US20170197276A1 - Method for bonding stainless steel members and stainless steel - Google Patents
Method for bonding stainless steel members and stainless steel Download PDFInfo
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- US20170197276A1 US20170197276A1 US15/471,712 US201715471712A US2017197276A1 US 20170197276 A1 US20170197276 A1 US 20170197276A1 US 201715471712 A US201715471712 A US 201715471712A US 2017197276 A1 US2017197276 A1 US 2017197276A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/227—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded with ferrous layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D6/00—Heat treatment of ferrous alloys
- C21D6/002—Heat treatment of ferrous alloys containing Cr
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/001—Ferrous alloys, e.g. steel alloys containing N
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/002—Ferrous alloys, e.g. steel alloys containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
- C22C38/44—Ferrous alloys, e.g. steel alloys containing chromium with nickel with molybdenum or tungsten
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
- C22C38/54—Ferrous alloys, e.g. steel alloys containing chromium with nickel with boron
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
- C22C38/58—Ferrous alloys, e.g. steel alloys containing chromium with nickel with more than 1.5% by weight of manganese
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
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- B23K2203/05—
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D2211/00—Microstructure comprising significant phases
- C21D2211/001—Austenite
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D2211/00—Microstructure comprising significant phases
- C21D2211/008—Martensite
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Abstract
A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.
Description
- This application is a divisional of U.S. application Ser. No. 14/881,971 filed Oct. 13, 2015, the entire contents of which is incorporated herein by reference. U.S. application Ser. No. 14/881,971 is a continuation application of International Application PCT/JP2014/074972 filed on Sep. 19, 2014 and designated the U.S., the entire contents of which are incorporated herein by reference.
- The present application relates to a method for bonding stainless steel members and a stainless steel.
- A technology for bonding stainless steel members is being demanded. For example, Patent Document 1 discloses a technology in which surfaces of metal members are activated by removing oxides on bonding faces with a chemical treatment and thereby a diffusion bonding is performed at a low temperature for suppressing grain coarsening.
- Patent Document 1: Japanese Laid-open Patent Publication No. 2011-200930
- According to an aspect of the present invention, there is provided a method for bonding stainless steel members including: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.
- According to another aspect of the present invention, there is provided a stainless steel that is obtained by bonding the first stainless steel member and the second stainless steel member by the above-mentioned method for bonding stainless steel members.
- According to another aspect of the present invention, there is provided a method for bonding stainless steel members including: contacting a first austenitic stainless steel member with a second austenitic stainless steel member that contains at least 30 volume % of martensite; and heating the first and second austenitic stainless steel members to an As temperature or higher, after the contacting.
- According to another aspect of the present invention, there is provided a stainless steel that is obtained by bonding the first austenitic stainless steel member and the second austenitic stainless steel member by the above-mentioned method for bonding stainless steel members.
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FIG. 1 illustrates a solid-phase diffusion bonding method in accordance with a comparative embodiment; -
FIG. 2 illustrates a bonding method in accordance with a first embodiment; -
FIG. 3 illustrates a flowchart of a bonding method in accordance with a first embodiment; -
FIG. 4 illustrates a flowchart of a bonding method in accordance with a second embodiment; -
FIG. 5 illustrates a result of a cross section around a bonding part observed by EBSD; -
FIG. 6 illustrates a relationship between temperatures during bonding and bonding strength; -
FIG. 7 illustrates a relationship between temperatures during bonding and bonding strength; -
FIG. 8 illustrates a relationship between temperatures during bonding and bonding strength. - Generally, a stainless steel is made by a smelting or a refining. After that, a microstructure of the stainless steel is adjusted in order to provide superior performance and is shipped. Generally, the stainless steel is processed into assemblies, and the assemblies are assembled. Thereby, various apparatuses are manufactured. There are various bonding technologies for assembling a stainless steel. However, a solid-phase diffusion bonding for contacting a bonding face with another bonding face in a solid phase and heating the bonding faces has to be used as a bonding technology of small stainless steels that can be used and has strength at a relative low temperature and has a length of a few millimeters or less.
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FIG. 1 illustrates a solid-phase diffusion bonding method in accordance with a comparative embodiment. As illustrated inFIG. 1 , astainless steel member 10 and astainless steel member 20 are compressed to each other by apressure device 30 at a high temperature. Thus, astainless steel 40 that is a bonded assembly is obtained. In order to activate diffusion of constituent atoms sufficiently, a temperature of 1000 degrees C. or higher is needed. However, with a high temperature process, a problem may occur that coarsening of crystal grains occurs in thestainless steel 40, and a problem may occur that strength of thestainless steel 40 is reduced by softening. - In order to solve the problems, it is necessary to achieve the diffusion bonding even if the temperature is low. For the purpose of solving the problems, research and development are being performed in order to activate bonding faces by cleaning the bonding faces The above-mentioned Patent Document 1 is an example. However, in a process using activation of a surface, when an activated surface is exposed to air, the activated surface is instantly contaminated by oxygen. And, the activated surface may be inactivated. Therefore, high quality bonding may not be achieved. It is thought that a sequence of processes from the surface treatment to the bonding are performed in a vacuum chamber. However, in this case, cost may increase.
- The present inventors focus attention on a phenomenon of re-crystallization occurring in a final thermal process of processes for adjusting a structure of a stainless steel member. During the phenomenon, in a material, a newly generated crystal grain (re-crystallized grain) grows up introducing atoms into a surface from a surrounding material. The driving force is caused by a difference of internal energy between re-crystallized grains that have low internal energy and are stable under an equilibrium state and re-crystallized grains that have high internal energy caused by strain or the like and are unstable. Based on the principle, when members are unstable by enhancing internal energy of the members, atoms near a metal surface become more stable by crossing a bonding face and moving to a surface of re-crystallized grains exposed from the other bonding face. Moreover, when the bonding faces disappear, energy becomes lower and brings stability. As a result, the re-crystallized grains of the other bonding face cross the other bonding face and grow up. Thereby, an integrated strong bonding is achieved. In this case, when the difference of the internal energy of the both is sufficiently large, the growing of the crystal grains progresses free from prevention by some contamination of the bonding faces.
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FIG. 2 illustrates a bonding method in accordance with a first embodiment.FIG. 3 illustrates a flowchart of the bonding method. First, before heating for the bonding, at least one of thestainless steel member 10 and thestainless steel member 20 is subjected to a reduction exceeding 50% to accumulate strain thereinside (Step S1), Next, bonding surfaces of thestainless steel member 10 and thestainless steel member 20 are smoothed (Step S2). - Next, the bonding surfaces of the
stainless steel member 10 and thestainless steel member 20 are in touch with each other and are heated (Step S3). A heating temperature in this case is equal to a re-crystallization initiation temperature or higher. When the temperatures of thestainless steel member 10 and thestainless steel member 20 are equal to the re-crystallization initiation temperature or higher, re-crystallized grains are generated in thestainless steel member 10 and thestainless steel member 20. Moreover, re-crystallized grains of the bonding face cross the bonding face and grow up, and strong bonding is achieved. Thus, thestainless steel 40 is obtained. When thestainless steel member 10 and thestainless steel member 20 are pressed by thepressure device 30 and tightly adhere to each other in Step S3, stronger bonding is achieved. - In the embodiment, the strain is accumulated in at least one of the
stainless steel member 10 and thestainless steel member 20 by adding reduction exceeding 50%. Thus, it is possible to achieve high quality bonding at a relative low temperature that is equal to the re-crystallization initiation temperature or higher. The crystal of thestainless steel 40 is miniaturized, because the bonding at the relative low temperature is achieved. Therefore, it is possible to suppress softening of thestainless steel 40. Accordingly, it is possible to manufacture a bonded assembly having high material strength and high spring characteristics. Even if the bonding surface is contaminated to some extent because of adsorption of oxygen or the like, the bonding can be achieved. It is therefore possible to perform the sequence of processes in normal air except for the heating for the bonding. Moreover, it is possible to adjust the structure of thestainless steel 40 to a necessary fine structure by a combination of a processing of enhancing internal energy in advance and adding strain, the bonding temperature and the process time. It is therefore possible to perform a manufacturing of materials and assembling of assemblies in parallel in the sequence of processes. And, it is possible to contribute to efficiency of works and energy conservation, by omitting a thermal process to adjust a fine structure during a material manufacturing. - With the bonding method in accordance with the embodiment, the bonding of high quality can be achieved at a temperature that is equal to the re-crystallization initiation temperature or higher. However, it is preferable that the bonding is achieved at a temperature that is equal to the re-crystallization initiation temperature or higher and is equal to the re-crystallization initiation temperature plus 100 degrees C. or lower, from a viewpoint of suppression of coarsening of the crystal grains. And, it is preferable that both of the
stainless steel member 10 and thestainless steel member 20 are subjected to the reduction exceeding 50% and the strain is accumulated in both of thestainless steel member 10 and thestainless steel member 20. - In a second embodiment, an effect caused by a phase transformation of metastable austenite-based stainless steel is used.
FIG. 4 illustrates a flowchart of a bonding method in accordance with the second embodiment. In the embodiment, the metastable austenite-based stainless steel is used as thestainless steel members - Before the heating for the bonding, strain is added to at least one of the
stainless steel member 10 and thestainless steel member 20 at a temperature that is equal to an Md point or lower. Thereby, martensite of 30 volume % or more is generated in the stainless steel member to which the strain is added (Step S11). Martensite transformation is achieved by processing at the Md point or lower. - Next, the bonding surfaces of the
stainless steel members stainless steel members stainless steel members stainless steel members stainless steel members stainless steel 40 is obtained. When thestainless steel members pressure device 30 and adhere to each other, stronger bonding is achieved. - In the embodiment, at least one of the metastable austenite-based
stainless steel members stainless steel 40 is miniaturized and softening of thestainless steel 40 is suppressed. It is therefore possible to manufacture a bonded assembly that has high material strength and high spring characteristic. Even if bonding faces are contaminated in some degree because of adsorption of oxygen, bonding can be achieved, It is therefore possible to perform a sequence of processes in normal air, except for the heating for the bonding. Moreover, it is possible to adjust the structure into a necessary fine structure by combining of a process of generating the martensite, the bonding temperature and the process time. It is therefore possible to perform a manufacturing of materials and assembling of assemblies in parallel in the sequence of processes. And it is possible to contribute to efficiency of works and energy saving by omitting a thermal process for adjusting of a microstructure in a manufacturing of materials. - In the bonding method in accordance with the embodiment, high quality bonding can be achieved at a temperature that is equal to the As point or higher. However, it is preferable to achieve the bonding at a temperature that is equal to the As point or higher and is equal to a re-crystallization initiation temperature plus 100 degrees C. or lower, in terms of suppressing coarsening crystal grains. It is preferable that at least one of the
stainless steel members stainless steel members stainless steel members stainless steel members stainless steel members - In the embodiment, the martensite is generated by the process at the Md point or lower. However, the martensite may be generated by rapidly cooling stable austenite to the Ms point or lower. When stable austenite is rapidly cooled to the Ms point or lower, the martensite is generated.
- Austenite-based stainless steel SUS316L was subjected to 99% reduction at a normal temperature (that is equal to the Md point or higher) by forging and rolling. The resulting board having a thickness of 1 mm was cut into two small pieces having a width of 12 mm and a length of 20 mm, First faces of the small pieces were processed into mirrored faces by emery paper and buffing in the atmosphere. The mirrored faces are made to face with each other and arranged crosswise in a vacuum chamber. Thus, the faces of 12 mm×12 mm adhered to each other. After vacuuming, the pieces were heated by high frequency heating to 730 degrees C. that is equal to a re-crystallization initiation temperature or higher under a condition that a load of 1 kN was added to the pieces in order to achieve adherence of the pieces. After the temperature of 730 degrees C. under the condition was kept for 30 minutes, the pieces were unloaded, cooled and brought out. Thereby, the pieces were strongly bonded. For confirmation, one of the pieces bonded crosswise was fixed by a vise, and the other was hammered to a dragging away direction. This results in bending of the piece fixed by the vise without dragging away.
- In a second example, the same bonding as the first example except for adding 80% rolling was performed. In the second example, a strong bonding was achieved.
- In a first comparative example, the same bonding as the first example except for adding 50% rolling was performed. The resulting bonded assembly was dragged away by hammering.
- In a second comparative example, the same bonding as the first example was performed except for using SUS316L material in which strain was completely removed and was subjected to a solution treatment. The resulting bonded assembly was easily dragged away by a hand.
- In the first and second examples, it is thought that re-crystallized grains crossed a bonding face and grew up and high quality bonding was achieved because strain was accumulated in the pieces by adding reduction exceeding 50% and, after that, the bonding was performed at a temperature that is equal to the re-crystallization initiation temperature or higher. On the other hand, in the second comparative example, it is thought that strong bonding was not achieved because the strain was completely removed. In the first comparative example, it is thought that sufficient bonding strength was not achieved because of lack of strain although given bonding strength was achieved by accumulation of internal strain.
- In a third example, metastable austenite-based stainless steel SUS304 was subjected to totally 99% strain at 300 degrees C. (that is equal to the Md point or higher) by multi-direction forging and rolling corresponding to 90% and rolling corresponding to 90%. The resulting board having a thickness of 1 mm was cut into two small pieces having a width of 12 mm and a length of 20 mm. First faces of the small pieces were processed into mirrored faces by emery paper and buffing in the atmosphere. The mirrored faces are made to face with each other and arranged crosswise in a vacuum chamber. Thus, the faces of 12 mm×12 mm adhered to each other. After vacuuming, the pieces were heated by high frequency heating to 730 degrees C. that is equal to a re-crystallization initiation temperature or higher under a condition that a load of 1 kN was added to the pieces in order to achieve adherence of the pieces. After the temperature of 730 degrees C. under the condition was kept for 30 minutes, the pieces were unloaded, cooled and brought out. Thereby, the SUS304 pieces were strongly bonded although, normally, a temperature of approximately 1000 degrees C. was needed for diffusion bonding of SUS304 pieces.
- Cross sections near the bonding part were observed by EBS D (Electron Backscatter Diffraction).
FIG. 5 illustrates the observation result. InFIG. 5 , the bonding part is between a left arrow and a right arrow Although the cross sections were smoothed before bonding, unevenness caused by grain growth from up and down was observed. - In a fourth example, austenite-based stainless steel SUS316L was subjected to 99% reduction at a normal temperature (that is equal to the Md point or higher) by forging and rolling. The resulting board having a thickness of 1 mm was cut into two small pieces having a width of 10 mm and a length of 50 mm. First faces of the small pieces were processed into mirrored faces by emery paper and buffing in the atmosphere. The mirrored faces are made to face with each other and arranged crosswise in a vacuum chamber. Thus, the faces of 10 mm×10 mm adhered to each other. After vacuuming, the pieces were heated by high frequency heating to various temperatures under a condition that a load of 1 kN was added to the pieces through a punched hole having a diameter of 5 mm in order to achieve adherence of the pieces. After the temperatures under the condition was kept for 30 minutes, the pieces were unloaded, cooled and brought out. For confirmation, a cross tension test of 0.01 mm/s was performed. And bonding strength was evaluated.
- In a third comparative example, the same bonding as the fourth example was performed except for using SUS316L material in which strain was completely removed and was subjected to a solution treatment.
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FIG. 6 illustrates a relationship between the temperatures during the bonding of the fourth example and the third comparative example and the bonding strength. InFIG. 6 , a horizontal axis indicates the temperatures during the bonding. A vertical axis indicates the bonding strength. W99 indicates the results of the fourth example. SOL indicates the results of the third comparative example. As illustrated inFIG. 6 , in the both cases, the bonding strength tends to increase as the temperature during the bonding increases. However, the results of the fourth example are shifted to a lower temperature side, compared to the third comparative example. That is, it is apparent that in the fourth example, the temperature during the bonding can be reduced in order to achieve identical bonding strength, compared to the third comparative example. - In a fifth example, metastable austenite-based stainless steel SUS304 was subjected to 90% reduction at 300 degrees C. (that is equal to the Md point or higher) by multi-direction forging and rolling and was subjected to 90% rolling at a normal temperature (that is equal to the Md point or higher). Almost entirely the resulting board was transformed into martensite and had a thickness of 1 mm. The resulting board was cut into two small pieces having a width of 12 mm and a length of 20 mm. First faces of the small pieces were processed into mirrored faces by emery paper and buffing in the atmosphere. The mirrored faces are made to face with each other and arranged crosswise in a vacuum chamber. Thus, the faces of 12 mm×12 mm adhered to each other. After vacuuming, the pieces were heated by high frequency heating to 700 degrees C. that is equal to the As point or higher under a condition that a load of 1 kN was added to the pieces in order to achieve adherence of the pieces. After the temperature of 700 degrees C. under the condition was kept for 30 minutes, the pieces were unloaded, cooled and brought out. Thereby, the SUS304 pieces were strongly bonded although, normally, a temperature of approximately 1000 degrees C. was needed for diffusion bonding of SUS304 pieces. For confirmation, one of the pieces bonded crosswise was fixed by a vise, and the other was hammered to a dragging away direction. This results in bending of the piece fixed by the vise without dragging away.
- In a fourth comparative example, the bonding test was performed under the same condition as the fifth example with use of a SUS304 sample that was subjected to totally 99% strain by multi-direction forging and rolling corresponding to 90% and rolling corresponding to 90% at 300 degrees C. The rolling was not performed at a temperature that is equal to the Md point or lower. Therefore, martensite was not generated. When one of the members bonded crosswise was fixed by a vise and the other of the members was hammered in a dragging away direction, the other was dragged away.
- In a fifth comparative example, the test was performed under the same condition as the fourth comparative example except for using the same size SUS304 to which strain was not added after the a thermal process for removing the strain.
- In the fifth example, it is thought that re-crystallized grains crossed a bonding face and grew up and high quality bonding was achieved because the martensite of 30 volume % or more was generated and the bonding was performed at the temperature that is equal to the As point or higher. On the other hand, in the fourth and fifth comparative examples, it is thought that strong bonding was not achieved because the martensite was not generated. In the fourth comparative example, it is thought that strong bonding was not achieved, because the temperature was not increased to the re-crystallization temperature or higher although the strains was added.
- In a sixth example, metastable austenite-based stainless steel SUS304 was subjected to 90% reduction at 300 degrees C. (that is equal to the Md point or higher) by multi-direction forging and rolling and was subjected to rolling corresponding to 90% at a normal temperature (that is equal to the Md point or lower). Almost entirely the resulting board was transformed into martensite and had a thickness of 1 mm. The resulting board was cut into two small pieces having a width of 10 mm and a length of 50 mm, First faces of the small pieces were processed into mirrored faces by emery paper and buffing in the atmosphere. The mirrored faces are made to face with each other and arranged crosswise in a vacuum chamber. Thus, the faces of 10 mm×10 mm adhered to each other. After vacuuming, the pieces were heated by high frequency heating to various temperatures under a condition that a load of 1 kN was added to the pieces through a punched hole having a diameter of 5 mm in order to achieve adherence of the pieces. After the temperatures under the condition was kept for 30 minutes, the pieces were unloaded, cooled and brought out. For confirmation, a cross tension test of 0.01 mm/s was performed. And bonding strength was evaluated.
- In a seventh example, the same bonding as the sixth example was performed except for using SUS304 material in which strain was completely removed and was subjected to a solution treatment, as one of the two small pieces.
- In a sixth comparative example, the same bonding as the seventh example was performed except for using SES304 material in which strain was completely removed and was subjected to a solution treatment, as the two small pieces.
-
FIG. 7 illustrates a relationship between the temperatures during the bonding of the sixth and seventh examples and the sixth comparative example and the bonding strength. InFIG. 7 , a horizontal axis indicates the temperatures during the bonding. A vertical axis indicates the bonding strength. WC/WC indicates the results of the sixth example. WC/SOL indicates the results of the seventh example. SOL/SOL indicates the results of the sixth comparative example. As illustrated inFIG. 7 , in any cases, the bonding strength tends to increase as the temperature during the bonding increases. However, the results of the sixth and seventh examples are shifted to a lower temperature side, compared to the sixth comparative example. That is, it is apparent that in the sixth and seventh examples, the temperature during the bonding can be reduced in order to achieve identical bonding strength, compared to the sixth comparative example. - In an eighth example, austenite-based stainless steel SUS304 was subjected to 99% reduction at 300 degrees C. (that is equal to the Md point or higher) by forging and rolling. The resulting board having a thickness of 1 mm was cut into two small pieces having a width of 10 mm and a length of 50 mm. First faces of the small pieces were processed into mirrored faces by emery paper and buffing in the atmosphere. The mirrored faces are made to face with each other and arranged crosswise in a vacuum chamber. Thus, the faces of 10 mm×10 mm adhered to each other. After vacuuming, the pieces were heated by high frequency heating to various temperatures under a condition that a load of 1 kN was added to the pieces through a punched hole having a diameter of 5 mm in order to achieve adherence of the pieces. After the temperatures under the condition were kept for 30 minutes, the pieces were unloaded, cooled and brought out. For confirmation, a cross tension test of 0.01 mm/s was performed. And bonding strength was evaluated.
- In a ninth example, the same bonding as the eighth example was performed except for rolling of 80%.
-
FIG. 8 illustrates a relationship between the temperatures during the bonding of the eighth example, the ninth example and the sixth comparative example and the bonding strength. InFIG. 8 , a horizontal axis indicates the temperatures during the bonding. A vertical axis indicates the bonding strength. W99 indicates the results of the eighth example. W80 indicates the results of the ninth example. SOL/SOL indicates the results of the sixth comparative example. As illustrated inFIG. 6 , in any cases, the bonding strength tends to increase as the temperature during the bonding increases. However, the results of the eighth and ninth examples are shifted to a lower temperature side, compared to the sixth comparative example. That is, it is apparent that in the eighth and ninth examples, the temperature during the bonding can be reduced in order to achieve identical bonding strength, compared to the sixth comparative example. - The present invention is not limited to the specifically described embodiments, but other embodiments and variations may be made without departing from the scope of the claimed invention.
Claims (8)
1. A stainless steel comprising:
a first stainless steel member;
a second stainless steel member having a strain exceeding 50% reduction; and
said first and second stainless steel members present in a recrystallized state bonded together.
2. The steel of claim 1 , wherein the first and second austenitic stainless steel members have re-crystallized grains.
3. The steel of claim , wherein the re-crystallized grains are disposed at bonding face between the first and second austenitic stainless steel members.
4. The steel of claim 3 , wherein the re-crystallized grains cross bonding face between the first and second austenitic stainless steel members.
5. The steel of claim 1 , wherein at least one of the first and second stainless steel members are strained.
6. The steel of claim 1 , wherein the second stainless steel members comprises at least 30 volume % of the martensite.
7. The steel of claim 1 , wherein an interface between the first and second austenitic stainless steel members is an uneven interface comprising re-crystallized grains.
8. The steel of claim 1 , wherein at least some of the re-crystallized grains comprise sub-micron grains.
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US15/471,712 US20170197276A1 (en) | 2013-09-27 | 2017-03-28 | Method for bonding stainless steel members and stainless steel |
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JP2013-201834 | 2013-09-27 | ||
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PCT/JP2014/074972 WO2015046091A1 (en) | 2013-09-27 | 2014-09-19 | Methods for joining stainless steel members, and stainless steels |
US14/881,971 US20160031035A1 (en) | 2013-09-27 | 2015-10-13 | Method for bonding stainless steel members and stainless steel |
US15/471,712 US20170197276A1 (en) | 2013-09-27 | 2017-03-28 | Method for bonding stainless steel members and stainless steel |
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US15/359,216 Active 2034-10-11 US10449629B2 (en) | 2013-09-27 | 2016-11-22 | Method for bonding stainless steel members and stainless steel |
US15/471,635 Active US10549380B2 (en) | 2013-09-27 | 2017-03-28 | Method for bonding stainless steel members and stainless steel |
US15/471,712 Abandoned US20170197276A1 (en) | 2013-09-27 | 2017-03-28 | Method for bonding stainless steel members and stainless steel |
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US15/359,216 Active 2034-10-11 US10449629B2 (en) | 2013-09-27 | 2016-11-22 | Method for bonding stainless steel members and stainless steel |
US15/471,635 Active US10549380B2 (en) | 2013-09-27 | 2017-03-28 | Method for bonding stainless steel members and stainless steel |
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JP (1) | JP6082866B2 (en) |
KR (2) | KR101923340B1 (en) |
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CN106493466A (en) * | 2016-10-14 | 2017-03-15 | 贝原合金(苏州)有限公司 | High pressure resistant double metallic composite material and its process equipment, processing method |
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-
2014
- 2014-09-19 DE DE112014001895.3T patent/DE112014001895T5/en not_active Ceased
- 2014-09-19 WO PCT/JP2014/074972 patent/WO2015046091A1/en active Application Filing
- 2014-09-19 KR KR1020177037014A patent/KR101923340B1/en active IP Right Grant
- 2014-09-19 KR KR1020157030591A patent/KR20150135452A/en active Application Filing
- 2014-09-19 JP JP2015539177A patent/JP6082866B2/en active Active
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2015
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2016
- 2016-11-22 US US15/359,216 patent/US10449629B2/en active Active
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2017
- 2017-03-28 US US15/471,635 patent/US10549380B2/en active Active
- 2017-03-28 US US15/471,712 patent/US20170197276A1/en not_active Abandoned
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US10549380B2 (en) | 2020-02-04 |
JP6082866B2 (en) | 2017-02-22 |
KR20180000747A (en) | 2018-01-03 |
US20160031035A1 (en) | 2016-02-04 |
US20170197275A1 (en) | 2017-07-13 |
KR20150135452A (en) | 2015-12-02 |
WO2015046091A1 (en) | 2015-04-02 |
KR101923340B1 (en) | 2018-11-28 |
DE112014001895T5 (en) | 2016-01-07 |
US10449629B2 (en) | 2019-10-22 |
US20170072503A1 (en) | 2017-03-16 |
JPWO2015046091A1 (en) | 2017-03-09 |
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