US20200211848A1 - Semiconductor structure providing for an increased pattern density on a substrate and method for forming same - Google Patents
Semiconductor structure providing for an increased pattern density on a substrate and method for forming same Download PDFInfo
- Publication number
- US20200211848A1 US20200211848A1 US16/542,563 US201916542563A US2020211848A1 US 20200211848 A1 US20200211848 A1 US 20200211848A1 US 201916542563 A US201916542563 A US 201916542563A US 2020211848 A1 US2020211848 A1 US 2020211848A1
- Authority
- US
- United States
- Prior art keywords
- sidewall
- layer
- forming
- region
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 134
- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 title claims description 22
- 239000010410 layer Substances 0.000 claims abstract description 203
- 239000012792 core layer Substances 0.000 claims abstract description 170
- 239000011162 core material Substances 0.000 claims abstract description 79
- 238000000059 patterning Methods 0.000 claims abstract description 24
- 238000005530 etching Methods 0.000 claims description 87
- 230000008569 process Effects 0.000 claims description 80
- 239000000463 material Substances 0.000 claims description 66
- 125000006850 spacer group Chemical group 0.000 claims description 43
- 239000011241 protective layer Substances 0.000 claims description 33
- 229920002120 photoresistant polymer Polymers 0.000 claims description 16
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 15
- 239000006117 anti-reflective coating Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 7
- 229910017817 a-Ge Inorganic materials 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229910004541 SiN Inorganic materials 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- -1 a-C Inorganic materials 0.000 claims 1
- 230000001131 transforming effect Effects 0.000 claims 1
- 239000011295 pitch Substances 0.000 abstract description 62
- 238000000206 photolithography Methods 0.000 description 9
- 238000000231 atomic layer deposition Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 6
- 238000004380 ashing Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 240000002329 Inga feuillei Species 0.000 description 1
- LKJPSUCKSLORMF-UHFFFAOYSA-N Monolinuron Chemical compound CON(C)C(=O)NC1=CC=C(Cl)C=C1 LKJPSUCKSLORMF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823431—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0335—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0338—Process specially adapted to improve the resolution of the mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823412—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/0886—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate including transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1037—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure and non-planar channel
Definitions
- Embodiments and implementations of the present disclosure relate to the field of semiconductor manufacturing, and in particular, to a semiconductor structure and a method for forming the same.
- a photolithography technology is a common patterning method, and is the most crucial production technology in a semiconductor manufacturing process.
- SADP self-aligned double patterning
- the method can increase the density of patterns formed on a substrate, to further shorten a pitch between neighboring two patterns, so that a photolithography process overcomes limits of the photolithography resolution.
- a self-aligned quadruple patterning (SAQP) method emerges.
- the density of the patterns formed on the substrate using the SADP method is double the density of patterns formed on the substrate using the photolithography process, that is, a 1 ⁇ 2 smallest pitch (1 ⁇ 2 pitch) may be obtained.
- the density of the patterns formed on the substrate using the SAQP method is quadruple the density of the patterns formed on the substrate using the photolithography process. That is, a 1 ⁇ 4 smallest pitch (1 ⁇ 4 pitch) may be obtained, thereby significantly improving the density of integrated circuits of the semiconductor, and shortening the CDs of the patterns, to further help improve the device performance.
- the problem to be addressed in embodiments and implementations of the present disclosure is to provide a semiconductor structure and a method for forming same, to meet the requirement of different pitches of target patterns.
- the method may include: providing a base, used to form target patterns, where the base includes a first region and a second region, and a pitch between target patterns formed on the first region is greater than a pitch between target patterns formed on the second region; forming a bottom core material layer on the base; forming a plurality of discrete first core layers on the bottom core material layer; forming a first mask sidewall on a sidewall of the first core layer of the first region, and forming a second mask sidewall on a sidewall of the first core layer of the second region, where a thickness of the second mask sidewall is greater than a thickness of the first mask sidewall; removing the first core layers; after the first core layers are removed, patterning the bottom core material layer by using the first mask sidewall and the second mask sidewall as masks, to form a plurality of discrete second core layers; removing the first mask sidewall and the second mask sidewall; after the first mask side
- the semiconductor structure may include: a substrate and a plurality of discrete fins protruding out of the substrate, where the substrate includes a core region and a peripheral region, and a pitch between fins located in the peripheral region is greater than a pitch between fins located in the core region.
- a first mask sidewall is formed on the sidewall of the first core layer of the first region, and a second mask sidewall is formed on the sidewall of the first core layer of the second region, where the thickness of the second mask sidewall is greater than the thickness of the first mask sidewall.
- the bottom core material layer is patterned using the first mask sidewall and the second mask sidewall as masks, to form a second core layer, and then, a third mask sidewall is formed on the sidewall of the second core layer, and used as a mask for patterning the base to form target patterns.
- Patterns are transferred to the second core layer through the first mask sidewall and the second mask sidewall, the third mask sidewall is formed on the sidewall of the second core layer, and the patterns are transferred to the base through the third mask sidewall, to form the target patterns. Therefore, the first mask sidewall and the second mask sidewall are used to define the spacer between neighboring target patterns, the thickness of the second mask sidewall is greater than the thickness of the first mask sidewall, and the spacer between the target patterns of the second region is correspondingly greater than the spacer between the target patterns of the first region, so that the pitch between the target patterns of the second region is greater than the pitch between the target patterns of the first region, to meet the requirement of different pitches of the target patterns.
- the formed target patterns are fins
- the first region is a core region
- the second region is a peripheral region.
- the core region is used to form a core device
- the peripheral region is used to form an input/output device (TO device)
- the thickness of a gate dielectric layer of the IO device is usually greater than the thickness of a gate dielectric layer of the core device.
- the pitch between the fins of the second region is made to be greater than the pitch between the fins of the first region, to provide sufficient space for forming the gate dielectric layer corresponding to the IO device.
- the pitch between the fins of the first region is still relatively small, to save the area, and avoid affecting the improvement of the device integration.
- FIG. 1 to FIG. 15 are schematic structural diagrams corresponding to steps in one form of a method for forming a semiconductor structure
- FIG. 16 to FIG. 20 are schematic structural diagrams corresponding to steps in another form of a method for forming a semiconductor structure.
- FIG. 21 is a schematic structural diagram of one form of a semiconductor structure.
- an SAQP method is usually selected to form target patterns, so that the target patterns can obtain a 1 ⁇ 4 pitch on a premise of not changing the current photolithography technology.
- the SAQP method can reduce the pitch between the target patterns, the pitches between the target patterns are equal, and the requirement of different pitches of regions cannot be met.
- a first mask sidewall is formed on the sidewall of the first core layer of the first region, and a second mask sidewall is formed on the sidewall of the first core layer of the second region, where the thickness of the second mask sidewall is greater than the thickness of the first mask sidewall.
- the bottom core material layer is patterned using the first mask sidewall and the second mask sidewall as masks, to form a second core layer, and then, a third mask sidewall is formed on the sidewall of the second core layer, and used as a mask for patterning the base to form target patterns.
- Patterns are transferred to the second core layer using the first mask sidewall and the second mask sidewall, the third mask sidewall is formed on the sidewall of the second core layer, and the patterns are transferred to the base using the third mask sidewall, to form the target patterns.
- the first mask sidewall and the second mask sidewall are used to define the spacer between neighboring target patterns, the thickness of the second mask sidewall is greater than the thickness of the first mask sidewall, and the spacer between the target patterns of the second region is correspondingly greater than the spacer between the target patterns of the first region, so that the pitch between the target patterns of the second region is greater than the pitch between the target patterns of the first region, to meet the requirement of different pitches of the target patterns.
- FIG. 1 to FIG. 15 are schematic structural diagrams corresponding to steps in one form of a method for forming a semiconductor structure.
- a base 100 is provided, used to form target patterns, where the base 100 includes a first region 100 a and a second region 100 b, and the pitch between the target patterns formed on the first region 100 a is greater than the pitch between the target patterns formed on the second region 100 b.
- the base 100 is used to form a substrate and fins located on the substrate, that is, the formed target patterns are the fins.
- the material of the base 100 is Si.
- the material of the base may also be another material such as Ge, SiGe, SiC, GaAs, or InGa.
- the base may also be a base of another type, such as a Si base on an insulator or a Ge base on an insulator.
- the base may further include a first semiconductor layer and a second semiconductor layer epitaxially growing on the first semiconductor layer, where the first semiconductor layer is used to provide a process foundation for subsequently forming the substrate, and the second semiconductor layer is used to provide a process foundation for subsequently forming the fins.
- the base may further include other to-be-etched functional layers, for example, a gate material layer.
- the base 100 includes a first region 100 a and a second region 100 b, and the pitch between target patterns subsequently formed on the first region 100 a is greater than the pitch between the target patterns formed on the second region 100 b.
- the first region 100 a is a core region
- the second region 100 b is a peripheral region, that is, the first region 100 a is used to form a core device
- the second region 100 b is used to form an IO device.
- the core device mainly refers to a device used inside a chip, and usually uses a relatively low voltage (which is generally 1.0 V, 1.2 V, 1.5 V, or 1.8 V).
- the IO device is a device used when the chip interacts with an external interface.
- the working voltage of such a device is generally relatively high, and depends on a compatible working voltage (which is generally 1.8 V, 2.5 V, 3.3 V, or 5V) of the external interface.
- the first region and the second region may also be used to form other types of devices, and the device types may also be the same.
- a pad oxide layer 110 is formed on the base 100 ; and a lapping stopping layer 125 is formed on the pad oxide layer 110 .
- the top of the lapping stopping layer 125 is used to define a stopping position of the lapping process.
- the material of the lapping stopping layer 125 is SiN.
- the pad oxide layer 110 is used to provide a cushioning effect in forming of the lapping stopping layer 125 , to avoid a dislocation problem caused when the lapping stopping layer 125 is directly formed on the base 100 .
- the material of the pad oxidation layer 110 is SiO.
- a bottom core material layer 205 is formed on the lapping stopping layer 125 .
- the bottom core material layer 205 is used to provide a process foundation for subsequently forming a second core layer.
- a third mask sidewall subsequently formed on a sidewall of the second core layer is used as a mask for patterning the base 100 .
- the bottom core material layer 205 is an easily removed material, and the process of removing the second core layer does less damage to other film layers.
- the material of the bottom core material layer 205 is a-Si.
- a-Si is a core layer material commonly used in an SAQP process.
- the material of the bottom core material layer is SiN.
- the material of the bottom core material layer may also be a-C, a-Ge, SiO, SiON, CN, Poly-Si, SiC, SiCN, SiOCN, or an organic dielectric layer (ODL) material.
- the method further includes: before the bottom core material layer 205 is formed, forming a first etching stopping layer 130 on the lapping stopping layer 125 .
- the third mask sidewall subsequently formed on the sidewall of the second core layer is formed using a process combining deposition and etching, and the top face of the first etching stopping layer 130 is used to define the stopping position of the etching process, to avoid causing an overetching problem, thereby reducing the probability of the height inconsistency problem of the top faces of to-be-etched film layers below the stopping position, so that the height and the morphology of the subsequently formed target patterns can meet the process requirement.
- the material of the first etching stopping layer 130 is SiO. In other implementations, the material may also be SiN or SiON.
- a plurality of discrete first core layers 300 is formed on the bottom core material layer 205 .
- the first core layer 300 is used to provide a process foundation for subsequently forming the first mask sidewall and the second mask sidewall. Subsequently, the first mask sidewall is formed on the sidewall of the first core layer 300 of the first region 100 a, and used to define the spacer between the target patterns formed on the first region 100 a. The second mask sidewall is formed on the sidewall of the first core layer 300 of the second region 100 b, and used to define the spacer between the target patterns formed on the second region 100 b.
- the first core layer 300 is further removed. Therefore, the first core layer 300 is an easily removed material, and the process of removing the first core layer 300 does less damage to other film layers.
- the material of the first core layer 300 is a-Si.
- the material of the bottom core material layer is SiN.
- the material of the bottom core material layer may also be a-C, a-Ge, SiO, SiON, CN, Poly-Si, SiC, SiCN, SiOCN, or an ODL material.
- the first core layers 300 have a first preset pitch, and the target patterns subsequently formed in the same region have a second preset pitch.
- the target patterns can obtain the 1 ⁇ 4 pitch on the premise of not changing the current photolithography technology. Therefore, in the same region, the first preset pitch is quadruple of the second preset pitch. That is, in the first region 100 a, the first preset pitch P 1 (as shown in FIG. 3 ) of the first core layers 300 is quadruple of the second preset pitch of the target patterns. In the second region 100 b, the first preset pitch P 2 (as shown in FIG. 3 ) of the first core layers 300 is quadruple of the second preset pitch of the target patterns.
- the first core layer 300 has a first preset width
- the target pattern has a second preset width.
- the first mask sidewall is used to define the spacer between the target patterns on the first region 100 a
- the second mask sidewall is used to define the spacer between the target patterns on the second region 100 b
- the first mask sidewall and the second mask sidewall are respectively formed on the sidewalls of the first core layers 300 of the first region 100 a and the second region 100 b. Therefore, in the same region, the first preset width is equal to the sum of the second preset width and the second preset pitch.
- the first preset width refers to the size of the first core layer 300 in a direction perpendicular to the sidewall of the first core layer 300 .
- a first preset width W 1 (as shown in FIG. 3 ) of the first core layer 300 is the sum of the second preset width and the second preset pitch of the target patterns of the corresponding region.
- a first preset width W 2 (as shown in FIG. 3 ) of the first core layer 300 is the sum of the second preset width and the second preset pitch of the target patterns of the corresponding region.
- the second preset pitch of the first region 100 a is less than the second preset pitch of the second region 100 b. Therefore, a first preset pitch P 1 of the first region 100 a is less than a first preset pitch P 2 of the second region 100 , a first preset width W 1 of the first region 100 a is less than a first preset width W 2 of the second region 100 b, the difference between the first preset pitches of the two regions is quadruple of the difference between the second preset pitches of the two regions, and the difference between the first preset widths of the two regions is the difference between the second preset pitches of the two regions.
- the step of forming the first core layer 300 includes: forming a top core material layer 305 (as shown in FIG. 1 ) on the bottom core material layer 205 ; forming a flat layer 310 on the top core material layer 305 ; forming an anti-reflective coating layer 320 on the flat layer 310 ; forming a patterned first photoresist layer 400 on the anti-reflective coating layer 320 ; and etching the anti-reflective coating layer 320 , the flat layer 310 , and the top core material layer 305 sequentially by using the first photoresist layer 400 as a mask, and using the residual top core material layer 305 as the first core layer 300 .
- the anti-reflective coating layer 320 is used to reduce the reflection effect during exposure, thereby improving the pattern transfer precision, and further improving the morphology quality and the size accuracy of the first photoresist layer 400 .
- the anti-reflective coating layer 320 is a Si-ARC layer.
- the top face of the flat layer 310 is a flat face, and used to improve the surface flatness of the anti-reflective coating layer 320 , thereby improving the morphology quality and the size accuracy of the first photoresist layer 400 .
- the flat layer 310 is a spin on carbon (SOC) layer.
- SOC spin on carbon
- the SOC layer is formed by using a spin coating process. The process costs are relatively low, and can ensure the surface flatness of the flat layer 310 .
- the material of the flat layer may also be SiO.
- the first photoresist layer 400 and the anti-reflective coating layer 320 may also have losses.
- both the first photoresist layer 400 and the anti-reflective coating layer 320 have been removed, and only the flat layer 310 is reserved on the top of the first core layer 300 .
- the flat layer 310 may be directly removed in the same etching machine by using an ashing process.
- the process is simple, and no transfer machine is needed.
- the method further includes: forming a second etching stopping layer 220 on the bottom core material layer 205 .
- the first mask sidewall is formed on the sidewall of the first core layer 300 of the first region 100 a
- the second mask sidewall is formed on the sidewall of the first core layer 300 of the second region 100 b.
- the first mask sidewall and the second mask sidewall are usually formed using a process deposition and etching.
- the top face of the second etching stopping layer 220 is used to define the stopping position of the etching process, to avoid causing etching damage to the film layer below the stopping position, thereby reducing the probability of the height inconsistency problem of the top faces of the to-be-etched film layers below the stopping position, to help improve the etching uniformity of the base 100 subsequently, so that the height and the morphology of the formed target patterns meet the process requirement.
- the material of the second etching stopping layer 220 and the material of the subsequent first mask sidewall and second mask sidewall have an etching selection ratio, and the etching process of forming the first mask sidewall and the second mask sidewall has a smaller etching rate for the second etching stopping layer 220 .
- the material of the second etching stopping layer 220 is SiO. SiO has lower costs, and higher process compatibility. In other implementations, the material of the second etching stopping layer may also be SiN or SiON.
- the method further includes: before the second etching stopping layer 220 is formed, forming a third etching stopping layer 210 on the bottom core material layer 205 .
- the third etching stopping layer 210 is used to further eliminate uncertainty of the etching effect when the first core layer 300 (as shown in FIG. 3 ) is formed. Specifically, in the procedure for subsequently etching the top core material layer 305 by using the etching process, to form the first core layer 300 , even though the second etching stopping layer 220 has etching losses (that is, the heights of the top faces of the second etching stopping layers 220 are different), during etching of the second etching stopping layer 220 , the etching process can also be well stopped on the third etching stopping layer 210 , or in the procedure for forming the first core layer 300 by using the etching process, even though the second etching stopping layer 220 is etched using the etching process and the third etching stopping layer 210 is exposed, the etching process can also be well stopped on the third etching stopping layer 210 , thereby further improving the etching uniformity of the bottom core material layers 205 subsequently.
- the third etching stopping layer 210 and the second etching stopping layer 220 have a higher etching selection ratio, and the third etching stopping layer 210 and the top core material layer 305 have a higher etching selection ratio.
- the material of the third etching stopping layer 210 is a-C.
- a-C has higher process compatibility with the subsequent manufacturing procedure, and after the bottom core material layer 205 is subsequently etched, the third etching stopping layer 210 can be removed in the same etching machine. The process is simple, and can help improve the manufacturing efficiency.
- the third etching stopping layer 210 is formed by using a spin coating process.
- the material of the third etching stopping layer may also be SiN.
- the third etching stopping layer is formed by using a deposition process. In other implementations, the third etching stopping layer may either not be formed.
- a first mask sidewall 350 is formed on the sidewall of the first core layer 300 on the first region 100 a
- a second mask sidewall 360 is formed on the sidewall of the first core layer 300 on the second region 100 b, where the thickness of the second mask sidewall 360 is greater than the thickness of the first mask sidewall 350 .
- the bottom core material layer 205 is patterned using the first mask sidewall 350 and the second mask sidewall 360 as masks, to form a plurality of discrete second core layers, and then, a third mask sidewall is formed on the sidewall of the second core layer, where the third mask sidewall is used as a mask for patterning the base 100 .
- patterns are transferred to the second core layer through the first mask sidewall 350 and the second mask sidewall 360 , the third mask sidewall is formed on the sidewall of the second core layer, and the patterns are transferred to the base 100 through the third mask sidewall, to form the target patterns. Therefore, the first mask sidewall 350 and the second mask sidewall 360 are used to define the spacer between neighboring target patterns, the thickness of the second mask sidewall 360 is greater than the thickness of the first mask sidewall 350 , and the spacer between the target patterns of the second region 100 b is correspondingly greater than the spacer between the target patterns of the first region 100 a, so that the pitch between the target patterns of the second region 100 b is greater than the pitch between the target patterns of the first region 100 a.
- the first mask sidewall 350 has a first preset thickness T 1 (as shown in FIG. 7 ), and the second mask sidewall 360 has a second preset thickness T 2 (as shown in FIG. 7 ).
- the first preset thickness T 1 and the second preset thickness T 2 respectively refer to the size of the first mask sidewall 350 and the size of the second mask sidewall 360 along a direction perpendicular to the sidewall of the first core layer 300 . It is defined that the target patterns subsequently formed on the first region 100 a have a first preset spacer, and it is defined that the target patterns subsequently formed on the second region 100 b have a second preset spacer.
- the first preset thickness T 1 is correspondingly equal to the first preset spacer, and the second preset thickness T 2 is correspondingly equal to the second preset spacer.
- a first sidewall film 345 conformally covering the first core layer 300 and the base 100 is formed.
- the first sidewall film 345 is used to provide a process foundation for subsequently forming a fourth mask sidewall.
- the fourth mask sidewall is used as a part of the second mask sidewall. Subsequently, the fourth mask sidewall needs to be further removed. Therefore, the first sidewall film 345 is an easily removed material, and the process of subsequently removing the fourth mask sidewall do less damage to other film layers.
- the material of the first sidewall film 345 is SiN.
- SiN is a mask sidewall material commonly used in the SAQP process.
- the rigidity and the density of SiN are relatively high, and selecting SiN can help ensure the etching mask effect of the subsequent second mask sidewall.
- SiN and a-Si have a relatively large etching selection ratio, so that the probability that the subsequent second mask sidewall is damaged in the procedure for removing the first core layer 300 can be reduced.
- the material of the first sidewall film when the material of the first core layer is SiN, the material of the first sidewall film may be correspondingly Poly-Si. In other implementations, according to actual situations, the material of the first sidewall film may also be SiO, SiON, CN, SiC, SiCN, or SiOCN.
- the first sidewall film 345 has a third preset thickness t 1 (as shown in FIG. 4 ), and the third preset thickness t 1 is used to define the difference between the thicknesses of the subsequent second mask sidewall and first mask sidewall. Because the thickness of the first mask sidewall is equal to the first preset spacer, and the thickness of the second mask sidewall is equal to the second preset spacer, correspondingly, the third preset thickness t 1 is equal to the difference between the second preset spacer and the first preset spacer.
- the first sidewall film 345 is formed using an atomic layer deposition process.
- the atomic layer deposition process can be used to help reduce the control difficulty of the third preset thickness t 1 .
- the first sidewall film may also be formed using a chemical vapor deposition process.
- the first sidewall film 345 of the first region 100 a is removed.
- the first sidewall film 345 of the first region 100 a is removed, so that the first mask sidewall subsequently formed on the first region 100 a has a smaller thickness.
- the step of removing the first sidewall film 345 of the first region 100 a includes: forming a second photoresist layer 380 , to cover a first sidewall film 345 of the second region 100 b; and etching and removing the first sidewall film 345 of the first region 100 a using the second photoresist layer 380 as a mask.
- the first sidewall film 345 is etched using a dry etching process.
- the dry etching process has an anisotropic etching property, and can help improve the profile quality of the residual first sidewall film 345 .
- the second photoresist layer 380 is removed using an ashing manner or a wet photoresist removing manner.
- a second sidewall film 355 is formed, to conformally cover the first core layer 300 , the base 100 , and the residual first sidewall film 345 .
- the second sidewall film 355 on the sidewall of the first core layer 300 of the first region 100 a is reserved as the first mask sidewall.
- the first mask sidewall is used as a mask for subsequently patterning the bottom core material layer 205 of the first region 100 a to form the second core layer.
- the material of the second sidewall film 355 is SiN. In some other implementations, when the material of the first core layer is SiN, the material of the second sidewall film may be correspondingly Poly-Si. In other implementations, according to actual situations, the material of the second sidewall film may also be SiO, SiON, CN, SiC, SiCN, or SiOCN. For descriptions of the material of the second sidewall film 355 , reference may be made to the foregoing corresponding descriptions of the first sidewall film 345 . Details are not described herein again.
- the second sidewall film 355 has a fourth preset thickness t 2 , and the fourth preset thickness t 2 is equal to the first preset spacer.
- the second sidewall film 355 is formed using an atomic layer deposition process. In other implementations, the second sidewall film may also be formed using a chemical vapor deposition process.
- the top of the first core layer 300 and the second sidewall film 355 and the first sidewall film 345 on the base 100 are removed using a blanket etching process, the residual second sidewall film 355 on the sidewall of the first core layer is reserved as the first mask sidewall 350 , and the residual first sidewall film 345 is reserved as the fourth mask sidewall 340 .
- the fourth mask sidewall 340 is located between the first mask sidewall 350 and the first core layer 300 of the second region 100 b, and between the first mask sidewall 350 and the bottom core material layer 205 of the second region 100 b, and the fourth mask sidewall 340 and the first mask sidewall 350 of the second region 100 b construct the second mask sidewall 360 .
- the first mask sidewall 350 of the first region 100 a, and the second mask sidewall 360 of the second region 100 b are used as etching masks for subsequently patterning the bottom core material layer 205 .
- the second sidewall film 355 and the first sidewall film 345 are etched selectively along the surface normal direction of the base 100 using an anisotropic blanket dry etching process, to form the first mask sidewall 350 on the sidewall of the first core layer 300 of the first region 100 a, and form the second mask sidewall 360 on the sidewall of the first core layer 300 of the second region 100 b.
- the material of the first mask sidewall 350 and the material of the second mask sidewall 360 are the same, and both are SiN, so that the etching mask effects of the first mask sidewall 350 and the second mask sidewall 360 are the same.
- the second mask sidewall 360 is constructed by the first mask sidewall 350 and the fourth mask sidewall 340 formed on the second region 100 b. Therefore, compared with the first mask sidewall 350 formed on the first region 100 a, the thickness of the second mask sidewall 360 formed on the second region 100 b is larger.
- the first core layer 300 (as shown in FIG. 7 ) is removed.
- the first core layer 300 is removed to provide a process foundation for subsequently patterning the bottom core material layer 205 .
- the first core layer 300 is etched and removed using a wet etching process.
- the material of the first core layer 300 is a-Si
- the etching solution used in the wet etching process is a mixing solution of C12 and HBr or a TMAH solution.
- the first core layer may also be removed using a dry etching process, or a process combining dry etching and wet etching.
- the bottom core material layer 205 is patterned using the first mask sidewall 350 and the second mask sidewall 360 as masks, to form a plurality of discrete second core layers 200 .
- the second core layer 200 is used to provide a process foundation for subsequently forming a third mask sidewall.
- the third mask sidewall is formed on the sidewall of the second core layer 200 , and the third mask sidewall is used as a mask for patterning the base 100 to form the target patterns.
- the material of the second core layer 200 is correspondingly a-Si.
- a third etching stopping layer 210 and a second etching stopping layer 220 are sequentially formed on the bottom core material layer 205 . Therefore, by using the first mask sidewall 350 and the second mask sidewall 360 as masks, the second etching stopping layer 220 , the third etching stopping layer 210 , and the bottom core material layer 205 are sequentially etched using a dry etching process.
- the patterns are transferred to the second core layer 200 using the first mask sidewall 350 and the second mask sidewall 360 , and the second preset thickness T 2 (as shown in FIG. 7 ) is greater than the first preset thickness T 1 (as shown in FIG. 7 ). Therefore, along the direction perpendicular to the sidewall of the second core layer 200 , a width W 4 of the second core layer 200 of the second region 100 b is greater than a width W 3 of the second core layer 200 of the first region 100 a.
- the width W 3 of the second core layer 200 of the first region 100 a is used to define the spacer between target patterns subsequently formed on the first region 100 a
- the width W 4 of the second core layer 200 of the second region 100 b is used to define the spacer between target patterns subsequently formed on the second region 100 b.
- the first mask sidewall 350 , the second mask sidewall 360 , and the second etching stopping layer 220 also have losses.
- the first mask sidewall 350 , the second mask sidewall 360 , and the second etching stopping layer 220 have all been removed, only the third etching stopping layer 210 is reserved on the top of the second core layer 200 .
- the method further includes: removing the third etching stopping layer 210 .
- the material of the third etching stopping layer 210 is a-C. Therefore, the third etching stopping layer 210 may be directly removed in the same etching machine using an ashing process. The process is simple, and no transfer machine is needed.
- a third mask sidewall 140 (as shown in FIG. 12 ) is formed on the sidewall of the second core layer 200 .
- the third mask sidewall 140 is used as a mask for patterning the base 100 . Therefore, a thickness T 3 of the third mask sidewall 140 (as shown in FIG. 12 ) is equal to the width of the target pattern.
- the thickness T 3 of the third mask sidewall 140 refers to the size of the third mask sidewall 140 along the direction perpendicular to the sidewall of the second core layer 200 .
- the material of the third mask sidewall 140 is SiN.
- the material of the third mask sidewall 140 reference may be made to the foregoing corresponding descriptions of the first sidewall film 345 . Details are not described herein again.
- the step of forming the third mask sidewall 140 includes: forming a fourth sidewall film 145 conformally covering the second core layer 200 and the base 100 ; and removing the top of the second core layer 200 and the fourth sidewall film 145 on the base 100 using a blanket etching process, and reserving the residual fourth sidewall film 145 on the sidewall of the second core layer 200 as the third mask sidewall 140 .
- the step of forming the fourth mask sidewall 140 reference may be made to the foregoing related descriptions of forming the first mask sidewall 350 (as shown in FIG. 7 ). Details are not described herein again.
- the second core layer 200 (as shown in FIG. 12 ) is removed.
- the second core layer 200 is removed to provide a process foundation for subsequently forming the base 100 .
- the second core layer 200 is etched and removed using a wet etching process.
- a wet etching process For specific descriptions of the process of removing the second core layer 200 , reference may be made to the foregoing corresponding descriptions of removing the first core layer 300 (as shown in FIG. 7 ). Details are not described herein again.
- the base 100 is patterned using the third mask sidewall 140 as a mask, to form a plurality of target patterns 160 protruding out of the residual base 100 .
- the first etching stopping layer 130 , the lapping stopping layer 125 , and the base 100 are sequentially etched using the third mask sidewall 140 as a mask, to form the target patterns 160 protruding out of the residual base 100 .
- the third mask sidewall 140 is formed on the sidewall of the second core layer 200 (as shown in FIG. 12 ), and along the direction perpendicular to the sidewall of the second core layer 200 , the width W 4 (as shown in FIG. 10 ) of the second core layer 200 of the second region 100 b is greater than the width W 3 (as shown in FIG. 10 ) of the second core layer 200 of the first region 100 a. Therefore, a pitch P 4 between the target patterns 160 of the second region 100 b is greater than a pitch P 3 between the target patterns 160 of the first region 100 a, to meet the requirement of different pitches.
- the residual base 100 is used as the substrate 150
- the target pattern 160 is the fin
- the fin 160 and the substrate 150 are in an integral structure.
- the base when the base includes a first semiconductor layer and a second semiconductor layer epitaxially growing on the first semiconductor layer, in the step of etching the base, only the first semiconductor layer is etched.
- the first semiconductor layer is used as the substrate, and the residual second semiconductor layer protruding out of the first semiconductor layer is used as the fin.
- the material of the fin may also be different from the material of the substrate.
- the first region 100 a is used to form a core device
- the second region 100 b is used to form an IO device
- the thickness of a gate dielectric layer of the IO device is usually greater than the thickness of a gate dielectric layer of the core device.
- the pitch between the fins of the second region 100 b is made to be greater than the pitch between the fins of the first region 100 a, to provide sufficient space for forming the gate dielectric layer corresponding to the IO device.
- the pitch between the fins located on the first region 100 a is still relatively small, to save the area, and avoid affecting the improvement of the device integration.
- FIG. 16 to FIG. 20 are schematic structural diagrams corresponding to steps in another form of a method for forming a semiconductor structure.
- the similarity of some implementations and the foregoing embodiment is not described herein again.
- the difference of some implementations from the foregoing embodiment lies in:
- the second mask sidewall 360 c (as shown in FIG. 20 ) is a single layer structure.
- the forming method includes the following.
- the third sidewall film 365 is used to provide a process foundation for subsequently forming a second mask sidewall.
- the second mask sidewall is used to define the spacer between the target patterns subsequently formed on the second region 100 b. Therefore, the thickness t 3 of the third sidewall film 365 c is determined according to the spacer between the target patterns on the second region 100 b.
- the material of the third sidewall film 365 c is SiN. In other implementations, the material of the third sidewall film may also be SiO, SiON, CN, Poly-Si, SiC, SiCN, or SiOCN.
- the third sidewall film 365 c is formed using an atomic layer deposition process. In other implementations, the third sidewall film may also be formed by using a chemical vapor deposition process.
- a protective layer 380 c is formed, to conformally cover the third sidewall film 365 c of the second region 100 b.
- the protective layer 380 c is used to protect the third sidewall film 365 c of the second region 100 b, to avoid affecting the third sidewall film 365 c of the second region 100 b in the subsequent manufacturing procedure.
- the subsequent step further includes: performing plasma processing on the third sidewall film 365 c of the first region 100 a. Therefore, the material of the protective layer 380 c is selected as: The protective layer 380 c can enter a plasma processing machine; and in the plasma processing procedure, the protective layer 380 c can have a blocking effect, thereby preventing the plasma processing from affecting the third sidewall film 365 c of the second region 100 b.
- the material of the protective layer 380 c is SiO.
- SiO has lower costs, and higher process compatibility, and is easily removed.
- the material of the protection layer may also be SiON, SiN, Silicon Rich Oxide (SRO), or a-Si.
- the protective layer 380 c conformally covers the third sidewall film 365 c of the second region 100 b, thereby avoiding wasting materials, and reducing the process difficulty in subsequently removing the protective layer 380 c.
- a thickness t 4 of the protective layer 380 c should not be excessively small or excessively large. If the thickness t 4 is excessively small, the third sidewall film 365 c of the second region 100 b is easily affected by the subsequent process, thereby changing the thickness t 3 (as shown in FIG. 16 ) of the third sidewall film 365 c of the second region 100 b, and further affecting the spacer between the target patterns formed on the second region 100 b. If the thickness t 4 is excessively large, not only the process costs and time are increased, but also the process difficulty in subsequently removing the protective layer 380 c is increased. Therefore, in some implementations, the thickness t 4 of the protective layer 380 c is 2 nm to 10 nm.
- the protection layer 380 c is formed using an atomic layer deposition process.
- the atomic layer deposition process has a better step coverage capability, and can improve the forming quality and the conformal coverage capability of the protective layer 380 c, and the atomic layer deposition process is used to further help improve the uniformity of the thickness t 4 of the protective layer 380 c.
- the step of forming the protective layer 380 c includes: forming a protective film (not shown in the figure) conformally covering the third sidewall film 365 c, forming a photoresist layer (not shown in the figure) on the protective film, and exposing the protective film of the first region 100 a; etching the protective film by using the photoresist layer as a mask, to form the protective layer 380 c; and after the protective layer 380 c is formed, removing the photoresist layer by using an ashing manner or a wet photoresist removing manner.
- the protective layer may also be formed using a chemical vapor deposition process.
- the protective layer further is filled between neighboring first core layers.
- plasma processing is performed on the third sidewall film 365 c of the first region 100 a, and the third sidewall film 365 c of a partial thickness exposed by the protective layer 380 c is transformed into the sacrificial layer 305 c.
- the third sidewall film 365 c of the partial thickness of the first region 100 a is transformed into the sacrificial layer 305 c, so that the thickness of the residual third sidewall film 365 c of the first region 100 a is less than the thickness of the third sidewall film 365 c of the second region 100 b.
- the target patterns of the first region 100 a have a first preset spacer
- the target patterns of the second region 100 b have a second preset spacer.
- the sacrificial layer 305 c has a fourth preset thickness t 5
- the fourth preset thickness t 5 is correspondingly equal to the difference between the second preset spacer and the first preset spacer.
- selecting the plasma processing manner easily makes the fourth preset thickness t meet the process requirement, and helps improve the uniformity of the fourth preset thickness t.
- the plasma processing is performed in an oxygen atmosphere, that is, the plasma processing is oxygen plasma processing, thereby achieving the effect of oxidizing the third sidewall film 365 c of the partial thickness.
- the process is simple.
- the material of the third sidewall film 365 c is SiN
- the material of the sacrificial layer 305 c is SiON.
- the plasma processing may also be performed in a hydrogen atmosphere, so that chemical bonds in the material of the third sidewall film 365 c of the partial thickness may break down, thereby easily removing the third sidewall film 365 c affected by the plasma processing.
- the protective layer 380 c (as shown in FIG. 18 ) and the sacrificial layer 305 c (as shown in FIG. 18 ) are removed.
- the protective layer 380 c and the sacrificial layer 305 c are removed to provide a process foundation for subsequently performing etching processing on the third sidewall film 365 c.
- the protective layer 380 c and the sacrificial layer 305 c are removed using a wet etching process.
- the material of the sacrificial layer 305 c is SiON
- the material of the protective layer 380 c is SiO. Therefore, the protective layer 380 c and the sacrificial layer 305 c may be removed in the same process step.
- the etching solution used in the wet etching process is a dilute hydrofluoric acid (DHF) solution.
- the top of first core layer 300 c and the third sidewall film 365 c (as shown in FIG. 19 ) on the second etching stopping layer 220 c are removed using a blanket etching process, the residual third sidewall film 365 c on the sidewall of the first core layer 300 c of the first region 100 a is reserved as the first mask sidewall 350 c, and the residual third sidewall film 365 c on the sidewall of the first core layer 300 c of the second region 100 b is reserved as the second mask sidewall 360 c.
- the thickness of the third sidewall film 365 c of the first region 100 a is less than the thickness of the third sidewall film 365 c of the second region 100 b. Therefore, the thickness of the first mask sidewall 350 c is less than the thickness of the second mask sidewall 360 c.
- FIG. 21 is a schematic structural diagram of one form of a semiconductor structure.
- the semiconductor structure includes: a substrate 500 and a plurality of discrete fins 510 protruding out of the substrate 500 .
- the substrate 500 includes a core region 500 a and a peripheral region 500 b, and a pitch P 6 between the fins 510 located in the peripheral region 500 is greater than a pitch P 5 between the fins 510 located in the core region 500 a.
- the material of the substrate 500 is Si
- the material of the fin 510 is Si
- the core region 500 a is used to form a core device
- the peripheral region 500 b is used to form an IO device
- the thickness of a gate dielectric layer of the IO device is usually greater than the thickness of a gate dielectric layer of the core device.
- the pitch P 6 between the fins 510 located in the peripheral region 500 b is greater than the pitch P 5 between the fins 510 located in the core region 500 a, to provide sufficient space for forming the gate dielectric layer corresponding to the IO device.
- the pitch P 5 between the fins 510 located in the core region 500 a is still relatively small, to save the area, and avoid affecting the improvement of the device integration.
- the semiconductor structure may be formed using the methods described above for forming a semiconductor structure or formed using other forming methods.
- the semiconductor structure of some implementations reference may be made to the corresponding descriptions in the foregoing implementations. Details are not described herein again.
Abstract
Description
- The present application claims priority to Chinese Patent Appln. No. 201811604233.7, filed Dec. 26, 2018, the entire disclosure of which is hereby incorporated by reference.
- Embodiments and implementations of the present disclosure relate to the field of semiconductor manufacturing, and in particular, to a semiconductor structure and a method for forming the same.
- A photolithography technology is a common patterning method, and is the most crucial production technology in a semiconductor manufacturing process. With the continuous reduction of nodes of a semiconductor process, a self-aligned double patterning (SADP) method has become a patterning method preferred in recent years. The method can increase the density of patterns formed on a substrate, to further shorten a pitch between neighboring two patterns, so that a photolithography process overcomes limits of the photolithography resolution.
- With the continuous reduction of critical dimensions (CDs) of patterns, a self-aligned quadruple patterning (SAQP) method emerges. The density of the patterns formed on the substrate using the SADP method is double the density of patterns formed on the substrate using the photolithography process, that is, a ½ smallest pitch (½ pitch) may be obtained. On the premise that the current photolithography technology is unchanged (that is, the size of a photolithography window is unchanged), the density of the patterns formed on the substrate using the SAQP method is quadruple the density of the patterns formed on the substrate using the photolithography process. That is, a ¼ smallest pitch (¼ pitch) may be obtained, thereby significantly improving the density of integrated circuits of the semiconductor, and shortening the CDs of the patterns, to further help improve the device performance.
- The problem to be addressed in embodiments and implementations of the present disclosure is to provide a semiconductor structure and a method for forming same, to meet the requirement of different pitches of target patterns.
- To address the foregoing problem, one form of the present disclosure provides a method for forming a semiconductor structure. The method may include: providing a base, used to form target patterns, where the base includes a first region and a second region, and a pitch between target patterns formed on the first region is greater than a pitch between target patterns formed on the second region; forming a bottom core material layer on the base; forming a plurality of discrete first core layers on the bottom core material layer; forming a first mask sidewall on a sidewall of the first core layer of the first region, and forming a second mask sidewall on a sidewall of the first core layer of the second region, where a thickness of the second mask sidewall is greater than a thickness of the first mask sidewall; removing the first core layers; after the first core layers are removed, patterning the bottom core material layer by using the first mask sidewall and the second mask sidewall as masks, to form a plurality of discrete second core layers; removing the first mask sidewall and the second mask sidewall; after the first mask sidewall and the second mask sidewall are removed, forming a third mask sidewall on a sidewall of the second core layer; removing the second core layers; and after the second core layers are removed, patterning the base by using the third mask sidewall as a mask, to form a plurality of target patterns protruding out of a residual base.
- Another form of the present disclosure provides a semiconductor structure. The semiconductor structure may include: a substrate and a plurality of discrete fins protruding out of the substrate, where the substrate includes a core region and a peripheral region, and a pitch between fins located in the peripheral region is greater than a pitch between fins located in the core region.
- Compared with the prior art, the technical solutions of embodiments and implementations of the present disclosure have the following advantages:
- In embodiments and implementations of the present disclosure, after the plurality of discrete first core layers is formed on the bottom core material layer, a first mask sidewall is formed on the sidewall of the first core layer of the first region, and a second mask sidewall is formed on the sidewall of the first core layer of the second region, where the thickness of the second mask sidewall is greater than the thickness of the first mask sidewall. Subsequently, the bottom core material layer is patterned using the first mask sidewall and the second mask sidewall as masks, to form a second core layer, and then, a third mask sidewall is formed on the sidewall of the second core layer, and used as a mask for patterning the base to form target patterns. Patterns are transferred to the second core layer through the first mask sidewall and the second mask sidewall, the third mask sidewall is formed on the sidewall of the second core layer, and the patterns are transferred to the base through the third mask sidewall, to form the target patterns. Therefore, the first mask sidewall and the second mask sidewall are used to define the spacer between neighboring target patterns, the thickness of the second mask sidewall is greater than the thickness of the first mask sidewall, and the spacer between the target patterns of the second region is correspondingly greater than the spacer between the target patterns of the first region, so that the pitch between the target patterns of the second region is greater than the pitch between the target patterns of the first region, to meet the requirement of different pitches of the target patterns.
- In some implementations, the formed target patterns are fins, the first region is a core region, and the second region is a peripheral region. The core region is used to form a core device, the peripheral region is used to form an input/output device (TO device), and the thickness of a gate dielectric layer of the IO device is usually greater than the thickness of a gate dielectric layer of the core device. The pitch between the fins of the second region is made to be greater than the pitch between the fins of the first region, to provide sufficient space for forming the gate dielectric layer corresponding to the IO device. The pitch between the fins of the first region is still relatively small, to save the area, and avoid affecting the improvement of the device integration.
-
FIG. 1 toFIG. 15 are schematic structural diagrams corresponding to steps in one form of a method for forming a semiconductor structure; -
FIG. 16 toFIG. 20 are schematic structural diagrams corresponding to steps in another form of a method for forming a semiconductor structure; and -
FIG. 21 is a schematic structural diagram of one form of a semiconductor structure. - With the continuous reduction of CDs of patterns, an SAQP method is usually selected to form target patterns, so that the target patterns can obtain a ¼ pitch on a premise of not changing the current photolithography technology. Although the SAQP method can reduce the pitch between the target patterns, the pitches between the target patterns are equal, and the requirement of different pitches of regions cannot be met.
- To address the technical problem, in embodiments and implementations of the present disclosure, after the first core layers are formed on the bottom core material layer, a first mask sidewall is formed on the sidewall of the first core layer of the first region, and a second mask sidewall is formed on the sidewall of the first core layer of the second region, where the thickness of the second mask sidewall is greater than the thickness of the first mask sidewall. Subsequently, the bottom core material layer is patterned using the first mask sidewall and the second mask sidewall as masks, to form a second core layer, and then, a third mask sidewall is formed on the sidewall of the second core layer, and used as a mask for patterning the base to form target patterns. Patterns are transferred to the second core layer using the first mask sidewall and the second mask sidewall, the third mask sidewall is formed on the sidewall of the second core layer, and the patterns are transferred to the base using the third mask sidewall, to form the target patterns. The first mask sidewall and the second mask sidewall are used to define the spacer between neighboring target patterns, the thickness of the second mask sidewall is greater than the thickness of the first mask sidewall, and the spacer between the target patterns of the second region is correspondingly greater than the spacer between the target patterns of the first region, so that the pitch between the target patterns of the second region is greater than the pitch between the target patterns of the first region, to meet the requirement of different pitches of the target patterns.
- To make the foregoing objectives, features, and advantages of the embodiments and implementations of the present disclosure clearer and more comprehensible, the following describes specific embodiments and implementations of the present disclosure in detail with reference to the accompanying drawings.
-
FIG. 1 toFIG. 15 are schematic structural diagrams corresponding to steps in one form of a method for forming a semiconductor structure. - Referring to
FIG. 1 , abase 100 is provided, used to form target patterns, where thebase 100 includes afirst region 100 a and asecond region 100 b, and the pitch between the target patterns formed on thefirst region 100 a is greater than the pitch between the target patterns formed on thesecond region 100 b. - In some implementations, the
base 100 is used to form a substrate and fins located on the substrate, that is, the formed target patterns are the fins. - In some implementations, the material of the
base 100 is Si. In other implementations, the material of the base may also be another material such as Ge, SiGe, SiC, GaAs, or InGa. The base may also be a base of another type, such as a Si base on an insulator or a Ge base on an insulator. In some other implementations, the base may further include a first semiconductor layer and a second semiconductor layer epitaxially growing on the first semiconductor layer, where the first semiconductor layer is used to provide a process foundation for subsequently forming the substrate, and the second semiconductor layer is used to provide a process foundation for subsequently forming the fins. In other implementations, the base may further include other to-be-etched functional layers, for example, a gate material layer. - The
base 100 includes afirst region 100 a and asecond region 100 b, and the pitch between target patterns subsequently formed on thefirst region 100 a is greater than the pitch between the target patterns formed on thesecond region 100 b. - In some implementations, the
first region 100 a is a core region, thesecond region 100 b is a peripheral region, that is, thefirst region 100 a is used to form a core device, and thesecond region 100 b is used to form an IO device. The core device mainly refers to a device used inside a chip, and usually uses a relatively low voltage (which is generally 1.0 V, 1.2 V, 1.5 V, or 1.8 V). The IO device is a device used when the chip interacts with an external interface. The working voltage of such a device is generally relatively high, and depends on a compatible working voltage (which is generally 1.8 V, 2.5 V, 3.3 V, or 5V) of the external interface. In other implementations, the first region and the second region may also be used to form other types of devices, and the device types may also be the same. - Still referring to
FIG. 1 , apad oxide layer 110 is formed on thebase 100; and a lappingstopping layer 125 is formed on thepad oxide layer 110. - In a lapping process of subsequently forming an isolation structure, the top of the lapping
stopping layer 125 is used to define a stopping position of the lapping process. In some implementations, the material of the lappingstopping layer 125 is SiN. - The
pad oxide layer 110 is used to provide a cushioning effect in forming of the lappingstopping layer 125, to avoid a dislocation problem caused when the lappingstopping layer 125 is directly formed on thebase 100. In some implementations, the material of thepad oxidation layer 110 is SiO. - Still referring to
FIG. 1 , a bottomcore material layer 205 is formed on the lappingstopping layer 125. - The bottom
core material layer 205 is used to provide a process foundation for subsequently forming a second core layer. A third mask sidewall subsequently formed on a sidewall of the second core layer is used as a mask for patterning thebase 100. - The second core layer is further removed subsequently. Therefore, the bottom
core material layer 205 is an easily removed material, and the process of removing the second core layer does less damage to other film layers. In some implementations, the material of the bottomcore material layer 205 is a-Si. a-Si is a core layer material commonly used in an SAQP process. In some other implementations, the material of the bottom core material layer is SiN. In other implementations, the material of the bottom core material layer may also be a-C, a-Ge, SiO, SiON, CN, Poly-Si, SiC, SiCN, SiOCN, or an organic dielectric layer (ODL) material. - In some implementations, the method further includes: before the bottom
core material layer 205 is formed, forming a firstetching stopping layer 130 on thelapping stopping layer 125. The third mask sidewall subsequently formed on the sidewall of the second core layer is formed using a process combining deposition and etching, and the top face of the firstetching stopping layer 130 is used to define the stopping position of the etching process, to avoid causing an overetching problem, thereby reducing the probability of the height inconsistency problem of the top faces of to-be-etched film layers below the stopping position, so that the height and the morphology of the subsequently formed target patterns can meet the process requirement. - In some implementations, according to the material of the bottom
core material layer 205, the material of the firstetching stopping layer 130 is SiO. In other implementations, the material may also be SiN or SiON. - Referring to
FIG. 1 toFIG. 3 , a plurality of discrete first core layers 300 (as shown inFIG. 3 ) is formed on the bottomcore material layer 205. - The
first core layer 300 is used to provide a process foundation for subsequently forming the first mask sidewall and the second mask sidewall. Subsequently, the first mask sidewall is formed on the sidewall of thefirst core layer 300 of thefirst region 100 a, and used to define the spacer between the target patterns formed on thefirst region 100 a. The second mask sidewall is formed on the sidewall of thefirst core layer 300 of thesecond region 100 b, and used to define the spacer between the target patterns formed on thesecond region 100 b. - After the first mask sidewall and the second mask sidewall are formed, the
first core layer 300 is further removed. Therefore, thefirst core layer 300 is an easily removed material, and the process of removing thefirst core layer 300 does less damage to other film layers. In some implementations, the material of thefirst core layer 300 is a-Si. In some other implementations, the material of the bottom core material layer is SiN. In other implementations, the material of the bottom core material layer may also be a-C, a-Ge, SiO, SiON, CN, Poly-Si, SiC, SiCN, SiOCN, or an ODL material. - The first core layers 300 have a first preset pitch, and the target patterns subsequently formed in the same region have a second preset pitch. In the SAQP process, the target patterns can obtain the ¼ pitch on the premise of not changing the current photolithography technology. Therefore, in the same region, the first preset pitch is quadruple of the second preset pitch. That is, in the
first region 100 a, the first preset pitch P1 (as shown inFIG. 3 ) of the first core layers 300 is quadruple of the second preset pitch of the target patterns. In thesecond region 100 b, the first preset pitch P2 (as shown inFIG. 3 ) of the first core layers 300 is quadruple of the second preset pitch of the target patterns. - The
first core layer 300 has a first preset width, and the target pattern has a second preset width. The first mask sidewall is used to define the spacer between the target patterns on thefirst region 100 a, the second mask sidewall is used to define the spacer between the target patterns on thesecond region 100 b, and the first mask sidewall and the second mask sidewall are respectively formed on the sidewalls of the first core layers 300 of thefirst region 100 a and thesecond region 100 b. Therefore, in the same region, the first preset width is equal to the sum of the second preset width and the second preset pitch. The first preset width refers to the size of thefirst core layer 300 in a direction perpendicular to the sidewall of thefirst core layer 300. - Specifically, in the
first region 100 a, a first preset width W1 (as shown inFIG. 3 ) of thefirst core layer 300 is the sum of the second preset width and the second preset pitch of the target patterns of the corresponding region. Likewise, in thesecond region 100 b, a first preset width W2 (as shown inFIG. 3 ) of thefirst core layer 300 is the sum of the second preset width and the second preset pitch of the target patterns of the corresponding region. - In some implementations, the second preset pitch of the
first region 100 a is less than the second preset pitch of thesecond region 100 b. Therefore, a first preset pitch P1 of thefirst region 100 a is less than a first preset pitch P2 of thesecond region 100, a first preset width W1 of thefirst region 100 a is less than a first preset width W2 of thesecond region 100 b, the difference between the first preset pitches of the two regions is quadruple of the difference between the second preset pitches of the two regions, and the difference between the first preset widths of the two regions is the difference between the second preset pitches of the two regions. - Specifically, the step of forming the
first core layer 300 includes: forming a top core material layer 305 (as shown inFIG. 1 ) on the bottomcore material layer 205; forming aflat layer 310 on the topcore material layer 305; forming ananti-reflective coating layer 320 on theflat layer 310; forming a patternedfirst photoresist layer 400 on theanti-reflective coating layer 320; and etching theanti-reflective coating layer 320, theflat layer 310, and the topcore material layer 305 sequentially by using thefirst photoresist layer 400 as a mask, and using the residual topcore material layer 305 as thefirst core layer 300. - The
anti-reflective coating layer 320 is used to reduce the reflection effect during exposure, thereby improving the pattern transfer precision, and further improving the morphology quality and the size accuracy of thefirst photoresist layer 400. In some implementations, theanti-reflective coating layer 320 is a Si-ARC layer. - The top face of the
flat layer 310 is a flat face, and used to improve the surface flatness of theanti-reflective coating layer 320, thereby improving the morphology quality and the size accuracy of thefirst photoresist layer 400. In some implementations, theflat layer 310 is a spin on carbon (SOC) layer. The SOC layer is formed by using a spin coating process. The process costs are relatively low, and can ensure the surface flatness of theflat layer 310. In other implementations, the material of the flat layer may also be SiO. - It should be noted that, in the pattern transfer procedure, the
first photoresist layer 400 and theanti-reflective coating layer 320 may also have losses. In some implementations, after thefirst core layer 300 is formed, both thefirst photoresist layer 400 and theanti-reflective coating layer 320 have been removed, and only theflat layer 310 is reserved on the top of thefirst core layer 300. - Therefore, as shown in
FIG. 3 , after thefirst core layer 300 is formed, theflat layer 310 may be directly removed in the same etching machine by using an ashing process. The process is simple, and no transfer machine is needed. - Still referring to
FIG. 1 , in some implementations, before the topcore material layer 305 is formed, the method further includes: forming a secondetching stopping layer 220 on the bottomcore material layer 205. - Subsequently, the first mask sidewall is formed on the sidewall of the
first core layer 300 of thefirst region 100 a, and the second mask sidewall is formed on the sidewall of thefirst core layer 300 of thesecond region 100 b. The first mask sidewall and the second mask sidewall are usually formed using a process deposition and etching. The top face of the secondetching stopping layer 220 is used to define the stopping position of the etching process, to avoid causing etching damage to the film layer below the stopping position, thereby reducing the probability of the height inconsistency problem of the top faces of the to-be-etched film layers below the stopping position, to help improve the etching uniformity of the base 100 subsequently, so that the height and the morphology of the formed target patterns meet the process requirement. - Therefore, the material of the second
etching stopping layer 220 and the material of the subsequent first mask sidewall and second mask sidewall have an etching selection ratio, and the etching process of forming the first mask sidewall and the second mask sidewall has a smaller etching rate for the secondetching stopping layer 220. In some implementations, the material of the secondetching stopping layer 220 is SiO. SiO has lower costs, and higher process compatibility. In other implementations, the material of the second etching stopping layer may also be SiN or SiON. - It should be further noted that, in some implementations, the method further includes: before the second
etching stopping layer 220 is formed, forming a thirdetching stopping layer 210 on the bottomcore material layer 205. - The third
etching stopping layer 210 is used to further eliminate uncertainty of the etching effect when the first core layer 300 (as shown inFIG. 3 ) is formed. Specifically, in the procedure for subsequently etching the topcore material layer 305 by using the etching process, to form thefirst core layer 300, even though the secondetching stopping layer 220 has etching losses (that is, the heights of the top faces of the secondetching stopping layers 220 are different), during etching of the secondetching stopping layer 220, the etching process can also be well stopped on the thirdetching stopping layer 210, or in the procedure for forming thefirst core layer 300 by using the etching process, even though the secondetching stopping layer 220 is etched using the etching process and the thirdetching stopping layer 210 is exposed, the etching process can also be well stopped on the thirdetching stopping layer 210, thereby further improving the etching uniformity of the bottom core material layers 205 subsequently. - Therefore, the third
etching stopping layer 210 and the secondetching stopping layer 220 have a higher etching selection ratio, and the thirdetching stopping layer 210 and the topcore material layer 305 have a higher etching selection ratio. - In some implementations, the material of the third
etching stopping layer 210 is a-C. a-C has higher process compatibility with the subsequent manufacturing procedure, and after the bottomcore material layer 205 is subsequently etched, the thirdetching stopping layer 210 can be removed in the same etching machine. The process is simple, and can help improve the manufacturing efficiency. - Specifically, the third
etching stopping layer 210 is formed by using a spin coating process. - In some other implementations, the material of the third etching stopping layer may also be SiN. Correspondingly, the third etching stopping layer is formed by using a deposition process. In other implementations, the third etching stopping layer may either not be formed.
- Referring to
FIG. 4 toFIG. 7 , afirst mask sidewall 350 is formed on the sidewall of thefirst core layer 300 on thefirst region 100 a, and a second mask sidewall 360 is formed on the sidewall of thefirst core layer 300 on thesecond region 100 b, where the thickness of the second mask sidewall 360 is greater than the thickness of thefirst mask sidewall 350. - Subsequently, the bottom
core material layer 205 is patterned using thefirst mask sidewall 350 and the second mask sidewall 360 as masks, to form a plurality of discrete second core layers, and then, a third mask sidewall is formed on the sidewall of the second core layer, where the third mask sidewall is used as a mask for patterning thebase 100. - In some implementations, patterns are transferred to the second core layer through the
first mask sidewall 350 and the second mask sidewall 360, the third mask sidewall is formed on the sidewall of the second core layer, and the patterns are transferred to the base 100 through the third mask sidewall, to form the target patterns. Therefore, thefirst mask sidewall 350 and the second mask sidewall 360 are used to define the spacer between neighboring target patterns, the thickness of the second mask sidewall 360 is greater than the thickness of thefirst mask sidewall 350, and the spacer between the target patterns of thesecond region 100 b is correspondingly greater than the spacer between the target patterns of thefirst region 100 a, so that the pitch between the target patterns of thesecond region 100 b is greater than the pitch between the target patterns of thefirst region 100 a. - In some implementations, the
first mask sidewall 350 has a first preset thickness T1 (as shown inFIG. 7 ), and the second mask sidewall 360 has a second preset thickness T2 (as shown inFIG. 7 ). The first preset thickness T1 and the second preset thickness T2 respectively refer to the size of thefirst mask sidewall 350 and the size of the second mask sidewall 360 along a direction perpendicular to the sidewall of thefirst core layer 300. It is defined that the target patterns subsequently formed on thefirst region 100 a have a first preset spacer, and it is defined that the target patterns subsequently formed on thesecond region 100 b have a second preset spacer. The first preset thickness T1 is correspondingly equal to the first preset spacer, and the second preset thickness T2 is correspondingly equal to the second preset spacer. - The following describes the step of forming the
first mask sidewall 350 and the second mask sidewall 360 in detail with reference to the accompanying drawings. - Referring to
FIG. 4 , afirst sidewall film 345 conformally covering thefirst core layer 300 and thebase 100 is formed. - The
first sidewall film 345 is used to provide a process foundation for subsequently forming a fourth mask sidewall. The fourth mask sidewall is used as a part of the second mask sidewall. Subsequently, the fourth mask sidewall needs to be further removed. Therefore, thefirst sidewall film 345 is an easily removed material, and the process of subsequently removing the fourth mask sidewall do less damage to other film layers. - In some implementations, the material of the
first sidewall film 345 is SiN. SiN is a mask sidewall material commonly used in the SAQP process. The rigidity and the density of SiN are relatively high, and selecting SiN can help ensure the etching mask effect of the subsequent second mask sidewall. SiN and a-Si have a relatively large etching selection ratio, so that the probability that the subsequent second mask sidewall is damaged in the procedure for removing thefirst core layer 300 can be reduced. - In some other implementations, when the material of the first core layer is SiN, the material of the first sidewall film may be correspondingly Poly-Si. In other implementations, according to actual situations, the material of the first sidewall film may also be SiO, SiON, CN, SiC, SiCN, or SiOCN.
- In some implementations, the
first sidewall film 345 has a third preset thickness t1 (as shown inFIG. 4 ), and the third preset thickness t1 is used to define the difference between the thicknesses of the subsequent second mask sidewall and first mask sidewall. Because the thickness of the first mask sidewall is equal to the first preset spacer, and the thickness of the second mask sidewall is equal to the second preset spacer, correspondingly, the third preset thickness t1 is equal to the difference between the second preset spacer and the first preset spacer. - In some implementations, to improve the uniformity of the third preset thickness t1, thereby improving the thickness uniformity of the subsequently formed fourth mask sidewall, the
first sidewall film 345 is formed using an atomic layer deposition process. Moreover, the atomic layer deposition process can be used to help reduce the control difficulty of the third preset thickness t1. In other implementations, the first sidewall film may also be formed using a chemical vapor deposition process. - Referring to
FIG. 5 , thefirst sidewall film 345 of thefirst region 100 a is removed. - The
first sidewall film 345 of thefirst region 100 a is removed, so that the first mask sidewall subsequently formed on thefirst region 100 a has a smaller thickness. Specifically, the step of removing thefirst sidewall film 345 of thefirst region 100 a includes: forming asecond photoresist layer 380, to cover afirst sidewall film 345 of thesecond region 100 b; and etching and removing thefirst sidewall film 345 of thefirst region 100 a using thesecond photoresist layer 380 as a mask. - In some implementations, the
first sidewall film 345 is etched using a dry etching process. The dry etching process has an anisotropic etching property, and can help improve the profile quality of the residualfirst sidewall film 345. - In some implementations, after the
first sidewall film 345 of thefirst region 100 a is removed, thesecond photoresist layer 380 is removed using an ashing manner or a wet photoresist removing manner. - Referring to
FIG. 6 , after thefirst sidewall film 345 of thefirst region 100 a is removed, asecond sidewall film 355 is formed, to conformally cover thefirst core layer 300, thebase 100, and the residualfirst sidewall film 345. - Subsequently, the
second sidewall film 355 on the sidewall of thefirst core layer 300 of thefirst region 100 a is reserved as the first mask sidewall. The first mask sidewall is used as a mask for subsequently patterning the bottomcore material layer 205 of thefirst region 100 a to form the second core layer. - In some implementations, the material of the
second sidewall film 355 is SiN. In some other implementations, when the material of the first core layer is SiN, the material of the second sidewall film may be correspondingly Poly-Si. In other implementations, according to actual situations, the material of the second sidewall film may also be SiO, SiON, CN, SiC, SiCN, or SiOCN. For descriptions of the material of thesecond sidewall film 355, reference may be made to the foregoing corresponding descriptions of thefirst sidewall film 345. Details are not described herein again. - The
second sidewall film 355 has a fourth preset thickness t2, and the fourth preset thickness t2 is equal to the first preset spacer. - In some implementations, to improve the uniformity of the fourth preset thickness t2, and reduce the control difficulty of the fourth preset thickness t2, the
second sidewall film 355 is formed using an atomic layer deposition process. In other implementations, the second sidewall film may also be formed using a chemical vapor deposition process. - Referring to
FIG. 7 , the top of thefirst core layer 300 and thesecond sidewall film 355 and thefirst sidewall film 345 on thebase 100 are removed using a blanket etching process, the residualsecond sidewall film 355 on the sidewall of the first core layer is reserved as thefirst mask sidewall 350, and the residualfirst sidewall film 345 is reserved as the fourth mask sidewall 340. The fourth mask sidewall 340 is located between thefirst mask sidewall 350 and thefirst core layer 300 of thesecond region 100 b, and between thefirst mask sidewall 350 and the bottomcore material layer 205 of thesecond region 100 b, and the fourth mask sidewall 340 and thefirst mask sidewall 350 of thesecond region 100 b construct the second mask sidewall 360. - The
first mask sidewall 350 of thefirst region 100 a, and the second mask sidewall 360 of thesecond region 100 b are used as etching masks for subsequently patterning the bottomcore material layer 205. - In some implementations, the
second sidewall film 355 and thefirst sidewall film 345 are etched selectively along the surface normal direction of the base 100 using an anisotropic blanket dry etching process, to form thefirst mask sidewall 350 on the sidewall of thefirst core layer 300 of thefirst region 100 a, and form the second mask sidewall 360 on the sidewall of thefirst core layer 300 of thesecond region 100 b. - In some implementations, the material of the
first mask sidewall 350 and the material of the second mask sidewall 360 are the same, and both are SiN, so that the etching mask effects of thefirst mask sidewall 350 and the second mask sidewall 360 are the same. - In some implementations, the second mask sidewall 360 is constructed by the
first mask sidewall 350 and the fourth mask sidewall 340 formed on thesecond region 100 b. Therefore, compared with thefirst mask sidewall 350 formed on thefirst region 100 a, the thickness of the second mask sidewall 360 formed on thesecond region 100 b is larger. - Referring to
FIG. 8 , the first core layer 300 (as shown inFIG. 7 ) is removed. - The
first core layer 300 is removed to provide a process foundation for subsequently patterning the bottomcore material layer 205. - In some implementations, the
first core layer 300 is etched and removed using a wet etching process. Specifically, the material of thefirst core layer 300 is a-Si, and the etching solution used in the wet etching process is a mixing solution of C12 and HBr or a TMAH solution. In other implementations, the first core layer may also be removed using a dry etching process, or a process combining dry etching and wet etching. - Referring to
FIG. 9 , after the first core layer 300 (as shown inFIG. 7 ) is removed, the bottom core material layer 205 (as shown inFIG. 8 ) is patterned using thefirst mask sidewall 350 and the second mask sidewall 360 as masks, to form a plurality of discrete second core layers 200. - The
second core layer 200 is used to provide a process foundation for subsequently forming a third mask sidewall. In the subsequent manufacturing procedure, the third mask sidewall is formed on the sidewall of thesecond core layer 200, and the third mask sidewall is used as a mask for patterning the base 100 to form the target patterns. - In some implementations, the material of the
second core layer 200 is correspondingly a-Si. - In some implementations, along a direction of the base 100 pointing to the bottom
core material layer 205, a thirdetching stopping layer 210 and a secondetching stopping layer 220 are sequentially formed on the bottomcore material layer 205. Therefore, by using thefirst mask sidewall 350 and the second mask sidewall 360 as masks, the secondetching stopping layer 220, the thirdetching stopping layer 210, and the bottomcore material layer 205 are sequentially etched using a dry etching process. - In some implementations, the patterns are transferred to the
second core layer 200 using thefirst mask sidewall 350 and the second mask sidewall 360, and the second preset thickness T2 (as shown inFIG. 7 ) is greater than the first preset thickness T1 (as shown inFIG. 7 ). Therefore, along the direction perpendicular to the sidewall of thesecond core layer 200, a width W4 of thesecond core layer 200 of thesecond region 100 b is greater than a width W3 of thesecond core layer 200 of thefirst region 100 a. - Specifically, the width W3 of the
second core layer 200 of thefirst region 100 a is used to define the spacer between target patterns subsequently formed on thefirst region 100 a, and the width W4 of thesecond core layer 200 of thesecond region 100 b is used to define the spacer between target patterns subsequently formed on thesecond region 100 b. - It should be noted that, in the pattern transfer procedure, the
first mask sidewall 350, the second mask sidewall 360, and the secondetching stopping layer 220 also have losses. In some implementations, after thesecond core layer 200 is formed, thefirst mask sidewall 350, the second mask sidewall 360, and the secondetching stopping layer 220 have all been removed, only the thirdetching stopping layer 210 is reserved on the top of thesecond core layer 200. - Therefore, referring to
FIG. 10 , after thesecond core layer 200 is formed, the method further includes: removing the thirdetching stopping layer 210. Specifically, the material of the thirdetching stopping layer 210 is a-C. Therefore, the thirdetching stopping layer 210 may be directly removed in the same etching machine using an ashing process. The process is simple, and no transfer machine is needed. - Referring to
FIG. 11 andFIG. 12 , a third mask sidewall 140 (as shown inFIG. 12 ) is formed on the sidewall of thesecond core layer 200. - The
third mask sidewall 140 is used as a mask for patterning thebase 100. Therefore, a thickness T3 of the third mask sidewall 140 (as shown inFIG. 12 ) is equal to the width of the target pattern. The thickness T3 of thethird mask sidewall 140 refers to the size of thethird mask sidewall 140 along the direction perpendicular to the sidewall of thesecond core layer 200. - In some implementations, the material of the
third mask sidewall 140 is SiN. For descriptions of the material of thethird mask sidewall 140, reference may be made to the foregoing corresponding descriptions of thefirst sidewall film 345. Details are not described herein again. - Specifically, the step of forming the
third mask sidewall 140 includes: forming afourth sidewall film 145 conformally covering thesecond core layer 200 and thebase 100; and removing the top of thesecond core layer 200 and thefourth sidewall film 145 on the base 100 using a blanket etching process, and reserving the residualfourth sidewall film 145 on the sidewall of thesecond core layer 200 as thethird mask sidewall 140. For specific descriptions of the step of forming thefourth mask sidewall 140, reference may be made to the foregoing related descriptions of forming the first mask sidewall 350 (as shown inFIG. 7 ). Details are not described herein again. - Referring to
FIG. 13 , the second core layer 200 (as shown inFIG. 12 ) is removed. - The
second core layer 200 is removed to provide a process foundation for subsequently forming thebase 100. - In some implementations, the
second core layer 200 is etched and removed using a wet etching process. For specific descriptions of the process of removing thesecond core layer 200, reference may be made to the foregoing corresponding descriptions of removing the first core layer 300 (as shown inFIG. 7 ). Details are not described herein again. - Referring to
FIG. 14 and theFIG. 15 , after the second core layer 200 (as shown inFIG. 12 ) is removed, the base 100 (as shown inFIG. 13 ) is patterned using thethird mask sidewall 140 as a mask, to form a plurality oftarget patterns 160 protruding out of theresidual base 100. - Specifically, the first
etching stopping layer 130, thelapping stopping layer 125, and the base 100 are sequentially etched using thethird mask sidewall 140 as a mask, to form thetarget patterns 160 protruding out of theresidual base 100. - In some implementations, the
third mask sidewall 140 is formed on the sidewall of the second core layer 200 (as shown inFIG. 12 ), and along the direction perpendicular to the sidewall of thesecond core layer 200, the width W4 (as shown inFIG. 10 ) of thesecond core layer 200 of thesecond region 100 b is greater than the width W3 (as shown inFIG. 10 ) of thesecond core layer 200 of thefirst region 100 a. Therefore, a pitch P4 between thetarget patterns 160 of thesecond region 100 b is greater than a pitch P3 between thetarget patterns 160 of thefirst region 100 a, to meet the requirement of different pitches. - In some implementations, after the
base 100 is patterned, theresidual base 100 is used as thesubstrate 150, thetarget pattern 160 is the fin, and thefin 160 and thesubstrate 150 are in an integral structure. - In other implementations, when the base includes a first semiconductor layer and a second semiconductor layer epitaxially growing on the first semiconductor layer, in the step of etching the base, only the first semiconductor layer is etched. The first semiconductor layer is used as the substrate, and the residual second semiconductor layer protruding out of the first semiconductor layer is used as the fin. Correspondingly, the material of the fin may also be different from the material of the substrate.
- Specifically, the
first region 100 a is used to form a core device, thesecond region 100 b is used to form an IO device, and the thickness of a gate dielectric layer of the IO device is usually greater than the thickness of a gate dielectric layer of the core device. The pitch between the fins of thesecond region 100 b is made to be greater than the pitch between the fins of thefirst region 100 a, to provide sufficient space for forming the gate dielectric layer corresponding to the IO device. The pitch between the fins located on thefirst region 100 a is still relatively small, to save the area, and avoid affecting the improvement of the device integration. -
FIG. 16 toFIG. 20 are schematic structural diagrams corresponding to steps in another form of a method for forming a semiconductor structure. - The similarity of some implementations and the foregoing embodiment is not described herein again. The difference of some implementations from the foregoing embodiment lies in: The
second mask sidewall 360 c (as shown inFIG. 20 ) is a single layer structure. - Specifically, the forming method includes the following.
- Referring to
FIG. 16 , after thefirst core layer 300 c is formed, athird sidewall film 365 c conformally covering thefirst core layer 300 c and the secondetching stopping layer 220 c is formed. - The third sidewall film 365 is used to provide a process foundation for subsequently forming a second mask sidewall. The second mask sidewall is used to define the spacer between the target patterns subsequently formed on the
second region 100 b. Therefore, the thickness t3 of thethird sidewall film 365 c is determined according to the spacer between the target patterns on thesecond region 100 b. - In some implementations, the material of the
third sidewall film 365 c is SiN. In other implementations, the material of the third sidewall film may also be SiO, SiON, CN, Poly-Si, SiC, SiCN, or SiOCN. - In some implementations, to improve the uniformity of the thickness t3 of the
third sidewall film 365 c, and reduce the control difficulty of the thickness t3, thethird sidewall film 365 c is formed using an atomic layer deposition process. In other implementations, the third sidewall film may also be formed by using a chemical vapor deposition process. - For specific descriptions of the foregoing steps and the
third sidewall film 365 c, reference may be made to the related descriptions in the foregoing embodiment. Details are not described herein again. - Referring to
FIG. 17 , aprotective layer 380 c is formed, to conformally cover thethird sidewall film 365 c of thesecond region 100 b. - The
protective layer 380 c is used to protect thethird sidewall film 365 c of thesecond region 100 b, to avoid affecting thethird sidewall film 365 c of thesecond region 100 b in the subsequent manufacturing procedure. - It should be noted that, the subsequent step further includes: performing plasma processing on the
third sidewall film 365 c of thefirst region 100 a. Therefore, the material of theprotective layer 380 c is selected as: Theprotective layer 380 c can enter a plasma processing machine; and in the plasma processing procedure, theprotective layer 380 c can have a blocking effect, thereby preventing the plasma processing from affecting thethird sidewall film 365 c of thesecond region 100 b. - Therefore, in some implementations, the material of the
protective layer 380 c is SiO. SiO has lower costs, and higher process compatibility, and is easily removed. In other implementations, the material of the protection layer may also be SiON, SiN, Silicon Rich Oxide (SRO), or a-Si. - In some implementations, the
protective layer 380 c conformally covers thethird sidewall film 365 c of thesecond region 100 b, thereby avoiding wasting materials, and reducing the process difficulty in subsequently removing theprotective layer 380 c. - It should be noted that, a thickness t4 of the
protective layer 380 c should not be excessively small or excessively large. If the thickness t4 is excessively small, thethird sidewall film 365 c of thesecond region 100 b is easily affected by the subsequent process, thereby changing the thickness t3 (as shown inFIG. 16 ) of thethird sidewall film 365 c of thesecond region 100 b, and further affecting the spacer between the target patterns formed on thesecond region 100 b. If the thickness t4 is excessively large, not only the process costs and time are increased, but also the process difficulty in subsequently removing theprotective layer 380 c is increased. Therefore, in some implementations, the thickness t4 of theprotective layer 380 c is 2 nm to 10 nm. - In some implementations, the
protection layer 380 c is formed using an atomic layer deposition process. The atomic layer deposition process has a better step coverage capability, and can improve the forming quality and the conformal coverage capability of theprotective layer 380 c, and the atomic layer deposition process is used to further help improve the uniformity of the thickness t4 of theprotective layer 380 c. - Specifically, the step of forming the
protective layer 380 c includes: forming a protective film (not shown in the figure) conformally covering thethird sidewall film 365 c, forming a photoresist layer (not shown in the figure) on the protective film, and exposing the protective film of thefirst region 100 a; etching the protective film by using the photoresist layer as a mask, to form theprotective layer 380 c; and after theprotective layer 380 c is formed, removing the photoresist layer by using an ashing manner or a wet photoresist removing manner. - It should be noted that, in other implementations, the protective layer may also be formed using a chemical vapor deposition process. Correspondingly, the protective layer further is filled between neighboring first core layers.
- Referring to
FIG. 18 , after theprotective layer 380 c is formed, plasma processing is performed on thethird sidewall film 365 c of thefirst region 100 a, and thethird sidewall film 365 c of a partial thickness exposed by theprotective layer 380 c is transformed into thesacrificial layer 305 c. - The
third sidewall film 365 c of the partial thickness of thefirst region 100 a is transformed into thesacrificial layer 305 c, so that the thickness of the residualthird sidewall film 365 c of thefirst region 100 a is less than the thickness of thethird sidewall film 365 c of thesecond region 100 b. After the target patterns are subsequently formed, the target patterns of thefirst region 100 a have a first preset spacer, and the target patterns of thesecond region 100 b have a second preset spacer. Thesacrificial layer 305 c has a fourth preset thickness t5, and the fourth preset thickness t5 is correspondingly equal to the difference between the second preset spacer and the first preset spacer. - In some implementations, selecting the plasma processing manner easily makes the fourth preset thickness t meet the process requirement, and helps improve the uniformity of the fourth preset thickness t.
- Specifically, the plasma processing is performed in an oxygen atmosphere, that is, the plasma processing is oxygen plasma processing, thereby achieving the effect of oxidizing the
third sidewall film 365 c of the partial thickness. The process is simple. In some implementations, the material of thethird sidewall film 365 c is SiN, and the material of thesacrificial layer 305 c is SiON. - In other implementations, the plasma processing may also be performed in a hydrogen atmosphere, so that chemical bonds in the material of the
third sidewall film 365 c of the partial thickness may break down, thereby easily removing thethird sidewall film 365 c affected by the plasma processing. - Referring to
FIG. 19 , theprotective layer 380 c (as shown inFIG. 18 ) and thesacrificial layer 305 c (as shown inFIG. 18 ) are removed. - The
protective layer 380 c and thesacrificial layer 305 c are removed to provide a process foundation for subsequently performing etching processing on thethird sidewall film 365 c. In some implementations, theprotective layer 380 c and thesacrificial layer 305 c are removed using a wet etching process. Specifically, the material of thesacrificial layer 305 c is SiON, and the material of theprotective layer 380 c is SiO. Therefore, theprotective layer 380 c and thesacrificial layer 305 c may be removed in the same process step. The etching solution used in the wet etching process is a dilute hydrofluoric acid (DHF) solution. - Referring to
FIG. 20 , after theprotective layer 380 c (as shown inFIG. 18 ) and thesacrificial layer 305 c (as shown inFIG. 18 ) are removed, the top offirst core layer 300 c and thethird sidewall film 365 c (as shown inFIG. 19 ) on the secondetching stopping layer 220 c are removed using a blanket etching process, the residualthird sidewall film 365 c on the sidewall of thefirst core layer 300 c of thefirst region 100 a is reserved as thefirst mask sidewall 350 c, and the residualthird sidewall film 365 c on the sidewall of thefirst core layer 300 c of thesecond region 100 b is reserved as thesecond mask sidewall 360 c. - Through the foregoing plasma processing, the thickness of the
third sidewall film 365 c of thefirst region 100 a is less than the thickness of thethird sidewall film 365 c of thesecond region 100 b. Therefore, the thickness of thefirst mask sidewall 350 c is less than the thickness of thesecond mask sidewall 360 c. - For the descriptions of the subsequent steps, reference may be made to the corresponding descriptions in the foregoing embodiments. Details are not described herein again.
- The present disclosure further provides a semiconductor structure. Referring to
FIG. 21 ,FIG. 21 is a schematic structural diagram of one form of a semiconductor structure. - The semiconductor structure includes: a
substrate 500 and a plurality of discrete fins 510 protruding out of thesubstrate 500. Thesubstrate 500 includes acore region 500 a and aperipheral region 500 b, and a pitch P6 between the fins 510 located in theperipheral region 500 is greater than a pitch P5 between the fins 510 located in thecore region 500 a. - In some implementations, the material of the
substrate 500 is Si, and the material of the fin 510 is Si. For specific descriptions of thesubstrate 500 and the fin 510, reference may be made to the corresponding descriptions in the foregoing embodiments. Details are not described herein again. - The
core region 500 a is used to form a core device, theperipheral region 500 b is used to form an IO device, and the thickness of a gate dielectric layer of the IO device is usually greater than the thickness of a gate dielectric layer of the core device. The pitch P6 between the fins 510 located in theperipheral region 500 b is greater than the pitch P5 between the fins 510 located in thecore region 500 a, to provide sufficient space for forming the gate dielectric layer corresponding to the IO device. The pitch P5 between the fins 510 located in thecore region 500 a is still relatively small, to save the area, and avoid affecting the improvement of the device integration. - The semiconductor structure may be formed using the methods described above for forming a semiconductor structure or formed using other forming methods. For specific descriptions of the semiconductor structure of some implementations, reference may be made to the corresponding descriptions in the foregoing implementations. Details are not described herein again.
- Although the present disclosure is described as above, the present disclosure is not limited thereto. Various variations and modifications may be made by any person skilled in the art without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the scope limited by the claims.
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811604233.7A CN111370299B (en) | 2018-12-26 | 2018-12-26 | Semiconductor structure and forming method thereof |
CN201811604233 | 2018-12-26 | ||
CN201811604233.7 | 2018-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
US10685838B1 US10685838B1 (en) | 2020-06-16 |
US20200211848A1 true US20200211848A1 (en) | 2020-07-02 |
Family
ID=71075124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/542,563 Active US10685838B1 (en) | 2018-12-26 | 2019-08-16 | Semiconductor structure providing for an increased pattern density on a substrate and method for forming same |
Country Status (2)
Country | Link |
---|---|
US (1) | US10685838B1 (en) |
CN (1) | CN111370299B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210358753A1 (en) * | 2018-05-07 | 2021-11-18 | Lam Research Corporation | Selective deposition of etch-stop layer for enhanced patterning |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112864094A (en) * | 2019-11-26 | 2021-05-28 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
US11417526B2 (en) | 2020-02-03 | 2022-08-16 | Tokyo Electron Limited | Multiple patterning processes |
US11854806B2 (en) * | 2020-05-22 | 2023-12-26 | Tokyo Electron Limited | Method for pattern reduction using a staircase spacer |
CN113948463B (en) * | 2020-07-17 | 2024-03-08 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
CN114334820A (en) * | 2020-09-30 | 2022-04-12 | 上海华力集成电路制造有限公司 | Truncation process method of fin field effect transistor |
CN113035696B (en) * | 2021-02-25 | 2022-05-27 | 长鑫存储技术有限公司 | Preparation method of semiconductor structure and semiconductor structure |
CN113078117A (en) * | 2021-03-30 | 2021-07-06 | 长鑫存储技术有限公司 | Mask pattern, semiconductor structure and preparation method thereof |
CN115223863A (en) * | 2021-04-21 | 2022-10-21 | 长鑫存储技术有限公司 | Method for manufacturing semiconductor structure |
CN113314408A (en) * | 2021-04-23 | 2021-08-27 | 长江先进存储产业创新中心有限责任公司 | Hard mask laminated structure and semiconductor device forming method |
CN113517181A (en) * | 2021-04-27 | 2021-10-19 | 长江先进存储产业创新中心有限责任公司 | Hard mask laminated structure and semiconductor device forming method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150041812A1 (en) * | 2013-08-07 | 2015-02-12 | International Business Machines Corporation | Integration of dense and variable pitch fin structures |
US20150318181A1 (en) * | 2014-05-02 | 2015-11-05 | GlobalFoundries, Inc. | Methods for fabricating integrated circuits using self-aligned quadruple patterning |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5289479B2 (en) * | 2011-02-14 | 2013-09-11 | 株式会社東芝 | Manufacturing method of semiconductor device |
CN104795332B (en) * | 2014-01-21 | 2018-02-16 | 中芯国际集成电路制造(上海)有限公司 | The forming method of fin formula field effect transistor |
CN108122843B (en) * | 2016-11-30 | 2020-12-25 | 中芯国际集成电路制造(上海)有限公司 | Fin field effect transistor forming method and semiconductor structure |
-
2018
- 2018-12-26 CN CN201811604233.7A patent/CN111370299B/en active Active
-
2019
- 2019-08-16 US US16/542,563 patent/US10685838B1/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150041812A1 (en) * | 2013-08-07 | 2015-02-12 | International Business Machines Corporation | Integration of dense and variable pitch fin structures |
US20150318181A1 (en) * | 2014-05-02 | 2015-11-05 | GlobalFoundries, Inc. | Methods for fabricating integrated circuits using self-aligned quadruple patterning |
US9209038B2 (en) * | 2014-05-02 | 2015-12-08 | GlobalFoundries, Inc. | Methods for fabricating integrated circuits using self-aligned quadruple patterning |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210358753A1 (en) * | 2018-05-07 | 2021-11-18 | Lam Research Corporation | Selective deposition of etch-stop layer for enhanced patterning |
US11869770B2 (en) * | 2018-05-07 | 2024-01-09 | Lam Research Corporation | Selective deposition of etch-stop layer for enhanced patterning |
Also Published As
Publication number | Publication date |
---|---|
CN111370299A (en) | 2020-07-03 |
CN111370299B (en) | 2023-03-10 |
US10685838B1 (en) | 2020-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10685838B1 (en) | Semiconductor structure providing for an increased pattern density on a substrate and method for forming same | |
KR101004691B1 (en) | Method for forming micropattern in semiconductor device | |
KR100965775B1 (en) | Method for forming micropattern in semiconductor device | |
US8623771B2 (en) | Method for fabricating micropattern of semiconductor device | |
US11309182B2 (en) | Semiconductor structure and method for forming the same | |
US11769691B2 (en) | Semiconductor device and formation method thereof | |
WO2022095419A1 (en) | Semiconductor device preparation method | |
KR101867503B1 (en) | Method of forming fine pattern for semiconductor device | |
US20130203247A1 (en) | Method of fabricating a semiconductor structure | |
CN111199880B (en) | Manufacturing method of semiconductor device and semiconductor device | |
CN114334619A (en) | Method for forming semiconductor structure | |
US10957550B2 (en) | Semiconductor structure and formation method thereof | |
CN110690117B (en) | Semiconductor structure and forming method thereof | |
CN112017948B (en) | Semiconductor structure and forming method thereof | |
US11557480B2 (en) | Semiconductor structure and fabrication method thereof | |
US11189492B2 (en) | Semiconductor structure and fabrication method thereof | |
US20220130672A1 (en) | Semiconductor structure formation method and mask | |
US11309183B2 (en) | Semiconductor structure and forming method thereof | |
CN113066724B (en) | Fin type field effect transistor and manufacturing method thereof | |
KR20110083978A (en) | Method of forming fine pattern of semiconductor device | |
CN113327843B (en) | Method for forming semiconductor structure | |
CN115332061B (en) | Manufacturing method of grid structure | |
KR20090027431A (en) | Method for forming micropattern in semiconductor device | |
KR100265853B1 (en) | A method for fabrication of semiconductor device | |
CN117832064A (en) | Method for forming semiconductor structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
AS | Assignment |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SHILIANG, JI;YIYING, ZHANG;HAIYANG, ZHANG;REEL/FRAME:051285/0861 Effective date: 20190808 Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SHILIANG, JI;YIYING, ZHANG;HAIYANG, ZHANG;REEL/FRAME:051285/0861 Effective date: 20190808 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |