US20230020180A1 - Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same - Google Patents

Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same Download PDF

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Publication number
US20230020180A1
US20230020180A1 US17/779,955 US202017779955A US2023020180A1 US 20230020180 A1 US20230020180 A1 US 20230020180A1 US 202017779955 A US202017779955 A US 202017779955A US 2023020180 A1 US2023020180 A1 US 2023020180A1
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United States
Prior art keywords
foil
carrier foil
layer
component
metal foil
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Pending
Application number
US17/779,955
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English (en)
Inventor
Hyun Woo JEON
Bo Mook CHUNG
Sung Wook Chun
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YMT Co Ltd
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YMT Co Ltd
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Filing date
Publication date
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Assigned to YMT CO.,LTD. reassignment YMT CO.,LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHUN, SUNG WOOK, CHUNG, BO MOOK, JEON, HYUN WOO
Publication of US20230020180A1 publication Critical patent/US20230020180A1/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • B05D1/185—Processes for applying liquids or other fluent materials performed by dipping applying monomolecular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/20—Metallic substrate based on light metals
    • B05D2202/25—Metallic substrate based on light metals based on Al
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/40—Metallic substrate based on other transition elements
    • B05D2202/45—Metallic substrate based on other transition elements based on Cu
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/24—Organic non-macromolecular coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Definitions

  • the present invention relates to a carrier foil-attached metal foil, a method of manufacturing the same, and a laminate for forming a printed circuit board including the metal foil.
  • a printed circuit board having a high-density ultra-fine wiring pattern is required.
  • Such a printed circuit board may be manufactured by forming the high-density ultra-fine wiring pattern on a metal foil included in the printed circuit board.
  • a relatively thin metal foil e.g., a metal foil having a thickness of 9 ⁇ m or less
  • the metal foil may be easily wrinkled or bent during the manufacturing of the printed circuit board.
  • a carrier foil-attached metal foil in which a carrier foil is attached to one surface of the metal foil through a release layer has been used.
  • a basic structure of the printed circuit board is formed by peeling the release layer and the carrier foil from the carrier foil-attached metal foil.
  • peeling the release layer and the carrier foil if the metal foil is deformed or impurities remain on the metal foil, a defect rate of the printed circuit board increases. Accordingly, it is required to stabilize a peeling strength when peeling the release layer and the carrier foil so that the impurities do not remain on the metal foil while preventing the deformation of the metal foil.
  • the present invention provides a carrier foil-attached metal foil capable of minimizing a deformation of a metal foil and impurities remaining on the metal foil when peeling the carrier foil from the metal foil.
  • the present invention provides a method of manufacturing the carrier foil-attached metal foil.
  • the present invention provides a laminate for forming a printed circuit board with excellent reliability by including the carrier foil-attached metal foil.
  • an carrier foil-attached metal foil including: a carrier foil; an alloy layer provided on the carrier foil; an organic layer provided on the alloy layer; and a metal layer provided on the organic layer, in which the alloy layer includes a first component containing nickel (Ni) and a second component containing molybdenum (Mo), and a ratio a:b of the first component a and the second component b is a weight ratio of 40 to 80:60 to 20, and the organic layer includes a cyclic compound containing two or more nitrogen atoms.
  • a method of manufacturing a carrier foil-attached metal foil including: preparing a carrier foil; forming an alloy layer on the carrier foil; forming an organic layer on the alloy layer; and forming a metal layer on the organic layer, in which the alloy layer is formed of a plating solution including a first component containing nickel (Ni) and a second component containing molybdenum (Mo), and a ratio a:b of the first component a and the second component b is a weight ratio of 40 to 80:60 to 20, and the organic layer is formed of a coating solution including a cyclic compound containing two or more nitrogen atoms.
  • a laminate including: the carrier foil-attached metal foil; and a resin substrate provided on the carrier foil-attached metal foil.
  • a carrier foil-attached metal foil includes an alloy layer containing molybdenum and nickel at a specific ratio and a release layer formed of an organic layer containing a cyclic compound containing two or more nitrogen atoms, when peeling the carrier foil from the metal foil, it is possible to prevent impurities (e.g., metal components derived from the alloy layer) from remaining on the metal foil while minimizing a deformation of the metal foil.
  • impurities e.g., metal components derived from the alloy layer
  • a laminate for forming a printed circuit board according to the present invention includes the carrier foil-attached metal foil, a defect rate is minimized, and thus the present invention may provide a laminate for forming a printed circuit board with excellent reliability.
  • FIG. 1 is a cross-sectional view of a carrier foil-attached metal foil according to the present invention.
  • the present invention is to provide a carrier foil-attached metal foil having a specific composition and structure of an alloy layer and an organic layer serving as a release layer.
  • the present invention relates to a carrier foil-attached metal foil capable of maintaining an alloy layer and an organic layer, which are bonded to a carrier foil, at an appropriate bonding strength (peeling strength) before peeling the alloy layer and the organic layer from a metal layer, minimizing a deformation of the metal layer by smoothly peeling the alloy layer and the organic layer from the metal layer when peeling, and preventing impurities from remaining in the metal layer after peeling, a method of manufacturing the carrier foil-attached metal foil, and a laminate including the carrier foil-attached metal foil, which will be described in detail as follows.
  • a carrier foil-attached metal foil according to the present invention includes a carrier foil, an alloy layer, an organic layer, and a metal layer, which will be described in detail with reference to FIG. 1 as follows.
  • a carrier foil 10 included in the carrier foil-attached metal foil according to the present invention may serve as a support layer to prevent a deformation of the metal layer 40 during movement or use of the carrier foil-attached metal foil.
  • the carrier foil 10 may be made of a metal such as copper or aluminum; or a polymer such as polyethylene terephthalate (PET), polyphenylene sulfide (PPS), or Teflon.
  • a thickness of the carrier foil 10 may be 10 to 50 ⁇ m. As the thickness of the carrier foil 10 is within the above range, it is possible to prevent the carrier foil-attached metal foil from becoming thicker than necessary while smoothly performing the role of a support layer.
  • the alloy layer 20 included in the carrier foil-attached metal foil according to the present invention is a first release layer provided on the carrier foil 10 , and may serve to bond the carrier foil 10 and the organic layer 30 and prevent a component of the carrier foil 10 from being diffused into the metal layer 40 .
  • the alloy layer 20 may include a first component containing nickel (Ni) and a second component containing molybdenum (Mo).
  • the first component is nickel, and may prevent the component of the carrier foil 10 from being diffused and adsorbed into the metal layer 40 as the nickel is contained in the alloy layer 20 .
  • the second component is molybdenum, and provides a site to which a cyclic compound included in the organic layer 30 is bonded as the molybdenum is contained in the alloy layer 20 , thereby providing a required bonding strength (peeling strength) between the alloy layer 20 and the organic layer 30 .
  • a ratio a:b of the first component a and the second component b may be within 40 to 80:60 to 20, and specifically, a weight ratio of 60 to 80:40 to 20.
  • the component of the carrier foil 10 may be prevented from being diffused into the metal layer 40 , and thus, may peel the carrier foil 10 so that impurities do not remain in the metal layer 40 , and may provide the required bonding strength (peeling strength) before and after peeling to the alloy layer 20 .
  • peeling strength peeling strength
  • the bonding strength (peeling strength) between the carrier foil 10 , the alloy layer 20 , and the organic layer 30 is maintained stably, so the carrier foil 10 may be peeled well.
  • the alloy layer 20 may further include a third component containing at least one selected from the group consisting of cobalt (Co), phosphorus (P), manganese (Mn), and iron (Fe).
  • the bonding strength (peeling strength) between the alloy layer 20 and the organic layer 30 may be increased, and even when the carrier foil-attached metal foil is heat-treated at 200° C. or higher, the bonding strength (peeling strength) may be stably maintained.
  • the alloy layer 20 further includes a third component c
  • a ratio a:b:c of the first component a, the second component b, and the third component c may be a weight ratio of 30 to 60:25 to 50:1 to 40.
  • a thickness of such an alloy layer 20 may be 30 nm to 1 ⁇ m. As the thickness of the alloy layer 20 is within the above range, the required bonding strength (peeling strength) may be exhibited while the alloy layer 20 and the organic layer 30 are stably bonded.
  • the organic layer 30 included in the carrier foil-attached metal foil according to the present invention is a second release layer provided on the alloy layer 20 , and may serve to bond the alloy layer 20 and the metal layer 40 and prevent the component of the carrier foil 10 and the component of the alloy layer 20 from being diffused into the metal layer 40 .
  • the organic layer 30 may include a cyclic compound containing two or more nitrogen atoms.
  • the cyclic compound may be at least one selected from the group consisting of benzotriazole, mercapto benzimidazole, mercapto benzotriazole, sodium mercapto benzotriazole, 3-amino-5-mercapto-1,2,4-triazole, 3-mercapto-1,2,4-triazole, triazole-5-carboxylic acid, 1-methyl-3-mercapto-1,2,4-triazole, and 1-phenyl-5-mercapto tetrazole.
  • the cyclic compound included in the organic layer 30 may be sodium mercapto benzotriazole, mercapto benzotriazole, 3-amino-5-mercapto-1,2,4-triazole, 3-mercapto-1,2,4-triazole, 1-methyl-3-mercapto-1,2,4-triazole, or 1-phenyl-5-mercapto tetrazole to which a mercapto group (—SH) (high bonding strength with a nitrogen atom due to many unshared electron pairs) and 3 or more nitrogen atoms are bonded.
  • —SH mercapto group
  • the structure of the organic layer 30 may be stably maintained, thereby preventing the component of the carrier foil 10 or the component of the alloy layer 20 from being diffused and absorbed into the metal layer 40 .
  • a thickness of the organic layer 30 may be 1 to 50 nm. As the thickness of the organic layer 30 is within the above range, the required bonding strength (peeling strength) may be exhibited while the organic layer 30 and the metal layer 40 are stably bonded.
  • the metal layer 40 included in the carrier foil-attached metal foil according to the present invention may serve as a circuit layer by going through the process of forming a wiring pattern in a process of manufacturing a printed wiring board.
  • the metal layer 40 may be made of copper.
  • a thickness of the metal layer 40 may be 0.1 to 5 As the thickness of the metal layer 40 is within the above range, it is possible to implement a high-density ultra-fine wiring pattern while preventing micropores from being generated.
  • a bonding strength (peeling strength) S 1 between the carrier foil 10 and the alloy layer 20 and a bonding strength (peeling strength) S 2 between the alloy layer 20 and the organic layer 30 may be equal, which may be greater than a bonding strength (peeling strength) S 3 between the organic layer and the metal layer 40 (S 1 , S 2 >S 3 ).
  • the bonding strength (peeling strength) S 3 between the organic layer 30 and the metal layer 40 may be 2 to 20 gf/cm, and specifically 5 to 15 gf/cm.
  • the carrier foil-attached metal foil according to the present invention may further include a surface roughening layer 50 provided on the metal layer 40 .
  • the surface roughening layer 50 may serve to increase the bonding strength between the carrier foil-attached metal foil and the resin substrate when manufacturing a laminate by bonding the carrier foil-attached metal foil and the resin substrate.
  • the surface roughening layer 50 may include copper.
  • the surface roughening layer 50 may include a seed layer having a thickness of 0.5 to 1 ⁇ m and a cover layer having a thickness of 1.0 to 2.0 ⁇ m.
  • Such a surface roughening layer 50 may have an arithmetic mean roughness Ra of 0.2 to 0.3 ⁇ m, and a ten-point average roughness Rz of 1.5 to 2.5 ⁇ m. As the roughness of the surface roughening layer 50 is within the above range, the high bonding strength between the carrier foil-attached metal foil and the resin substrate may be exhibited.
  • the carrier foil-attached metal foil according to the present invention may further include a diffusion barrier layer (not illustrated) provided between the carrier foil 10 and the alloy layer 20 .
  • the diffusion barrier layer may include nickel and phosphorus.
  • the carrier foil-attached metal foil according to the present invention may further include an antioxidant layer (not illustrated) provided between the organic layer 30 and the metal layer 40 .
  • the antioxidant layer may include nickel and phosphorus.
  • the present invention provides a method of manufacturing a carrier foil-attached metal foil, which will be described in detail as follows.
  • a carrier foil is prepared. Specifically, a metal foil film made of copper or aluminum; or a polymer thin film made of polyethylene terephthalate (PET), polyphenylene sulfide (PPS), or Teflon may be prepared as a carrier foil.
  • PET polyethylene terephthalate
  • PPS polyphenylene sulfide
  • Teflon Teflon
  • the alloy layer is formed on the prepared carrier foil.
  • the alloy layer may be formed by electroplating or electroless plating.
  • a plating solution including a first component containing nickel (Ni) and a second component containing molybdenum (Mo) may be used.
  • a ratio a:b of a first component a and a second component b may be a weight ratio of 40 to 80:60 to 20.
  • the carrier foil, the alloy layer, and the organic layer may be well bonded to prevent the component of the carrier foil from being diffused into the metal layer.
  • the plating solution may further include a third component containing at least one selected from the group consisting of cobalt (Co), phosphorus (P), manganese (Mn), and iron (Fe).
  • a third component containing at least one selected from the group consisting of cobalt (Co), phosphorus (P), manganese (Mn), and iron (Fe).
  • the organic layer is formed by a coating method such as an immersion method, a showering method, or a spray method.
  • a coating solution including a cyclic compound containing two or more nitrogen atoms may be used.
  • the cyclic compound may be at least one selected from the group consisting of benzotriazole, mercapto benzimidazole, mercapto benzotriazole, sodium mercapto benzotriazole, 3-amino-5-mercapto-1,2,4-triazole, 3-mercapto-1,2,4-triazole, triazole-5-carboxylic acid, 1-methyl-3-mercapto-1,2,4-triazole, and 1-phenyl-5-mercapto tetrazole.
  • the cyclic compound may be sodium mercapto benzotriazole, mercapto benzotriazole, 3-amino-5-mercapto-1,2,4-triazole, 3-mercapto-1,2,4-triazole, 1-methyl-3-mercapto-1,2,4-triazole, or 1-phenyl-5-mercapto tetrazole, to which a mercapto group (—SH) (high bonding strength with a nitrogen atom due to many unshared electron pairs) and 3 or more nitrogen atoms are bonded.
  • —SH mercapto group
  • the content of this cyclic compound may be 0.1 to 2 parts by weight based on 100 parts by weight of the coating solution. As the content of the cyclic compound is within the above range, the amount of the cyclic compound adsorbed into the metal layer is optimized, thereby preventing an appearance from being deteriorated while increasing bonding strength (peeling strength).
  • the metal layer is formed by a plating method such as electroplating or electroless plating; or a deposition method such as chemical vapor deposition (CVC), physical chemical vapor deposition (PVC), or ion plating.
  • a plating method such as electroplating or electroless plating
  • a deposition method such as chemical vapor deposition (CVC), physical chemical vapor deposition (PVC), or ion plating.
  • the method of manufacturing a carrier foil-attached metal foil according to the present invention may further include forming a surface roughening layer on the metal layer.
  • the surface roughening layer may be formed by going through a process of primary electroplating (forming a seed layer) and secondary electroplating (forming a cover layer).
  • the primary electroplating may be performed using an electroplating solution containing 60 to 70 g/L of copper and 150 to 170 g/L of sulfuric acid under conditions of a temperature of 25° C. and a current density of 15 ASD.
  • the secondary electroplating may be performed using an electroplating solution containing 220 to 240 g/L of copper and 120 to 140 g/L of sulfuric acid under conditions of a temperature of 45° C. and a current density of 15 ASD.
  • the method of manufacturing a carrier foil-attached metal foil according to the present invention may further include forming a diffusion barrier layer between the carrier foil and the alloy layer.
  • the method of manufacturing a carrier foil-attached metal foil according to the present invention may further include forming an antioxidant layer between the organic layer 30 and the metal layer 40 .
  • the present invention provides a laminate including a carrier foil-attached metal foil and a resin substrate.
  • the carrier foil-attached metal foil included in the laminate according to the present invention may serve as a circuit layer on which a wiring pattern is formed.
  • the description of this carrier foil-attached metal foil is the same as described above, and therefore, will be omitted.
  • the resin substrate included in the laminate according to the present invention serves as an insulating layer.
  • the resin substrate is commonly known and may have a structure in which inorganic or organic fibers are impregnated with resin.
  • the resin may be at least one selected from the group consisting of naphthalene-based epoxy resins, bisphenol A-type epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, rubber-modified epoxy resins, phosphorus-based epoxy resins, and bisphenol F-type epoxy resins.
  • the laminate according to the present invention is a laminate for forming a printed circuit board, and as the laminate includes the above-described carrier foil-attached metal foil, a defect rate is minimized, so the laminate may be used as a laminate for forming a printed circuit board with excellent reliability.
  • a carrier foil formed of a copper foil having a thickness of 18 ⁇ m was immersed in 5 wt % of sulfuric acid, pickled, and then washed with pure water.
  • the electroplating was performed at 5 A/dm 2 for 30 seconds while maintaining pH 10 or higher.
  • the carrier foil on which the alloy layer is formed was washed, and then, was immersed for 30 seconds in a coating solution of 30° C. which contains 1 part by weight of sodium mercapto benzotriazole and 99 parts by weight of pure water to form an organic layer having a thickness of 1 to 10 nm on the alloy layer.
  • the carrier foil on which the alloy layer and the organic layer were formed was washed, and then, electroplated to form a metal layer (electrolytic copper layer) having a thickness of 2 ⁇ m to manufacture the carrier foil-attached metal foil.
  • a copper sulfate solution of 23° C. having a copper concentration of 150 g/L and a free sulfuric acid concentration of 100 g/L was used for the electroplating, and a current density was 5 A/dm 2 .
  • a carrier foil-attached metal foil was manufactured in the same process as in Example 1, except that benzotriazole was used instead of sodium mercapto benzotriazole when forming an organic layer.
  • a carrier foil-attached metal foil was manufactured in the same process as in Example 1, except that mercapto benzimidazol was used instead of sodium mercapto benzotriazole when forming an organic layer.
  • a carrier foil-attached metal foil was manufactured in the same process as in Example 1, except that an alloy layer was formed by adjusting a plating solution composition so that a ratio of nickel:molybdenum was a weight ratio of 80:20.
  • a carrier foil-attached metal foil was manufactured in the same process as in Example 1, except that an alloy layer was formed by adjusting a plating solution composition so that a ratio of nickel:molybdenum was a weight ratio of 40:60.
  • a carrier foil-attached metal foil was manufactured in the same process as in Example 1, except that an organic layer was not formed.
  • a carrier foil-attached metal foil was manufactured in the same process as in Example 1, except that an alloy layer was formed by adjusting a plating solution composition so that a ratio of nickel:molybdenum was a weight ratio of 85:15.
  • a carrier foil-attached metal foil was manufactured in the same process as in Example 1, except that an alloy layer was formed by adjusting a plating solution composition so that a ratio of nickel:molybdenum was a weight ratio of 35:65.
  • the ratio of nickel:molybdenum was a weight ratio of 35:65
  • the electroplating was not performed well, so the alloy layer was not properly formed.
  • the bonding strength between the subsequently formed organic layer and the metal layer was low, making it difficult to use as the carrier foil-attached metal foil.
  • a laminate was manufactured by forming a resin substrate (Doosan Electronics prepreg (DS-7409HG)) laminated on the carrier foil-attached metal foil manufactured in Examples 1 to 9 and Comparative Examples 1 to 5 and then pressing the resin substrate at a pressure of 220 MPa at 220° C. for 100 minutes.
  • a resin substrate Doosan Electronics prepreg (DS-7409HG)
  • the peeling strength (gf/cm) of the carrier foil-attached metal foil manufactured in Examples 1 to 9 and Comparative Examples 1 to 5 and the laminate manufactured in Manufacturing Examples 1 to 9 and Comparative Manufacturing Examples 1 to 5 was measured by IPC-TM-650 standard (using a plate-shaped test piece having width of 10 mm ⁇ length of 10 cm), and the results were shown in Table 1 below.
  • the peeling strength means the peeling strength between the metal layer and the structure in which the organic layer/alloy layer/carrier foil are bonded.
  • the carrier foil-attached metal foil (Examples 1 to 9) of Manufacturing Examples 1 to 9 according to the present invention maintained the bonding with the carrier foil due to the alloy layer and organic layer, and then, was peeled well, but it was confirmed that the carrier foil-attached metal foil of Comparative Manufacturing Examples 1 to 4 was not peeled. In addition, it was confirmed that the carrier foil-attached metal foil of Comparative Manufacturing Example 5 was pressed and then not easily peeled due to high peeling strength.
  • the component of the alloy layer (nickel) does not remain (nickel residue 0%) on the surface of the metal layer after peeling, but in the carrier foil-attached metal foil of Comparative Example 1, it was confirmed that a large amount of the component of the alloy layer (nickel) remains on the surface of the metal layer after peeling (nickel residue 5.08%).

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US17/779,955 2019-11-27 2020-10-15 Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same Pending US20230020180A1 (en)

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Families Citing this family (1)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100282500A1 (en) * 2007-12-28 2010-11-11 Iljin Copper Foil Co., Ltd. Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
EP2336395A1 (en) * 2008-09-05 2011-06-22 Furukawa Electric Co., Ltd. Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
WO2015170715A1 (ja) * 2014-05-07 2015-11-12 三井金属鉱業株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、キャリア付銅箔を用いて得られる銅張積層板及びプリント配線板
JP2018192775A (ja) * 2017-05-22 2018-12-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法、及び、電子機器の製造方法
US20190364664A1 (en) * 2017-01-16 2019-11-28 Iljin Materials Co., Ltd. Carrier-foil-attached ultra-thin copper foil

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770976B2 (en) * 2002-02-13 2004-08-03 Nikko Materials Usa, Inc. Process for manufacturing copper foil on a metal carrier substrate
CN1984527B (zh) * 2005-12-15 2010-12-01 古河电气工业株式会社 带载体的极薄铜箔及印刷电路基板
KR101436360B1 (ko) 2012-05-25 2014-09-01 일진머티리얼즈 주식회사 표면처리동박, 상기 동박을 포함하는 프린트배선판용 동부착적층판, 상기 프린트배선판의 제조방법, 및 상기 표면처리동박의 제조방법
WO2014132947A1 (ja) * 2013-02-26 2014-09-04 古河電気工業株式会社 キャリア付き極薄銅箔、銅張積層板並びにコアレス基板
JP6310192B2 (ja) * 2013-07-02 2018-04-11 Ｊｘ金属株式会社 キャリア付銅箔及びその製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
JP5503789B2 (ja) * 2013-08-30 2014-05-28 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP5521099B1 (ja) * 2013-09-02 2014-06-11 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板、及びプリント配線板の製造方法
WO2015080052A1 (ja) * 2013-11-27 2015-06-04 三井金属鉱業株式会社 キャリア箔付銅箔及び銅張積層板
TWI592066B (zh) * 2014-04-02 2017-07-11 Mitsui Mining & Smelting Co Carrier copper foil, method for producing the carrier copper foil, copper-clad laminate obtained by using the carrier copper foil, and printed circuit board
JP6557493B2 (ja) * 2015-03-30 2019-08-07 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器、キャリア付銅箔の製造方法及びプリント配線板の製造方法
JP6058182B1 (ja) * 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2017149811A1 (ja) * 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔、並びに配線層付コアレス支持体及びプリント配線板の製造方法
KR102137068B1 (ko) * 2019-11-27 2020-07-23 와이엠티 주식회사 캐리어박 부착 금속박, 이의 제조방법 및 이를 포함하는 적층체

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100282500A1 (en) * 2007-12-28 2010-11-11 Iljin Copper Foil Co., Ltd. Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
EP2336395A1 (en) * 2008-09-05 2011-06-22 Furukawa Electric Co., Ltd. Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
WO2015170715A1 (ja) * 2014-05-07 2015-11-12 三井金属鉱業株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、キャリア付銅箔を用いて得られる銅張積層板及びプリント配線板
US20190364664A1 (en) * 2017-01-16 2019-11-28 Iljin Materials Co., Ltd. Carrier-foil-attached ultra-thin copper foil
JP2018192775A (ja) * 2017-05-22 2018-12-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法、及び、電子機器の製造方法

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CN115023514A (zh) 2022-09-06
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