US20170047558A1 - Organic light-emitting device and method of manufacturing the same - Google Patents
Organic light-emitting device and method of manufacturing the same Download PDFInfo
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- US20170047558A1 US20170047558A1 US15/208,554 US201615208554A US2017047558A1 US 20170047558 A1 US20170047558 A1 US 20170047558A1 US 201615208554 A US201615208554 A US 201615208554A US 2017047558 A1 US2017047558 A1 US 2017047558A1
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- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
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- H10K2102/301—Details of OLEDs
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- H10K2102/3023—Direction of light emission
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Abstract
An organic light-emitting device includes a substrate, a bottom electrode on the substrate, an organic light-emitting layer on the bottom electrode, and a top electrode on the organic light-emitting layer, wherein the top electrode includes a first electrode part, a grid-shaped or plate-shaped second electrode part on the first electrode part, and an adhesive layer on the second electrode part.
Description
- This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application No. 10-2015-0114736, filed on Aug. 13, 2015, the entire contents of which are hereby incorporated by reference.
- The present disclosure herein relates to organic light-emitting devices and methods of manufacturing the same, and more particularly, to organic light-emitting devices including an auxiliary electrode and methods of manufacturing the same.
- Recently, the demand for a top emission organic light-emitting device has increased as the resolution of monitors or televisions is increased. The reason for this is that, with respect to bottom emission, since an aperture ratio is decreased due to an area occupied by a driving thin film transistor (TFT), brightness may be reduced and an actual light-emitting area per each unit pixel may be reduced as the resolution increases. Accordingly, driving brightness may increase to obtain the same brightness, and this may reduce the reliability of the device and may increase power consumption. For top emission or dual emission, a transparent top electrode is required, and a thin metal layer, such as silver, is used as the top electrode having conductivity as well as transparency. However, since the thin metal layer may have low optical transmittance and high reflectance, the thin metal layer may reduce luminous efficiency and may distort colors. A transparent conductive oxide, instead of the thin metal layer, may also be used as the top electrode. However, since an organic layer may be damaged when the transparent conductive oxide is deposited on the organic layer, the transparent conductive oxide is not being used in an actual product. That is, there is a need to develop an electrode, which is optically transparent, has electrical conductivity, and does not damage the lower organic layer during the formation of the electrode, and a method of manufacturing the electrode.
- Recently, graphene receives attention as one of the above-described transparent electrodes. Graphene is structurally and chemically very stable and has conductivity 100 times higher than that of silicon or copper, and a single layer of graphene has an optical transmittance of about 98% in the visible region. That is, the graphene, according to its physical nature, has characteristics suitable for a transparent electrode.
- The present disclosure provides a top electrode of an organic light-emitting device which has low sheet resistance.
- An embodiment of the inventive concept provides an organic light-emitting device including a substrate; a bottom electrode on the substrate; an organic light-emitting layer on the bottom electrode; and a top electrode on the organic light-emitting layer, wherein the top electrode may include a first electrode part, a grid-shaped second electrode part on the first electrode part, and an adhesive layer on the second electrode part.
- In an embodiment, the first electrode part may include graphene.
- In an embodiment, the first electrode part and the adhesive layer may be spaced apart from each other in a direction perpendicular to a top surface of the first electrode part.
- In an embodiment, the second electrode part may be surrounded by the adhesive layer, and a bottom surface of the second electrode part may be in contact with a top surface of the first electrode part.
- In an embodiment, the second electrode part may include any one of a metal, metal nanoparticles, and metal nanowires.
- In an embodiment, the organic light-emitting device may further include a conductive polymer between the first electrode part and the second electrode part.
- In an embodiment of the inventive concept, a method of manufacturing an organic light-emitting device includes: providing a substrate; forming a bottom electrode on the substrate; forming an organic light-emitting layer on the bottom electrode; and transferring a top electrode on the organic light-emitting layer, wherein the transferring of the top electrode includes: providing a graphene layer; transferring an auxiliary electrode film on the graphene layer; and bonding a top surface of the organic light-emitting layer and a bottom surface of the graphene layer.
- In an embodiment, the transferring of the auxiliary electrode film may include: providing a self-assembled monolayer; forming a grid-shaped or plate-shaped auxiliary electrode part on the self-assembled monolayer; forming an adhesive layer on the auxiliary electrode part; forming a support layer on the adhesive layer; removing the self-assembled monolayer; and bonding a bottom surface of the auxiliary electrode part and a top surface of the graphene layer.
- In an embodiment, the forming of the grid-shaped auxiliary electrode part may include: forming a photoresist layer on the self-assembled monolayer; forming a photoresist pattern by etching the photoresist layer; forming a conductive material layer on the graphene layer; and lifting off the photoresist pattern.
- In an embodiment, the forming of the grid-shaped auxiliary electrode part may include using an inkjet printing method, an electrohydrodynamic printing method, a gravure offset printing, a gravure printing, a reverse offset printing or a screen printing.
- In an embodiment, the forming of the plate-shaped auxiliary electrode part may include: forming a photoresist layer on the self-assembled monolayer; forming a photoresist pattern by etching the photoresist layer; forming a conductive material layer on the self-assembled monolayer; forming a protective layer on the conductive material layer; removing a portion of the protective layer to expose a top surface of the conductive material layer in contact with a top surface of the photoresist pattern; exposing the top surface of the photoresist pattern by etching the conductive material layer; and removing the entire protective layer.
- In an embodiment, the method may further include removing the support layer after the transferring of the top electrode.
- In an embodiment, the method may further include: providing an auxiliary substrate under the self-assembled monolayer; forming a photoresist pattern between the auxiliary substrate and the self-assembled monolayer; and lifting off the photoresist pattern after the forming of the auxiliary electrode part.
- In an embodiment, the transferring of the auxiliary electrode film may include: providing an auxiliary substrate; performing a plasma treatment on a top surface of the auxiliary substrate; forming a grid-shaped or plate-shaped auxiliary electrode part on the auxiliary substrate; forming an adhesive layer on the auxiliary electrode part; forming a support layer on the adhesive layer; removing the auxiliary substrate; and bonding a bottom surface of the auxiliary electrode part and a top surface of the graphene layer.
- The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept. In the drawings:
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FIG. 1 is a cross-sectional view illustrating an example of a film for a top electrode of an organic light-emitting device according to an embodiment of the inventive concept; -
FIGS. 2 through 4 are plan views illustrating second electrode parts of the film for a top electrode of the organic light-emitting device according to the embodiment of the inventive concept; -
FIG. 5 is a cross-sectional view illustrating another example of the film for a top electrode of the organic light-emitting device according to the embodiment of the inventive concept; -
FIG. 6 is a cross-sectional view illustrating another example of the top electrode of the organic light-emitting device according to the embodiment of the inventive concept; -
FIG. 7 is a cross-sectional view illustrating another example of the top electrode of the organic light-emitting device according to the embodiment of the inventive concept; -
FIGS. 8 through 10 are cross-sectional views for illustrating an example of a method of manufacturing a film for a top electrode of an organic light-emitting device according to an embodiment of the inventive concept; -
FIGS. 11 through 13 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept; -
FIGS. 14 through 18 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept; -
FIGS. 19 through 22 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept; -
FIG. 23 is a cross-sectional view for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept; -
FIGS. 24 through 26 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept; -
FIGS. 27 through 30 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept; and -
FIGS. 31 through 34 are cross-sectional views illustrating examples of an organic light-emitting device according to another embodiment of the inventive concept. - The foregoing and other objects, features and advantages of the present disclosure will become more readily apparent from the following detailed description of preferred embodiments of the present disclosure that proceeds with reference to the appending drawings. The present disclosure may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art.
- In this specification, it will be understood that when a film (or layer) is referred to as being “on” another film (or layer) or substrate, it can be directly on the other film (or layer) or substrate, or intervening films (or layers) may also be present therebetween. Also, in the figures, the sizes and thicknesses of elements are exaggerated for clarity of illustration. Furthermore, though terms like a first, a second, and a third are used to describe various directions and films (or layers) in various embodiments of the present invention, the directions and the films (or layers) are not limited to these terms. These terms are used only to discriminate one direction or film (or layer) from another direction or film (or layer). Therefore, a film referred to as a first film (or layer) in one embodiment can be referred to as a second film (or layer) in another embodiment. An embodiment described and exemplified herein includes a complementary embodiment thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Like reference numerals refer to like elements throughout.
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FIG. 1 is a cross-sectional view illustrating an example of a film for a top electrode of an organic light-emitting device according to an embodiment of the inventive concept.FIGS. 2 through 4 are plan views illustrating second electrode parts of the film for a top electrode of the organic light-emitting device according to the embodiment of the inventive concept. - Referring to
FIG. 1 , afirst electrode part 110 may be provided. A voltage may be applied to an organic light-emitting layer of the organic light-emitting device to be described later through thefirst electrode part 110. Thefirst electrode part 110 may have a plate shape which may be in contact with a top surface of the organic light-emitting layer of the organic light-emitting device. Thefirst electrode part 110 may include a conductive material. For example, thefirst electrode part 110 may include at least one selected from the group consisting of graphene, a transparent conductive metal oxide, indium tin oxide (ITO), indium zinc oxide (IZO), Al-doped zinc oxide (AZO), Ga-doped zinc oxide (GZO), propylenedioxythiophene, poly(3,4-ethylenedioxythiophene), and carbon nanotubes. The graphene may have a single layer graphene or multi-layer graphene structure. - A
second electrode part 120 may be provided on thefirst electrode part 110. When viewed from a plan view, thesecond electrode part 120 may have a grid shape. For example, as illustrated inFIGS. 2 to 4 , grid cells GC of thesecond electrode part 120 may have a rectangular, triangular, or hexagonal shape. A width of each of the grid cells GC of thesecond electrode part 120 may be in a range of a few tens of micrometers to a few hundreds of micrometers. A thickness of thesecond electrode part 120 may be in a range of a few hundreds of nanometers to a few thousands of nanometers. - The
second electrode part 120 may include a conductive material. For example, thesecond electrode part 120 may include a metal. For example, thesecond electrode part 120 may include at least one selected from the group consisting of titanium (Ti), gold (Au), platinum (Pt), silver (Ag), aluminum (Al), copper (Cu), chromium (Cr), nickel (Ni), and molybdenum (Mo). In another example, thesecond electrode part 120 may include carbon nanotubes, graphite, amorphous carbon, metal particles, metal nanoparticles, metal microparticles, metal nanowires, or a combination thereof. Thesecond electrode part 120 may have a lower resistance than thefirst electrode part 110. Although not shown inFIG. 1 , a conductive polymer may be disposed between the above-describedfirst electrode part 110 andsecond electrode part 120. - An
adhesive layer 130 may be provided on thesecond electrode part 120. Theadhesive layer 130 may cover a surface of thesecond electrode part 120 except a bottom surface of thesecond electrode part 120. Theadhesive layer 130 may be in contact with thefirst electrode part 110. Theadhesive layer 130, as a semi solid having viscoelasticity, may be deformed by an external force. For example, theadhesive layer 130 may include polydimethylsiloxanes having a plurality of different terminal functional groups. Theadhesive layer 130 may include methacryloxypropyl terminated polydimethylsiloxane of Formula 1. - where n includes a natural number, and a weight-average molecular weight is in a range of about 500 to about 100,000.
- The
adhesive layer 130 may include monomethacryloxypropyl terminated polydimethylsiloxane of Formula 2. - where n includes a natural number, and a weight-average molecular weight is in a range of about 500 to about 100,000.
- The
adhesive layer 130 may include monocarbinol terminated polydimethylsiloxane of Formula 3. - where n includes a natural number, and a weight-average molecular weight is in a range of about 1,000 to about 100,000.
- The
adhesive layer 130 may include epoxypropoxypropyl terminated polydimethylsiloxane of Formula 4. - where n includes a natural number, and a weight-average molecular weight is in a range of about 1,000 to about 500,000.
- The
adhesive layer 130 may include (epoxypropoxypropyl)dimethoxysilyl terminated polydimethylsiloxane of Formula 5. - where n includes a natural number, and a weight-average molecular weight is in a range of about 1,000 to about 500,000.
- The
adhesive layer 130 may include mono-(2,3-epoxy)propylether terminated polydimethylsiloxane of Formula 6. - where n includes a natural number, and a weight-average molecular weight is in a range of about 1,000 to about 500,000.
- A
support layer 140 may be provided on theadhesive layer 130. Thesupport layer 140 may include any one of polyester (PES), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polydimethylsiloxane (PDMS) films. Thesupport layer 140 may fix thesecond electrode part 120 and theadhesive layer 130. In the above description, a top electrode of the organic light-emitting device including thefirst electrode part 110 and the grid-shapedsecond electrode part 120 may be provided. Since thesecond electrode part 120 has a lower resistance than thefirst electrode part 110, sheet resistance of the top electrode of the organic light-emitting device may be reduced. -
FIG. 5 is a cross-sectional view illustrating another example of the film for a top electrode of the organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same part as that of the film for a top electrode of the organic light-emitting device described with reference toFIG. 1 will be omitted for the simplicity of the description. - Referring to
FIG. 5 , afirst electrode part 110, asecond electrode part 120 on thefirst electrode part 110, anadhesive layer 130 on thesecond electrode part 120, and asupport layer 140 on theadhesive layer 130 may be provided. Thefirst electrode part 110, theadhesive layer 130, and thesupport layer 140 may be substantially the same as the film for a top electrode of the organic light-emitting device ofFIG. 1 . Thefirst electrode part 110 and theadhesive layer 130 may be spaced apart from each other. Accordingly, anair gap 30 may be included in cells of thesecond electrode part 120. In the above description, a top electrode of the organic light-emitting device including thefirst electrode part 110 and the grid-shapedsecond electrode part 120 may be provided. Since thesecond electrode part 120 has a lower resistance than thefirst electrode part 110, sheet resistance of the top electrode of the organic light-emitting device may be reduced. -
FIG. 6 is a cross-sectional view illustrating another example of the top electrode of the organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same part as that of the top electrode of the organic light-emitting device described with reference toFIG. 1 will be omitted for the simplicity of the description. - Referring to
FIG. 6 , afirst electrode part 110, athird electrode part 122 on thefirst electrode part 110, anadhesive layer 130 on thethird electrode part 122, and asupport layer 140 on theadhesive layer 130 may be provided. Thefirst electrode part 110, theadhesive layer 130, and thesupport layer 140 may be substantially the same as thefirst electrode part 110, theadhesive layer 130, and thesupport layer 140 of the organic light-emitting device ofFIG. 1 , respectively. Thethird electrode part 122 may have a plate shape. Thethird electrode part 122 may include at least one selected from the group consisting of graphene, metal nanoparticles, and metal nanowires. In the above description, a top electrode of the organic light-emitting device including thefirst electrode part 110 and the grid-shapedthird electrode part 122 may be provided. Since thethird electrode part 122 has a lower resistance than thefirst electrode part 110, sheet resistance of the top electrode of the organic light-emitting device may be reduced. -
FIG. 7 is a cross-sectional view illustrating another example of the top electrode of the organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same part as that of the top electrode of the organic light-emitting device described with reference toFIG. 1 will be omitted for the simplicity of the description. - Referring to
FIG. 7 , afirst electrode part 110, aconductive polymer layer 112 on thefirst electrode part 110, asecond electrode part 122 on theconductive polymer layer 112, anadhesive layer 130 on thesecond electrode part 122, and asupport layer 140 on theadhesive layer 130 may be provided. Thefirst electrode part 110, thesecond electrode part 122, theadhesive layer 130, and thesupport layer 140 may be substantially the same as thefirst electrode part 110, thesecond electrode part 122, theadhesive layer 130, and thesupport layer 140 of the top electrode of the organic light-emitting device ofFIG. 1 . Conductivity of the top electrode of the inventive concept may be improved through theconductive polymer layer 112. In a case in which thefirst electrode part 110 includes graphene, void defects may occur in which carbon bonds in a graphene layer break. In a case in which theconductive polymer layer 112 is coated on the graphene layer, the void defects of the graphene may be reduced. A top electrode of the organic light-emitting device, which has low sheet resistance by including thefirst electrode part 110, thesecond electrode part 120, and theconductive polymer layer 112, may be provided. - Hereinafter, methods of manufacturing top electrodes of the organic light-emitting electrode of the inventive concept will be described with reference to the drawings. Although a case is described in which the first electrode part described with reference to
FIG. 1, 5, 6 , or 7 is graphene, the first electrode part is not limited thereto. In other embodiments not described here, the first electrode part may include at least one selected from the group consisting of a transparent conductive metal oxide, indium tin oxide (ITO), indium zinc oxide (IZO), Al-doped zinc oxide (AZO), Ga-doped zinc oxide (GZO), propylenedioxythiophene, poly(3,4-ethylenedioxythiophene), carbon nanotubes, and a conductive organic material. -
FIGS. 8 through 10 are cross-sectional views for illustrating an example of a method of manufacturing a film for a top electrode of an organic light-emitting device according to an embodiment of the inventive concept. Although a case is described in which the first electrode part of the inventive concept is graphene, the embodiment of the inventive concept is not limited thereto. - Referring to
FIG. 8 , acatalyst layer 20 may be formed on asubstrate 10. For example, thecatalyst layer 20 may be deposited on thesubstrate 10 by chemical vapor deposition (CVD). Thecatalyst layer 20 may include nickel (Ni) or copper (Cu), but the embodiment of the inventive concept is not limited thereto. Thecatalyst layer 20 may be used to form graphene in a large area. In a case in which afirst electrode part 110, which will be described below, is not graphene, thecatalyst layer 20 may be removed. - The
graphene layer 110 may be formed on thecatalyst layer 20. Thegraphene layer 110 may be formed in a large area. Thegraphene layer 110 may have a single layer or multilayer structure. Although thegraphene layer 110 may be formed by CVD, the embodiment of the inventive concept is not limited thereto. - Referring to
FIG. 9 , asecond electrode part 120 may be formed on thegraphene layer 110. For example, thesecond electrode part 120 may be formed by patterning a conductive material layer. For example, the conductive material layer may be formed in a large area on thegraphene layer 110. The conductive material layer may be formed by CVD, but the embodiment of the inventive concept is not limited thereto. The conductive material layer may be patterned in the form of a grid to form thesecond electrode part 120. When viewed from a plan view, the grid may have various shapes which have described with reference toFIGS. 2 to 4 . In another example, thesecond electrode part 120 may be formed on thegraphene layer 110 by inkjet printing, electrohydrodynamic (EHD) printing, gravure offset printing, gravure printing, reverse offset printing or screen printing. Accordingly, thesecond electrode part 120 may be directly formed in a grid shape on thegraphene layer 110. Thesecond electrode part 120 may include carbon nanotubes, graphite, amorphous carbon, metal particles, metal nanoparticles, metal microparticles, metal nanowires, or a combination thereof. In a case in which thesecond electrode part 120 is metal, thesecond electrode part 120 may include at least one selected from the group consisting of titanium (Ti), gold (Au), platinum (Pt), silver (Ag), aluminum (Al), copper (Cu), chromium (Cr), nickel (Ni), and molybdenum (Mo). - Referring to
FIG. 10 , anadhesive layer 130 may be formed on thesecond electrode part 120. For example, theadhesive layer 130 may be in contact with thegraphene layer 110. In another example, theadhesive layer 130 may be spaced apart from thegraphene layer 110. Theadhesive layer 130, as a semi solid having viscoelasticity, may be deformed by an external force. Theadhesive layer 130 may connect thegraphene layer 110 and asupport layer 140 to be described later. Thesupport layer 140 may be formed on theadhesive layer 130. Thesupport layer 140 may include any one of polyester (PES), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polydimethylsiloxane (PDMS) films. Thesupport layer 140 may prevent deformation of thesecond electrode part 120 and theadhesive layer 130 by fixing thesecond electrode part 120 and theadhesive layer 130. - Referring again to
FIG. 1 or 5 , a film for a top electrode of the organic light-emitting device may be formed by removing thecatalyst layer 20 and thesubstrate 10. Thecatalyst layer 20 may be removed through an etching process using an etching solution, but the embodiment of the inventive concept is not limited thereto. Thesubstrate 10 may be removed by the removal of thecatalyst layer 20. -
FIGS. 11 through 13 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same process as that of the top electrode of the organic light-emitting device described with reference toFIGS. 8 to 10 will be omitted for the simplicity of the description. - Referring to
FIG. 11 , aconductive polymer layer 112 may be formed on agraphene layer 110. A process of forming theconductive polymer layer 112 may include deposition or printing, but the embodiment of the inventive concept is not limited thereto. For example, theconductive polymer layer 112 may be formed on thegraphene layer 110 by CVD. Thegraphene layer 110 may include void defects in which carbon bonds in thegraphene layer 110 break. In a case in which theconductive polymer layer 112 is coated on thegraphene layer 110, the void defects of thegraphene layer 110 may be reduced. Theconductive polymer layer 112 may improve the conductivity of the top electrode. - Referring to
FIG. 12 , asecond electrode part 120 may be formed on theconductive polymer layer 112. A process of forming thesecond electrode part 120 may be substantially the same as the process of forming thesecond electrode part 120 described with reference toFIG. 9 . In the present example, although thesecond electrode part 120 has a grid shape, the embodiment of the inventive concept is not limited thereto. That is, in another example, thesecond electrode part 120 may be formed in a large area on theconductive polymer layer 112. - Referring to
FIG. 13 , anadhesive layer 130 and asupport layer 140 on theadhesive layer 130 may be formed on thesecond electrode part 120. A process of forming theadhesive layer 130 and thesupport layer 140 may be substantially the same as the process of forming theadhesive layer 130 and thesupport layer 140 described with reference toFIG. 10 . Theadhesive layer 130, as a semi solid having viscoelasticity, may be deformed by an external force. Theadhesive layer 130 may connect thesupport layer 140 and thegraphene layer 110. Thesupport layer 140 may include any one of PES, PI, PET, PEN, and PDMS films. Thesupport layer 140 may prevent deformation of thesecond electrode part 120 and theadhesive layer 130 by fixing thesecond electrode part 120 and theadhesive layer 130. - Referring again to
FIG. 7 , a film for a top electrode of the organic light-emitting device may be formed by removing acatalyst layer 20 and asubstrate 10. Thecatalyst layer 20 may be removed through an etching process using an etching solution, but the embodiment of the inventive concept is not limited thereto. Thesubstrate 10 may be removed by the removal of thecatalyst layer 20. -
FIGS. 14 through 18 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same process as that of the examples described with reference toFIGS. 8 to 10 will be omitted for the simplicity of the description. - Referring to
FIG. 14 , aphotoresist layer 150 may be formed on agraphene layer 110. For example, thephotoresist layer 150 may be formed on thegraphene layer 110 through a coating process, but the embodiment of the inventive concept is not limited thereto. - Referring to
FIG. 15 , aphotoresist pattern 152 may be formed by patterning thephotoresist layer 150. Thephotoresist layer 150 may be patterned to expose a top surface of thegraphene layer 110 in the form of a grid. The formation of asecond electrode part 120 to be described later at an unwanted portion may be prevented by using thephotoresist pattern 152. - Referring to
FIG. 16 , aconductive material layer 124 may be formed on thegraphene layer 110. For example, theconductive material layer 124 may be formed on thegraphene layer 110 by CVD. Theconductive material layer 124 may include carbon nanotubes, graphite, amorphous carbon, metal particles, metal nanoparticles, metal microparticles, or a combination thereof. In a case in which theconductive material layer 124 includes a metal, theconductive material layer 124 may include at least one selected from the group consisting of Ti, Au, Pt, Ag, Al, Cu, Cr, Ni, and Mo. - Referring to
FIG. 17 , thephotoresist pattern 152 may be lifted off. Accordingly, a grid-shapedsecond electrode part 120 may be formed on thegraphene layer 110. Thesecond electrode part 120 may include the same material as theconductive material layer 124. - Referring to
FIG. 18 , anadhesive layer 130 and asupport layer 140 on theadhesive layer 130 may be formed on thesecond electrode part 120. A process of forming theadhesive layer 130 and thesupport layer 140 may be substantially the same as the process of forming theadhesive layer 130 and thesupport layer 140 described with reference toFIG. 10 . Theadhesive layer 130, as a semi solid having viscoelasticity, may be deformed by an external force. Theadhesive layer 130 may connect thesupport layer 140 and thegraphene layer 110. Thesupport layer 140 may include any one of PES, PI, PET, PEN, and PDMS films. Thesupport layer 140 may prevent deformation of thesecond electrode part 120 and theadhesive layer 130 by fixing thesecond electrode part 120 and theadhesive layer 130. - Referring again to
FIG. 1 or 5 , a film for a top electrode of the organic light-emitting device may be formed by removing acatalyst layer 20. Thecatalyst layer 20 may be removed through an etching process using an etching solution, but the embodiment of the inventive concept is not limited thereto. -
FIGS. 19 through 22 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same process as that of the examples described with reference toFIGS. 14 to 18 will be omitted for the simplicity of the description. - Referring to
FIG. 19 , aprotective layer 160 may be formed on aconductive material layer 124. Theconductive material layer 124 may be substantially the same as theconductive material layer 124 described with reference toFIG. 16 . For example, theprotective layer 160 may be formed on theconductive material layer 124 through a coating process. Theprotective layer 160 may include a material having different etching characteristics from a photoresist pattern 152 (for example, a photoresist material different from the photoresist pattern 152). - Referring to
FIG. 20 , top surfaces of asecond electrode part 120 and thephotoresist pattern 152 may be exposed by removing theprotective layer 160 and theconductive material layer 124. For example, theprotective layer 160 and theconductive material layer 124 may be removed by an etching process or a planarization process (e.g., chemical mechanical polishing). For example, a top surface of theconductive material layer 124 in contact with the top surface of thephotoresist pattern 152 may be exposed by etching a portion of theprotective layer 160. Theconductive material layer 124 may be etched to expose the top surface of thephotoresist pattern 152. The entireprotective layer 160 may be etched. In a case in which theprotective layer 160 and theconductive material layer 124 are removed through the planarization process, heights of the top surfaces of thephotoresist pattern 152 and thesecond electrode part 120 may be the same. - Referring to
FIG. 21 , anadhesive layer 130 on thesecond electrode part 120 and asupport layer 140 on theadhesive layer 130 may be formed. A process of forming theadhesive layer 130 and thesupport layer 140 may be substantially the same as the process of forming theadhesive layer 130 and thesupport layer 140 described with reference toFIG. 10 . Theadhesive layer 130, as a semi solid having viscoelasticity, may be deformed by an external force. Theadhesive layer 130 may connect thesupport layer 140 and thegraphene layer 110. Thesupport layer 140 may include any one of PES, PI, PET, PEN, and PDMS films. Thesupport layer 140 may prevent deformation of thesecond electrode part 120 and theadhesive layer 130 by fixing thesecond electrode part 120 and theadhesive layer 130. - Referring to
FIG. 22 , a film for a top electrode of the organic light-emitting device may be formed by removing acatalyst layer 20 and asubstrate 10. Thecatalyst layer 20 may be removed through an etching process using an etching solution, but the embodiment of the inventive concept is not limited thereto. Thesubstrate 10 may be removed by the removal of thecatalyst layer 20. -
FIG. 23 is a cross-sectional view for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same process as that of the examples described with reference toFIGS. 8 to 10 will be omitted for the simplicity of the description. - Referring to
FIG. 23 , acatalyst layer 20, agraphene layer 110, athird electrode part 122, anadhesive layer 130, and asupport layer 140 may be formed on asubstrate 10. A process of forming thecatalyst layer 20, thegraphene layer 110, theadhesive layer 130, and thesupport layer 140 may be substantially the same as the process of forming thecatalyst layer 20, thegraphene layer 110, theadhesive layer 130, and thesupport layer 140 described with reference toFIG. 8 . Thethird electrode part 122 may be formed on thegraphene layer 110. Thethird electrode part 122 may include a conductive material. For example, thethird electrode part 122 may include at least one selected from the group consisting of graphene, metal nanoparticles, and metal nanowires, but the embodiment of the inventive concept is not limited thereto. Thethird electrode part 122 may be formed on thegraphene layer 110 through a coating process. - Referring again to
FIG. 6 , a film for a top electrode of the organic light-emitting device may be formed by removing thecatalyst layer 20 and thesubstrate 10. Thecatalyst layer 20 may be removed through an etching process using an etching solution, but the embodiment of the inventive concept is not limited thereto. Thesubstrate 10 may be removed by the removal of thecatalyst layer 20. -
FIGS. 24 through 26 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same process as that of the examples described with reference toFIGS. 8 to 10 ,FIGS. 14 to 18 ,FIGS. 19 to 22 , orFIG. 23 will be omitted for the simplicity of the description. - Referring to
FIG. 24 , a self-assembled monolayer (SAM) 170 may be formed on afirst substrate 12. The self-assembledmonolayer 170 may facilitate the separation of thefirst substrate 12 and a second electrode part 120 (or third electrode part 122) to be described later. The self-assembledmonolayer 170 may be formed by a reaction of a hydroxy group (—OH) with a self-assembled single molecular material. Hereinafter, a process of forming the self-assembledmonolayer 170 will be described. - Liquid acetone, methanol, and deionized water are sequentially provided to the
first substrate 12. Thefirst substrate 12 may be treated with ultraviolet light in an ozone atmosphere. Accordingly, a hydroxy group (—OH) may be formed on thefirst substrate 12. A self-assembled single molecular material may be provided on thefirst substrate 12. The self-assembled single molecular material may include trichloro(1H, 1H, 2H, 2H-heptadecafluorodecyl)silane. For example, the self-assembled single molecular material may be coated on thefirst substrate 12. The hydroxy group (—OH) and the self-assembled single molecular material may be subjected to a condensation reaction to form the self-assembledmonolayer 170. Thefirst substrate 12 may be washed and dried. A washing process of thefirst substrate 12 may be performed using at least one selected from the group consisting of acetone, toluene, methanol, and deionized water. Thefirst substrate 12 may be dried at a temperature of about 100° C. to about 130° C. and a pressure of about 10−2 torr. A drying process of thefirst substrate 12 may be maintained for about 1 hour. - The self-assembled
monolayer 170 may be refined. For example, acetone, toluene, methanol, and water solvents may be sequentially provided to the self-assembledmonolayer 170. The self-assembledmonolayer 170 may be dried for about 1 hour at a temperature of about 100° C. and a pressure of about 10−2 torr. The self-assembledmonolayer 170 may have a surface roughness of about 1 nm or less. - Referring to
FIG. 25 , thesecond electrode part 120, anadhesive layer 130 on thesecond electrode part 120, and asupport layer 140 on theadhesive layer 130 may be formed on the self-assembledmonolayer 170. A process of forming thesecond electrode part 120, theadhesive layer 130, and thesupport layer 140 may be substantially the same as the process of forming thesecond electrode part 120, theadhesive layer 130, and thesupport layer 140 described with reference toFIGS. 8 to 10 ,FIGS. 14 to 18 , orFIGS. 19 to 24 . Although a case is illustrated in which thesecond electrode part 120 is a grid shape, thesecond electrode part 120 may be substantially the same as the third electrode part ofFIG. 23 . The process of forming thesecond electrode part 120 may be substantially the same as the process of forming thethird electrode part 122 described with reference toFIG. 23 . - Referring to
FIG. 26 , the self-assembledmonolayer 170 and thefirst substrate 12 may be removed to expose a bottom surface of theadhesive layer 130. The self-assembledmonolayer 170 may be removed by a physical force. For example, the bottom surface of theadhesive layer 130 may have a surface roughness of about 1 nm or less. Thefirst substrate 12 may be removed by the removal of the self-assembledmonolayer 170. - Referring again to
FIG. 10, 13, 18 , or 21, a bottom surface of thesecond electrode part 120 and a top surface of thegraphene layer 110 may be bonded to each other. Accordingly, thecatalyst layer 20, the first electrode part (e.g., graphene layer) 110, thesecond electrode part 120, theadhesive layer 130, and thesupport layer 140 may be sequentially provided in a layered structure on thesubstrate 10. - Referring again to
FIG. 1, 5, 6, 7 , or 22, a film for a top electrode of the organic light-emitting device may be formed by removing thecatalyst layer 20 and thesubstrate 10. Thecatalyst layer 20 may be removed through an etching process using an etching solution, but the embodiment of the inventive concept is not limited thereto. Thesubstrate 10 may be removed by the removal of thecatalyst layer 20. -
FIGS. 27 through 30 are cross-sectional views for illustrating another example of the method of manufacturing a film for a top electrode of an organic light-emitting device according to the embodiment of the inventive concept. Description of substantially the same process as that of the examples described with reference toFIGS. 8 to 10 ,FIGS. 14 to 18 ,FIGS. 19 to 22 ,FIG. 23 , orFIGS. 24 to 26 will be omitted for the simplicity of the description. - Referring to
FIG. 27 , aphotoresist pattern 152 may be formed on afirst substrate 12. Thephotoresist pattern 152 may be formed by substantially the same process as the process of forming thephotoresist pattern 152 described with reference toFIGS. 14 and 15 . Aconductive material layer 124 may be formed on thefirst substrate 12. Although not shown inFIG. 27 , a self-assembled monolayer (SAM), for example, may be disposed between theconductive material layer 124 and thefirst substrate 12. Thefirst substrate 12 and a second electrode part to be described later may be effectively separated by the disposition of the SAM. In another example, a plasma surface treatment process may be provided to a top surface of thefirst substrate 12 in contact with theconductive material layer 124. For example, the top surface of thefirst substrate 12 may be subjected to a plasma treatment using nitrogen, oxygen, argon, and/or CFx gas. The energy of the surface of thefirst substrate 12 may be changed by the plasma treatment process, and the surface of thefirst substrate 12 may be hydrophobic or hydrophilic. Substantially the same effect as that of the disposition of the SAM between theconductive material layer 124 and thefirst substrate 12 may be obtained by the plasma treatment process. - Referring to
FIG. 28 , thephotoresist pattern 152 may be lifted off to form asecond electrode part 120. Thesecond electrode part 120 may have a grid shape. Thesecond electrode part 120 may include carbon nanotubes, graphite, amorphous carbon, metal particles, metal nanoparticles, metal microparticles, metal nanowires, or a combination thereof. In a case in which thesecond electrode part 120 is metal, thesecond electrode part 120 may include at least one selected from the group consisting of Ti, Au, Pt, Ag, Al, Cu, Cr, Ni, and Mo. - Referring to
FIG. 29 , anadhesive layer 130 and asupport layer 140 on theadhesive layer 130 may be formed on thesecond electrode part 120. A process of forming theadhesive layer 130 and thesupport layer 140 may be substantially the same as the process of forming theadhesive layer 130 and thesupport layer 140 described with reference toFIGS. 24 to 26 . Theadhesive layer 130 may cover surfaces except a bottom surface of thesecond electrode part 120. - Referring to
FIG. 30 , anadhesive layer 130 and asupport layer 140 on theadhesive layer 130 may be formed on thesecond electrode part 120. A process of forming theadhesive layer 130 and thesupport layer 140 may be substantially the same as the process of forming theadhesive layer 130 and thesupport layer 140 described with reference toFIGS. 24 to 26 . However, theadhesive layer 130 may be spaced apart from thefirst substrate 12. Also, anair gap 30 may be disposed between thesecond electrode parts 120. - Referring again to
FIG. 26 , thefirst substrate 12 may be removed to expose bottom surfaces of theadhesive layer 130 and thesecond electrode part 120. Thefirst substrate 12 may be removed by a physical force in a direction away from theadhesive layer 130. For example, a self-assembled monolayer (SAM, not shown) may be formed between thefirst substrate 12 and thesecond electrode part 120. Adhesion between the SAM and thesecond electrode part 120 may be lower than adhesion between the SAM and thefirst substrate 12. Accordingly, in a case in which thefirst substrate 12 is subjected to a force in the direction away from theadhesive layer 130, the SAM and theadhesive layer 130 may be separated. Thefirst substrate 12 may be separated from theadhesive layer 130 due to the separation of the SAM. In another embodiment, a top surface of thefirst substrate 12 may be subjected to a plasma surface treatment. The plasma surface treatment may control surface characteristics of thefirst substrate 12 to be hydrophilic or hydrophobic. The surface characteristics of thefirst substrate 12 may be selected to allow theadhesive layer 130 and thesecond electrode part 120 to be easily separated from thefirst substrate 12. Accordingly, thefirst substrate 12 and thesecond electrode part 120 and thesubstrate 12 and theadhesive layer 130 may be separated by a force in a direction away from each other. - Referring again to
FIG. 10, 13, 18 , or 21, a bottom surface of thesecond electrode part 120 and a top surface of thegraphene layer 110 may be bonded to each other. Accordingly, thecatalyst layer 20, the first electrode part (e.g., graphene layer) 110, thesecond electrode part 120, theadhesive layer 130, and thesupport layer 140 may be sequentially provided in a layered structure on thesubstrate 10. - Referring again to
FIG. 1, 5, 6, 7 , or 22, a film for a top electrode of the organic light-emitting device may be formed by removing thecatalyst layer 20 and thesubstrate 10. Thecatalyst layer 20 may be removed through an etching process using an etching solution, but the embodiment of the inventive concept is not limited thereto. Thesubstrate 10 may be removed by the removal of thecatalyst layer 20. - Hereinafter, an organic light-emitting device will be described with reference to the drawings.
-
FIGS. 31 through 34 are cross-sectional views illustrating examples of an organic light-emitting device according to another embodiment of the inventive concept. Description of substantially the same part as that of the film for a top electrode of the organic light-emitting device and the method of manufacturing the same, which have been described with reference toFIGS. 1 to 30 , will be omitted for the simplicity of the description. Although a case is described in which the first electrode part described with reference toFIGS. 1 to 7 is graphene, the embodiment of the inventive concept is not limited thereto. In other embodiments not described here, the first electrode part may include at least one selected from the group consisting of a transparent conductive metal oxide, indium tin oxide (ITO), indium zinc oxide (IZO), Al-doped zinc oxide (AZO), Ga-doped zinc oxide (GZO), propylenedioxythiophene, poly(3,4-ethylenedioxythiophene), and carbon nanotubes. Although not shown in the drawings, a conductive polymer may be disposed between agraphene layer 110 and an auxiliary electrode part which will be described later. - Referring to
FIG. 31 , abottom electrode 210 may be formed on asubstrate 200. For example, thebottom electrode 210 may be deposited on thesubstrate 200 through a chemical vapor deposition (CVD) process, but the embodiment of the inventive concept is not limited thereto. Thebottom electrode 210 may include a conductive material. An organic light-emittinglayer 220 may be formed on thebottom electrode 210. For example, the organic light-emittinglayer 220 may be formed on thebottom electrode 210 through a CVD process, but the embodiment of the inventive concept is not limited thereto. The organic light-emittinglayer 220 may emit light by a voltage applied between thebottom electrode 210 and atop electrode 230. - The
top electrode 230 may be transferred on the organic light-emittinglayer 220. Thetop electrode 230 may include thegraphene layer 110, anauxiliary electrode part 120 on thegraphene layer 110, and anadhesive layer 130 on theauxiliary electrode part 120. Thegraphene layer 110, theauxiliary electrode part 120, and theadhesive layer 130 may be substantially the same as thefirst electrode part 110, thesecond electrode part 120, and theadhesive layer 130 of the film for thetop electrode 230 which have been described with reference toFIG. 1 , respectively. - Hereinafter, a transfer process of the
top electrode 230 will be described. A top surface of the organic light-emittinglayer 220 and a bottom surface of thegraphene layer 110 of the film for thetop electrode 230 described with referenceFIG. 1 may be bonded to each other. Thesupport layer 140 may be removed. A process of manufacturing a film for thetop electrode 230 may be substantially the same as the process of manufacturing the film for thetop electrode 230 described with reference toFIGS. 8 to 10 ,FIGS. 24 to 26 , orFIGS. 27 to 30 . - Referring to
FIG. 32 , abottom electrode 210 may be formed on asubstrate 200. For example, thebottom electrode 210 may be deposited on thesubstrate 200 through a CVD process, but the embodiment of the inventive concept is not limited thereto. Thebottom electrode 210 may include a conductive material. An organic light-emittinglayer 220 may be formed on thebottom electrode 210. For example, the organic light-emittinglayer 220 may be formed on thebottom electrode 210 through a CVD process, but the embodiment of the inventive concept is not limited thereto. The organic light-emittinglayer 220 may emit light by a voltage applied between thebottom electrode 210 and atop electrode 230. - The
top electrode 230 may be transferred on the organic light-emittinglayer 220. Thetop electrode 230 may include agraphene layer 110, anauxiliary electrode part 120 on thegraphene layer 110, and anadhesive layer 130 on theauxiliary electrode part 120. Thegraphene layer 110, theauxiliary electrode part 120, and theadhesive layer 130 may be substantially the same as thefirst electrode part 110, thesecond electrode part 120, and theadhesive layer 130 of the film for thetop electrode 230 described with reference toFIG. 5 , respectively. - Hereinafter, a transfer process of the
top electrode 230 will be described. A top surface of the organic light-emittinglayer 220 and a bottom surface of thegraphene layer 110 of the film for thetop electrode 230 described with referenceFIG. 5 may be bonded to each other. Thesupport layer 140 may be removed. A process of manufacturing a film for thetop electrode 230 may be substantially the same as the process of manufacturing the film for thetop electrode 230 described with reference toFIGS. 8 to 10 ,FIGS. 24 to 26 , orFIGS. 27 to 30 . - Referring to
FIG. 33 , abottom electrode 210 may be formed on asubstrate 200. For example, thebottom electrode 210 may be deposited on thesubstrate 200 through a CVD process, but the embodiment of the inventive concept is not limited thereto. Thebottom electrode 210 may include a conductive material. An organic light-emittinglayer 220 may be formed on thebottom electrode 210. For example, the organic light-emittinglayer 220 may be formed on thebottom electrode 210 through a CVD process, but the embodiment of the inventive concept is not limited thereto. The organic light-emittinglayer 220 may emit light by a voltage applied between thebottom electrode 210 and atop electrode 230. - The
top electrode 230 may be transferred on the organic light-emittinglayer 220. Thetop electrode 230 may include agraphene layer 110, anauxiliary electrode part 120 on thegraphene layer 110, and anadhesive layer 130 on theauxiliary electrode part 120. Thegraphene layer 110, theauxiliary electrode part 120, and theadhesive layer 130 may be substantially the same as thefirst electrode part 110, thethird electrode part 122, and theadhesive layer 130 of the film for thetop electrode 230 described with reference toFIG. 6 , respectively. - Hereinafter, a transfer process of the
top electrode 230 will be described. A top surface of the organic light-emittinglayer 220 and a bottom surface of thegraphene layer 110 of the film for thetop electrode 230 described with referenceFIG. 6 may be bonded to each other. Thesupport layer 140 may be removed. A process of manufacturing a film for thetop electrode 230 may be substantially the same as the process of manufacturing the film for thetop electrode 230 described with reference toFIG. 23 orFIGS. 24 to 26 . - Referring to
FIG. 34 , abottom electrode 210 may be formed on asubstrate 200. For example, thebottom electrode 210 may be deposited on thesubstrate 200 through a CVD process, but the embodiment of the inventive concept is not limited thereto. Thebottom electrode 210 may include a conductive material. An organic light-emittinglayer 220 may be formed on thebottom electrode 210. For example, the organic light-emittinglayer 220 may be formed on thebottom electrode 210 through a CVD process, but the embodiment of the inventive concept is not limited thereto. The organic light-emittinglayer 220 may emit light by a voltage applied between thebottom electrode 210 and atop electrode 230. - The
top electrode 230 may be transferred on the organic light-emittinglayer 220. Thetop electrode 230 may include agraphene layer 110, anauxiliary electrode part 120 and aphotoresist pattern 152 on thegraphene layer 110, and anadhesive layer 130 on theauxiliary electrode part 120. Thegraphene layer 110, theauxiliary electrode part 120, thephotoresist pattern 152, and theadhesive layer 130 may be substantially the same as thefirst electrode part 110, thesecond electrode part 120, thephotoresist pattern 152, and theadhesive layer 130 of the film for thetop electrode 230 described with reference toFIG. 22 , respectively. - Hereinafter, a transfer process of the
top electrode 230 will be described. A top surface of the organic light-emittinglayer 220 and a bottom surface of thegraphene layer 110 of the film for thetop electrode 230 described with referenceFIG. 22 may be bonded to each other. Thesupport layer 140 may be removed. A process of manufacturing a film for thetop electrode 230 may be substantially the same as the process of manufacturing the film for thetop electrode 230 described with reference toFIGS. 14 to 22 orFIGS. 24 to 26 . - According to the inventive concept, an organic light-emitting device, which has a top electrode having low sheet resistance, may be provided.
- However, the effects of the inventive concept are not limited to the above-described effects.
- Although the exemplary embodiments of the present invention have been described, it is understood that the present invention should not be limited to these exemplary embodiments but various changes and modifications can be made by one ordinary skilled in the art within the spirit and scope of the present invention as hereinafter claimed. Accordingly, the exemplary embodiments should be considered in descriptive sense only and not for purposes of limitation. Therefore, the scope of the invention is defined not by the detailed description of the invention but by the appended claims, and all differences within the scope will be construed as being included in the present invention.
Claims (14)
1. An organic light-emitting device comprising:
a substrate;
a bottom electrode on the substrate;
an organic light-emitting layer on the bottom electrode; and
a top electrode on the organic light-emitting layer,
wherein the top electrode comprises a first electrode part, a grid-shaped second electrode part on the first electrode part, and an adhesive layer on the second electrode part.
2. The organic light-emitting device of claim 1 , wherein the first electrode part comprises graphene.
3. The organic light-emitting device of claim 1 , wherein the first electrode part and the adhesive layer are spaced apart from each other in a direction perpendicular to a top surface of the first electrode part.
4. The organic light-emitting device of claim 1 , wherein the second electrode part is surrounded by the adhesive layer, and
a bottom surface of the second electrode part is in contact with a top surface of the first electrode part.
5. The organic light-emitting device of claim 1 , wherein the second electrode part comprises any one of a metal, metal nanoparticles, and metal nanowires.
6. The organic light-emitting device of claim 1 , further comprising a conductive polymer between the first electrode part and the second electrode part.
7. A method of manufacturing an organic light-emitting device, the method comprising:
providing a substrate;
forming a bottom electrode on the substrate;
forming an organic light-emitting layer on the bottom electrode; and
transferring a top electrode on the organic light-emitting layer,
wherein the transferring of the top electrode comprises:
providing a graphene layer;
transferring an auxiliary electrode film on the graphene layer; and
bonding a top surface of the organic light-emitting layer and a bottom surface of the graphene layer.
8. The method of claim 7 , wherein the transferring of the auxiliary electrode film comprises:
providing a self-assembled monolayer;
forming a grid-shaped or plate-shaped auxiliary electrode part on the self-assembled monolayer;
forming an adhesive layer on the auxiliary electrode part;
forming a support layer on the adhesive layer;
removing the self-assembled monolayer; and
bonding a bottom surface of the auxiliary electrode part and a top surface of the graphene layer.
9. The method of claim 8 , wherein the forming of the grid-shaped auxiliary electrode part comprises:
forming a photoresist layer on the self-assembled monolayer;
forming a photoresist pattern by etching the photoresist layer;
forming a conductive material layer on the graphene layer; and
lifting off the photoresist pattern.
10. The method of claim 8 , wherein the forming of the grid-shaped auxiliary electrode part comprises using an inkjet printing method, an electrohydrodynamic printing method, a gravure offset printing, a gravure printing, a reverse offset printing or a screen printing.
11. The method of claim 8 , wherein the forming of the plate-shaped auxiliary electrode part comprises:
forming a photoresist layer on the self-assembled monolayer;
forming a photoresist pattern by etching the photoresist layer;
forming a conductive material layer on the self-assembled monolayer;
forming a protective layer on the conductive material layer;
removing a portion of the protective layer to expose a top surface of the conductive material layer in contact with a top surface of the photoresist pattern;
exposing the top surface of the photoresist pattern by etching the conductive material layer; and
removing the entire protective layer.
12. The method of claim 8 , further comprising removing the support layer after the transferring of the top electrode.
13. The method of claim 8 , further comprising:
providing an auxiliary substrate under the self-assembled monolayer;
forming a photoresist pattern between the auxiliary substrate and the self-assembled monolayer; and
lifting off the photoresist pattern after the forming of the auxiliary electrode part.
14. The method of claim 7 , wherein the transferring of the auxiliary electrode film comprises:
providing an auxiliary substrate;
performing a plasma treatment on a top surface of the auxiliary substrate;
forming a grid-shaped or plate-shaped auxiliary electrode part on the auxiliary substrate;
forming an adhesive layer on the auxiliary electrode part;
forming a support layer on the adhesive layer;
removing the auxiliary substrate; and
bonding a bottom surface of the auxiliary electrode part and a top surface of the graphene layer.
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US20190013488A1 (en) * | 2017-07-05 | 2019-01-10 | Center For Advanced Soft Electronics | Nanopatch graphene composite and method of manufacturing the same |
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KR102049323B1 (en) | 2017-07-05 | 2019-11-27 | 재단법인 나노기반소프트일렉트로닉스연구단 | Nanopatch graphene composite and method for preparing the same |
US10600977B2 (en) * | 2017-07-05 | 2020-03-24 | Center For Advanced Soft Electronics | Nanopatch graphene composite |
US11127698B2 (en) * | 2017-07-07 | 2021-09-21 | Toray Industries, Inc. | Method for producing conductive film, method for producing field effect transistor using same, and method for producing wireless communication device |
JP2019207808A (en) * | 2018-05-30 | 2019-12-05 | 東洋アルミニウム株式会社 | Mesh electrode material |
JP7039392B2 (en) | 2018-05-30 | 2022-03-22 | 東洋アルミニウム株式会社 | Mesh electrode material |
EP4027373A4 (en) * | 2019-09-03 | 2023-10-04 | The University of Tokyo | Source/drain electrode for organic semiconductor device, organic semiconductor device using same, and production method for source/drain electrode and semiconductor device |
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Also Published As
Publication number | Publication date |
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KR20170020652A (en) | 2017-02-23 |
KR102144865B1 (en) | 2020-08-18 |
US10403859B2 (en) | 2019-09-03 |
US20180190949A1 (en) | 2018-07-05 |
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