e-beam sources may be used as the movable radiation source.
- a laser such a suitable semiconductor diode laser or a solid state laser is used for the movable radiation source.
- the output of the radiation source e.g., a laser output beam, may be modulated by a suitable controller 441 .
- the head assembly 409 may include autofocus and other control circuitry as necessary to maintain the position and uniformity of the produced radiation, e.g., optical output beam.
- the translation of assembly 409 by the linear actuator 416 may be controlled by a suitable position controller 442 .
- the cylinder 401 may be rotated about its central shaft 451 while assembly 409 is simultaneously translated along the direction of the longitudinal axis of the cylinder 401 .
- the output of the radiation source of assembly 409 can be modulated to produce exposure of layer 402 according to the desired pattern.
- Smooth continuous motion of the radiation source, or its radiation can be used to produce a spiral pattern, or other desired pattern(s) on/in the selected surface of the support cylinder 401 .
- intermittent rotation and translation of the radiation source relative to the selected surface of the support cylinder can be employed to produce concentric patterns.
- Rotation, translation, and radiation output (e.g., laser beam intensity) control of assembly 409 a may be synchronized and programmed through a master controller device 440 .
- a master controller device 440 can include, but are not limited to suitable programmable logic controllers (PLCs), computers, suitable processors, field-programmable gate arrays (FPGAs), or the like.
- PLCs programmable logic controllers
- FPGAs field-programmable gate arrays
- alternative techniques for moving the radiation output with respect to the selected surface of a support cylinder, with any desired coating(s)/layer(s) may be used.
- the radiation source or its output may be held steady while rotating and translating a support cylinder in a desired way.
- the radiation source or its output could be rotated while the cylinder 401 is translated to achieve writing/recording of the desired pattern.
- FIG. 4A shows a radiation source configured and arranged to apply a desired pattern to an internal or inner surface of a support cylinder 401
- other embodiments may include a radiation source configured and arranged to apply a desired pattern to an external surface of a support cylinder 401 , as shown in FIG. 4B .
- FIG. 4B is a schematic drawing depicting a cross section of an apparatus 400 B including a movable radiation source for recording information-bearing features on an outer surface of a support cylinder 401 , in accordance with further embodiments.
- Apparatus 400 B is similar to (and includes like numbering) apparatus 400 A shown and described for FIG. 4A , however, the substrate layer 402 is disposed on the outer radial, or exterior, surface of the support cylinder 401 .
- the movable radiation source assembly 409 is configured to move along a frame, e.g., track 408 , that is located exterior to and in suitable proximity with the outer surface of the support cylinder 401 .
- Lithographic techniques may employ a photomask (“stencil”), either in direct contact with the substrate (“contact printing”), or by projecting the image of the pattern onto the substrate (“projection printing”).
- a photomask (“stencil”)
- contact printing either in direct contact with the substrate
- projection printing or by projecting the image of the pattern onto the substrate (“projection printing”).
- the selected surface (internal or external) of the cylindrical support cylinder is coated with a photosensitive layer, e.g., as shown in FIG. 2A , and radiation of an appropriate wavelength is used to expose the photosensitive layer through the photomask.
- the photoresist may subsequently be developed to obtain a desired relief pattern.
- Suitable indirect writing techniques can include holographic techniques in which a photoresist-coated cylinder is exposed to a standing wave pattern made by the interference of multiple laser beams.
- a photomask may not be necessary, however, the ability to write certain types of patterns may as a consequence be impacted, since the laser interference pattern may have a high degree of spatial uniformity.
- suitable direct writing techniques may be used to directly form a desired pattern in/on a selected surface of the support cylinder.
- subtractive processing such as laser ablation
- Additive processing may also be used, where material is added to the support cylinder in a desired pattern.
- suitable additive techniques include, but are not limited to, embossing techniques including thermally-activated, chemically-activated, and radiation-activated embossing techniques as well as the use of ink jet printing or dip-pen lithography.
- a further technique may utilize a microstylus (e.g., using atomic force microscopy “AFM,” micro-indenter, etc.) to form a pattern by disruption of the coated layer.
- a further technique may utilize a microstylus (e.g., using atomic force microscopy “AFM,” micro-indenter, etc.) to form a pattern by disruption of the coated layer.
- AFM atomic force microscopy
- a tool haying the desired surface relief pattern (which can made by any number of techniques know in the art) may be placed into contact with the surface (internal or external) of the cylindrical substrate.
- the substrate surface can be softened so that the relief pattern can be pressed into it.
- the relief pattern may be removed once the substrate surface is re-hardened (e.g., by returning the substrate surface to below its softening point).
- a liquid curable polymer can be applied to the substrate surface and caused to set exposure to radiation (thermal, optical) or as the result of a chemical ratio (epoxies).
- Numerous techniques known in the art, including the more recently developed Nano Imprint Lithography can be used in this regard.
- the selection of a particular pattern writing technique may be influenced by one or more factors, including the resolution achievable by the process relative to that required by the desired pattern, and the time required to write the desired pattern, etc.
- one or more subsequent development steps may be included for the formation of the desired three-dimensional relief pattern, as shown in FIG. 5 .
- a Shipley type photoresist commonly used in the semiconductor industry uses an aqueous basic developer to dissolve those areas exposed to the writing beam or photomask pattern.
- FIG. 5 is a schematic drawing, in accordance with a further embodiment, depicting a cross section of a fluid delivery apparatus 500 that may be used for the application of a photoresist developer to an internal surface of a support cylinder 501 with substrate 502 in accordance with a further embodiment similar to apparatus 200 of FIG. 2 . It should be noted that an analogous process to that shown in FIG. 5 can be used to develop the external surface of a cylinder.
- the apparatus 500 can include first and seconds ends 520 , 521 for holding the support cylinder 501 .
- the first end 520 a includes a first passageway 570 that is configured to receive a fluid 511 from a fluid supply 510 (possibly via external piping or passageways 572 ) and to distribute the a fluid 511 for application to a substrate layer 502 disposed on a selected surface (e.g., the inner surface) of the support cylinder 501 .
- a manifold 513 may be configured within the bore 503 of the cylinder 501 for receiving fluid 511 from the first end 520 .
- Manifold 513 includes one or more orifices suitable for the distribution (shown as fluid spray 514 ) of the fluid 511 to a selected surface (e.g., the inner surface) of the support cylinder 501 .
- the apparatus 500 can include a second end 521 for holding the support cylinder 501 at a different location than the first end 520 .
- the second end 521 may include a second passageway 571 that is configured to receive accumulated fluid 515 from the support cylinder 501 .
- fluid 511 Once removed from the cylinder 501 , fluid 511 may be directed to a desired location, e.g., a suitable reservoir 512 , via suitable external piping or passageways 573 .
- FIG. 5 Also shown in FIG. 5 are a pair of cylindrical wall 522 , 523 that act as holding means for holding the support cylinder 501 relative to the first and second ends 520 , 521 .
- the pair of cylindrical walls 522 , 523 can be disposed substantially along the same cylindrical surface, each one of the pair located at opposite ends of the support cylinder 501 , with each wall having a lateral surface adapted to receive the support cylinder 501 .
- Other suitable holding means may be used for support of the support cylinder, e.g., gasket configurations, etc.
- the development process of a photoresist applied to the support cylinder 501 may be monitored optically.
- the optical monitoring may be performed in real time by using a suitable optical source 530 and detector(s) 532 to detect the reflection 536 or transmission 538 of radiation produced by the source 530 .
- the developer liquid may be removed or application of such may be stopped when it is determined that the optimum endpoint of the development process has been reached.
- Suitable control and detection circuitry (not shown) may be used for such monitoring.
- sleeve 501 may be transparent to the applied radiation of source 530 .
- developed patterns may further be made more resistant to mechanical and chemical attack or degradation by use of radiation and/or chemical processing, e.g., by general hardening processes know, in the art.
- exposure of development photoresist to e-beam, UV, or thermal radiation in a post-processing operation can increase the durability, abrasion resistance, solvent resistance, etc., of the photoresist (“hardening”).
- hardening In the case of certain photoresists, e-beam exposure is particularly effective.
- Such hardening of the patterned photoresist can allow a patterned cylinder to be used and re-used for subsequent tool formation (“replication”).
- patterning techniques described herein may additionally make use of precise positioning of the patterning apparatus (laser or e-beam, photomask, image field, embossing tool, etc.) with respect to the substrate or selected surface of the support cylinder. Achieving precision alignment may be facilitated by use of mechanical hardware appropriate for resolution of the desired pattern, with consideration of the mechanical limitations of the system.
- Certain embodiments including those using beams of radiation for writing/recording the desired pattern have additional advantages of being steerable (laser, e-beam) to make small adjustments for more accurately aligning the patterns.
- other techniques can be used to assist in the pattern alignment process, such as interferometry.
- a desired pattern may be embedded (or pre-written) in the substrate or written directly onto the substrate (by ablation or other techniques that result in an immediately readable pattern.)
- Optical techniques e.g., distance or interference fringe measurement, etc.
- the support cylinder may be used to form a complimentary replica or negative-relief pattern in a durable cylindrical surface of a tool that is suitable for use in preformatting desired media, e.g. optical discs.
- This replication of the original relief pattern can be accomplished by a number of techniques, including electroless plating, electrolytic plating, electroforming, physical vapor deposition, chemical vapor deposition, epoxy replication, radiation cross-linking, casting, etc.
- durable replicas may be created by means of an electrodeposition process, such as nickel electroforming.
- FIG. 6 is a schematic drawing depicting a cross section of an apparatus 600 for vacuum deposition of a layer on an internal patterned substrate surface of a support cylinder 601 , in accordance with a further embodiment.
- the substrate 602 with portion that includes a desired relief pattern 604 is disposed on a selected surface, e.g., inner, of support cylinder 601 .
- the apparatus 600 includes a vacuum chamber 620 in which a support cylinder 601 is placed.
- a sputtering cathode or evaporation wire 630 may be positioned through the bore 603 formed by the support cylinder 601 .
- the configuration of the evaporation wire 630 and support cylinder 601 facilitates uniform coating of the inner surface of the cylinder 601 with a desired material.
- the sputtering cathode or wire 630 running in the direction of the cylinder axis can be used to vacuum deposit a conductive (“starting”) layer 605 , such as Ni, NiV, or Ag, etc.
- a conductive or starting layer 605 may be useful for eletroforming/plating embodiments (e.g., shown and described for FIGS. 7A-7B ) to initiate plating of a non-conductive patterned surface.
- the source/cathode and/or the cylinder 601 can be rotated and/or translated during the starting layer deposition process.
- the thickness of the layer 605 may be selected as desired, e.g., to be sufficient to form a continuous conductive layer on the pattern (typically less than 100 nm).
- Metal plating e.g., electroforming
- electroless deposition may be used to produce durable replication tools in accordance with certain embodiments of the disclosure.
- a metal deposition cell such as shown and described for FIGS. 7A-7B may be used for the formation of replication tools.
- FIG. 7A is a schematic drawing depicting a cross section of an electrochemical deposition cell 700 A for making a durable pattern replication tools having a negative-relief replica of a pattern formed on an inner surface of a support cylinder 701 , in accordance with further embodiments.
- a support cylinder 701 is placed within the deposition cell 700 A.
- An outer cylinder 722 of the cell 700 A may be sized and adapted to securely hold the support cylinder 701 having a relief patter on its inner surface, such as described previously for FIGS. 1 and 2 .
- First and second end disks 741 , 742 may be present to seal cylinder 722 to circulate a metal-containing solution suitable for electrochemical or electroless plating.
- the deposition system 700 may be used to make a durable sleeve with an inverse or negative of the relief pattern on the inner surface of a support cylinder.
- the resulting durable sleeve may be used for as part of a replication tool, as described herein.
- a metal containing solution e.g., aqueous
- an electrolyte e.g., aqueous nickel sulfamate solution
- a voltage is applied between the two surfaces. This applied voltage results in the deposition of nickel (Ni) metal onto the patterned surface, where the total deposit thickness is determined by the amount of current passed during the deposition process.
- a Ni (or other conductive) layer is deposited by means of electroless deposition, a widely used process in which metals are formed by reduction onto a catalytic or nucleation layer (e.g., silver mirror formation) on the surface to be replicated.
- a catalytic or nucleation layer e.g., silver mirror formation
- Several key variables, including time and temperature, are used to control the thickness of the deposit, which can, for example, range from microns to millimeters, as desired.
- the details of the electroless deposition process are known in the art.
- system 700 A may include a closed recirculating system including a reservoir 723 from which a metal-containing solution 720 is pumped, an in-line filtration system or filter 724 to remove any particulate and other unwanted matter, and heating elements (not shown) by which the reservoir 723 is caused to reach and maintain a desired operating temperature.
- the system 700 A may include suitable pumping and valving means to allow the metal-containing solution to continuously circulate under controlled (and monitored) conditions.
- Suitable pumping and valving means can include but are not limited to suitable pumps, pipes, valve, and related components.
- the metal-containing solution 720 circulates through cylinder 722 as part of a plating process.
- the solution may be heated in reservoir 723 and passed through filtration unit 724 before entering the cell at location 725 .
- the support cylinder 701 with photoresist substrate 702 may initially serve as a part (e.g., a boundary wall) of the deposition and fluid recirculation pathway.
- the solution 720 exits the cell at the top outflow pipe 721 and returns to reservoir 723 for reconditioning and recirculation to the cell.
- One or more non-conductive stop rings 727 may be located on the substrate, e.g., toward one end of the cell, to facilitate definition of the ends of the deposited replica by inhibiting the deposition process at this surface.
- a spiral distribution flow director 726 may, as shown, optionally be present at the bottom of the cell to create a fluid vortex pattern within the cell 700 A to facilitate a higher flow velocity near the cylinder wall. Such a flow improvement may facilitate thorough mixing of the solution, as well as dislodging and sweeping away of bubbles or other byproducts or impurities from the inside walls of the cylinder 722 .
- the electrical circuit 770 can provide sufficient current paths for electrodeposition of a sleeve layer 705 onto the patterned substrate or layer 702 or patterned support cylinder 701 containing the first relief pattern.
- the electrical circuit 770 can include two electrodes 771 , 772 for applying a current through the metal containing solution 720 .
- the inner surface of the pattern-containing support cylinder 701 may be coated with a thin layer or coating of electrically conductive material (not shown) forming the first electrode for initiation of electroplating.
- the thin conductive coating can be achieved by suitable techniques such as vacuum deposition, e.g., as shown and described previously for FIG. 6 , or electroless deposition.
- the first electrode can be connected via terminal 774 and appropriate electrical connection(s) to power supply 728 .
- the second electrode 772 e.g., as a nickel assembly, may be positioned within cylinder 722 and may be connected through a terminal 772 and suitable electrical connection(s) to power supply 778 . Circulation of the electrolyte 720 within the cylinder 722 provides an electrical path between the electrodes and the power supply and completes the electrical circuit 770 .
- the second electrode 772 includes Ni pellets (or solid rod or the like) placed a titanium basket, which in turn is surrounded by a filter bag to retain any particulates produced as byproducts of the electroforming process.
- the thickness of the deposited metal (e.g., nickel) layer 705 is proportional to the total charge passed through the cell, as is known in the art of electroplating.
- the process can be terminated after any length of time, where the thickness of the deposited layer is thereby proportional to the cumulative amount of current passed through the cell, as well as other factors, and which typically may range from a few microns to many millimeters in thickness.
- the electrodeposition process may be terminated by removing the voltage, draining and disassembling the cell 700 A.
- FIG. 7B is a schematic drawing depicting a cross section of an electrochemical deposition cell 700 B, similar to (and including like numbering) deposition cell 700 A of FIG. 7A .
- Cell 700 B can be used for making durable pattern replication tools with relief patterns 704 recorded on an external surface of a support cylinder 701 , in accordance with further embodiments of the present disclosure.
- the cylinder 701 includes a desired first relief pattern 704 in a substrate 702 disposed on an outer surface of the cylinder 701 .
- the externally patterned support cylinder 701 is located between a first pair of end plate 730 , 731 , which can serve to prevent solution 720 from entering the cylinder.
- a second pair of end plates 732 , 733 and a centralizing shaft 751 may also be present to facilitate positioning of the cylinder.
- FIGS. 8A-D depict apparatus 800 A-D that are suited for casting a polymeric material against the patterned surface to form a tool sleeve for use in replication tools according to exemplary embodiments of the present disclosure.
- FIG. 8A is a schematic drawing depicting a cross section of an apparatus 800 A useful for applying a fluid or liquid such as polymer to an internal patterned surface of a support cylinder 801 , in accordance with a further embodiment.
- a desired relief pattern 804 is located within a substrate 802 disposed on an inner surface of the support cylinder or sleeve 801 .
- the apparatus 800 A, or fixture can include first and seconds ends 820 , 821 for holding the support cylinder 801 and a cylindrical shell or sleeve 821 .
- the cylindrical sleeve 821 may function as holing means for holding the support cylinder relative to the first and second ends 820 , 821 .
- the first and second end 820 , 821 , along with the support cylinder 801 and cylindrical sleeve 821 may be configured and arranged in a fluid-tight seal.
- a cylindrical fluid passageway is formed through which a desired fluid 811 , such as a curable liquid polymer, can be applied to a patterned surface of the support cylinder 801 for forming a replication tool having the complimentary relief pattern.
- the first end 820 of the apparatus 800 A can include a first passageway 870 .
- the first passageway may be configured to receive vacuum from a vacuum supply (shown as 873 ), and to apply the vacuum to a castable fluid 811 such as a polymeric liquid to draw the fluid 811 over a patterned surface of a support cylinder 801 .
- the apparatus 800 A can include a second end 821 for holding the support cylinder 801 at an opposite end of the support cylinder than the first end 820 .
- Alignment rings 808 and seals 809 may be used for alignment and sealing of the support cylinder 801 and cylindrical sleeve 822 .
- alignment plates 832 , 833 in conjunction with a centralizing shaft 852 may be used for alignment of the support cylinder and cylindrical sleeve 822 .
- the fluid 811 is caused to flow through the second end 821 and over the patterned surface, e.g., substrate 802 with first desired relief pattern 804 .
- a sleeve layer 805 including a second desired relief pattern 806 complementary to the first relief pattern 804 can be formed.
- suitable polymeric materials can include, but are not limited to, a radiation cross-linkable polymer system, such as a material that is curable by application of ultraviolet light.
- suitable materials include, but are not limited to, thermoplastics, which may be injected in the molten state and allowed to cool, or multi-part catalytically/thermally cured materials (“epoxies”) and the like.
- FIG. 8B depicts an apparatus 800 B that is similar to 800 A except for the inclusion of one or more radiation sources 860 configured within the cylindrical sleeve or shell 822 to cure a radiation-curable liquid 811 .
- the cylindrical shell 822 is transparent or translucent to the radiation of the source(s) 860 .
- the radiation source operates to irradiate the curable polymer 811 .
- the curable liquid polymer 811 is cured and hardened it forms a tool sleeve 805 having a complimentary (second) relief pattern to the relief (first) pattern 804 recorded in the substrate 802 on the support cylinder 801 .
- UV-curable polymers are utilized for the layer 805 .
- a parting layer could be coated on the master pattern surface and would adhere preferentially to one of the two surfaces. Such a parting layer could be either left in place or removed, e.g., by chemical or plasma stripping, etc.
- FIG. 8C is a schematic drawing depicting a cross section of an apparatus 800 C, similar to 800 A of FIG. 8A , but configured and arranged for forming a tool sleeve is formed about an external surface (i.e., in a radial sense) of a support cylinder 801 .
- Embodiments such as 800 C may be used for applying a fluid (e.g., liquid or gas) such as a curable liquid polymer to an external surface of a support cylinder.
- a fluid e.g., liquid or gas
- a curable liquid polymer such as a curable liquid polymer
- FIG. 8D depicts an apparatus 800 D that is similar to 800 B except that the one or more radiation sources 860 are configured on the exterior of the cylindrical shell 822 , which itself is configured on the exterior of the support cylinder 801 .
- Apparatus 800 D may be used for curing a layer such as a polymer that has been applied to an external surface of the support cylinder 801 , in accordance with exemplary embodiments.
- the cylindrical shell 822 is transparent or translucent to the radiation of the source(s) 860 .
- the initial or master three-dimensional relief pattern may itself be sacrificed or removed (or partially removed) as part of the process to separate the support cylinder from a final tool sleeve.
- FIG. 9A is a schematic drawing depicting a cross section of an apparatus 900 A used for chemically stripping a material layer (e.g., photoresist) applied to an internal surface of a support cylinder 901 , in accordance with a further embodiment.
- the apparatus 900 A similar to apparatus 200 of FIG. 2 , can include first and seconds ends 920 , 921 for holding the support cylinder 901 with substrate 902 and first relief pattern 904 .
- a chemical that acts as a solvent for the master layer material of the substrate 902 , but not the replica 905 may be introduced into the interface, e.g., 934 , between the master (substrate 902 ) and replica sleeve 905 , thereby dissolving master material and producing a gap between the two surfaces.
- the first end 920 includes a first passageway 970 that is configured to receive a fluid 911 , e.g., a photoresist solvent, from a fluid supply 910 (possibly via external piping or passageways 972 ) and to distribute the a fluid 911 for application to a substrate layer 902 disposed on a selected surface (e.g., the inner surface) of the support cylinder 901 .
- the second end 921 may include a second passageway 971 that is configured to receive the fluid 911 , e.g., from within bore 903 , for removal from the selected surface of the support cylinder 901 .
- fluid 911 Once removed from the cylinder 901 , fluid 911 may be directed to a desired location, e.g., a suitable reservoir 912 .
- the direction of flow 974 is indicated for the configuration shown.
- Alignment rings 923 , 924 may be used to facilitate precise positioning of the support cylinder 901 relative to the first and second ends 920 , 921 in exemplary embodiment
- a precision centralizing shaft 952 and precision bearing surface along which the inner or outer element is guided may be used in order to eliminate or minimize contact of the two surfaces during separation as shown in FIG. 9A .
- a cylindrical sleeve or bearing surface 922 is placed into contact with the tool sleeve 905 with relief pattern 906 , e.g., as made by system 600 of FIG. 6A .
- Centralizing disks, or elements, 932 , 933 are positioned at opposing ends of the tool sleeve 905 .
- Bearing surface 922 and element 932 , 933 operate as a centering means or device that centers sleeve 905 about shaft 952 , and thereby prevents damage to the outer pattern of the replica sleeve during the process of separation of replica tool sleeve 905 from cylinder 901 .
- one or more seals 909 may be used to facilitate fluid tight sealing between bearing surface 922 , cylinder 901 and the ends 920 , 921 .
- the bearing surface 922 may, in exemplary embodiments, be an expandable arbor, e.g., an inflatable elastomeric device, or a mechanical expansion device, etc.
- FIG. 9B is a schematic drawing depicting a cross section of portions of FIG. 900A in a removal process for of a replication tool sleeve from a support sleeve or patterning fixture in accordance with another embodiment 900 B.
- the tool sleeve 905 may be separated by means of sliding assembly of the bearing surface 922 and elements 932 , 932 on shaft 952 .
- the dissolved material can be used as a “lubricant” layer, or alternatively another material designed to lubricate/protect the replica surface can be introduced into the interspace for the separation process.
- a planarizing layer can be first applied to the SCS to increase separation clearance prior to coating of the photoresist layer. Residual photoresist or other contaminant material can be removed from the external patterned surface of the tool by cleaning as necessary.
- Separating the replication tool sleeve 905 from the support cylinder 901 may include other techniques such as those relying on differential thermal expansion/contraction between the support cylinder and replication tool sleeve, for example as described for FIGS. 10A-10B .
- FIGS. 10A-10B are schematic drawings depicting cross sections of a further embodiments 1000 A-B that utilize application of a heat flux for separating an internal replica 1005 with relief pattern 1006 from a patterning fixture with support cylinder 1001 having substrate 1002 and relief pattern 1004 .
- FIG. 10A is a schematic drawing depicting a cross section of an apparatus 1000 A including cooling means 1008 and heating means 1009 for separating the internal replica 1005 from a patterning fixture (or support cylinder) 1001 by differential thermal expansion/contraction, in accordance with a further embodiment.
- Cooling mean 1008 such as cooling coils heating means 1009 such as heating elements are included for application of a heat flux (a flow of heat into or out of the adjacent structure/material).
- a heat flux a flow of heat into or out of the adjacent structure/material.
- Introduction of a heat flux to either or both of the support cylinder 1001 and replica sleeve 1005 can cause differential thermal expansion/contraction, causing a radial clearance between the sleeve 1005 and support cylinder 1001 .
- simultaneous cooling of the inner component e.g., support cylinder 1001
- heating of the outer component e.g., sleeve layer 1004
- Heating or cooling alone may be used when the respective materials of the support cylinder and first layer have suitable differences in coefficients of thermal expansion.
- the inner and outer elements may be separated, e.g., by using a precision centralizing shaft and precision bearing surface along which the inner or outer element is guided in order to eliminate or minimize contact of the two surfaces. This separation technique applies to both the internal and external replica process.
- FIG. 10B is a schematic drawing depicting the apparatus of FIG. 10A with the internal replica 1001 mounted on a centralizing fixture and partially separated from the outer fixture.
- the centralizing fixture can include end element 1020 , centralizing shaft, and centralizing elements 1032 , 1033 .
- the movement of the sleeve 1005 away from the support cylinder 1001 for the separation process is indicated by the arrow shown.
- the separated sleeve e.g., sleeve 1005 in FIG. 10B
- the separated sleeve may be used without further processing as a master drum or replication tool for roll-to-roll (R2R) processes.
- the separated sleeve may be subjected to post processing, e.g., for cleaning, additional hardening, or application of a release layer to aid in the subsequent R2R process.
- Such cleaning process may involve rinsing with the appropriate solution(s) to remove residual dissolved photopolymer, electrolyte, lubricant, etc.
- the cleaning process may also include other cleaning steps, such as chemical stripping (of the parting and/or plating starting layers) or plasma stripping/cleaning etc., or other such cleaning processes.
- the sleeve containing the desired relief pattern may be further treated in order to impart additional benefits in the subsequent manufacturing process.
- Exemplary embodiments use known radiation or chemical cross-linking techniques to harden the finished patterning tool. Hardening can be beneficial, particularly when the patterned tool includes a polymeric material. For either polymeric tools or metallic tools, or for other types of material as well, post-processing may also be used to assist in reducing adhesion between the tool and the polymer film into which its pattern is being transferred (e.g., embossed).
- a useful release overcoat can be achieved by application of specific layers of atmospheric, vacuum, CVD, electrolytic, etc., coating processes. Suitable components for such a release overcoat, include, but are not limited to, PTFE [Teflon®], chrome, gold, inorganic oxide, or other materials.
- a release overcoat can include appropriate adhesion sublayers that are known to reduce adhesion to polymeric substrates.
- a replication tool sleeve according to embodiment of the present disclosure may be mounted in a rotary manufacturing machine using suitable apparatus and/or techniques.
- Suitable methods/apparatus may include an expansion arbor bonded to an inner centralizing sleeve using a gap-filling adhesive, or by other suitable methods and/or apparatus.
- An example of a suitable air-activated, compressed rubber or polymer expansion arbor is shown and described for FIG. 11 .
- FIG. 11 shows a replication tool 1100 according to the present disclosure, including a support fixture and an expansion arbor 1140 .
- a thick-walled cylindrically-shaped elastomeric insert piece 1140 is inserted into sleeve 1141 over shaft 1142 and compression nuts 1143 are tightened against thrust washer 1144 to compress elastomeric insert piece 1140 .
- the resultant shortening of the length of the insert piece 1140 causes its outer diameter to concomitantly expand, thereby firmly capturing and securing tool sleeve 1141 . Removal of the tool sleeve 1141 from the mounting fixture is accomplished by reversing this tightening process.
- the finished tool 1100 may be suitable for use in replication machinery, and may allow rapid changing of the tool sleeve.
- the tool 1100 may minimize the potential for contacting or otherwise damaging the outer surface holding the relief pattern 1145 during the mounting process.
- the support fixture shown in FIG. 11 can be used for the extraction of a sleeve (from a deposition cell, e.g., cell 700 B of FIG. 7B , or support fixture, e.g., 900 B shown in FIG. 9B .
- the insert piece 1140 may be inserted with the bore formed by the inner surface of the plating forming the replication tool.
- the associated compression nuts can be tightened so the insert piece 40 is pressed against and holds the replication tool sleeve.
- the support fixture holds the replication tool sleeve 1141 and prevents damage to the pattern 1141 on the outside surface of the tool sleeve 1141 , forming a completed replication tool that is suitable to imprint or pre-format desired media such as optical recording media.
- FIG. 12 is a diagram depicting steps in a method 1200 of fabricating a seamless replication tool according to a further embodiment of the present disclosure.
- An inner surface of a support cylinder is prepared for holding a desired relief pattern, as described at 1202 .
- a light-sensitive polymer in the form of a photoresist fluid such as previously mentioned, is poured in excess onto the inner wall of the support cylinder from the top opening such that the photoresist completely covers the inner wall below the top opening and is allowed to flow downward by gravity until a continuous film is formed.
- the layer thickness (e.g., as shown by layer 102 in FIG. 1 ) can be controlled by adjusting the weight ratio of solid material to diluent (solvent) in the photoresist composition.
- the evaporation of the diluent component of the resist, and hence the drying time, can be modulated as necessary to achieve a smooth surface by control of the ambient temperature or control of the solvent vapor pressure (by, for example, partially scaling the support structure against evaporation), which will effect the thickness and surface quality, among other things, of the photoresist layer.
- the final preparation of the photoresist may involve heating or baking as required by the particular material.
- a desired pattern may be formed or recorded in the substrate as described at 1204 .
- radiation is applied to the substrate by computer-controlled motion of a movable radiation source producing a laser output within the support cylinder, e.g., as shown and described for FIGS. 4A-B .
- translation of a radiation head assembly used at 1204 to apply radiation may be accomplished by means of a linear actuator, which may be controlled by a position controller.
- the support cylinder with photoresist coating can be rotated about its central shaft while simultaneously translating an optical head along the direction of the axis of the cylinder.
- the output of the optical head of an optical source e.g., laser
- the rotation, translation, and laser control may be synchronized and programmed through master controller device, which may include a programmable logic controller (PLC), or computer, or the like.
- PLC programmable logic controller
- the recording of the desired pattern may include other sources and configurations of light or radiation delivery and exposure of the photoresist, including the use of gas and/or solid state lasers, electron beams, focused ion beams, light emitting diodes (LEDs), incoherent light sources, fiber optic devices, and the like.
- Other configurations for recording a desired pattern on the photoresist are also envisioned by this disclosure, including relaying of the beam along the direction of the rotation axis of the cylinder to an assembly which re-directs and focuses the beam to the surface of the photoresist.
- both rotation and translation can be accomplished by movement of only the light head or source (either directly or as relayed by mirrors, etc.), or accomplished by rotation and translation of the cylinder only, or various combinations of the movements of the cylinder and the head or laser.
- a relief pattern may be formed from the desired pattern, as described at 1206 .
- Suitable methods for forming the relief pattern include applying a developer or solvent to the substrate to remove desired portions of the substrate, leaving the desired pattern in relief.
- Other suitable techniques may be used to recording the desired pattern may be used, such as laser ablating of material deposited on the sleeve surface, etc.
- a hard and durable layer (e.g., of a suitable metal) may be applied over the substrate and relief pattern, as described at 1208 , to form a durable and seamless replication tool sleeve.
- This application of the durable layer serves to form a mirror-image or negative relief pattern of the pattern on the substrate in a durable surface that is suitable for use in preformatting optical media.
- applying a hard and durable sleeve layer includes forming a continuous layer of electrically conductive material on the substrate of the support cylinder and then plating the substrate by an electroplating or electrodeposition process, e.g., as described for FIG. 7A .
- durable layer may be accomplished by other suitable techniques including, for example, electroless plating, electrolytic plating, electroforming, physical vapor deposition, chemical vapor deposition, epoxy replication, radiation cross-linking, casting, etc.
- any internally-patterned cylinder can be used as the pattern from which the desired tool is produced.
- an internally-patterned Ni cylinder can be used to produce an externally-patterned Ni tool.
- apparatus may be used for an electrodeposition process at 1208 .
- the patterned surface of the resist may be made electrically conductive in order to serve as an electrode in the electrical circuit.
- Creation of a conductive surface over the (non-conductive) photoresist pattern can be achieved by suitable techniques including, for example, vacuum deposition, chemical reduction, chemical vapor deposition, etc.
- a conductive layer can be made of silver, gold, chrome, nickel, or any compatible conductive material or alloy, and is of such a thickness so as to ensure an electrically continuous layer, as necessary to obtain faithful pattern reproduction in the electroforming process.
- the durable replica may be made by electroless deposition techniques, for example, electroless deposition of nickel (Ni) by immersion, etc.
- the durable layer or sleeve may be removed or separated from the support cylinder, as described at 1210 .
- a centralizing element e.g., element 1052 in FIG. 10B
- end element e.g., element 1020 in FIG. 10B
- the step of separating 1210 the durable layer from the support cylinder may include introducing a suitable solvent (e.g., a photoresist solvent or photoresist developer) to the space between the outer tool surface and the inner wall of the support sleeve (the space occupied by the photoresist, e.g., region 934 in FIG. 9A ).
- a suitable solvent e.g., a photoresist solvent or photoresist developer
- the tool sleeve may be separated by a sliding assembly on the shaft. Any residual photoresist or other contaminant material can be removed from the external patterned surface of the replication tool by cleaning as necessary.
- Separating the replication tool from the support cylinder may include cooling or heating the support cylinder or replication tool to cause differential expansion between the supports cylinder and replication tool.
- An expandable arbor e.g., an inflatable elastomeric device or a mechanical expansion device, etc., or other mounting fixture may be used for the separation process.
- the seamless replication tool sleeve may be mounted on a support fixture, as described at 1212 , to form a replication tool for imprinting the relief pattern on a desired medium, such as used for optical recording and data storage media.
- a thick-walled cylindrically-shaped elastomeric insert piece e.g., piece 1140 of FIG. 11
- the insert piece may be placed around a support shaft. Compression nuts may be tightened against respective thrust washers to compress an elastomeric insert piece.
- the resultant shortening of the length of the insert piece causes its outer diameter to concomitantly expand, thereby firmly capturing and securing the tool sleeve. Removal of the tool from the mounting fixture is accomplished by reversing this tightening process.
- FIG. 13 is a process flow chart for the formation of replication tool according to the present disclosure for both external and internal master drums.
- embodiments of the present disclosure can provide the ability to fabricate one or more master drums or replication tools from a single, original master pattern, whether internal or external type. This ability cab be particularly beneficial for the production of a number of identical replication sleeves, or when the “turn-around” time for producing another master pattern is too long or the cost too high to be viable for the production process.
- FIG. 13 is a process flow diagram illustrating the formation 1300 of multiple replica patterning sleeves and replication tools, in accordance with embodiments of the present disclosure.
- the pattern formed e.g., 1302 , 1306
- R2R roll-to-roll
- the process 1300 can start with either a negative internal pattern (i.e., external master pattern) 1302 or a positive internal pattern 1304 , where positive refers to the geometry being that of the master pattern and the finished replica (tool sleeve) having the same symmetry when viewed from the patterned surface.
- a positive internal pattern 1304 can be formed directly from a patterned internal surface of a support cylinder, e.g., cylinder 401 of FIG. 4A , or as a result of replication of a negative internal drum, e.g., drum 1302 .
- a negative internal pattern 1302 can be formed directly from a patterned external surface of a support cylinder, e.g., cylinder 401 of FIG. 4B , or as a result of replication of a negative external drum, e.g., drum 1304 using methods/apparatus of the present disclosure.
- Positive internal pattern 1304 can be used to form a number of negative internal drums, e.g., drum 1306 , by formation methods/apparatus according to the present disclosure, e.g., shown and described for FIGS. 2-12 .
- Ni deposition methods/apparatus e.g., shown and described for FIGS. 4A-B
- polymer application methods/apparatus e.g., shown and described for FIG. 8A-D
- Drum 1306 may be separated from drum 1304 by suitable methods/apparatus according to the present disclosure.
- thermal differential expansion/contraction shown and described for FIGS. 10A-B may be used for the separation of drum 1306 from drum 1304 .
- chemical stripping may be used to dissolve portions of such for the removal of drum 1304 .
- embodiments of the present disclosure provide durable seamless replication tools useful for the replication of desired relief patterns on recording media, or data storage substrates, including optical recording media.
- Replication tools according to exemplary embodiments may include desired relief patterns with features on a micron and/or nanometer scale. Further embodiments of the present disclosure may provide methods and/or apparatus for fabricating such seamless replication tools.
- a tool sleeve can be affixed to a support insert by suitable adhesives to bond the inner tool surface to the outer surface of a centralized sleeve, brazing or welding, press-fitting, thermal shrink-fitting, etc.
- a desired pattern on (or in) photoresist may be recorded by other suitable techniques, including relaying of an optical beam along the direction of the rotation axis of a support cylinder to an assembly which re-directs and focuses the beam on the surface of the photoresist.
- both rotation and translation can be accomplished by movement of only the light source (either directly or as relayed by mirrors, etc.), or accomplished by rotation and translation of the cylinder only, or various combinations of the movements of the cylinder and the head or laser.
- embodiments of the present disclosure may be used for other applications including, but not limited to, holographic replication, microimprint, and nanoimprint lithography and microscopic printing processes, to name a few examples.
- seamless cylindrical substrates SCS
- support cylinders that are in the form of circular cylinders
- the scope of the present disclosure includes SCS and support cylinders having other types of cylindrical shapes, e.g., elliptical cylinders.
Abstract
Durable replication tools are disclosed for replication of relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including recording and developing a relief pattern on a selected surface of a support cylinder, creating a durable layer with a complementary relief replica of the pattern, separating the durable layer from the support cylinder. Apparatus are disclosed for fabricating such replication tools, including systems and apparatus for recording a desired relief pattern on a surface of a support cylinder. Also disclosed are electro deposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
Description
- This application is a divisional of U.S. application Ser. No. 11/509,288 filed Aug. 24, 2006 which is a continuation-in-part of U.S. application Ser. No. 11/337,013 filed 20 Jan. 2006, which claims the benefit of U.S. Provisional Application No. 60/645,714 filed 21 Jan. 2005, the contents of both of which are incorporated herein in their entirety by reference. This application is also related to U.S. Provisional Application No. 60/777,138 filed 27 Feb. 2006, the contents of which are incorporated herein in their entirety by reference.
- Optical data storage media including compact discs (CDs) and digital video discs (DVDs) typically contain physical relief structures that are used by an optical read/write head to obtain position and tracking information, error correction, conveying data content, etc. These relief structures are created during the manufacturing process of the particular optical medium and typically include very fine modulations on a surface of the optical medium. The surface modulations are often in the form of pits, bumps, grooves, or lands, etc., and can include features with submicron-scale down to nanometer-scale dimensions. The process of incorporating such features into the substrate of the optical medium during manufacturing is variously referred to as “preformatting” or “replication.” The benefits of preformatting include very efficient utilization of the optical medium (e.g., disc) surface, which in turn allows higher storage capacity and enhanced performance compared to media without such formatting.
- The standard process for incorporating such information structures into the surface of optical disc substrates is injection molding, wherein pellets of a polymeric material, usually polycarbonate, are melted and injected into a mold containing an insert, or stamper, which has the mirror image of the desired pattern on its surface and against which the melted polymeric substrate material is brought into contact. Cooling of the mold allows the polymer material to solidify, at which point the substrate disc, now having the information formed into its surface, is removed.
- In the case of optical media designed for recording/rewriting of user data, the molded features typically contain various format and header addressing information to help locate the user data, and additionally may contain other features, including those relating to prerecorded information, often referred to as read-only memory (ROM) information.
- Although the injection molding process described above is the virtually exclusive manufacturing process used worldwide for making optical discs, a number of attempts have been made to fabricate data storage substrates by means other than injection molding, including continuous roll processing. Continuous roll-to-roll (R2R) techniques have been used in a number of manufacturing areas, including photographic film, paper and plastic, graphic arts, holographic and light control films, etc. For an article on continuous roll processing, see W. D. Slafer at al., “Continuous Web Manufacturing of thin-coverslip optical media”, SPIE Optical Data Storage '92, San Jose, Calif., 12 Feb. 1992. Such roll-to-roll (R2R) processes have involved a rotary or step-and-repeat replication process, either of which utilizes a replication tool whose surface contains the mirror image of the desired pattern, and which is used to create multiple replicas of the tool pattern.
- There are a number of techniques known in the art whereby embossing tools used in the R2R processes can be created, including direct etching on the external surface of the tool, or use of a flat substrate that is attached to the outer surface of a support member, patterned or patterned after mounting. See, for example, U.S. Pat. No. 5,521,030 and U.S. Pat. No. 5,147,763. It is further known that such tooling can be formed from discrete elements, whereby several substrates containing a pattern to be replicated can be joined, as in the form of a mosaic pattern, for example, and thereby increase the size of the tool.
- Many of the techniques of the prior art described previously include the inevitable creation of one or more joints or seams at the location(s) where substrate edges abut. The resulting master replication tool exhibits a discontinuity or seam at the location at which the discrete pieces are joined. Such seams do not represent a limitation in applications in which the desired pattern to be replicated is by design composed of discreet elements such as discs and cards, since the seams can merely be placed between the natural divisions of these discrete elements. For other applications, the visual effects of the seams can be reduced by techniques known in the art so as not to be noticeable or objectionable for a particular application, for example holographic designs or embossed foils for wrapping and packaging and the like. The discontinuities introduced by the existence of one or more seams, however, can present limitations in other applications in which a recording medium requires a format with a relatively long dimension compared to the replication tool, e.g., such as optical storage tape.
- In addition to cosmetic effects, a discontinuity such as a seam that is made by the replication tool can often cause mechanical problems during the replication process, and techniques known in the art have been developed to reduce the seam, including careful piecing of the segments, grinding, polishing, etc. For some applications, such techniques are not acceptable, for example micropatterns that require a pattern without interruption for long distances, such as lenticules for photographic films and preformatted recording tape. See E. H. Land, “An Introduction to Polavision,” Photogr. Sci. Eng. 21: 225 (1977).
- Examples of previous techniques of producing true seamless patterning tools have involved producing a mirror image of the desired pattern on the external face of a geometric surface, such as a drum, by engraving or by lithographic techniques, e.g., as taught in U.S. Pat. No. 6,045,980. These previous techniques, however, suffer from the drawback that the replica surface is often made of materials that are not durable (glass, photopolymer, etc.) or cannot be readily replicated. A direct (molded) copy of such an external master pattern would by necessity have the pattern facing inward, and attempting to “invert” such a tool, for example by slitting to turn it “inside out,” would by necessity introduce a seam.
- Other examples of processes for making replication tools suitable for optical recording media involve spiral wrapping of a discreet tape over the outer surface of a sleeve to create an external pattern. See, for example, U.S. Pat. No. 5,872,758. This technique does not eliminate discontinuities, however, and suffers from the limitation of creating multiple diagonal seams on the substrate being imprinted.
- What are desirable, therefore, are methods and apparatus that address the shortcomings noted for the prior art.
- The present disclosure is directed to methods and apparatus that substantially or altogether eliminate the shortcomings, limitations and disadvantages described previously. Certain embodiments of the present disclosure are directed to durable replication tools having a cylindrical surface that includes a seamless surface patterns for the formation or replication of predetermined continuous and seamless patterns useful for pre-formatting a desired recording substrate.
- Such replication tools may include a seamless cylindrical substrate (“SCS”) holding a desired three-dimensional relief pattern. The three-dimensional relief pattern of the SCS is complimentary or substantially complimentary to a three-dimensional relief pattern formed on a selected surface of a support cylinder.
- The recording substrate can be rigid or flexible. In certain embodiments, the recording substrate can include a layer of liquid polymer that can be cured or hardened to receive or hold a complimentary pattern based on the predetermined seamless pattern of the replication tool.
- Other embodiments of the present disclosure are directed to related methods and apparatus for fabricating such seamless replication tools, including chemical deposition cells, fluid delivery systems, centralizing fixtures, and differential thermal expansion/contraction methods/apparatus.
- Exemplary embodiments of continuous and seamless durable replication tools as described herein may provide the capability of forming a continuous pattern capable of having features with critical dimensions down to the micron and nanometer regimes on a substrate of arbitrary length, e.g., a substrate for preformatted tape, and the like.
- These and other features of the present disclosure will be more clearly apparent from the following description when taken in conjunction with the accompanying drawings.
- Various aspects of the disclosure may be more fully understood from the following description when read together with the accompanying drawings, which are to be regarded as illustrative in nature, and not as limiting. The drawings are not necessarily to scale, emphasis instead being placed on the principles of the disclosure. In the drawings:
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FIG. 1 is a schematic drawing depicting a cross section of a support cylinder having a photosensitive layer on an inner surface, in accordance with an embodiment of the present disclosure; -
FIG. 2 is a schematic drawing depicting a cross section of a further embodiment for applying a liquid to an internal surface of a support cylinder; -
FIG. 3 is a schematic drawing depicting a cross section of a further embodiment for vacuum deposition of a recording layer on a inner surface of a support cylinder; -
FIG. 4A is a schematic drawing depicting a cross section of a further embodiment including a movable radiation source for recording information-bearing features on an inner surface of a support cylinder; -
FIG. 4B is a schematic drawing depicting a cross section of a further embodiment including a movable radiation source for recording information-bearing features on an outer surface of a support cylinder; -
FIG. 5 is a schematic drawing depicting a cross section of a further embodiment for the application of a photoresist developer to an internal surface of a support cylinder; -
FIG. 6 is a schematic drawing depicting a cross section of a further embodiment for vacuum deposition of a layer on an internal patterned surface of a support cylinder; -
FIG. 7A is a schematic drawing depicting a cross section of a further embodiment in which an electrochemical deposition cell is utilized for making durable pattern replication tools having a negative-relief replica of a pattern formed on an inner surface of a support cylinder; -
FIG. 7B is a schematic drawing depicting a cross section of an electrochemical deposition cell similar to that ofFIG. 7A for making durable pattern replication tools having a negative-relief replica of a pattern formed on an external surface of a support cylinder, in accordance with a further embodiment; -
FIG. 8A is a schematic drawing depicting a cross section of a further embodiment for applying a liquid such as polymer to an internal patterned surface of the support cylinder; -
FIG. 8B is a schematic drawing depicting a cross section of a further embodiment for curing a layer such as a polymer applied to an internal patterned surface of the support cylinder, for example as shown inFIG. 8A ; -
FIG. 8C is a schematic drawing depicting a cross section of a further embodiment according to an embodiment for applying a liquid such as a polymer to an external patterned surface of a support cylinder; -
FIG. 8D is a schematic drawing depicting a cross section of a further embodiment for curing a layer such as a polymer applied to an external patterned surface of the support cylinder, for example as shown inFIG. 8C ; -
FIG. 9A is a schematic drawing depicting a cross section of a further embodiment used for chemically stripping a photoresist layer applied to an internal surface of a support cylinder; -
FIG. 9B is a schematic drawing depicting a cross section of a further embodiment used in the removal for of a replication tool sleeve from a support sleeve or patterning fixture; -
FIG. 10A is a schematic drawing depicting a cross section of a further embodiment for separating an internal replica from a patterning fixture by differential thermal expansion/contraction. -
FIG. 10B is a schematic drawing depicting apparatus ofFIG. 10A with the internal replica mounted on a centralizing fixture and partially separated from the outer fixture; -
FIG. 11 is a schematic drawing depicting a cross section of a replication tool including a support fixture, in accordance with a further embodiment; -
FIG. 12 is a diagram depicting a method of fabricating a seamless replication tool, in accordance with a further embodiment of the present disclosure; and -
FIG. 13 is a process flow chart for formation of replication tools for cases of external and internal master drums, or replication tools, in accordance with further embodiments of the disclosure. - The following description refers to several possible embodiments of the present disclosure. It should be understood by one skilled in the art that variations of the embodiments described herein may be envisioned and practiced within the scope of the disclosure.
- Embodiments of the present disclosure are directed to pattern replication tools, or master drums, and related fabrication methods and apparatus useful for making and copying seamless cylindrical substrates (“SCS”). Formation of a replication tool can include the use of a cylindrical surface that includes a seamless surface patterns for the formation or replication of predetermined continuous and seamless patterns useful for pre-formatting a desired recording substrate. The cylindrical surface may be a selected inner or outer radial surface of a support cylinder. Such master drums, or replication tools, can provide the ability to relatively quickly and inexpensively make copies of one or more master patterns used in the manufacturing of recording media.
- The replication tools can have one or more desired or predetermined three-dimensional relief patterns that are suitable for imprinting or embossing the relief pattern(s) in various media including optical storage media. The relief patterns of the replication tools are formed as three-dimensional patterns that are complementary, or substantially complimentary, to relief patterns of a selected surface of a support cylinder. The selected surface of a support cylinder can be the inner or outer radial surface relative to the longitudinal axis of the cylinder.
- The relief patterns themselves can be predetermined, pseudorandom, or random, and the surfaces can be seamless. A relief pattern may be formed by suitable techniques including, but not limited to, direct writing contact or projection lithography, physical contact with another pattern, or other suitable techniques.
- In exemplary embodiments, the relief pattern(s) of the support cylinder can be formed or recorded in a substrate material that has been applied to the selected surface of the support cylinder. Exemplary embodiments of continuous and seamless durable replication tools as described herein may provide the capability of forming a continuous pattern with features having critical dimensions down to the micron and nanometer regime on a substrate of arbitrary length, e.g., a substrate for preformatted optical tape, and the like.
- Further embodiments of the present disclosure are directed to apparatus for fabricating such seamless master drums or replication tools. Certain embodiments are directed to systems that utilize a radiation source to record a desired relief pattern on a radiation-sensitive layer on a selected surface of a support cylinder. Further embodiments of the present disclosure are directed to chemical deposition cells for plating a support cylinder having a relief pattern and forming a durable tool sleeve having a complimentary relief pattern.
- Exemplary embodiments of the present disclosure are directed to techniques for applying requisite materials to the internal or external surface of a support cylinder prior to pattern formation, and, where required, developing this layer after pattern exposure. Coated materials for pattern formation may include, but are not limited to, photoresists, metals, alloys, compounds, and polymeric layers.
- Further embodiments of the present disclosure are directed to apparatus and methods for forming multiple generations (i.e., copies or replicas) from an original patterned cylinder. This may be useful if, for example, the initial pattern is formed internally or from a material that is fragile or incompatible with the physical or chemical conditions of the replication process. By making multiple generations of tools from a single original or master pattern, the time-consuming and expensive process of producing original master patterns may be minimized.
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FIG. 1 is a schematic drawing depicting a cross section of a support cylinder having a recording layer on an inner surface, in accordance with anembodiment 100 of the present disclosure. Thesupport cylinder 101 forms abore 103, and may be made of a suitable strong and rigid material such as glass, metal, plastic, etc. In preferred embodiments, the cylinder is devoid of surface seams, i.e., is seamless, or substantially so. A selected surface of thesupport cylinder 101, e.g., the inner surface as shown, may be coated with a layer of suitable material to form asubstrate 102 that can be used for recording a desired or predetermined relief pattern. In exemplary embodiments,substrate 102 includes a radiation-sensitive material such as a light-sensitive polymer (such as Shipley AZ photoresist, or the like). - In
FIG. 1 , distance “A” is representative of a portion ofsubstrate 102 that has substantially uniform thickness when compared to the thickness of thesubstrate 102 along the overall length “B” of thesupport cylinder 101. Distance B (or overall length) of thecylinder 101 may be made longer than the desired final length of the uniform section A to take into account any coating thickness non-uniformity at the top and bottom areas of the cylinder, e.g.,section 150. The non-uniform sections of the cylinder may be removed and discarded leaving a support cylinder withsubstrate 102 of substantially uniform thickness along the length of the cylinder. -
Substrate 102 can be applied by any of a number of techniques, including but not limited to dipping thecylinder 101 in a bath or reservoir of the substrate material, drawing thecylinder 101 out of such a bath, draining the bath at a desired rate, spraying substrate material onto one end of thesupport cylinder 101, and/or spinning thesupport cylinder 101 to spread the substrate material, etc. - In exemplary embodiments, at least one of the layers or surfaces of the support cylinder includes a material or substrate that is sensitive to the application of incident energy (e.g., actinic radiation, electrons, ions, or heat, and the like). The radiation-sensitive material can include one or more layers or regions of photoresist, such as those used for typically used in optical or e-beam lithography. Suitable photoresists can be of the positive or negative types. Positive photoresists are weakened by exposure to the incident energy, facilitating a “positive” pattern resulting from removal of the exposed (and thus weakened) areas of the resist. Conversely, negative photoresists are strengthened by the incident energy, facilitating a “negative” pattern resulting from removal of the unexposed areas of the resist. In exemplary embodiments, for example, so-called Shipley photoresists may be used, though other suitable types may likewise be used.
- In exemplary embodiments, the
substrate material 102 may be applied to the top rim of the support cylinder (preferably below the edge to prevent dripping) in sufficient quantity to form a continuous liquid film covering the inner surface of the cylinder, then allowed to drain down by gravity. The thickness and uniformity of the substrate material (e.g., photoresist) may be controlled, for example, by control of the viscosity of the coating fluid (adjusted by the use of one or more diluents), the evaporation rate of the diluent(s), among other factors. In exemplary embodiments including use of a photoresist, pre-bake and other steps typically used with photoresists may be followed in order to prepare the resist for subsequent exposure. - In certain embodiments, a
substrate 102 can include an ablative material, such as a polymer, metal, or alloy (e.g., tellurium or a tellurium alloy) that can be vaporized or physically deformed by the action of the incident energy (e.g., optical radiation). In further embodiments, thesubstrate 102 or pattern forming layer(s) can include a soft polymeric or metallic material that may be deformed by the action of a precision stylus (atomic force microscopy “AFM”, etc.) or cutting tool or by suitable techniques including thermal embossing, chemical embossing, imprint lithography, or self-assembly, etc. - While
FIG. 1 indicates thatlayer 102 is located on the inner surface of thesupport cylinder 101, the desired pattern may be formed on the outside surface of similar support cylinders in other embodiments. For such embodiments, e.g., including an externally patterned substrate, the support cylinder may be used directly as a production pattern replication tool in a manufacturing process, e.g., for pre-formatting optical recording media. Replication tools may also be formed from a replica of an original or master patterned tool. -
FIG. 2 is a schematic drawing depicting a cross section of anapparatus 200 for applying a fluid, e.g., a liquid such a suitable substrate material, to a selected surface of asupport cylinder 201, in accordance with further embodiments. As described previously forFIG. 1 , thecylinder 201 may be made from a suitably strong and rigid material, e.g., glass, metal, plastic, etc. - The
apparatus 200, or fixture, can include opposed first and seconds ends 220, 221 for holding thesupport cylinder 201. Thefirst end 220 includes afirst passageway 270 that is configured to receive a fluid 211 from a fluid supply, e.g.,supply reservoir 210, possibly via external piping orpassageways 272. A manifold 213 may be configured within thebore 203 of thecylinder 201 for receiving fluid 211 from thefirst end 220.Manifold 213 includes one or more orifices suitable for the distribution (shown as fluid spray 214) of the fluid 211 to a selected surface (e.g., the inner surface) of thesupport cylinder 201. Thesecond end 221 may include one or more orifices to receive accumulatedfluid 215 used for the coating of the cylinder surface. Thesecond end 221 also includes asecond passageway 271 that is configured to conveyfluid 211 for removal from thesupport cylinder 201, possibly viaexternal piping 273. - Also shown in
FIG. 2 are a pair ofcylindrical wall support cylinder 201 relative to the first and second ends 220, 221. The pair ofcylindrical walls support cylinder 201, with each wall having a lateral surface adapted to receive thesupport cylinder 201. Other suitable holding means may be used for support of the support cylinder, e.g., gasket configurations, etc. Thefluid delivery apparatus 200 may also include adelivery manifold 213 that is connected to one end, e.g., end 220, with a suitable number and configuration of orifices to deliver the fluid 211 to a surface of thesupport cylinder 201 to form asubstrate 202. InFIG. 2 , similar toFIG. 1 , height “A” is representative of a portion ofsubstrate 202 that has substantially uniform thickness when compared to the thickness of thesubstrate 202 along the fluid application height “B” including portions of holding means, e.g., bracketingcylindrical walls cylinder 201, fluid 211 may be directed to a desired location, e.g., asuitable reservoir 212. - The fluid (e.g., liquid) applied to the
support cylinder 201 with theapparatus 200 may be selected as desired. For example, a photoresist polymeric material may be selected for some applications. Further, liquids including suitable polymers may be used to impart a planarizing effect on thecylinder 201. Planarization may be achieved by applying a suitable liquid (e.g., polymer) to even uneven surface features, thus reducing or eliminating the effects of scratches, roughness due to intrinsic crystal structure, and/or mechanical surface roughness. In certain embodiments, multiple liquid application steps may be performed usingapparatus 200. For example,apparatus 200 may be used with afirst liquid 211 to apply a first coating that primarily planarizes and reduces defects in the selected surface of thecylinder 201 and a second, subsequent coating including a photosensitive layer in then applied on the first planarizing layer. - In addition to embodiments according to
FIG. 2 , material and layers for recording (or holding) a desired relief pattern may be added to a support cylinder used for replication or preformatting, e.g.,cylinder 101, by suitable methods and apparatus.FIG. 3 is a schematic drawing depicting a cross section anapparatus 300 for vacuum deposition of a recording layer orsubstrate 302 on a inner surface of asupport cylinder 301, in accordance with a further embodiment. - The
apparatus 300 includes avacuum chamber 320 in which thesupport cylinder 301 can be placed. A sputter cathode orevaporation wire 330 may be positioned through thebore 303 formed by thesupport cylinder 301. The configuration of theevaporation wire 330 andsupport cylinder 301 facilitates uniform coating of the inner surface of thecylinder 301 with a desired material. - The apparatus of
FIG. 3 may be used to uniformly coat a metal, alloy, compound, polymer, photopolymer, etc., layer to the inside surface of thecylinder 301. The uniformity of the deposit may be improved by the rotation and/or translation of thecylinder 301 and/or source (e.g., sputter cathode), as well as by using appropriate aperture shields during the deposition process (not shown). In alternate embodiments, method/apparatus analogous to that shown inFIG. 3 may be used to coat an external surface of a cylinder in order to form an externally-patterned cylinder. -
FIG. 4A is a schematic drawing depicting a cross section of anapparatus 400A including a movable radiation source for recording information-bearing features on an inner surface of asupport cylinder 401, in accordance with a further embodiment. The apparatus (or system) 400A can include a movableradiation head assembly 409 disposed within thebore 403 of the support cylinder. Thehead assembly 409 can include a radiation source for recording a desired pattern, e.g., information-bearing features, on asubstrate 402 that has been applied to the inside surface of thesupport cylinder 401. One or more centralizing end bells, or disks, 406, 407 may be present for holding the head assembly within thecylinder 401. One or more support members may be present to support thesupport cylinder 401, and may be connected to the one ormore end bells central shaft 451 extending throughbearings motor 414 may be present for rotation of theshaft 451. To facilitate improved precision and accuracy in patterning, or pattern formation, thebearings - The
apparatus 400A may include a frame, e.g., track 408 andlegs radiation source 409 relative to thecylinder 401. ForFIG. 4A , the frame is located within thebore 403 of thecylinder 401. In exemplary embodiments, thetrack 408 can be parallel or substantially parallel to thesupport shaft 451. Themovable head assembly 409 can include an actuator 416 (e.g., a linear actuator) configured to move the radiation source along thetrack 408. - The radiation source used for
assembly 409 may be a light source of any suitable wavelength and degree of coherence. In further embodiments, ion sources and/or e-beam sources may be used as the movable radiation source. In exemplary embodiments, a laser such a suitable semiconductor diode laser or a solid state laser is used for the movable radiation source. The output of the radiation source, e.g., a laser output beam, may be modulated by asuitable controller 441. Thehead assembly 409 may include autofocus and other control circuitry as necessary to maintain the position and uniformity of the produced radiation, e.g., optical output beam. The translation ofassembly 409 by thelinear actuator 416 may be controlled by asuitable position controller 442. - To produce relative movement between the
head assembly 409 and thecylinder 401, thecylinder 401 may be rotated about itscentral shaft 451 whileassembly 409 is simultaneously translated along the direction of the longitudinal axis of thecylinder 401. During such motion, the output of the radiation source ofassembly 409 can be modulated to produce exposure oflayer 402 according to the desired pattern. Smooth continuous motion of the radiation source, or its radiation, can be used to produce a spiral pattern, or other desired pattern(s) on/in the selected surface of thesupport cylinder 401. For example, intermittent rotation and translation of the radiation source relative to the selected surface of the support cylinder can be employed to produce concentric patterns. - Rotation, translation, and radiation output (e.g., laser beam intensity) control of assembly 409 a may be synchronized and programmed through a
master controller device 440. Example of a suitablemaster controller device 440 can include, but are not limited to suitable programmable logic controllers (PLCs), computers, suitable processors, field-programmable gate arrays (FPGAs), or the like. It may also be appreciated that alternative techniques for moving the radiation output with respect to the selected surface of a support cylinder, with any desired coating(s)/layer(s), may be used. For example, in certain embodiments, the radiation source or its output may be held steady while rotating and translating a support cylinder in a desired way. For further example, the radiation source or its output could be rotated while thecylinder 401 is translated to achieve writing/recording of the desired pattern. WhileFIG. 4A shows a radiation source configured and arranged to apply a desired pattern to an internal or inner surface of asupport cylinder 401, other embodiments may include a radiation source configured and arranged to apply a desired pattern to an external surface of asupport cylinder 401, as shown inFIG. 4B . -
FIG. 4B is a schematic drawing depicting a cross section of anapparatus 400B including a movable radiation source for recording information-bearing features on an outer surface of asupport cylinder 401, in accordance with further embodiments.Apparatus 400B is similar to (and includes like numbering)apparatus 400A shown and described forFIG. 4A , however, thesubstrate layer 402 is disposed on the outer radial, or exterior, surface of thesupport cylinder 401. For this configuration, the movableradiation source assembly 409 is configured to move along a frame, e.g.,track 408, that is located exterior to and in suitable proximity with the outer surface of thesupport cylinder 401. - In addition to the use of
apparatus 400A-400B shown and described forFIGS. 4A-4B , other indirect writing techniques including lithography may be used to prepare a desired pattern in/on the selected surface of a support cylinder. Lithographic techniques may employ a photomask (“stencil”), either in direct contact with the substrate (“contact printing”), or by projecting the image of the pattern onto the substrate (“projection printing”). For such lithographic techniques, the selected surface (internal or external) of the cylindrical support cylinder is coated with a photosensitive layer, e.g., as shown inFIG. 2A , and radiation of an appropriate wavelength is used to expose the photosensitive layer through the photomask. The photoresist may subsequently be developed to obtain a desired relief pattern. - Other suitable indirect writing techniques can include holographic techniques in which a photoresist-coated cylinder is exposed to a standing wave pattern made by the interference of multiple laser beams. In such embodiments, a photomask may not be necessary, however, the ability to write certain types of patterns may as a consequence be impacted, since the laser interference pattern may have a high degree of spatial uniformity.
- Besides indirect writing techniques, e.g., as described for
FIGS. 4A-B , suitable direct writing techniques may be used to directly form a desired pattern in/on a selected surface of the support cylinder. For example, subtractive processing, such as laser ablation, may be utilized, where material is removed by the direct action of the radiation. Additive processing may also be used, where material is added to the support cylinder in a desired pattern. Examples of suitable additive techniques include, but are not limited to, embossing techniques including thermally-activated, chemically-activated, and radiation-activated embossing techniques as well as the use of ink jet printing or dip-pen lithography. A further technique may utilize a microstylus (e.g., using atomic force microscopy “AFM,” micro-indenter, etc.) to form a pattern by disruption of the coated layer. - In embodiments utilizing embossing techniques to produce a cylindrical master pattern, a tool haying the desired surface relief pattern (which can made by any number of techniques know in the art) may be placed into contact with the surface (internal or external) of the cylindrical substrate. By using thermal or chemical techniques, the substrate surface can be softened so that the relief pattern can be pressed into it. The relief pattern may be removed once the substrate surface is re-hardened (e.g., by returning the substrate surface to below its softening point). Alternatively, a liquid curable polymer can be applied to the substrate surface and caused to set exposure to radiation (thermal, optical) or as the result of a chemical ratio (epoxies). Numerous techniques known in the art, including the more recently developed Nano Imprint Lithography can be used in this regard.
- The selection of a particular pattern writing technique (e.g., a direct or indirect technique) may be influenced by one or more factors, including the resolution achievable by the process relative to that required by the desired pattern, and the time required to write the desired pattern, etc.
- For processes based on exposure of a photoresist, one or more subsequent development steps may be included for the formation of the desired three-dimensional relief pattern, as shown in
FIG. 5 . For example a Shipley type photoresist commonly used in the semiconductor industry uses an aqueous basic developer to dissolve those areas exposed to the writing beam or photomask pattern. -
FIG. 5 is a schematic drawing, in accordance with a further embodiment, depicting a cross section of afluid delivery apparatus 500 that may be used for the application of a photoresist developer to an internal surface of asupport cylinder 501 withsubstrate 502 in accordance with a further embodiment similar toapparatus 200 ofFIG. 2 . It should be noted that an analogous process to that shown inFIG. 5 can be used to develop the external surface of a cylinder. - The
apparatus 500 can include first and seconds ends 520, 521 for holding thesupport cylinder 501. The first end 520 a includes afirst passageway 570 that is configured to receive a fluid 511 from a fluid supply 510 (possibly via external piping or passageways 572) and to distribute the afluid 511 for application to asubstrate layer 502 disposed on a selected surface (e.g., the inner surface) of thesupport cylinder 501. A manifold 513 may be configured within thebore 503 of thecylinder 501 for receiving fluid 511 from thefirst end 520.Manifold 513 includes one or more orifices suitable for the distribution (shown as fluid spray 514) of the fluid 511 to a selected surface (e.g., the inner surface) of thesupport cylinder 501. Theapparatus 500 can include asecond end 521 for holding thesupport cylinder 501 at a different location than thefirst end 520. Thesecond end 521 may include asecond passageway 571 that is configured to receive accumulated fluid 515 from thesupport cylinder 501. Once removed from thecylinder 501, fluid 511 may be directed to a desired location, e.g., asuitable reservoir 512, via suitable external piping orpassageways 573. - Also shown in
FIG. 5 are a pair ofcylindrical wall support cylinder 501 relative to the first and second ends 520, 521. The pair ofcylindrical walls support cylinder 501, with each wall having a lateral surface adapted to receive thesupport cylinder 501. Other suitable holding means may be used for support of the support cylinder, e.g., gasket configurations, etc. - As shown in
FIG. 5 , the development process of a photoresist applied to thesupport cylinder 501 may be monitored optically. The optical monitoring may be performed in real time by using a suitableoptical source 530 and detector(s) 532 to detect thereflection 536 ortransmission 538 of radiation produced by thesource 530. The developer liquid may be removed or application of such may be stopped when it is determined that the optimum endpoint of the development process has been reached. Suitable control and detection circuitry (not shown) may be used for such monitoring. In exemplary transmission embodiments,sleeve 501 may be transparent to the applied radiation ofsource 530. - It should be noted that developed patterns, e.g., a desired relief pattern produced by application of developer according to
FIG. 5 , may further be made more resistant to mechanical and chemical attack or degradation by use of radiation and/or chemical processing, e.g., by general hardening processes know, in the art. For example, exposure of development photoresist to e-beam, UV, or thermal radiation in a post-processing operation can increase the durability, abrasion resistance, solvent resistance, etc., of the photoresist (“hardening”). In the case of certain photoresists, e-beam exposure is particularly effective. Such hardening of the patterned photoresist can allow a patterned cylinder to be used and re-used for subsequent tool formation (“replication”). Certain image processes, such as ablation, dye-polymer, etc., do not require a subsequent process to form (“develop”) the three-dimensional relief pattern resulting from the previously described image processes. In certain embodiments, hardened externally-patterned cylinders may be used directly in manufacturing, although the durability may generally not be as good as that of other patterning tools (discussed below). - For the production of a desired pattern in/on a surface of a support cylinder used for forming a replication tool, patterning techniques described herein may additionally make use of precise positioning of the patterning apparatus (laser or e-beam, photomask, image field, embossing tool, etc.) with respect to the substrate or selected surface of the support cylinder. Achieving precision alignment may be facilitated by use of mechanical hardware appropriate for resolution of the desired pattern, with consideration of the mechanical limitations of the system.
- Certain embodiments including those using beams of radiation for writing/recording the desired pattern have additional advantages of being steerable (laser, e-beam) to make small adjustments for more accurately aligning the patterns. In addition to using mechanical hardware appropriate for the resolution of the desired pattern, other techniques can be used to assist in the pattern alignment process, such as interferometry. For example, a desired pattern may be embedded (or pre-written) in the substrate or written directly onto the substrate (by ablation or other techniques that result in an immediately readable pattern.) Optical techniques (e.g., distance or interference fringe measurement, etc.) can be used to correct the position as the patterning device aligns or “stitches” a new pattern with a previous one.
- Once the selected surface of a support cylinder has a desired or predetermined relief pattern, the support cylinder may be used to form a complimentary replica or negative-relief pattern in a durable cylindrical surface of a tool that is suitable for use in preformatting desired media, e.g. optical discs. This replication of the original relief pattern can be accomplished by a number of techniques, including electroless plating, electrolytic plating, electroforming, physical vapor deposition, chemical vapor deposition, epoxy replication, radiation cross-linking, casting, etc. In exemplary embodiments, durable replicas may be created by means of an electrodeposition process, such as nickel electroforming.
-
FIG. 6 is a schematic drawing depicting a cross section of anapparatus 600 for vacuum deposition of a layer on an internal patterned substrate surface of asupport cylinder 601, in accordance with a further embodiment. Thesubstrate 602 with portion that includes a desiredrelief pattern 604 is disposed on a selected surface, e.g., inner, ofsupport cylinder 601. Theapparatus 600 includes avacuum chamber 620 in which asupport cylinder 601 is placed. A sputtering cathode orevaporation wire 630 may be positioned through thebore 603 formed by thesupport cylinder 601. The configuration of theevaporation wire 630 andsupport cylinder 601 facilitates uniform coating of the inner surface of thecylinder 601 with a desired material. - In the case of the internally-patterned
cylinder 601 withsubstrate 602 having aportion 604 containing the desired pattern, the sputtering cathode orwire 630 running in the direction of the cylinder axis can be used to vacuum deposit a conductive (“starting”)layer 605, such as Ni, NiV, or Ag, etc. Such a conductive or startinglayer 605 may be useful for eletroforming/plating embodiments (e.g., shown and described forFIGS. 7A-7B ) to initiate plating of a non-conductive patterned surface. In order to improve the uniformity of the deposition, the source/cathode and/or thecylinder 601 can be rotated and/or translated during the starting layer deposition process. The thickness of thelayer 605 may be selected as desired, e.g., to be sufficient to form a continuous conductive layer on the pattern (typically less than 100 nm). - Metal plating (e.g., electroforming) or electroless deposition may be used to produce durable replication tools in accordance with certain embodiments of the disclosure. In exemplary embodiments, a metal deposition cell such as shown and described for
FIGS. 7A-7B may be used for the formation of replication tools. -
FIG. 7A is a schematic drawing depicting a cross section of anelectrochemical deposition cell 700A for making a durable pattern replication tools having a negative-relief replica of a pattern formed on an inner surface of asupport cylinder 701, in accordance with further embodiments. As shown, asupport cylinder 701 is placed within thedeposition cell 700A. Anouter cylinder 722 of thecell 700A may be sized and adapted to securely hold thesupport cylinder 701 having a relief patter on its inner surface, such as described previously forFIGS. 1 and 2 . First andsecond end disks cylinder 722 to circulate a metal-containing solution suitable for electrochemical or electroless plating. The deposition system 700 may be used to make a durable sleeve with an inverse or negative of the relief pattern on the inner surface of a support cylinder. The resulting durable sleeve may be used for as part of a replication tool, as described herein. A metal containing solution, e.g., aqueous, is circulated within thecell 700A. In the case of electroforming, an electrolyte, e.g., aqueous nickel sulfamate solution, is circulated between anode and cathode surfaces, and a voltage is applied between the two surfaces. This applied voltage results in the deposition of nickel (Ni) metal onto the patterned surface, where the total deposit thickness is determined by the amount of current passed during the deposition process. The details of the electroforming process are well known in the art. In other embodiments of the metal replica formation process, a Ni (or other conductive) layer is deposited by means of electroless deposition, a widely used process in which metals are formed by reduction onto a catalytic or nucleation layer (e.g., silver mirror formation) on the surface to be replicated. Several key variables, including time and temperature, are used to control the thickness of the deposit, which can, for example, range from microns to millimeters, as desired. The details of the electroless deposition process are known in the art. - With continued reference to
FIG. 7A ,system 700A may include a closed recirculating system including areservoir 723 from which a metal-containingsolution 720 is pumped, an in-line filtration system or filter 724 to remove any particulate and other unwanted matter, and heating elements (not shown) by which thereservoir 723 is caused to reach and maintain a desired operating temperature. Thesystem 700A may include suitable pumping and valving means to allow the metal-containing solution to continuously circulate under controlled (and monitored) conditions. Suitable pumping and valving means can include but are not limited to suitable pumps, pipes, valve, and related components. - The metal-containing
solution 720 circulates throughcylinder 722 as part of a plating process. The solution may be heated inreservoir 723 and passed throughfiltration unit 724 before entering the cell atlocation 725. Thesupport cylinder 701 withphotoresist substrate 702 may initially serve as a part (e.g., a boundary wall) of the deposition and fluid recirculation pathway. In exemplary embodiments, thesolution 720 exits the cell at the top outflow pipe 721 and returns toreservoir 723 for reconditioning and recirculation to the cell. One or more non-conductive stop rings 727 may be located on the substrate, e.g., toward one end of the cell, to facilitate definition of the ends of the deposited replica by inhibiting the deposition process at this surface. - A spiral
distribution flow director 726 may, as shown, optionally be present at the bottom of the cell to create a fluid vortex pattern within thecell 700A to facilitate a higher flow velocity near the cylinder wall. Such a flow improvement may facilitate thorough mixing of the solution, as well as dislodging and sweeping away of bubbles or other byproducts or impurities from the inside walls of thecylinder 722. - Also shown in
FIG. 7A is an optionalelectrical circuit 770 for use in exemplary electroplating embodiments. Theelectrical circuit 770 can provide sufficient current paths for electrodeposition of asleeve layer 705 onto the patterned substrate orlayer 702 or patternedsupport cylinder 701 containing the first relief pattern. Theelectrical circuit 770 can include twoelectrodes metal containing solution 720. The inner surface of the pattern-containingsupport cylinder 701 may be coated with a thin layer or coating of electrically conductive material (not shown) forming the first electrode for initiation of electroplating. The thin conductive coating can be achieved by suitable techniques such as vacuum deposition, e.g., as shown and described previously forFIG. 6 , or electroless deposition. The first electrode can be connected viaterminal 774 and appropriate electrical connection(s) to power supply 728. Thesecond electrode 772, e.g., as a nickel assembly, may be positioned withincylinder 722 and may be connected through a terminal 772 and suitable electrical connection(s) topower supply 778. Circulation of theelectrolyte 720 within thecylinder 722 provides an electrical path between the electrodes and the power supply and completes theelectrical circuit 770. In exemplary embodiments, thesecond electrode 772 includes Ni pellets (or solid rod or the like) placed a titanium basket, which in turn is surrounded by a filter bag to retain any particulates produced as byproducts of the electroforming process. - To electroplate the inner surface of the
support cylinder 701 and thereby form a durable sleeve including a replica relief pattern, current passes through the electrolyte solution between the electrodes. In accordance with Faraday's Law, the thickness of the deposited metal (e.g., nickel)layer 705 is proportional to the total charge passed through the cell, as is known in the art of electroplating. The process can be terminated after any length of time, where the thickness of the deposited layer is thereby proportional to the cumulative amount of current passed through the cell, as well as other factors, and which typically may range from a few microns to many millimeters in thickness. When the thickness of the deposit has reached the desired value, such as 0.010 inches for one example, the electrodeposition process may be terminated by removing the voltage, draining and disassembling thecell 700A. -
FIG. 7B is a schematic drawing depicting a cross section of anelectrochemical deposition cell 700B, similar to (and including like numbering)deposition cell 700A ofFIG. 7A .Cell 700B can be used for making durable pattern replication tools withrelief patterns 704 recorded on an external surface of asupport cylinder 701, in accordance with further embodiments of the present disclosure. - The
cylinder 701 includes a desiredfirst relief pattern 704 in asubstrate 702 disposed on an outer surface of thecylinder 701. For the embodiment shown, the externally patternedsupport cylinder 701 is located between a first pair ofend plate solution 720 from entering the cylinder. A second pair ofend plates shaft 751 may also be present to facilitate positioning of the cylinder. - In addition to electroplating and deposition techniques such as those shown and described for
FIGS. 7A-B , a replica of a patterned cylinder can be formed by suitable techniques including casting techniques.FIGS. 8A-D (with like numbering) depictapparatus 800A-D that are suited for casting a polymeric material against the patterned surface to form a tool sleeve for use in replication tools according to exemplary embodiments of the present disclosure. -
FIG. 8A is a schematic drawing depicting a cross section of anapparatus 800A useful for applying a fluid or liquid such as polymer to an internal patterned surface of asupport cylinder 801, in accordance with a further embodiment. For the embodiment shown, a desiredrelief pattern 804 is located within asubstrate 802 disposed on an inner surface of the support cylinder orsleeve 801. Theapparatus 800A, or fixture, can include first and seconds ends 820, 821 for holding thesupport cylinder 801 and a cylindrical shell orsleeve 821. Thecylindrical sleeve 821 may function as holing means for holding the support cylinder relative to the first and second ends 820, 821. The first andsecond end support cylinder 801 andcylindrical sleeve 821 may be configured and arranged in a fluid-tight seal. In such a configuration, a cylindrical fluid passageway is formed through which a desiredfluid 811, such as a curable liquid polymer, can be applied to a patterned surface of thesupport cylinder 801 for forming a replication tool having the complimentary relief pattern. - The
first end 820 of theapparatus 800A can include afirst passageway 870. The first passageway may be configured to receive vacuum from a vacuum supply (shown as 873), and to apply the vacuum to acastable fluid 811 such as a polymeric liquid to draw the fluid 811 over a patterned surface of asupport cylinder 801. Theapparatus 800A can include asecond end 821 for holding thesupport cylinder 801 at an opposite end of the support cylinder than thefirst end 820. Alignment rings 808 and seals 809 may be used for alignment and sealing of thesupport cylinder 801 andcylindrical sleeve 822. In exemplary embodiments,alignment plates shaft 852 may be used for alignment of the support cylinder andcylindrical sleeve 822. - With continued reference to
FIG. 8 , through application of vacuum to the fluid 811, the fluid 811 is caused to flow through thesecond end 821 and over the patterned surface, e.g.,substrate 802 with first desiredrelief pattern 804. By a casting process, asleeve layer 805 including a second desiredrelief pattern 806 complementary to thefirst relief pattern 804 can be formed. - As used for embodiments in accordance with
FIGS. 8A-8D , suitable polymeric materials can include, but are not limited to, a radiation cross-linkable polymer system, such as a material that is curable by application of ultraviolet light. Other suitable materials include, but are not limited to, thermoplastics, which may be injected in the molten state and allowed to cool, or multi-part catalytically/thermally cured materials (“epoxies”) and the like. -
FIG. 8B depicts anapparatus 800B that is similar to 800A except for the inclusion of one ormore radiation sources 860 configured within the cylindrical sleeve or shell 822 to cure a radiation-curable liquid 811. For the embodiment shown, thecylindrical shell 822 is transparent or translucent to the radiation of the source(s) 860. The radiation source operates to irradiate thecurable polymer 811. When the curableliquid polymer 811 is cured and hardened it forms atool sleeve 805 having a complimentary (second) relief pattern to the relief (first)pattern 804 recorded in thesubstrate 802 on thesupport cylinder 801. According to an exemplary embodiments UV-curable polymers are utilized for thelayer 805. - It may be desirable to minimize the amount of polymer adhering to the
second pattern 806 after separation of the durable layer orsleeve 805 from thesupport cylinder 801. The use of polymer/pattern combinations with low intrinsic adhesion to one another, or the use of a “parting” layer can facilitate a minimum amount of adhering polymer or eliminate such altogether. For example, a parting layer could be coated on the master pattern surface and would adhere preferentially to one of the two surfaces. Such a parting layer could be either left in place or removed, e.g., by chemical or plasma stripping, etc. -
FIG. 8C is a schematic drawing depicting a cross section of anapparatus 800C, similar to 800A ofFIG. 8A , but configured and arranged for forming a tool sleeve is formed about an external surface (i.e., in a radial sense) of asupport cylinder 801. Embodiments such as 800C may be used for applying a fluid (e.g., liquid or gas) such as a curable liquid polymer to an external surface of a support cylinder. -
FIG. 8D depicts anapparatus 800D that is similar to 800B except that the one ormore radiation sources 860 are configured on the exterior of thecylindrical shell 822, which itself is configured on the exterior of thesupport cylinder 801.Apparatus 800D may be used for curing a layer such as a polymer that has been applied to an external surface of thesupport cylinder 801, in accordance with exemplary embodiments. For the embodiment shown, thecylindrical shell 822 is transparent or translucent to the radiation of the source(s) 860. In certain embodiments, the initial or master three-dimensional relief pattern may itself be sacrificed or removed (or partially removed) as part of the process to separate the support cylinder from a final tool sleeve. -
FIG. 9A is a schematic drawing depicting a cross section of anapparatus 900A used for chemically stripping a material layer (e.g., photoresist) applied to an internal surface of asupport cylinder 901, in accordance with a further embodiment. Theapparatus 900A, similar toapparatus 200 ofFIG. 2 , can include first and seconds ends 920, 921 for holding thesupport cylinder 901 withsubstrate 902 andfirst relief pattern 904. A chemical that acts as a solvent for the master layer material of thesubstrate 902, but not thereplica 905, may be introduced into the interface, e.g., 934, between the master (substrate 902) andreplica sleeve 905, thereby dissolving master material and producing a gap between the two surfaces. - The
first end 920 includes afirst passageway 970 that is configured to receive a fluid 911, e.g., a photoresist solvent, from a fluid supply 910 (possibly via external piping or passageways 972) and to distribute the afluid 911 for application to asubstrate layer 902 disposed on a selected surface (e.g., the inner surface) of thesupport cylinder 901. Thesecond end 921 may include asecond passageway 971 that is configured to receive the fluid 911, e.g., from withinbore 903, for removal from the selected surface of thesupport cylinder 901. Once removed from thecylinder 901, fluid 911 may be directed to a desired location, e.g., asuitable reservoir 912. The direction offlow 974 is indicated for the configuration shown. Alignment rings 923, 924 may be used to facilitate precise positioning of thesupport cylinder 901 relative to the first and second ends 920, 921 in exemplary embodiments. - A
precision centralizing shaft 952 and precision bearing surface along which the inner or outer element is guided may be used in order to eliminate or minimize contact of the two surfaces during separation as shown inFIG. 9A . A cylindrical sleeve or bearingsurface 922 is placed into contact with thetool sleeve 905 withrelief pattern 906, e.g., as made bysystem 600 ofFIG. 6A . Centralizing disks, or elements, 932, 933 are positioned at opposing ends of thetool sleeve 905.Bearing surface 922 andelement sleeve 905 aboutshaft 952, and thereby prevents damage to the outer pattern of the replica sleeve during the process of separation ofreplica tool sleeve 905 fromcylinder 901. In exemplary embodiments, one ormore seals 909 may be used to facilitate fluid tight sealing between bearingsurface 922,cylinder 901 and theends surface 922 may, in exemplary embodiments, be an expandable arbor, e.g., an inflatable elastomeric device, or a mechanical expansion device, etc. By centering thesleeve 905 and the support cylinder about the same central axis and then separating thesleeve 905 andcylinder 901 apart along the axis of theshaft 952, damage to therelief pattern 906 on thesleeve 905 surface can be prevented or minimized for the separation process, e.g., as shown inFIG. 9B . -
FIG. 9B is a schematic drawing depicting a cross section of portions ofFIG. 900A in a removal process for of a replication tool sleeve from a support sleeve or patterning fixture in accordance with anotherembodiment 900B. After the solution (911 ofFIG. 9A ) has penetrated and dissolved the photoresist, thetool sleeve 905 may be separated by means of sliding assembly of the bearingsurface 922 andelements shaft 952. - To further assist separation, e.g., as shown in
FIG. 9B , the dissolved material can be used as a “lubricant” layer, or alternatively another material designed to lubricate/protect the replica surface can be introduced into the interspace for the separation process. In certain embodiments, a planarizing layer can be first applied to the SCS to increase separation clearance prior to coating of the photoresist layer. Residual photoresist or other contaminant material can be removed from the external patterned surface of the tool by cleaning as necessary. - Separating the
replication tool sleeve 905 from thesupport cylinder 901 may include other techniques such as those relying on differential thermal expansion/contraction between the support cylinder and replication tool sleeve, for example as described forFIGS. 10A-10B . -
FIGS. 10A-10B are schematic drawings depicting cross sections of afurther embodiments 1000A-B that utilize application of a heat flux for separating aninternal replica 1005 withrelief pattern 1006 from a patterning fixture withsupport cylinder 1001 havingsubstrate 1002 andrelief pattern 1004. -
FIG. 10A is a schematic drawing depicting a cross section of anapparatus 1000A including cooling means 1008 and heating means 1009 for separating theinternal replica 1005 from a patterning fixture (or support cylinder) 1001 by differential thermal expansion/contraction, in accordance with a further embodiment. - Cooling mean 1008 such as cooling coils heating means 1009 such as heating elements are included for application of a heat flux (a flow of heat into or out of the adjacent structure/material). Introduction of a heat flux to either or both of the
support cylinder 1001 andreplica sleeve 1005 can cause differential thermal expansion/contraction, causing a radial clearance between thesleeve 1005 andsupport cylinder 1001. For example, simultaneous cooling of the inner component (e.g., support cylinder 1001) and heating of the outer component (e.g., sleeve layer 1004) may be employed to reduce the outer diameter (OD) and increase the inner diameter (ID) of the respective parts, causing the parts to separate due to differential expansion/contraction. - Heating or cooling alone may be used when the respective materials of the support cylinder and first layer have suitable differences in coefficients of thermal expansion. When sufficient clearance has been achieved, the inner and outer elements may be separated, e.g., by using a precision centralizing shaft and precision bearing surface along which the inner or outer element is guided in order to eliminate or minimize contact of the two surfaces. This separation technique applies to both the internal and external replica process.
-
FIG. 10B is a schematic drawing depicting the apparatus ofFIG. 10A with theinternal replica 1001 mounted on a centralizing fixture and partially separated from the outer fixture. The centralizing fixture can includeend element 1020, centralizing shaft, and centralizingelements sleeve 1005 away from thesupport cylinder 1001 for the separation process is indicated by the arrow shown. - After separation, the separated sleeve, e.g.,
sleeve 1005 inFIG. 10B , may be used without further processing as a master drum or replication tool for roll-to-roll (R2R) processes. Alternatively, the separated sleeve may be subjected to post processing, e.g., for cleaning, additional hardening, or application of a release layer to aid in the subsequent R2R process. Such cleaning process may involve rinsing with the appropriate solution(s) to remove residual dissolved photopolymer, electrolyte, lubricant, etc. The cleaning process may also include other cleaning steps, such as chemical stripping (of the parting and/or plating starting layers) or plasma stripping/cleaning etc., or other such cleaning processes. - In accordance with another aspect of this disclosure, the sleeve containing the desired relief pattern may be further treated in order to impart additional benefits in the subsequent manufacturing process. Exemplary embodiments use known radiation or chemical cross-linking techniques to harden the finished patterning tool. Hardening can be beneficial, particularly when the patterned tool includes a polymeric material. For either polymeric tools or metallic tools, or for other types of material as well, post-processing may also be used to assist in reducing adhesion between the tool and the polymer film into which its pattern is being transferred (e.g., embossed).
- Clean separation of the tool and the film is desirable for reducing “clogging” or contamination of the patterning tool. For roll-to-roll (R2R) manufacturing, a useful release overcoat can be achieved by application of specific layers of atmospheric, vacuum, CVD, electrolytic, etc., coating processes. Suitable components for such a release overcoat, include, but are not limited to, PTFE [Teflon®], chrome, gold, inorganic oxide, or other materials. A release overcoat can include appropriate adhesion sublayers that are known to reduce adhesion to polymeric substrates.
- A replication tool sleeve according to embodiment of the present disclosure, e.g.,
FIGS. 1-10 , may be mounted in a rotary manufacturing machine using suitable apparatus and/or techniques. Suitable methods/apparatus may include an expansion arbor bonded to an inner centralizing sleeve using a gap-filling adhesive, or by other suitable methods and/or apparatus. An example of a suitable air-activated, compressed rubber or polymer expansion arbor is shown and described forFIG. 11 . -
FIG. 11 shows areplication tool 1100 according to the present disclosure, including a support fixture and anexpansion arbor 1140. A thick-walled cylindrically-shapedelastomeric insert piece 1140 is inserted intosleeve 1141 overshaft 1142 andcompression nuts 1143 are tightened againstthrust washer 1144 to compresselastomeric insert piece 1140. The resultant shortening of the length of theinsert piece 1140 causes its outer diameter to concomitantly expand, thereby firmly capturing and securingtool sleeve 1141. Removal of thetool sleeve 1141 from the mounting fixture is accomplished by reversing this tightening process. Thefinished tool 1100 may be suitable for use in replication machinery, and may allow rapid changing of the tool sleeve. Thetool 1100 may minimize the potential for contacting or otherwise damaging the outer surface holding therelief pattern 1145 during the mounting process. - The support fixture shown in
FIG. 11 can be used for the extraction of a sleeve (from a deposition cell, e.g.,cell 700B ofFIG. 7B , or support fixture, e.g., 900B shown inFIG. 9B . For example, theinsert piece 1140 may be inserted with the bore formed by the inner surface of the plating forming the replication tool. The associated compression nuts can be tightened so the insert piece 40 is pressed against and holds the replication tool sleeve. - As a portion of the substrate or first layer is removed, e.g., by a suitable solvent or developer, the support fixture holds the
replication tool sleeve 1141 and prevents damage to thepattern 1141 on the outside surface of thetool sleeve 1141, forming a completed replication tool that is suitable to imprint or pre-format desired media such as optical recording media. -
FIG. 12 is a diagram depicting steps in amethod 1200 of fabricating a seamless replication tool according to a further embodiment of the present disclosure. An inner surface of a support cylinder is prepared for holding a desired relief pattern, as described at 1202. - In an exemplary embodiment a light-sensitive polymer in the form of a photoresist fluid, such as previously mentioned, is poured in excess onto the inner wall of the support cylinder from the top opening such that the photoresist completely covers the inner wall below the top opening and is allowed to flow downward by gravity until a continuous film is formed.
- The layer thickness (e.g., as shown by
layer 102 inFIG. 1 ) can be controlled by adjusting the weight ratio of solid material to diluent (solvent) in the photoresist composition. The evaporation of the diluent component of the resist, and hence the drying time, can be modulated as necessary to achieve a smooth surface by control of the ambient temperature or control of the solvent vapor pressure (by, for example, partially scaling the support structure against evaporation), which will effect the thickness and surface quality, among other things, of the photoresist layer. After sufficient drying time, the final preparation of the photoresist may involve heating or baking as required by the particular material. - A desired pattern may be formed or recorded in the substrate as described at 1204. In exemplary embodiments, radiation is applied to the substrate by computer-controlled motion of a movable radiation source producing a laser output within the support cylinder, e.g., as shown and described for
FIGS. 4A-B . - In certain embodiments, translation of a radiation head assembly used at 1204 to apply radiation may be accomplished by means of a linear actuator, which may be controlled by a position controller. Further, in an exemplary embodiment, the support cylinder with photoresist coating can be rotated about its central shaft while simultaneously translating an optical head along the direction of the axis of the cylinder. During this motion, the output of the optical head of an optical source (e.g., laser) can be modulated to produce the desired pattern by exposure of the photoresist. The rotation, translation, and laser control may be synchronized and programmed through master controller device, which may include a programmable logic controller (PLC), or computer, or the like.
- The recording of the desired pattern, described at 1204, may include other sources and configurations of light or radiation delivery and exposure of the photoresist, including the use of gas and/or solid state lasers, electron beams, focused ion beams, light emitting diodes (LEDs), incoherent light sources, fiber optic devices, and the like. Other configurations for recording a desired pattern on the photoresist are also envisioned by this disclosure, including relaying of the beam along the direction of the rotation axis of the cylinder to an assembly which re-directs and focuses the beam to the surface of the photoresist.
- It is also possible that both rotation and translation can be accomplished by movement of only the light head or source (either directly or as relayed by mirrors, etc.), or accomplished by rotation and translation of the cylinder only, or various combinations of the movements of the cylinder and the head or laser.
- A relief pattern may be formed from the desired pattern, as described at 1206. Suitable methods for forming the relief pattern include applying a developer or solvent to the substrate to remove desired portions of the substrate, leaving the desired pattern in relief. Other suitable techniques may be used to recording the desired pattern may be used, such as laser ablating of material deposited on the sleeve surface, etc.
- Continuing with the description of
method 1200, a hard and durable layer (e.g., of a suitable metal) may be applied over the substrate and relief pattern, as described at 1208, to form a durable and seamless replication tool sleeve. This application of the durable layer serves to form a mirror-image or negative relief pattern of the pattern on the substrate in a durable surface that is suitable for use in preformatting optical media. In exemplary embodiments, applying a hard and durable sleeve layer includes forming a continuous layer of electrically conductive material on the substrate of the support cylinder and then plating the substrate by an electroplating or electrodeposition process, e.g., as described forFIG. 7A . - Application of the durable layer may be accomplished by other suitable techniques including, for example, electroless plating, electrolytic plating, electroforming, physical vapor deposition, chemical vapor deposition, epoxy replication, radiation cross-linking, casting, etc. Furthermore, it should be appreciated that any internally-patterned cylinder can be used as the pattern from which the desired tool is produced. Thus for example an internally-patterned Ni cylinder can be used to produce an externally-patterned Ni tool.
- In exemplary embodiments, apparatus according to the embodiment described for
FIG. 7A may be used for an electrodeposition process at 1208. For an electrodeposition process, the patterned surface of the resist may be made electrically conductive in order to serve as an electrode in the electrical circuit. Creation of a conductive surface over the (non-conductive) photoresist pattern can be achieved by suitable techniques including, for example, vacuum deposition, chemical reduction, chemical vapor deposition, etc. Such a conductive layer can be made of silver, gold, chrome, nickel, or any compatible conductive material or alloy, and is of such a thickness so as to ensure an electrically continuous layer, as necessary to obtain faithful pattern reproduction in the electroforming process. In other embodiments, the durable replica may be made by electroless deposition techniques, for example, electroless deposition of nickel (Ni) by immersion, etc. - After the durable layer including the negative relief pattern is made, the durable layer or sleeve may be removed or separated from the support cylinder, as described at 1210. In an exemplary embodiment, a centralizing element (e.g.,
element 1052 inFIG. 10B ) and end element (e.g.,element 1020 inFIG. 10B ) may be used to hold the sleeve and support cylinder. This is one of several possible embodiments of an assembly that insures precise alignment of the axes of the sleeve in the cylinder, which thereby prevents damage to the outer pattern of the replica during the process of separation of replica tool from cylinder. - The step of separating 1210 the durable layer from the support cylinder may include introducing a suitable solvent (e.g., a photoresist solvent or photoresist developer) to the space between the outer tool surface and the inner wall of the support sleeve (the space occupied by the photoresist, e.g.,
region 934 inFIG. 9A ). After the solution has penetrated and dissolved the photoresist, the tool sleeve may be separated by a sliding assembly on the shaft. Any residual photoresist or other contaminant material can be removed from the external patterned surface of the replication tool by cleaning as necessary. - By centering the sleeve and the support cylinder about the same central axis and then separating the sleeve and cylinder apart along this axis, damage to the relief pattern on the sleeve surface can be prevented or minimized for the separation process. Separating the replication tool from the support cylinder may include cooling or heating the support cylinder or replication tool to cause differential expansion between the supports cylinder and replication tool. An expandable arbor, e.g., an inflatable elastomeric device or a mechanical expansion device, etc., or other mounting fixture may be used for the separation process.
- The seamless replication tool sleeve may be mounted on a support fixture, as described at 1212, to form a replication tool for imprinting the relief pattern on a desired medium, such as used for optical recording and data storage media. In an exemplary embodiment, a thick-walled cylindrically-shaped elastomeric insert piece, e.g.,
piece 1140 ofFIG. 11 , may be inserted into the bore formed by the inner surface of the durable layer of the replication tool. The insert piece may be placed around a support shaft. Compression nuts may be tightened against respective thrust washers to compress an elastomeric insert piece. The resultant shortening of the length of the insert piece causes its outer diameter to concomitantly expand, thereby firmly capturing and securing the tool sleeve. Removal of the tool from the mounting fixture is accomplished by reversing this tightening process. -
FIG. 13 is a process flow chart for the formation of replication tool according to the present disclosure for both external and internal master drums. As is indicated inFIG. 13 , embodiments of the present disclosure can provide the ability to fabricate one or more master drums or replication tools from a single, original master pattern, whether internal or external type. This ability cab be particularly beneficial for the production of a number of identical replication sleeves, or when the “turn-around” time for producing another master pattern is too long or the cost too high to be viable for the production process. -
FIG. 13 is a process flow diagram illustrating theformation 1300 of multiple replica patterning sleeves and replication tools, in accordance with embodiments of the present disclosure. The pattern formed (e.g., 1302, 1306) may be used in a roll-to-roll (R2R) replication process directly and without regard as to whether an intermediary replication process was involved. - The
process 1300 can start with either a negative internal pattern (i.e., external master pattern) 1302 or a positiveinternal pattern 1304, where positive refers to the geometry being that of the master pattern and the finished replica (tool sleeve) having the same symmetry when viewed from the patterned surface. A positiveinternal pattern 1304 can be formed directly from a patterned internal surface of a support cylinder, e.g.,cylinder 401 ofFIG. 4A , or as a result of replication of a negative internal drum, e.g.,drum 1302. Similarly, a negativeinternal pattern 1302 can be formed directly from a patterned external surface of a support cylinder, e.g.,cylinder 401 ofFIG. 4B , or as a result of replication of a negative external drum, e.g.,drum 1304 using methods/apparatus of the present disclosure. - Positive
internal pattern 1304 can be used to form a number of negative internal drums, e.g.,drum 1306, by formation methods/apparatus according to the present disclosure, e.g., shown and described forFIGS. 2-12 . In exemplary embodiments, Ni deposition methods/apparatus, e.g., shown and described forFIGS. 4A-B , can be used to form a negative internal drum 1310. In further exemplary embodiments, polymer application methods/apparatus, e.g., shown and described forFIG. 8A-D , can be used to form a negative internal drum 1310. -
Drum 1306 may be separated fromdrum 1304 by suitable methods/apparatus according to the present disclosure. For example, thermal differential expansion/contraction shown and described forFIGS. 10A-B may be used for the separation ofdrum 1306 fromdrum 1304. In exemplary embodiments including polymers or polymeric compounds, chemical stripping may be used to dissolve portions of such for the removal ofdrum 1304. - Accordingly, the previous descriptions illustrate that embodiments of the present disclosure provide durable seamless replication tools useful for the replication of desired relief patterns on recording media, or data storage substrates, including optical recording media. Replication tools according to exemplary embodiments may include desired relief patterns with features on a micron and/or nanometer scale. Further embodiments of the present disclosure may provide methods and/or apparatus for fabricating such seamless replication tools.
- While certain embodiments have been described herein, others may be practiced within the scope of the present disclosure. For example, in addition to the embodiments described previously, a tool sleeve can be affixed to a support insert by suitable adhesives to bond the inner tool surface to the outer surface of a centralized sleeve, brazing or welding, press-fitting, thermal shrink-fitting, etc. Furthermore, while an optical head with a laser inside of a support cylinder has been described, a desired pattern on (or in) photoresist may be recorded by other suitable techniques, including relaying of an optical beam along the direction of the rotation axis of a support cylinder to an assembly which re-directs and focuses the beam on the surface of the photoresist.
- It is also possible that both rotation and translation can be accomplished by movement of only the light source (either directly or as relayed by mirrors, etc.), or accomplished by rotation and translation of the cylinder only, or various combinations of the movements of the cylinder and the head or laser. Moreover, it will be appreciated that, although certain embodiments have been described herein in the context of imprinting structures on data storage substrates, embodiments of the present disclosure may be used for other applications including, but not limited to, holographic replication, microimprint, and nanoimprint lithography and microscopic printing processes, to name a few examples.
- Moreover, while the previous description has included reference to seamless cylindrical substrates (SCS) and support cylinders that are in the form of circular cylinders, the scope of the present disclosure includes SCS and support cylinders having other types of cylindrical shapes, e.g., elliptical cylinders.
- Accordingly, the methods, systems, and apparatus of the present disclosure may be embodied in other specific forms without departing from the spirit thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the disclosure being indicated by the appended claims rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (7)
1. A replication tool comprising:
a sleeve having an outer durable surface defined by a first diameter and an inner surface defined by a second diameter, the inner surface forming a bore, wherein the sleeve has a height along a longitudinal axis perpendicular to the inner and outer diameters;
a relief pattern disposed on the outer surface of the sleeve, wherein the relief pattern includes a seamless three-dimensional pattern; and
a mounting fixture for supporting the sleeve in rotation as the outer surface of the sleeve is pressed against a substrate.
2. The tool of claim 1 , wherein the mounting fixture comprises:
a support shaft extending though the bore of the sleeve;
an elastomeric insert configured for insertion into the bore of the support cylinder and about the support shaft; and
a compression assembly arranged so as to compress the elastomeric insert in a direction along the longitudinal axis of the support cylinder to expand the insert along the inner diameter of the support cylinder.
3. The tool of claim 2 , wherein the compression assembly includes:
threads on the support shaft;
a pair of thrust washers configured to receive the support shaft, one washer at each end of the sleeve; and
a pair of compression nuts configured for threaded connection to the threads of the support shaft, one compression nut at each end of the sleeve, wherein rotation of each compression nut in one direction tightens the nut against the adjacent thrust washer and rotation in the opposite direction loosens the nut against the thrush washer.
4. The tool of claim 1 , wherein the relief pattern includes desired features of micron-scale size.
5. The tool of claim 1 , wherein the relief pattern includes features of nanometer-scale size.
6. The tool of claim 1 , wherein the mounting fixture comprises an expandable arbor.
7. The tool of claim 1 , wherein the mounting fixture comprises a rigid sleeve having an outer surface adapted to the bore of the sleeve to hold the sleeve against rotational movement relative to the mounting fixture.
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US12/947,132 US20110064838A1 (en) | 2005-01-21 | 2010-11-16 | Replication tools and related fabrication methos and apparatus |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64571405P | 2005-01-21 | 2005-01-21 | |
US11/337,013 US7674103B2 (en) | 2005-01-21 | 2006-01-20 | Replication tools and related fabrication methods and apparatus |
US77713806P | 2006-02-27 | 2006-02-27 | |
US11/509,288 US7833389B1 (en) | 2005-01-21 | 2006-08-24 | Replication tools and related fabrication methods and apparatus |
US12/947,132 US20110064838A1 (en) | 2005-01-21 | 2010-11-16 | Replication tools and related fabrication methos and apparatus |
Related Parent Applications (1)
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US11/509,288 Division US7833389B1 (en) | 2004-01-21 | 2006-08-24 | Replication tools and related fabrication methods and apparatus |
Publications (1)
Publication Number | Publication Date |
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US20110064838A1 true US20110064838A1 (en) | 2011-03-17 |
Family
ID=39107707
Family Applications (2)
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---|---|---|---|
US11/509,288 Active 2029-01-12 US7833389B1 (en) | 2004-01-21 | 2006-08-24 | Replication tools and related fabrication methods and apparatus |
US12/947,132 Abandoned US20110064838A1 (en) | 2005-01-21 | 2010-11-16 | Replication tools and related fabrication methos and apparatus |
Family Applications Before (1)
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US11/509,288 Active 2029-01-12 US7833389B1 (en) | 2004-01-21 | 2006-08-24 | Replication tools and related fabrication methods and apparatus |
Country Status (3)
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US (2) | US7833389B1 (en) |
CA (1) | CA2661767A1 (en) |
WO (1) | WO2008024947A2 (en) |
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US20110210480A1 (en) * | 2008-11-18 | 2011-09-01 | Rolith, Inc | Nanostructures with anti-counterefeiting features and methods of fabricating the same |
WO2018108579A1 (en) * | 2016-12-14 | 2018-06-21 | Amo Gmbh | Device and method for producing large-area periodic nanostructures on an extensive substrate by means of a nanoimprint method |
Also Published As
Publication number | Publication date |
---|---|
CA2661767A1 (en) | 2008-02-28 |
US7833389B1 (en) | 2010-11-16 |
WO2008024947A3 (en) | 2008-12-31 |
WO2008024947A2 (en) | 2008-02-28 |
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