US20220259743A1 - Plating bath for the electroless plating of a substrate - Google Patents

Plating bath for the electroless plating of a substrate Download PDF

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Publication number
US20220259743A1
US20220259743A1 US17/611,429 US202017611429A US2022259743A1 US 20220259743 A1 US20220259743 A1 US 20220259743A1 US 202017611429 A US202017611429 A US 202017611429A US 2022259743 A1 US2022259743 A1 US 2022259743A1
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Prior art keywords
plating bath
ion source
plating
substrate
nickel
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US17/611,429
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English (en)
Inventor
Anshuma Pathak
Thorsten Teutsch
Georg Friedrich
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Pac Tech Packaging Technologies GmbH
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Pac Tech Packaging Technologies GmbH
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Assigned to PAC TECH - PACKAGING TECHNOLOGIES GMBH reassignment PAC TECH - PACKAGING TECHNOLOGIES GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FRIEDRICH, GEORG, TEUTSCH, THORSTEN, PATHAK, Anshuma
Publication of US20220259743A1 publication Critical patent/US20220259743A1/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Definitions

  • the present disclosure relates to a plating bath for electroless plating of a substrate, in particular a copper or aluminum substrate, with nickel, the plating bath comprising a nickel ion source.
  • Plating baths for electroless plating with nickel are known from the state of the art. Plating baths of this kind provide an alternative to galvanic metal deposition.
  • galvanic metal deposition the injection of an electric current or an electric voltage into a substrate to be plated drives the deposition of the metal dissolved in a plating electrolyte.
  • Electroless/chemical plating can be classified into two subgroups:
  • nickel is to be layered onto the copper in an electroless manner.
  • the electroless application of nickel on copper is often used in printed circuits in order to form a diffusion barrier for a subsequently applied gold layer.
  • electroless nickel plating baths which generally consist of aqueous solutions containing a source of nickel ions, a reducing agent for the nickel, and a complexing agent in order to be able to operate in predefined ranges of the pH.
  • the most commonly used baths of this kind use hypophosphite reducing agents. With these baths, phosphor and nickel are jointly deposited on the surface to be plated.
  • the mentioned nickel plating baths pose the problem of very low process stability and difficult and complex process control.
  • the very low bath stability of the bath containing the electrolyte which is due to the autocatalytic process, can be considered to be one problem of this process.
  • these plating baths are very sensitive to contamination.
  • the decomposition of the bath due to active hydrogen, which is formed during the reduction reaction, is another problematic issue of these electroless nickel plating baths.
  • the mentioned problems have the result that the lifetime and the bath operating time are limited to few days and that tool cleaning processes which are very intricate in terms of safety are necessary at the end of a bath operating cycle.
  • stabilizing agents which are supposed to prevent decomposition and contamination of the plating bath are known from the state of the art.
  • thiourea compounds, thiocyanate compounds, and Pb 2+ and Bi 2+ ion sources are stabilizing agents known from the art.
  • said stabilizing agents have the disadvantage that they are highly toxic, which makes them undesirable for environmental reasons, as well.
  • the heavy metal salts mentioned above have been found to also tend to accumulate on a substrate to be plated. This is caused by the reduction process taking place during the plating. If these metal ions are deposited on a substrate in the course of the process, bath decomposition processes occur again, namely when the concentration of these metal ions in the plating bath drops.
  • thiourea compounds mentioned above are also disadvantageous. For instance, these compounds can only be used in very low concentrations (in the range of 1 ppm) since they act as what is referred to as catalytic poisons in the plating bath and can lead to a decomposition of the plating bath if their concentrations are too high. Lead salts on the other hand lead to a deterioration of the Ni deposition rate at such concentrations, for example, which leads to a low-crystalline, fine-grain consistency of the applied layer.
  • the object of the present disclosure is to provide a plating bath of the kind mentioned above that overcomes the disadvantages of the plating baths from the state of the art.
  • the object of the present disclosure is to provide a plating bath for electroless plating of a substrate that remains stable as long as possible.
  • a plating bath of the kind mentioned above that comprises a stabilizing system comprising an iodate ion source and a heavy metal ion source.
  • the plating bath according to the disclosure is an aqueous solution. Iron salts, tin salts and cadmium salts are possible heavy metal ion sources, for example.
  • the heavy metal ion source is a copper salt, such as copper sulfate (CuSO 4 or CuSO 4 .5H 2 O).
  • the plating bath according to the disclosure which contains the stabilizing system mentioned above, does not exhibit a decrease in the deposition rate of nickel on a substrate.
  • a surface quality examination of the nickel plating which was carried out using an optical microscope and SEM, did not reveal any differences from conventional nickel platings, either.
  • the tank containing the plating bath according to the disclosure does not show any visible residue or contamination on the tank wall after one month.
  • the iodate ion source is potassium iodate.
  • a combination of copper sulfate and potassium iodate has proven to be of particularly advantageous use as a stabilizing system for a plating bath for depositing nickel.
  • the plating bath according to the disclosure generally comprises at least one reducing agent, in particular sodium hypophosphite and/or DMAB (dimethylaminoborane), and preferably at least one complexing agent and at least one pH adjuster.
  • at least one reducing agent in particular sodium hypophosphite and/or DMAB (dimethylaminoborane)
  • DMAB dimethylaminoborane
  • the nickel ion source is generally nickel sulfate.
  • the iodate ion source in particular potassium iodate, has a concentration of approx. 100 ⁇ l of a 0.05 molar solution/l to approx. 400 ⁇ l of a 0.05 molar solution/l, preferably approx. 200 ⁇ l of a 0.05 molar solution/l
  • the heavy metal ion source in particular CuSO 4 .5H 2 O, has a concentration of approx. 20 ⁇ l of a 0.1 molar solution/l to approx. 80 ⁇ l of a 0.1 molar solution/l, preferably approx. 40 ⁇ l of a 0.1 molar solution/l.
  • concentration ranges render an ideal stabilization effect without affecting the plating process. It has further been found that a negative effect on the plating process and decomposition tendencies of the plating bath can be observed at a concentration of more than 400 ⁇ l of a 0.05 molar solution/1 and 80 ⁇ l of a 0.1 molar solution/l, respectively.
  • An ideal concentration of the iodate ion source is approx. 200 ⁇ l of a 0.05 molar solution/l.
  • concentration of the heavy metal ion source is approx. 40 ⁇ l of a 0.1 molar solution/l.
  • the plating bath according to the disclosure has a pH of approx. 3 to 5, preferably 4.4 and a temperature of approx. 80 to 90° C., preferably 85° C. These conditions have proven particularly advantageous in the plating process.
  • the present disclosure further relates to the use of an iodate ion source and a heavy metal ion source, in particular a copper ion source, for stabilizing a nickel plating bath.
  • the present disclosure further relates to a method for depositing nickel on a substrate, the method comprising the following steps:
  • the copper surface In order to deposit nickel on, for example, a copper surface from the plating bath in an electroless manner, the copper surface has to be activated first. To this end, the copper surface is contaminated with an agent having a catalytic effect for the deposition. In the case at hand, this takes places by means of palladium, in particular palladium seeds.
  • each of the process steps mentioned above is followed by a rinsing of the substrate with distilled water.
  • a drying step is generally carried out at the end.
  • the surface of the copper substrate is cleaned and subjected to micro-etching. This step is generally carried out using diluted sulfuric acid.
  • the polished copper surface is then activated for a subsequent plating step using palladium seeds, which produces a catalytic surface. Then, the activated substrate is introduced into the plating bath.
  • An example of a plating bath according to the disclosure has the following parameters:
  • the nickel plating process on a copper substrate described here is an autocatalytic process which does not involve an exchange reaction.
  • Ni 2+ ions are reduced to elementary nickel by a reducing agent (sodium hypophosphite in this case), the elementary nickel precipitating on the activated copper surface.
  • a reducing agent sodium hypophosphite in this case
  • phosphor is co-deposited in the nickel layer. In the case at hand, this takes place through catalytic partial reactions in the system.
  • a hydrolysis of the reducing agent, sodium hypophosphite leads to a production of active hydrogen in an atomic state. This is reflected in chemical equation (i) below.
  • the active hydrogen produced in this reaction is most likely primarily responsible for a decomposition of the plating bath and thus for a negative impact on the bath stability.
  • the plating bath according to the disclosure which contains the stabilizing system, does not exhibit a lower deposition rate of nickel on copper substrates than a comparable plating bath without said stabilizing system.
  • a comparative test was carried out, in which the nickel deposition rate was run with a plating bath according to the disclosure and with a plating bath without a stabilizing system. The results are illustrated in FIG. 1 . Samples were run on a small scale (bath volume 1.61) and on a large scale (bath volume 1001). Both copper test chips and copper wafers having different test structures and sizes were used for this evaluation.
  • FIG. 1 shows: deposition rate of a Ni—P layer on copper surfaces using a plating bath with and without a stabilizing system. A deposition time of 15 minutes was selected for each sample.
  • the stabilization components (copper ions and iodate ions) act as a catalytic poison.
  • a certain concentration must not be exceeded since an excess of a certain concentration causes a deterioration of the plating process.
  • an average concentration of lead salts or thiourea not having a negative effect on the plating process is very low (approx. 1 ppm).
  • the concentration of the components of the stabilizing system can be significantly higher.
  • the surface topographies of the platings were examined using an optical microscope and a scanning electron microscope. No significant differences of the surface qualities of the Ni—P layers deposited using a plating bath with and without a stabilizing system were observed. The platings have a homogenous appearance in both cases. Physical and chemical properties of the electroless nickel platings vary depending on the phosphor content in the deposited layer. An EDX analysis showed that the phosphor content in the Ni—P plating is in the range of 6% to 7%. This range is known to provide good solderability and corrosion resistance if gold is applied to the plating. The corrosion resistance is known to increase with an increasing phosphor content in the plating.
  • FIG. 2 shows: FIB cross sections of copper pads plated with nickel in an electroless manner, copper sulfate and potassium iodate having been used as a stabilizing system for one pad (illustration on the right) and no stabilizing agent having been used for the comparative pad (illustration on the left).
  • the bath compositions were identical except for the stabilizing components (copper sulfate and potassium iodate). The photos show that the structural morphology of the two samples is nearly identical.
  • the two copper pads showed no significant differences in the two interfaces of the platings to the copper substrate. Moreover, it is to be noted that an increase in gloss and smoothness of the layer would have to be expected in the event of a co-deposition of copper on the pad to be plated. However, such effects are not found in the case at hand, which means that a co-deposition of copper can be virtually excluded.
  • the stability of the plating baths was examined by intentionally compromising the plating baths with a PdCl 2 solution (titration method).
  • a certain amount of PdCl 2 solution (1 ml of a 50 mg/l solution) was admixed to the plating baths during a period of 60 seconds, and the added amount was monitored throughout said period.
  • Table 2 shows the amount of titration solution required in order to decompose the plating bath in the presence of a stabilizing system (bath no. 2) and in the absence of a stabilizing system (bath no. 1).
  • a combination of copper sulfate and potassium iodate was used as the stabilizing system.
  • Baths of a volume of 1.6 liters were used. As shown in Table 2, bath no. 2 requires four times the amount of PdCl 2 in order to decompose the bath.
  • a plating bath according to the disclosure was left in a bath tank for approx. 1 month.
  • a visual inspection of the tank revealed that no contaminations or deposits are deposited on the tank interior or on the bottom of the tank.
  • the same observations could be made on smaller scales (e.g., in a beaker).
  • bath samples were collected after the plating process. Thereafter, the bath tank was emptied and filled with water. Thereafter, the water was removed from the tank and what is referred to as a stripping process was performed using nitric acid. Thereafter, the nitric acid was removed from the tank, whereupon the latter was again filled with water in order to determine possible residue of stabilizers.
  • An ICP elementary analysis of the collected bath samples revealed that no contaminating residue resulting from the components of the stabilizing system was present in the bath samples.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
US17/611,429 2019-05-16 2020-04-16 Plating bath for the electroless plating of a substrate Pending US20220259743A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019112883.8A DE102019112883B4 (de) 2019-05-16 2019-05-16 Beschichtungsbad zur stromlosen Beschichtung eines Substrats
DE102019112883.8 2019-05-16
PCT/EP2020/060664 WO2020229082A1 (de) 2019-05-16 2020-04-16 Beschichtungsbad zur stromlosen beschichtung eines substrats

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DE (1) DE102019112883B4 (de)
WO (1) WO2020229082A1 (de)

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Publication number Priority date Publication date Assignee Title
CN113026005B (zh) * 2021-03-04 2022-02-01 珠海市创智成功科技有限公司 一种应用在柔性线路板化学镀镍钯金镀层的化学镀溶液及工艺

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US5886409A (en) * 1996-01-16 1999-03-23 Hitachi, Ltd. Electrode structure of wiring substrate of semiconductor device having expanded pitch
US20100136244A1 (en) * 2008-12-03 2010-06-03 C. Uyemura & Co., Ltd. Electroless nickel plating bath and method for electroless nickel plating
US20150110965A1 (en) * 2012-06-04 2015-04-23 Atotech Deutschland Gmbh Plating bath for electroless deposition of nickel layers
CN106399982A (zh) * 2016-08-31 2017-02-15 潍坊歌尔精密制造有限公司 一种陶瓷表面导体线路的制作方法
CN106756904A (zh) * 2016-12-16 2017-05-31 贵阳华科电镀有限公司 一种高磷化学镀镍液
US20170335462A1 (en) * 2014-11-26 2017-11-23 Atotech Deutschland Gmbh Plating bath and method for electroless deposition of nickel layers
US20190301038A1 (en) * 2018-03-30 2019-10-03 Toyoda Gosei Co., Ltd. Electroplating bath, method for manufacturing plated product, and plated product

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US1448831A (en) * 1923-03-20 Guide foe
US5886409A (en) * 1996-01-16 1999-03-23 Hitachi, Ltd. Electrode structure of wiring substrate of semiconductor device having expanded pitch
US20100136244A1 (en) * 2008-12-03 2010-06-03 C. Uyemura & Co., Ltd. Electroless nickel plating bath and method for electroless nickel plating
US20150110965A1 (en) * 2012-06-04 2015-04-23 Atotech Deutschland Gmbh Plating bath for electroless deposition of nickel layers
US20170335462A1 (en) * 2014-11-26 2017-11-23 Atotech Deutschland Gmbh Plating bath and method for electroless deposition of nickel layers
CN106399982A (zh) * 2016-08-31 2017-02-15 潍坊歌尔精密制造有限公司 一种陶瓷表面导体线路的制作方法
CN106756904A (zh) * 2016-12-16 2017-05-31 贵阳华科电镀有限公司 一种高磷化学镀镍液
US20190301038A1 (en) * 2018-03-30 2019-10-03 Toyoda Gosei Co., Ltd. Electroplating bath, method for manufacturing plated product, and plated product

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DE102019112883A1 (de) 2020-11-19
DE102019112883B4 (de) 2024-05-16
WO2020229082A1 (de) 2020-11-19

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