US20230122733A1 - Transportation method - Google Patents
Transportation method Download PDFInfo
- Publication number
- US20230122733A1 US20230122733A1 US18/082,641 US202218082641A US2023122733A1 US 20230122733 A1 US20230122733 A1 US 20230122733A1 US 202218082641 A US202218082641 A US 202218082641A US 2023122733 A1 US2023122733 A1 US 2023122733A1
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- Prior art keywords
- fabry
- perot interference
- layer
- accommodating container
- wafer
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Images
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/12—Generating the spectrum; Monochromators
- G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
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- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/284—Interference filters of etalon type comprising a resonant cavity other than a thin solid film, e.g. gas, air, solid plates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Definitions
- One aspect of the present invention relates to a transportation method.
- a Fabry-Perot interference filter including a substrate, a fixed mirror and a movable mirror facing each other via a gap on the substrate is known (for example, refer to Patent Literature 1).
- Patent Literature 1 Japanese Unexamined Patent Publication No. 2013-506154
- the Fabry-Perot interference filter In transportation of such a Fabry-Perot interference filter, the Fabry-Perot interference filter can be individually accommodated in an accommodating container.
- an increase in the market demand for the Fabry-Perot interference filter as described above in recent years has led to a necessity to transport a large number of Fabry-Perot interference filters at one time. This makes it necessary to perform repeated operations of accommodating the Fabry-Perot interference filters individually in the accommodating container, leading to concerns of heavier burden due to longer operation time and the risk of occurrence of faulty products due to deterioration in operation accuracy (for example, a risk of occurrence of breakage in a movable mirror due to contact of the accommodating container with the movable mirror).
- a method capable of transporting a large number of Fabry-Perot interference filters with reduced risk of filter breakage is desired.
- An object of one aspect of the present invention is to provide a transportation method capable of transporting a large number of Fabry-Perot interference filters with reduced risk of breakage.
- a transportation method is a method for transporting an object including a plurality of Fabry-Perot interference filters, the method including a first step of accommodating the object in an accommodating container, in which the Fabry-Perot interference filter includes a substrate, a first mirror portion and a second mirror portion provided on the substrate and facing each other via a gap and in which a distance from each other is variable, and in the first step, the object is accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged.
- the transportation object includes a plurality of Fabry-Perot interference filters.
- the two-dimensionally arranged Fabry-Perot interference filters is accommodated and supported in the accommodating container.
- this method makes it possible to transport a plurality of (a large number of) Fabry-Perot interference filters with a simple configuration with reduced risk of breakage.
- the object may be a wafer in which the plurality of Fabry-Perot interference filters is formed, the wafer may include a first surface on the sides of the first mirror portion and the second mirror portion with respect to the substrate and includes a second surface opposite to the first surface, and in the first step, the object may be accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged as the wafer.
- the plurality of Fabry-Perot interference filters is integrated as a wafer. For this reason, it is possible to transport a large number of (a plurality of) Fabry-Perot interference filters with a simpler configuration with reduced risk of breakage.
- the object may include a bonding layer bonded to the second surface, a support body may be provided at an outer edge portion of the bonding layer, a clamping portion configured to clamp the support body may be provided on an inner surface of the accommodating container, and in the first step, the object may be supported in the accommodating container by clamping the support body with the clamping portion.
- the object can be supported without bringing the clamping portion into contact with the wafer being the object. This prevents breakage in the Fabry-Perot interference filter due to contact with the clamping portion when the object is accommodated and supported.
- the object in the first step, may be supported by vertically clamping the support body with the clamping portion in a state where the first surface faces downward.
- the first surface on the side of the mirror portion faces downward in the accommodating container.
- an effective area including the plurality of Fabry-Perot interference filters and a dummy area provided to surround the effective area so as to form an outer edge may be formed in the wafer
- the dummy area may include a plurality of dummy filters in which an intermediate layer is provided between the first mirror portion and the second mirror portion facing each other, a clamping portion configured to clamp the object in the dummy area may be provided on an inner surface of the accommodating container, and in the first step, the object may be supported in the accommodating container by clamping the dummy area with the clamping portion.
- the object can be supported in the accommodating container without separately using a member such as a support body.
- the dummy area is provided at the outer edge portion of the wafer being the object, the strength of the wafer is improved and the warpage is suppressed. For this reason, the object can be accommodated easily in the accommodating container.
- the object in the first step, may be supported in the accommodating container by vertically clamping the dummy area with the clamping portion in a state where the first surface faces downward.
- the first surface on the side of the mirror portion faces downward in the accommodating container.
- the object may include a bonding layer and the plurality of Fabry-Perot interference filters separately formed from each other, the Fabry-Perot interference filter may be two-dimensionally arranged and may be bonded to the bonding layer, a support body may be provided on an outer edge portion of the bonding layer, a clamping portion configured to vertically clamp the support body may be provided on an inner surface of the accommodating container, the Fabry-Perot interference filter may include a first surface on the sides of the first mirror portion and the second mirror portion with respect to the substrate and includes a second surface that is a surface opposite to the first surface and that is bonded to the bonding layer, and in the first step, the object may be supported in the accommodating container by clamping the support body with the clamping portion in a state where the first surface faces downward.
- the plurality of Fabry-Perot interference filters formed separately from each other is two-dimensionally arranged so as to be bonded to the bonding layer. This makes it easier to store and support the filters so as not to come in contact with the mirror portion. Furthermore, the first surface faces downward in the accommodating container. For this reason, even when the mirror portion is broken in one Fabry-Perot interference filter, fragments of the broken portion are unlikely to influence other Fabry-Perot interference filters.
- a moisture absorbing layer may be provided on a surface of the bonding layer opposite to the second surface
- an adsorption layer may be provided on a surface of the moisture absorbing layer opposite to the bonding layer
- the object in the first step, the object may be accommodated and supported in the accommodating container such that the adsorption layer of one object faces the first surface of another object in a downside of the first surface of another object.
- the moisture absorbing layer is disposed at a position closer to the Fabry-Perot interference filter as compared with a case where a moisture absorbing member is disposed at a bottom of the accommodating container, for example.
- the adsorption layer is disposed in a downside of the first surface so as to face the first surface. For this reason, even when the mirror portion is broken in one Fabry-Perot interference filter, fragments of the broken portion will be adsorbed onto the adsorption layer, making is possible to prevent the situation in which the broken fragments influence other Fabry-Perot interference filters.
- the transportation method may include, after the first step, a second step of accommodating the accommodating container into a vacuum pack and evacuating the inside of the accommodating container by exhausting the vacuum pack.
- a second step of accommodating the accommodating container into a vacuum pack and evacuating the inside of the accommodating container by exhausting the vacuum pack.
- FIG. 1 is a plan view of a Fabry-Perot interference filter of the present embodiment.
- FIG. 2 is a bottom view of the Fabry-Perot interference filter illustrated in FIG. 1 .
- FIG. 3 is a cross-sectional view of the Fabry-Perot interference filter taken along line in FIG. 1 .
- FIG. 4 is a cross-sectional view of a dummy filter according to the present embodiment.
- FIG. 5 is a plan view of a wafer according to the present embodiment.
- FIG. 6 is an enlarged plan view of a part of the wafer illustrated in FIG. 5 .
- FIG. 7 is a cross-sectional view of a Fabry-Perot interference filter portion and a dummy filter portion of the wafer illustrated in FIG. 5 .
- FIG. 8 is a schematic cross-sectional view illustrating an example of a transportation method according to the present embodiment.
- FIG. 9 is a schematic cross-sectional view illustrating an example of a transportation method according to a modification.
- FIG. 10 is a cross-sectional view of a wafer according to a modification.
- the transportation method according to the present embodiment is a method for transporting an object including a Fabry-Perot interference filter. Therefore, an embodiment of an object including a Fabry-Perot interference filter as a transportation object will be described first.
- FIG. 1 is a plan view of a Fabry-Perot interference filter of the present embodiment.
- FIG. 2 is a bottom view of the Fabry-Perot interference filter illustrated in FIG. 1 .
- FIG. 3 is a cross-sectional view of the Fabry-Perot interference filter taken along line in FIG. 1 .
- a Fabry-Perot interference filter 1 includes a substrate 11 .
- the substrate 11 has a first surface 11 a and a second surface 11 b opposite to the first surface 11 a .
- a reflection prevention layer 21 On the first surface 11 a , a reflection prevention layer 21 , a first laminate 22 , an intermediate layer 23 , and a second laminate 24 are laminated in this order.
- a gap (air gap) S is defined between the first laminate 22 and the second laminate 24 by the frame-like intermediate layer 23 .
- the shape and the positional relationship of each of portions when viewed in a direction perpendicular to the first surface 11 a are as follows.
- the outer edge of the substrate 11 has a rectangular shape with a side being several hundred ⁇ m to several mm.
- the outer edge of the substrate 11 and an outer edge of the second laminate 24 are aligned with each other.
- An outer edge of the reflection prevention layer 21 , an outer edge of the first laminate 22 , and an outer edge of the intermediate layer 23 are aligned with each other.
- the substrate 11 has an outer edge portion 11 c positioned on an outer side of the outer edge of the intermediate layer 23 with respect to the center of the gap S.
- the outer edge portion 11 c has a frame shape and surrounds the intermediate layer 23 when viewed in a direction perpendicular to the first surface 11 a .
- the gap S has a circular shape, for example.
- the Fabry-Perot interference filter 1 transmits light having a predetermined wavelength through a light transmission region 1 a defined in a center portion of the Fabry-Perot interference filter 1 .
- the light transmission region 1 a is a columnar region.
- the substrate 11 is formed of silicon, quartz, or glass, for example.
- the reflection prevention layer 21 and the intermediate layer 23 are formed of silicon oxide, for example.
- the thickness of the intermediate layer 23 ranges from several tens of nm to several tens of ⁇ m, for example.
- a portion corresponding to the light transmission region 1 a in the first laminate 22 functions as a first mirror portion 31 .
- the first mirror portion 31 is a fixed mirror.
- the first mirror portion 31 is disposed on the first surface 11 a via the reflection prevention layer 21 .
- the first laminate 22 includes alternate laminations of each of a plurality of polysilicon layers 25 and each of a plurality of silicon nitride layers 26 .
- the Fabry-Perot interference filter 1 includes layers of a polysilicon layer 25 a , a silicon nitride layer 26 a , a polysilicon layer 25 b , a silicon nitride layer 26 b , and a polysilicon layer 25 c laminated on the reflection prevention layer 21 in this order.
- each of the polysilicon layers 25 and the silicon nitride layers 26 included in the first mirror portion 31 can be set to an integral multiple of 1 ⁇ 4 of a center transmission wavelength.
- the first mirror portion 31 may be directly disposed on the first surface 11 a without interposing the reflection prevention layer 21 .
- the portion corresponding to the light transmission region 1 a in the second laminate 24 functions as a second mirror portion 32 .
- the second mirror portion 32 is a movable mirror.
- the second mirror portion 32 faces the first mirror portion 31 via the gap S on a side opposite to the substrate 11 with respect to the first mirror portion 31 .
- the direction in which the first mirror portion 31 and the second mirror portion 32 face each other is parallel to a direction perpendicular to the first surface 11 a .
- the second laminate 24 is disposed on the first surface 11 a via the reflection prevention layer 21 , the first laminate 22 , and the intermediate layer 23 .
- the second laminate 24 includes alternate laminations of each of the plurality of polysilicon layers 27 and each of the plurality of silicon nitride layers 28 .
- the Fabry-Perot interference filter 1 includes layers of a polysilicon layer 27 a , a silicon nitride layer 28 a , a polysilicon layer 27 b , a silicon nitride layer 28 b , and a polysilicon layer 27 c laminated on the intermediate layer 23 in this order.
- the optical thickness of each of the polysilicon layers 27 and the silicon nitride layers 28 included in the second mirror portion 32 can be set to an integral multiple of 1 ⁇ 4 of a center transmission wavelength.
- silicon oxide layers may be used in place of the silicon nitride layers.
- examples of the material applicable for each of layers forming the first laminate 22 and the second laminate 24 include titanium oxide, tantalum oxide, zirconium oxide, magnesium fluoride, aluminum oxide, calcium fluoride, silicon, germanium, zinc sulfide, or the like.
- the surface of the first mirror portion 31 on the gap S side (surface of the polysilicon layer 25 c ) and the surface of the second mirror portion 32 on the gap S side (surface of the polysilicon layer 27 a ) directly face each other via the gap S.
- an electrode layer, a protective layer, or the like may be formed on the surface of the first mirror portion 31 on the gap S side and on the surface of the second mirror portion 32 on the gap S side.
- the first mirror portion 31 and the second mirror portion 32 face each other via the gap S with the presence of these interposed layers. In other words, even in such a case, a facing configuration between the first mirror portion 31 and the second mirror portion 32 via the gap S can be achieved.
- a plurality of through-holes 24 b is formed at a portion of the second laminate 24 corresponding to the gap S (a portion overlapping the gap S when viewed in a direction perpendicular to the first surface 11 a ). Each of the through-holes 24 b extends to reach the gap S from a surface 24 a of the second laminate 24 opposite to the intermediate layer 23 .
- the plurality of through-holes 24 b is formed so as not to substantially influence the function of the second mirror portion 32 .
- the plurality of through-holes 24 b is used for forming the gap S by removing a portion of the intermediate layer 23 through etching.
- the second laminate 24 further includes a covering portion 33 and a peripheral edge portion 34 .
- the second mirror portion 32 , the covering portion 33 , and the peripheral edge portion 34 are integrally formed to have a portion of a same laminated structure and to be continuous to each other.
- the covering portion 33 surrounds the second minor portion 32 when viewed in a direction perpendicular to the first surface 11 a .
- the covering portion 33 covers a surface 23 a of the intermediate layer 23 on a side opposite to the substrate 11 , a side surface 23 b of the intermediate layer 23 (a side surface on the outer side, that is, a side surface on a side opposite to the gap S side), a side surface 22 a of the first laminate 22 , and a side surface 21 a of the reflection prevention layer 21 , so as to reach the first surface 11 a . That is, the covering portion 33 covers the outer edge of the intermediate layer 23 , the outer edge of the first laminate 22 , and the outer edge of the reflection prevention layer 21 .
- the peripheral edge portion 34 surrounds the covering portion 33 when viewed in a direction perpendicular to the first surface 11 a .
- the peripheral edge portion 34 is positioned on the first surface 11 a in the outer edge portion 11 c .
- the outer edge of the peripheral edge portion 34 is aligned with the outer edge of the substrate 11 when viewed in a direction perpendicular to the first surface 11 a .
- the peripheral edge portion 34 is thinned along an outer edge of the outer edge portion 11 c . That is, the portion along the outer edge of the outer edge portion 11 c in the peripheral edge portion 34 is thinner compared to other portions excluding the portion along the outer edge of the peripheral edge portion 34 .
- the peripheral edge portion 34 is thinned by removing a portion of the polysilicon layer 27 and the silicon nitride layer 28 included in the second laminate 24 .
- the peripheral edge portion 34 includes a non-thinned portion 34 a continuous to the covering portion 33 , and a thinned portion 34 b surrounding the non-thinned portion 34 a .
- the polysilicon layer 27 and the silicon nitride layer 28 are removed excluding the polysilicon layer 27 a directly provided on the first surface 11 a.
- the height from the first surface 11 a to a surface 34 c of the non-thinned portion 34 a on a side opposite to the substrate 11 is lower than the height from the first surface 11 a to the surface 23 a of the intermediate layer 23 .
- the height from the first surface 11 a to the surface 34 c of the non-thinned portion 34 a ranges from 100 nm to 5000 nm, for example.
- the height from the first surface 11 a to the surface 23 a of the intermediate layer 23 ranges from 500 nm to 20000 nm, for example.
- the width of the thinned portion 34 b (distance between the outer edge of the non-thinned portion 34 a and the outer edge of the outer edge portion 11 c when viewed in the direction perpendicular to the first surface 11 a ) is 0.01 times the thickness of the substrate 11 , or more.
- the width of the thinned portion 34 b ranges from 5 ⁇ m to 400 ⁇ m, for example.
- the thickness of the substrate 11 ranges from 500 ⁇ m to 800 ⁇ m, for example.
- a first electrode 12 is formed in the first mirror portion 31 so as to surround the light transmission region 1 a when viewed in a direction perpendicular to the first surface 11 a .
- the first electrode 12 is formed by doping impurities into the polysilicon layer 25 c to achieve low resistivity.
- a second electrode 13 is formed in the first mirror portion 31 so as to include the light transmission region 1 a when viewed in a direction perpendicular to the first surface 11 a .
- the second electrode 13 is formed by doping impurities into the polysilicon layer 25 c to achieve low resistivity.
- the second electrode 13 can be sized to include the entire light transmission region 1 a when viewed in a direction perpendicular to the first surface 11 a , the second electrode 13 may be set to substantially the same size as that of the light transmission region 1 a.
- a third electrode 14 is formed in the second mirror portion 32 .
- the third electrode 14 faces the first electrode 12 and the second electrode 13 via the gap S.
- the third electrode 14 is formed by doping impurities into the polysilicon layer 27 a to achieve low resistivity.
- a pair of terminals 15 are provided to face each other across the light transmission region 1 a .
- Each of the terminals 15 is disposed inside a through-hole leading from the surface 24 a of the second laminate 24 to the first laminate 22 .
- Each of the terminals 15 is electrically connected to the first electrode 12 through wiring 12 a .
- each of the terminals 15 is formed with a metal film of aluminum, an alloy thereof, or the like.
- a pair of terminals 16 are provided to face each other across the light transmission region 1 a .
- Each of the terminals 16 is disposed inside a through-hole leading from the surface 24 a of the second laminate 24 to the first laminate 22 .
- Each of the terminals 16 is electrically connected to the second electrode 13 through wiring 13 a and is electrically connected to the third electrode 14 through wiring 14 a .
- the terminals 16 are formed with a metal film of aluminum, an alloy thereof, or the like.
- the facing direction of the pair of terminals 15 and the facing direction of the pair of terminals 16 are orthogonal to each other (refer to FIG. 1 ).
- a plurality of trenches 17 and 18 is provided on a surface 22 b of the first laminate 22 .
- the trench 17 annularly extends to surround a connection with respect to the terminals 16 in the wiring 13 a .
- the trench 17 electrically insulates the first electrode 12 and the wiring 13 a from each other.
- the trench 18 annularly extends along an inner edge of the first electrode 12 .
- the trench 18 electrically insulates the first electrode 12 and a region of the first electrode 12 on an inner side (second electrode 13 ) from each other.
- Each of the regions in the trenches 17 and 18 may be an insulating material or a gap.
- a trench 19 is provided on the surface 24 a of the second laminate 24 .
- the trench 19 annularly extends to surround the terminals 15 .
- the trench 19 electrically insulates the terminals 15 and the third electrode 14 from each other.
- the region inside the trench 19 may be an insulating material or a gap.
- the second surface 11 b of the substrate 11 includes layers of a reflection prevention layer 41 , a third laminate 42 , an intermediate layer 43 , and a fourth laminate 44 laminated in this order.
- the reflection prevention layer 41 and the intermediate layer 43 each have a configuration similar to those of the reflection prevention layer 21 and the intermediate layer 23 .
- the third laminate 42 and the fourth laminate 44 each have a laminated structure symmetrical to those of the first laminate 22 and the second laminate 24 with respect to the substrate 11 .
- the reflection prevention layer 41 , the third laminate 42 , the intermediate layer 43 , and the fourth laminate 44 have a function of suppressing warpage of the substrate 11 .
- the third laminate 42 , the intermediate layer 43 , and the fourth laminate 44 are thinned along the outer edge of the outer edge portion 11 c . That is, the portion along the outer edge of the outer edge portion 11 c in the third laminate 42 , the intermediate layer 43 , and the fourth laminate 44 is thinner compared to other portions excluding the portion along the outer edge in the third laminate 42 , the intermediate layer 43 , and the fourth laminate 44 .
- the third laminate 42 , the intermediate layer 43 , and the fourth laminate 44 are thinned by removing all of the third laminate 42 , the intermediate layer 43 , and the fourth laminate 44 in a portion overlapping the thinned portion 34 b when viewed in a direction perpendicular to the first surface 11 a.
- the third laminate 42 , the intermediate layer 43 , and the fourth laminate 44 have an opening 40 a so as to include the light transmission region 1 a when viewed in a direction perpendicular to the first surface Ila.
- the opening 40 a has a diameter approximately the same as the size of the light transmission region 1 a .
- the opening 40 a is open on the light emission side.
- the bottom surface of the opening 40 a reaches the reflection prevention layer 41 .
- a light shielding layer 45 is formed on a surface of the fourth laminate 44 on the light emission side.
- the light shielding layer 45 is formed of aluminum or the like.
- a protective layer 46 is formed on a surface of the light shielding layer 45 and an inner surface of the opening 40 a .
- the protective layer 46 covers the outer edges of the third laminate 42 , the intermediate layer 43 , the fourth laminate 44 , and the light shielding layer 45 and covers the reflection prevention layer 41 on the outer edge portion 11 c .
- the protective layer 46 is formed of aluminum oxide.
- An optical influence due to the protective layer 46 can be disregarded by causing the thickness of the protective layer 46 to range from 1 nm to 100 nm (approximately 30 nm, for example).
- the Fabry-Perot interference filter 1 configured as described above, when a voltage is applied between the first electrode 12 and the third electrode 14 via the pair of terminals 15 and 16 , an electrostatic force corresponding to the voltage is generated between the first electrode 12 and the third electrode 14 .
- the second mirror portion 32 is attracted to the first mirror portion 31 side secured to the substrate 11 by the electrostatic force, and the distance between the first mirror portion 31 and the second mirror portion 32 is adjusted. In this manner, in the Fabry-Perot interference filter 1 , the distance between the first minor portion 31 and the second mirror portion 32 changes by the electrostatic force.
- the wavelength of light to be transmitted through the Fabry-Perot interference filter 1 depends on the distance between the first minor portion 31 and the second mirror portion 32 in the light transmission region 1 a . Therefore, the wavelength of light to be transmitted can be appropriately selected by adjusting the voltage to be applied between the first electrode 12 and the third electrode 14 .
- the second electrode 13 has the same potential as that of the third electrode 14 . Therefore, the second electrode 13 functions as a compensation electrode to keep the first mirror portion 31 and the second mirror portion 32 flat in the light transmission region 1 a.
- a spectroscopic spectrum can be obtained by detecting light transmitted through the light transmission region 1 a of the Fabry-Perot interference filter 1 using a light detector while changing the voltage to be applied to the Fabry-Perot interference filter 1 (that is, while changing the distance between the first minor portion 31 and the second minor portion 32 in the Fabry-Perot interference filter 1 ).
- the Fabry-Perot interference filter 1 has a membrane structure M including the first minor portion 31 and the second minor portion 32 facing each other via the gap S and in which a distance from each other is variable.
- the membrane structure M includes a main surface Ms opposite to the substrate 11 .
- the membrane structure M is a portion not overlapping the intermediate layer 23 in the first laminate 22 and the second laminate 24 when viewed in a direction intersecting (orthogonal to) the first surface 11 a of the substrate 11 and the main surface Ms. That is, the outer shape of the membrane structure M when viewed in the direction intersecting (orthogonal to) the main surface Ms is defined by an inner edge of the intermediate layer 23 , illustrated here in a circular shape (refer to FIG. 1 ).
- FIG. 4 is a cross-sectional view of a dummy filter according to the present embodiment.
- a dummy filter 2 is different from the Fabry-Perot interference filter 1 described above in that the plurality of through-holes 24 b is not formed in the second laminate 24 and the gap S is not formed in the intermediate layer 23 .
- an intermediate layer 23 is provided between the first minor portion 31 and the second minor portion 32 . That is, the second minor portion 32 is disposed on the surface 23 a of the intermediate layer 23 , not floating above the gap S.
- FIG. 5 is a plan view of the wafer according to the present embodiment.
- FIG. 6 is an enlarged plan view of a portion of the wafer illustrated in FIG. 5 .
- a wafer 100 includes a substrate layer 110 .
- the substrate layer 110 has a disk shape with a diameter of approximately 150 mm or 200 mm, with an orientation flat OF formed in a portion of the substrate layer 110 .
- the substrate layer 110 is formed of silicon, quartz, glass, or the like.
- a virtual straight line that passes through the center of the substrate layer 110 when viewed in the thickness direction of the substrate layer 110 and is parallel to the orientation flat OF is referred to as a first straight line 3
- a virtual straight line that passes through the center of the substrate layer 110 when viewed in the thickness direction of the substrate layer 110 and is perpendicular to the orientation flat OF is referred to as a second straight line 4 .
- the wafer 100 includes an effective area 101 and a dummy area 102 .
- the dummy area 102 is an area along an outer edge 110 c of the substrate layer 110 (that is, an outer edge 100 a of the wafer 100 ) (so as to form the outer edge 100 a ).
- the effective area 101 is an area inside the dummy area 102 .
- the dummy area 102 surrounds the effective area 101 when viewed in the thickness direction of the substrate layer 110 .
- the dummy area 102 is adjacent to the effective area 101 .
- the effective area 101 includes a plurality of two-dimensionally arranged Fabry-Perot interference filter portions 1 A.
- the plurality of Fabry-Perot interference filter portions 1 A is provided in the entire effective area 101 .
- the dummy area 102 includes a plurality of two-dimensionally arranged dummy filter portions 2 A.
- the plurality of dummy filter portions 2 A is provided in an area of the dummy area 102 excluding a pair of areas 102 a .
- One area 102 a is an area along the orientation flat OF.
- the other area 102 a is an area along the portion of the outer edge 110 c of the substrate layer 110 on the side opposite to the orientation flat OF.
- the Fabry-Perot interference filter portion 1 A and the dummy filter portion 2 A are adjacent to each other at a boundary between the effective area 101 and the dummy area 102 .
- the outer shape of the Fabry-Perot interference filter portion 1 A and the outer shape of the dummy filter portion 2 A are the same.
- the plurality of Fabry-Perot interference filter portions 1 A and the plurality of dummy filter portions 2 A are arranged so as to be symmetric about each of the first straight line 3 and the second straight line 4 orthogonal to each other.
- the plurality of dummy filter portions 2 A may be provided over the entire dummy area 102 .
- the plurality of dummy filter portions 2 A may be provided in an area other than one of the areas 102 a in the dummy areas 102 .
- Each of the plurality of Fabry-Perot interference filter portions 1 A is to be each of a plurality of Fabry-Perot interference filters 1 when the wafer 100 is cut along each of lines 5 .
- Each of the plurality of dummy filter portions 2 A is to be each of a plurality of dummy filters 2 when the wafer 100 is cut along each of the lines 5 .
- the plurality of lines 5 extends in a direction parallel to the orientation flat OF, and the plurality of lines 5 extends in a direction perpendicular to the orientation flat OF.
- each of the filter portions 1 A and 2 A has a rectangular shape when viewed in the thickness direction of the substrate layer 110 , each of the filter portions 1 A and 2 A is arranged in a two-dimensional matrix, and the plurality of lines 5 is set in a lattice pattern so as to pass between adjacent filter portions 1 A- 1 A, between adjacent filter portions 1 A- 2 A, and between adjacent filter portions 2 A- 2 A.
- the plurality of lines 5 is set in a lattice pattern so as to pass between adjacent filter portions 1 A- 1 A, between adjacent filter portions 1 A- 2 A, and between adjacent filter portions 2 A- 2 A.
- a 3 ⁇ 3 array including a certain Fabry-Perot interference filter portion 1 A or a dummy filter portion 2 A and including the Fabry-Perot interference filter 1 and/or the dummy filter portion 2 A surrounding the certain Fabry-Perot interference filter portion 1 A or the dummy filter portion 2 A is to be defined as a unit array.
- a plurality of the unit arrays is individually arranged in four regions divided by a first straight line 3 and a second straight line 4 in the wafer 100 .
- the same number of unit arrays are arranged in each of the four regions divided by the first straight line 3 and the second straight line 4 . Furthermore, here, the unit arrays are arranged symmetrically with respect to the first straight line 3 and the second straight line 4 .
- a unit array has its width (surface area) larger than its thickness (cross-sectional area).
- the substrate layer 110 is a layer that is to be a plurality of substrates 11 when the wafer 100 is cut along each of the lines 5 .
- the substrate layer 110 has a first surface 110 a and a second surface 110 b opposite to the first surface 110 a .
- a reflection prevention layer 210 is provided on the first surface 110 a of the substrate layer 110 .
- the reflection prevention layer 210 is a layer to be a plurality of reflection prevention layers 21 when the wafer 100 is cut along each of the lines 5 .
- a reflection prevention layer 410 is provided on the second surface 110 b of the substrate layer 110 .
- the reflection prevention layer 410 is a layer to be a plurality of reflection prevention layers 41 when the wafer 100 is cut along each of the lines 5 .
- a device layer 200 is provided on the reflection prevention layer 210 .
- the device layer 200 includes a first mirror layer 220 , an intermediate layer 230 , and a second mirror layer 240 .
- the first mirror layer 220 is a layer having a plurality of first mirror portions 31 , and is a layer to be a plurality of first laminates 22 when the wafer 100 is cut along each of the lines 5 .
- the plurality of first mirror portions 31 is two-dimensionally arranged on the first surface 110 a of the substrate layer 110 via the reflection prevention layer 210 .
- the intermediate layer 230 is a layer to be a plurality of intermediate layers 23 when the wafer 100 is cut along each of the lines 5 .
- the second mirror layer 240 is a layer having a plurality of second mirror portions 32 , and is a layer to be a plurality of second laminates 24 when the wafer 100 is cut along each of the lines 5 .
- the plurality of second mirror portions 32 is two-dimensionally arranged on the first mirror layer 220 via the intermediate layer 23 .
- a stress adjustment layer 400 is provided on the reflection prevention layer 410 . That is, the stress adjustment layer 400 is provided on the second surface 110 b of the substrate layer 110 via the reflection prevention layer 410 .
- the stress adjustment layer 400 includes a plurality of layers 420 , 430 , and 440 .
- the layer 420 is a layer that is to be a plurality of third laminates 42 when the wafer 100 is cut along each of the lines 5 .
- the layer 430 is a layer to be a plurality of intermediate layers 43 when the wafer 100 is cut along each of the lines 5 .
- the layer 440 is a layer to be a plurality of fourth laminates 44 when the wafer 100 is cut along each of the lines 5 .
- a light shielding layer 450 and a protective layer 460 are provided on the stress adjustment layer 400 .
- the light shielding layer 450 is a layer that is to be a plurality of light shielding layers 45 when the wafer 100 is cut along each of the lines 5 .
- the protective layer 460 is a layer that is to be a plurality of protective layers 46 when the wafer 100 is cut along each of the lines 5 .
- each of the Fabry-Perot interference filter portions 1 A has a gap S formed between the first minor portion 31 and the second minor portion 32 facing each other. That is, in each of the Fabry-Perot interference filter portions 1 A, the intermediate layer 23 defines the gap S, and the second minor portion 32 floats on the gap S.
- each of the Fabry-Perot interference filter portions 1 A includes a configuration related to the first electrode 12 , the second electrode 13 , the third electrode 14 , the plurality of terminals 15 and 16 , the opening 40 a , and the like.
- the effective area 101 includes the plurality of Fabry-Perot interference filters 1 .
- each of the dummy filter portions 2 A includes the intermediate layer 23 provided between the first minor portion 31 and the second minor portion 32 facing each other. That is, in the dummy filter portion 2 A, the intermediate layer 23 does not define the gap S, and the second minor portion 32 is disposed on the surface 23 a of the intermediate layer 23 . Accordingly, although each of the dummy filter portions 2 A has a configuration related to the first electrode 12 , the second electrode 13 , the third electrode 14 , the plurality of terminals 15 and 16 , the openings 40 a , and the like, similarly to the configuration of the dummy filter 2 described above, the distance between the first mirror portion 31 and the second minor portion 32 facing each other would not change.
- each of the dummy filter portions 2 A does not need to include the configuration related to the first electrode 12 , the second electrode 13 , the third electrode 14 , the plurality of terminals 15 and 16 (a metal film such as aluminum to form each of the terminal 15 and 16 , through-holes for disposing each of the terminals 15 and 16 , and the like), the opening 40 a , and the like.
- a plurality of two-dimensionally arranged dummy filters 2 is already formed and fixed in the wafer 100 (the relative positions to each other are fixed).
- the dummy area 102 includes the plurality of dummy filters 2 .
- the device layer 200 has a first groove 290 opening on the side opposite to the substrate layer 110 .
- the first groove 290 is formed along each of the lines 5 .
- the first groove 290 surrounds the first mirror portion 31 , the intermediate layer 23 , and the second mirror portion 32 in each of the Fabry-Perot interference filter portions 1 A and each of the dummy filter portions 2 A.
- the first mirror portion 31 , the intermediate layer 23 , and the second mirror portion 32 are surrounded by the annularly continuous first groove 290 .
- the first mirror portion 31 , the intermediate layer 23 , and the second mirror portion 32 are surrounded by the annularly continuous first groove 290 .
- the first groove 290 corresponds to a region on a peripheral edge portion 34 of one filter portion and a peripheral edge portion 34 of the other filter portion.
- the first groove 290 is continuous through the effective area 101 and the dummy area 102 , and reaches the outer edge 110 c of the substrate layer 110 when viewed in a direction in which the first mirror portion 31 and the second mirror portion 32 face each other (hereinafter, simply referred to as a “facing direction”). It is sufficient as long as the first groove 290 surrounds at least the second minor portion 32 in each of the Fabry-Perot interference filter portions 1 A and each of the dummy filter portions 2 A.
- the stress adjustment layer 400 has a second groove 470 opening on the side opposite to the substrate layer 110 .
- the second groove 470 is formed along each of the lines 5 . That is, the second groove 470 is formed so as to correspond to the first groove 290 .
- formation of the second groove 470 corresponding to the first groove 290 means that the second groove 470 overlaps the first groove 290 when viewed in the facing direction. Therefore, the second groove 470 is continuous in the effective area 101 and the dummy area 102 and reaches the outer edge 110 c of the substrate layer 110 when viewed in the facing direction.
- an expanding tape (an example of a bonding layer 501 described below) is attached onto the protective layer 460 (that is, on the second surface 110 b side).
- laser light is applied from a side opposite to the expanding tape in a state where the expanding tape is attached to the second surface 110 b side, and then a converging point of the laser light L is relatively moved along each of the lines 5 while the converging point of the laser light is positioned in the substrate layer 110 . That is, the laser light is introduced to be incident on the substrate layer 110 from the side opposite to the expanding tape through the surface of the polysilicon layer exposed in the first groove 290 .
- the modified region is a region having physical characteristics such as density, a refractive index, mechanical strength different from those in the surrounding area, and is a region to be a start point of a fracture extending in a thickness direction of the substrate layer 110 .
- Examples of the modified region include molten processed regions (which means at least any one of a region resolidified after melting, a region in a melted state, and a region in a state of being resolidified from the melted state), a crack region, a dielectric breakdown region, a refractive index changed region or the like, or a mixed region thereof.
- modified region examples include a region where the density of the modified region has changed from that of an unmodified region, a region with a lattice defect, or the like, in the material of the substrate layer 110 .
- the modified region can also be defined as a high-dislocation density region. The number of rows of the modified regions arranged in the thickness direction of the substrate layer 110 with respect to each of the lines 5 is appropriately adjusted on the basis of the thickness of the substrate layer 110 .
- the expanding tape attached to the second surface 110 b side is expanded so as to extend the fracture in the thickness direction of the substrate layer 110 from the modified region formed in the substrate layer 110 , and then, the substrate layer 110 is cut into the plurality of substrates 11 along each of the lines 5 .
- the polysilicon layer of the second mirror layer 240 is cut along each of the lines 5 in the first groove 290 , while the reflection prevention layer 410 and the protective layer 460 are cut along each of the lines 5 in the second groove 470 .
- a plurality of Fabry-Perot interference filters 1 and the plurality of dummy filters 2 in a state of being separated from each other on the expanding tape are obtained.
- FIG. 8 is a schematic cross-sectional view illustrating an example of a transportation method according to the present embodiment.
- the wafer 100 is represented by each of objects 100 A and 100 B of transportation. That is, here, as illustrated in FIGS. 5 to 8 , the objects 100 A and 100 B including a plurality of two-dimensionally arranged Fabry-Perot interference filters 1 as the Fabry-Perot interference filter portions 1 A are to be transported. More specifically, each of the objects 100 A and 100 B is the wafer 100 in which a plurality of Fabry-Perot interference filters 1 and a plurality of dummy filters 2 are formed.
- the effective area 101 including the plurality of Fabry-Perot interference filters 1 (Fabry-Perot interference filter portions 1 A), and the dummy area 102 surrounding the effective area 101 to form an outer edge of the wafer 100 are formed.
- the wafer 100 includes a main surface (first surface) 100 s and a back surface (second surface) 100 r opposite to the main surface 100 s .
- the main surface 100 s is a surface on the side of the first mirror portion 31 and the second mirror portion 32 with respect to the substrate 11 (substrate layer 110 ).
- the main surface 100 s is a surface including the main surface Ms of the membrane structure M of each of the Fabry-Perot interference filters 1 , and a surface including an outer surface of the second mirror portion 32 .
- the back surface 100 r is a surface opposite to the main surface 100 s .
- the back surface 100 r is a surface opposite to the main surface Ms of the membrane structure M of each of the Fabry-Perot interference filters 1 as well as being an outer surface of the protective layer 460 .
- a film 500 is attached to the objects 100 A and 100 B.
- the film 500 is attached on the back surface 100 r of the objects 100 A and 100 B.
- the main surfaces 100 s of the objects 100 A and 100 B are exposed to the atmosphere without any contact (that is, there is no member or the like in contact with the main surface 100 s ).
- the plurality of Fabry-Perot interference filters 1 is arranged two-dimensionally in a state of being oriented in a same direction (direction in which the main surface Ms faces the side opposite to the bonding layer 501 ). That is, the main surfaces Ms of the membrane structures M of the individual Fabry-Perot interference filters 1 are located on a same plane.
- the film 500 has various functions. That is, the film 500 includes the bonding layer 501 , a moisture absorbing layer 502 , and an adsorption layer 503 .
- the bonding layer 501 is bonded to the back surface 100 r and forms a contact with the back surface 100 r .
- each of the objects 100 A and 100 B further includes the bonding layer 501 bonded to the back surface 100 r .
- the bonding layer 501 is, for example, the expanding tape used as described above in dicing the wafer 100 at a transport destination.
- the moisture absorbing layer 502 is provided on a surface of the bonding layer 501 opposite to the back surface 100 r (that is, the objects 100 A and 100 B).
- the adsorption layer 503 is provided on a surface of the moisture absorbing layer 502 opposite to the bonding layer 501 .
- the adsorption layer 503 adsorbs and holds minute pieces by adhesive force or electrostatic force, for example.
- the bonding layer 501 may have a configuration in which its entire surface has a bonding force (that is, bondable) or only a part of the surface has a bonding force (that is, bondable).
- the bonding layer 501 may have a configuration in which a portion coming in contact with the back surface 100 r is a bonding portion having a bonding force, and the wafer 100 is bonded and secured to the bonding layer 501 at the bonding portion.
- An outer edge portion of the film 500 protrudes outward from the outer edges of the objects 100 A and 100 B when viewed in a direction intersecting (orthogonal to) the main surface 100 s .
- a support body 510 is provided on the outer edge portion of the film 500 protruding from the object 100 A.
- the support body 510 is a loop (or annular) shaped frame, for example, and is bonded to the bonding layer 501 in a downside of the film 500 .
- the support body 510 can be commonly used, for example, in dicing the wafer 100 at a transport destination.
- the accommodating container P When transporting the objects 100 A and 100 B, the accommodating container P is used.
- the accommodating container P has a box shape, for example, and includes a space to accommodate a plurality (here, two) of the objects 100 A and 100 B. This space is formed so as to enable accommodation of the plurality of objects 100 A and 100 B to be arranged side by side while being separated from each other (avoiding contact with the main surface Ms in particular) in the thickness direction (direction from the main surface 100 s toward the back surface 100 r ).
- An inner surface Ps of the accommodating container P includes a pair of protrusions Pa and a pair of protrusions Pb for one object 100 A or 100 B.
- the protrusions Pa corresponding to each other are formed at the same position in the vertical direction.
- each of the pair of protrusions Pa or Pb for one object 100 A or 100 B may be connected and integrated to each other (for example, in a shape such as an annular shape, a semicircular shape, or a U shape) in a plan view (for example, when viewed in a direction from the protrusion Pa to the protrusion Pb) or may be formed separately from each other.
- the objects 100 A and 100 B are accommodated in the accommodating container P (first step).
- the objects 100 A and 100 B are accommodated and supported in the accommodating container P in a state where the plurality of Fabry-Perot interference filters 1 is arranged two-dimensionally. Since the objects 100 A and 100 B are the wafers 100 as described above, here, the objects 100 A and 100 B are to be accommodated and supported in the accommodating container P as the wafer 100 in a state where the plurality of Fabry-Perot interference filters 1 is two-dimensionally arranged.
- the objects 100 A and 100 B including the plurality of Fabry-Perot interference filters 1 in a state of being formed in a two-dimensional sheet shape (that is, a thin plate shape) that substantially would not deform will be accommodated in the accommodating container P.
- the objects 100 A and 100 B are accommodated and supported in the accommodating container P so as to avoid contact with the main surfaces 100 s of the objects 100 A and 100 B (that is, the main surface Ms, the similar applies hereinafter).
- the support body 510 is to be inserted between the protrusions Pa and the protrusions Pb in a state where the main surface 100 s is directed downward so as to vertically clamp the support body 510 by the protrusions Pa and Pb, thereby supporting the objects 100 A and 100 B in the accommodating container P so as not to allow the entire objects 100 A and 100 B to come in contact with the inner surface Ps of the accommodating container P.
- the films 500 are provided on the objects 100 A and 100 B. Therefore, in this step, the moisture absorbing layer 502 and the adsorption layer 503 are arranged in the accommodating container P with accommodating the objects 100 A and 100 B in the accommodating container P. In particular, in this step, the objects 100 A and 100 B are accommodated and supported in the accommodating container P such that the adsorption layer 503 of one object 100 B faces the main surface 100 s of another object 100 A in a downside of the main surface 100 s of the other object 100 A.
- the entire accommodating container P is to be accommodated in a vacuum pack, and the inside of the accommodating container P is to be evacuated by exhausting the vacuum pack (second step). Thereafter, the accommodating container P and the objects 100 A and 100 B in the accommodating container P are transported in a state of being held in the vacuum pack, to a desired location. This makes it possible to transport the plurality of Fabry-Perot interference filters 1 collectively.
- the transport objects 100 A and 100 B include the plurality of Fabry-Perot interference filters 1 (the Fabry-Perot interference filter portions 1 A).
- the two-dimensionally arranged Fabry-Perot interference filters 1 is accommodated and supported in the accommodating container P.
- the membrane structure M has a configuration that is relatively easily broken among components of the Fabry-Perot interference filter 1 . Therefore, forming the membrane structure M at an early stage (stage of the wafer 100 ) might increase the risk of breakage. For example, in a case where the membrane structure M is formed at the stage of the wafer 100 and where water is used in the subsequent cutting step, the membrane-like second minor portion 32 floating on the gap S might be broken by water pressure or entrance of water into the gap S might cause sticking (a phenomenon in which the second minor portion 32 comes into contact with the first minor portion 31 and stops movement).
- the objects 100 A and 100 B are the wafers 100 in which the plurality of Fabry-Perot interference filters 1 is formed.
- the wafer 100 includes: the main surface 100 s (first surface) on the side of the first minor portion 31 and the second minor portion 32 with respect to the substrate 11 (substrate layer 110 ); and the back surface (second surface) 100 r opposite to the main surface 100 s .
- the objects 100 A and 100 B are accommodated and supported in the accommodating container P in a state where the plurality of Fabry-Perot interference filters 1 is arranged two-dimensionally as the wafer 100 .
- the plurality of Fabry-Perot interference filters 1 are integrated as the wafer 100 . For this reason, it is possible to transport a large number of (a plurality of) Fabry-Perot interference filters 1 with a simpler configuration with reduced risk of breakage.
- the bonding layer 501 is provided on the back surface 100 r of the wafer 100 opposite to the main surface 100 s .
- the support body 510 is provided at the outer edge portion of the bonding layer 501 , and the protrusions (clamping portions) Pa and Pb that vertically clamp the support body 510 are provided on the inner surface Ps of the accommodating container P.
- the objects 100 A and 100 B are supported in the accommodating container P by clamping the support body 510 by using the protrusions Pa and Pb.
- the plurality of Fabry-Perot interference filters 1 is integrated as the wafer 100 . This prevents breakage of the Fabry-Perot interference filter 1 due to contact with the clamping portion when the objects 100 A and 100 B are accommodated and supported.
- the objects 100 A and 100 B are supported in the accommodating container P by clamping the support body 510 by using the protrusions Pa and Pb in a state where the main surface 100 s faces downward.
- the mirror portion (the main surface Ms of the membrane structure M) is set to face downward in the accommodating container P.
- fragments of the broken portion are unlikely to influence the other Fabry-Perot interference filters 1 .
- the moisture absorbing layer 502 is provided on a surface of the bonding layer 501 opposite to the main surface 100 s
- the adsorption layer 503 is provided on a surface of the moisture absorbing layer 502 opposite to the bonding layer 501 .
- the objects 100 A and 100 B are accommodated and supported in the accommodating container P such that the adsorption layer 503 of one object 100 B faces the main surface 100 s of another object 100 A in a downside of the main surface 100 s of the other object 100 A.
- the moisture absorbing layer 502 it is possible to dispose the moisture absorbing layer 502 at a position closer to the Fabry-Perot interference filter 1 as compared with a case where a moisture absorbing member is disposed at a bottom of the accommodating container P, for example. Furthermore, the adsorption layer 503 is disposed below the main surface Ms of the membrane structure M so as to face the main surface Ms.
- the membrane structure M is broken in one Fabry-Perot interference filter 1 , the fragments of the broken portion would be adsorbed by the adsorption layer 503 in the accommodating container P (for example, the adsorption layer 503 on the back surface 100 r of the object adjacent to the object including the Fabry-Perot interference filter 1 having the breakage). Therefore, it is possible to prevent transmission of the influence of the breakage to other Fabry-Perot interference filters 1 .
- the transportation method according to the present embodiment includes, after the first step, the second step of accommodating the accommodating container P in a vacuum pack and evacuating the inside of the accommodating container P by exhausting the vacuum pack. In this case, it is possible to evacuate the inside of the accommodating container P without influencing the Fabry-Perot interference filter 1 .
- the transportation method according to one aspect of the present invention is not limited to the above-described method, and may include an arbitrary modification of the above-described method.
- the outer shape of the Fabry-Perot interference filter portion 1 A and the outer shape of the dummy filter portion 2 A need not be the same. Furthermore, when cutting out a plurality of Fabry-Perot interference filters 1 from the wafer 100 , there is no need to cut out all the dummy filter portions 2 A (that is, it is not necessary to singulate all the dummy filter portions 2 A). Furthermore, the configuration of the dummy area 102 is not limited to the above.
- the second minor portion 32 need not be surrounded by the first groove 290 that is annularly continuous (for example, the first groove 290 may simply cross a region corresponding to the dummy area 102 ), or the first groove 290 need not be formed in the device layer 200 .
- a portion of the device layer 200 or the entire device layer 200 need not be provided. That is, in the wafer being a transportation object, the dummy area is not an essential configuration.
- FIG. 9 is a schematic cross-sectional view illustrating an example of a transportation method according to a modification.
- each of the objects 100 A and 100 B here includes: the bonding layer 501 ; and a plurality of Fabry-Perot interference filters 1 formed separately from each other, two-dimensionally arranged, and bonded to the bonding layer 501 .
- the plurality of Fabry-Perot interference filters 1 may be fixed in a state where the Fabry-Perot interference filters 1 are separated from each other in order to avoid an occurrence of breakage due to contact with each other.
- the two-dimensional array is not limited to a periodic array (for example, a two-dimensional lattice array) and may be an array that is randomly distributed in a predetermined plane.
- the main surfaces Ms of the membrane structure M of each of the Fabry-Perot interference filters 1 are be located on a same plane.
- Such objects 100 A and 100 B may be obtained, for example, by a procedure including manufacturing the Fabry-Perot interference filters 1 by dicing the wafer 100 as described above, picking up the manufactured Fabry-Perot interference filters 1 and then bonding the Fabry-Perot interference filters 1 to the bonding layer 501 . That is, the sheet-like objects 100 A and 100 B including the plurality of Fabry-Perot interference filters 1 are formed.
- the objects 100 A and 100 B in this state has a sheet shape deformable in accordance with flexibility of the bonding layer 501 .
- the plurality of Fabry-Perot interference filters 1 is two-dimensionally arranged by the outer edge portion of the bonding layer 501 being supported by the support body 510 , so as to be in a fixed state of suppressing the change in a mutual positional relationship (sheet shape that would not substantially deform).
- the objects 100 A and 100 B do not include the dummy filter 2 .
- the protrusions Pa and Pb it is possible, in the first step, to allow the protrusions Pa and Pb to clamp the support body 510 in a state where the main surface Ms (the above-described first surface) of the membrane structure M of each of the Fabry-Perot interference filters 1 faces downward, and possible to store (insert and arrange) and support the sheet-like objects 100 A and 100 B in the accommodating container P as described above.
- a plurality of Fabry-Perot interference filters 1 formed separately from each other is arranged in a two-dimensional sheet shape and bonded (secured) to the bonding layer 501 .
- eliminating the Fabry-Perot interference filter 1 determined to be faulty in a preliminary inspection at the time of pickup of the Fabry-Perot interference filter 1 after manufacturing the Fabry-Perot interference filter 1 by dicing the wafer 100 would make it possible to determine non-faulty product alone to be an object of transportation without including faulty products.
- the first surface is set to face downward in the accommodating container P. For this reason, even when the mirror portion (membrane structure M) is broken in one Fabry-Perot interference filter 1 , fragments of the broken portion are unlikely to influence other Fabry-Perot interference filters 1 . Moreover, even when the mirror portion (membrane structure M) is broken in one Fabry-Perot interference filter 1 , fragments of the broken portion will be adsorbed onto the adsorption layer 503 , making is possible to prevent the situation in which the broken fragments influence other Fabry-Perot interference filters 1 .
- the above-described example is a case of a mode in which the objects 100 A and 100 B are supported in the accommodating container P via the film 500 and the support body 510 , there is no need to use the film 500 and the support body 510 . That is, it is allowable to use a configuration in which a clamping portion configured to vertically clamp an object being the wafer 100 in the dummy area 102 is provided on the inner surface Ps of the accommodating container P, and in the first step, the object may be supported in the accommodating container P by clamping the dummy area 102 with the clamping portion in a state where the main surface 100 s facing downward. In this case, it is possible to support the object in the accommodating container P without separately using a member such as the support body 510 . Furthermore, since the dummy area 102 is provided at the outer edge portion of the wafer 100 being the object, the strength of the wafer 100 is improved and the warpage is suppressed. For this reason, the object can be accommodated easily in the accommodating container P.
- the wafer 600 includes a plurality of Fabry-Perot interference filter portions 650 A.
- the plurality of Fabry-Perot interference filter portions 650 A is to be a plurality of Fabry-Perot interference filters 650 when the wafer 600 is cut along each of lines 5 set on each of the first wafer 610 and the second wafer 620 .
- the plurality of Fabry-Perot interference filter portions 650 A is two-dimensionally arranged when viewed in the thickness direction of the wafer 600 .
- the first wafer 610 includes a substrate layer 611 , a plurality of first mirror portions 612 , and a plurality of drive electrodes 613 .
- the substrate layer 611 includes a surface 611 a and a surface 611 b opposite to the surface 611 a .
- the substrate layer 611 is formed of a light transmitting material.
- Each of the first minor portions 612 is a metal film, a dielectric multilayer film, or a composite film thereof, for example.
- the drive electrode 613 is formed of a metal material, for example.
- the second wafer 620 includes a substrate layer 621 , a plurality of second minor portions 622 , and a plurality of drive electrodes 623 .
- the substrate layer 621 includes a surface 621 a and a surface 621 b opposite to the surface 621 a .
- the substrate layer 621 is formed of a light transmitting material.
- Each of the second mirror portions 622 is a metal film, a dielectric multilayer film, or a composite film thereof, for example.
- the drive electrode 623 is formed of a metal material, for example.
- one Fabry-Perot interference filter portion 650 A includes one first minor portion 612 , one drive electrode 613 , one second minor portion 622 , and one drive electrode 623 .
- the configuration of the wafer 600 will be described focusing on the one Fabry-Perot interference filter portion 650 A.
- a recess 614 is formed on the surface 611 a of the substrate layer 611 .
- a protrusion 615 is provided on a bottom surface 614 a of the recess 614 .
- the height of the protrusion 615 is less than the depth of the recess 614 . That is, an end surface 615 a of the protrusion 615 is at a recessed level with respect to the surface 611 a of the substrate layer 611 .
- the first minor portion 612 is provided on the end surface 615 a of the protrusion 615 .
- the drive electrode 613 is provided on the bottom surface 614 a of the recess 614 so as to surround the protrusion 615 .
- the drive electrode 613 is electrically connected to an electrode pad (not illustrated) via wiring (not illustrated) provided on the substrate layer 611 , for example.
- the electrode pad is provided in a region of the substrate layer 611 that can be accessed from the outside, for example.
- the surface 621 b of the substrate layer 621 is joined to the surface 611 a of the substrate layer 611 by a plasma polymerized film or the like, for example.
- the second minor portion 622 and the drive electrode 623 are provided on the surface 621 b of the substrate layer 621 .
- the second minor portion 622 faces the first minor portion 612 via the gap S.
- the drive electrode 623 is provided on the surface 621 b of the substrate layer 621 so as to surround the second minor portion 622 and faces the drive electrode 613 via the gap S.
- the drive electrode 623 is electrically connected to an electrode pad (not illustrated), for example, via wiring (not illustrated) provided on the substrate layer 621 .
- the electrode pad is provided in a region of the substrate layer 621 that can be accessed from the outside, for example.
- a groove 621 c is formed on the surface 621 a of the substrate layer 621 so as to surround the second minor portion 622 and the drive electrode 623 when viewed in the thickness direction of the wafer 600 .
- the groove 621 c extends in an annular shape.
- the portion of the substrate layer 621 surrounded by the groove 621 c is displaceable in the thickness direction of the wafer 600 with the portion where the groove 621 c is formed defined as a diaphragm-like holder 621 d .
- a holder may be formed by a plurality of beams arranged radially.
- each of the Fabry-Perot interference filter portions 650 A is formed as described above, when a voltage is applied between the drive electrode 613 and the drive electrode 623 in each of the Fabry-Perot interference filter portions 650 A, an electrostatic force corresponding to the voltage is generated between the drive electrode 613 and the drive electrode 623 .
- the portion of the substrate layer 621 surrounded by the groove 621 c is attracted toward the substrate layer 611 side by the electrostatic force, thereby adjusting the distance between the first minor portion 612 and the second minor portion 622 . This allows transmission of light having a wavelength corresponding to the distance between the first mirror portion 612 and the second minor portion 622 .
- the wafer 600 as a transportation object includes a plurality of two-dimensionally arranged Fabry-Perot interference filters 650 .
- the Fabry-Perot interference filter 650 includes: the substrate formed from the substrate layer 611 ; and the first minor portion 612 and the second minor portion 622 provided on the substrate to face each other via the gap S and in which the distance from each other is variable.
- the first surface on the side of the first mirror portion 31 and the second minor portion 32 with respect to the substrate layer 611 (and the substrate formed from the substrate layer 611 ) corresponds to the surface 621 a of the substrate layer 621 (and the substrate formed from the substrate layer 621 ), with the substrate layer 611 as reference.
- the second surface opposite to the first surface is the surface 611 b of the substrate layer 611 (and the substrate formed from the substrate layer 611 ).
- the object will be accommodated in the accommodating container P in the first step similarly to the above-described case.
- the object is accommodated and supported in the accommodating container P in a state where the plurality of Fabry-Perot interference filters 650 is arranged two-dimensionally.
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Abstract
A transportation method for transporting an object including a plurality of Fabry-Perot interference filters, the transportation method including a first step of accommodating the object in an accommodating container, wherein the Fabry-Perot interference filter includes a substrate, a first mirror portion and a second mirror portion provided on the substrate to face each other via a gap and in which a distance from each other is variable, and in the first step, the object is accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged.
Description
- This application is a continuation application of U.S. application Ser. No. 16/765,765, filed on May 20, 2020, which is a National Stage Entry of PCT/JP2018/041729, filed on Nov. 9, 2018, which claims the benefit of priority to Japanese Patent Application No. 2017-225973, filed on Nov. 24, 2017, the entire contents of which are incorporated herein by reference.
- One aspect of the present invention relates to a transportation method.
- In the related art, a Fabry-Perot interference filter including a substrate, a fixed mirror and a movable mirror facing each other via a gap on the substrate is known (for example, refer to Patent Literature 1).
- Patent Literature 1: Japanese Unexamined Patent Publication No. 2013-506154
- In transportation of such a Fabry-Perot interference filter, the Fabry-Perot interference filter can be individually accommodated in an accommodating container. On the other hand, an increase in the market demand for the Fabry-Perot interference filter as described above in recent years has led to a necessity to transport a large number of Fabry-Perot interference filters at one time. This makes it necessary to perform repeated operations of accommodating the Fabry-Perot interference filters individually in the accommodating container, leading to concerns of heavier burden due to longer operation time and the risk of occurrence of faulty products due to deterioration in operation accuracy (for example, a risk of occurrence of breakage in a movable mirror due to contact of the accommodating container with the movable mirror). In view of these, a method capable of transporting a large number of Fabry-Perot interference filters with reduced risk of filter breakage is desired.
- An object of one aspect of the present invention is to provide a transportation method capable of transporting a large number of Fabry-Perot interference filters with reduced risk of breakage.
- A transportation method according to one aspect of the present invention is a method for transporting an object including a plurality of Fabry-Perot interference filters, the method including a first step of accommodating the object in an accommodating container, in which the Fabry-Perot interference filter includes a substrate, a first mirror portion and a second mirror portion provided on the substrate and facing each other via a gap and in which a distance from each other is variable, and in the first step, the object is accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged.
- In this method, the transportation object includes a plurality of Fabry-Perot interference filters. In addition, in the first step, the two-dimensionally arranged Fabry-Perot interference filters is accommodated and supported in the accommodating container. In this manner, in a state where the plurality of Fabry-Perot interference filters is arranged two-dimensionally, it is easier to carry out collective accommodation and support while avoiding occurrence of contact with mirror portions such as the first mirror portion and the second mirror portion, compared with a case where the Fabry-Perot interference filters are handled individually. Therefore, this method makes it possible to transport a plurality of (a large number of) Fabry-Perot interference filters with a simple configuration with reduced risk of breakage.
- In the transportation method according to one aspect of the present invention, the object may be a wafer in which the plurality of Fabry-Perot interference filters is formed, the wafer may include a first surface on the sides of the first mirror portion and the second mirror portion with respect to the substrate and includes a second surface opposite to the first surface, and in the first step, the object may be accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged as the wafer. In this case, the plurality of Fabry-Perot interference filters is integrated as a wafer. For this reason, it is possible to transport a large number of (a plurality of) Fabry-Perot interference filters with a simpler configuration with reduced risk of breakage.
- In the transportation method according to one aspect of the present invention, the object may include a bonding layer bonded to the second surface, a support body may be provided at an outer edge portion of the bonding layer, a clamping portion configured to clamp the support body may be provided on an inner surface of the accommodating container, and in the first step, the object may be supported in the accommodating container by clamping the support body with the clamping portion. In this case, the object can be supported without bringing the clamping portion into contact with the wafer being the object. This prevents breakage in the Fabry-Perot interference filter due to contact with the clamping portion when the object is accommodated and supported.
- In the transportation method according to one aspect of the present invention, in the first step, the object may be supported by vertically clamping the support body with the clamping portion in a state where the first surface faces downward. In this case, the first surface on the side of the mirror portion faces downward in the accommodating container. For this reason, even when the mirror portion is broken in one Fabry-Perot interference filter, fragments of the broken portion are unlikely to influence other Fabry-Perot interference filters.
- In the transportation method according to one aspect of the present invention, an effective area including the plurality of Fabry-Perot interference filters and a dummy area provided to surround the effective area so as to form an outer edge may be formed in the wafer, the dummy area may include a plurality of dummy filters in which an intermediate layer is provided between the first mirror portion and the second mirror portion facing each other, a clamping portion configured to clamp the object in the dummy area may be provided on an inner surface of the accommodating container, and in the first step, the object may be supported in the accommodating container by clamping the dummy area with the clamping portion. In this case, the object can be supported in the accommodating container without separately using a member such as a support body. Furthermore, since the dummy area is provided at the outer edge portion of the wafer being the object, the strength of the wafer is improved and the warpage is suppressed. For this reason, the object can be accommodated easily in the accommodating container.
- In the transportation method according to one aspect of the present invention, in the first step, the object may be supported in the accommodating container by vertically clamping the dummy area with the clamping portion in a state where the first surface faces downward. In this case, the first surface on the side of the mirror portion faces downward in the accommodating container. For this reason, even when the mirror portion is broken in one Fabry-Perot interference filter, fragments of the broken portion are unlikely to influence other Fabry-Perot interference filters.
- In the transportation method according to one aspect of the present invention, the object may include a bonding layer and the plurality of Fabry-Perot interference filters separately formed from each other, the Fabry-Perot interference filter may be two-dimensionally arranged and may be bonded to the bonding layer, a support body may be provided on an outer edge portion of the bonding layer, a clamping portion configured to vertically clamp the support body may be provided on an inner surface of the accommodating container, the Fabry-Perot interference filter may include a first surface on the sides of the first mirror portion and the second mirror portion with respect to the substrate and includes a second surface that is a surface opposite to the first surface and that is bonded to the bonding layer, and in the first step, the object may be supported in the accommodating container by clamping the support body with the clamping portion in a state where the first surface faces downward. In this case, the plurality of Fabry-Perot interference filters formed separately from each other is two-dimensionally arranged so as to be bonded to the bonding layer. This makes it easier to store and support the filters so as not to come in contact with the mirror portion. Furthermore, the first surface faces downward in the accommodating container. For this reason, even when the mirror portion is broken in one Fabry-Perot interference filter, fragments of the broken portion are unlikely to influence other Fabry-Perot interference filters.
- In the transportation method according to one aspect of the present invention, a moisture absorbing layer may be provided on a surface of the bonding layer opposite to the second surface, an adsorption layer may be provided on a surface of the moisture absorbing layer opposite to the bonding layer, and in the first step, the object may be accommodated and supported in the accommodating container such that the adsorption layer of one object faces the first surface of another object in a downside of the first surface of another object. In this case, it is possible to dispose the moisture absorbing layer and the adsorption layer in the accommodating container together with accommodating the object into the accommodating container. In particular, in this case, it is possible to dispose the moisture absorbing layer at a position closer to the Fabry-Perot interference filter as compared with a case where a moisture absorbing member is disposed at a bottom of the accommodating container, for example. Furthermore, the adsorption layer is disposed in a downside of the first surface so as to face the first surface. For this reason, even when the mirror portion is broken in one Fabry-Perot interference filter, fragments of the broken portion will be adsorbed onto the adsorption layer, making is possible to prevent the situation in which the broken fragments influence other Fabry-Perot interference filters.
- In the transportation method according to one aspect of the present invention may include, after the first step, a second step of accommodating the accommodating container into a vacuum pack and evacuating the inside of the accommodating container by exhausting the vacuum pack. In this case, it is possible to evacuate the inside of the accommodating container without influencing the Fabry-Perot interference filter.
- According to one aspect of the present invention, it is possible to provide a transportation method capable of transporting a large number of Fabry-Perot interference filters with reduced risk of breakage.
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FIG. 1 is a plan view of a Fabry-Perot interference filter of the present embodiment. -
FIG. 2 is a bottom view of the Fabry-Perot interference filter illustrated inFIG. 1 . -
FIG. 3 is a cross-sectional view of the Fabry-Perot interference filter taken along line inFIG. 1 . -
FIG. 4 is a cross-sectional view of a dummy filter according to the present embodiment. -
FIG. 5 is a plan view of a wafer according to the present embodiment. -
FIG. 6 is an enlarged plan view of a part of the wafer illustrated inFIG. 5 . -
FIG. 7 is a cross-sectional view of a Fabry-Perot interference filter portion and a dummy filter portion of the wafer illustrated inFIG. 5 . -
FIG. 8 is a schematic cross-sectional view illustrating an example of a transportation method according to the present embodiment. -
FIG. 9 is a schematic cross-sectional view illustrating an example of a transportation method according to a modification. -
FIG. 10 is a cross-sectional view of a wafer according to a modification. - Hereinafter, an embodiment will be described in detail with reference to the drawings. In each of the drawings, the same elements or corresponding elements will be denoted by the same reference numerals, and redundant description will be omitted in some cases.
- The transportation method according to the present embodiment is a method for transporting an object including a Fabry-Perot interference filter. Therefore, an embodiment of an object including a Fabry-Perot interference filter as a transportation object will be described first.
- [Configuration of Fabry-Perot interference filter and dummy filter]
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FIG. 1 is a plan view of a Fabry-Perot interference filter of the present embodiment.FIG. 2 is a bottom view of the Fabry-Perot interference filter illustrated inFIG. 1 .FIG. 3 is a cross-sectional view of the Fabry-Perot interference filter taken along line inFIG. 1 . - As illustrated in
FIGS. 1 to 3 , a Fabry-Perot interference filter 1 includes asubstrate 11. Thesubstrate 11 has afirst surface 11 a and asecond surface 11 b opposite to thefirst surface 11 a. On thefirst surface 11 a, areflection prevention layer 21, afirst laminate 22, anintermediate layer 23, and asecond laminate 24 are laminated in this order. A gap (air gap) S is defined between thefirst laminate 22 and thesecond laminate 24 by the frame-likeintermediate layer 23. - The shape and the positional relationship of each of portions when viewed in a direction perpendicular to the
first surface 11 a (plan view) are as follows. The outer edge of thesubstrate 11 has a rectangular shape with a side being several hundred μm to several mm. The outer edge of thesubstrate 11 and an outer edge of thesecond laminate 24 are aligned with each other. An outer edge of thereflection prevention layer 21, an outer edge of thefirst laminate 22, and an outer edge of theintermediate layer 23 are aligned with each other. Thesubstrate 11 has anouter edge portion 11 c positioned on an outer side of the outer edge of theintermediate layer 23 with respect to the center of the gap S. For example, theouter edge portion 11 c has a frame shape and surrounds theintermediate layer 23 when viewed in a direction perpendicular to thefirst surface 11 a. The gap S has a circular shape, for example. - The Fabry-
Perot interference filter 1 transmits light having a predetermined wavelength through alight transmission region 1 a defined in a center portion of the Fabry-Perot interference filter 1. For example, thelight transmission region 1 a is a columnar region. Thesubstrate 11 is formed of silicon, quartz, or glass, for example. When thesubstrate 11 is formed of silicon, thereflection prevention layer 21 and theintermediate layer 23 are formed of silicon oxide, for example. The thickness of theintermediate layer 23 ranges from several tens of nm to several tens of μm, for example. - A portion corresponding to the
light transmission region 1 a in thefirst laminate 22 functions as afirst mirror portion 31. Thefirst mirror portion 31 is a fixed mirror. Thefirst mirror portion 31 is disposed on thefirst surface 11 a via thereflection prevention layer 21. Thefirst laminate 22 includes alternate laminations of each of a plurality ofpolysilicon layers 25 and each of a plurality of silicon nitride layers 26. The Fabry-Perot interference filter 1 includes layers of apolysilicon layer 25 a, asilicon nitride layer 26 a, a polysilicon layer 25 b, asilicon nitride layer 26 b, and apolysilicon layer 25 c laminated on thereflection prevention layer 21 in this order. The optical thickness of each of the polysilicon layers 25 and the silicon nitride layers 26 included in thefirst mirror portion 31 can be set to an integral multiple of ¼ of a center transmission wavelength. Thefirst mirror portion 31 may be directly disposed on thefirst surface 11 a without interposing thereflection prevention layer 21. - The portion corresponding to the
light transmission region 1 a in thesecond laminate 24 functions as asecond mirror portion 32. Thesecond mirror portion 32 is a movable mirror. Thesecond mirror portion 32 faces thefirst mirror portion 31 via the gap S on a side opposite to thesubstrate 11 with respect to thefirst mirror portion 31. The direction in which thefirst mirror portion 31 and thesecond mirror portion 32 face each other is parallel to a direction perpendicular to thefirst surface 11 a. Thesecond laminate 24 is disposed on thefirst surface 11 a via thereflection prevention layer 21, thefirst laminate 22, and theintermediate layer 23. Thesecond laminate 24 includes alternate laminations of each of the plurality ofpolysilicon layers 27 and each of the plurality of silicon nitride layers 28. The Fabry-Perot interference filter 1 includes layers of apolysilicon layer 27 a, asilicon nitride layer 28 a, apolysilicon layer 27 b, a silicon nitride layer 28 b, and apolysilicon layer 27 c laminated on theintermediate layer 23 in this order. The optical thickness of each of the polysilicon layers 27 and the silicon nitride layers 28 included in thesecond mirror portion 32 can be set to an integral multiple of ¼ of a center transmission wavelength. - In the
first laminate 22 and thesecond laminate 24, silicon oxide layers may be used in place of the silicon nitride layers. In addition, examples of the material applicable for each of layers forming thefirst laminate 22 and thesecond laminate 24 include titanium oxide, tantalum oxide, zirconium oxide, magnesium fluoride, aluminum oxide, calcium fluoride, silicon, germanium, zinc sulfide, or the like. Here, the surface of thefirst mirror portion 31 on the gap S side (surface of thepolysilicon layer 25 c) and the surface of thesecond mirror portion 32 on the gap S side (surface of thepolysilicon layer 27 a) directly face each other via the gap S. Note that an electrode layer, a protective layer, or the like (not forming a mirror) may be formed on the surface of thefirst mirror portion 31 on the gap S side and on the surface of thesecond mirror portion 32 on the gap S side. In this case, thefirst mirror portion 31 and thesecond mirror portion 32 face each other via the gap S with the presence of these interposed layers. In other words, even in such a case, a facing configuration between thefirst mirror portion 31 and thesecond mirror portion 32 via the gap S can be achieved. - A plurality of through-
holes 24 b is formed at a portion of thesecond laminate 24 corresponding to the gap S (a portion overlapping the gap S when viewed in a direction perpendicular to thefirst surface 11 a). Each of the through-holes 24 b extends to reach the gap S from asurface 24 a of thesecond laminate 24 opposite to theintermediate layer 23. The plurality of through-holes 24 b is formed so as not to substantially influence the function of thesecond mirror portion 32. The plurality of through-holes 24 b is used for forming the gap S by removing a portion of theintermediate layer 23 through etching. - In addition to the
second mirror portion 32, thesecond laminate 24 further includes a coveringportion 33 and aperipheral edge portion 34. Thesecond mirror portion 32, the coveringportion 33, and theperipheral edge portion 34 are integrally formed to have a portion of a same laminated structure and to be continuous to each other. The coveringportion 33 surrounds the secondminor portion 32 when viewed in a direction perpendicular to thefirst surface 11 a. The coveringportion 33 covers asurface 23 a of theintermediate layer 23 on a side opposite to thesubstrate 11, aside surface 23 b of the intermediate layer 23 (a side surface on the outer side, that is, a side surface on a side opposite to the gap S side), aside surface 22 a of thefirst laminate 22, and aside surface 21 a of thereflection prevention layer 21, so as to reach thefirst surface 11 a. That is, the coveringportion 33 covers the outer edge of theintermediate layer 23, the outer edge of thefirst laminate 22, and the outer edge of thereflection prevention layer 21. - The
peripheral edge portion 34 surrounds the coveringportion 33 when viewed in a direction perpendicular to thefirst surface 11 a. Theperipheral edge portion 34 is positioned on thefirst surface 11 a in theouter edge portion 11 c. The outer edge of theperipheral edge portion 34 is aligned with the outer edge of thesubstrate 11 when viewed in a direction perpendicular to thefirst surface 11 a. Theperipheral edge portion 34 is thinned along an outer edge of theouter edge portion 11 c. That is, the portion along the outer edge of theouter edge portion 11 c in theperipheral edge portion 34 is thinner compared to other portions excluding the portion along the outer edge of theperipheral edge portion 34. In the Fabry-Perot interference filter 1, theperipheral edge portion 34 is thinned by removing a portion of thepolysilicon layer 27 and thesilicon nitride layer 28 included in thesecond laminate 24. Theperipheral edge portion 34 includes anon-thinned portion 34 a continuous to the coveringportion 33, and a thinned portion 34 b surrounding thenon-thinned portion 34 a. In the thinned portion 34 b, thepolysilicon layer 27 and thesilicon nitride layer 28 are removed excluding thepolysilicon layer 27 a directly provided on thefirst surface 11 a. - The height from the
first surface 11 a to asurface 34 c of thenon-thinned portion 34 a on a side opposite to thesubstrate 11 is lower than the height from thefirst surface 11 a to thesurface 23 a of theintermediate layer 23. The height from thefirst surface 11 a to thesurface 34 c of thenon-thinned portion 34 a ranges from 100 nm to 5000 nm, for example. The height from thefirst surface 11 a to thesurface 23 a of theintermediate layer 23 ranges from 500 nm to 20000 nm, for example. The width of the thinned portion 34 b (distance between the outer edge of thenon-thinned portion 34 a and the outer edge of theouter edge portion 11 c when viewed in the direction perpendicular to thefirst surface 11 a) is 0.01 times the thickness of thesubstrate 11, or more. The width of the thinned portion 34 b ranges from 5 μm to 400 μm, for example. The thickness of thesubstrate 11 ranges from 500 μm to 800 μm, for example. - A
first electrode 12 is formed in thefirst mirror portion 31 so as to surround thelight transmission region 1 a when viewed in a direction perpendicular to thefirst surface 11 a. Thefirst electrode 12 is formed by doping impurities into thepolysilicon layer 25 c to achieve low resistivity. Asecond electrode 13 is formed in thefirst mirror portion 31 so as to include thelight transmission region 1 a when viewed in a direction perpendicular to thefirst surface 11 a. Thesecond electrode 13 is formed by doping impurities into thepolysilicon layer 25 c to achieve low resistivity. Note that although thesecond electrode 13 can be sized to include the entirelight transmission region 1 a when viewed in a direction perpendicular to thefirst surface 11 a, thesecond electrode 13 may be set to substantially the same size as that of thelight transmission region 1 a. - A
third electrode 14 is formed in thesecond mirror portion 32. - The
third electrode 14 faces thefirst electrode 12 and thesecond electrode 13 via the gap S. Thethird electrode 14 is formed by doping impurities into thepolysilicon layer 27 a to achieve low resistivity. - A pair of
terminals 15 are provided to face each other across thelight transmission region 1 a. Each of theterminals 15 is disposed inside a through-hole leading from thesurface 24 a of thesecond laminate 24 to thefirst laminate 22. Each of theterminals 15 is electrically connected to thefirst electrode 12 throughwiring 12 a. For example, each of theterminals 15 is formed with a metal film of aluminum, an alloy thereof, or the like. - A pair of
terminals 16 are provided to face each other across thelight transmission region 1 a. Each of theterminals 16 is disposed inside a through-hole leading from thesurface 24 a of thesecond laminate 24 to thefirst laminate 22. Each of theterminals 16 is electrically connected to thesecond electrode 13 throughwiring 13 a and is electrically connected to thethird electrode 14 throughwiring 14 a. For example, theterminals 16 are formed with a metal film of aluminum, an alloy thereof, or the like. The facing direction of the pair ofterminals 15 and the facing direction of the pair ofterminals 16 are orthogonal to each other (refer toFIG. 1 ). - A plurality of
trenches surface 22 b of thefirst laminate 22. Thetrench 17 annularly extends to surround a connection with respect to theterminals 16 in thewiring 13 a. Thetrench 17 electrically insulates thefirst electrode 12 and thewiring 13 a from each other. Thetrench 18 annularly extends along an inner edge of thefirst electrode 12. Thetrench 18 electrically insulates thefirst electrode 12 and a region of thefirst electrode 12 on an inner side (second electrode 13) from each other. Each of the regions in thetrenches - A
trench 19 is provided on thesurface 24 a of thesecond laminate 24. Thetrench 19 annularly extends to surround theterminals 15. Thetrench 19 electrically insulates theterminals 15 and thethird electrode 14 from each other. The region inside thetrench 19 may be an insulating material or a gap. - The
second surface 11 b of thesubstrate 11 includes layers of areflection prevention layer 41, athird laminate 42, anintermediate layer 43, and afourth laminate 44 laminated in this order. Thereflection prevention layer 41 and theintermediate layer 43 each have a configuration similar to those of thereflection prevention layer 21 and theintermediate layer 23. Thethird laminate 42 and thefourth laminate 44 each have a laminated structure symmetrical to those of thefirst laminate 22 and thesecond laminate 24 with respect to thesubstrate 11. Thereflection prevention layer 41, thethird laminate 42, theintermediate layer 43, and thefourth laminate 44 have a function of suppressing warpage of thesubstrate 11. - The
third laminate 42, theintermediate layer 43, and thefourth laminate 44 are thinned along the outer edge of theouter edge portion 11 c. That is, the portion along the outer edge of theouter edge portion 11 c in thethird laminate 42, theintermediate layer 43, and thefourth laminate 44 is thinner compared to other portions excluding the portion along the outer edge in thethird laminate 42, theintermediate layer 43, and thefourth laminate 44. In the Fabry-Perot interference filter 1, thethird laminate 42, theintermediate layer 43, and thefourth laminate 44 are thinned by removing all of thethird laminate 42, theintermediate layer 43, and thefourth laminate 44 in a portion overlapping the thinned portion 34 b when viewed in a direction perpendicular to thefirst surface 11 a. - The
third laminate 42, theintermediate layer 43, and thefourth laminate 44 have anopening 40 a so as to include thelight transmission region 1 a when viewed in a direction perpendicular to the first surface Ila. The opening 40 a has a diameter approximately the same as the size of thelight transmission region 1 a. The opening 40 a is open on the light emission side. The bottom surface of the opening 40 a reaches thereflection prevention layer 41. - A
light shielding layer 45 is formed on a surface of thefourth laminate 44 on the light emission side. For example, thelight shielding layer 45 is formed of aluminum or the like. Aprotective layer 46 is formed on a surface of thelight shielding layer 45 and an inner surface of the opening 40 a. Theprotective layer 46 covers the outer edges of thethird laminate 42, theintermediate layer 43, thefourth laminate 44, and thelight shielding layer 45 and covers thereflection prevention layer 41 on theouter edge portion 11 c. For example, theprotective layer 46 is formed of aluminum oxide. An optical influence due to theprotective layer 46 can be disregarded by causing the thickness of theprotective layer 46 to range from 1 nm to 100 nm (approximately 30 nm, for example). - In the Fabry-
Perot interference filter 1 configured as described above, when a voltage is applied between thefirst electrode 12 and thethird electrode 14 via the pair ofterminals first electrode 12 and thethird electrode 14. Thesecond mirror portion 32 is attracted to thefirst mirror portion 31 side secured to thesubstrate 11 by the electrostatic force, and the distance between thefirst mirror portion 31 and thesecond mirror portion 32 is adjusted. In this manner, in the Fabry-Perot interference filter 1, the distance between the firstminor portion 31 and thesecond mirror portion 32 changes by the electrostatic force. - The wavelength of light to be transmitted through the Fabry-
Perot interference filter 1 depends on the distance between the firstminor portion 31 and thesecond mirror portion 32 in thelight transmission region 1 a. Therefore, the wavelength of light to be transmitted can be appropriately selected by adjusting the voltage to be applied between thefirst electrode 12 and thethird electrode 14. At this time, thesecond electrode 13 has the same potential as that of thethird electrode 14. Therefore, thesecond electrode 13 functions as a compensation electrode to keep thefirst mirror portion 31 and thesecond mirror portion 32 flat in thelight transmission region 1 a. - In the Fabry-
Perot interference filter 1, for example, a spectroscopic spectrum can be obtained by detecting light transmitted through thelight transmission region 1 a of the Fabry-Perot interference filter 1 using a light detector while changing the voltage to be applied to the Fabry-Perot interference filter 1 (that is, while changing the distance between the firstminor portion 31 and the secondminor portion 32 in the Fabry-Perot interference filter 1). - In this manner, the Fabry-
Perot interference filter 1 has a membrane structure M including the firstminor portion 31 and the secondminor portion 32 facing each other via the gap S and in which a distance from each other is variable. The membrane structure M includes a main surface Ms opposite to thesubstrate 11. The membrane structure M is a portion not overlapping theintermediate layer 23 in thefirst laminate 22 and thesecond laminate 24 when viewed in a direction intersecting (orthogonal to) thefirst surface 11 a of thesubstrate 11 and the main surface Ms. That is, the outer shape of the membrane structure M when viewed in the direction intersecting (orthogonal to) the main surface Ms is defined by an inner edge of theintermediate layer 23, illustrated here in a circular shape (refer toFIG. 1 ). -
FIG. 4 is a cross-sectional view of a dummy filter according to the present embodiment. As illustrated inFIG. 4 , a dummy filter 2 is different from the Fabry-Perot interference filter 1 described above in that the plurality of through-holes 24 b is not formed in thesecond laminate 24 and the gap S is not formed in theintermediate layer 23. In the dummy filter 2, anintermediate layer 23 is provided between the firstminor portion 31 and the secondminor portion 32. That is, the secondminor portion 32 is disposed on thesurface 23 a of theintermediate layer 23, not floating above the gap S. [Wafer configuration] - Next, a configuration of a wafer according to an embodiment will be described.
FIG. 5 is a plan view of the wafer according to the present embodiment.FIG. 6 is an enlarged plan view of a portion of the wafer illustrated inFIG. 5 . As illustrated inFIGS. 5 and 6 , awafer 100 includes asubstrate layer 110. Thesubstrate layer 110 has a disk shape with a diameter of approximately 150 mm or 200 mm, with an orientation flat OF formed in a portion of thesubstrate layer 110. For example, thesubstrate layer 110 is formed of silicon, quartz, glass, or the like. Hereinafter, a virtual straight line that passes through the center of thesubstrate layer 110 when viewed in the thickness direction of thesubstrate layer 110 and is parallel to the orientation flat OF is referred to as a first straight line 3, while a virtual straight line that passes through the center of thesubstrate layer 110 when viewed in the thickness direction of thesubstrate layer 110 and is perpendicular to the orientation flat OF is referred to as a second straight line 4. - The
wafer 100 includes aneffective area 101 and adummy area 102. Thedummy area 102 is an area along anouter edge 110 c of the substrate layer 110 (that is, anouter edge 100 a of the wafer 100) (so as to form theouter edge 100 a). Theeffective area 101 is an area inside thedummy area 102. Thedummy area 102 surrounds theeffective area 101 when viewed in the thickness direction of thesubstrate layer 110. Thedummy area 102 is adjacent to theeffective area 101. - The
effective area 101 includes a plurality of two-dimensionally arranged Fabry-Perotinterference filter portions 1A. The plurality of Fabry-Perotinterference filter portions 1A is provided in the entireeffective area 101. Thedummy area 102 includes a plurality of two-dimensionally arrangeddummy filter portions 2A. The plurality ofdummy filter portions 2A is provided in an area of thedummy area 102 excluding a pair ofareas 102 a. Onearea 102 a is an area along the orientation flat OF. Theother area 102 a is an area along the portion of theouter edge 110 c of thesubstrate layer 110 on the side opposite to the orientation flat OF. The Fabry-Perotinterference filter portion 1A and thedummy filter portion 2A are adjacent to each other at a boundary between theeffective area 101 and thedummy area 102. When viewed in the thickness direction of thesubstrate layer 110, the outer shape of the Fabry-Perotinterference filter portion 1A and the outer shape of thedummy filter portion 2A are the same. The plurality of Fabry-Perotinterference filter portions 1A and the plurality ofdummy filter portions 2A are arranged so as to be symmetric about each of the first straight line 3 and the second straight line 4 orthogonal to each other. The plurality ofdummy filter portions 2A may be provided over theentire dummy area 102. Furthermore, the plurality ofdummy filter portions 2A may be provided in an area other than one of theareas 102 a in thedummy areas 102. - Each of the plurality of Fabry-Perot
interference filter portions 1A is to be each of a plurality of Fabry-Perot interference filters 1 when thewafer 100 is cut along each oflines 5. Each of the plurality ofdummy filter portions 2A is to be each of a plurality of dummy filters 2 when thewafer 100 is cut along each of thelines 5. When viewed in the thickness direction of thesubstrate layer 110, the plurality oflines 5 extends in a direction parallel to the orientation flat OF, and the plurality oflines 5 extends in a direction perpendicular to the orientation flat OF. As an example, when each of thefilter portions substrate layer 110, each of thefilter portions lines 5 is set in a lattice pattern so as to pass betweenadjacent filter portions 1A-1A, betweenadjacent filter portions 1A-2A, and betweenadjacent filter portions 2A-2A. Here, as illustrated inFIG. 5 , among the plurality of Fabry-Perotinterference filter portions 1A anddummy filter portions 2A arranged in a two-dimensional array, a 3×3 array including a certain Fabry-Perotinterference filter portion 1A or adummy filter portion 2A and including the Fabry-Perot interference filter 1 and/or thedummy filter portion 2A surrounding the certain Fabry-Perotinterference filter portion 1A or thedummy filter portion 2A is to be defined as a unit array. At this time, a plurality of the unit arrays is individually arranged in four regions divided by a first straight line 3 and a second straight line 4 in thewafer 100. In addition, the same number of unit arrays are arranged in each of the four regions divided by the first straight line 3 and the second straight line 4. Furthermore, here, the unit arrays are arranged symmetrically with respect to the first straight line 3 and the second straight line 4. A unit array has its width (surface area) larger than its thickness (cross-sectional area). - (a) of
FIG. 7 is a cross-sectional view of the Fabry-Perotinterference filter portion 1A. (b) ofFIG. 7 is a cross-sectional view of thedummy filter portion 2A. As illustrated in (a) and (b) ofFIG. 7 , thesubstrate layer 110 is a layer that is to be a plurality ofsubstrates 11 when thewafer 100 is cut along each of thelines 5. Thesubstrate layer 110 has afirst surface 110 a and asecond surface 110 b opposite to thefirst surface 110 a. Areflection prevention layer 210 is provided on thefirst surface 110 a of thesubstrate layer 110. Thereflection prevention layer 210 is a layer to be a plurality of reflection prevention layers 21 when thewafer 100 is cut along each of thelines 5. Areflection prevention layer 410 is provided on thesecond surface 110 b of thesubstrate layer 110. Thereflection prevention layer 410 is a layer to be a plurality of reflection prevention layers 41 when thewafer 100 is cut along each of thelines 5. - A
device layer 200 is provided on thereflection prevention layer 210. Thedevice layer 200 includes a first mirror layer 220, anintermediate layer 230, and asecond mirror layer 240. The first mirror layer 220 is a layer having a plurality offirst mirror portions 31, and is a layer to be a plurality offirst laminates 22 when thewafer 100 is cut along each of thelines 5. The plurality offirst mirror portions 31 is two-dimensionally arranged on thefirst surface 110 a of thesubstrate layer 110 via thereflection prevention layer 210. Theintermediate layer 230 is a layer to be a plurality ofintermediate layers 23 when thewafer 100 is cut along each of thelines 5. Thesecond mirror layer 240 is a layer having a plurality ofsecond mirror portions 32, and is a layer to be a plurality ofsecond laminates 24 when thewafer 100 is cut along each of thelines 5. The plurality ofsecond mirror portions 32 is two-dimensionally arranged on the first mirror layer 220 via theintermediate layer 23. - A
stress adjustment layer 400 is provided on thereflection prevention layer 410. That is, thestress adjustment layer 400 is provided on thesecond surface 110 b of thesubstrate layer 110 via thereflection prevention layer 410. Thestress adjustment layer 400 includes a plurality oflayers layer 420 is a layer that is to be a plurality ofthird laminates 42 when thewafer 100 is cut along each of thelines 5. Thelayer 430 is a layer to be a plurality ofintermediate layers 43 when thewafer 100 is cut along each of thelines 5. Thelayer 440 is a layer to be a plurality offourth laminates 44 when thewafer 100 is cut along each of thelines 5. - A
light shielding layer 450 and aprotective layer 460 are provided on thestress adjustment layer 400. Thelight shielding layer 450 is a layer that is to be a plurality of light shielding layers 45 when thewafer 100 is cut along each of thelines 5. Theprotective layer 460 is a layer that is to be a plurality ofprotective layers 46 when thewafer 100 is cut along each of thelines 5. - As illustrated in (a) of
FIG. 7 , each of the Fabry-Perotinterference filter portions 1A has a gap S formed between the firstminor portion 31 and the secondminor portion 32 facing each other. That is, in each of the Fabry-Perotinterference filter portions 1A, theintermediate layer 23 defines the gap S, and the secondminor portion 32 floats on the gap S. Similarly to the configuration of the Fabry-Perot interference filter 1 described above, each of the Fabry-Perotinterference filter portions 1A includes a configuration related to thefirst electrode 12, thesecond electrode 13, thethird electrode 14, the plurality ofterminals interference filter portions 1A is still in the state of thewafer 100, applying a voltage to each of the Fabry-Perotinterference filter portions 1A via the pair ofterminals first mirror portion 31 and the secondminor portion 32 facing each other by the electrostatic force. In this manner, a plurality of two-dimensionally arranged Fabry-Perot interference filters 1 is already formed and fixed in the wafer 100 (the relative positions to each other are fixed). Furthermore, theeffective area 101 includes the plurality of Fabry-Perot interference filters 1. - As illustrated in (b) of
FIG. 7 , each of thedummy filter portions 2A includes theintermediate layer 23 provided between the firstminor portion 31 and the secondminor portion 32 facing each other. That is, in thedummy filter portion 2A, theintermediate layer 23 does not define the gap S, and the secondminor portion 32 is disposed on thesurface 23 a of theintermediate layer 23. Accordingly, although each of thedummy filter portions 2A has a configuration related to thefirst electrode 12, thesecond electrode 13, thethird electrode 14, the plurality ofterminals openings 40 a, and the like, similarly to the configuration of the dummy filter 2 described above, the distance between thefirst mirror portion 31 and the secondminor portion 32 facing each other would not change. Note that each of thedummy filter portions 2A does not need to include the configuration related to thefirst electrode 12, thesecond electrode 13, thethird electrode 14, the plurality ofterminals 15 and 16 (a metal film such as aluminum to form each of the terminal 15 and 16, through-holes for disposing each of theterminals dummy area 102 includes the plurality of dummy filters 2. - As illustrated in
FIG. 6 and (a) ofFIG. 7 , thedevice layer 200 has afirst groove 290 opening on the side opposite to thesubstrate layer 110. Thefirst groove 290 is formed along each of thelines 5. Thefirst groove 290 surrounds thefirst mirror portion 31, theintermediate layer 23, and thesecond mirror portion 32 in each of the Fabry-Perotinterference filter portions 1A and each of thedummy filter portions 2A. In each of the Fabry-Perotinterference filter portions 1A, thefirst mirror portion 31, theintermediate layer 23, and thesecond mirror portion 32 are surrounded by the annularly continuousfirst groove 290. Similarly, in each of thedummy filter portions 2A, thefirst mirror portion 31, theintermediate layer 23, and thesecond mirror portion 32 are surrounded by the annularly continuousfirst groove 290. Focusing on theadjacent filter portions 1A-1A, theadjacent filter portions 1A-2A, and theadjacent filter portions 2A-2A, thefirst groove 290 corresponds to a region on aperipheral edge portion 34 of one filter portion and aperipheral edge portion 34 of the other filter portion. Thefirst groove 290 is continuous through theeffective area 101 and thedummy area 102, and reaches theouter edge 110 c of thesubstrate layer 110 when viewed in a direction in which thefirst mirror portion 31 and thesecond mirror portion 32 face each other (hereinafter, simply referred to as a “facing direction”). It is sufficient as long as thefirst groove 290 surrounds at least the secondminor portion 32 in each of the Fabry-Perotinterference filter portions 1A and each of thedummy filter portions 2A. - As illustrated in (b) of
FIG. 7 , thestress adjustment layer 400 has asecond groove 470 opening on the side opposite to thesubstrate layer 110. Thesecond groove 470 is formed along each of thelines 5. That is, thesecond groove 470 is formed so as to correspond to thefirst groove 290. Here, formation of thesecond groove 470 corresponding to thefirst groove 290 means that thesecond groove 470 overlaps thefirst groove 290 when viewed in the facing direction. Therefore, thesecond groove 470 is continuous in theeffective area 101 and thedummy area 102 and reaches theouter edge 110 c of thesubstrate layer 110 when viewed in the facing direction. - When manufacturing the Fabry-
Perot interference filter 1 and the dummy filter 2 from above mentionedwafer 100, first, an expanding tape (an example of abonding layer 501 described below) is attached onto the protective layer 460 (that is, on thesecond surface 110 b side). Subsequently, laser light is applied from a side opposite to the expanding tape in a state where the expanding tape is attached to thesecond surface 110 b side, and then a converging point of the laser light L is relatively moved along each of thelines 5 while the converging point of the laser light is positioned in thesubstrate layer 110. That is, the laser light is introduced to be incident on thesubstrate layer 110 from the side opposite to the expanding tape through the surface of the polysilicon layer exposed in thefirst groove 290. - With the irradiation of the laser light, a modified region is formed in the
substrate layer 110 along each of thelines 5. The modified region is a region having physical characteristics such as density, a refractive index, mechanical strength different from those in the surrounding area, and is a region to be a start point of a fracture extending in a thickness direction of thesubstrate layer 110. Examples of the modified region include molten processed regions (which means at least any one of a region resolidified after melting, a region in a melted state, and a region in a state of being resolidified from the melted state), a crack region, a dielectric breakdown region, a refractive index changed region or the like, or a mixed region thereof. Further examples of the modified region include a region where the density of the modified region has changed from that of an unmodified region, a region with a lattice defect, or the like, in the material of thesubstrate layer 110. When the material of thesubstrate layer 110 is monocrystalline silicon, the modified region can also be defined as a high-dislocation density region. The number of rows of the modified regions arranged in the thickness direction of thesubstrate layer 110 with respect to each of thelines 5 is appropriately adjusted on the basis of the thickness of thesubstrate layer 110. - Subsequently, the expanding tape attached to the
second surface 110 b side is expanded so as to extend the fracture in the thickness direction of thesubstrate layer 110 from the modified region formed in thesubstrate layer 110, and then, thesubstrate layer 110 is cut into the plurality ofsubstrates 11 along each of thelines 5. At this time, the polysilicon layer of thesecond mirror layer 240 is cut along each of thelines 5 in thefirst groove 290, while thereflection prevention layer 410 and theprotective layer 460 are cut along each of thelines 5 in thesecond groove 470. With this procedure, a plurality of Fabry-Perot interference filters 1 and the plurality of dummy filters 2 in a state of being separated from each other on the expanding tape are obtained. [One embodiment of transportation method] -
FIG. 8 is a schematic cross-sectional view illustrating an example of a transportation method according to the present embodiment. As illustrated inFIG. 8 , in the transportation method according to the present embodiment, thewafer 100 is represented by each ofobjects FIGS. 5 to 8 , theobjects interference filter portions 1A are to be transported. More specifically, each of theobjects wafer 100 in which a plurality of Fabry-Perot interference filters 1 and a plurality of dummy filters 2 are formed. As described above, in thewafer 100, theeffective area 101 including the plurality of Fabry-Perot interference filters 1 (Fabry-Perotinterference filter portions 1A), and thedummy area 102 surrounding theeffective area 101 to form an outer edge of thewafer 100 are formed. Thewafer 100 includes a main surface (first surface) 100 s and a back surface (second surface) 100 r opposite to themain surface 100 s. Themain surface 100 s is a surface on the side of thefirst mirror portion 31 and thesecond mirror portion 32 with respect to the substrate 11 (substrate layer 110). Here, themain surface 100 s is a surface including the main surface Ms of the membrane structure M of each of the Fabry-Perot interference filters 1, and a surface including an outer surface of thesecond mirror portion 32. Theback surface 100 r is a surface opposite to themain surface 100 s. Here, theback surface 100 r is a surface opposite to the main surface Ms of the membrane structure M of each of the Fabry-Perot interference filters 1 as well as being an outer surface of theprotective layer 460. - As illustrated in
FIG. 8 , afilm 500 is attached to theobjects film 500 is attached on theback surface 100 r of theobjects main surfaces 100 s of theobjects main surface 100 s). Here, the plurality of Fabry-Perot interference filters 1 is arranged two-dimensionally in a state of being oriented in a same direction (direction in which the main surface Ms faces the side opposite to the bonding layer 501). That is, the main surfaces Ms of the membrane structures M of the individual Fabry-Perot interference filters 1 are located on a same plane. - The
film 500 has various functions. That is, thefilm 500 includes thebonding layer 501, amoisture absorbing layer 502, and anadsorption layer 503. Thebonding layer 501 is bonded to theback surface 100 r and forms a contact with theback surface 100 r. In other words, each of theobjects bonding layer 501 bonded to theback surface 100 r. Thebonding layer 501 is, for example, the expanding tape used as described above in dicing thewafer 100 at a transport destination. Themoisture absorbing layer 502 is provided on a surface of thebonding layer 501 opposite to theback surface 100 r (that is, theobjects adsorption layer 503 is provided on a surface of themoisture absorbing layer 502 opposite to thebonding layer 501. Theadsorption layer 503 adsorbs and holds minute pieces by adhesive force or electrostatic force, for example. Note that, thebonding layer 501 may have a configuration in which its entire surface has a bonding force (that is, bondable) or only a part of the surface has a bonding force (that is, bondable). For example, thebonding layer 501 may have a configuration in which a portion coming in contact with theback surface 100 r is a bonding portion having a bonding force, and thewafer 100 is bonded and secured to thebonding layer 501 at the bonding portion. - An outer edge portion of the film 500 (here, the bonding layer 501) protrudes outward from the outer edges of the
objects main surface 100 s. Asupport body 510 is provided on the outer edge portion of thefilm 500 protruding from theobject 100A. Thesupport body 510 is a loop (or annular) shaped frame, for example, and is bonded to thebonding layer 501 in a downside of thefilm 500. Thesupport body 510 can be commonly used, for example, in dicing thewafer 100 at a transport destination. - When transporting the
objects objects objects main surface 100 s toward theback surface 100 r). An inner surface Ps of the accommodating container P includes a pair of protrusions Pa and a pair of protrusions Pb for oneobject support body 510. In addition, each of the pair of protrusions Pa or Pb for oneobject - In the transportation method according to the present embodiment, first, the
objects objects objects wafers 100 as described above, here, theobjects wafer 100 in a state where the plurality of Fabry-Perot interference filters 1 is two-dimensionally arranged. That is, here, theobjects objects main surfaces 100 s of theobjects support body 510 is to be inserted between the protrusions Pa and the protrusions Pb in a state where themain surface 100 s is directed downward so as to vertically clamp thesupport body 510 by the protrusions Pa and Pb, thereby supporting theobjects entire objects - As described above, the
films 500 are provided on theobjects moisture absorbing layer 502 and theadsorption layer 503 are arranged in the accommodating container P with accommodating theobjects objects adsorption layer 503 of oneobject 100B faces themain surface 100 s of anotherobject 100A in a downside of themain surface 100 s of theother object 100A. - Subsequently, the entire accommodating container P is to be accommodated in a vacuum pack, and the inside of the accommodating container P is to be evacuated by exhausting the vacuum pack (second step). Thereafter, the accommodating container P and the
objects - As described above, in the transportation method according to the present embodiment, the transport objects 100A and 100B include the plurality of Fabry-Perot interference filters 1 (the Fabry-Perot
interference filter portions 1A). In addition, in the first step, the two-dimensionally arranged Fabry-Perot interference filters 1 is accommodated and supported in the accommodating container P. In this manner, in a state where the plurality of Fabry-Perot interference filters 1 is arranged two-dimensionally, it is easier to perform collective accommodation (insert and arrange) and support in the accommodating container P while avoiding occurrence of contact with mirror portions such as thefirst mirror portion 31 and the second mirror portion 32 (main surface Ms on the membrane structure M), compared with a case where the Fabry-Perot interference filters 1 are handled individually. Therefore, this method makes it possible to transport a plurality of (a large number of) Fabry-Perot interference filters 1 with a simple configuration with reduced risk of breakage. - The membrane structure M has a configuration that is relatively easily broken among components of the Fabry-
Perot interference filter 1. Therefore, forming the membrane structure M at an early stage (stage of the wafer 100) might increase the risk of breakage. For example, in a case where the membrane structure M is formed at the stage of thewafer 100 and where water is used in the subsequent cutting step, the membrane-like secondminor portion 32 floating on the gap S might be broken by water pressure or entrance of water into the gap S might cause sticking (a phenomenon in which the secondminor portion 32 comes into contact with the firstminor portion 31 and stops movement). - Furthermore, there is a possibility, in the
wafer 100 on which the membrane structures M are arranged, that a large number of the Fabry-Perot interference filters 1 might become faulty at one time due to arrival of foreign substance or the like. Furthermore, there is a concern that the shaking or vibration during transport might influence the membrane structure M. Therefore, in order to adopt transportation in the state of thewafer 100 including the membrane structure M in transporting a large number of Fabry-Perot interference filters 1 without using individual containers, there is a need to consider ways to reduce the risk of breakage. In contrast, with the transportation method according to the present embodiment, it would be possible, as described above, to achieve collective transportation of a large number of Fabry-Perot interference filters 1 with reduced risk of breakage by handling the large number of two-dimensionally arranged Fabry-Perot interference filters 1 and performing accommodation and support in the accommodating container P. As described above, by adopting, in the present embodiment, a method of cutting thewafer 100 by forming a modified region inside thesubstrate layer 110 along each of thelines 5 using irradiation of laser light, it is possible to solve the above-described problem caused by use of water. - In the transportation method according to the present embodiment, the
objects wafers 100 in which the plurality of Fabry-Perot interference filters 1 is formed. Thewafer 100 includes: themain surface 100 s (first surface) on the side of the firstminor portion 31 and the secondminor portion 32 with respect to the substrate 11 (substrate layer 110); and the back surface (second surface) 100 r opposite to themain surface 100 s. In addition, in the first step, theobjects wafer 100. In this case, the plurality of Fabry-Perot interference filters 1 are integrated as thewafer 100. For this reason, it is possible to transport a large number of (a plurality of) Fabry-Perot interference filters 1 with a simpler configuration with reduced risk of breakage. - In the transportation method according to the present embodiment, the
bonding layer 501 is provided on theback surface 100 r of thewafer 100 opposite to themain surface 100 s. Thesupport body 510 is provided at the outer edge portion of thebonding layer 501, and the protrusions (clamping portions) Pa and Pb that vertically clamp thesupport body 510 are provided on the inner surface Ps of the accommodating container P. In the first step, theobjects support body 510 by using the protrusions Pa and Pb. In this case, the plurality of Fabry-Perot interference filters 1 is integrated as thewafer 100. This prevents breakage of the Fabry-Perot interference filter 1 due to contact with the clamping portion when theobjects - In the transportation method according to the present embodiment, in the first step, the
objects support body 510 by using the protrusions Pa and Pb in a state where themain surface 100 s faces downward. For this reason, the mirror portion (the main surface Ms of the membrane structure M) is set to face downward in the accommodating container P. For this reason, even when the minor portion (membrane structure M) is broken in one Fabry-Perot interference filter 1, fragments of the broken portion are unlikely to influence the other Fabry-Perot interference filters 1. - In the transportation method according to the present embodiment, the
moisture absorbing layer 502 is provided on a surface of thebonding layer 501 opposite to themain surface 100 s, and theadsorption layer 503 is provided on a surface of themoisture absorbing layer 502 opposite to thebonding layer 501. Additionally, in the first step, theobjects adsorption layer 503 of oneobject 100B faces themain surface 100 s of anotherobject 100A in a downside of themain surface 100 s of theother object 100A. In this case, it is possible to dispose themoisture absorbing layer 502 and theadsorption layer 503 in the accommodating container P together with accommodating theobjects moisture absorbing layer 502 at a position closer to the Fabry-Perot interference filter 1 as compared with a case where a moisture absorbing member is disposed at a bottom of the accommodating container P, for example. Furthermore, theadsorption layer 503 is disposed below the main surface Ms of the membrane structure M so as to face the main surface Ms. Therefore, even in a case where the membrane structure M is broken in one Fabry-Perot interference filter 1, the fragments of the broken portion would be adsorbed by theadsorption layer 503 in the accommodating container P (for example, theadsorption layer 503 on theback surface 100 r of the object adjacent to the object including the Fabry-Perot interference filter 1 having the breakage). Therefore, it is possible to prevent transmission of the influence of the breakage to other Fabry-Perot interference filters 1. - The transportation method according to the present embodiment includes, after the first step, the second step of accommodating the accommodating container P in a vacuum pack and evacuating the inside of the accommodating container P by exhausting the vacuum pack. In this case, it is possible to evacuate the inside of the accommodating container P without influencing the Fabry-
Perot interference filter 1. - The above embodiment has described one embodiment of the transportation method according to one aspect of the present invention. Therefore, the transportation method according to one aspect of the present invention is not limited to the above-described method, and may include an arbitrary modification of the above-described method.
- Subsequently, a modification of the transportation method will be described. In the
wafer 100, when viewed in the thickness direction of thesubstrate layer 110, the outer shape of the Fabry-Perotinterference filter portion 1A and the outer shape of thedummy filter portion 2A need not be the same. Furthermore, when cutting out a plurality of Fabry-Perot interference filters 1 from thewafer 100, there is no need to cut out all thedummy filter portions 2A (that is, it is not necessary to singulate all thedummy filter portions 2A). Furthermore, the configuration of thedummy area 102 is not limited to the above. For example, in a region corresponding to thedummy area 102, at least the secondminor portion 32 need not be surrounded by thefirst groove 290 that is annularly continuous (for example, thefirst groove 290 may simply cross a region corresponding to the dummy area 102), or thefirst groove 290 need not be formed in thedevice layer 200. Furthermore, in a region corresponding to thedummy area 102, a portion of thedevice layer 200 or theentire device layer 200 need not be provided. That is, in the wafer being a transportation object, the dummy area is not an essential configuration. -
FIG. 9 is a schematic cross-sectional view illustrating an example of a transportation method according to a modification. As illustrated inFIG. 9 , each of theobjects bonding layer 501; and a plurality of Fabry-Perot interference filters 1 formed separately from each other, two-dimensionally arranged, and bonded to thebonding layer 501. The plurality of Fabry-Perot interference filters 1 may be fixed in a state where the Fabry-Perot interference filters 1 are separated from each other in order to avoid an occurrence of breakage due to contact with each other. In this case, the two-dimensional array is not limited to a periodic array (for example, a two-dimensional lattice array) and may be an array that is randomly distributed in a predetermined plane. In addition, the main surfaces Ms of the membrane structure M of each of the Fabry-Perot interference filters 1 (the first surface on the side of thefirst mirror portion 31 and thesecond mirror portion 32 with respect to thesubstrate 11 of the Fabry-Perot interference filter 1, and the second surface opposite to the first surface) are be located on a same plane.Such objects wafer 100 as described above, picking up the manufactured Fabry-Perot interference filters 1 and then bonding the Fabry-Perot interference filters 1 to thebonding layer 501. That is, the sheet-like objects objects bonding layer 501. Thereafter, the plurality of Fabry-Perot interference filters 1 is two-dimensionally arranged by the outer edge portion of thebonding layer 501 being supported by thesupport body 510, so as to be in a fixed state of suppressing the change in a mutual positional relationship (sheet shape that would not substantially deform). Here, theobjects support body 510 in a state where the main surface Ms (the above-described first surface) of the membrane structure M of each of the Fabry-Perot interference filters 1 faces downward, and possible to store (insert and arrange) and support the sheet-like objects - Even in this case, a plurality of Fabry-Perot interference filters 1 formed separately from each other is arranged in a two-dimensional sheet shape and bonded (secured) to the
bonding layer 501. This makes it easier to carry out accommodation andsupport 1 so as not to come in contact with the mirror portion (main surface Ms (first surface) of the membrane structure M). Furthermore, in this case, eliminating the Fabry-Perot interference filter 1 determined to be faulty in a preliminary inspection at the time of pickup of the Fabry-Perot interference filter 1 after manufacturing the Fabry-Perot interference filter 1 by dicing thewafer 100 would make it possible to determine non-faulty product alone to be an object of transportation without including faulty products. Furthermore, the first surface is set to face downward in the accommodating container P. For this reason, even when the mirror portion (membrane structure M) is broken in one Fabry-Perot interference filter 1, fragments of the broken portion are unlikely to influence other Fabry-Perot interference filters 1. Moreover, even when the mirror portion (membrane structure M) is broken in one Fabry-Perot interference filter 1, fragments of the broken portion will be adsorbed onto theadsorption layer 503, making is possible to prevent the situation in which the broken fragments influence other Fabry-Perot interference filters 1. - Although the above-described example is a case of a mode in which the
objects film 500 and thesupport body 510, there is no need to use thefilm 500 and thesupport body 510. That is, it is allowable to use a configuration in which a clamping portion configured to vertically clamp an object being thewafer 100 in thedummy area 102 is provided on the inner surface Ps of the accommodating container P, and in the first step, the object may be supported in the accommodating container P by clamping thedummy area 102 with the clamping portion in a state where themain surface 100 s facing downward. In this case, it is possible to support the object in the accommodating container P without separately using a member such as thesupport body 510. Furthermore, since thedummy area 102 is provided at the outer edge portion of thewafer 100 being the object, the strength of thewafer 100 is improved and the warpage is suppressed. For this reason, the object can be accommodated easily in the accommodating container P. - Furthermore, as illustrated in
FIG. 10 , it is allowable to define awafer 600 formed by joining afirst wafer 610 and asecond wafer 620 to have a substantially non-deformable sheet shape (that is, a plate shape), as the transportation object. Thewafer 600 includes a plurality of Fabry-Perotinterference filter portions 650A. The plurality of Fabry-Perotinterference filter portions 650A is to be a plurality of Fabry-Perot interference filters 650 when thewafer 600 is cut along each oflines 5 set on each of thefirst wafer 610 and thesecond wafer 620. The plurality of Fabry-Perotinterference filter portions 650A is two-dimensionally arranged when viewed in the thickness direction of thewafer 600. - The
first wafer 610 includes asubstrate layer 611, a plurality offirst mirror portions 612, and a plurality ofdrive electrodes 613. Thesubstrate layer 611 includes a surface 611 a and asurface 611 b opposite to the surface 611 a. Thesubstrate layer 611 is formed of a light transmitting material. Each of the firstminor portions 612 is a metal film, a dielectric multilayer film, or a composite film thereof, for example. Thedrive electrode 613 is formed of a metal material, for example. - The
second wafer 620 includes asubstrate layer 621, a plurality of secondminor portions 622, and a plurality ofdrive electrodes 623. Thesubstrate layer 621 includes asurface 621 a and asurface 621 b opposite to thesurface 621 a. Thesubstrate layer 621 is formed of a light transmitting material. Each of thesecond mirror portions 622 is a metal film, a dielectric multilayer film, or a composite film thereof, for example. Thedrive electrode 623 is formed of a metal material, for example. - In the
wafer 600, one Fabry-Perotinterference filter portion 650A includes one firstminor portion 612, onedrive electrode 613, one secondminor portion 622, and onedrive electrode 623. Hereinafter, the configuration of thewafer 600 will be described focusing on the one Fabry-Perotinterference filter portion 650A. - A
recess 614 is formed on the surface 611 a of thesubstrate layer 611. Aprotrusion 615 is provided on abottom surface 614 a of therecess 614. The height of theprotrusion 615 is less than the depth of therecess 614. That is, anend surface 615 a of theprotrusion 615 is at a recessed level with respect to the surface 611 a of thesubstrate layer 611. The firstminor portion 612 is provided on theend surface 615 a of theprotrusion 615. Thedrive electrode 613 is provided on thebottom surface 614 a of therecess 614 so as to surround theprotrusion 615. Thedrive electrode 613 is electrically connected to an electrode pad (not illustrated) via wiring (not illustrated) provided on thesubstrate layer 611, for example. The electrode pad is provided in a region of thesubstrate layer 611 that can be accessed from the outside, for example. - The
surface 621 b of thesubstrate layer 621 is joined to the surface 611 a of thesubstrate layer 611 by a plasma polymerized film or the like, for example. On thesurface 621 b of thesubstrate layer 621, the secondminor portion 622 and thedrive electrode 623 are provided. The secondminor portion 622 faces the firstminor portion 612 via the gap S. Thedrive electrode 623 is provided on thesurface 621 b of thesubstrate layer 621 so as to surround the secondminor portion 622 and faces thedrive electrode 613 via the gap S. Thedrive electrode 623 is electrically connected to an electrode pad (not illustrated), for example, via wiring (not illustrated) provided on thesubstrate layer 621. The electrode pad is provided in a region of thesubstrate layer 621 that can be accessed from the outside, for example. - A
groove 621 c is formed on thesurface 621 a of thesubstrate layer 621 so as to surround the secondminor portion 622 and thedrive electrode 623 when viewed in the thickness direction of thewafer 600. Thegroove 621 c extends in an annular shape. The portion of thesubstrate layer 621 surrounded by thegroove 621 c is displaceable in the thickness direction of thewafer 600 with the portion where thegroove 621 c is formed defined as a diaphragm-like holder 621 d. In the diaphragm-like holder 621 d, it is allowable to form a groove surrounding the secondminor portion 622 and thedrive electrode 623 when viewed in the thickness direction of thewafer 600 on at least one of thesurface 621 a and thesurface 621 b of thesubstrate layer 621. Furthermore, it is also allowable to form the groove surrounding thefirst mirror portion 612 and thedrive electrode 613 in thesubstrate layer 611 when viewed in the thickness direction of thewafer 600 so as to form the diaphragm-like holder in thesubstrate layer 611. Further alternatively, instead of the diaphragm-like holder, a holder may be formed by a plurality of beams arranged radially. - In the
wafer 600 on which each of the Fabry-Perotinterference filter portions 650A is formed as described above, when a voltage is applied between thedrive electrode 613 and thedrive electrode 623 in each of the Fabry-Perotinterference filter portions 650A, an electrostatic force corresponding to the voltage is generated between thedrive electrode 613 and thedrive electrode 623. The portion of thesubstrate layer 621 surrounded by thegroove 621 c is attracted toward thesubstrate layer 611 side by the electrostatic force, thereby adjusting the distance between the firstminor portion 612 and the secondminor portion 622. This allows transmission of light having a wavelength corresponding to the distance between thefirst mirror portion 612 and the secondminor portion 622. - The
wafer 600 as a transportation object includes a plurality of two-dimensionally arranged Fabry-Perot interference filters 650. The Fabry-Perot interference filter 650 includes: the substrate formed from thesubstrate layer 611; and the firstminor portion 612 and the secondminor portion 622 provided on the substrate to face each other via the gap S and in which the distance from each other is variable. - Furthermore, in the
wafer 600 and the Fabry-Perot interference filter 650, the first surface on the side of thefirst mirror portion 31 and the secondminor portion 32 with respect to the substrate layer 611 (and the substrate formed from the substrate layer 611) corresponds to thesurface 621 a of the substrate layer 621 (and the substrate formed from the substrate layer 621), with thesubstrate layer 611 as reference. Furthermore, the second surface opposite to the first surface is thesurface 611 b of the substrate layer 611 (and the substrate formed from the substrate layer 611). - Even in a case where such a
wafer 600 is transported as an object, the object will be accommodated in the accommodating container P in the first step similarly to the above-described case. At this time, in the first step, the object is accommodated and supported in the accommodating container P in a state where the plurality of Fabry-Perot interference filters 650 is arranged two-dimensionally. - It is possible to provide a transportation method capable of transporting a large number of Fabry-Perot interference filters with reduced risk of breakage.
-
- 1, 650 Fabry-Perot interference filter
- 2 Dummy filter
- 11 Substrate
- 31 First mirror portion
- 32 Second mirror portion
- 100, 600 Wafer
- 100A, 100B Object
- 101 Effective area
- 102 Dummy area
- 501 Bonding layer
- 502 Moisture absorbing layer
- 503 Adsorption layer
- P Accommodating container
- Ps Inner surface
- Pa, Pb Protrusion (clamping portion)
Claims (9)
1. A transportation method for transporting an object including a plurality of Fabry-Perot interference filters, the transportation method comprising a first step of accommodating the object in an accommodating container,
wherein the Fabry-Perot interference filter includes a substrate, a first mirror portion and a second minor portion provided on the substrate to face each other via a gap and in which a distance from each other is variable, and
in the first step, the object is accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged and each of the Fabry-Perot interference filters is separated from a bottom surface of the accommodating container via a gap.
2. The transportation method according to claim 1 ,
wherein the object is a wafer in which the plurality of Fabry-Perot interference filters is formed,
the wafer includes a first surface on the sides of the first minor portion and the second minor portion with respect to the substrate and includes a second surface opposite to the first surface, and
in the first step, the object is accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged as the wafer.
3. The transportation method according to claim 2 ,
wherein the object includes a bonding layer bonded to the second surface,
a support body is provided at an outer edge portion of the bonding layer, and
in the first step, the object is supported in the accommodating container by supporting the support body.
4. The transportation method according to claim 3 ,
wherein in the first step, the object is supported by vertically supported the support body in a state where the first surface faces downward.
5. The transportation method according to claim 2 ,
wherein an effective area including the plurality of Fabry-Perot interference filters and an outer edge surrounding the effective area are formed in the wafer,
in the first step, the object is supported in the accommodating container by supporting the outer edge.
6. The transportation method according to claim 5 ,
wherein in the first step, the object is supported in the accommodating container by vertically supporting the outer edge in a state where the first surface faces downward.
7. The transportation method according to claim 1 ,
wherein the object includes a bonding layer and the plurality of Fabry-Perot interference filters separately formed from each other, the Fabry-Perot interference filters are two-dimensionally arranged and are bonded to the bonding layer,
a support body is provided on an outer edge portion of the bonding layer,
the Fabry-Perot interference filter includes a first surface on the sides of the first mirror portion and the second minor portion with respect to the substrate and includes a second surface that is a surface opposite to the first surface and that is bonded to the bonding layer, and
in the first step, the object is supported in the accommodating container by supporting the support body in a state where the first surface faces downward.
8. The transportation method according to claim 3 ,
wherein a moisture absorbing layer is provided on a surface of the bonding layer opposite to the second surface,
an adsorption layer is provided on a surface of the moisture absorbing layer opposite to the bonding layer, and
in the first step, the object is accommodated and supported in the accommodating container such that the adsorption layer of one object faces the first surface of another object in a downside of the first surface of another object.
9. The transportation method according to claim 1 , further comprising,
after the first step, a second step of accommodating the accommodating container into a vacuum pack and evacuating the inside of the accommodating container by exhausting the vacuum pack.
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US18/082,641 US20230122733A1 (en) | 2017-11-24 | 2022-12-16 | Transportation method |
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JP2017225973A JP7131901B2 (en) | 2017-11-24 | 2017-11-24 | Transportation method |
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US202016765765A | 2020-05-20 | 2020-05-20 | |
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-
2017
- 2017-11-24 JP JP2017225973A patent/JP7131901B2/en active Active
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2018
- 2018-11-09 US US16/765,765 patent/US11592332B2/en active Active
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US20230118479A1 (en) | 2023-04-20 |
KR102613360B1 (en) | 2023-12-14 |
TWI780265B (en) | 2022-10-11 |
CN111373521A (en) | 2020-07-03 |
JP2022179478A (en) | 2022-12-02 |
JP7470158B2 (en) | 2024-04-17 |
JP7131901B2 (en) | 2022-09-06 |
KR20200091875A (en) | 2020-07-31 |
KR20230170152A (en) | 2023-12-18 |
US20200292386A1 (en) | 2020-09-17 |
JP2019096781A (en) | 2019-06-20 |
EP3716318A1 (en) | 2020-09-30 |
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