US20050274693A1 - Device and method for lithography - Google Patents

Device and method for lithography Download PDF

Info

Publication number
US20050274693A1
US20050274693A1 US11123087 US12308705A US2005274693A1 US 20050274693 A1 US20050274693 A1 US 20050274693A1 US 11123087 US11123087 US 11123087 US 12308705 A US12308705 A US 12308705A US 2005274693 A1 US2005274693 A1 US 2005274693A1
Authority
US
Grant status
Application
Patent type
Prior art keywords
radiation
layer
template
substrate
recited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11123087
Inventor
Babak Heidari
Marc Beck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Obducat AB
Original Assignee
Obducat AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3647Bags, bleeder sheets or cauls for isostatic pressing membranes, diaphragms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds

Abstract

Apparatus and method for transferring a pattern from a template (10) having a structured surface to a substrate (12) carrying a surface layer of a radiation polymerisable fluid (14). The apparatus comprises a first main part (101) and a second main part (102) having opposing surfaces (104;105), means for adjusting a spacing (115) between said main parts, support means (106) for supporting said template and substrate in mutual parallel engagement in said spacing with said structured surface facing said surface layer, a radiation source (110) devised to emit radiation into said spacing. A cavity (115) has a first wall comprising a flexible membrane (113) devised to engage said template or substrate, and means (114;116) are provided for applying an adjustable overpressure to a medium present in said cavity, whereby an even distribution of force is obtained over the whole of the contact surface between the substrate and the template. The apparatus further includes a heater device having a surface facing said spacing, for heating either fluid layer (14).

Description

    FIELD OF THE INVENTION
  • The invention relates to a device in connection with the lithography of structures on a micro or nanometre scale. In particular, the invention relates to imprint lithography on substrates or objects.
  • BACKGROUND
  • The trend in microelectronics, as well as in micromechanics, is towards ever smaller dimensions. Some of the most interesting techniques for fabrication of micro and submicro structures include different types of lithography.
  • Photolithography typically involves the steps of coating a substrate with a photoresist material to form a resist layer on a surface of the substrate. The resist layer is then exposed to radiation at selective portions, preferably by using a mask. Subsequent developing steps remove portions of the resist, thereby forming a pattern in the resist corresponding to the mask. The removal of resist portions exposes the substrate surface, which may be processed by e.g. etching, doping, or metallisation. For fine scale replication, photolithography is limited by diffraction, which is dependent on the wavelength of the radiation used. For fabrication of structures on a scale of less than 50 nm, such a short wavelength is needed that the material requirements on the optical systems will be major.
  • An alternative technique is imprint technology. In an imprint lithography process, a substrate to be patterned is covered by a mouldable layer. A pattern to be transferred to the substrate is predefined in three dimensions on a stamp or template. The stamp is brought into contact with the mouldable layer, and the layer is softened, preferably by heating. The stamp is then pressed into the softened layer, thereby making an imprint of the stamp pattern in the mouldable layer. The layer is cooled down until it hardens to a satisfactory degree followed by detachment and removal of the stamp. Subsequent etching may be employed to replicate the stamp pattern in the substrate. The steps of heating and cooling the combined stamp and substrate can bring about movement in the engaging surfaces due to heat expansion. The larger the area to be imprinted, the larger the actual expansion and contraction, which can make the imprint process more difficult for larger surface areas.
  • A different form of imprint technology, generally known as step and flash imprint lithography has been proposed by Willson et al. in U.S. Pat. No. 6,334,960, and also by Mancini et al in U.S. Pat. No. 6,387,787. Similar to the imprint technique briefly described above, this technique involves a template having a structured surface defining a pattern to be transferred to a substrate. The substrate is covered by a layer of polymerisable fluid, into which layer the template is pressed such that the fluid fills recesses in the pattern structure. The template is made from a material which is transparent to a radiation wavelength range which is usable for polymerising the polymerisable fluid, typically UV light. By applying radiation to the fluid through the template, the fluid is solidified. The template is subsequently removed, after which the pattern thereof is replicated in the solid polymer material layer made from the polymerised fluid. Further processing transfers the structure in the solid polymer material layer to the substrate.
  • WO 02/067055 to Board of Regents, the University of Texas System, discloses a system for applying step and flash imprint lithography. Among other things, this document relates to production-scale implementation of a step and flash apparatus, also called a stepper. The template used in such an apparatus has a rigid body of transparent material, typically quartz. The template is supported in the stepper by flexure members, which allow the template to pivot about both X and Y axes, which are mutually perpendicular in a plane parallel to the substrate surface to be imprinted. This mechanism also involves a piezo actuator for controlling parallelism and the gap between the template and the substrate. Such a system is, however, not capable of handling large area substrate surfaces in a single imprint step. A step and flash system offered on the market is the IMPRIO 100, provided by Molecular Imprints, Inc, 1807-C West Braker Lane, Austin, Tex. 78758, U.S.A. This system has a template image area of 25×25 mm, and a street width of 0.1 mm. Although this system is capable of handling substrate wafers of up to 8 inches, the imprint process has to be repeated by lifting the template, moving it sideways, and lowering it to the substrate again, by means of an X-Y translation stage. Furthermore, for each such step, renewed alignment as well as new deposition of polymerisable fluid has to be performed. This technique is therefore very time-consuming, and less than optimum for large scale production. Furthermore, besides problems of repeated alignment errors, and high accuracy demands on the translation stage, this technique suffers from the drawback that continuous structures which are larger than said template size cannot be produced. All in all, this means the productions costs may be too high to make this technique interesting for large scale production of fine structure devices.
  • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide methods and means for improving fabrication of structures comprising three-dimensional features on a micro or nanometre scale. In particular, it is an object to provide improved methods and means for transferring a pattern of such structures to substrates having widths of more than one inch, and even for 8 inch diameters, 12 inch diameters, and larger. An aspect of this object is to provide an apparatus and an associated process which is more cost effective and more versatile.
  • According to a first aspect, this object is fulfilled by an apparatus for transferring a pattern from a template having a structured surface to a substrate carrying a surface layer of a radiation polymerisable fluid, said apparatus comprising a first main part and a second main part having opposing surfaces, means for adjusting a spacing between said main parts, support means for supporting said template and substrate in mutual parallel engagement in said spacing with said structured surface facing said surface layer, a radiation source devised to emit radiation into said spacing, a cavity having a first wall comprising a flexible membrane devised to engage said template or substrate, means for applying an adjustable overpressure to a medium present in said cavity, and a heater device having a surface facing said spacing. Due to the flexible membrane, an absolutely even distribution of force is obtained over the whole of the contact surface between the substrate and the template, whereby patterning of large area substrates in a single imprint step is made possible.
  • Preferably, said radiation source is positioned in said first main part, devised to emit radiation into said spacing from a first direction, and said heater device is positioned in said second main part, having said surface of the heater device facing said spacing from a second direction, opposite said first direction.
  • In one embodiment, said heater device comprises a heating element, connected to an energy source.
  • In one embodiment, said heater device comprises a cooling element, connected to a cooling source.
  • Preferably, said medium comprises a gas or a liquid.
  • In one embodiment, said medium comprises air.
  • In one embodiment, said means for applying an adjustable overpressure is arranged to adjust the pressure to 1-500 bar.
  • Preferably, said cavity is defined by a part of the surface of said first main part, a flexible seal member arranged in and protruding from said first main part surface, and said membrane which engages said seal member.
  • In a preferred embodiment, said membrane is disconnectable from said seal member, and devised to engage said seal member by application of pressure from said second main part.
  • Preferably, said membrane is transparent to a wavelength range of said radiation, said radiation source being positioned behind said membrane.
  • In one embodiment, said membrane and at least a portion of said surface of said first main part is transparent to a wavelength range of said radiation, said radiation source being positioned behind said portion of said surface of said first main part.
  • In a preferred embodiment, said portion of said surface of said first main part is made from quartz, calcium fluoride or any other pressure stable material being transparent to said radiation.
  • Preferably, said radiation source is devised to emit radiation at least in a wavelength range of 100-500 nm.
  • In a preferred embodiment, said radiation source is air-cooled and devised to emit pulsating radiation with a pulse duration of 0.5-10 μs and a pulse rate of 1-10 pulses per second.
  • In one embodiment, said membrane consists of a polymer material.
  • In a preferred embodiment, said membrane has a diameter or width of 50-1000 mm.
  • In one embodiment, said substrate acts as said membrane.
  • According to a second aspect, the object of the present invention is fulfilled by a method for transferring a pattern from a template having a structured surface to a substrate carrying a surface layer of a radiation polymerisable fluid, comprising the steps of:
    • arranging said template and substrate mutually parallel in an imprint apparatus, with said structured surface facing said surface layer, between a stop member and a first side of a flexible membrane;
    • heating said surface layer by means of a heater device in said imprint apparatus;
    • applying an overpressure to a medium present on a second side of the membrane, opposite to said first side, for imprinting said pattern into said layer; and
    • exposing said layer to radiation for solidifying said layer.
  • In a preferred embodiment, the method further comprises the step of:
    • baking said layer by providing heat from said heater device after said step of exposing said layer to radiation.
  • Preferably, said medium comprises a gas or a liquid.
  • In one embodiment, said medium comprises air.
  • Preferably, the method comprises the step of:
    • placing said membrane in direct engagement with said template or said substrate.
  • In a preferred embodiment, the method comprises the step of:
    • clamping said membrane at a peripheral portion thereof between said stop member and a seal member, thereby defining a peripheral wall for a cavity for said medium.
  • Preferably, the method comprises the steps of:
    • emitting radiation to said layer through said template, which template is transparent to a wavelength range of a radiation usable for polymerising said fluid; and
    • heating said substrate by direct contact with said heater device.
  • Alternatively, the method may comprise the steps of:
    • emitting radiation to said layer through said substrate, which substrate is transparent to a wavelength range of a radiation usable for polymerising said fluid; and
    • heating said template by direct contact with said heater device.
  • In a preferred embodiment, the method comprises the step of:
    • emitting radiation to said layer through said membrane, which membrane is transparent to a wavelength range of a radiation usable for polymerising said fluid.
  • Preferably, the method comprises the step of:
    • emitting radiation to said layer through said membrane, and through a transparent wall opposing said membrane, defining a back wall for a cavity for said medium, which back wall and membrane are transparent to a wavelength range of a radiation usable for polymerising said fluid.
  • In one embodiment, the step of exposing said layer comprises the step of:
    • emitting radiation from a radiation source within a wavelength range of 100-500 nm.
  • In a preferred embodiment, the method comprises the steps of:
    • air-cooling said radiation source, and emitting pulsating radiation with a pulse duration in the range of 0.5-10 μs and a pulse rate in the range of 1-10 pulses per second.
  • In one embodiment, the method comprises the step of:
    • using said substrate as said membrane.
  • In another embodiment, the method comprises the step of:
    • clamping said substrate and template together prior to arranging said template and substrate between said stop member and said flexible membrane.
  • In yet another embodiment, the method comprises the step of:
    • applying a vacuum between said template and said substrate in order to extract air inclusions from said surface layer prior to exposing said layer to radiation.
  • According to a third aspect, the object of the present invention is fulfilled by a method for transferring a pattern from a template having a structured surface to a substrate carrying a surface layer of a radiation polymerisable fluid, wherein said template includes protrusions defining a pattern, which protrusions have non-transparent layers at outer ends, comprising the steps of:
    • arranging said template and substrate mutually parallel in an imprint apparatus, with said structured surface facing said surface layer, between a stop member and a first side of a flexible membrane;
    • heating said surface layer by means of a heater device in said imprint apparatus;
    • applying an overpressure to a medium present on a second side of the membrane, opposite to said first side, for imprinting said pattern into said layer; and
    • exposing said layer to radiation for solidifying said layer at portions between said protrusions.
  • In a preferred embodiment, the method further comprises the step of:
    • baking said layer by providing heat from said heater device after said step of exposing said layer to radiation.
    BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention will be described in greater detail below with reference to the accompanying drawings, on which:
  • FIGS. 1-3 schematically illustrate the main process steps for transferring a pattern from a template to a substrate, wherein radiation is applied through a transparent template to solidify a polymerisable fluid on the substrate surface;
  • FIGS. 4-6 schematically illustrate corresponding process steps for transferring a pattern from a template to a substrate, wherein radiation is applied through a transparent substrate to solidify a polymerisable fluid on the substrate surface;
  • FIG. 7 schematically illustrates an embodiment of an apparatus according to the invention, for performing the process as generally described in FIGS. 1-3 or 4-6;
  • FIG. 8 schematically illustrates the apparatus of FIG. 7, when loaded with a template and a substrate at an initial step of the process;
  • FIG. 9 illustrates the apparatus of FIGS. 7 and 8, at an active process step of transferring a pattern from the template to the substrate; and
  • FIGS. 10-12 illustrates an alternative embodiment of an imprint process according to the present invention.
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • The present invention relates, in general, to a method of transferring a pattern from a template to a substrate, by creating a relief image of a structure on a surface of the template on a surface of the substrate. The surface of the template and the surface of the substrate are in this process arranged generally parallel to each other, and the transfer of the pattern is obtained by pressing the structured template surface into a formable layer disposed on the substrate surface. The formable layer is treated to solidify, such that its shape is forced to resemble the template surface. The template can thereafter be removed from the substrate and its layer, said layer now being an inverted topographical replica of the template. In order to permanent the transferred pattern in the substrate, further processing may be required. Typically, wet or dry etching is performed to selectively etch the surface of the substrate under the solidified layer, whereby the pattern in the solidified layer is transferred to the substrate surface. This much is state of the art, and is well described in prior art documents, such as the aforementioned U.S. Pat. No. 6,334,960.
  • FIGS. 1-3 schematically present the basic process steps of the actual pattern transfer steps, or imprint steps, of an embodiment of the invention.
  • In FIG. 1 a template 10 is illustrated, the template having a structured surface 11, in which three-dimensional protrusions and recesses are formed with a feature size in height and width within a range of 1 nm to several μm, and potentially both smaller and larger. The thickness of template 10 is typically between 10 and 1000 μm. A substrate 12 has a surface 17 which is arranged substantially parallel to template surface 11, with an intermediate spacing between the surfaces at the initial stage shown in FIG. 1. The substrate 12 comprises a substrate base 13, to which the pattern of template surface 11 is to be transferred. Though not shown, the substrate may also include a support layer below the substrate base 13. In a process where the pattern of template 10 is to be transferred to substrate 12 directly through an imprint in a polymerisable fluid, said fluid may be applied as a surface layer 14 directly onto the substrate base surface 17. In alternative embodiments, indicated by the dashed line, a transfer layer 15 is also employed, of e.g. a polymer. Examples of such, and how they are used in the subsequent process of transferring the imprinted pattern to the substrate base 13, are also described in U.S. Pat. No. 6,334,960. In an embodiment including a transfer layer 15, substrate surface 17 denotes the upper or outer surface of the transfer layer 15, which in turn is arranged on the substrate base surface 18.
  • Substrate 12 is positioned on a heater device 20. Heater device 20 preferably comprises a heater body 21 of metal, e.g. aluminium. A heater element 22 is connected to or included in heater body 21, for transferring thermal energy to heater body 21. In one embodiment, heater element 22 is an electrical immersion heater inserted in a socket in heater body 21. In another embodiment, an electrical heating coil is provided inside heater body 21, or attached to a lower surface of heater body 21. In yet another embodiment, heating element 22 is a formed channel in heater body 21, for passing a heating fluid through said channel. Heater element 22 is further provided with connectors 23 for connection to an external energy source (not shown). In the case of electrical heating, connectors 23 are preferably galvanic contacts for connection to a current source. For an embodiment with formed channels for passing a heating fluid, said connectors 23 are preferably conduits for attachment to a heated fluid source. The heating fluid may e.g. be water, or an oil.
  • Heater body 21 is preferably a piece of cast metal, such as aluminium, stainless steel, or other metal. Furthermore, a body 21 of a certain mass and thickness is preferably used such that an even distribution of heat at an upper side of heater device 20 is achieved, which upper side is connected to substrate 12 for transferring heat from body 21 through substrate 12 to heat layer 14. For an imprint process used to imprint 2.5″ substrates, a heater body 21 of at least 2.5″ diameter, and preferably 3″ or more, is used, with a thickness of at least 1 cm, preferably at least 2 or 3 cm. For an imprint process used to imprint 6″ substrates, a heater body 21 of at least 6″ diameter, and preferably 7″ or more, is used, with a thickness of at least 2 cm, preferably at least 3 or 4 cm. Heater device 20 is preferably capable of heating heater body 21 to a temperature of 200-300° C., though lower temperatures will be sufficient for most processes.
  • For the purpose of providing controlled cooling of layer 14, heater device 20 is further provided with a cooling element 24 connected to or included in heater body 21, for transferring thermal energy from heater body 21. In a preferred embodiment, cooling element 24 comprises a formed channel or channels in heater body 21, for passing a cooling fluid through said channel or channels. Cooling element 24 is further provided with connectors 25 for connection to an external cooling source (not shown). Preferably, said connectors 25 are conduits for attachment to a cooling fluid source. Said cooling fluid is preferably water, but may alternatively be an oil, e.g. an insulating oil, or any other suitable coolant.
  • Examples of available and usable polymerisable or curable fluids for layer 14 comprise NIP-K17 and NIP-K22 from ZEN Photonics, 104-11 Moonj i-Dong, Yusong-Gu, Daejeon 305-308, South Korea. NIP-K17 has a main component of acrylate, and has a viscosity at 25° C. of about 9.63 cps. NIP-K22 also has a main component of acrylate, and a viscosity at 25° C. of about 5.85 cps. Both substances are devised to cure under exposure to ultraviolet radiation above 12 mW/cm2 for 2 minutes.
  • Another example of an available and usable polymerisable fluid for layer 14 is Ormocore from Micro Resist Technology GmbH, Koepenicker Strasse 325, Haus 211, D-12555 Berlin, Germany. This substance has a composition of inorganic-organic hybrid polymer, unsaturated, with a 1-3% photopolymerisation initiator. Viscosity is 3-8 mPas at 25° C., and the fluid may be cured under exposure of radiation with 500 mJ/cm2 at a wavelength of 365 nm. Other examples of polymerisable materials are mentioned in U.S. Pat. No. 6,334,960.
  • The thickness of layer 14 when deposited on the substrate surface is typically 10 nm-10 μm, depending on application area. The polymerisable fluid may be applied by spin coating, roller coating, dip coating or similar. A typical advantage with the present invention, compared to the prior art step and flash method, is that the polymer fluid may be spin coated on the entire substrate, which is an advantageous and fast process. The step and flash method, on the other hand, has to use repeated dispensation by dripping on repeated surface portions, since that method is incapable of handling large surfaces in single steps.
  • The arrows of FIG. 1 illustrate that the template surface 11 is pressed into surface 16 of the polymerisable fluid layer 14. At this step, heater device 20 is preferably used to control the temperature of layer 14, for obtaining a suitable viscosity in the material of layer 14.
  • FIG. 2 illustrates how the structures of template surface 11 has made an imprint in the fluid layer 14, at which the fluid has been forced to fill the recesses in template surface 11. In the illustrated embodiment, the highest protrusions in template surface 11 do not penetrate all the way down to substrate surface 17. This may be beneficial for protecting the substrate surface 17, and particularly the template surface 11, from damage. However, in alternative embodiments, such as one including a transfer layer, imprint may be performed all the way down to transfer layer surface 17. In the embodiment illustrated in FIGS. 1-3, the template is made from a material which is transparent to radiation 19 of a predetermined wavelength or wavelength range, which is usable for solidifying a selected polymerisable fluid. Such materials may e.g. be quartz or various forms of polymers, dependent on the radiation wavelength. Radiation 19 is typically applied when template 10 has been pressed into fluid layer 14 with a suitable alignment between template 10 and substrate 12. When exposed to this radiation 19, solidification of the polymerisable fluid is initiated, for solidification to a solid body 14′ taking the shape determined by the template 10. However, heater device 20 is preferably used to provide heat to layer 14′, for baking layer 14′ to a solid body before separation of template 10 and substrate 12.
  • The template 10 is thereafter removed, e.g. by a peeling and pulling process. The formed and solidified polymer layer 14′ remains on the substrate 12. The various different ways of further processing of the substrate and its layer 14′ will not be dealt with here in any detail, since the invention as such is neither related to such further processing, nor is it dependent on how such further processing is achieved.
  • FIGS. 4-6 schematically present the basic process steps of the actual pattern transfer steps, or imprint steps, of an alternative embodiment of the invention. The only real difference from the embodiment of FIGS. 1-3 is that in this embodiment the radiation 19 is applied through substrate 12 instead of through template 10, while the same reference marks have been used. Furthermore, heater device 20 is instead connected to template 10, for heating layer 14 through template 10. Heater device 20 of FIGS. 4-6 otherwise comprises the same features as the heater device of FIGS. 1-3, wherefore the same reference markings have been used. No further explanation of the features of FIGS. 4-6 will therefore be made.
  • FIG. 7 schematically illustrates a preferred embodiment of an apparatus according to the present invention, also usable for carrying out an embodiment of the method according to the present invention. It should be noted that this drawing is purely schematic, for the purpose of clarifying the different features thereof. In particular, dimensions of the different features are not on a common scale.
  • The apparatus 100 comprises a first main part 101 and a second main part 102. In the illustrated preferred embodiment these main parts are arranged with the first main part 101 on top of second main part, with an adjustable spacing 103 between said main parts. When making a surface imprint by a process as illustrated in FIGS. 1-6, it may be of great importance that the template and the substrate are properly aligned in the lateral direction, typically called the X-Y plane. This is particularly important if the imprint is to be made on top of or adjacent to a previously existing pattern in the substrate. However, the specific problems of alignment, and different ways of overcoming them, are not addressed herein, but may of course be combined with the present invention when needed.
  • The first, upper, main part 101 has a downwards facing surface 104, and the second, lower, main part 102 has an upwards facing surface 105. Upwards facing surface 105 is, or has a portion that is, substantially flat, and which is placed on or forms part of a plate 106 which acts as a support structure for a template or a substrate to be used in an imprint process, as will be more thoroughly described in conjunction with FIGS. 8 and 9. A heater body 21 is placed on plate 106, or forms part of plate 106. Heater body 21 forms part of a heater device 20, and includes a heating element 22 and preferably also a cooling element 24, as shown in FIGS. 1-6. Heating element 22 is connected through connectors 23 to a energy source 26, e.g. an electrical power supply with current control means. Furthermore, cooling element 24 is connected through connectors 25 to a cooling source 27, e.g. a cooling fluid reservoir and pump, with control means for controlling flow and temperature of the cooling fluid.
  • Means for adjusting spacing 103 are, in the illustrated embodiment, provided by a piston member 107 attached at its outer end to plate 106. Piston member 107 is displaceably linked to a cylinder member 108, which preferably is held in fixed relation to first main part 101. As is indicated by the arrow in the drawing, the means for adjusting spacing 103 are devised to displace second main part 102 closer to or farther from first main part 101, by means of a movement substantially perpendicular to the substantially flat surface 105, i.e. in the Z direction. Displacement may be achieved manually, but is preferably assisted by employing either a hydraulic or pneumatic arrangement. The illustrated embodiment may be varied in a number of ways in this respect, for instance by instead attaching plate 106 to a cylinder member about a fixed piston member. It should further be noted that the displacement of second main part 102 is mainly employed for loading and unloading the apparatus 100 with a template and a substrate, and for arranging the apparatus in an initial operation position. The movement of second main part 102 is, however, preferably not included in the actual imprint process as such in the illustrated embodiment, as will be described.
  • First main part 101 comprises a peripheral seal member 108, which encircles surface 104. Preferably, seal member 108 is an endless seal such as an o-ring, but may alternatively be composed of several interconnected seal members which together form a continuous seal 108. Seal member 108 is disposed in a recess 109 outwardly of surface 104, and is preferably detachable from said recess. The apparatus further comprises a radiation source 110, in the illustrated embodiment disposed in the first main part 101 behind surface 104. Radiation source 110 is connectable to a radiation source driver 111, which preferably comprises or is connected to a power source (not shown). Radiation source driver 111 may be included in the apparatus 100, or be an external connectable member. A surface portion 112 of surface 104, disposed adjacent to radiation source 110, is formed in a material which is transparent to radiation of a certain wavelength or wavelength range of radiation source 110. This way, radiation emitted from radiation source 110 is transmitted towards spacing 103 between first main part 101 and second main part 102, through said surface portion 112. Surface portion 112, acting as a window, may be formed in available fused silica, quartz, or glass used for CD/DVD mastering.
  • In operation, apparatus 100 is further provided with a flexible membrane 113, which is substantially flat and engages seal member 108. In a preferred embodiment, seal member 113 is a separate member from seal member 108, and is only engaged with seal member 108 by applying a counter pressure from surface 105 of plate 106, as will be explained. However, in an alternative embodiment, membrane 113 is attached to seal member 108, e.g. by means of a cement, or by being an integral part of seal member 108. Furthermore, in such an alternative embodiment, membrane 113 may be firmly attached to main part 101, whereas seal 108 is disposed outwardly of membrane 113. For an embodiment such as the one illustrated, also membrane 113 is formed in a material which is transparent to radiation of a certain wavelength or wavelength range of radiation source 110. This way, radiation emitted from radiation source 110 is transmitted into spacing 103 through said cavity 115 and its boundary walls 104 and 113. Examples of usable materials for membrane 113, for the embodiment of FIGS. 7-9, include polycarbonate, polypropylene, polyethylene. The thickness of membrane 113 may typically be 10-500 μm.
  • A conduit 114 is formed in first main part 101 for allowing a fluid medium to pass to a space defined by surface 104, seal member 108 and membrane 113, which space acts as a cavity 115 for said fluid medium. Conduit 114 is connectable to a pressure source 116, such as a pump, which may be an external or a built in part of apparatus 100. Pressure source 116 is devised to apply an adjustable pressure, in particular an overpressure, to a fluid medium contained in said cavity 115. An embodiment such as the one illustrated is suitable for use with a gaseous pressure medium. Preferably, said medium is selected from the group containing air, nitrogen, and argon. If instead a liquid medium is used, it is preferred to have the membrane attached to seal member 108. Such a liquid may be a hydraulic oil.
  • FIG. 8 illustrates the apparatus embodiment of FIG. 7, when being loaded with a substrate and a template for a lithographic process. For better understanding of this drawing, reference is also made to FIGS. 1-3. Second main part 102 has been displaced downwards from first main part 101, for opening up spacing 103. As indicated in FIGS. 1-6, either the template or the substrate are transparent to radiation of a certain wavelength or wavelength range of radiation source 110. The illustrated embodiment of FIG. 8 shows an apparatus loaded with a transparent template 10 on top of a substrate 12. Substrate 12 is placed with a backside thereof on surface 105 of heater body 21, placed on or in the second main part 102. Thereby, substrate 12 has its substrate surface 17 with the layer 14 of polymerisable fluid facing upwards. For the sake of simplicity, all features of heater device 20, as seen in FIGS. 1-6 are not shown in FIG. 8. Template 10 is placed on or adjacent to substrate 12, with its structured surface 11 facing substrate 12. Means for aligning template 10 with substrate 12 may be provided, but are not illustrated in this schematic drawing. Membrane 113 is then placed on top of template 10. For an embodiment where membrane 113 is attached to the first main part, the step of actually placing membrane 113 on the template is, of course, dispensed with. In FIG. 8 template 10, substrate 12 and membrane 113 are shown completely separated for the sake of clarity only, whereas in a real situation they would be stacked on surface 105.
  • FIG. 9 illustrates an operative position of apparatus 100. Second main part 102 has been raised to a position where membrane 113 is clamped between seal member 108 and surface 105. In reality, both template 10 and substrate 12 are very thin, typically only parts of a millimetre, and the actual bending of membrane 113 as illustrated is minimal. Still, surface 105 may optionally be devised with a raised peripheral portion at the point where it contacts seal member 108 through membrane 113, for compensating for the combined thickness of template 10 and substrate 12.
  • Once main parts 101 and 102 are engaged to clamp membrane 113, cavity 115 is sealed. Pressure source 116 is then devised to apply an overpressure to a fluid medium in cavity 115. The pressure in cavity 115 is transferred by membrane 113 to template 10, which is pressed towards substrate 12 for imprinting the template pattern in the polymerisable fluid layer 14, cf. FIG. 2. For a polymer material of layer 14 having sufficient viscosity at the operating temperature, typically room temperature between 20 and 25° C., imprint may be made directly. However, certain types of polymers need pre-heating to overcome its glass transition temperature TG, which may be about 60° C. An example of such a polymer is MRL 6000 by Micro Resist Technology. When using such polymers, the apparatus 100, having combined radiation and heating capabilities, is particularly useful. Heater device 20 is activated to heat polymer layer 14 through substrate 12, by means of heater body 21, until TG has been over come. The pressure of the medium in cavity 115 is then increased to 5-500 bar, advantageously to 5-200 bar, and preferably to 5-100 bar. Template 10 and substrate 12 are thereby being pressed together with a corresponding pressure. Thanks to flexible membrane 113, an absolutely even distribution of force is obtained over the whole of the contact surface between the substrate and the template. The template and the substrate are thereby made to arrange themselves absolutely parallel in relation to one another and, the influence of any irregularities in the surface of the substrate or template being eliminated.
  • When template 10 and substrate 12 have been brought together by means of the applied fluid medium pressure, radiation source is triggered to emit radiation 19. The radiation is transmitted through surface portion 112, which acts as a window, through cavity 115, membrane 113, and template 10. The radiation is partly or completely absorbed in the layer 14 of polymerisable fluid, which thereby is solidified in the perfectly parallel arrangement between template 10 and substrate 12, provided by the pressure and membrane assisted compression. Radiation exposure time is dependent on the type and amount of fluid in layer 14, the radiation wavelength combined with the type of fluid, and of the radiation power. The feature of solidifying such a polymerisable fluid is well known as such, and the relevant combinations of the mentioned parameters are likewise known to the skilled person. Once the fluid has solidified to form a layer 14′, further exposure has no major effect. However, dependent on the type of polymerisable fluid, post-baking at an elevated temperature of 150-160° C. may be necessitated for a time period of 0.5-1 hour. With the apparatus 100 according to the present invention, post-baking may be performed in the imprint machine 100, which means that it is not necessary to bring the substrate out of the apparatus and into a separate oven. This saves one process step, which makes both time and cost savings possible in the imprint process. For the example of MRL 6000, post-baking is typically performed at 100-120° C. for about 10 minutes. By performing the post-baking step while the template 10 is still held with the selected pressure towards substrate 10, higher accuracy in the resulting structure pattern in layer 14 may also be achieved, which makes it possible to produce finer structures. Following an exposure time and possibly post-baking under compression, depending on the choice of material and radiation, and dimensions of the polymerisable layer, the pressure in cavity 115 is reduced and the two main parts 101 and 102 are separated from one another. In one embodiment, cooling element 24 of heater device 20 may first be used to cool down the substrate 12 and template 10 before separation. Substrate 12 and template 10 are thereafter separated from one another. After this, the substrate is subjected to further treatment according to what is previously known for imprint lithography.
  • FIGS. 8 and 9 illustrate a process similar to that of FIGS. 1-3. Again, it should be noted that with a transparent substrate 12, template 10 may instead be placed on surface 105 of heater body 21, with substrate on top of template 10, as shown in FIGS. 4-6.
  • FIGS. 10-12 illustrates an alternative method of using apparatus 100, in accordance with an embodiment of the invention. The same reference markings are used for like features as in FIGS. 1-3. However, in the process of FIGS. 10-12, a transparent template 200 is used, preferably made from glass or quartz. Template 200 has a structured surface facing substrate 12, with projecting pattern-defining protrusions 201 having opaque layers 202 covering the outer end surfaces of protrusions 201. Preferably, layers 202 are metal layers. In a preferred embodiment, template 200 is manufactured by means of first applying a metal mask 202 on selected areas of the template surface, where after an etching process is used for defining grooves between the masked portions. Instead of removing the mask after the etching step, the mask 202 is kept on the template to define the non-transparent outer end surfaces of the template protrusions 201. By manufacturing template 200 by means of this process, it is also ensured that a near completely even common plane for the outer end surfaces of protrusions 201 is achieved, since the template manufacturing process starts from a flat template body with a plane surface. It should be noted that dimensions illustrated in FIGS. 1-12 are exaggerated for the sake of easy understanding. For instance, layers 202 may be only a few atomic monolayers thick.
  • In FIG. 10, template 200 is pressed into layer 214 on substrate 12, preferably by using an apparatus as described with reference to FIGS. 7-9. Layer 214 is in this case a Uv-curable negative resist polymer, which may be of any known type. An even pressure is achieved over the entire engaging surfaces of template 200 and substrate 12, thanks to the imprint technique using a membrane and gas pressure as described above. Preferably, the template 200 is pressed into layer 214 such that the outer ends of protrusions 201 come extremely close to substrate layer 17, preferably only a few nanometres. In one embodiment, heater device 20 is used for pre-heating layer 214 trough substrate 12, in order for the polymer of layer 214 to overcome the glass transition temperature.
  • In FIG. 11, radiation 19 is applied through template 200, towards substrate 12. Radiation which hits layers 202 is stopped and reflected, and does not reach layer portions 214′. Radiation which radiates between protrusions 201, however, will hit layer 214 and start a curing or solidification process in layer portions 214″. Preferably, baking process is then performed using heater device 20 for completing the curing process.
  • In the step illustrated in FIG. 12, template 200 is separated and removed from template 12, leaving layer 214 as imprinted. In this shape, substrate 12 is exposed to a negative resist developer fluid. The exact type of fluid may be of any known kind, although the skilled person realises that developer type has to be selected dependent on the resist polymer used. The developer will only remove portions 214′ which were not exposed to radiation, and which remain only as very thin layers at the bottom of the recesses in the polymer layer formed by protrusions 201. Compared to prior art processes, where an ashing or etching process has to be applied to remove the remaining polymer portions 214′ in the recesses, which is then also cured, this process is considerably easier and faster. Furthermore, ashing or etching of the patterned polymer layer 14 will remove material from all parts of layer 214, both portions 214′ and 214″, whereas the proposed method only takes away the portions 214′ which were not exposed to radiation.
  • One embodiment of the system according to the invention further comprises mechanical clamping means, for clamping together substrate 12 and template 10. This is particularly preferred in an embodiment with an external alignment system for aligning substrate and template prior to pattern transfer, where the aligned stack comprising the template and the substrate has to be transferred into the imprint apparatus. The system may also contain means for applying a vacuum between template and substrate in order to extract air inclusions from the polymerisable layer of the stacked sandwich prior to hardening of the polymerisable fluid through UV irradiation.
  • In a preferred embodiment, the template surface 11 is preferably treated with an anti-adhesion layer to prevent the cured polymer layer 14′ from sticking to it after the imprint process. An example of such an anti-adhesion layer comprises a fluorine-containing group, as presented in WO 03/005124 and invented by one of the inventors of the instant invention. The contents of WO 03/005124 are also hereby incorporated by reference.
  • A first mode of the invention, with a transparent template, which has been successfully tested by the inventors, involves a substrate 12 of silicon covered by a layer 14 of NIP-K17 with a thickness of 1 μm. A template of glass or fused silica/quartz, with a thickness of 600 μm, has been used.
  • A second mode of the invention, with a transparent substrate, which has been successfully tested by the inventors, involves a substrate 12 of glass or fused silica/quartz covered by a layer 14 of NIP-K17 with a thickness of 1 μm. A template of e.g. nickel or silicon has been used, with a thickness of about 600 μm, though any other suitable non-transparent material can be used.
  • After compression by means of membrane 113 with a pressure of 5-100 bar for about 30 seconds, radiation source 110 is turned on. Radiation source 110 is typically devised to emit at least in the ultraviolet region below 400 nm. In a preferred embodiment, an air-cooled xenon lamp with an emission spectrum ranging from 200-1000 nm is employed as the radiation source 110. The preferred xenon type radiation source 110 provides a radiation of 1-10 W/cm2, and is devised to flash 1-5 μs pulses, with a pulse rate of 1-5 pulses per second. In an alternative embodiment, a continuous mode UV source is used. A window 112 of quartz is formed in surface 104 for passing through radiation. Exposure time is preferably between 1-30 seconds, for polymerising fluid layer 14 into a solid layer 14′. After successful exposure, second main part 102 is lowered to a position similar to that of FIG. 8, following which template 10 and substrate 12 are removed from the apparatus for separation and further processing of the substrate.
  • The disclosed apparatus and method is particularly advantageous for large area imprint in a single step, and has as such huge benefits over the previously known step and flash method. Thanks to the membrane-transferred fluid pressure, the present invention can be used for one step imprint of substrates of 8 inch, 12 inch, and even larger discs. Even full flat panel displays with sizes of about 400×600 mm and larger can be patterned with a single imprint and exposure step with the present invention. The present invention therefore provides a technique which may for the first time make radiation-assisted polymerisation imprint attractive to large scale production. The invention is usable for forming patterns in a substrate for production of e.g. printed wire boards or circuit boards, electronic circuits, miniaturised mechanical or electromechanical structures, magnetic and optical storage media etc. The apparatus according to the invention may of course also be used only with the radiation source, or instead only with the heater device.
  • The invention is defined by the appended claims.

Claims (33)

  1. 1. Apparatus for transferring a pattern from a template having a structured surface to a substrate carrying a surface layer of a radiation polymerisable fluid, said apparatus comprising a first main part and a second main part having opposing surfaces, means for adjusting a spacing between said main parts, support means for supporting said template and substrate in mutual parallel engagement in said spacing with said structured surface facing said surface layer, a radiation source devised to emit radiation into said spacing, a cavity having a first wall comprising a flexible membrane devised to engage said template or substrate, means for applying an adjustable overpressure to a medium present in said cavity, and a heater device having a surface facing said spacing.
  2. 2. The apparatus as recited in claim 1, wherein said radiation source is positioned in said first main part, devised to emit radiation into said spacing from a first direction, and said heater device is positioned in said second main part, having said surface of the heater device facing said spacing from a second direction, opposite said first direction.
  3. 3. The apparatus as recited in claim 1 or 2, wherein said heater device comprises a heating element, connected to an energy source.
  4. 4. apparatus as recited in claim 3, wherein said heater device comprises a cooling element, connected to a cooling source.
  5. 5. The apparatus as recited in claim any of the preceding claims, wherein said medium comprises a gas.
  6. 6. The apparatus as recited in claim 5, wherein said medium comprises air.
  7. 7. The apparatus as recited in any of the preceding claims, wherein said means for applying an adjustable overpressure is arranged to adjust the pressure to 1-500 bar.
  8. 8. The apparatus as recited in any of the preceding claims, wherein said cavity is defined by a part of the surface of said first main part, a flexible seal member arranged in and protruding from said first main part surface, and said membrane which engages said seal member.
  9. 9. The apparatus as recited in claim 8, wherein said membrane is disconnectable from said seal member, and devised to engage said seal member by application of pressure from said second main part.
  10. 10. The apparatus as recited in any of the preceding claims, wherein said membrane is transparent to a wavelength range of said radiation, said radiation source being positioned behind said membrane.
  11. 11. The apparatus as recited in claim 8, wherein said membrane and at least a portion of said surface of said first main part is transparent to a wavelength range of said radiation, said radiation source being positioned behind said portion of said surface of said first main part.
  12. 12. The apparatus as recited in claim 8, wherein said portion of said surface of said first main part is made from quartz, calcium fluoride or any other pressure stable material being transparent to said radiation.
  13. 13. The apparatus as recited in any of the preceding claims, wherein said radiation source is devised to emit radiation at least in a wavelength range of 100-500 nm.
  14. 14. The apparatus as recited in claim 10, wherein said radiation source is devised to emit pulsating radiation with a pulse duration of 0.5-10 μs and a pulse rate of 1-10 pulses per second.
  15. 15. The apparatus as recited in any of the preceding claims, wherein said membrane is made from a polymer material.
  16. 16. The apparatus as recited in any of the preceding claims, wherein said membrane has a diameter or width of 50-1000 mm.
  17. 17. The apparatus as recited in any of the preceding claims, where said substrate acts as said membrane.
  18. 18. Method for transferring a pattern from a template having a structured surface to a substrate carrying a surface layer of a radiation polymerisable fluid, comprising the steps of:
    arranging said template and substrate mutually parallel in an imprint apparatus, with said structured surface facing said surface layer, between a stop member and a first side of a flexible membrane;
    heating said surface layer by means of a heater device in said imprint apparatus;
    applying an overpressure to a medium present on a second side of the membrane, opposite to said first side, for imprinting said pattern into said layer; and
    exposing said layer to radiation for solidifying said layer.
  19. 19. The method as recited in claim 18, further comprising the step of:
    baking said layer by providing heat from said heater device after said step of exposing said layer to radiation.
  20. 20. The method as recited in claim 18 or 19, wherein said medium comprises a gas.
  21. 21. The method as recited in claim 20, wherein said medium comprises air.
  22. 22. The method as recited in any of the preceding claims 18-21, comprising the step of:
    placing said membrane in direct engagement with said template or said substrate.
  23. 23. The method as recited in claim 18, comprising the step of:
    clamping said membrane at a peripheral portion thereof between said stop member and a seal member, thereby defining a peripheral wall for a cavity for said medium.
  24. 24. The method as recited in claim 18, comprising the steps of:
    emitting radiation to said layer through said template, which template is transparent to a wavelength range of a radiation usable for polymerising said fluid; and
    heating said substrate by direct contact with said heater device.
  25. 25. The method as recited in claim 18, comprising the steps of:
    emitting radiation to said layer through said substrate, which substrate is transparent to a wavelength range of a radiation usable for polymerising said fluid; and
    heating said template by direct contact with said heater device.
  26. 26. The method as recited in any of the preceding claims 18-25, comprising the step of:
    emitting radiation to said layer through said membrane, which membrane is transparent to a wavelength range of a radiation usable for polymerising said fluid.
  27. 27. The method as recited in any of the preceding claims 18-26, comprising the step of:
    emitting radiation to said layer through said membrane, and through a transparent wall opposing said membrane, defining a back wall for a cavity for said medium, which back wall and membrane are transparent to a wavelength range of a radiation usable for polymerising said fluid.
  28. 28. The method as recited in any of the preceding claims 18-27, wherein the step of exposing said layer comprises the step of:
    emitting radiation from a radiation source within a wavelength range of 100-500 nm.
  29. 29. The method as recited in claim 28, comprising the steps of:
    emitting pulsating radiation with a pulse duration in the range of 0.5-10 μs and a pulse rate in the range of 1-10 pulses per second.
  30. 30. The method as recited in any of the preceding claims 18-29, comprising the step of:
    clamping said substrate and template together prior to arranging said template and substrate between said stop member and said flexible membrane.
  31. 31. The method as recited in claim 18, comprising the step of:
    applying a vacuum between said template and said substrate in order to extract air inclusions from said surface layer prior to exposing said layer to radiation.
  32. 32. Method for transferring a pattern from a template having a structured surface to a substrate carrying a surface layer of a radiation polymerisable fluid, wherein said template includes protrusions defining a pattern, which protrusions have non-transparent layers at outer ends, comprising the steps of:
    arranging said template and substrate mutually parallel in an imprint apparatus, with said structured surface facing said surface layer, between a stop member and a first side of a flexible membrane;
    heating said surface layer by means of a heater device in said imprint apparatus;
    applying an overpressure to a medium present on a second side of the membrane, opposite to said first side, for imprinting said pattern into said layer; and
    exposing said layer to radiation for solidifying said layer at portions between said protrusions.
  33. 33. The method as recited in claim 32, further comprising the step of:
    baking said layer by providing heat from said heater device after said step of exposing said layer to radiation.
US11123087 2004-05-07 2005-05-06 Device and method for lithography Abandoned US20050274693A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP20040445057 EP1594001B1 (en) 2004-05-07 2004-05-07 Device and method for imprint lithography
EP04445057.5 2004-05-07
US52156204 true 2004-05-25 2004-05-25
US11123087 US20050274693A1 (en) 2004-05-07 2005-05-06 Device and method for lithography

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11123087 US20050274693A1 (en) 2004-05-07 2005-05-06 Device and method for lithography
US11905036 US7997890B2 (en) 2004-05-07 2007-09-27 Device and method for lithography

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11905036 Division US7997890B2 (en) 2004-05-07 2007-09-27 Device and method for lithography

Publications (1)

Publication Number Publication Date
US20050274693A1 true true US20050274693A1 (en) 2005-12-15

Family

ID=34932984

Family Applications (3)

Application Number Title Priority Date Filing Date
US11579540 Active 2026-09-06 US7972553B2 (en) 2004-05-07 2004-11-25 Method for imprint lithography at constant temperature
US11123087 Abandoned US20050274693A1 (en) 2004-05-07 2005-05-06 Device and method for lithography
US11905036 Active 2025-05-24 US7997890B2 (en) 2004-05-07 2007-09-27 Device and method for lithography

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US11579540 Active 2026-09-06 US7972553B2 (en) 2004-05-07 2004-11-25 Method for imprint lithography at constant temperature

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11905036 Active 2025-05-24 US7997890B2 (en) 2004-05-07 2007-09-27 Device and method for lithography

Country Status (5)

Country Link
US (3) US7972553B2 (en)
EP (2) EP1594001B1 (en)
JP (1) JP4267675B2 (en)
CN (2) CN101073034B (en)
WO (1) WO2005109095A3 (en)

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050236738A1 (en) * 2002-09-12 2005-10-27 Harper Bruce M Disk alignment apparatus and method for patterned media production
US20060283539A1 (en) * 2005-06-20 2006-12-21 Slafer W D Systems and methods for roll-to-roll patterning
KR100710851B1 (en) 2006-03-22 2007-04-17 (주) 비앤피 사이언스 Nano-imprint lithography method and apparatus
US20070114686A1 (en) * 2002-11-13 2007-05-24 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
EP1854617A1 (en) * 2005-02-25 2007-11-14 SUMITOMO ELECTRIC INDUSTRIES Ltd Machining method of microstructure and machining system of microstructure
US20080145617A1 (en) * 2006-10-20 2008-06-19 The Provost Fellows And Scholars Of The College Of The Holy And Undivided Trinity Of Queen Elizabeth Cyclic loading system and methods for forming nanostructures
US20080145774A1 (en) * 2006-10-06 2008-06-19 Asml Netherlands B.V. Imprint lithography
US20080271628A1 (en) * 2007-05-02 2008-11-06 Asml Netherlands B.V. Imprint lithography
US20080311235A1 (en) * 2005-01-21 2008-12-18 Slafer Dennis W Replication Tools and Related Fabrication Methods and Apparatus
US20090038636A1 (en) * 2007-08-09 2009-02-12 Asml Netherlands B.V. Cleaning method
EP2026131A2 (en) 2007-08-14 2009-02-18 ASML Netherlands BV Lithography meandering order
US20090057267A1 (en) * 2007-09-05 2009-03-05 Asml Netherlands B.V. Imprint lithography
US20090108484A1 (en) * 2007-10-11 2009-04-30 Asml Netherlands B.V. Imprint lithography
US20090130607A1 (en) * 2004-01-21 2009-05-21 Microcontinuum, Inc Roll-to-roll patterning of transparent and metallic layers
WO2009094572A1 (en) * 2008-01-23 2009-07-30 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US20100065987A1 (en) * 2008-09-11 2010-03-18 Asml Netherlands B.V. Imprint lithography
US20100092889A1 (en) * 2008-01-30 2010-04-15 Arthur Alan R Mandrel
US20100096774A1 (en) * 2008-10-17 2010-04-22 Asml Netherlands B.V. Imprint lithography apparatus and method
US20100195102A1 (en) * 2009-02-04 2010-08-05 Asml Netherlands B.V. Imprint lithography
JP2010245521A (en) * 2009-04-01 2010-10-28 Asml Netherlands Bv Imprint lithography apparatus and method
US7833389B1 (en) 2005-01-21 2010-11-16 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US20100297282A1 (en) * 2009-05-19 2010-11-25 Asml Netherlands B.V. Imprint lithography apparatus
US20110001254A1 (en) * 2009-07-06 2011-01-06 Asml Netherlands B.V. Imprint Lithography Apparatus and Method
US20110003023A1 (en) * 2009-07-06 2011-01-06 Asml Netherlands B.V. Imprint lithography apparatus
US20110008483A1 (en) * 2009-07-06 2011-01-13 Asml Netherlands B.V. Imprint lithography apparatus
US20110018168A1 (en) * 2009-07-27 2011-01-27 Asml Netherlands B.V. Imprint lithography template
US20110018167A1 (en) * 2009-07-27 2011-01-27 Asml Netherlands B.V. Imprint lithography apparatus and method
US20110037201A1 (en) * 2009-08-14 2011-02-17 Asml Netherlands B.V. Imprint lithography apparatus and method
US20110043795A1 (en) * 2009-08-21 2011-02-24 Asml Netherlands B.V. Inspection method and apparatus
US20110049097A1 (en) * 2009-08-28 2011-03-03 Asml Netherlands B.V. Imprint lithography method and apparatus
US20110076351A1 (en) * 2009-09-29 2011-03-31 Asml Netherlands B.V. Imprint lithography
US20110076352A1 (en) * 2009-09-29 2011-03-31 Asml Netherlands B.V. Imprint lithography
US20110095455A1 (en) * 2009-10-28 2011-04-28 Asml Netherlands B.V. Imprint lithography
US20110129930A1 (en) * 2009-11-30 2011-06-02 Asml Netherlands B.V. Inspection method and apparatus
WO2011064020A1 (en) 2009-11-24 2011-06-03 Asml Netherlands B.V. Alignment and imprint lithography
WO2011064021A1 (en) 2009-11-30 2011-06-03 Asml Netherlands B.V. Imprint lithography apparatus and method
WO2011072897A1 (en) 2009-12-18 2011-06-23 Asml Netherlands B.V. Imprint lithography
US20110163477A1 (en) * 2009-12-23 2011-07-07 Asml Netherlands B.V. Imprint lithographic apparatus and imprint lithographic method
US20110200795A1 (en) * 2010-02-16 2011-08-18 Asml Netherlands B.V. Imprint lithography
WO2011107302A2 (en) 2010-03-03 2011-09-09 Asml Netherlands B.V. Imprint lithography
US20110226735A1 (en) * 2010-03-22 2011-09-22 Asml Netherlands B.V. Imprint lithography
US20110233825A1 (en) * 2010-03-25 2011-09-29 Asml Netherlands B.V. Imprint lithography
US8043085B2 (en) 2008-08-19 2011-10-25 Asml Netherlands B.V. Imprint lithography
WO2012016744A1 (en) 2010-08-05 2012-02-09 Asml Netherlands B.V. Imprint lithography
WO2012019874A1 (en) 2010-08-13 2012-02-16 Asml Netherlands B.V. Lithography method and apparatus
WO2012022561A1 (en) 2010-08-16 2012-02-23 Asml Netherlands B.V. Inspection method for imprint lithography and apparatus therefor
WO2012025316A1 (en) 2010-08-26 2012-03-01 Asml Netherlands B.V. Imprint lithography method and imprintable medium
US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8597014B2 (en) 2009-04-27 2013-12-03 Asml Netherlands B.V. Actuator
US8743361B2 (en) 2010-05-03 2014-06-03 Asml Netherlands B.V. Imprint lithography method and apparatus

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7641468B2 (en) * 2004-09-01 2010-01-05 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and method employing an effective pressure
EP1959299B1 (en) * 2005-06-10 2012-12-26 Obducat AB Pattern replication with intermediate stamp
US8846551B2 (en) 2005-12-21 2014-09-30 University Of Virginia Patent Foundation Systems and methods of laser texturing of material surfaces and their applications
US7500431B2 (en) * 2006-01-12 2009-03-10 Tsai-Wei Wu System, method, and apparatus for membrane, pad, and stamper architecture for uniform base layer and nanoimprinting pressure
US7377765B2 (en) * 2006-02-14 2008-05-27 Hitachi Global Storage Technologies System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
US7924399B2 (en) 2006-03-27 2011-04-12 Asml Netherlands B.V. Assembly comprising a conditioning system and at least one object, a conditioning system, a lithographic apparatus and methods
CN100451840C (en) 2006-04-04 2009-01-14 吉林大学 Method for constructing micrometre, submicrometre structural surface
EP1884830A1 (en) * 2006-08-04 2008-02-06 Sony Deutschland GmbH A method of applying a material on a substrate
US7832416B2 (en) 2006-10-10 2010-11-16 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and methods
CN101674942B (en) 2006-11-15 2012-01-25 3M创新有限公司 Flexographic printing with curing during transfer to substrate
KR101371094B1 (en) 2006-11-22 2014-03-12 엘아이지에이디피 주식회사 Pattern forming apparatus and pattern forming method
US8608972B2 (en) 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
JP4989234B2 (en) * 2007-01-09 2012-08-01 東芝機械株式会社 Transfer device
JP5054412B2 (en) * 2007-04-05 2012-10-24 コマツ産機株式会社 Mold systems for hot press forming apparatus and the apparatus
US8010900B2 (en) * 2007-06-08 2011-08-30 Apple Inc. User interface for electronic backup
US20090056575A1 (en) * 2007-08-31 2009-03-05 Bartman Jon A Pattern transfer apparatus
KR100856559B1 (en) 2007-09-20 2008-09-04 국민대학교산학협력단 Temperature controler of equipment for nano imprint lithography and nano imprint equipment involving this
KR100874756B1 (en) 2007-10-18 2008-12-19 한국생산기술연구원 Nano imprinting apparatus
WO2009072690A1 (en) * 2007-12-07 2009-06-11 Top Engineering Co., Ltd. Apparatus for heating pattern frame
JP2011067950A (en) * 2008-01-25 2011-04-07 Kyowa Hakko Chemical Co Ltd Method of forming metallic film pattern
JP2009208239A (en) * 2008-02-29 2009-09-17 Fujifilm Corp The pattern forming method
CN101960559A (en) * 2008-03-07 2011-01-26 昭和电工株式会社 UV nanoimprint method, resin replica mold and method for producing the same, magnetic recording medium and method for producing the same, and magnetic recording/reproducing apparatus
JP2009266901A (en) * 2008-04-22 2009-11-12 Sharp Corp Transfer apparatus, method for manufacturing wafer-like optical device, electronic element wafer module, sensor wafer module, electronic element module, sensor module and electronic information instrument
EP2124514A1 (en) * 2008-05-23 2009-11-25 Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO Providing a plastic substrate with a metallic pattern
JP5155814B2 (en) * 2008-10-21 2013-03-06 株式会社日立ハイテクノロジーズ Imprint apparatus
US8652393B2 (en) 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
EP2199854B1 (en) 2008-12-19 2015-12-16 Obducat AB Hybrid polymer mold for nano-imprinting and method for making the same
EP2199855B1 (en) 2008-12-19 2016-07-20 Obducat Methods and processes for modifying polymer material surface interactions
US20120292820A1 (en) * 2009-11-02 2012-11-22 Nil Technology Aps Method and device for nanoimprint lithography
KR101319353B1 (en) * 2009-12-23 2013-10-16 엘지디스플레이 주식회사 Apparatus and method of fabricating flat display device
US8366431B2 (en) * 2010-04-13 2013-02-05 Sematech, Inc. Partial die process for uniform etch loading of imprint wafers
US20110272838A1 (en) * 2010-05-06 2011-11-10 Matt Malloy Apparatus, System, and Method for Nanoimprint Template with a Backside Recess Having Tapered Sidewalls
JP2012169503A (en) * 2011-02-15 2012-09-06 Bridgestone Corp Imprint device
JP2012190877A (en) * 2011-03-09 2012-10-04 Fujifilm Corp Nanoimprint method and nanoimprint device for use therein
US10131086B2 (en) 2011-06-30 2018-11-20 University Of Virginia Patent Foundation Micro-structure and nano-structure replication methods and article of manufacture
CN102436141A (en) * 2011-12-29 2012-05-02 苏州光舵微纳科技有限公司 Nano hot stamping device
JP5821909B2 (en) * 2013-07-30 2015-11-24 大日本印刷株式会社 Mold and its manufacturing method for photo-imprinting

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054383A (en) * 1976-02-02 1977-10-18 International Business Machines Corporation Jig and process for contact printing
US4360266A (en) * 1979-08-24 1982-11-23 Dai Nippon Insatsu Kabushiki Kaisha Contact printing method and apparatus
US4844947A (en) * 1986-11-06 1989-07-04 Westinghouse Electric Corp. Technique for the application and cure of photosensitive paints
US5804017A (en) * 1995-07-27 1998-09-08 Imation Corp. Method and apparatus for making an optical information record
US5866281A (en) * 1996-11-27 1999-02-02 Wisconsin Alumni Research Foundation Alignment method for multi-level deep x-ray lithography utilizing alignment holes and posts
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
US6027630A (en) * 1997-04-04 2000-02-22 University Of Southern California Method for electrochemical fabrication
US6190929B1 (en) * 1999-07-23 2001-02-20 Micron Technology, Inc. Methods of forming semiconductor devices and methods of forming field emission displays
US6284345B1 (en) * 1997-12-08 2001-09-04 Washington University Designer particles of micron and submicron dimension
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6387778B1 (en) * 2000-02-11 2002-05-14 Seagate Technology Llc Breakable tethers for microelectromechanical system devices utilizing reactive ion etching lag
US6387787B1 (en) * 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
US6482742B1 (en) * 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US20030071016A1 (en) * 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
US20030159608A1 (en) * 1999-12-10 2003-08-28 Babak Heidari Device and method in connection with the production of structures
US20030189273A1 (en) * 2002-04-04 2003-10-09 Lennart Olsson Imprint method and device
US20040021254A1 (en) * 2002-08-01 2004-02-05 Sreenivasan Sidlgata V. Alignment methods for imprint lithography
US20040079730A1 (en) * 2001-07-05 2004-04-29 Gisel Ahrens Plastic male mold for fabricating microstructures and nanostructures using imprint lithography
US6743740B2 (en) * 2002-10-18 2004-06-01 Intel Corporation Using sonic energy in connection with laser-assisted direct imprinting
US20040110856A1 (en) * 2002-12-04 2004-06-10 Young Jung Gun Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US20040131718A1 (en) * 2000-07-18 2004-07-08 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US20050158419A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Thermal processing system for imprint lithography
US20050202350A1 (en) * 2004-03-13 2005-09-15 Colburn Matthew E. Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning
US6949199B1 (en) * 2001-08-16 2005-09-27 Seagate Technology Llc Heat-transfer-stamp process for thermal imprint lithography
US7374864B2 (en) * 2003-02-13 2008-05-20 The Regents Of The University Of Michigan Combined nanoimprinting and photolithography for micro and nano devices fabrication

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL177721B (en) 1977-03-14 1985-06-03 Philips Nv A process for producing a plastic information carrier with layered structure, as well as a device for carrying out the method.
NL7710555A (en) 1977-09-28 1979-03-30 Philips Nv Method and apparatus for the manufacture of information-containing plates.
DE3643817A1 (en) 1986-12-20 1988-06-30 Agfa Gevaert Ag Contact copier
JPH02289311A (en) 1989-01-25 1990-11-29 Hoya Corp Manufacture of stamper and board for information recording medium for which stamper is used
JP3876510B2 (en) 1997-12-25 2007-01-31 ソニー株式会社 The method of manufacturing an optical recording medium
JP2000194142A (en) 1998-12-25 2000-07-14 Fujitsu Ltd Pattern forming method and production of semiconductor device
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
JP3588633B2 (en) 2001-09-04 2004-11-17 独立行政法人産業技術総合研究所 Moving stage for imprint lithography
US7455955B2 (en) 2002-02-27 2008-11-25 Brewer Science Inc. Planarization method for multi-layer lithography processing
JP3907504B2 (en) 2002-03-14 2007-04-18 三菱電機株式会社 Method of manufacturing a semiconductor device and mold for producing a semiconductor device
CN1478642A (en) 2002-08-30 2004-03-03 张哲豪 Gas subfebrile temperature in pression shaping method

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054383A (en) * 1976-02-02 1977-10-18 International Business Machines Corporation Jig and process for contact printing
US4360266A (en) * 1979-08-24 1982-11-23 Dai Nippon Insatsu Kabushiki Kaisha Contact printing method and apparatus
US4844947A (en) * 1986-11-06 1989-07-04 Westinghouse Electric Corp. Technique for the application and cure of photosensitive paints
US5804017A (en) * 1995-07-27 1998-09-08 Imation Corp. Method and apparatus for making an optical information record
US5866281A (en) * 1996-11-27 1999-02-02 Wisconsin Alumni Research Foundation Alignment method for multi-level deep x-ray lithography utilizing alignment holes and posts
US6027630A (en) * 1997-04-04 2000-02-22 University Of Southern California Method for electrochemical fabrication
US6284345B1 (en) * 1997-12-08 2001-09-04 Washington University Designer particles of micron and submicron dimension
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6190929B1 (en) * 1999-07-23 2001-02-20 Micron Technology, Inc. Methods of forming semiconductor devices and methods of forming field emission displays
US20030159608A1 (en) * 1999-12-10 2003-08-28 Babak Heidari Device and method in connection with the production of structures
US6387778B1 (en) * 2000-02-11 2002-05-14 Seagate Technology Llc Breakable tethers for microelectromechanical system devices utilizing reactive ion etching lag
US20040131718A1 (en) * 2000-07-18 2004-07-08 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US6482742B1 (en) * 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US6387787B1 (en) * 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
US20040079730A1 (en) * 2001-07-05 2004-04-29 Gisel Ahrens Plastic male mold for fabricating microstructures and nanostructures using imprint lithography
US6949199B1 (en) * 2001-08-16 2005-09-27 Seagate Technology Llc Heat-transfer-stamp process for thermal imprint lithography
US20030071016A1 (en) * 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
US7144539B2 (en) * 2002-04-04 2006-12-05 Obducat Ab Imprint method and device
US20030189273A1 (en) * 2002-04-04 2003-10-09 Lennart Olsson Imprint method and device
US20040021254A1 (en) * 2002-08-01 2004-02-05 Sreenivasan Sidlgata V. Alignment methods for imprint lithography
US6743740B2 (en) * 2002-10-18 2004-06-01 Intel Corporation Using sonic energy in connection with laser-assisted direct imprinting
US20040110856A1 (en) * 2002-12-04 2004-06-10 Young Jung Gun Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US7374864B2 (en) * 2003-02-13 2008-05-20 The Regents Of The University Of Michigan Combined nanoimprinting and photolithography for micro and nano devices fabrication
US20050158419A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Thermal processing system for imprint lithography
US20050202350A1 (en) * 2004-03-13 2005-09-15 Colburn Matthew E. Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning

Cited By (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050236738A1 (en) * 2002-09-12 2005-10-27 Harper Bruce M Disk alignment apparatus and method for patterned media production
US7682546B2 (en) 2002-09-12 2010-03-23 Wd Media, Inc. Disk alignment apparatus and method for patterned media production
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US20070114686A1 (en) * 2002-11-13 2007-05-24 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US7691313B2 (en) * 2002-11-13 2010-04-06 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US20090130607A1 (en) * 2004-01-21 2009-05-21 Microcontinuum, Inc Roll-to-roll patterning of transparent and metallic layers
US9307648B2 (en) 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US8062495B2 (en) 2005-01-21 2011-11-22 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US7833389B1 (en) 2005-01-21 2010-11-16 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US20080311235A1 (en) * 2005-01-21 2008-12-18 Slafer Dennis W Replication Tools and Related Fabrication Methods and Apparatus
US20110064838A1 (en) * 2005-01-21 2011-03-17 Microcontinuum, Inc. Replication tools and related fabrication methos and apparatus
US9395623B2 (en) 2005-01-21 2016-07-19 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
EP1854617A1 (en) * 2005-02-25 2007-11-14 SUMITOMO ELECTRIC INDUSTRIES Ltd Machining method of microstructure and machining system of microstructure
EP1854617A4 (en) * 2005-02-25 2011-07-06 Sumitomo Electric Industries Machining method of microstructure and machining system of microstructure
US20060283539A1 (en) * 2005-06-20 2006-12-21 Slafer W D Systems and methods for roll-to-roll patterning
US8435373B2 (en) 2005-06-20 2013-05-07 Microcontinumm, Inc. Systems and methods for roll-to-roll patterning
KR100710851B1 (en) 2006-03-22 2007-04-17 (주) 비앤피 사이언스 Nano-imprint lithography method and apparatus
US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US7946837B2 (en) 2006-10-06 2011-05-24 Asml Netherlands B.V. Imprint lithography
US20080145774A1 (en) * 2006-10-06 2008-06-19 Asml Netherlands B.V. Imprint lithography
US7632088B2 (en) * 2006-10-20 2009-12-15 Provost Fellows And Scholars Of The College Of The Holy And Undivided Trinity Of Queen Elizabeth Near Dublin Cyclic loading system and methods for forming nanostructures
US20080145617A1 (en) * 2006-10-20 2008-06-19 The Provost Fellows And Scholars Of The College Of The Holy And Undivided Trinity Of Queen Elizabeth Cyclic loading system and methods for forming nanostructures
US7641467B2 (en) 2007-05-02 2010-01-05 Asml Netherlands B.V. Imprint lithography
US20080271628A1 (en) * 2007-05-02 2008-11-06 Asml Netherlands B.V. Imprint lithography
US20090038636A1 (en) * 2007-08-09 2009-02-12 Asml Netherlands B.V. Cleaning method
EP2026131A2 (en) 2007-08-14 2009-02-18 ASML Netherlands BV Lithography meandering order
US7854877B2 (en) 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
US8144309B2 (en) 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
US20090057267A1 (en) * 2007-09-05 2009-03-05 Asml Netherlands B.V. Imprint lithography
US8323541B2 (en) 2007-09-05 2012-12-04 Asml Netherlands B.V. Imprint lithography
US20090108484A1 (en) * 2007-10-11 2009-04-30 Asml Netherlands B.V. Imprint lithography
US8579625B2 (en) 2007-10-11 2013-11-12 Asml Netherlands B.V. Imprint lithography
US9889597B2 (en) 2007-10-11 2018-02-13 Asml Netherlands B.V. Imprint lithography
WO2009094572A1 (en) * 2008-01-23 2009-07-30 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US20100092889A1 (en) * 2008-01-30 2010-04-15 Arthur Alan R Mandrel
US8293455B2 (en) * 2008-01-30 2012-10-23 Hewlett-Packard Development Company, L.P. Mandrel
US8043085B2 (en) 2008-08-19 2011-10-25 Asml Netherlands B.V. Imprint lithography
US8319968B2 (en) 2008-09-11 2012-11-27 Asml Netherlands B.V. Imprint lithography
US20100065987A1 (en) * 2008-09-11 2010-03-18 Asml Netherlands B.V. Imprint lithography
US20100096774A1 (en) * 2008-10-17 2010-04-22 Asml Netherlands B.V. Imprint lithography apparatus and method
US9372396B2 (en) 2008-10-17 2016-06-21 Asml Netherlands B.V. Imprint lithography method
US8248608B2 (en) 2009-02-04 2012-08-21 Asml Netherlands B.V. Imprint lithography
US20100195102A1 (en) * 2009-02-04 2010-08-05 Asml Netherlands B.V. Imprint lithography
JP2010245521A (en) * 2009-04-01 2010-10-28 Asml Netherlands Bv Imprint lithography apparatus and method
US9274418B2 (en) 2009-04-01 2016-03-01 Asml Netherlands B.V. Imprint lithography apparatus and method
US8597014B2 (en) 2009-04-27 2013-12-03 Asml Netherlands B.V. Actuator
US20100297282A1 (en) * 2009-05-19 2010-11-25 Asml Netherlands B.V. Imprint lithography apparatus
US8845320B2 (en) 2009-05-19 2014-09-30 Asml Netherlands B.V. Imprint lithography apparatus
US8685295B2 (en) 2009-07-06 2014-04-01 Asml Netherlands B.V. Imprint lithography apparatus
US20110001254A1 (en) * 2009-07-06 2011-01-06 Asml Netherlands B.V. Imprint Lithography Apparatus and Method
US20110003023A1 (en) * 2009-07-06 2011-01-06 Asml Netherlands B.V. Imprint lithography apparatus
US9116423B2 (en) 2009-07-06 2015-08-25 Asml Netherlands B.V. Imprint lithography apparatus
US20110008483A1 (en) * 2009-07-06 2011-01-13 Asml Netherlands B.V. Imprint lithography apparatus
US9547234B2 (en) 2009-07-27 2017-01-17 Asml Netherlands B.V. Imprint lithography apparatus and method
US20110018168A1 (en) * 2009-07-27 2011-01-27 Asml Netherlands B.V. Imprint lithography template
US20110018167A1 (en) * 2009-07-27 2011-01-27 Asml Netherlands B.V. Imprint lithography apparatus and method
US8967991B2 (en) 2009-07-27 2015-03-03 Asml Netherlands B.V. Imprint lithography template
US20110037201A1 (en) * 2009-08-14 2011-02-17 Asml Netherlands B.V. Imprint lithography apparatus and method
US8404170B2 (en) * 2009-08-14 2013-03-26 Asml Netherlands B.V. Imprint lithography apparatus and method
US8830455B2 (en) 2009-08-21 2014-09-09 Asml Netherlands B.V. Inspection method and apparatus
US20110043795A1 (en) * 2009-08-21 2011-02-24 Asml Netherlands B.V. Inspection method and apparatus
US8961801B2 (en) 2009-08-28 2015-02-24 Asml Netherlands B.V. Imprint lithography method and apparatus
US9278466B2 (en) 2009-08-28 2016-03-08 Asml Netherlands B.V. Imprint lithography method and apparatus
US20110049097A1 (en) * 2009-08-28 2011-03-03 Asml Netherlands B.V. Imprint lithography method and apparatus
US20110076352A1 (en) * 2009-09-29 2011-03-31 Asml Netherlands B.V. Imprint lithography
US9588422B2 (en) 2009-09-29 2017-03-07 Asml Netherlands B.V. Imprint lithography
US8529823B2 (en) 2009-09-29 2013-09-10 Asml Netherlands B.V. Imprint lithography
US20110076351A1 (en) * 2009-09-29 2011-03-31 Asml Netherlands B.V. Imprint lithography
US8968630B2 (en) 2009-10-28 2015-03-03 Asml Netherlands B.V. Imprint lithography
US20110095455A1 (en) * 2009-10-28 2011-04-28 Asml Netherlands B.V. Imprint lithography
US9658528B2 (en) 2009-10-28 2017-05-23 Asml Netherlands B.V. Imprint lithography
US8691124B2 (en) 2009-11-24 2014-04-08 Asml Netherlands B.V. Alignment and imprint lithography
WO2011064020A1 (en) 2009-11-24 2011-06-03 Asml Netherlands B.V. Alignment and imprint lithography
US9726973B2 (en) 2009-11-30 2017-08-08 Asml Netherlands B.V. Imprint lithography apparatus and method
US20110129930A1 (en) * 2009-11-30 2011-06-02 Asml Netherlands B.V. Inspection method and apparatus
US8357536B2 (en) 2009-11-30 2013-01-22 Asml Netherlands B.V. Inspection method and apparatus
WO2011064021A1 (en) 2009-11-30 2011-06-03 Asml Netherlands B.V. Imprint lithography apparatus and method
US9625811B2 (en) 2009-12-18 2017-04-18 Asml Netherlands B.V. Imprint lithography
WO2011072897A1 (en) 2009-12-18 2011-06-23 Asml Netherlands B.V. Imprint lithography
US20110163477A1 (en) * 2009-12-23 2011-07-07 Asml Netherlands B.V. Imprint lithographic apparatus and imprint lithographic method
US9715171B2 (en) 2009-12-23 2017-07-25 Asml Netherlands B.V. Imprint lithographic apparatus and imprint lithographic method
US9645489B2 (en) 2010-02-16 2017-05-09 Asml Netherlands B.V. Imprint lithography
US20110200795A1 (en) * 2010-02-16 2011-08-18 Asml Netherlands B.V. Imprint lithography
WO2011107302A2 (en) 2010-03-03 2011-09-09 Asml Netherlands B.V. Imprint lithography
US9958774B2 (en) 2010-03-03 2018-05-01 Asml Netherlands B.V. Imprint lithography
US9535322B2 (en) 2010-03-03 2017-01-03 Asml Netherlands B.V. Imprint lithography
US20110226735A1 (en) * 2010-03-22 2011-09-22 Asml Netherlands B.V. Imprint lithography
US8454849B2 (en) 2010-03-22 2013-06-04 Asml Netherlands B.V. Imprint lithography
US9927699B2 (en) 2010-03-25 2018-03-27 Asml Netherlands B.V. Imprint lithography
US20110233825A1 (en) * 2010-03-25 2011-09-29 Asml Netherlands B.V. Imprint lithography
US8743361B2 (en) 2010-05-03 2014-06-03 Asml Netherlands B.V. Imprint lithography method and apparatus
WO2012016744A1 (en) 2010-08-05 2012-02-09 Asml Netherlands B.V. Imprint lithography
US9864279B2 (en) 2010-08-05 2018-01-09 Asml Netherlands B.V. Imprint lithography
WO2012019874A1 (en) 2010-08-13 2012-02-16 Asml Netherlands B.V. Lithography method and apparatus
US9310700B2 (en) 2010-08-13 2016-04-12 Asml Netherlands B.V. Lithography method and apparatus
US9274441B2 (en) 2010-08-16 2016-03-01 Asml Netherlands B.V. Inspection method for imprint lithography and apparatus therefor
WO2012022561A1 (en) 2010-08-16 2012-02-23 Asml Netherlands B.V. Inspection method for imprint lithography and apparatus therefor
US9372399B2 (en) 2010-08-26 2016-06-21 Asml Netherlands B.V. Imprint lithography method and imprintable medium
WO2012025316A1 (en) 2010-08-26 2012-03-01 Asml Netherlands B.V. Imprint lithography method and imprintable medium

Also Published As

Publication number Publication date Type
EP1594001A1 (en) 2005-11-09 application
JP2007536750A (en) 2007-12-13 application
EP1594001B1 (en) 2015-12-30 grant
WO2005109095A2 (en) 2005-11-17 application
US7997890B2 (en) 2011-08-16 grant
CN1700100A (en) 2005-11-23 application
EP1743217A2 (en) 2007-01-17 application
EP1743217B1 (en) 2012-04-04 grant
JP4267675B2 (en) 2009-05-27 grant
US20070164487A1 (en) 2007-07-19 application
US7972553B2 (en) 2011-07-05 grant
US20080030700A1 (en) 2008-02-07 application
WO2005109095A3 (en) 2006-08-10 application
CN101073034B (en) 2011-08-10 grant
CN101073034A (en) 2007-11-14 application

Similar Documents

Publication Publication Date Title
US7179079B2 (en) Conforming template for patterning liquids disposed on substrates
US7070406B2 (en) Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media
US6908861B2 (en) Method for imprint lithography using an electric field
US20070237886A1 (en) Imprint lithography
US7019819B2 (en) Chucking system for modulating shapes of substrates
EP1072954A2 (en) Lithographic process for device fabrication
US20050061773A1 (en) Capillary imprinting technique
US20070145639A1 (en) Imprint method, imprint apparatus, and process for producing chip
US6932934B2 (en) Formation of discontinuous films during an imprint lithography process
US7077992B2 (en) Step and repeat imprint lithography processes
US6808646B1 (en) Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
US20060144275A1 (en) Imprint lithography
US20040008334A1 (en) Step and repeat imprint lithography systems
US20050064344A1 (en) Imprint lithography templates having alignment marks
US20040250945A1 (en) Method for and apparatus for bonding patterned imprint to a substrate by adhering means
US20070102844A1 (en) Imprint lithography
US7862761B2 (en) Pattern forming method and pattern forming apparatus
Acikgoz et al. Polymers in conventional and alternative lithography for the fabrication of nanostructures
US20100123885A1 (en) Large area nanopatterning method and apparatus
WO2004013693A2 (en) Scatterometry alignment for imprint lithography
US20070238037A1 (en) Imprint lithography
US20080055581A1 (en) Devices and methods for pattern generation by ink lithography
US20070228608A1 (en) Preserving Filled Features when Vacuum Wiping
US20080011934A1 (en) Imprint lithography
JP2005286062A (en) Processing apparatus

Legal Events

Date Code Title Description
AS Assignment

Owner name: OBDUCAT AB, SWEDEN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HEIDARI, BABAK;BECK, MARC;REEL/FRAME:016909/0089

Effective date: 20050815