US20170216994A1 - Chemical mechanical polishing conditioner and fabrication method thereof - Google Patents

Chemical mechanical polishing conditioner and fabrication method thereof Download PDF

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Publication number
US20170216994A1
US20170216994A1 US15/293,642 US201615293642A US2017216994A1 US 20170216994 A1 US20170216994 A1 US 20170216994A1 US 201615293642 A US201615293642 A US 201615293642A US 2017216994 A1 US2017216994 A1 US 2017216994A1
Authority
US
United States
Prior art keywords
substrate
abrasive
layer
mechanical polishing
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/293,642
Other languages
English (en)
Inventor
Jui-Lin Chou
Chia-Feng CHIU
Yu-Tai Chen
Wen-Jen Liao
Xue-Shen Su
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kinik Co
Original Assignee
Kinik Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Assigned to KINIK COMPANY LTD. reassignment KINIK COMPANY LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, YU-TAI, CHIU, CHIA-FENG, CHOU, JUI-LIN, LIAO, WEN-JEN, SU, XUE-SHEN
Publication of US20170216994A1 publication Critical patent/US20170216994A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
US15/293,642 2016-02-01 2016-10-14 Chemical mechanical polishing conditioner and fabrication method thereof Abandoned US20170216994A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105103089A TW201728411A (zh) 2016-02-01 2016-02-01 化學機械研磨修整器及其製造方法
TW105103089 2016-02-01

Publications (1)

Publication Number Publication Date
US20170216994A1 true US20170216994A1 (en) 2017-08-03

Family

ID=59385270

Family Applications (1)

Application Number Title Priority Date Filing Date
US15/293,642 Abandoned US20170216994A1 (en) 2016-02-01 2016-10-14 Chemical mechanical polishing conditioner and fabrication method thereof

Country Status (3)

Country Link
US (1) US20170216994A1 (zh)
CN (1) CN107020574A (zh)
TW (1) TW201728411A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160346901A1 (en) * 2015-06-01 2016-12-01 Kinik Company Chemical Mechanical Polishing Conditioner
CN110556318A (zh) * 2019-09-04 2019-12-10 张家港市欧微自动化研发有限公司 一种基于晶片粘片设备的晶片粘片方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023055649A1 (en) * 2021-09-29 2023-04-06 Entegris, Inc. Double-sided pad conditioner
CN113997201B (zh) * 2021-11-11 2022-07-22 深圳市前海科创石墨烯新技术研究院 一种新型抛光垫修整盘组装方法及制造工具

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6872127B2 (en) * 2002-07-11 2005-03-29 Taiwan Semiconductor Manufacturing Co., Ltd Polishing pad conditioning disks for chemical mechanical polisher
US8900473B2 (en) * 2008-08-06 2014-12-02 Hitachi Chemical Company, Ltd. Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP
TW201016387A (en) * 2008-10-22 2010-05-01 jian-min Song CMP Pad Dressers with Hybridized abrasive surface and related methods
CN103221180A (zh) * 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
TWI492291B (zh) * 2012-06-28 2015-07-11 Kinik Co 化學機械研磨修整器及其製造方法
CN203390712U (zh) * 2013-04-08 2014-01-15 宋健民 化学机械研磨修整器
TWM465659U (zh) * 2013-04-08 2013-11-11 jian-min Song 化學機械硏磨修整器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160346901A1 (en) * 2015-06-01 2016-12-01 Kinik Company Chemical Mechanical Polishing Conditioner
CN110556318A (zh) * 2019-09-04 2019-12-10 张家港市欧微自动化研发有限公司 一种基于晶片粘片设备的晶片粘片方法

Also Published As

Publication number Publication date
TW201728411A (zh) 2017-08-16
CN107020574A (zh) 2017-08-08

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Date Code Title Description
AS Assignment

Owner name: KINIK COMPANY LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOU, JUI-LIN;CHIU, CHIA-FENG;CHEN, YU-TAI;AND OTHERS;REEL/FRAME:040087/0866

Effective date: 20160616

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION