US20160158909A1 - Chemical mechanical polishing fastening device - Google Patents

Chemical mechanical polishing fastening device Download PDF

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Publication number
US20160158909A1
US20160158909A1 US14/736,920 US201514736920A US2016158909A1 US 20160158909 A1 US20160158909 A1 US 20160158909A1 US 201514736920 A US201514736920 A US 201514736920A US 2016158909 A1 US2016158909 A1 US 2016158909A1
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US
United States
Prior art keywords
plane
inner annular
combining
chemical mechanical
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/736,920
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English (en)
Inventor
Hui-Chen YEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAI FUNG TECHNOLOGY Co Ltd
Original Assignee
KAI FUNG TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KAI FUNG TECHNOLOGY Co Ltd filed Critical KAI FUNG TECHNOLOGY Co Ltd
Assigned to KAI FUNG TECHNOLOGY CO., LTD. reassignment KAI FUNG TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YEN, HUI-CHEN
Publication of US20160158909A1 publication Critical patent/US20160158909A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Definitions

  • the instant disclosure relates to a chemical mechanical fastening ring, in particular, to a chemical mechanical polishing fastening device applied for polishing semiconductor wafers.
  • Chemical mechanical polishing is an essential procedure during manufacturing the semiconductors. If the wafers cannot be polished properly or if scratches left on the wafers, process error would occur during the subsequent lithography procedure like exposure, develop, and etching. In some situation, unrecoverable defects may be formed on the wafers.
  • a fastening ring with a specific thickness faces and is adhered to a base whose shape is corresponding to the ring.
  • the fastening ring is made of polymers and provided for securing a wafer to be polished.
  • the fastening ring has to sustain the wearing from the high-rotational-speed polishing pad, and fastening ring also has to suffer the erosion from the chemical mechanical polishing liquid. Therefore, after the fastening ring is used for a certain times, the fastening ring has to be replaced by another.
  • the fastening ring may be failure ahead of the predicted life time (early life failure).
  • the reason is described as follows.
  • the chemical mechanical polishing liquid may enter into the interface between the fastening ring and the base, the adhesive in the interface would become small particles by reacting with the polishing liquid and then the particles spread in the polishing liquid. Therefore, during the polishing procedure, the small particles in the polishing liquid would rub against the surface of the wafer to produce scratches on the wafer.
  • the fastening ring would be failure ahead of the schedule. Accordingly, the replacement times of the fastening ring and the downtime of the production line are increased. Consequently, the material cost and the manufacturing cost of the wafer subcontractors would be increased at the same time.
  • the chemical mechanical polishing liquid would enter the interface between the fastening ring and the base so as to make the fastening ring be early life failure and to cause the increasing of the material cost and the manufacturing cost of the wafer subcontractors.
  • an exemplary embodiment of the instant disclosure provides a chemical mechanical polishing fastening device comprising an annular base and a fastening ring.
  • the annular base comprises a first combining plane, a first inner annular plane, a first jointing plane, and a second inner annular plane.
  • the first combining plane is parallel to the radial direction of the annular base.
  • the diameter of the first inner annular plane is greater than the diameter of the second inner annular plane.
  • Two sides of the first inner annular base are connected to the first combining plane and the first jointing plane, respectively.
  • Two sides of the first jointing plane are connected to the first inner annular plane and the second inner annular plane, respectively.
  • the fastening ring comprises a second combining plane and an inner annular flange.
  • the second combining plane is parallel to the radial direction of the fastening ring.
  • the second combining plane is combined with the first combining plane of the annular base.
  • the inner annular flange is protruded from the second combining plane.
  • the inner annular flange has an outer annular wall and a top plane. The outer annular wall is combined with the first inner annular plane of the annular base, and the top plane is combined with the first jointing plane.
  • the distance between the top plane of the inner annular flange and the second combining plane of the fastening ring is defined in the range from 5 mm to 15 mm.
  • the thickness of the inner annular flange along the radial direction of the fastening ring is defined in the range from 1 mm to 5 mm.
  • the inner annular flange has an inner annular wall.
  • the inner annular wall of the inner annular flange and the second inner annular plane are aligned at the same level.
  • a nominal fillet radius of 1.5 mm is defined at the connection between the first jointing plane and the first inner annular plane.
  • the annular base further comprises a first outer annular plane, a second jointing plane, and a second outer annular plane.
  • the diameter of the first outer annular plane is less than that of the second outer annular plane.
  • Two sides of the first outer annular plane are connected to the first combining plane and the second jointing plane, respectively.
  • Two sides of the second jointing plane are connected to the first outer annular plane and the second outer annular plane, respectively.
  • the fastening ring comprises an outer annular flange protruded from the second combining plane.
  • the outer annular flange has an inner annular wall and a second top plane.
  • the inner annular wall is combined with the first inner annular plane of the annular base, and the second top plane is combined with the first jointing plane.
  • the distance between the second top plane of the outer annular flange and the second combining plane of the fastening ring is defined in the range from 4 mm to 10 mm.
  • the thickness of the outer annular flange along the radial direction of the fastening ring is defined in the range from 1 mm to 4 mm.
  • the outer annular flange has an outer annular wall.
  • the outer annular wall of the outer annular flange and the second outer annular plane of the annular base are aligned at the same level.
  • FIG. 1 is a perspective view of a traditional chemical mechanical polishing fastening device
  • FIG. 2 is a sectional view along line 1 - 1 of FIG. 1 ;
  • FIG. 3 is an exploded view of a chemical mechanical polishing fastening device of an exemplary embodiment of the instant disclosure
  • FIG. 4 is a perspective view of the chemical mechanical polishing fastening device
  • FIG. 5 is a sectional view along line 2 - 2 - of FIG. 4 ;
  • FIG. 6 is an operational view of the chemical mechanical polishing fastening device.
  • FIG. 1 and FIG. 2 illustrating a perspective view and a sectional view of a typical chemical mechanical polishing fastening device 9 including a base 91 , a fastening ring 92 , and a jointing plane 93 between the base 91 and the fastening ring 92 .
  • the base 91 and the fastening ring 92 are combined with each other by sticks.
  • the chemical mechanical polishing liquid would enter into the space between the base 91 and the fastening ring 92 from the jointing plane 93 , such that the fastening ring 92 made of polymers (e.g., Polyphenylene sulfide, PPS), may be failed ahead of the predicted time. Therefore, one of the important concepts of the embodiment is to provide a technical solution to prevent the chemical mechanical polishing liquid from entering into the space between the base 91 and the fastening ring 92 during the chemical mechanical polishing procedure.
  • polymers e.g., Polyphenylene sulfide, PPS
  • FIG. 3 , FIG. 4 , and FIG. 5 provide an exploded view, a perspective view, and a sectional view of a chemical mechanical polishing fastening device 1 according to an exemplary embodiment of the instant disclosure.
  • the chemical mechanical polishing fastening device 1 comprises an annular base 11 and a fastening ring 12 .
  • the fastening ring 12 faces down to frame the wafer within the fastening ring 12 .
  • the annular base 11 comprises a first combining plane 111 , a first inner annular plane 112 , a first jointing plane 113 , a second inner annular plane 114 , a plurality of engaging blocks 118 , and a plurality of lock holes 119 .
  • the first combining plane 111 is parallel to the radial direction of the annular base 11 .
  • the diameter of the first inner annular plane 112 is greater than the diameter of the second inner annular plane 114 .
  • two sides of the first inner annular plane 112 are connected to the first combining plane 111 and the first jointing plane 113 , respectively.
  • first inner annular plane 112 two sides are connected, in a one-to-one relationship, to the first combining plane 111 and the first jointing plane 113 .
  • the first jointing plane 113 is substantially parallel to the first combining plane 111 , and two sides of the first jointing plane 113 are connected to the first inner annular plane 112 and the second inner annular plane 114 , respectively.
  • two sides of the first jointing plane 113 are connected, in a one-to-one relationship, to the first annular plane 112 and the second inner annular plane 114 .
  • a nominal fillet radius of 1.5 mm to 2.0 mm is defined at the connection between the first jointing plane 113 and the first inner annular plane 112 .
  • the engaging blocks 118 are fastened on the first combining plane 111 of the annular base 11 via screws passing through the lock holes 119 .
  • the fastening ring 12 comprises a second combining plane 121 , a plurality of engaging holes 128 , and an inner annular flange 129 .
  • the second combining plane 121 is parallel to the radial direction of the fastening ring 12 .
  • the second combining plane 121 is combined with the first combining plane 111 via the engagements between the engaging blocks 118 and the engaging holes 128 .
  • the combination between the fastening ring 12 and the annular base 11 may be further enhanced by applying adhesive to the interface between the first combining plane 111 and the second combining plane 121 .
  • the inner annular flange 129 is protruded from the second combining plane 121 .
  • the inner annular flange 129 has an outer annular wall 129 a and a top plane 129 b. As shown in FIG. 5 , the outer annular wall 129 a is combined with the first inner annular plane 112 of the annular base 11 , and the top plane 129 b is combined with the first jointing plane 113 .
  • FIG. 6 provides an operational view of the chemical mechanical polishing fastening device 1 according to the exemplary embodiment of the instant disclosure.
  • the chemical mechanical polishing fastening device 1 is fixed to a chemical mechanical polishing apparatus 6 so as to be rotatable relative to a polishing pad (not shown) therebeneath, and a wafer 7 is framed within the fastening ring 12 .
  • the chemical mechanical polishing liquid may possibly pass through the space between the wafer 7 and the fastening ring 12 to be accumulated at the back of the wafer 7 .
  • the fastening ring 12 further comprises the inner annular flange 129
  • the second combining plane 121 is combined with the first combining plane 111 of the annular base 11
  • the outer annular wall 129 a is combined with the first inner annular plane 112 of the annular base 11
  • the top plane 129 b is combined with the first jointing plane 113 of the annular base 11 . Accordingly, when the wafer 7 is polishing, the chemical mechanical polishing liquid 8 accumulated at the back of the wafer 7 may solely enter the space between the annular base 11 and the fastening ring 12 from the connection between the first jointing plane 113 and the top plane 129 b of the inner annular flange 129 .
  • the fastening ring 12 As compared with the traditional chemical mechanical polishing device, the fastening ring 12 according to the exemplary embodiment of the instant disclosure would not be failure ahead of the predicted life time. Therefore, the problems in increasing of the material cost and the manufacturing cost of the wafer subcontractors can be solved.
  • the thickness of the inner annular flange 129 along the radial direction of the fastening ring 12 is defined to be equal to or greater than 1 mm, the structural strength of the inner annular flange 129 can be enhanced, and the inner annular flange 129 would not be broken easily. Therefore, the connection between the first jointing plane 113 of the annular base 11 and the top plane 129 b of the inner annular flange 129 would have a certain structural strength to bear the shearing stress generated at the connection between the first jointing plane 113 and the top plane 129 b during the chemical mechanical polishing procedure.
  • the inner annular flange 129 has an inner annular wall 129 c.
  • the inner annular wall 129 c of the inner annular flange 129 and the second inner annular plane 114 of the annular base 11 are aligned at the same level. If the inner annular wall 129 c and the second inner annular plane 114 does not align at the same level, for example, if the area of the top plane 129 b is greater than that of the first jointing plane 113 , a few chemical mechanical polishing liquids 8 would be accumulated at the top plane 129 b of the inner annular flange 129 with an extremely small possibility.
  • the chemical mechanical polishing liquid 8 would enter inside the fastening ring 12 through the space between the top plane 129 b and the first jointing plane 113 .
  • the inner annular wall 129 c and the second inner annular plane 114 are aligned at the same level, even when a small amount of chemical mechanical polishing liquid 8 has already been spread to the space between the top plane 129 b and the first jointing plane 113 , the chemical mechanical polishing liquid 8 does not enter inside the fastening ring 12 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
US14/736,920 2014-12-05 2015-06-11 Chemical mechanical polishing fastening device Abandoned US20160158909A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103221659 2014-12-05
TW103221659U TWM504343U (zh) 2014-12-05 2014-12-05 化學機械研磨固定裝置

Publications (1)

Publication Number Publication Date
US20160158909A1 true US20160158909A1 (en) 2016-06-09

Family

ID=53487027

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/736,920 Abandoned US20160158909A1 (en) 2014-12-05 2015-06-11 Chemical mechanical polishing fastening device

Country Status (3)

Country Link
US (1) US20160158909A1 (zh)
JP (1) JP3197674U (zh)
TW (1) TWM504343U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230129597A1 (en) * 2021-10-27 2023-04-27 Sch Power Tech Co., Ltd. Retaining Ring for Wafer Polishing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791305B (zh) * 2021-10-18 2023-02-01 尚源股份有限公司 晶圓研磨嵌合結構

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US20040152403A1 (en) * 2003-02-05 2004-08-05 Applied Materials, Inc. Retaining ring with flange for chemical mechanical polishing
US20040219870A1 (en) * 2003-04-30 2004-11-04 Chen Hung Chih Two part retaining ring
US7789736B2 (en) * 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US20040152403A1 (en) * 2003-02-05 2004-08-05 Applied Materials, Inc. Retaining ring with flange for chemical mechanical polishing
US7094139B2 (en) * 2003-02-05 2006-08-22 Applied Materials, Inc. Retaining ring with flange for chemical mechanical polishing
US20040219870A1 (en) * 2003-04-30 2004-11-04 Chen Hung Chih Two part retaining ring
US6974371B2 (en) * 2003-04-30 2005-12-13 Applied Materials, Inc. Two part retaining ring
US7789736B2 (en) * 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring
US8465345B2 (en) * 2006-10-13 2013-06-18 Applied Materials, Inc. Stepped retaining ring

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230129597A1 (en) * 2021-10-27 2023-04-27 Sch Power Tech Co., Ltd. Retaining Ring for Wafer Polishing

Also Published As

Publication number Publication date
JP3197674U (ja) 2015-05-28
TWM504343U (zh) 2015-07-01

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Legal Events

Date Code Title Description
AS Assignment

Owner name: KAI FUNG TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YEN, HUI-CHEN;REEL/FRAME:035824/0319

Effective date: 20150609

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION