US20200233029A1 - History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management pad - Google Patents
History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management pad Download PDFInfo
- Publication number
- US20200233029A1 US20200233029A1 US16/633,375 US201816633375A US2020233029A1 US 20200233029 A1 US20200233029 A1 US 20200233029A1 US 201816633375 A US201816633375 A US 201816633375A US 2020233029 A1 US2020233029 A1 US 2020233029A1
- Authority
- US
- United States
- Prior art keywords
- film member
- socket
- chip
- electrode units
- tracking chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2894—Aspects of quality control [QC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
Definitions
- the present invention relates to a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad, and more specifically, to a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad, in which the history management pad is provided in the semiconductor test socket, and may obtain accurate data by managing history such as lifespan and inventory of the socket, information on a device under test, identification of a position and the like, and accurately determine a time for replacing the socket.
- a semiconductor package manufacturing process is largely divided into a preprocess, a postprocess and a test process.
- the preprocess is also referred to as a fabrication (FAB) process, which is a process of forming an integrated circuit on a wafer of a single crystal silicon material.
- the postprocess is also referred to as an assembly process, which is a process of forming an integrated circuit package (device under test) by dividing the wafer into individual chips, connecting a conductive lead or ball to the chips to make connection of electrical signals to external devices possible, and molding the chips with resin such as epoxy resin to protect the chips from the external environments.
- the test process is a process of testing whether the integrated circuit package normally operates, and separating good and bad products.
- the socket is mounted on a printed circuit board (PCB) electrically connected to a tester for testing an integrated circuit and is in charge of a function of electrically and mechanically connecting the tester and a handler.
- PCB printed circuit board
- contact pins of the socket are in charge of a function of electrically connecting a lead of the integrated circuit package and a terminal of the printed circuit board.
- the tester creates an electrical signal for testing an integrated circuit package that will be mounted on the socket, outputs the electrical signal to the integrated circuit package, and tests whether the integrated circuit package normally operates using the electrical signal inputted through the integrated circuit package. As a result, the integrated circuit package is determined as a good or bad product.
- the handler automatically mounts the integrated circuit package on the socket, withdraws the integrated circuit package from the socket according to a test result of the tester, and disposes the integrated circuit package after determining the package as a bad or good product.
- this method may not acquire accurate data as the position of a socket may not be recognized when the position of the socket is changed, and there is a problem in that it is unable to identify the number of times of using a socket reused through a reproduction work such as a cleansing work or the like described above.
- the present invention has been made in view of the above problems, and it is an object of the present invention to provide a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad, in which the history management pad is provided in the semiconductor test socket, and may obtain accurate data by managing history such as lifespan and inventory of the socket, information on a device under test, identification of a position and the like.
- Another object of the present invention is to provide a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad, which can prevent a test error caused by the socket by accurately determining a time for replacing the socket, and maintain production yield by estimating an accurate time for replacing the socket and replacing the socket at an idle time.
- a history management pad of a semiconductor test socket comprising: an insulative mold film member installed at an outer portion of a socket frame of the semiconductor test socket configured of a socket body and the socket frame, and provided with a plurality of electrode units in the thickness direction; a guide film means formed on the top of the mold film member to guide and support a tracking chip when the tracking chip is mounted on the mold film member; the tracking chip conductively contacting with the top of the electrode units of the mold film member; and a fixing means for fixing the tracking chip to the guide film means, wherein lower portions of the electrode units contact with pads of a socket printed circuit board through holes of the socket frame formed at the positions corresponding to the electrode units.
- the socket body is an elastic conductive sheet including a conductive unit, in which a plurality of conductive particles is distributed in an insulative elastic material; and an insulative supporting unit for disconnecting electrical contact with an adjacent conductive unit while supporting each conductive unit.
- the electrode unit is an elastic electrode unit which forms a conductive path as a plurality of conductive particles is arranged in the thickness direction within the insulative elastic material.
- the guide film means includes: a ball guide film member in which position compensation holes for aligning balls of the tracking chip are formed; and a chip guide film member in which a chip guide hole for guiding and supporting the tracking chip is formed.
- the fixing means is formed as a film cover covering the tracking chip.
- the fixing means is formed of an adhesive or silicon for fixing the tracking chip.
- a method of manufacturing a history management pad of a semiconductor test socket comprising: a first step of forming, at an outer portion of a socket frame of the semiconductor test socket, an insulative mold film member provided with a plurality of electrode units for electrically connecting electrode balls of the tracking chip to pad electrodes provided in a socket printed circuit board; a second step of attaching a ball guide film member, in which guide holes aligned with the electrode units are formed, on the top surface of the mold film member; a third step of attaching a chip guide film member, in which a chip guide hole for guiding the tracking chip is formed, on the top surface of the ball guide film member; a fourth step of contacting the balls of the tracking chip to the electrode units of the mold film member through the guide holes of the ball guide film member, while guiding the tracking chip through the chip guide hole of the chip guide film member; and a fifth step of fixing the tracking chip on the mold film member.
- the first step is accomplished by attaching the insulative mold film member, in which the plurality of electrode units is formed, to the socket frame in which holes corresponding to the electrode units are formed at an outer portion.
- the first step is accomplished by providing the mold film member in which holes for forming the electrode units are formed and the socket frame in which holes corresponding to the holes for forming the electrode units are formed at an outer portion, attaching the mold film member at an outer portion of the socket frame in one piece, and filling the electrode units in the holes for forming the electrode units and the holes of the socket frame.
- the tracking chip is fixed by attaching a cover film around an area including the top of the tracking chip.
- the tracking chip is fixed using an adhesive or silicon.
- a method of manufacturing a history management pad of a semiconductor test socket comprising: a first step of providing an insulative mold film member provided with a plurality of electrode units; a second step of attaching a ball guide film member, in which guide holes aligned with the electrode units are formed, on the top surface of the mold film member; a third step of attaching a chip guide film member, in which a chip guide hole for guiding the tracking chip is formed, on the top surface of the ball guide film member; a fourth step of contacting the balls of the tracking chip to the electrode units of the mold film member through the guide holes of the ball guide film member, while guiding the tracking chip through the chip guide hole of the chip guide film member; a fifth step of fixing the tracking chip on the mold film member; and a sixth step of attaching the mold film member, which has completed gone through the process up to the fifth step, at an outer portion of the socket frame of the semiconductor test socket in which holes corresponding to the electrode units are formed.
- the tracking chip is fixed by attaching a cover film around an area including the top of the tracking chip.
- the tracking chip is fixed using an adhesive or silicon.
- a semiconductor test device comprising: a socket frame provided with the history management pad according to any one of claims 1 to 6 at an outer portion; and a socket guide member provided on the top of the tracking chip and configured to press the tracking chip when a semiconductor test socket is tested.
- a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad according to the present invention provides the effects described below.
- the present invention has an effect of obtaining accurate data by managing history such as lifespan and inventory of the socket, information on a device under test, identification of a position and the like.
- the present invention has an effect of preventing a device under test of a good quality from being treated as a defective due to the socket, by accurately determining a time for replacing the socket.
- the present invention is effective in that production yield is not be affected by estimating an accurate time for replacing a socket and replacing the socket at an idle time.
- FIG. 1 is a view showing a semiconductor test socket provided with a history management pad of the semiconductor test socket according to the present invention.
- FIG. 2 is a view showing the configuration of a history management pad of a semiconductor test socket according to the present invention.
- FIG. 3 is a view showing a configuration provided with a socket guide for pressing a history management pad in a semiconductor test socket according to the present invention.
- FIG. 4 is a view showing the manufacturing process of a history management pad of a semiconductor test socket according to an embodiment of the present invention.
- FIG. 5 is a view showing a process following the process of FIG. 4 .
- FIG. 1 is a view showing a semiconductor test socket provided with a history management pad of the semiconductor test socket according to the present invention
- FIG. 2 is a view showing the configuration of a history management pad of a semiconductor test socket according to the present invention
- FIG. 3 is a view showing a configuration provided with a socket guide for pressing a history management pad in a semiconductor test socket according to the present invention.
- a history management pad P of a semiconductor test socket is provided at an outer portion of a socket frame 200 of the semiconductor test socket provided with a socket body C (an elastic conductive sheet or a pogo pin body) for electrically contacting a lead of a device under test and a terminal of the printed circuit board of the socket, and the history management pad includes an insulative mold film member 100 provided with a plurality of conductive electrode units 110 in the thickness direction (vertical direction); an insulative mold socket frame 200 having a plurality of holes 210 formed for the lower portions (bumps) 111 of the electrode units 110 to pass through, on the top surface of which the insulative mold film member 100 is attached; a guide film means 300 formed on the top of the mold film member 100 to provide contact stability of a tracking chip 400 by resting the tracking chip 400 on the mold film member 100 while the tracking chip 400 conductively contacts with the electrode units 110 of the mold film member 100 ; the tracking chip 400 conductively contacting with the electrode
- the socket body electrically connects a terminal of a device under test and a pad of a test device (socket printed circuit board) and may be an elastic conductive sheet having elasticity or a pogo pin body.
- the elastic conductive sheet is preferable since smooth contact is possible by absorbing mechanical impacts or deformation.
- the elastic conductive sheet like this is configured of a conductive unit, in which a plurality of conductive particles is distributed in an insulative elastic material, and an insulative supporting unit for disconnecting electrical contact with an adjacent conductive unit while supporting each conductive unit.
- the mold film member 100 is preferably formed of, for example, polyimide, it is not limited thereto, and any insulative (nonconductor) material, in which the electrode units 110 can be stably provided, can be used.
- the electrode units 110 of the mold film member 100 electrically connect the balls 420 provided in the tracking chip 400 to the pad electrodes 11 provided in the socket printed circuit board 10 (see FIG. 3 ).
- the electrode unit 110 of the mold film member 100 is preferably formed as an elastic electrode unit which forms a conductive path, in which a plurality of conductive particles is distributed to be arranged in the thickness direction within an insulative elastic material such as silicon.
- the reason that the elastic electrode unit is preferable like this is that if the top of the tracking chip 400 of the history management pad of the semiconductor test socket is pressed through a socket guide member G (see FIG. 3 ) in association with a test operation of a device under test when the device under test is tested, the electrode unit 110 may smoothly contact with the pad electrode while being elastically deformed.
- the electrode units 110 of the mold film member 100 are configured to flow current between the balls 420 of the tracking chip 400 and the pad electrodes 11 of the socket printed circuit board 10 , they are not specially limited.
- the socket frame 200 is for supporting the elastic conductive sheet or the pogo pin body and aligning the socket in a lubber socket for testing or a socket for pogo pin and is formed of a material such as stainless steel, polyimide or the like, and in the present invention, the history management pad P may be attached at an outer portion of the socket frame 200 .
- the guide film means 300 includes a ball guide film member 310 in which a plurality of position compensation holes 311 is formed at the positions corresponding to the balls 420 of the tracking chip 400 , and a chip guide film member 320 in which a chip guide hole 321 for guiding the body 410 of the tracking chip 400 is formed.
- the guide film means 300 including the ball guide film member 310 and the chip guide film member 320 like this is configured, contact stability of the tracking chip 400 can be achieved.
- the tracking chip 400 is designed to obtain data on the information related to history management and test of the socket, such as information on the inventory and lifespan of the socket and information on the device under test, and the detailed configuration of the tracking chip may be designed through a publicized method, and detailed description thereof will be omitted to clarify the target of the present invention.
- a fixing means for fixing the tracking chip 400 to the guide film member 300 is not specially limited if the fixing means is a configuration which can fix the guide film member 300 and the tracking chip 400 .
- the fixing means may be configured as a cover film 500 attached to cover the top surface of the tracking chip 400 (specifically, together with the top surface of the chip guide film member 320 of the guide film means 300 ).
- the fixing means may fix the tracking chip 400 by using an adhesive, silicon or the like.
- the history management pad of a semiconductor test socket according to the present invention configured as described above is attached and fixed at an outer portion of the socket frame 200 of the semiconductor test socket in which penetration holes are formed to expose the electrode units 110 of the mold film member 100 toward the bottom.
- FIGS. 4 and 5 are views showing the manufacturing process of a history management pad of a semiconductor test socket according to an embodiment of the present invention.
- the same numerals and symbols are assigned to the elements the same as the elements described in the description of the history management pad of a semiconductor test socket, and repeated description will be omitted to simplify the description of the present invention.
- the method of manufacturing a history management pad of a semiconductor test socket includes: a first step of forming a plurality of electrode units 110 at an outer portion of the socket frame 200 of the semiconductor test socket by attaching an insulative mold film member 100 to a socket frame 200 , in which holes 210 are formed to electrically connect the balls 420 of the tracking chip 400 and the pad electrodes 11 of the socket printed circuit board ( FIG.
- the first step may be accomplished in two methods described below.
- an insulative mold film member 100 in which electrode units 110 are formed may be integrated with a socket frame 200 ( FIG. 4 ( a - 3 )) in one piece by attaching an insulative mold film member 100 , in which the electrode units 110 are formed in the holes 101 for forming the electrode units 110 ( FIG. 4 ( a - 1 )), to a socket frame 200 in which holes 210 corresponding to the electrode units 110 are formed at an outer portion ( FIG. 4 ( a - 1 ′)).
- the history management pad may be formed by providing a mold film member 100 in which holes 101 for forming the electrode units are formed as shown in FIG. 4 ( a - 2 ) and a socket frame 200 in which holes 210 corresponding to the holes 101 for forming the electrode units 110 are formed at an outer portion, attaching the mold film member 100 and the socket frame 200 in one piece, and filling the electrode units 110 in the holes 101 and 210 ( FIG. 4 ( a - 3 )).
- the mold film member 100 may be formed of, for example, a polyimide material, and the socket frame 200 may be formed of a stainless steel material.
- the lower portion of the electrode unit 110 may be formed to protrude from the bottom surface of the socket frame 200 to some extent (i.e., to form a bump 111 ).
- the electrode unit 110 is preferably formed as, for example, an elastic electrode unit which forms a conductive path as a plurality of conductive particles is distributed to be arranged in the thickness direction within an insulative elastic material such as silicon.
- the second step (the step of forming a ball guide film member), the third step (the step of forming a chip guide film member) and the fourth step (the step of installing a tracking chip) align positions of the balls of the tracking chip 400 when the tracking chip 400 is installed and guide and stably support the tracking chip 400 to stably accomplish contact of the tracking chip 400 .
- the fifth step is a step of fixing the tracking chip 400 , and if a method may fix the tracking chip, it is not specially limited.
- the fifth step may fix the tracking chip by attaching a cover film 500 on the top of the tracking chip 400 and the chip guide film member 320 , and as another example, the tracking chip 400 may be fixed using an adhesive, silicon or the like.
- a method of manufacturing a history management pad P by applying the second to fifth steps to the insulative mold film member 100 ( FIG. 4 ( a - 1 )), in which the electrode units 110 are formed in the holes 101 for forming the electrode units 110 as described above, and attaching the history management pad at an outer portion of the socket frame 200 is also possible. According to the embodiment like this, since the history management pad P may be manufactured in advance, an effect of enhancing work productivity may be obtained.
- the present invention as described above may obtain accurate data by managing history such as lifespan management and inventory management of the socket, information on the device under test, identification of the position and the like, and has an advantage of preventing a device under test of a good quality from being treated as a defective one due to the socket, by accurately determining a time for replacing the socket.
- the present invention is advantageous in that production yield is not be affected by estimating an accurate time for replacing a socket and replacing the socket at an idle time.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
- The present invention relates to a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad, and more specifically, to a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad, in which the history management pad is provided in the semiconductor test socket, and may obtain accurate data by managing history such as lifespan and inventory of the socket, information on a device under test, identification of a position and the like, and accurately determine a time for replacing the socket.
- Generally, a semiconductor package manufacturing process is largely divided into a preprocess, a postprocess and a test process. The preprocess is also referred to as a fabrication (FAB) process, which is a process of forming an integrated circuit on a wafer of a single crystal silicon material. The postprocess is also referred to as an assembly process, which is a process of forming an integrated circuit package (device under test) by dividing the wafer into individual chips, connecting a conductive lead or ball to the chips to make connection of electrical signals to external devices possible, and molding the chips with resin such as epoxy resin to protect the chips from the external environments. The test process is a process of testing whether the integrated circuit package normally operates, and separating good and bad products.
- One of core components applied to the test process is a socket. The socket is mounted on a printed circuit board (PCB) electrically connected to a tester for testing an integrated circuit and is in charge of a function of electrically and mechanically connecting the tester and a handler. Here, contact pins of the socket are in charge of a function of electrically connecting a lead of the integrated circuit package and a terminal of the printed circuit board.
- The tester creates an electrical signal for testing an integrated circuit package that will be mounted on the socket, outputs the electrical signal to the integrated circuit package, and tests whether the integrated circuit package normally operates using the electrical signal inputted through the integrated circuit package. As a result, the integrated circuit package is determined as a good or bad product.
- The handler automatically mounts the integrated circuit package on the socket, withdraws the integrated circuit package from the socket according to a test result of the tester, and disposes the integrated circuit package after determining the package as a bad or good product.
- Meanwhile, the price of testers increases recently due to increase of devices under test (DUTs) simultaneously tested for the sake of high speed, high functionality and high productivity of the integrated circuits. To efficiently use the expensive testers, it is very important to select and use an appropriate socket and manage the lifespan of the socket.
- If lifespan of a socket is exhausted and performance of the socket is degraded while testing a large quantity of packages, the cases of classifying a semiconductor package of a good quality as a defective one gradually increase, and a very high defective rate is maintained until the defective socket is replaced with a new socket. In addition, as the expensive tester and the handler should be stopped to replace the socket whenever a defective socket is replaced, efficiency of the test is lowered, and as a result, and this may affect the production yield.
- To prevent this problem, in the semiconductor industry, gradual increase of the defective rate is prevented by replacing a defective socket with a new socket when a socket reaches a predetermined number of times of using the socket, i.e., a threshold use count, and an appropriate replacement time is managed by grasping the number of good products and bad products, together with the threshold use count. Meanwhile, the replaced socket may be reused through a test after cleansing the socket.
- The methods currently used in the semiconductor industry to grasp the threshold use count, the number of good products and the number of bad products as described above will be described below. Although a method of approximately estimating the number of times of using a socket by recording an initial use date on the socket body and grasping the time elapsed from the date is used as a first method, this method may not calculate an accurate data, and it is impossible to grasp all the necessary items such as the number of times of using the socket, the number of good products, the number of bad products and the like. As a second method, there is a method in which the tester or the handler memorizes the data processed by each socket. However, this method may not acquire accurate data as the position of a socket may not be recognized when the position of the socket is changed, and there is a problem in that it is unable to identify the number of times of using a socket reused through a reproduction work such as a cleansing work or the like described above.
- Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad, in which the history management pad is provided in the semiconductor test socket, and may obtain accurate data by managing history such as lifespan and inventory of the socket, information on a device under test, identification of a position and the like.
- Another object of the present invention is to provide a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad, which can prevent a test error caused by the socket by accurately determining a time for replacing the socket, and maintain production yield by estimating an accurate time for replacing the socket and replacing the socket at an idle time.
- To accomplish the above objects, according to a first aspect of the present invention, there is provided a history management pad of a semiconductor test socket, the pad comprising: an insulative mold film member installed at an outer portion of a socket frame of the semiconductor test socket configured of a socket body and the socket frame, and provided with a plurality of electrode units in the thickness direction; a guide film means formed on the top of the mold film member to guide and support a tracking chip when the tracking chip is mounted on the mold film member; the tracking chip conductively contacting with the top of the electrode units of the mold film member; and a fixing means for fixing the tracking chip to the guide film means, wherein lower portions of the electrode units contact with pads of a socket printed circuit board through holes of the socket frame formed at the positions corresponding to the electrode units.
- In the first aspect of the present invention, the socket body is an elastic conductive sheet including a conductive unit, in which a plurality of conductive particles is distributed in an insulative elastic material; and an insulative supporting unit for disconnecting electrical contact with an adjacent conductive unit while supporting each conductive unit.
- In the first aspect of the present invention, the electrode unit is an elastic electrode unit which forms a conductive path as a plurality of conductive particles is arranged in the thickness direction within the insulative elastic material.
- In the first aspect of the present invention, the guide film means includes: a ball guide film member in which position compensation holes for aligning balls of the tracking chip are formed; and a chip guide film member in which a chip guide hole for guiding and supporting the tracking chip is formed.
- In the first aspect of the present invention, the fixing means is formed as a film cover covering the tracking chip.
- In the first aspect of the present invention, the fixing means is formed of an adhesive or silicon for fixing the tracking chip.
- According to a second aspect of the present invention, there is provided a method of manufacturing a history management pad of a semiconductor test socket, the method comprising: a first step of forming, at an outer portion of a socket frame of the semiconductor test socket, an insulative mold film member provided with a plurality of electrode units for electrically connecting electrode balls of the tracking chip to pad electrodes provided in a socket printed circuit board; a second step of attaching a ball guide film member, in which guide holes aligned with the electrode units are formed, on the top surface of the mold film member; a third step of attaching a chip guide film member, in which a chip guide hole for guiding the tracking chip is formed, on the top surface of the ball guide film member; a fourth step of contacting the balls of the tracking chip to the electrode units of the mold film member through the guide holes of the ball guide film member, while guiding the tracking chip through the chip guide hole of the chip guide film member; and a fifth step of fixing the tracking chip on the mold film member.
- In the second aspect of the present invention, the first step is accomplished by attaching the insulative mold film member, in which the plurality of electrode units is formed, to the socket frame in which holes corresponding to the electrode units are formed at an outer portion.
- In the second aspect of the present invention, the first step is accomplished by providing the mold film member in which holes for forming the electrode units are formed and the socket frame in which holes corresponding to the holes for forming the electrode units are formed at an outer portion, attaching the mold film member at an outer portion of the socket frame in one piece, and filling the electrode units in the holes for forming the electrode units and the holes of the socket frame.
- In the second aspect of the present invention, at the fifth step, the tracking chip is fixed by attaching a cover film around an area including the top of the tracking chip.
- In the second aspect of the present invention, at the fifth step, the tracking chip is fixed using an adhesive or silicon.
- According to a third aspect of the present invention, there is provided a method of manufacturing a history management pad of a semiconductor test socket, the method comprising: a first step of providing an insulative mold film member provided with a plurality of electrode units; a second step of attaching a ball guide film member, in which guide holes aligned with the electrode units are formed, on the top surface of the mold film member; a third step of attaching a chip guide film member, in which a chip guide hole for guiding the tracking chip is formed, on the top surface of the ball guide film member; a fourth step of contacting the balls of the tracking chip to the electrode units of the mold film member through the guide holes of the ball guide film member, while guiding the tracking chip through the chip guide hole of the chip guide film member; a fifth step of fixing the tracking chip on the mold film member; and a sixth step of attaching the mold film member, which has completed gone through the process up to the fifth step, at an outer portion of the socket frame of the semiconductor test socket in which holes corresponding to the electrode units are formed.
- In the third aspect of the present invention, at the fifth step, the tracking chip is fixed by attaching a cover film around an area including the top of the tracking chip.
- In the third aspect of the present invention, at the fifth step, the tracking chip is fixed using an adhesive or silicon.
- According to a fourth aspect of the present invention, there is provided a semiconductor test device comprising: a socket frame provided with the history management pad according to any one of
claims 1 to 6 at an outer portion; and a socket guide member provided on the top of the tracking chip and configured to press the tracking chip when a semiconductor test socket is tested. - A history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad according to the present invention provides the effects described below.
- First, as the history management pad is provided in the semiconductor test socket, the present invention has an effect of obtaining accurate data by managing history such as lifespan and inventory of the socket, information on a device under test, identification of a position and the like.
- Second, the present invention has an effect of preventing a device under test of a good quality from being treated as a defective due to the socket, by accurately determining a time for replacing the socket.
- Third, the present invention is effective in that production yield is not be affected by estimating an accurate time for replacing a socket and replacing the socket at an idle time.
-
FIG. 1 is a view showing a semiconductor test socket provided with a history management pad of the semiconductor test socket according to the present invention. -
FIG. 2 is a view showing the configuration of a history management pad of a semiconductor test socket according to the present invention. -
FIG. 3 is a view showing a configuration provided with a socket guide for pressing a history management pad in a semiconductor test socket according to the present invention. -
FIG. 4 is a view showing the manufacturing process of a history management pad of a semiconductor test socket according to an embodiment of the present invention. -
FIG. 5 is a view showing a process following the process ofFIG. 4 . - Additional objects, features and advantages of the present invention can be understood more clearly from the following detailed description and accompanying drawings.
- Before the detailed description of the present invention, it should be understood that as the present invention may make diverse changes and have various embodiments, the examples described below in detail and shown in the drawings are not intended to limit the present invention to a specific embodiment, but include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention.
- It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it may be directly connected or coupled to another element or intervening elements may exist. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements.
- The terms used herein are used only to describe particular embodiments and are not intended to limit the present invention. Singular expressions include plural expressions, unless the context clearly indicates otherwise. It will be further understood that the terms “include”, “have” and the like used herein is to specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude in advance the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
- In addition, the terms such as “section”, “unit”, “module” and the like stated in the specification mean a unit of processing at least a function or an operation, and they can be implemented as hardware, software or a combination of hardware and software.
- In addition, in describing with reference to the accompanying drawings, like reference symbols will be assigned to like constitutional elements regardless of drawing symbols, and duplicated descriptions thereof will be omitted. In describing the present invention, when it is determined that specific description of known techniques related to the present invention unnecessarily blurs the gist of the present invention, the detailed description will be omitted.
- Hereinafter, a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.
- First, a history management pad of a semiconductor test socket according to the present invention will be described in detail with reference to
FIGS. 1 and 2 .FIG. 1 is a view showing a semiconductor test socket provided with a history management pad of the semiconductor test socket according to the present invention,FIG. 2 is a view showing the configuration of a history management pad of a semiconductor test socket according to the present invention, andFIG. 3 is a view showing a configuration provided with a socket guide for pressing a history management pad in a semiconductor test socket according to the present invention. - As shown in
FIGS. 1 to 3 , a history management pad P of a semiconductor test socket according to the present invention is provided at an outer portion of a socket frame 200 of the semiconductor test socket provided with a socket body C (an elastic conductive sheet or a pogo pin body) for electrically contacting a lead of a device under test and a terminal of the printed circuit board of the socket, and the history management pad includes an insulative mold film member 100 provided with a plurality of conductive electrode units 110 in the thickness direction (vertical direction); an insulative mold socket frame 200 having a plurality of holes 210 formed for the lower portions (bumps) 111 of the electrode units 110 to pass through, on the top surface of which the insulative mold film member 100 is attached; a guide film means 300 formed on the top of the mold film member 100 to provide contact stability of a tracking chip 400 by resting the tracking chip 400 on the mold film member 100 while the tracking chip 400 conductively contacts with the electrode units 110 of the mold film member 100; the tracking chip 400 conductively contacting with the electrode units 110 of the mold film member 100 through the guide film means 300; and a fixing means 500 for firmly fixing the tracking chip 400 to the guide film means 300. - The socket body electrically connects a terminal of a device under test and a pad of a test device (socket printed circuit board) and may be an elastic conductive sheet having elasticity or a pogo pin body.
- However, the elastic conductive sheet is preferable since smooth contact is possible by absorbing mechanical impacts or deformation. The elastic conductive sheet like this is configured of a conductive unit, in which a plurality of conductive particles is distributed in an insulative elastic material, and an insulative supporting unit for disconnecting electrical contact with an adjacent conductive unit while supporting each conductive unit.
- Although the
mold film member 100 is preferably formed of, for example, polyimide, it is not limited thereto, and any insulative (nonconductor) material, in which theelectrode units 110 can be stably provided, can be used. - The
electrode units 110 of themold film member 100 electrically connect theballs 420 provided in thetracking chip 400 to the pad electrodes 11 provided in the socket printed circuit board 10 (seeFIG. 3 ). - Here, the
electrode unit 110 of themold film member 100 is preferably formed as an elastic electrode unit which forms a conductive path, in which a plurality of conductive particles is distributed to be arranged in the thickness direction within an insulative elastic material such as silicon. The reason that the elastic electrode unit is preferable like this is that if the top of thetracking chip 400 of the history management pad of the semiconductor test socket is pressed through a socket guide member G (seeFIG. 3 ) in association with a test operation of a device under test when the device under test is tested, theelectrode unit 110 may smoothly contact with the pad electrode while being elastically deformed. - However, if the
electrode units 110 of themold film member 100 are configured to flow current between theballs 420 of thetracking chip 400 and the pad electrodes 11 of the socket printedcircuit board 10, they are not specially limited. - In addition, the
socket frame 200 is for supporting the elastic conductive sheet or the pogo pin body and aligning the socket in a lubber socket for testing or a socket for pogo pin and is formed of a material such as stainless steel, polyimide or the like, and in the present invention, the history management pad P may be attached at an outer portion of thesocket frame 200. - Next, the guide film means 300 includes a ball
guide film member 310 in which a plurality of position compensation holes 311 is formed at the positions corresponding to theballs 420 of thetracking chip 400, and a chipguide film member 320 in which achip guide hole 321 for guiding thebody 410 of thetracking chip 400 is formed. - As the guide film means 300 including the ball
guide film member 310 and the chipguide film member 320 like this is configured, contact stability of thetracking chip 400 can be achieved. - Subsequently, the
tracking chip 400 is designed to obtain data on the information related to history management and test of the socket, such as information on the inventory and lifespan of the socket and information on the device under test, and the detailed configuration of the tracking chip may be designed through a publicized method, and detailed description thereof will be omitted to clarify the target of the present invention. - Next, a fixing means for fixing the
tracking chip 400 to theguide film member 300 is not specially limited if the fixing means is a configuration which can fix theguide film member 300 and thetracking chip 400. - For example, as shown in the figure, the fixing means may be configured as a
cover film 500 attached to cover the top surface of the tracking chip 400 (specifically, together with the top surface of the chipguide film member 320 of the guide film means 300). In addition, as another example, the fixing means may fix thetracking chip 400 by using an adhesive, silicon or the like. - The history management pad of a semiconductor test socket according to the present invention configured as described above is attached and fixed at an outer portion of the
socket frame 200 of the semiconductor test socket in which penetration holes are formed to expose theelectrode units 110 of themold film member 100 toward the bottom. - Next, a method of manufacturing a history management pad of a semiconductor test socket according to an embodiment of the present invention will be described in detail with reference to
FIGS. 4 and 5 .FIGS. 4 and 5 are views showing the manufacturing process of a history management pad of a semiconductor test socket according to an embodiment of the present invention. In the description of the manufacturing process of the history management pad of the semiconductor test socket described below, the same numerals and symbols are assigned to the elements the same as the elements described in the description of the history management pad of a semiconductor test socket, and repeated description will be omitted to simplify the description of the present invention. - As shown in
FIGS. 4 and 5 , the method of manufacturing a history management pad of a semiconductor test socket according to an embodiment of the present invention includes: a first step of forming a plurality of electrode units 110 at an outer portion of the socket frame 200 of the semiconductor test socket by attaching an insulative mold film member 100 to a socket frame 200, in which holes 210 are formed to electrically connect the balls 420 of the tracking chip 400 and the pad electrodes 11 of the socket printed circuit board (FIG. 4(a) ); a second step of attaching a ball guide film member 310, in which position compensation holes (or guide holes) 311 aligned with the electrode units 110 are formed, on the top surface of the mold film member 100; a third step of attaching the chip guide film member 320, in which a chip guide hole 321 for guiding the tracking chip 400 is formed, on the top surface of the ball guide film member 310; a fourth step of positioning the balls of the tracking chip 400 to the electrode units 110 of the mold film member 100 through the position compensation holes 311 of the ball guide film member 310, while guiding the tracking chip 400 through the chip guide hole 321 of the chip guide film member 320; and a fifth step of fixing the tracking chip 400. - The first step may be accomplished in two methods described below.
- As a first method of the first step, an insulative
mold film member 100 in which electrodeunits 110 are formed may be integrated with a socket frame 200 (FIG. 4 (a-3)) in one piece by attaching an insulativemold film member 100, in which theelectrode units 110 are formed in theholes 101 for forming the electrode units 110 (FIG. 4 (a-1)), to asocket frame 200 in which holes 210 corresponding to theelectrode units 110 are formed at an outer portion (FIG. 4 (a-1′)). - As a second method of the first step, the history management pad may be formed by providing a
mold film member 100 in which holes 101 for forming the electrode units are formed as shown inFIG. 4 (a-2) and asocket frame 200 in which holes 210 corresponding to theholes 101 for forming theelectrode units 110 are formed at an outer portion, attaching themold film member 100 and thesocket frame 200 in one piece, and filling theelectrode units 110 in theholes 101 and 210 (FIG. 4 (a-3)). - The
mold film member 100 may be formed of, for example, a polyimide material, and thesocket frame 200 may be formed of a stainless steel material. - The lower portion of the
electrode unit 110 may be formed to protrude from the bottom surface of thesocket frame 200 to some extent (i.e., to form a bump 111). - The
electrode unit 110 is preferably formed as, for example, an elastic electrode unit which forms a conductive path as a plurality of conductive particles is distributed to be arranged in the thickness direction within an insulative elastic material such as silicon. - Subsequently, the second step (the step of forming a ball guide film member), the third step (the step of forming a chip guide film member) and the fourth step (the step of installing a tracking chip) align positions of the balls of the
tracking chip 400 when thetracking chip 400 is installed and guide and stably support thetracking chip 400 to stably accomplish contact of thetracking chip 400. - Next, the fifth step is a step of fixing the
tracking chip 400, and if a method may fix the tracking chip, it is not specially limited. - For example, the fifth step may fix the tracking chip by attaching a
cover film 500 on the top of thetracking chip 400 and the chipguide film member 320, and as another example, thetracking chip 400 may be fixed using an adhesive, silicon or the like. - In addition, as still another example, a method of manufacturing a history management pad P by applying the second to fifth steps to the insulative mold film member 100 (
FIG. 4 (a-1)), in which theelectrode units 110 are formed in theholes 101 for forming theelectrode units 110 as described above, and attaching the history management pad at an outer portion of thesocket frame 200 is also possible. According to the embodiment like this, since the history management pad P may be manufactured in advance, an effect of enhancing work productivity may be obtained. - The present invention as described above may obtain accurate data by managing history such as lifespan management and inventory management of the socket, information on the device under test, identification of the position and the like, and has an advantage of preventing a device under test of a good quality from being treated as a defective one due to the socket, by accurately determining a time for replacing the socket.
- In addition, the present invention is advantageous in that production yield is not be affected by estimating an accurate time for replacing a socket and replacing the socket at an idle time.
- The embodiments described in this specification and the attached drawings merely illustrate part of the technical spirit included in the present invention. Accordingly, since the embodiments disclosed in this specification are intended not to limit, but to describe the spirit of the present invention, it is apparent that the scope of the technical spirit of the present invention is not limited by the embodiments. It should be interpreted that all modifications and specific embodiments, which can be easily inferred by those skilled in the art within the scope of the technical spirit included in the specification and drawings of the present invention, are included in the scope of the present invention.
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170167278A KR101879806B1 (en) | 2017-12-07 | 2017-12-07 | Pad for managing history of semiconductor test socket, manufacturing method thereof and semiconductor test device including the same |
KR10-2017-0167278 | 2017-12-07 | ||
PCT/KR2018/008285 WO2019112134A1 (en) | 2017-12-07 | 2018-07-23 | History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management pad |
Publications (2)
Publication Number | Publication Date |
---|---|
US10718809B1 US10718809B1 (en) | 2020-07-21 |
US20200233029A1 true US20200233029A1 (en) | 2020-07-23 |
Family
ID=63049333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/633,375 Active US10718809B1 (en) | 2017-12-07 | 2018-07-23 | History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management pad |
Country Status (5)
Country | Link |
---|---|
US (1) | US10718809B1 (en) |
KR (1) | KR101879806B1 (en) |
CN (1) | CN110799848B (en) |
TW (1) | TWI688779B (en) |
WO (1) | WO2019112134A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102132821B1 (en) * | 2018-11-09 | 2020-07-13 | 주식회사 아이에스시 | Id chip socket for test connector assembly, test connector assembly comprising the same and test device set |
US11047905B2 (en) * | 2019-05-31 | 2021-06-29 | Analog Devices International Unlimited Company | Contactor with integrated memory |
KR102187265B1 (en) * | 2019-09-06 | 2020-12-04 | (주)마이크로컨텍솔루션 | Test socket |
CN110726917B (en) * | 2019-09-25 | 2022-04-05 | 苏州韬盛电子科技有限公司 | Semiconductor test socket with hybrid coaxial structure and preparation method thereof |
KR102089653B1 (en) * | 2019-12-30 | 2020-03-16 | 신종천 | Test socket assembly |
KR102466458B1 (en) | 2021-10-08 | 2022-11-14 | (주)마이크로컨텍솔루션 | Test socket |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051568A (en) * | 2001-08-08 | 2003-02-21 | Nec Corp | Semiconductor device |
KR20040054904A (en) * | 2002-12-18 | 2004-06-26 | (주)티에스이 | Socket and managing system for test results of semiconductor device using the socket |
US20060028327A1 (en) * | 2004-08-09 | 2006-02-09 | Delbert Amis | Wireless replication, verification, and tracking apparatus and methods for towed vehicles |
KR100555714B1 (en) * | 2004-09-09 | 2006-03-03 | 정운영 | Method for manufacturing a contact guide film in an inspection socket for semiconductor package |
KR100843202B1 (en) * | 2006-09-06 | 2008-07-02 | 삼성전자주식회사 | Semiconductor package having test pad on both side of substrate and method for testing thereof |
KR20110048956A (en) * | 2009-11-04 | 2011-05-12 | 앰코 테크놀로지 코리아 주식회사 | Test socket embedded rfid tag |
KR101798440B1 (en) * | 2011-03-08 | 2017-11-16 | 삼성전자주식회사 | An apparatus for testing a semiconductor device and a method of testing a semiconductor device |
CN202145214U (en) * | 2011-06-30 | 2012-02-15 | 上海韬盛电子科技有限公司 | Semiconductor chip test socket based on Kelvin principle |
KR101437092B1 (en) * | 2013-09-30 | 2014-09-03 | 주식회사 엔티에스 | Semiconductor chip testing device |
US20180188290A1 (en) * | 2015-07-03 | 2018-07-05 | Okins Electronics Co.,Ltd | Test socket, test socket manufacturing method, and jig assembly for test socket |
KR101682230B1 (en) * | 2015-08-04 | 2016-12-02 | 주식회사 아이에스시 | Socket for electrical test |
CN105327492B (en) * | 2015-08-26 | 2017-12-08 | 深圳市酷浪云计算有限公司 | Somatosensory device |
CN205049698U (en) * | 2015-09-14 | 2016-02-24 | 安拓锐高新测试技术(苏州)有限公司 | Test fixture based on two -sided pin array semiconductor chip |
CN205139319U (en) * | 2015-11-27 | 2016-04-06 | 法特迪精密科技(苏州)有限公司 | Heavy current semiconductor test seat |
CN105589025B (en) * | 2016-03-08 | 2018-06-12 | 江苏福田电气有限公司 | A kind of BGA package test jack |
KR102132821B1 (en) * | 2018-11-09 | 2020-07-13 | 주식회사 아이에스시 | Id chip socket for test connector assembly, test connector assembly comprising the same and test device set |
-
2017
- 2017-12-07 KR KR1020170167278A patent/KR101879806B1/en active IP Right Grant
-
2018
- 2018-07-23 WO PCT/KR2018/008285 patent/WO2019112134A1/en active Application Filing
- 2018-07-23 US US16/633,375 patent/US10718809B1/en active Active
- 2018-07-23 CN CN201880042852.3A patent/CN110799848B/en active Active
- 2018-08-14 TW TW107128290A patent/TWI688779B/en active
Also Published As
Publication number | Publication date |
---|---|
KR101879806B1 (en) | 2018-07-18 |
WO2019112134A1 (en) | 2019-06-13 |
TW201925802A (en) | 2019-07-01 |
US10718809B1 (en) | 2020-07-21 |
TWI688779B (en) | 2020-03-21 |
CN110799848A (en) | 2020-02-14 |
CN110799848B (en) | 2020-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10718809B1 (en) | History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management pad | |
US10184956B2 (en) | Probe card | |
KR100681772B1 (en) | Method and apparatus for testing semiconductor devices | |
US5523586A (en) | Burn-in socket used in a burn-in test for semiconductor chips | |
JP2000292485A (en) | Socket for electrical inspection of bag package and inspection method employing it | |
US20060125501A1 (en) | Modularized probe head | |
CN109585317B (en) | Test equipment and test method | |
JP2007071699A (en) | Perpendicular type probe card | |
US7102372B2 (en) | Apparatus and method for testing conductive bumps | |
US11784100B2 (en) | Method of manufacturing a molded flip chip package to facilitate electrical testing | |
US20080265920A1 (en) | Probe card | |
CN212391574U (en) | Testing device | |
KR101399542B1 (en) | Probe card | |
KR101260409B1 (en) | Probe card and Semiconductor device test socket | |
US7061261B2 (en) | Semiconductor inspection device and method for manufacturing contact probe | |
JP2011038930A (en) | Probe card and test method of device to be inspected | |
US11209462B1 (en) | Testing apparatus | |
KR100955493B1 (en) | The probe block structure of probe card for semiconducter testing apparatus | |
KR100890190B1 (en) | Method of manufacturing probe card | |
TW201350862A (en) | Film type probe card | |
JP2000340709A (en) | Semiconductor device and manufacture thereof | |
KR20090000862A (en) | Probe card for high frequency |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: TSE CO.,LTD, KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIM, BO HYUN;LEE, YOON HYEONG;REEL/FRAME:051599/0060 Effective date: 20191230 |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
RF | Reissue application filed |
Effective date: 20220105 |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |