US20220040802A1 - Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board - Google Patents
Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board Download PDFInfo
- Publication number
- US20220040802A1 US20220040802A1 US17/417,205 US202017417205A US2022040802A1 US 20220040802 A1 US20220040802 A1 US 20220040802A1 US 202017417205 A US202017417205 A US 202017417205A US 2022040802 A1 US2022040802 A1 US 2022040802A1
- Authority
- US
- United States
- Prior art keywords
- soldering
- soldering alloy
- alloy
- solder
- solder joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 223
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 203
- 239000000956 alloy Substances 0.000 title claims abstract description 203
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 105
- 230000004907 flux Effects 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 title claims abstract description 12
- 229920005989 resin Polymers 0.000 title claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 238000002844 melting Methods 0.000 claims description 55
- 230000008018 melting Effects 0.000 claims description 55
- 229910052738 indium Inorganic materials 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 229910052797 bismuth Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 13
- 239000010410 layer Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 230000008520 organization Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 229910018956 Sn—In Inorganic materials 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 229910006640 β-Sn Inorganic materials 0.000 description 2
- 229910006632 β—Sn Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019098427A JP6708942B1 (ja) | 2019-05-27 | 2019-05-27 | はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板 |
| JP2019-098427 | 2019-05-27 | ||
| PCT/JP2020/018837 WO2020241225A1 (ja) | 2019-05-27 | 2020-05-11 | はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2020/018837 A-371-Of-International WO2020241225A1 (ja) | 2019-05-27 | 2020-05-11 | はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US18/126,695 Continuation US20230226648A1 (en) | 2019-05-27 | 2023-03-27 | Method for step-soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20220040802A1 true US20220040802A1 (en) | 2022-02-10 |
Family
ID=70976379
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US17/417,205 Abandoned US20220040802A1 (en) | 2019-05-27 | 2020-05-11 | Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board |
| US18/126,695 Pending US20230226648A1 (en) | 2019-05-27 | 2023-03-27 | Method for step-soldering |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US18/126,695 Pending US20230226648A1 (en) | 2019-05-27 | 2023-03-27 | Method for step-soldering |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US20220040802A1 (da) |
| EP (1) | EP3888840A4 (da) |
| JP (1) | JP6708942B1 (da) |
| KR (1) | KR102342394B1 (da) |
| CN (1) | CN113677477B (da) |
| BR (1) | BR112021012348B1 (da) |
| MX (1) | MX2021007954A (da) |
| MY (1) | MY195069A (da) |
| SG (1) | SG11202107118QA (da) |
| TW (1) | TWI744907B (da) |
| WO (1) | WO2020241225A1 (da) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112621020B (zh) * | 2020-12-25 | 2022-06-21 | 中机智能装备创新研究院(宁波)有限公司 | 一种镍基药芯钎料、制备方法及应用 |
| CN113996967B (zh) * | 2021-08-19 | 2023-04-28 | 苏州优诺电子材料科技有限公司 | 一种中温熔点合金及其应用 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5256370B1 (en) * | 1992-05-04 | 1996-09-03 | Indium Corp America | Lead-free alloy containing tin silver and indium |
| JP2002096191A (ja) * | 2000-09-18 | 2002-04-02 | Matsushita Electric Ind Co Ltd | はんだ材料およびこれを利用する電気・電子機器 |
| ATE471224T1 (de) * | 2001-03-01 | 2010-07-15 | Senju Metal Industry Co | Bleifreie lötpaste |
| JP2004188453A (ja) * | 2002-12-11 | 2004-07-08 | Harima Chem Inc | Ｓｎ系はんだ合金 |
| JP5696173B2 (ja) | 2005-08-12 | 2015-04-08 | アンタヤ・テクノロジーズ・コープ | はんだ組成物 |
| JP4618089B2 (ja) * | 2005-10-12 | 2011-01-26 | 千住金属工業株式会社 | Ｓｎ−Ｉｎ系はんだ合金 |
| EP2131450B1 (en) * | 2007-03-12 | 2013-08-07 | Senju Metal Industry Co., Ltd | Anisotropic electroconductive material |
| CN101801589B (zh) * | 2007-07-18 | 2013-05-15 | 千住金属工业株式会社 | 车载电子电路用In掺入无铅焊料 |
| CN102017111B (zh) * | 2008-03-05 | 2013-01-16 | 千住金属工业株式会社 | 无铅焊料连接构造体和焊料球 |
| KR101773733B1 (ko) * | 2011-02-25 | 2017-08-31 | 센주긴조쿠고교 가부시키가이샤 | 파워 디바이스용의 땜납 합금과 고전류 밀도의 땜납 조인트 |
| JP5590272B1 (ja) * | 2012-12-18 | 2014-09-17 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| CN103341699A (zh) * | 2013-07-04 | 2013-10-09 | 浙江亚通焊材有限公司 | 一种取代锡铅钎料的Sn-In-Ag无铅钎料 |
| KR101551613B1 (ko) * | 2014-06-24 | 2015-09-08 | 하리마카세이 가부시기가이샤 | 땜납 합금, 땜납 조성물, 솔더 페이스트 및 전자 회로 기판 |
| KR101985646B1 (ko) * | 2014-07-21 | 2019-06-04 | 알파 어셈블리 솔루션스 인크. | 솔더링용 저온 고신뢰성 주석 합금 |
| TWI764632B (zh) * | 2015-05-05 | 2022-05-11 | 美商銦業公司 | 用於嚴苛環境之電子應用的高可靠度無鉛焊料合金 |
| CN105665956A (zh) * | 2016-03-23 | 2016-06-15 | 徐宏达 | 一种用于钎焊铝及其合金的软钎料合金 |
| CN107877031A (zh) * | 2017-11-27 | 2018-04-06 | 东莞市千岛金属锡品有限公司 | 一种无铅低温焊料及其制备方法 |
| CN108971793B (zh) * | 2018-08-24 | 2021-04-23 | 云南科威液态金属谷研发有限公司 | 一种低温无铅焊料 |
| US10833050B1 (en) * | 2019-05-22 | 2020-11-10 | Lenovo (Singapore) Pte. Ltd. | Interposer, electronic substrate, and method for producing electronic substrate |
-
2019
- 2019-05-27 JP JP2019098427A patent/JP6708942B1/ja active Active
-
2020
- 2020-05-11 SG SG11202107118QA patent/SG11202107118QA/en unknown
- 2020-05-11 MY MYPI2021003719A patent/MY195069A/en unknown
- 2020-05-11 BR BR112021012348-2A patent/BR112021012348B1/pt active IP Right Grant
- 2020-05-11 EP EP20815157.1A patent/EP3888840A4/en active Pending
- 2020-05-11 WO PCT/JP2020/018837 patent/WO2020241225A1/ja unknown
- 2020-05-11 KR KR1020217019763A patent/KR102342394B1/ko active IP Right Grant
- 2020-05-11 CN CN202080027863.1A patent/CN113677477B/zh active Active
- 2020-05-11 MX MX2021007954A patent/MX2021007954A/es unknown
- 2020-05-11 US US17/417,205 patent/US20220040802A1/en not_active Abandoned
- 2020-05-21 TW TW109116943A patent/TWI744907B/zh active
-
2023
- 2023-03-27 US US18/126,695 patent/US20230226648A1/en active Pending
Non-Patent Citations (1)
| Title |
|---|
| Partial Translation of JP 2007-105750 A. (Year: 2007) * |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202104607A (zh) | 2021-02-01 |
| KR20210083367A (ko) | 2021-07-06 |
| TWI744907B (zh) | 2021-11-01 |
| CN113677477A (zh) | 2021-11-19 |
| BR112021012348B1 (pt) | 2022-05-03 |
| BR112021012348A2 (da) | 2021-11-16 |
| JP2020192552A (ja) | 2020-12-03 |
| WO2020241225A1 (ja) | 2020-12-03 |
| EP3888840A4 (en) | 2022-09-21 |
| JP6708942B1 (ja) | 2020-06-10 |
| MX2021007954A (es) | 2022-06-28 |
| KR102342394B1 (ko) | 2021-12-22 |
| MY195069A (en) | 2023-01-06 |
| CN113677477B (zh) | 2022-10-14 |
| SG11202107118QA (en) | 2021-07-29 |
| US20230226648A1 (en) | 2023-07-20 |
| EP3888840A1 (en) | 2021-10-06 |
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