US20160178282A1 - Cooling body - Google Patents

Cooling body Download PDF

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Publication number
US20160178282A1
US20160178282A1 US14/960,745 US201514960745A US2016178282A1 US 20160178282 A1 US20160178282 A1 US 20160178282A1 US 201514960745 A US201514960745 A US 201514960745A US 2016178282 A1 US2016178282 A1 US 2016178282A1
Authority
US
United States
Prior art keywords
wall
cooling
cooling body
edge
heat conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/960,745
Other languages
English (en)
Inventor
Martin Bergmann
Klaus Busch
Mathias BÄUML
Christoph Wiesner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WIESNER, CHRISTOPH, BAEUML, MATHIAS, BERGMANN, MARTIN, BUSCH, KLAUS
Publication of US20160178282A1 publication Critical patent/US20160178282A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/0066—Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Definitions

  • the invention relates to a substantially cuboidal cooling body, where a first cooling contact surface incorporated in a first outer side surface of a first wall of the cuboid and a second cooling contact surface incorporated in a second outer side surface of a second wall of the cuboid are present.
  • the computing power of an automation device leads to power loss.
  • the power loss i.e., the creation of heat.
  • European publication EP 2 736 312 A1 discloses an automation device with a cooling body.
  • this publication teaches that a cuboidal cooling body with a first cooling contact surface incorporated in a side surface of the cuboid on a first printed circuit board and with a second cooling contact surface incorporated in a second side surface of the cooling body is positioned on a second printed circuit board to dissipate the power loss.
  • This conventional cooling body has the drawback that it is no longer able to sufficiently dissipate the power loss generated, particularly when multicore microprocessors are used, and the conventional prior art automation device comprising such a conventional cooling body would overheat.
  • a substantially cuboidal cooling body where a first cooling contact surface incorporated in a first outer side surface of a first wall of the cuboid and a second cooling contact surface incorporated in a second outer side surface of a second wall of the cuboid are present, where the second wall is arranged perpendicularly to the first wall and forms a first edge, a third wall is arranged perpendicularly to the second wall and forms a second edge, a fourth wall is arranged perpendicularly to the third wall and forms a third edge, and the first wall is arranged perpendicularly to the fourth wall and forms a fourth edge is formed, where the four walls are arranged such that an internal space having a medium inlet opening and a medium outlet opening forms a flow channel for a cooling medium.
  • the walls form a delimited internal space, for example, ambient air as cooling medium is able to flow more effectively and rapidly through the cooling body, and thus more effectively dissipat
  • cooling plates are arranged in the internal space.
  • the thermal behavior is even further optimized, where the internal space has a heat conducting wall that is arranged perpendicularly to the first inner side surface of the first wall and connects the first wall to the third wall, and where the heat conducting wall is arranged substantially centrally relative to the first cooling contact surface.
  • the heat conducting wall incorporated in the internal space only insignificantly influences the flow behavior through the internal space, but nevertheless ensures a heat flow that flows into the first wall may be distributed more effectively and, in particular, may be conducted to the opposing third wall, whereby the heat flow may be distributed more effectively over the entire cuboid surface.
  • first wall with the first cooling contact surface could be regarded as a main cooling surface, for example, for a multicore processor
  • the second wall with the second cooling contact surface could be regarded as an additional cooling surface for any other electronic components.
  • the heat conducting wall is arranged substantially centrally relative to the first cooling contact surface, perpendicularly to the main cooling surface, the greatest heat flow is conducted from the main cooling surface, in particular from the multicore microprocessor, to the opposing third wall.
  • the wall thicknesses are designed to be substantially thicker in comparison with the plate thicknesses.
  • a cooling body temperature should be distributed as uniformly as possible over the cooling body volume and at a temperature which is as high as possible.
  • a solid outer heat conducting frame is provided. This heat conducting frame serves to produce a high uniform temperature distribution inside the cooling body volume, irrespective of the potentially non-uniform geometric position of the components to be cooled.
  • the cooling plates are thus arranged between two opposing frame sides.
  • the “frame cooling body” thus formed is advantageously produced as a component in an extrusion method.
  • the cooling body in accordance with the disclosed embodiments of the invention is configured as a continuously cast profile in one piece or a one-piece continuously cast profile.
  • FIG. 1 shows a three-dimensional view of a cooling body in accordance with the invention
  • FIG. 2 shows a sectional view of the cooling body shown in FIG. 1 ;
  • FIG. 3 shows a further sectional view of the cooling body shown in FIG. 1 , in order to illustrate a peripheral path of a heat conducting frame;
  • FIG. 4 shows a plan view of the cooling plates of the cooling body in accordance with the invention.
  • FIG. 1 A cooling body 1 which has been improved in its heat dissipation behavior relative to a conventional cooling body is shown in FIG. 1 .
  • the cooling body 1 is substantially cuboidal and thus has a first wall 11 , a second wall 12 , a third wall 13 and a fourth wall 14 .
  • a first cooling contact surface 2 is incorporated in a first outer side surface 21 of the first wall 11 of the cuboid and a second cooling contact surface 3 is incorporated in a second outer side surface of the second wall 2 of the cuboid.
  • the walls 11 , 12 , 13 , 14 are arranged such that an internal space 30 with a medium inlet opening 15 and a medium outlet opening 16 forms a flow channel 37 for a cooling medium.
  • the second wall 12 is located perpendicular to the first wall 11 , whereby a first edge K 1 is formed.
  • the third wall 13 is located perpendicular to the second wall 12 , whereby a second edge K 2 is formed.
  • the fourth wall 14 is located perpendicular to the third wall 13 , whereby a third edge K 3 is formed.
  • the first wall 11 is accordingly located perpendicular to the fourth wall 14 , whereby a fourth edge K 4 is formed.
  • An approximately rectangular peripheral path 40 (see FIG. 3 ) of the four walls connected together 11 , 12 , 13 , 14 , which forms a peripheral heat conducting frame 41 , is achieved by this arrangement of the walls 11 , 12 , 13 , 14 .
  • a first cooling plate 31 , a second cooling plate 32 , a third cooling plate 33 , a fourth cooling plate 34 , a fifth cooling plate 35 and a sixth cooling plate 36 are arranged in the internal space 30 .
  • a heat conducting wall 17 is arranged between the third cooling plate 33 and the fourth cooling plate 34 , where the heat conducting wall is located perpendicular to the first inner side surface 21 a of the first wall 11 and connects the first wall 11 to the third wall 13 , and where the heat conducting wall 17 is arranged substantially centrally relative to the first cooling contact surface 2 .
  • a first electronic component arranged in the first cooling contact surface 2 in particular a multicore microprocessor, discharges a first heat flow ⁇ dot over (Q) ⁇ 1 into the first wall 11 .
  • a second electronic component arranged in the second cooling contact surface 3 would discharge a second heat flow ⁇ dot over (Q) ⁇ 2 into the second wall 12 . So that, in particular, the first heat flow ⁇ dot over (Q) ⁇ 1 may be rapidly dissipated and effectively distributed within the entire cooling body 1 , the internal wall 17 is arranged substantially centrally relative to the first cooling contact surface 2 .
  • the first heat flow ⁇ dot over (Q) ⁇ 1 in the first wall 11 is divided into a first partial heat flow ⁇ dot over (Q) ⁇ 11 , a second partial heat flow ⁇ dot over (Q) ⁇ 12 and a third partial heat flow ⁇ dot over (Q) ⁇ 13 .
  • the first partial heat flow ⁇ dot over (Q) ⁇ 11 flows through the first wall 11 in the direction of the fourth edge K 4
  • the second partial heat flow ⁇ dot over (Q) ⁇ 12 flows through the first wall 11 in the direction of the first edge K 1
  • the third partial heat flow ⁇ dot over (Q) ⁇ 13 flows through the heat conducting wall 17 in the direction of the third wall 13 , where it is then re-divided in the third wall 13 into a further partial heat flow ⁇ dot over (Q) ⁇ ′ in the direction of the second edge K 2 and into a further partial heat flow ⁇ dot over (Q) ⁇ ′′ in the direction of the third edge K 3 .
  • FIG. 3 An illustration of the configuration of the walls 11 , 12 , 13 , 14 with an approximately rectangular peripheral path 40 , which thus form a solid heat conducting frame 41 , is shown in FIG. 3 .
  • a fifth edge K 5 , a sixth edge K 6 , a seventh edge K 7 and an eighth edge K 8 substantially depict the heat conducting frame 41 .
  • the heat conducting frame 41 is also shown in a further view, i.e., in a plan view of the cooling body 1 .
  • the heat conducting frame 41 is substantially configured by the first wall 11 , the second wall 11 , the third wall 13 and the fourth wall 14 .
  • a solid heat conducting wall 17 is arranged between the first wall 11 and the third wall 13 .
  • the cooling body 1 is configured as a continuously cast profile in one piece or a one-piece continuously cast profile. Cooling body profiles produced in a continuous casting method, which are made of aluminum, for example, and which may be cut to length as required, are mass-produced items which may be produced inexpensively.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US14/960,745 2014-12-18 2015-12-07 Cooling body Abandoned US20160178282A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14198897.2A EP3035780A1 (de) 2014-12-18 2014-12-18 Kühlkörper
EP14198897 2014-12-18

Publications (1)

Publication Number Publication Date
US20160178282A1 true US20160178282A1 (en) 2016-06-23

Family

ID=52231882

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/960,745 Abandoned US20160178282A1 (en) 2014-12-18 2015-12-07 Cooling body

Country Status (3)

Country Link
US (1) US20160178282A1 (zh)
EP (1) EP3035780A1 (zh)
CN (1) CN105720025A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EA029101B1 (ru) 2010-10-01 2018-02-28 Апталис Фарма Лимитид Составы с низкой дозой панкрелипазы и кишечнорастворимым покрытием

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7002795B2 (en) * 2003-06-26 2006-02-21 Intel Corporation Low noise heatsink
WO2014155541A1 (ja) * 2013-03-26 2014-10-02 三菱電機株式会社 電力変換装置および冷却装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4631635A (en) * 1984-10-31 1986-12-23 The United States Of America As Represented By The Secretary Of The Air Force Vibration isolated cold plate assembly
DE29923011U1 (de) * 1999-12-30 2000-02-24 H.-J. Bernstein GmbH, 32479 Hille Gehäuse zur Aufnahme elektrischer oder elektronischer Bauteile
JP2002368473A (ja) * 2001-06-12 2002-12-20 Mitsubishi Electric Corp 発熱性電子部品放熱装置、放熱構造を有する電子機器および電子装置
CN100518476C (zh) * 2006-06-02 2009-07-22 富准精密工业(深圳)有限公司 散热装置
DE112011101959B4 (de) * 2010-06-07 2016-11-24 Mitsubishi Electric Corporation Wärmesenke und Verfahren zu deren Herstellung
EP2736312B1 (de) 2012-11-27 2017-08-16 Siemens Aktiengesellschaft Automatisierungsgerät mit Kühlkörper

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7002795B2 (en) * 2003-06-26 2006-02-21 Intel Corporation Low noise heatsink
WO2014155541A1 (ja) * 2013-03-26 2014-10-02 三菱電機株式会社 電力変換装置および冷却装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Translation of International Publication WO 2014155541 A1 entitled TRANSLATION-WO 2014155541 A1 *

Also Published As

Publication number Publication date
CN105720025A (zh) 2016-06-29
EP3035780A1 (de) 2016-06-22

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Date Code Title Description
AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BERGMANN, MARTIN;BUSCH, KLAUS;BAEUML, MATHIAS;AND OTHERS;SIGNING DATES FROM 20160201 TO 20160205;REEL/FRAME:037799/0639

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION