US20210083057A1 - Semiconductor device, manufacturing method thereof, and semiconductor storage device - Google Patents
Semiconductor device, manufacturing method thereof, and semiconductor storage device Download PDFInfo
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- US20210083057A1 US20210083057A1 US16/817,814 US202016817814A US2021083057A1 US 20210083057 A1 US20210083057 A1 US 20210083057A1 US 202016817814 A US202016817814 A US 202016817814A US 2021083057 A1 US2021083057 A1 US 2021083057A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000003860 storage Methods 0.000 title claims description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 74
- 239000002184 metal Substances 0.000 claims abstract description 74
- 239000001301 oxygen Substances 0.000 claims abstract description 44
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 44
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 43
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 17
- 239000010937 tungsten Substances 0.000 claims abstract description 16
- 239000011651 chromium Substances 0.000 claims abstract description 13
- 239000010955 niobium Substances 0.000 claims abstract description 13
- 239000010936 titanium Substances 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 7
- 239000011733 molybdenum Substances 0.000 claims abstract description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000007789 gas Substances 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 239000012159 carrier gas Substances 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 230000008022 sublimation Effects 0.000 claims description 5
- 238000000859 sublimation Methods 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 4
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- 239000001569 carbon dioxide Substances 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
- 229910001882 dioxygen Inorganic materials 0.000 claims description 2
- 239000001272 nitrous oxide Substances 0.000 claims description 2
- 150000003658 tungsten compounds Chemical class 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 33
- 125000004429 atom Chemical group 0.000 description 27
- 125000004430 oxygen atom Chemical group O* 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 4
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 4
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 4
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 4
- 238000010587 phase diagram Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 229910001930 tungsten oxide Inorganic materials 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 3
- RJNBTFHJYBHWCU-UHFFFAOYSA-L Cl[W](Cl)(=O)=O Chemical compound Cl[W](Cl)(=O)=O RJNBTFHJYBHWCU-UHFFFAOYSA-L 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910008940 W(CO)6 Inorganic materials 0.000 description 2
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 2
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910017333 Mo(CO)6 Inorganic materials 0.000 description 1
- 229910015686 MoOCl4 Inorganic materials 0.000 description 1
- 229910019651 Nb(OC2H5)5 Inorganic materials 0.000 description 1
- 229910004481 Ta2O3 Inorganic materials 0.000 description 1
- 229910003091 WCl6 Inorganic materials 0.000 description 1
- 229910009035 WF6 Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- ASLHVQCNFUOEEN-UHFFFAOYSA-N dioxomolybdenum;dihydrochloride Chemical compound Cl.Cl.O=[Mo]=O ASLHVQCNFUOEEN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- -1 is used Chemical compound 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005078 molybdenum compound Substances 0.000 description 1
- 150000002752 molybdenum compounds Chemical class 0.000 description 1
- 150000002822 niobium compounds Chemical class 0.000 description 1
- SFPKXFFNQYDGAH-UHFFFAOYSA-N oxomolybdenum;tetrahydrochloride Chemical compound Cl.Cl.Cl.Cl.[Mo]=O SFPKXFFNQYDGAH-UHFFFAOYSA-N 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003482 tantalum compounds Chemical class 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 1
- WIDQNNDDTXUPAN-UHFFFAOYSA-I tungsten(v) chloride Chemical compound Cl[W](Cl)(Cl)(Cl)Cl WIDQNNDDTXUPAN-UHFFFAOYSA-I 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28079—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a single metal, e.g. Ta, W, Mo, Al
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/40—EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
Definitions
- Embodiments of the present invention relate to a semiconductor device, a manufacturing method thereof, and a semiconductor storage device.
- FIG. 1 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a first embodiment
- FIG. 2 is an explanatory diagram of a manufacturing method of the semiconductor device according to the first embodiment
- FIG. 3A is a diagram schematically illustrating a state of an interface between an oxide film and a conductive film
- FIG. 3B is a diagram schematically illustrating a state of the interface between an oxide film and a conductive film
- FIG. 4 is an example of a phase diagram of tungsten element and oxygen element
- FIG. 5 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a second embodiment.
- FIG. 6 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a third embodiment.
- a semiconductor device comprises: an oxide film containing first element; and a conductive film provided to be in contact with the oxide film, containing metal element and oxygen atoms, and having conductivity.
- a volume density of the oxygen element in the conductive film is less than 2.38 ⁇ 10 22 atoms/cm 3 when the metal element is tungsten (W), less than 4.27 ⁇ 10 22 atoms/cm 3 when the metal element is molybdenum (Mo), less than 2.28 ⁇ 10 22 atoms/cm 3 when the metal element is titanium (Ti), less than 5.00 ⁇ 10 22 atoms/cm 3 when the metal element is chromium (Cr), less than 4.23 ⁇ 10 22 atoms/cm 3 when the metal element is vanadium (V), less than 4.84 ⁇ 10 22 atoms/cm 3 when the metal element is iron (Fe), less than 2.82 ⁇ 10 22 atoms/cm 3 when the metal element is copper (Cu), less than 3.32 ⁇ 10 22 atoms/cm 3 when the metal element
- FIG. 1 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a first embodiment.
- the semiconductor device 1 according to the present embodiment includes a substrate 10 , an oxide film 20 , and a conductive film 30 .
- the substrate 10 is a silicon substrate, for example.
- the oxide film 20 is formed on the substrate 10 .
- the oxide film 20 contains silicon oxide (SiO 2 ) or aluminum oxide (Al 2 O 3 ), for example.
- the conductive film 30 is formed on the oxide film 20 .
- the conductive film 30 contains metal element and oxygen element.
- the metal element is, for example, tungsten (W), titanium (Ti), molybdenum (Mo), chromium (Cr), vanadium (V), iron (Fe), copper (Cu), tantalum (Ta), or niobium (Nb).
- the conductive film 30 has conductivity and has an electrical resistivity (a resistivity) of 1.0 ⁇ 10 6 ⁇ /cm or less, for example.
- a manufacturing method of the semiconductor device 1 according to the present embodiment is described below. Manufacturing steps of the conductive film 30 are described here.
- the substrate 10 is accommodated in a chamber 101 while being fixed on a stage 100 .
- the oxide film 20 has already been formed on the substrate 10 .
- the oxide film 20 is a silicon oxide film in the present embodiment.
- the conductive film 30 is formed on the oxide film 20 by CVD (Chemical Vapor Deposition). Specifically, a material gas 201 containing metal element and oxygen element and a reducing gas 202 that reduces the metal element contained in the material gas 201 are alternately introduced into the chamber 101 . At this time, a carrier gas 203 is introduced between the material gas 201 and the reducing gas 202 . A gas remaining in the chamber 101 is discharged by the carrier gas 203 .
- CVD Chemical Vapor Deposition
- the material gas 201 is a gas containing tungsten dichloride dioxide (WO 2 Cl 2 ).
- the reducing gas 202 is hydrogen (H 2 ) gas.
- the carrier gas 203 is argon (Ar) gas.
- FIGS. 3A and 3B are diagrams schematically illustrating states of atoms at an interface between the oxide film 20 and the conductive film 30 .
- the material gas 201 , the reducing gas 202 , and the carrier gas 203 described above are introduced into the chamber 101 , the conductive film 30 containing tungsten element and oxygen element is formed on the oxide film 20 to be in contact therewith, as illustrated in FIG. 3A .
- oxygen atoms have a property of being easily bonded with silicon atoms. Therefore, as illustrated in FIG. 3B , oxygen atoms contained in the conductive film 30 are bonded with silicon atoms contained in the oxide film 20 at the interface between the conductive film 30 and the oxide film 20 . In other words, metal atoms contained in the conductive film 30 are bonded with the silicon atoms in the oxide film 20 via the oxygen atoms. That is, an atom of the metal element is bounded with an atom of the oxygen element in the conductive film 30 , and said atom of the oxygen element is bounded with an atom of the silicon element.
- a binding energy between a metal atom (a tungsten atom) and an oxygen atom is smaller than a binding energy between a silicon atom and an oxygen atom. Therefore, in the present embodiment, the oxygen atoms contained in the conductive film 30 are to be bonded with the silicon atoms contained in the oxide film 20 , rather than the metal atoms, at the interface between the conductive film 30 and the oxide film 20 . Accordingly, it is possible to further increase the adhesion between the conductive film 30 and the oxide film 20 . Meanwhile, in the present embodiment, when the oxygen concentration in the conductive film 30 is high, metal oxide is easily generated in the conductive film 30 , which causes increase in the resistivity of the conductive film 30 .
- FIG. 4 is an example of a phase diagram of tungsten element and oxygen element.
- tungsten oxide having the lowest oxygen atom ratio is pentatungsten trioxide (W 5 O 3 ).
- An oxide concentration in this pentatungsten trioxide is about 37.5 atom %.
- oxide concentration in the conductive film 30 exceeds 37.5 atom %, tungsten oxide is generated, causing increase in the resistivity of the conductive film 30 .
- the volume density of oxygen element corresponding to 37.5% of the number of atoms described above is about 2.38 ⁇ 10 22 atoms/cm 3 . Therefore, in order to ensure high adhesion between the oxide film 20 and the conductive film 30 , suppress increase in the resistivity of the conductive film 30 , and cause the conductive film 30 to have conductivity, it is desirable that the volume density of oxygen element in the conductive film 30 is less than 2.38 ⁇ 10 22 atoms/cm 3 .
- an upper limit of the volume density of oxygen element for causing the conductive film 30 to have the conductivity can be obtained by using a phase diagram or the like, as represented in the following Table 1.
- the conductive film 30 has a volume density of a certain number or more from a viewpoint of adhesion.
- the adhesion with an oxide film can be further increased when the volume density of oxygen element in the conductive film 30 is 1.0 ⁇ 10 16 atoms/cm 3 or more.
- the temperature of the substrate 10 (a film forming temperature) to be higher than a sublimation temperature of metal oxide in which metal element contained in the conductive film 30 and oxygen element are bonded together, in order to suppress generation of the metal oxide.
- a film forming temperature a sublimation temperature of metal oxide in which metal element contained in the conductive film 30 and oxygen element are bonded together.
- the temperature of the substrate 10 is higher than 750° C.
- generation of the tungsten oxide in the conductive film 30 can be suppressed.
- molybdenum oxide is sublimated at 400° C. to 600° C. Therefore, generation of the molybdenum oxide can be suppressed by setting the temperature of the substrate 10 to be higher than 400° C.
- Table 2 represents stable oxides of the metal element described above and sublimation temperatures of those oxides.
- the temperature of the substrate 10 (the film forming temperature) to be higher than the sublimation temperature described in Table 2. Such setting enables the metal oxide to be sublimated.
- the material gas 201 contains oxygen element in the present embodiment
- a film forming method of the conductive film 30 is not limited thereto. It suffices that the conductive film 30 is formed by using a combination of the material gas 201 , the reducing gas 202 , and the carrier gas 203 at least one of which contains oxygen element.
- tungsten has been referred to as an example here, the present embodiment can be achieved by another metal element similarly.
- a gas containing a molybdenum compound (MoO 2 Cl 2 , MoOCl 4 , Mo(CO) 6 ), a titanium compound (Ti[OCH(CH 3 ) 2 ] 4 ), a tantalum compound (Ta(OC 2 H 5 ) 5 ), or a niobium compound (Nb(OC 2 H 5 ) 5 ) can be used as the material gas.
- FIG. 5 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a second embodiment. Constituent elements identical to those of the semiconductor device 1 according to the first embodiment described above are denoted by like reference signs, and detailed explanations thereof are omitted.
- a semiconductor device 2 according to the present embodiment is different from that of the first embodiment in the structure of the conductive film 30 . While the conductive film 30 according to the first embodiment has a single-layer structure, the conductive film 30 according to the present embodiment has a double-layer structure including a first layer 31 and a second layer 32 .
- the first layer 31 is in contact with the oxide film 20 and contains metal element and oxygen element.
- the first layer 31 is formed by identical manufacturing steps to those of the conductive film 30 according to the first embodiment described above. For example, when CVD is performed by using the material gas 201 containing tungsten dichloride dioxide, the reducing gas 202 containing hydrogen element, and the carrier gas 203 containing argon element, the first layer 31 containing tungsten element and oxygen element can be formed on the oxide film 20 . At this time, if the first layer 31 is formed thick, its resistance becomes high. Therefore, it is desirable that the thickness of the first layer 31 is 10 nm or less.
- the second layer 32 is formed on the first layer 31 .
- the second layer 32 is formed by using the material gas 201 that is different from that for the first layer 31 .
- the material gas 201 containing tungsten hexafluoride (WF 6 ), the reducing gas 202 containing hydrogen element, and the carrier gas 203 containing argon element the second layer 32 containing tungsten element can be formed on the first layer 31 .
- the second layer 32 has a lower resistance than the first layer 31 , because the second layer 32 does not contain oxygen element. In order to reduce the resistance of the conductive film 30 as a whole, it is desirable that the second layer 32 is thicker than the first layer 31 .
- the present embodiment it is possible to increase adhesion between the oxide film 20 and the conductive film 30 by forming the first layer 31 containing oxygen element on the oxide layer 20 . Further, the resistance of the conductive film 30 can be reduced by forming the second layer 32 containing less impurities on the first layer 31 . Accordingly, it is possible to achieve the conductive film 30 in which the adhesion and the low resistance are balanced.
- metal element contained in the first layer 31 is the same type as metal element contained in the second layer 32 in the present embodiment, the metal element contained in the respective layers may be of different types from each other.
- a structure may be employed in which molybdenum element is used for the first layer 31 and tungsten element is used for the second layer 32 .
- the adhesion and the low resistance can be balanced.
- the second layer 32 has been described as a layer not containing oxygen element, the second layer 32 that is formed to have a lower oxygen concentration than the first layer 31 can also have identical effects to those in a case where the second layer 32 does not contain oxygen element.
- FIG. 6 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a third embodiment.
- a semiconductor device 3 illustrated in FIG. 6 is a three-dimensional semiconductor memory in which word lines are stacked.
- the oxide films 20 and the conductive films 30 are alternately stacked on the substrate 10 .
- Each conductive film 30 functions as a word line.
- each conductive film 30 of the third embodiment When each conductive film 30 of the third embodiment is formed, first, the oxide films 20 and sacrificial films are alternately stacked on the substrate 10 .
- the sacrificial film is a silicon nitride (SiN) film, for example.
- the sacrificial film is removed by a chemical containing phosphoric acid, for example, after formation of a memory element film 40 described later.
- a cavity is formed between the oxide films 20 . In this cavity, each conductive film 30 is formed in the manner described in the above first or second embodiment.
- the memory element film 40 is formed in a hole that penetrates through a stack of the oxide films 20 and the above sacrificial films.
- a charge blocking film 41 is formed in an outer peripheral portion of this hole.
- a charge storage film 42 is formed inside the charge blocking film 41 .
- a tunnel insulation film 43 is formed inside the charge storage film 42 .
- a channel film 44 is formed inside the tunnel insulation film 43 .
- a core film 45 is formed inside the channel film 44 .
- Each of the charge blocking film 41 , the tunnel insulation film 43 , and the core film 45 is a silicon oxide film, for example.
- the charge storage film 42 is a silicon nitride (SiN) film, for example.
- the channel film 44 is a polysilicon film, for example.
- the conductive film 30 is formed in the manner described in the above first or second embodiment, and therefore contains oxygen element. Adhesion between the oxide film 20 and the conductive film 30 is improved because of this oxygen element. Therefore, metal nitride having a high resistance is not required. Accordingly, it is possible to reduce the resistance of the conductive film 30 while increasing the adhesion between the oxide film 20 and the conductive film 30 .
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Abstract
Description
- This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2019-169528, filed on Sep. 18, 2019; the entire contents of which are incorporated herein by reference.
- Embodiments of the present invention relate to a semiconductor device, a manufacturing method thereof, and a semiconductor storage device.
- When a metal film is formed directly on an oxide film, there is a possibility that the metal film peels off because adhesion between the metal film and the oxide film is weak. Therefore, there is known a technique of forming a metal nitride film between the oxide film and the metal film. However, the resistivity of metal nitride is higher than that of metal, and therefore a conductive film including a metal nitride film and a metal film as a whole has a high resistance.
-
FIG. 1 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a first embodiment; -
FIG. 2 is an explanatory diagram of a manufacturing method of the semiconductor device according to the first embodiment; -
FIG. 3A is a diagram schematically illustrating a state of an interface between an oxide film and a conductive film; -
FIG. 3B is a diagram schematically illustrating a state of the interface between an oxide film and a conductive film; -
FIG. 4 is an example of a phase diagram of tungsten element and oxygen element; -
FIG. 5 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a second embodiment; and -
FIG. 6 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a third embodiment. - Embodiments will now be explained with reference to the accompanying drawings. The present invention is not limited to the embodiments.
- A semiconductor device according to an embodiment comprises: an oxide film containing first element; and a conductive film provided to be in contact with the oxide film, containing metal element and oxygen atoms, and having conductivity. A volume density of the oxygen element in the conductive film is less than 2.38×1022 atoms/cm3 when the metal element is tungsten (W), less than 4.27×1022 atoms/cm3 when the metal element is molybdenum (Mo), less than 2.28×1022 atoms/cm3 when the metal element is titanium (Ti), less than 5.00×1022 atoms/cm3 when the metal element is chromium (Cr), less than 4.23×1022 atoms/cm3 when the metal element is vanadium (V), less than 4.84×1022 atoms/cm3 when the metal element is iron (Fe), less than 2.82×1022 atoms/cm3 when the metal element is copper (Cu), less than 3.32×1022 atoms/cm3 when the metal element is tantalum (Ta), and less than 2.78×1022 atoms/cm3 when the metal element is niobium (Nb).
-
FIG. 1 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a first embodiment. Thesemiconductor device 1 according to the present embodiment includes asubstrate 10, anoxide film 20, and aconductive film 30. - The
substrate 10 is a silicon substrate, for example. Theoxide film 20 is formed on thesubstrate 10. Theoxide film 20 contains silicon oxide (SiO2) or aluminum oxide (Al2O3), for example. Theconductive film 30 is formed on theoxide film 20. - The
conductive film 30 contains metal element and oxygen element. The metal element is, for example, tungsten (W), titanium (Ti), molybdenum (Mo), chromium (Cr), vanadium (V), iron (Fe), copper (Cu), tantalum (Ta), or niobium (Nb). Theconductive film 30 has conductivity and has an electrical resistivity (a resistivity) of 1.0×106 μΩ/cm or less, for example. - A manufacturing method of the
semiconductor device 1 according to the present embodiment is described below. Manufacturing steps of theconductive film 30 are described here. - First, as illustrated in
FIG. 2 , thesubstrate 10 is accommodated in achamber 101 while being fixed on astage 100. At this time, theoxide film 20 has already been formed on thesubstrate 10. Theoxide film 20 is a silicon oxide film in the present embodiment. - Subsequently, the
conductive film 30 is formed on theoxide film 20 by CVD (Chemical Vapor Deposition). Specifically, amaterial gas 201 containing metal element and oxygen element and a reducinggas 202 that reduces the metal element contained in thematerial gas 201 are alternately introduced into thechamber 101. At this time, acarrier gas 203 is introduced between thematerial gas 201 and the reducinggas 202. A gas remaining in thechamber 101 is discharged by thecarrier gas 203. - In the present embodiment, the
material gas 201 is a gas containing tungsten dichloride dioxide (WO2Cl2). The reducinggas 202 is hydrogen (H2) gas. Thecarrier gas 203 is argon (Ar) gas. -
FIGS. 3A and 3B are diagrams schematically illustrating states of atoms at an interface between theoxide film 20 and theconductive film 30. When thematerial gas 201, the reducinggas 202, and thecarrier gas 203 described above are introduced into thechamber 101, theconductive film 30 containing tungsten element and oxygen element is formed on theoxide film 20 to be in contact therewith, as illustrated inFIG. 3A . - In general, oxygen atoms have a property of being easily bonded with silicon atoms. Therefore, as illustrated in
FIG. 3B , oxygen atoms contained in theconductive film 30 are bonded with silicon atoms contained in theoxide film 20 at the interface between theconductive film 30 and theoxide film 20. In other words, metal atoms contained in theconductive film 30 are bonded with the silicon atoms in theoxide film 20 via the oxygen atoms. That is, an atom of the metal element is bounded with an atom of the oxygen element in theconductive film 30, and said atom of the oxygen element is bounded with an atom of the silicon element. - Therefore, according to the present embodiment, it is possible to increase adhesion between the
conductive film 30 and theoxide film 20 without forming a high-resistance metal nitride film between theconductive film 30 and theoxide film 20. - Further, a binding energy between a metal atom (a tungsten atom) and an oxygen atom is smaller than a binding energy between a silicon atom and an oxygen atom. Therefore, in the present embodiment, the oxygen atoms contained in the
conductive film 30 are to be bonded with the silicon atoms contained in theoxide film 20, rather than the metal atoms, at the interface between theconductive film 30 and theoxide film 20. Accordingly, it is possible to further increase the adhesion between theconductive film 30 and theoxide film 20. Meanwhile, in the present embodiment, when the oxygen concentration in theconductive film 30 is high, metal oxide is easily generated in theconductive film 30, which causes increase in the resistivity of theconductive film 30. -
FIG. 4 is an example of a phase diagram of tungsten element and oxygen element. According to the phase diagram illustrated inFIG. 4 , tungsten oxide having the lowest oxygen atom ratio is pentatungsten trioxide (W5O3). An oxide concentration in this pentatungsten trioxide is about 37.5 atom %. When the oxide concentration in theconductive film 30 exceeds 37.5 atom %, tungsten oxide is generated, causing increase in the resistivity of theconductive film 30. - Because the number of atoms per unit volume of tungsten is about 6.3×1022 atoms/cm3, the volume density of oxygen element corresponding to 37.5% of the number of atoms described above is about 2.38×1022 atoms/cm3. Therefore, in order to ensure high adhesion between the
oxide film 20 and theconductive film 30, suppress increase in the resistivity of theconductive film 30, and cause theconductive film 30 to have conductivity, it is desirable that the volume density of oxygen element in theconductive film 30 is less than 2.38×1022 atoms/cm3. - Further, also for metal other than tungsten, an upper limit of the volume density of oxygen element for causing the
conductive film 30 to have the conductivity can be obtained by using a phase diagram or the like, as represented in the following Table 1. -
TABLE 1 Oxide having Metal lowest oxygen Upper limit of volume density of element ratio oxygen element (atoms/cm3) Ti Ti3O2 2.28 × 1022 Mo MoO2 4.27 × 1022 Cr Cr2O3 5.00 × 1022 V V2O3 4.23 × 1022 Fe Fe3O4 4.84 × 1022 Cu Cu2O 2.82 × 1022 Ta Ta2O3 3.32 × 1022 Nb NbO 2.78 × 1022 - Meanwhile, it is desirable that the
conductive film 30 has a volume density of a certain number or more from a viewpoint of adhesion. For example, the adhesion with an oxide film can be further increased when the volume density of oxygen element in theconductive film 30 is 1.0×1016 atoms/cm3 or more. - Further, when the
conductive film 30 is formed, it is desirable to set the temperature of the substrate 10 (a film forming temperature) to be higher than a sublimation temperature of metal oxide in which metal element contained in theconductive film 30 and oxygen element are bonded together, in order to suppress generation of the metal oxide. For example, when the temperature of thesubstrate 10 is higher than 750° C., it is possible to sublimate tungsten oxide. As a result, generation of the tungsten oxide in theconductive film 30 can be suppressed. Further, in a case where the metal element contained in theconductive film 30 is molybdenum, molybdenum oxide is sublimated at 400° C. to 600° C. Therefore, generation of the molybdenum oxide can be suppressed by setting the temperature of thesubstrate 10 to be higher than 400° C. - The following Table 2 represents stable oxides of the metal element described above and sublimation temperatures of those oxides. In film formation of atoms of each metal element, it is desirable to set the temperature of the substrate 10 (the film forming temperature) to be higher than the sublimation temperature described in Table 2. Such setting enables the metal oxide to be sublimated.
-
TABLE 2 Example of Metal most stable element oxide Sublimation temperature (° C.) Ti TiO2 935 Mo MoO2 397.5 Cr Cr2O3 1217.5 V V2O5 345 Fe Fe3O4 798.5 Cu Cu2O 617.5 Ta Ta2O5 734 Nb Nb2O5 760 W WO3 736.5 - Although the
material gas 201 contains oxygen element in the present embodiment, a film forming method of theconductive film 30 is not limited thereto. It suffices that theconductive film 30 is formed by using a combination of thematerial gas 201, the reducinggas 202, and thecarrier gas 203 at least one of which contains oxygen element. - For example, when a combination of the
material gas 201 containing a tungsten compound (W(CO)6, WF6, WCl6, WCl5, WO2Cl2, WOCl4, or W(CO)6), the reducinggas 202 containing hydrogen gas (H2), nitrogen dioxide gas (NO2), nitrous oxide gas (N2O), carbon monoxide gas (CO), oxygen gas (O2), or ozone gas (O3), and thecarrier gas 203 containing argon gas (Ar), nitrogen gas (N2), or carbon dioxide gas (CO2), at least one of which contains oxygen, is used, tungsten element and oxygen element are contained in theconductive film 30. Therefore, the adhesion between theconductive film 30 and theoxide film 20 is increased. Although tungsten has been referred to as an example here, the present embodiment can be achieved by another metal element similarly. For example, a gas containing a molybdenum compound (MoO2Cl2, MoOCl4, Mo(CO)6), a titanium compound (Ti[OCH(CH3)2]4), a tantalum compound (Ta(OC2H5)5), or a niobium compound (Nb(OC2H5)5) can be used as the material gas. -
FIG. 5 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a second embodiment. Constituent elements identical to those of thesemiconductor device 1 according to the first embodiment described above are denoted by like reference signs, and detailed explanations thereof are omitted. - As illustrated in
FIG. 5 , asemiconductor device 2 according to the present embodiment is different from that of the first embodiment in the structure of theconductive film 30. While theconductive film 30 according to the first embodiment has a single-layer structure, theconductive film 30 according to the present embodiment has a double-layer structure including afirst layer 31 and asecond layer 32. - The
first layer 31 is in contact with theoxide film 20 and contains metal element and oxygen element. Thefirst layer 31 is formed by identical manufacturing steps to those of theconductive film 30 according to the first embodiment described above. For example, when CVD is performed by using thematerial gas 201 containing tungsten dichloride dioxide, the reducinggas 202 containing hydrogen element, and thecarrier gas 203 containing argon element, thefirst layer 31 containing tungsten element and oxygen element can be formed on theoxide film 20. At this time, if thefirst layer 31 is formed thick, its resistance becomes high. Therefore, it is desirable that the thickness of thefirst layer 31 is 10 nm or less. - The
second layer 32 is formed on thefirst layer 31. Thesecond layer 32 is formed by using thematerial gas 201 that is different from that for thefirst layer 31. For example, when CVD is performed by using thematerial gas 201 containing tungsten hexafluoride (WF6), the reducinggas 202 containing hydrogen element, and thecarrier gas 203 containing argon element, thesecond layer 32 containing tungsten element can be formed on thefirst layer 31. Thesecond layer 32 has a lower resistance than thefirst layer 31, because thesecond layer 32 does not contain oxygen element. In order to reduce the resistance of theconductive film 30 as a whole, it is desirable that thesecond layer 32 is thicker than thefirst layer 31. - According to the present embodiment, it is possible to increase adhesion between the
oxide film 20 and theconductive film 30 by forming thefirst layer 31 containing oxygen element on theoxide layer 20. Further, the resistance of theconductive film 30 can be reduced by forming thesecond layer 32 containing less impurities on thefirst layer 31. Accordingly, it is possible to achieve theconductive film 30 in which the adhesion and the low resistance are balanced. - Although metal element contained in the
first layer 31 is the same type as metal element contained in thesecond layer 32 in the present embodiment, the metal element contained in the respective layers may be of different types from each other. For example, a structure may be employed in which molybdenum element is used for thefirst layer 31 and tungsten element is used for thesecond layer 32. Also in this case, the adhesion and the low resistance can be balanced. Further, although thesecond layer 32 has been described as a layer not containing oxygen element, thesecond layer 32 that is formed to have a lower oxygen concentration than thefirst layer 31 can also have identical effects to those in a case where thesecond layer 32 does not contain oxygen element. -
FIG. 6 is a cross-sectional view illustrating a structure of relevant parts of a semiconductor device according to a third embodiment. Asemiconductor device 3 illustrated inFIG. 6 is a three-dimensional semiconductor memory in which word lines are stacked. In thesemiconductor device 3, theoxide films 20 and theconductive films 30 are alternately stacked on thesubstrate 10. Eachconductive film 30 functions as a word line. - When each
conductive film 30 of the third embodiment is formed, first, theoxide films 20 and sacrificial films are alternately stacked on thesubstrate 10. The sacrificial film is a silicon nitride (SiN) film, for example. The sacrificial film is removed by a chemical containing phosphoric acid, for example, after formation of amemory element film 40 described later. By removal of the sacrificial film, a cavity is formed between theoxide films 20. In this cavity, eachconductive film 30 is formed in the manner described in the above first or second embodiment. - The
memory element film 40 is formed in a hole that penetrates through a stack of theoxide films 20 and the above sacrificial films. Acharge blocking film 41 is formed in an outer peripheral portion of this hole. Acharge storage film 42 is formed inside thecharge blocking film 41. Atunnel insulation film 43 is formed inside thecharge storage film 42. Achannel film 44 is formed inside thetunnel insulation film 43. Acore film 45 is formed inside thechannel film 44. - Each of the
charge blocking film 41, thetunnel insulation film 43, and thecore film 45 is a silicon oxide film, for example. Thecharge storage film 42 is a silicon nitride (SiN) film, for example. Thechannel film 44 is a polysilicon film, for example. - In the present embodiment, the
conductive film 30 is formed in the manner described in the above first or second embodiment, and therefore contains oxygen element. Adhesion between theoxide film 20 and theconductive film 30 is improved because of this oxygen element. Therefore, metal nitride having a high resistance is not required. Accordingly, it is possible to reduce the resistance of theconductive film 30 while increasing the adhesion between theoxide film 20 and theconductive film 30. - While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Claims (10)
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