US20230243603A1 - Heat sink structure with heat pipe - Google Patents
Heat sink structure with heat pipe Download PDFInfo
- Publication number
- US20230243603A1 US20230243603A1 US18/064,293 US202218064293A US2023243603A1 US 20230243603 A1 US20230243603 A1 US 20230243603A1 US 202218064293 A US202218064293 A US 202218064293A US 2023243603 A1 US2023243603 A1 US 2023243603A1
- Authority
- US
- United States
- Prior art keywords
- copper
- heat pipe
- aluminum fin
- aluminum
- fin assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 107
- 229910052802 copper Inorganic materials 0.000 claims abstract description 104
- 239000010949 copper Substances 0.000 claims abstract description 104
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 90
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 90
- 230000000149 penetrating effect Effects 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 36
- 238000007747 plating Methods 0.000 abstract description 24
- 229910052759 nickel Inorganic materials 0.000 abstract description 18
- 239000007769 metal material Substances 0.000 abstract description 10
- 230000005496 eutectics Effects 0.000 abstract description 6
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 19
- 238000003466 welding Methods 0.000 description 19
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- OBSZRRSYVTXPNB-UHFFFAOYSA-N tetraphosphorus Chemical compound P12P3P1P32 OBSZRRSYVTXPNB-UHFFFAOYSA-N 0.000 description 4
- 239000003440 toxic substance Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000010808 liquid waste Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 231100000167 toxic agent Toxicity 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000951 Aluminide Inorganic materials 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910018563 CuAl2 Inorganic materials 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 208000001132 Osteoporosis Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- -1 copper heat pipes Chemical compound 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 230000035622 drinking Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 210000004373 mandible Anatomy 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000017074 necrotic cell death Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000009853 pyrometallurgy Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
- F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
- F28F1/325—Fins with openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/12—Fins with U-shaped slots for laterally inserting conduits
Definitions
- the present invention relates to a heat sink, and more particularly, to a heat sink structure with heat pipe, which includes a copper embedding layer provided on areas of an aluminum fin assembly to be connected to other members of the heat sink structure, so that the aluminum fin assembly can be directly connected with copper heat pipes via welding without the need of electroless nickel plating.
- Heat sinks or radiation fins are usually used with an electronic element or in a system to dissipate heat produced by the element or the system through heat exchange.
- the radiation fins show relatively high heat dissipation efficiency.
- thermal resistance includes the thermal spreading resistance in the radiation fins and the convection thermal resistance between the radiation fin surface and the atmospheric environment.
- some more efficient heat dissipation systems use a combination of high-conductivity heat pipes and fins of heat sink to effectively solve the problem of heat dissipation.
- a thermal module with heat pipe includes at least one heat pipe and a plurality of spacedly arranged fins, and any two adjacent fins together define a flow passage between them.
- the fins are respectively provided with a through hole, an upper bent edge and a lower bent edge.
- the through holes on the fins are aligned with one another.
- the upper and the lower bent edges are respectively provided with at least one fastening section.
- the fins are sequentially fastened to one another through connection of the fastening sections on one fin to the fastening sections on another adjacent fin to thereby form a heat sink having fins or a heat dissipation fin assembly, and all the upper bent edges and the lower bent edges of the fins together constitute a top surface and a bottom surface, respectively, of the heat sink or the heat dissipation fin assembly.
- each of the through holes on the fins is provided with a flange, which is projected from one side to another opposite side of the fin.
- the heat pipe has a first end that extends through the through holes and is surrounded by the flanges.
- a second end of the heat pipe extends through the bottom surface of the heat sink or the heat dissipation fin assembly or through a base thereof.
- the through holes on the fins and the first end of the heat pipe are connected to one another mostly by tight fit or loose fit.
- the flanges of the through holes respectively have an inner diameter slightly smaller than an outer diameter of the first end of the heat pipe, so that an interference fit is formed between the flanges and the first end of the heat pipe.
- the fins can be heated to expand the inner surfaces of the flanges and then let them cool after the heat pipe is fully extended through the through holes. At this point, the inner diameter of the cooled flanged is naturally reduced to its original size for the flanges to tightly fit around the heat pipe.
- the flange has an inner diameter slightly larger than an outer diameter of the first end of the heat pipe and a medium, such as a thermal glue, a thermal paste, or a tin solder rod, is provided between the through holes on the fins and the heat pipe for gap filling.
- a medium such as a thermal glue, a thermal paste, or a tin solder rod
- One of the ways to set the medium is to place it between inner surfaces of the flanges of the through holes and the outer surface of the first end of the heat pipe.
- Another way is to form a filler hole at an edge of the through holes for receiving the medium therein.
- the medium is heated to melt and evenly distribute between the outer surface of the heat pipe and the inner surfaces of the flanges of through holes.
- the tight fit can also be realized by providing a corrugated structure around the flanges by compressing the flanges with a tightening device.
- the corrugated structure includes a plurality of protrusions and dents, which are continuously and alternately arrayed along a circumferential surface of the flanges to apply a radially inward force on the heat pipe, causing the outer surface of the heat pipe to deform, so that interference fit is formed between the deformed outer surface of the heat pipe and the flanges with the corrugated structure, enabling the flanges and the heat pipe to tightly connected to one another.
- aluminum material having light weight and low cost is usually selected for forming the fins, the heat sink, and the base of the heat sink, while other metal materials with high thermal conductivity, such as brass, aluminum, nickel and stainless steel, are selected for forming the heat pipe.
- the copper When the surface of the aluminum has fully molten in the welding operation, the copper is still in a solid phase.
- the copper when the copper is molten, the aluminum has long been molten and could not co-exist with the molten copper in the eutectic state to further increase the difficulty of welding operation.
- the copper material and the aluminum material all have good heat conductivity, the metal in the weld pool crystallizes quickly, which prevents the reaction gas used in pyrometallurgy from timely escaping from the weld pool to form air pores in the weld joint easily. Therefore, the copper material and the aluminum material could not be directly welded together.
- the surface of the aluminum material must be modified to enable subsequent welding of the aluminum material to the copper material or other metal materials.
- electroless nickel plating is one of the technical means adopted for aluminum surface modification.
- electroless nickel plating can be classified into three types, namely, low, middle and high phosphorus electroless nickel plating.
- the electroless nickel plating is particularly different from the electroplating in that it is performed in a working environment without electric current and uses reducing agent in the plating solution to reduce metal ions.
- a specimen surface Prior to the electroless nickel plating, a specimen surface must be catalyzed. There are three types of electroless nickel plating solution.
- the first type contains activator, sensitizer, and an acidic plating bath having a pH value between 4 and 6, and is characterized in that less loss in chemical composition is caused by evaporation; this type of electroless nickel plating solution requires a relatively higher operating temperature, but is considerably safe for use and easy to control; and it has high phosphorus content and high plating rate and is often used in the industrial field.
- the second type contains activator, sensitizer, and a basic plating solution or bath having a pH value between 8 and 10. Since the ammonia solution used to adjust the pH value of the plating bath is volatile, it must be replenished timely to maintain stable pH value of the plating bath; this type of electroless nickel plating solution has less phosphorus content, is less stable and needs only a lower operating temperature.
- HPM means a mixture of hydrochloric acid and peroxide.
- DI deionized
- H 2 O 2 hydrogen peroxide
- HCl hydrogen Chloride
- Electroless nickel plating requires a large quantity of chemical reaction liquid during the process and produces a large quantity of industrial liquid waste containing heavy metals or chemical substances after the process.
- Industrial liquid waste generates a large amount of wastewater that contains toxicants, such as yellow phosphorus.
- concentration of yellow phosphorus thereof reaches 50 ⁇ 390 mg/L.
- Yellow phosphorus is highly toxic, and its existence in human body would badly endanger liver and other organs. Drinking phosphorus-containing water for a long time would result in osteoporosis to cause different diseases, such as mandible necrosis.
- a primary object of the present invention is to provide a heat sink structure with heat pipe, which includes a copper embedding layer formed on areas of an aluminum fin assembly that are to be connected to other members of the heat sink structure made of a metal material different from aluminum, such as copper heat pipes, so that the aluminum fin assembly and the copper heat pipes made of dissimilar metal materials can be directly welded to one another without the need of first performing an electroless nickel plating on the aluminum fin assembly. In this manner, no toxic substance would be produced and can therefore ensure environmental protection; and the problem of eutectic as found in the prior art can be improved.
- Another object of the present invention is to provide a heat sink structure with heat pipe including an aluminum fin assembly, areas on which for connecting to a copper heat pipe and/or a copper base are respectively provided with a copper embedding layer, so that the aluminum fin assembly can be directly welded to the copper heat pipe or the copper base via the copper embedding layer without the need of electroless nickel plating.
- it is able to reduce an overall weight of the heat sink structure and to reduce thermal resistance at connecting joints between the aluminum fin assembly and the copper heat pipe and/or the copper base while upgrade the heat transfer efficiency of the heat sink structure.
- the present invention provides a heat sink structure with heat pipe, which includes at least one aluminum fin assembly and at least one copper heat pipe.
- the aluminum fin assembly has a bottom surface and a top surface. Any two adjacent aluminum fins together define a flow passage between them.
- the bottom surface is provided with at least one groove, which has an open side and a groove inner surface.
- the aluminum fins are respectively provided with at least one through hole that extends through the aluminum fin in a thickness direction thereof, and the through holes respectively include a flange, which is projected from one side of the aluminum fin and internally defines a flange inner surface.
- the groove inner surface and the flange inner surfaces which are areas of the aluminum fin assembly for connecting to other members of the heat sink structure, are respectively provided with a copper embedding layer.
- the copper embedding layer includes a deepening surface and a connecting surface. The deepening surface bonds to and deeply penetrates into the groove inner surface and the flange inner surfaces, respectively.
- the at least one copper heat pipe has a first end and a second end extended through the through holes and the groove on the aluminum fin assembly, respectively.
- the first end is connected to the through holes and the flanges by loose fit, and is in contact with and connected to the connecting surface of the copper embedding layer on the flange inner surfaces by welding, and the second end is in contact with and connected to the connecting surface of the copper embedding layer on the groove inner surface also by welding.
- the second end of the at least one copper heat pipe has an exposed surface exposed from the open side of the groove; and a contact surface in contact with and connected to the connecting surface of the copper embedding layer provided on the groove inner surface.
- the bottom surface is another area of the aluminum fin assembly to be connected to other members of the heat sink structure and has the copper embedding layer provided thereon.
- FIGS. 1 A and 1 B are exploded and assembled bottom perspective views, respectively, of a heat sink structure with heat pipe according to a preferred embodiment of the present invention
- FIG. 1 C is an assembled top perspective view of the heat sink structure with heat pipe according to the preferred embodiment of the present invention.
- FIG. 1 D shows an outermost fin of an aluminum fin assembly included in the present invention is turned inside out to connect to other fins
- FIG. 2 A is a sectional view of the aluminum fin assembly in the present invention.
- FIG. 2 B is a sectional view showing the connecting of the aluminum fin assembly with a copper heat pipe
- FIGS. 3 A and 3 B show the aluminum fin assembly before and after being provided with a copper embedding layer.
- FIGS. 1 A and 1 B are exploded and assembled bottom perspective views, respectively, of a heat sink structure 10 with heat pipe according to the present invention
- FIG. 1 C is an assembled top perspective view of the present invention
- FIG. 1 D shows an outermost fin of an aluminum fin assembly included in the present invention is turned inside out to connect to other fins
- FIG. 2 A is a sectional view of the aluminum fin assembly in the present invention
- FIG. 2 B is a sectional view showing the connecting the aluminum fin assembly with a copper heat pipe.
- the heat sink structure 10 includes an aluminum fin assembly 11 and at least one copper heat pipe 121 .
- the aluminum fin assembly 11 has a bottom surface 113 and a top surface 116 .
- each groove 115 On the bottom surface 113 , there is provided at least one groove 115 . In the illustrated preferred embodiment, two grooves 115 are shown. Every groove 115 has an open side 1151 located flush with the bottom surface 113 and a groove inner surface 1152 recessed from the bottom surface 113 . The bottom surface 113 and the groove inner surfaces 1152 are areas on the aluminum fin assembly 11 to be connected to other copper parts as will be described in detail later.
- the aluminum fin assembly 11 is formed of a plurality of fins 111 sequentially fastened to one another in a horizontal direction or a vertical direction, and any two adjacent fins 111 define a flow passage 117 between them.
- the fins 111 are made of aluminum or an aluminum alloy.
- every aluminum fin 111 has an upper bent edge 1111 and a lower bent edge 1112 , which are projected from one side of the aluminum fin 111 to align with the upper bent edge 1111 and the lower bent edge 1112 of another adjacent aluminum fin 111 .
- the upper bent edge 1111 and the lower bent edge 1112 are respectively provided with at least one fastening section 11111 , 11121 .
- the fastening sections 11111 , 11121 are snap-fit structures.
- the aluminum fins 111 are sequentially horizontally connected to one another by snap fitting the fastening sections 11111 , 11121 of one aluminum fin 111 to the fastening sections 11111 , 11121 on another adjacent aluminum fin 111 to thereby form a heat sink structure with snap-fitted fins.
- the upper bent edges 1111 together form the top surface 116 of the aluminum fin assembly 11
- the lower bent edges 1112 together form the bottom surface 113 of the aluminum fin assembly 11
- the lower bent edge 1112 of every aluminum fin 111 is provided with at least one downward opened recess.
- the aluminum fins 111 are sequentially fastened together, the downward opened recesses are aligned with one another to constitute the groove 115 on the bottom surface 113 .
- the aluminum fins 111 are respectively provided with at least one through hole 114 , which extend through the aluminum fin 111 in a thickness direction thereof and are aligned with one another. Every through hole 114 has a flange 1141 formed around a rim thereof and projected from one side of the aluminum fin 111 .
- the flanges 1141 are projected from a front side of the aluminum fins 111 .
- the flanges 1141 respectively define a flange inner surface 1143 .
- the aluminum fin assembly 11 may be otherwise formed by sequentially vertically fastening the aluminum fins 111 to one another. As can be seen in FIG. 1 D , an outermost aluminum fin 111 of the aluminum fin assembly 11 is turned inside out when being connected to an adjacent aluminum fin 111 , so that no upper bent edge 1111 and lower bent edge 1112 would expose to outside and undesirably scratch other members of the heat sink structure 10 .
- each of the copper heat pipes 121 includes a first end 1211 and a second end 1212 .
- the first ends 1211 are extended through the through holes 114 and connected to the flanges 1141 through loose fit. That is, the flange inner surfaces 1143 of the flanges 1141 respectively have an inner diameter slightly larger than an outer diameter of the first ends 1211 of the copper heat pipes 121 .
- the second ends 1212 are extended to the bottom surface 113 of the aluminum fin assembly 11 and through the grooves 115 .
- the second ends 1212 of the copper heat pipes 121 respectively have an exposed surface 12121 corresponding to the open side 1151 of the groove 115 and a contact surface 12122 facing toward the groove inner surface 1152 .
- every copper heat pipe 121 has a U-shaped section 1213 formed between the first end 1211 and the second end 1212 to extend from the first end 1211 to the second end 1212 .
- the first end 1211 and the second end 1212 of each copper heat pipe 121 serve as a condensation end and an evaporation end, respectively.
- the copper heat pipe 121 also has at least one wick structure and a working fluid provided therein.
- the at least one wick structure may be, for example, a plurality of grooves, a powder sintered structure, a mesh structure, a fibrous structure, a corrugated plate, or any combination thereof extended in the copper heat pipe 121 from the first end 1211 to the second end 1212 .
- the first end 1211 is round in cross section while the second end 1212 is D-shaped or flat in cross section. That is, the exposed surface of the second end 1212 is a flat surface formed by, for example, pressing with a tool or milling with a milling cutter and is located flush with the bottom surface 113 of the aluminum fin assembly 11 .
- the first end 1211 and the second end 1212 can be the same in cross section, such as a round or a flat cross section.
- FIGS. 3 A and 3 B show the aluminum fin assembly 11 before and after being provided with a copper embedding layer 14 . Please refer to FIGS. 3 A and 3 B along with FIGS. 1 A, 1 B, 2 A and 2 B .
- a copper embedding layer 14 is provided at areas of the aluminum fin assembly 11 corresponding to the flange inner surfaces 1143 , the groove inner surfaces 1152 and the bottom surface 113 , at where the aluminum fin assembly 11 is to be connected to other members of the heat sink structure 10 .
- the copper embedding layer 14 includes a deepening surface 141 and a connecting surface 142 , which are located at two opposite sides of the copper embedding layer 14 .
- the deepening surface 141 bonds or grips to, is embedded or buried in, or is deposited on the flange inner surfaces 1143 , the groove inner surface 1152 and the bottom surface 113 ; and the connecting surface 142 is an exposed surface of the copper embedding layer 14 for contacting with and connecting to other members of the heat sink structure 10 .
- the copper embedding layer 14 can be copper sheet, copper foil, copper powder/granules, or liquid copper applied to the flange inner surfaces 1143 , the groove inner surfaces 1152 and the bottom surface 113 through mechanical processing, such as pneumatic pressing, hydraulic pressing, stamping, oil pressing, extruding, or hammering; or through surface finishing, such as spraying, electroplating or printing; or through chemical processing, such as electroplating or anodizing.
- mechanical processing such as pneumatic pressing, hydraulic pressing, stamping, oil pressing, extruding, or hammering
- surface finishing such as spraying, electroplating or printing
- chemical processing such as electroplating or anodizing.
- a part of the copper embedding layer 14 directly grips to, is embedded or buried in, deeply penetrates into, or is deposited on the flange inner surfaces 1143 , the groove inner surface 1152 and the bottom surface 113 to form the deepening surface 141 of the copper embedding layer 14 .
- the copper embedding layer 14 is not only connected at the connecting surface 142 to the flange inner surfaces 1143 , the groove inner surface 1152 and the bottom surface 113 , but also has the deepening surface 141 gripped to, embedded or buried in, or deposited on the flange inner surfaces 1143 , the groove inner surface 1152 and the bottom surface 113 to form a foundation of the copper embedding layer 14 , which increases the binding strength between the copper embedding layer 14 and the flange inner surfaces 1143 , the groove inner surface 1152 and the bottom surface 113 and prevent the copper embedding layer 14 from peeling off or separating from the flange inner surfaces 1143 , the groove inner surface 1152 and the bottom surface 113 .
- the through holes 114 on the aluminum fin assembly 11 can be in contact with and connected to the first ends 1211 or the copper heat pipes 121 via the connecting surface 142 of the copper embedding layer 14 on the flange inner surfaces 1143 for example by welding; and the grooves 115 on the aluminum fin assembly 11 can be in contact with and connected to the contact surfaces 12122 of the second ends 1212 of the copper heat pipes 121 via the connecting surface 142 of the copper embedding layer 14 on the groove inner surfaces 1152 . More specifically, for example, solder can be used between the connecting surface 142 of the copper embedding layer 14 and the contact surfaces 12122 of the copper heat pipes 121 to weld them to one another.
- the connecting surface 142 of the copper embedding layer 14 and the contact surfaces 12122 of the copper heat pipes 121 can be connected together by supersonic welding or laser welding.
- the aluminum fin assembly 11 can be directly welded to the copper heat pipes 121 made of a dissimilar metal material without the need of electroless nickel plating.
- the bottom surface 113 of the aluminum fin assembly 11 may be optionally connected to a heat conducting base made of a copper-based material, such as pure copper or any copper alloy.
- the heat conducting base can be a solid base plate or a hollow vapor chamber internally provided with a working fluid.
- the bottom surface 113 can be connected, such as by welding, to the copper-based heat conducting base via the connecting surface 142 of the copper embedding layer 14 , while the exposed surfaces at the second ends 1212 of the copper heat pipes 121 can also be directly connected, such as by welding, to the copper-based heat conducting base.
- the aluminum fin assembly 11 With the copper embedding layer 14 , the aluminum fin assembly 11 can be directly welded to the copper-based heat conducting base made of a dissimilar metal material without the need of electroless nickel plating. Thus, no toxic substances would be produced in the manufacturing process of the heat sink structure 10 to ensure good environmental protection and the problem of forming eutectic as found in the prior art is also improved.
- the copper embedding layer 14 is formed on the groove inner surfaces 1152 and the bottom surface 113 .
- the present invention is not limited thereto.
- the bottom surface 113 of the aluminum fin assembly 11 may be provided at a substantially central area with one single groove 115 having flat and straight groove inner surfaces 1152 , on which the copper embedding layer 14 is formed; and there is a plurality of copper heat pipes 121 (for example, three copper heat pipes 121 ), second ends 1212 of which are extended through the groove 115 and arranged side by side.
- the second ends 1212 respectively have a rectangular cross section, such that the contact surfaces 12122 of the second ends 1212 of the copper heat pipes 121 together form a common plane corresponding to the flat and straight groove inner surface 1152 .
- the contact surfaces 12122 are in contact with and connected to the connecting surface 142 of the copper embedding layer 14 by, for example, welding, ultrasonic welding, or laser welding.
- the exposed surfaces 12121 of the second ends 1212 of the copper heat pipes 121 together form another common plane, which is in contact with an upper surface of a heat-producing element, such as a central processing unit or a microprocessor.
- the two copper heat pipes 121 are extended from the same side into the aluminum fin assembly 11 .
- the heat sink structure 10 can include a plurality of copper heat pipes 121 and the aluminum fin assembly 11 is formed with through holes and grooves 115 respectively in a number the same as the copper heat pipes 121 ; and the copper heat pipes 121 can be arranged at staggered or non-staggered locations and extended into the aluminum fin assembly 11 from two opposite sides thereof to upgrade the heat dissipation efficiency of the heat sink structure 10 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111103914A TWI800244B (zh) | 2022-01-28 | 2022-01-28 | 具有熱管之散熱器總成 |
TW111103914 | 2022-01-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20230243603A1 true US20230243603A1 (en) | 2023-08-03 |
Family
ID=86948916
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US18/064,293 Pending US20230243603A1 (en) | 2022-01-28 | 2022-12-12 | Heat sink structure with heat pipe |
US18/064,292 Pending US20230243597A1 (en) | 2022-01-28 | 2022-12-12 | Heat sink assembly with heat pipe |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US18/064,292 Pending US20230243597A1 (en) | 2022-01-28 | 2022-12-12 | Heat sink assembly with heat pipe |
Country Status (2)
Country | Link |
---|---|
US (2) | US20230243603A1 (zh) |
TW (1) | TWI800244B (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM241626U (en) * | 2003-09-30 | 2004-08-21 | Huei-Ran Wu | Improvement on heat-dissipating fin assembly comprising heat pipe coupled to heat-dissipating fin |
CN100343611C (zh) * | 2003-12-31 | 2007-10-17 | 奇鋐科技股份有限公司 | 散热模块及其制造方法 |
TW200538696A (en) * | 2005-08-17 | 2005-12-01 | Cooler Master Co Ltd | Heat dissipation fins, heat sink formed of fins, and method for producing the same |
TWI309760B (en) * | 2005-12-16 | 2009-05-11 | Foxconn Tech Co Ltd | Heat dissipation device |
CN102116586B (zh) * | 2009-12-30 | 2013-11-06 | 富准精密工业(深圳)有限公司 | 散热装置 |
TWM629047U (zh) * | 2022-01-28 | 2022-07-01 | 奇鋐科技股份有限公司 | 具有熱管之散熱器總成 |
-
2022
- 2022-01-28 TW TW111103914A patent/TWI800244B/zh active
- 2022-12-12 US US18/064,293 patent/US20230243603A1/en active Pending
- 2022-12-12 US US18/064,292 patent/US20230243597A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230243597A1 (en) | 2023-08-03 |
TW202331184A (zh) | 2023-08-01 |
TWI800244B (zh) | 2023-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103502768B (zh) | 制造具有增强材料系统的换热器的方法 | |
JP3597436B2 (ja) | 熱交換器 | |
TWI296039B (en) | Heat dissipation module and heat column thereof | |
US20230243603A1 (en) | Heat sink structure with heat pipe | |
CN114322616A (zh) | 具有热管的散热器总成 | |
TWM629047U (zh) | 具有熱管之散熱器總成 | |
CN105387439A (zh) | 一种led光源模块散热器和led照明设备的制造方法 | |
TWM629434U (zh) | 散熱模組結構 | |
CN217210494U (zh) | 具有热管的散热器总成 | |
US20230243608A1 (en) | Thermal module structure | |
US20230243598A1 (en) | Thermal module structure | |
TWM627124U (zh) | 散熱裝置 | |
CN216820488U (zh) | 散热模块 | |
TWM627850U (zh) | 散熱模組結構 | |
JP2006245560A (ja) | 放熱フィン構造及びその製造方法 | |
US20230243596A1 (en) | Heat dissipation device | |
TWI824401B (zh) | 散熱裝置組合 | |
CN216671612U (zh) | 散热模块结构 | |
TW202331187A (zh) | 散熱模組 | |
CN113056344B (zh) | 热管结构体、散热器、热管结构体的制造方法及散热器的制造方法 | |
CN216820486U (zh) | 散热装置 | |
CN114245697A (zh) | 散热模块 | |
CN216820489U (zh) | 散热装置组合 | |
CN114279246A (zh) | 散热模块结构 | |
CN114284221A (zh) | 散热模块结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, SHENG-HUANG;LIN, YUAN-YI;REEL/FRAME:062114/0366 Effective date: 20220708 |