KR100555714B1 - Method for manufacturing a contact guide film in an inspection socket for semiconductor package - Google Patents

Abstract

The present invention provides a plate-like film with a hard insulating resin; Forming a plurality of through holes in the insulating resin film; Placing a transparent flexible film on one surface of the insulating resin film, and filling a plurality of through holes by pushing a conductive paste on the other surface; After confirming that the conductive paste is filled from all the through holes through the transparent flexible film, the filling of the conductive paste is stopped; And removing the conductive paste and the transparent flexible film on both surfaces of the insulating resin film, thereby providing a method of manufacturing a contact guide film for a socket for semiconductor package inspection. According to the present invention, it is possible to manufacture a contact guide film for use in a test socket of a semiconductor device, which greatly improves the reliability of electrical properties, and in particular, to reduce the contamination of the use of the contact guide film, easy to clean even if contamination occurs And recycling is possible.

Contact Guide Film, Electrical Contact, Conductive Rubber, BGA Package

Description

Manufacturing method of contact guide film of socket for semiconductor package inspection {METHOD FOR MANUFACTURING A CONTACT GUIDE FILM IN AN INSPECTION SOCKET FOR SEMICONDUCTOR PACKAGE}

1 is a cross-sectional view showing an example of a socket for inspecting a semiconductor package using pogo pins.

2 is a cross-sectional view showing an example of a semiconductor package inspection socket using a conductive rubber.

3 is a cross-sectional view of a socket for a semiconductor package inspection in which the contact guide film of the present invention is used.

4 is a plan view showing an example of a contact guide film.

5 is a cross-sectional view illustrating a semiconductor package in contact with a contact guide film.

6 is an enlarged partial view of FIG. 5.

7A to 7F are process drawings illustrating a method of manufacturing a contact guide film according to the present invention.

8 is a cross-sectional view showing a contact guide film according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: PCB substrate 102: electrode terminal

110: lower frame 120: upper frame

130: contact guide film 133: through-hole

134: conductive rubber 135: transparent flexible film

136: conductive paste 138: conductive member

The present invention relates to a socket for inspecting a semiconductor package. More particularly, the present invention relates to a socket for inspecting a semiconductor package, and more specifically, to inspecting a multi-pinned semiconductor package such as a ball grid array (BGA) package having a plurality of external terminals. The present invention relates to a method for manufacturing a socket for inspecting a BGA package in which an insulating film is filled with a conductive rubber so that terminals can be reliably contacted to prevent inspection defects caused by poor contact.

There is an increasing demand in the industrial market for providing semiconductor devices having the characteristics of multifunction, high speed operation and low power consumption. Accordingly, in the semiconductor device having a patch form, a plurality of external terminals having a ball shape are formed on the lower surface of the body rather than a QFP form in which the external terminals protrude outward from the side of the body.

A semiconductor device manufactured through a complicated process is inspected for characteristics and defective states through various electrical tests. At this time, the socket is used to electrically connect the test circuit of the test printed circuit board installed in the test equipment and the external terminal of the device under test. That is, in the test of the semiconductor device, the socket serves as an interface for electrically connecting the printed circuit of the test equipment and the semiconductor device. In general, the test socket is a conductive contact terminal that serves to electrically connect the external terminal of the device under test and the test circuit of the test device, the contact terminals are fixedly arranged at regular intervals, and the contact terminals are deformed. Or an insulating body supporting the contact terminals to protect it from external physical shocks. As the body, plastic or ceramics is generally used.

On the other hand, according to the trend that the package form is changed to BGA, the inspection device for inspecting the electrical characteristics of the package is being changed to a suitable form, for example, there is an electrical connection with the inspection device and the package to be inspected is mounted. In addition, a socket that can be dismantled has been developed and proposed in various forms.

1 is a longitudinal cross-sectional view illustrating an example of a socket for inspecting a semiconductor package, and illustrates an example of using a pogo pin as a means for connecting a metal pattern on a PCB and an external terminal of the semiconductor package.

As shown in the drawing, in the conventional semiconductor package inspection socket, a cover (not shown) is coupled to the upper side of the socket body 1 so as to be replicable, and the package 3 to be inspected on the upper surface of the body 1. The package seating portion 4 is formed thereon, and the bottom of the package seating portion 4 is electrically connected between the terminal 3a of the package 3 and the contact pad 5a of the test board 5. Pogo pins 6 are provided to make the connection.

The pogo pin 6 has a tubular pin body 11, an upper contactor 12 made of a metal body coupled to an upper side of the pin body 11 and coupled to a terminal 3a of the package 3. A lower contactor 13 made of a metal body coupled to a lower side of the pin body 11 to be in contact with the contact pad 5a of the test board 5, and an upper end contacting the upper contactor 12, The upper contactor 12 is contacted with the terminal 3a of the package 3 and the lower contactor 13 is tested by being disposed inside the pin body 11 so that the lower end contacts the contactor 13. It is composed of a coil spring 14 for resilient contact when in contact with the contact pad 5a of the board 5.

When the semiconductor package is inspected using the conventional semiconductor package inspection socket 20 configured as described above, a cover (not shown) of the socket 20 is opened and a package seating portion formed on the upper surface of the socket body 1. After mounting the package 3 to be inspected inside (4), the lid (not shown) is closed again.

When the cover (not shown) is closed as described above, the terminal 3a of the package 3 seated on the package seating part 4, the pogo pin 6, and the contact pad 5a of the test board 5 come into contact with each other. The electrical connection is established, and in that state the electrical characteristics are tested.

However, as described above, the socket 20 having a form of electrical connection by the conventional pogo pin 6 is electrically connected between the terminal 3a of the package 3 and the contact pad 5a of the test board 5. The contact with which the contact is made is between the terminal 3a of the package 3 and the upper end of the upper contactor 12 of the pogo pin 6 during the inspection, between the lower end of the upper contactor 12 and the upper end of the coil spring 14. , Between the lower end of the coil spring 14 and the upper end of the lower contactor 13, between the lower end of the lower contactor 13 and the contact pad 5a of the test board 5, there are too many contacts. As a result, the impedance is unstable, and there is a problem in that the high frequency characteristics are not good, thereby reducing the reliability of the test.

FIG. 2 is a longitudinal sectional view showing another example of a socket for semiconductor package inspection, and is a means for connecting between an external terminal of a semiconductor package and a metal pattern on a PCB. A plurality of through holes are formed in an insulating film, and the through holes are conductive. An example using a contact guide film filled with rubber is shown.

As shown in the drawing, the contact guide film 60 using the conventional conductive rubber 52 has a plurality of through holes 51a formed in the insulating plate 51 made of silicon rubber so as to penetrate upward and downward. The through hole 51a is filled with the conductive rubber 52 and bonded to each other. The upper surface of the conductive rubber 52 is in contact with the terminal 3a of the package 3 during the inspection, and the lower surface of the test board 5 In contact with the contact pad 5a, electrical contact is made.

However, when the contact guide film 60 using the conventional conductive rubber 52 is used as a BGA socket, when the number of balls, which are BGA external terminals, increases, for example, when 300 or more, a plurality of conductive rubbers are used. It was very difficult to fill all of the fine holes in. This results in a partial electrical short, thus deteriorating the electrical characteristics of the socket and making it difficult to test reliable devices due to high defects in testing of semiconductor devices.

In addition, when silicon rubber is used as the insulating plate, and a plurality of holes are formed on the insulating plate to fill the holes with the conductive rubber, contamination between the silicon rubber and the conductive rubber causes a problem of leakage current.

Therefore, there is an urgent need for the development of a contact guide film that can ensure the reliability of electrical characteristics and easily solve the contamination problem in a test socket of a semiconductor device.

Accordingly, an object of the present invention is to provide a new manufacturing method that can ensure the reliability of the electrical properties of the contact guide film used in the test socket of the semiconductor device.

In addition, another object of the present invention is to reduce the contamination of the contact guide film, and to provide a new contact guide film that can be easily recycled even if contamination occurs.

In order to achieve the above object, the present invention provides a plate-like film of a hard insulating resin; Forming a plurality of through holes in the insulating resin film; Placing a transparent flexible film on one surface of the insulating resin film, and filling a plurality of through holes by pushing a conductive paste on the other surface; After confirming that the conductive paste is filled from all the through holes through the transparent flexible film, the filling of the conductive paste is stopped; And removing the conductive paste and the transparent flexible film on both surfaces of the insulating resin film, thereby providing a method of manufacturing a contact guide film for a socket for semiconductor package inspection.

Glass epoxy is used as the insulating resin in the preferred embodiment of the present invention. However, the present invention is not limited thereto, and other materials having rigid insulation properties may be used. In addition, the transparent flexible film is preferably transparent vinyl, and other materials that are easy to attach and remove and have transparency may be used.

On the other hand, the conductive paste used a silicone rubber, but other materials having conductivity may be used. The conductive paste may further include a metal powder for improving conductivity to reduce contact resistance.

The through hole is formed in the same pitch as the pitch of the external electrode terminal of the semiconductor device to be inspected, the diameter is preferably formed larger than the external electrode terminal. In addition, the method may further include forming a conductive ball under the through hole.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. First, the contact guide film of the present invention will be described with reference to FIGS. 3 to 6.

3 is a side cross-sectional view of a test socket of a semiconductor device (ie, a semiconductor package) in which a contact guide film according to the present invention is used. The test socket is composed of a lower frame 110 mounted on the PCB substrate 100 with fixing bolts 112 and an upper frame 120 fastened by the fixing bolts 122 on the lower frame. An opening is formed in the center of the lower frame to allow electrical contact with the PCB substrate, and the contact guide film 130 is placed on the opening. In FIG. 3, the PCB substrate 100 and the contact guide film 130 are spaced apart from each other, but there is a lot of space. However, in actual testing, the PCB substrate 100 and the contact guide film 130 are in a physical contact state.

The contact guide film 130 is preferably located in the center of the lower frame 110 to be freely removable. For example, in order to remove contaminants on the contact guide film or to replace a separate contact guide film corresponding to the external terminal shape of each semiconductor device, it is not preferable that the contact guide film is completely fixed to the lower frame. However, in order to secure the reliability of the contact state, it may be possible to partially fix it so that the position is not changed by the guide groove.

It can be seen that the pressing plate 124 is mounted at the center of the upper frame 120. The press plate 124 is a semiconductor device (not shown) is mounted on the contact guide film 130 in the center of the lower frame 110, and then serves to fix the semiconductor device on the upper portion of the semiconductor device and a certain level of Pressure is applied to facilitate contact between the semiconductor device and the contact guide film.

Referring to FIG. 4, the shape of the contact guide film may be confirmed in more detail. The contact guide film 130 is preferably formed of a hard insulating material. The thickness is determined according to the shape of the semiconductor device to be tested and the arrangement, size, etc. of external terminals (balls), and a thin film as possible is preferable. It can be seen that the opening 131 is formed in the center on the contact guide film. Such an opening is not necessarily required, and its shape may vary depending on the arrangement of the external terminals of the semiconductor device under test. It can be seen that a plurality of through holes 133 are formed around the opening 131. The through hole 131 is determined in size, number, and arrangement form according to the arrangement of external terminals of the semiconductor device under test. For example, when the ball size, which is an external terminal of the BGA device to be tested, has a pitch of 1.0 mm between pitches and a ball diameter of 0.7 mm, the pitch of the through hole 131 formed in the contact guide film is 1.0 mm. It is desirable to form the diameter slightly larger than 0.7 mm and about 0.8 mm.

Glass epoxy is used in the embodiment of the present invention as a hard insulating film material, but the present invention is not limited thereto, and other materials may be used as long as the material has a certain degree of hardness and little deformation.

After preparing the insulating film, flattening of the upper and lower surfaces (ie, polishing) can be performed. This flattening operation makes the electrical connection uniform in contact with the semiconductor element, and in subsequent conductive rubber filling operations, the conductive rubber is uniformly filled in all the through holes.

In Figure 4 it can be seen that the groove 132 is formed around the edge of the contact guide film. Such grooves allow the contact guide film to be combined with a protrusion (not shown) on the lower frame (or PCB) to serve as a guide when mounting the contact guide film, and to fix the position on a horizontal plane. Improves the electrical contact reliability.

5 illustrates a state in which the BGA package 140 is positioned on the contact guide film 130 as the semiconductor device under test. A plurality of balls are formed on the bottom surface of the BGA package as the external terminal 142, and a through hole forming part 133 ′ is formed on the contact guide film at a position corresponding to the external terminal.

FIG. 6 is an enlarged view of part 'A' of FIG. 5, and as shown, the BGA package 140, the contact guide film 130, and the PCB substrate 100 are vertically corresponding to each other. . The lower surface of the BGA package 140 corresponds to the conductive rubber 134 filled in the through hole on the contact guide film 130 at the bottom of the conductive ball, which is an external terminal 142, the conductive rubber 134 is a contact guide The electrode pads 102 on the PCB substrate 100 positioned below the film 130 correspond to each other. Therefore, as a result, the external terminal 142 and the electrode pad 102 are electrically connected.

Next, the manufacturing method of the contact guide film of this invention is demonstrated with reference to FIGS. 7A-7F.

According to FIG. 7A, a thin plate-like contact guide film 130 is shown. An opening 131 is formed through the top and bottom of the film. However, the opening 131 is not essential, and the shape thereof may also be changed as described above.

Next, as shown in FIG. 7B, a plurality of through holes 133 are formed at predetermined positions of the contact guide film 130. Known drilling methods may be used to form the through hole 133. It is desirable that the larger the number of through holes and the smaller the diameter, the more precise the formation using an automated device.

After forming the through hole 133, as shown in FIG. 7C, the transparent flexible film 135 is positioned below the contact guide film 130. Although not necessarily required, a slight adhesive (eg, a solid paste for stationery) may be applied to the flexible film 135 for uniform contact and attached to the contact guide film 130. However, it is better to avoid the use of adhesives that are too strong to facilitate subsequent removal.

Next, as shown in FIG. 7D, the conductive paste 136 is applied to the through hole 133 on the contact guide film 130. The conductive paste 136 is prepared by pasting an electrically conductive material, and in the embodiment of the present invention, a conductive silicone rubber is used. In order to enhance conductivity, it is preferable to prepare a paste by adding a metal powder having excellent electrical conductivity.

The conductive paste is pushed into the through hole 133 on the contact guide film 130 using a spatula or pressing member (not shown). Although small amounts of contact guide film can be made by hand, using automated equipment for high volume production will improve productivity. In addition, a series of processes for preparing a thin plate-shaped contact guide film, forming a plurality of through holes, and injecting a conductive paste into the through holes may be performed in a continuous process.

7E schematically illustrates a state in which the conductive paste 136 is filled in the through hole 133. In this case, the conductive paste 136 completely fills the through holes 133, and confirms that the conductive paste has escaped to the transparent flexible film 135 on the lower surface of the contact guide film 130. When the conductive paste is filled, the injection of the conductive paste is stopped.

After a certain period of time, when the conductive paste is hardened, the conductive paste 136 and the transparent flexible film 135 deposited on the upper and lower surfaces of the contact guide film are removed using a sharp tool. 7F shows the finally prepared contact guide film. The contact guide film formed by such a manufacturing method fills the paste while confirming that the conductive paste is filled in the through hole through the transparent flexible film, so that even if the contact guide film has a large number of through holes, the defect rate can be nearly zero. have. In addition, as a result of several repeated processes, it was confirmed that the conductive paste was completely filled in all the through holes of the contact guide film. In addition, as a result of the electrical property test of the BGA device it was confirmed that the contact guide film has 100% conductivity.

The test socket having a contact guide film according to the present invention forms a barrier wall between conductive rubbers filled with a plurality of through-holes formed with a hard insulating film therein, so that contamination is not easily transmitted, and even if the contamination is washed with a cleaning agent. It has the advantage of being renewable.

On the other hand, the contact guide film according to the present invention may further include a separate electrical contact means on the lower surface of the through hole filled with the conductive rubber. FIG. 8 illustrates another embodiment of the present invention, in which the conductive member 138 having excellent ball conductivity is mounted on the lower surface of the conductive rubber 134 formed in the contact guide film 130. have. The metal member may be a lead ball coated with gold or silver, or a metal ball formed of a metal having good electrical conductivity. In this type of contact guide film, conductive rubber is interposed between the upper surface of the contact guide film and the ball, which is an external terminal of the BGA element, and the lower surface of the contact guide film is in contact with the electrode pad of the PCB substrate, thereby providing the BGA. It will be possible to further improve the electrical contact reliability when testing the device.

In the above, the present invention has been described through the preferred embodiment, but various modifications and improvements of the present invention will be possible without departing from the scope of the technical idea according to the following claims.

According to the present invention, it is possible to manufacture a contact guide film for use in a test socket of a semiconductor device that greatly improves the reliability of electrical characteristics. Such a contact guide film is not only easy to manufacture, but also can be mass-produced at a low cost, and in particular, can reduce contamination in use of the contact guide film, and can be easily cleaned and recycled even when contamination occurs.

Claims (7)

A plate-like film is prepared from a hard insulating resin; Forming a plurality of through holes in the insulating resin film; Placing a transparent flexible film on one surface of the insulating resin film, and filling a plurality of through holes by pushing a conductive paste on the other surface; After confirming that the conductive paste is filled from all the through holes through the transparent flexible film, the filling of the conductive paste is stopped; And And removing the conductive paste and the transparent flexible film on both surfaces of the insulating resin film. Method of manufacturing a contact guide film for a socket for semiconductor package inspection. The method of claim 1, wherein the insulating resin is glass epoxy. The method of claim 1, wherein the transparent flexible film is transparent vinyl. The method of claim 1, wherein the conductive paste is a silicone rubber paste. The method of claim 4, wherein the conductive paste further comprises a metal powder. The method of claim 1, wherein the through hole is formed of the same pitch as the pitch of the external electrode terminal of the semiconductor device to be inspected, the diameter of the contact guide film manufacturing of the socket for semiconductor package inspection, characterized in that formed larger than the external electrode terminal. Way. The method of claim 1, further comprising forming a conductive ball in a lower portion of the through hole.

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