US20230115369A1 - Manufacturing method of capacitor component - Google Patents

Manufacturing method of capacitor component Download PDF

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Publication number
US20230115369A1
US20230115369A1 US17/562,386 US202117562386A US2023115369A1 US 20230115369 A1 US20230115369 A1 US 20230115369A1 US 202117562386 A US202117562386 A US 202117562386A US 2023115369 A1 US2023115369 A1 US 2023115369A1
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United States
Prior art keywords
pattern
green sheet
inkjet printing
dielectric green
manufacturing
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Pending
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US17/562,386
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English (en)
Inventor
Eung Seok Lee
Tae Gyun Kwon
So Hyeon HONG
Tae Sung Kim
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HONG, SO HYEON, KIM, TAE SUNG, KWON, TAE GYUN, LEE, EUNG SEOK
Publication of US20230115369A1 publication Critical patent/US20230115369A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates

Definitions

  • the present disclosure relates to a manufacturing method of a capacitor component.
  • a multilayer ceramic capacitor (MLCC), a capacitor component is an important chip component used in areas such as communications, information technology, home appliance and automobile manufacturing, and other industries, due to advantages thereof such as a small size, high capacitance, and ease of mounting, and in particular, is a core passive element used in various electric, electronic and information communication devices such as mobile phones, computers, digital TVs, and the like.
  • an MLCC is manufactured by forming an unsintered internal electrode layer on a dielectric green sheet, stacking a plurality of dielectric green sheets on which an unsintered internal electrode layer is formed, and then sintering the same.
  • the unsintered internal electrode layer generally formed by screen-printina or gravure printing of a conductive paste, but there may be a limitation in thinning the internal electrode layer using the above described methods.
  • An aspect of the present disclosure is to provide a manufacturing method of a capacitor component for thinning an internal electrode layer.
  • Another aspect of the present disclosure is to provide a manufacturing method of a capacitor component for improving thickness uniformity of an internal electrode layer.
  • a manufacturing method of a capacitor component includes forming a dielectric green sheet and inkjet printing a conductive pattern on the dielectric green sheet.
  • the inkjet printing the conductive pattern includes inkjet printing a base pattern on the dielectric green sheet and printing a reinforcing pattern on at least a portion of each of both end portions of the base pattern in a width direction of the dielectric green sheet.
  • FIGS. 1 to 8 are views sequentially illustrating processes of a manufacturing method of a capacitor component according to an embodiment of the present disclosure
  • FIG. 9 is a diagram schematically illustrating an example of a capacitor component manufactured using a manufacturing method of a capacitor component according to an embodiment of the present disclosure.
  • FIG. 10 is a view illustrating a cross-section taken along line I-I′ of FIG. 9 .
  • Coupled to may not only indicate that elements are directly and physically in contact with each other, but also include the configuration in which the other element is interposed between the elements such that the elements are also in contact with the other component.
  • an L direction is a first direction or a length direction
  • a W direction is a second direction or a width direction
  • a T direction is a third direction or a thickness direction.
  • FIGS. 1 to 8 are views sequentially illustrating some processes of a manufacturing method of a capacitor component according to an embodiment of the present disclosure.
  • FIG. 9 is a diagram schematically illustrating an example of a capacitor component manufactured by the manufacturing method. of a capacitor component according to an embodiment of the present disclosure.
  • FIG. 10 is a view lust rating a cross-section taken along line I-I′ of FIG. 9 .
  • each of FIGS. 1 to 5 illustrates a plan view viewed from above and a cross-sectional view viewed from below.
  • a capacitor component 1000 includes a body 100 and external electrodes 210 and 220 .
  • the body 100 includes a dielectric layer 110 and internal electrode layers 121 and 122 .
  • the body 100 forms an exterior of the capacitor component 1000 according to the present embodiment.
  • a specific shape of the body 100 is not particularly limited, but as illustrated, the body 100 may have a hexahedral or similar shape. Due to sintering shrinkage occurring during a sintering process, the body 100 may have a substantially hexahedral shape although without perfectly straight lines within the hexahedral shape.
  • the body 100 includes a first surface 101 and a second surface 102 facing each other in a thickness (T) direction, a third surface 103 and a fourth surface 104 facing each other in a longitudinal (L) direction, and a fifth surface 105 and a sixth surface 106 facing each other in a width (W) direction.
  • Each of the third to sixth surfaces 103 , 104 , 105 , and 106 of the body 100 corresponds to a wall surface of the body 100 connecting the first surface 101 and the second surface 102 of the body 100 .
  • both end surfaces (one end surface and the other end surface) of the body 100 may mean the third surface 103 and the fourth surface 104 of the body, and both side surfaces (one side surface and the other side surface) of the body 100 may mean the fifth surface 105 and the sixth surface 106 of the body 100 .
  • one surface and the other surface of the body 100 may mean the first surface 101 and the second surface 102 of the body 100 , respectively.
  • One surface 101 of the body 100 may be used as amounting surface when the capacitor component 1000 according to the present embodiment is mounted on a mounting substrate such as a printed circuit board, or the like.
  • the body 100 includes a dielectric layer 110 and first and second internal electrode layers 121 and 122 alternately disposed with the dielectric layer 110 interposed therebetween.
  • Each of the dielectric layer 110 , the first internal electrode layer 121 , and the second internal electrode layer 122 is formed of a plurality of layers.
  • the first and second internal electrode layers 121 and 122 will be collectively referred to as internal electrode layers 121 and 122 , except for a case in which it is necessary to distinguish therebetween. Accordingly, the description of a portion collectively referred to as the internal electrode layers 121 and 122 may be commonly applied to the first and second internal electrode layers 121 and 122 .
  • a plurality of dielectric layers 110 forming the body 100 are in a sintered state, and boundaries between adjacent dielectric layers 110 may be integrated to such an extent that they may be difficult to determine without using a scanning electron microscope (SEM).
  • SEM scanning electron microscope
  • a raw material for forming the dielectric layer 110 is not particularly limited as long as sufficient capacitance can be obtained therewith.
  • the dielectric layer 110 may be formed by sintering the dielectric ceramic composition according to an embodiment of the present disclosure.
  • a material for forming the dielectric layer 110 , various ceramic additives, organic solvents, plasticizers, binders, dispersants, and the like may be added to powder such as barium titanate (BaTiO 3 ) according to the purpose of the present disclosure.
  • a cover layer 130 may be disposed on upper and lower portions of the body 100 , that is, in both end portions of the body 100 in a thickness direction (T direction).
  • the cover layer 130 may serve to maintain reliability of the capacitor component against external impacts.
  • the cover layer 110 may be formed using a material for forming the dielectric layer 110 or a material different from the material for forming the dielectric layer 110 .
  • the material for forming the dielectric layer 110 and the material for forming the cover layer 110 maybe different from each other in at least one of the a composition, a size, a content, and a dispersion degree of ceramic particles in the material, or may be different from each other in at least one of a size, a content, and a dispersion degree of subcomponents in the material.
  • the internal electrode layers 121 and 122 may be alternately disposed with the dielectric layer 110 , and may include first and second internal electrode layers 121 and 122 .
  • the first and second internal electrode layers 121 and 122 may be alternately disposed to face each other with the dielectric layer 110 interposed therebetween, and may be exposed to the third and fourth surfaces 103 and 104 of the body 100 , respectively.
  • the internal electrode layers 121 and 122 have a shape, similar to that of a plate as a whole, and are alternately exposed to (or are in contact with or extend from) the third surface 103 and the fourth surface 104 , which are both end surfaces in a longitudinal direction of the body 100 (L direction), respectively, and are connected to first and second external electrodes 210 and 220 . That is, the first internal electrode layer 121 is exposed to the third surface 103 of the body 100 to be connected to the first external electrode 210 , and is not exposed to the fourth surface 104 of the body 100 to not be connected to the second external electrode 220 .
  • the second internal electrode layer 122 is exposed to the fourth surface 104 of the body 100 to be connected to the second external electrode 220 , and is not exposed to the third surface 103 of the body 100 to not be connected to the first external electrode 210 . Accordingly, the first internal electrode layer 121 is spaced apart from the fourth surface 104 of the body 100 by a predetermined distance, and the second internal electrode layer 122 is spaced apart from the third surface 103 of the body 100 by a predetermined distance. In this case, the internal electrode layers 121 and 122 maybe electrically separated from each other by the dielectric layer 110 disposed therebetween.
  • the internal electrode layers 121 and 122 may include, for example, one or more conductors of palladium (Pd), silver (Ag), nickel (Ni), and copper (Cu).
  • the internal electrode layers 121 and 122 may be formed by inkjet printing conductive droplets on a dielectric green sheet to form a conductive pattern on the dielectric green sheet, and stacking a plurality of dielectric green sheets on which the conductive pattern is formed, and then sintering the same.
  • the conductive droplets for forming the internal electrode layer may include a conductive powder containing nickel (Ni), a binder, a solvent, and the like.
  • An average thickness T 1 of each of (or one of) the internal electrode layers 121 and 122 may be 200 nm or more and 250 nm or less.
  • the thickness T 1 of the internal electrode layers 121 and 122 is less than 200 nm, connectivity of the internal electrode layers 121 and 122 maybe deteriorated, such that capacitance may be reduced.
  • the thickness T 1 of the internal electrode layers 121 and 122 exceeds 250 nm, the dielectric layer 110 is formed to have a thin thickness based on a component having the same size, such that it may be difficult to provide electrical insulation between the internal electrode layers 121 and 122 .
  • the average thickness T 1 of the internal electrode layers 121 and 122 may be measured by using an optical image or an SEM image obtained by scanning a cross-section in a longitudinal direction-thickness direction (LT cross-section) of the capacitor component in a central portion in a width direction (W).
  • the average thickness T 1 of the internal electrode layers 121 and 122 may be determined by selecting any one of the internal electrode layers 121 and 122 shown in the image, and may mean that a dimension of a selected internal electrode layer in a thickness direction (T) multiple times in a longitudinal direction (L) and mathematically averaging the same. Measuring the dimension thereof multiple times in the longitudinal direction (L) may be performed at equal intervals in the longitudinal direction (L), but is not limited thereto.
  • the average thickness T 1 of the internal electrode layers 121 and 122 may be obtained by calculating a sum of average thicknesses of the internal electrode layers 121 and 122 , measured for each of the plurality of internal electrode layers 121 and 122 shown in the image by the above-described method, and dividing the sum by the total number of the internal electrode layers 121 and 122 .
  • Voids and ceramic particles may be disposed in the internal electrode layers 121 and 122 .
  • the ceramic particles may be due to ceramic powder such as barium titanate, or the like added additionally to the conductive droplet for forming the internal electrode layer.
  • the ceramic particles maybe made of a barium titanate-based material in the same manner as the dielectric of the dielectric layer 110 , but is not limited thereto.
  • the voids may be formed due to diffusion and recrystallization in a sintering process of conductive powder such as nickel (Ni), or the like included in the conductive droplet, or may be formed by removing an organic material such as a solvent included in the conductive droplet during a heat treatment process such as a drying process and/or a sintering process.
  • External electrodes 210 and 220 are disposed on the body 100 and are connected to the internal electrode layers 121 and 122 . As illustrated in FIGS. 9 and 10 , the external electrodes 210 and 220 may include first and second external electrodes 210 and 220 respectively disposed on the third and fourth surfaces 103 and 104 of the body 100 and respectively connected to the first and second internal electrodes 121 and 122 .
  • the first and second external electrodes 210 and 220 may include first and second connection portions respectively disposed on the third and fourth surfaces 103 and 104 of the body 100 to be connected to the first and second internal electrode layers 121 and 122 , and first and second extension portions extending from the first and second connection portions to the first surface 101 of the body 100 , respectively.
  • the first and second extension portions are disposed to be spaced apart from each other on the first surface 101 of the body 100 . Meanwhile, the first and second extension portions may extend not only to the first surface 101 of the body 100 , but also to each of the second, fifth and sixth surfaces 102 , 105 , 106 of the body 100 , but the scope of the present disclosure is not limited thereto. That is, as illustrated in FIG.
  • each of the external electrodes 210 and 220 of the present disclosure may be a normal type formed on five surfaces of the body 100 , but is not limited thereto. It may be an L-type formed on two surfaces of the body 100 , a C-type formed on three surfaces of the body 100 , and the like.
  • the external electrodes 210 and 220 may be formed of any material as long as they have electrical conductivity, such as metal, and specific materials may be determined in consideration of electrical characteristics and structural stability, and further may have a multilayer structure.
  • each of the external electrodes 210 and 220 may include a first layer and a second layer, and the first layer may be formed by sintering a sintered conductive paste including a conductive metal and glass, or may be formed by curing a curable conductive paste including a conductive metal a base resin, or may be formed by vapor deposition.
  • the second layer may be a nickel (Ni) plating layer and a tin (Sn) plating layer sequentially formed on the first layer by a plating method.
  • the capacitor component 100 has two external electrodes 210 and 220
  • the number and shape of the external electrodes 210 and 220 may be changed depending on the shape of the internal electrode layers 121 and 122 or other purposes.
  • a dielectric green sheet is formed.
  • the dielectric green sheet 10 is configured to become the aforementioned dielectric layer 110 through a subsequent process, and may be formed of a dielectric paste.
  • the dielectric paste may include various ceramic additives, organic solvents, plasticizers, binders, dispersants, and the like, added to ceramic powder such as barium titanate (BaTiO 3 ), which is a dielectric, according to the purpose of the present disclosure.
  • the dielectric green sheet 10 may be divided into an inner region 11 in which a conductive pattern 20 to be described later is formed, and an outer region 12 surrounding the inner region and in which a dummy pattern D to be described later is formed.
  • the dielectric green sheet 10 may be formed on a support plate such as a PET film or the like, and the support plate may support the dielectric green sheet 10 during the process.
  • a dummy pattern is formed in an outer region of a dielectric green sheet.
  • a dummy pattern D includes an uncoated pattern D 1 formed in an outermost portion of the outer regions 11 of the dielectric green sheet 10 and an index pattern D 2 formed in a region closest to the inner region 12 among the outer regions 11 of the dielectric green sheet 10 .
  • the uncoated pattern D 1 may refer to an outermost pattern or an edge pattern formed on an edge portion of the dielectric green sheet.
  • Each of the uncoated pattern 11 and the index pattern 12 may be formed by inkjet printing.
  • An inkjet head used for inkjet printing may include a plurality of outlets for discharging droplets. In the present process, the inkjet head may discharge droplets for forming an uncoated pattern and droplets for forming an index pattern, respectively, in order to form the dummy pattern D.
  • the droplet for forming the uncoated pattern and the droplet for forming the index pattern may be formed of a material different from that of the dielectric green sheet described above and the conductive droplet for forming an internal electrode to be described later.
  • the droplet for forming an uncoated pattern and the droplet for forming an index pattern may not contain ceramic dielectric particles, unlike a dielectric paste for forming the dielectric green sheet, and may not contain conductive particles, unlike the conductive droplet for forming the conductive pattern.
  • the droplet for forming the dummy pattern D is formed of a material different from the dielectric paste for forming the dielectric green sheet and the conductive droplet for forming the conductive pattern, the dummy pattern D, which is a portion that does not remain in a final product, may be formed more simply and at reduced costs.
  • the uncoated pattern D 1 may be, for example, disposed further outside of the index pattern D 2 and the conductive pattern 20 to protect the index pattern D 2 and the conductive pattern 20 from the outside.
  • the index pattern D 2 may be, for example, a reference in a process of cutting a laminate 30 to be described later, but the scope of the present disclosure is not limited thereto.
  • each of the uncoated pattern D 1 and the index pattern D 2 is shown to be formed in a rectangular ring shape, but this is merely an example.
  • the index pattern D 2 may be disposed on each of a plurality of dicing lines in a process of cutting the laminate 30 , which will be described later, and formed to be spaced apart from each other.
  • a conductive pattern is inkjet printed on the dielectric green sheet.
  • a conductive pattern ( 20 in FIG. 5 ) is configured to become internal electrode layers ( 121 and 122 in FIG. 10 ) of the capacitor component ( 1000 in FIG. 9 ) through a subsequent process.
  • the conductive pattern 20 is formed by inkjet printing a base pattern 21
  • the conductive pattern 20 is formed by inkjet printing a reinforcing pattern 22 on at least a portion of both end portions 21 B of the base pattern 21 in a width direction.
  • the base pattern may have a stripe shape extending in the length direction.
  • a base pattern of the conductive pattern 20 is formed in an inner region 11 of the dielectric green sheet by inkjet printing.
  • a conductive droplet DL 1 used for inkjet printing to form a base pattern may be discharged through a plurality of outlets of an inkjet head H.
  • the base pattern 21 may be printed to have an average thickness in a central portion 21 A thereof in a width direction to be thicker than an average thickness in both end portions 21 B thereof in the width direction.
  • the base pattern 21 may be printed such that the thickness of each of both end portions 21 B in the width direction becomes thinner outwardly in the width direction. That is, the base pattern 21 may be formed to have a dome-shaped cross-section due to relatively low viscosity and surface tension of the conductive droplet DL 1 .
  • a portion having a thickness of 90% or more compared to a maximum thickness of the base pattern 21 may be defined as a central portion 21 A, and a portion having a thickness of 90% or less compared to a maximum thickness of the base pattern 21 may be defined as an outer portion 21 B.
  • the central portion 21 A of the base pattern 21 in the width direction and the outer portion 21 B thereof in the width direction may be defined, for example, by dividing a dimension of the base pattern in the width direction of into three equal parts.
  • the base pattern 21 may be formed in plural forms spaced apart from each other in the inner region 11 of the dielectric green sheet 10 using a single inkjet head H, by controlling whether or not the droplet DL 1 of the plurality of outlets of the inkjet head H. Accordingly, even when the inkjet head H moves only once in a longitudinal direction L, the above-described plurality of base patterns 21 , spaced apart from each other, may be formed.
  • a reinforcing pattern 22 is formed by inkjet printing the droplet DL 2 for forming a reinforcing pattern on at least a portion of each of both end portions 21 B of the base pattern 21 in the width direction.
  • both end portions 21 B is formed to have a relatively thinner thickness than the central portion 21 A, and the reinforcing pattern 22 is formed in at least a portion of the both end portions 21 B of the base pattern 21 , such that a difference in thickness of the base pattern 21 in the width direction is reduced.
  • a difference in thickness of the conductive pattern 20 in the width direction may be alleviated due to the reinforcing pattern 22 .
  • the conductive droplet DL 2 used for inkjet printing to forma reinforcing pattern may be discharged through an outlet corresponding to a position of both end portions 21 B of each base pattern 21 in the width direction among a plurality of outlets of the inkjet head H.
  • the reinforcing pattern 22 may be formed only on at least a portion of both end portions 21 B of the base pattern 21 in the width direction, but may not be formed in the central portion 21 A of the base pattern 21 in the width direction.
  • the reinforcing pattern 22 is formed in both end portions 21 B of the base pattern 21 after the inkjet head H moves once in a longitudinal direction L to form the base pattern 21 , the reinforcing pattern 22 is formed later than the base pattern 21 by one reciprocating time in a longitudinal direction L of the inkjet head H.
  • the conductive droplet DL 2 for forming the reinforcing pattern is formed on a surface of the base pattern dried during the time, the reinforce pattern 22 may be formed in both end portions 21 B of the base patter 21 , and a thickness of a region close to both ends of the base pattern in the width direction may be formed to be thicker than a thickness of a region close to the central portion 21 A of the base pattern 21 in the width direction.
  • the reinforcing pattern 22 may be formed in a shape not in contact with the dielectric green sheet 10 , but, the scope of the present embodiment is not limited thereto. Meanwhile, the base pattern 21 and the reinforcing pattern 22 may be formed using the same conductive droplet. In this case, the manufacturing costs may be reduced, and the process and equipment may be simplified.
  • FIG. 6 Thereafter, as shown in FIG. 6 , the processes of FIGS. 4 and 5 are additionally repeated at least once to form a plurality of conductive patterns 20 in an inner region 11 of the dielectric green sheet 10 .
  • a laminate is formed by stacking a plurality of dielectric green sheets on which a conductive pattern is printed, and at least one green chip is formed by cutting the laminate.
  • a laminate 30 is formed by stacking the plurality of dielectric green sheets 10 each having the conductive pattern 20 printed thereon.
  • a support plate described above may be formed on each dielectric green sheet 10 , and a support plate attached to each dielectric green sheet 10 before a process of forming the laminate 30 may be removed.
  • the laminate 30 is cut to form a plurality of green chips 40 corresponding to a body of the capacitor component.
  • each green chip 40 is sintered to form a body ( 100 in FIG. 10 ) in which a dielectric 110 in FIG. 10 ) and internal electrode layers ( 121 and 122 in FIG. 10 ) are alternately disposed, and external electrodes ( 210 and 220 in FIGS. 9 and 10 ) are formed on both end surfaces ( 103 and 104 in FIGS. 9 and 10 ) of the body ( 100 in FIG. 10 ) facing in a longitudinal (L) direction.
  • a conductive pattern 20 for forming the internal electrode layers 121 and 122 is formed by inkjet printing, thereby reducing the thickness of the internal electrode layers 121 and 122 of a final component after firing. That is, in the case of conventional screen-printing and gravure printing, it may be difficult to thin the conductive pattern by printing a paste and further it may be difficult to reduce the thickness of the internal electrode layer. In the present embodiment, it is advantageous for thinning of the conductive pattern by forming the conductive pattern as a discharge of conductive droplets (inkjet printing). As a result, it is advantageous in reducing the thickness of the internal electrode layers 121 and 122 of the final component.
  • a base pattern 21 is formed by inkjet printing, and a reinforcing pattern is additionally formed on both end portions 21 B of the base pattern 21 by inkjet printing, thereby alleviating a thickness difference in the width direction of the base pattern 21 formed by inkjet printing. Accordingly, thickness uniformity in the width direction of the conductive pattern 20 may be improved, and as a result, the thickness uniformity of the internal electrode layers 121 and 122 of the final component may be improved.
  • a thickness of an internal electrode layer may be reduced.
  • thickness uniformity of an internal electrode layer may be improved.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
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KR1020210135759A KR20230052560A (ko) 2021-10-13 2021-10-13 커패시터 부품의 제조 방법
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0696991A (ja) * 1992-09-14 1994-04-08 Toshiba Corp 積層セラミックコンデンサの製造方法
US20140265729A1 (en) * 2011-10-26 2014-09-18 Canon Kabushiki Kaisha Piezoelectric material, piezoelectric element, and electronic apparatus
JP2018082067A (ja) * 2016-11-17 2018-05-24 株式会社村田製作所 積層セラミックコンデンサ
JP2021111661A (ja) * 2020-01-08 2021-08-02 株式会社村田製作所 電子部品の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017221917A (ja) 2016-06-16 2017-12-21 株式会社村田製作所 電子部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0696991A (ja) * 1992-09-14 1994-04-08 Toshiba Corp 積層セラミックコンデンサの製造方法
US20140265729A1 (en) * 2011-10-26 2014-09-18 Canon Kabushiki Kaisha Piezoelectric material, piezoelectric element, and electronic apparatus
JP2018082067A (ja) * 2016-11-17 2018-05-24 株式会社村田製作所 積層セラミックコンデンサ
JP2021111661A (ja) * 2020-01-08 2021-08-02 株式会社村田製作所 電子部品の製造方法

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