US20150151335A1 - Substrate processing apparatus and substrate processing method - Google Patents
Substrate processing apparatus and substrate processing method Download PDFInfo
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- US20150151335A1 US20150151335A1 US14/557,773 US201414557773A US2015151335A1 US 20150151335 A1 US20150151335 A1 US 20150151335A1 US 201414557773 A US201414557773 A US 201414557773A US 2015151335 A1 US2015151335 A1 US 2015151335A1
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- substrate
- region
- discharging
- processing liquid
- peripheral edge
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- 239000000758 substrate Substances 0.000 title claims abstract description 300
- 238000003672 processing method Methods 0.000 title claims description 9
- 238000007599 discharging Methods 0.000 claims abstract description 295
- 239000007788 liquid Substances 0.000 claims abstract description 274
- 230000002093 peripheral effect Effects 0.000 claims abstract description 125
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims description 153
- 238000004891 communication Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 80
- 239000002245 particle Substances 0.000 description 16
- 238000009736 wetting Methods 0.000 description 16
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
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- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B08B1/04—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Definitions
- the present invention relates to a substrate processing technique for processing a peripheral edge part of a substrate.
- Japanese Patent Application Laid-Open No. 2006-278592 discloses an apparatus for causing a cylindrical brush to abut on a peripheral edge part of a substrate to carry out processing for cleaning the peripheral edge part while discharging a processing liquid onto a central part of an upper surface of the rotating substrate from above.
- Japanese Patent Application Laid-Open No. 2006-278592 discloses an apparatus for causing a cylindrical brush to abut on a peripheral edge part of a substrate to carry out processing for cleaning the peripheral edge part while discharging a processing liquid onto a central part of an upper surface of the rotating substrate from above.
- 2009-164405 discloses a substrate processing apparatus for causing a sponge member impregnated with a processing liquid to abut on a peripheral edge part of a substrate, thereby supplying the processing liquid to the peripheral edge part, and at the same time, causing a blush to abut on the peripheral edge part, thereby cleaning the peripheral edge part at a position different from a position of the sponge member.
- the substrate processing apparatus disclosed in the Japanese Patent Application Laid-Open No. 2006-278592 has the following problem. More specifically, the processing liquid is supplied to a non-processing region other than the peripheral edge part on the upper surface of the substrate in addition to the peripheral edge part to be cleaned by the brush. For this reason, a device pattern formed in the non-processing region is damaged. This is a problem caused not only in the cleaning processing but in general processing to be performed in the peripheral edge part of the substrate by using the processing liquid. Furthermore, the substrate processing apparatus disclosed in the Japanese Patent Application Laid-Open No. 2009-164405 has the following problem. More specifically, the processing liquid is caused to leak out of the sponge member and is thus supplied to the peripheral edge part. For this reason, the processing liquid lacks so that the peripheral edge part is cleaned insufficiently and a pollutant scraped off by the brush cannot be sufficiently cleaned away.
- the present invention is directed to substrate processing for processing a peripheral edge part of a substrate.
- a substrate processing apparatus includes the following members: a substrate rotating mechanism for holding and rotating a substrate; a discharging portion for discharging a processing liquid to an upper surface peripheral edge part in an upper surface of the substrate which is being rotated by the substrate rotating mechanism; a moving portion for moving the discharging portion; and a controller for controlling each of operations of the discharging portion and the moving portion.
- the discharging portion includes a discharging port for discharging the processing liquid and a passage for supplying the processing liquid to the discharging port in communication with the discharging port, the controller controls the discharging portion and the moving portion in such a manner that the discharging portion starts to discharge the processing liquid at a first position above the substrate and is moved to a second position which is closer to a rotating axis of the substrate than the first position while discharging the processing liquid, and continuously discharges the processing liquid at the second position
- the first position is a position of the discharging portion where a section of the passage in a discharging port part of the discharging portion is projected onto a first region in a rotating track of the upper surface peripheral edge part in an axial direction of the passage in the discharging port part
- the second position is a position of the discharging portion where the section of the passage is projected onto a second region in the rotating track in the axial direction of the passage
- the first region is a region on a peripheral edge side of the substrate from
- the discharging portion starts to discharge the processing liquid at the first position and is moved to the second position which is closer to the rotating axis of the substrate than the first position while carrying out the discharge, and continuously carries out the discharge at the second position.
- the processing liquid is discharged from the discharging port in the axial direction of the passage in the discharging port part of the discharging portion. For this reason, the processing liquid is discharged from the discharging portion at the first position toward the first region in the rotating track of the upper surface peripheral edge part, and is discharged from the discharging portion at the second position toward the second region of the rotating track.
- a shape of a liquid column of the discharged processing liquid is more unstable as compared with that in the case in which the discharge is continuously carried out.
- the processing liquid discharged toward the first region is also discharged to a periphery of the first region in some cases.
- the first region is a region on the peripheral edge side of the substrate from the second region.
- the discharging portion continuously carries out the discharging operation. Therefore, the processing liquid is discharged in a more stable shape of the liquid column than that at the start of the discharge. Accordingly, it is possible to restrain the adhesion of the processing liquid to the non-processing region due to the splash of the processing liquid on the upper surface of the substrate or the spread of the processing liquid on the upper surface of the substrate.
- the substrate processing apparatus includes the following members: a substrate rotating mechanism for holding and rotating a substrate; a discharging portion for discharging a processing liquid to an upper surface peripheral edge part in an upper surface of the substrate which is being rotated by the substrate rotating mechanism; and a cleaning portion for abutting on the upper surface peripheral edge part of the substrate which is being rotated by the substrate rotating mechanism, thereby cleaning the upper surface peripheral edge part, and the discharging portion discharges the processing liquid toward a main discharging region which is predefined in a semicircular region at a downstream side in a rotating direction of the substrate with respect to the cleaning portion in a rotating track of the upper surface peripheral edge part.
- the discharging portion discharges the processing liquid toward the main discharging region which is predefined in the semicircular region at the downstream side in the rotating direction of the substrate with respect to the cleaning portion in the rotating track of the upper surface peripheral edge part of the substrate. Accordingly, a range in which the processing liquid is removed to bring a dry state by the cleaning portion in the upper surface peripheral edge part is reduced as compared with the case in which the processing liquid is discharged to an upstream side in the rotating direction of the substrate with respect to the cleaning portion, for example. Accordingly, the upper surface peripheral edge part of the substrate can be cleaned more reliably.
- the present invention is also directed to a substrate processing method of processing a peripheral edge part of a substrate.
- FIG. 1 is a side view typically showing an example of a schematic structure of a substrate processing apparatus according to a preferred embodiment
- FIG. 2 is a top view showing the substrate processing apparatus of FIG. 1 ;
- FIG. 3 is a top view for explaining a region onto which a discharging portion discharges a processing liquid
- FIG. 4 is a top view for explaining a discharging direction of the processing liquid through the discharging portion
- FIG. 5 is a side view for explaining the discharging direction of the processing liquid through the discharging portion
- FIG. 6 is a side view typically showing an example of a schematic structure of a gas injecting portion
- FIGS. 7 , 8 , 9 , 10 are top views each showing an example of an injecting port of the gas injecting portion
- FIG. 11 is a graph showing an example of a relationship between a structure of the injecting port and the number of increase in particles
- FIG. 12 is a side view showing an example of a schematic structure of the discharging portion
- FIG. 13 is a view for explaining a region on a substrate where the discharging portion discharges the processing liquid
- FIG. 14 is a view for showing an example of change in a position of the discharging portion in time series
- FIG. 15 is a graph showing an example of a relationship between a region on the substrate where discharging start (stop) is carried out and a wetting range distribution;
- FIG. 16 is a graph showing an example of a relationship between the region on the substrate where the discharging start (stop) is carried out and a distribution of the number of increase in particles;
- FIGS. 17 and 18 are time charts each showing an example of an operation for cleaning the substrate processing apparatus
- FIG. 19 is a flowchart showing an example of a processing liquid discharging operation of the substrate processing apparatus.
- FIG. 20 is a flowchart showing an example of the operation for cleaning the substrate processing apparatus.
- FIG. 1 is a view typically showing an example of a schematic structure of a substrate processing apparatus 100 according to a preferred embodiment.
- FIG. 2 is a top view showing the substrate processing apparatus 100 .
- the substrate processing apparatus 100 supplies a processing liquid 51 such as pure water to a processing region (which is also referred to as an “upper surface peripheral edge part”) S3 having a determined width from a peripheral edge (which is also referred to as an “end edge” or a “peripheral end edge”) E1 in an upper surface (which is also referred to as a “front surface”) S1 of a substrate W such as a semiconductor wafer and performs determined processing over the processing region S3 by using the processing liquid 51 .
- a processing liquid 51 such as pure water
- a processing region which is also referred to as an “upper surface peripheral edge part”
- S3 having a determined width from a peripheral edge (which is also referred to as an “end edge” or a “peripheral end edge”) E1 in an upper surface (which is
- the pure water is used for the processing liquid 51 , for example.
- the processing liquid 51 is not limited to the pure water, but may be functional water such as carbonated water, ion water, ozone water, reduced water (hydrogen water) or magnetic water, or chemicals such as ammonia water or a mixed solution of ammonia water and hydrogen peroxide water.
- the processing region S3 is a ring-shaped region having a width of 1.5 to 3.0 mm from the peripheral edge E1 of the substrate W in the upper surface S1 of the substrate W, for example.
- a lower surface S2 on an opposite side to the upper surface S1 is also referred to as a “back surface”.
- the substrate W takes an approximately circular surface shape which has a diameter of 300 mm, for example.
- a non-processing region S4 other than the processing region S3 of the upper surface S1 of the substrate W represents a device formation surface where a device pattern is formed.
- the substrate processing apparatus 100 includes a spin chuck (“a substrate rotating mechanism”) 5 for adsorbing and holding the substrate W in an approximately horizontal condition and rotating the substrate W in a direction of an arrow R1, a rotating spindle 6 which is provided on a lower surface of the spin chuck 5 and is rotatable with the spin chuck 5 supported, and a motor 7 which is coupled to the rotating spindle 6 and rotatively drives the rotating spindle 6 , thereby rotatively driving the spin chuck 5 and the substrate W around a rotating axis a1.
- a spin chuck (“a substrate rotating mechanism”) 5 for adsorbing and holding the substrate W in an approximately horizontal condition and rotating the substrate W in a direction of an arrow R1
- a rotating spindle 6 which is provided on a lower surface of the spin chuck 5 and is rotatable with the spin chuck 5 supported
- a motor 7 which is coupled to the rotating spindle 6 and rotatively drives the rotating spindle 6 , thereby rot
- the substrate processing apparatus 100 includes a discharging portion 20 capable of discharging the processing liquid 51 , a moving portion 155 for moving the discharging portion 20 , and a processing liquid supplying source 131 for supplying the processing liquid 51 to the discharging portion 20 .
- the discharging portion 20 discharges the processing liquid 51 to the processing region S3 of the substrate W which is being rotated by the spin chuck 5 .
- the moving portion 155 is provided with a motor at a side of the substrate W held on the spin chuck 5 .
- a cylindrical piping arm 180 is connected to an upper end of the discharging portion 20 .
- the piping arm 180 has rigidity and can supply the processing liquid 51 to the discharging portion 20 .
- the other end side of the piping arm 180 penetrates the moving portion 155 to reach a lower surface thereof.
- the moving portion 155 turns the piping arm 180 in an approximately horizontal plane around the moving portion 155 by means of a motor, thereby retreating the discharging portion 20 to an external retreating position of a conveyance passage in delivery of the substrate W to the spin chuck 5 .
- the moving portion 155 turns the piping arm 180 , thereby positioning the discharging portion 20 at a position above the substrate W where the discharging portion 20 can discharge the processing liquid 51 to a predetermined region on the processing region S3.
- the moving portion 155 turns the piping arm 180 , thereby moving the discharging portion 20 which is discharging the processing liquid 51 above the substrate W in order to move, over the processing region S3, the region to which the processing liquid 51 is to be discharged.
- the positioning and movement can be accurately carried out by servo control in the discharge of the processing liquid 51 through the discharging portion 20 .
- the servo control is carried out by a controller 161 . Therefore, it is possible to adjust the position of the discharging portion 20 in accordance with a command sent from the controller 161 .
- One end of a pipe 381 is connected to the other end of the piping arm 180 penetrating the moving portion 155 .
- the pipe 381 is provided through the processing liquid supplying source 131 .
- the other end of the pipe 381 is connected to the processing liquid supplying source 131 and an opening/closing valve 171 is provided in a middle part.
- the processing liquid supplying source 131 supplies the stored processing liquid 51 to the discharging portion 20 through the pipe 381 and the piping arm 180 by means of a pump or the like.
- the opening/closing operation of the opening/closing valve 171 is controlled by the controller 161 .
- the substrate processing apparatus 100 includes a cleaning portion 10 for cleaning the processing region S3 of the substrate W, a gas injecting portion 30 for injecting a gas 52 to an upper surface S1 of the substrate W, a gas supplying source 132 for supplying the stored gas 52 to the gas injecting portion 30 by means of a pump or the like, and a pipe 382 for connecting the gas injecting portion 30 and the gas supplying source 132 in communication.
- An opening/closing valve 172 is provided in a middle of the pipe 382 . The opening/closing valve 172 is controlled to be opened/closed by the controller 161 .
- the processing liquid supplying source 131 and the gas supplying source 132 may be provided on an outside of the substrate processing apparatus 100 .
- the cleaning portion 10 scrapes off and removes an adhering substance (a “pollutant”) such as a particle or a processing liquid adhering to the processing region S3 of the substrate W in abutment on the processing region S3 of the substrate W which is being rotated by the spin chuck 5 , thereby cleaning the processing region S3.
- the cleaning portion 10 is configured rotatably and has flexibility.
- the cleaning portion 10 is formed by a cylindrical brush or a porous member, for example, a member such as a sponge.
- the cleaning portion 10 abuts on the processing region S3 of the substrate W with an axial direction parallel with the rotating axis a1 of the substrate W.
- the cleaning portion 10 is rotated by a rotating mechanism not shown and is thus rotated around the axis of the cleaning portion 10 . Moreover, the cleaning portion 10 is positioned by means of a moving mechanism not shown at an abutting position where the cleaning portion 10 abuts on the processing region S3 of the substrate W and a separating position where the cleaning portion 10 separates from the processing region S3, respectively.
- the cleaning portion 10 abuts on the substrate W in a state in which the cleaning portion 10 breaks into the peripheral edge E1 of the substrate W, which is illustrated with simplification for easiness in understanding in FIGS. 1 to 3 .
- the cleaning portion 10 can clean the processing region S3 in a state in which the discharging portion 20 discharges the processing liquid 51 to the processing region S3, and furthermore, can clean the processing region S3 in a state in which the processing liquid 51 is not discharged.
- FIG. 6 is a side view typically showing an example of a schematic structure of the gas injecting portion 30 .
- the gas injecting portion 30 is provided above a portion between the cleaning portion 10 and the rotating axis a1 of the substrate W in the upper surface S1 of the substrate W.
- the gas injecting portion 30 includes a body taking a shape of a rectangular parallelepiped, an injecting port 31 provided on a side surface 36 opposed to the cleaning portion 10 in the body, and a passage 32 for causing the injecting port 31 and a pipe 382 to communicate with each other.
- a height h2 of a lower end of the gas injecting portion 30 with respect to the upper surface S1 of the substrate W is set to be 25 mm, for example.
- the shape of the gas injecting portion 30 is not restricted to the rectangular parallelepiped but various shapes are employed.
- the gas injecting portion 30 injects the gas 52 onto the upper surface S1 of the substrate W from above the substrate W toward a predefined injecting target region 201 in an axial direction of the passage 32 in the injecting port 31 portion. Consequently, a flow of the gas 52 (that is, a gas flow) from the injecting target region 201 toward the cleaning portion 10 side is generated on the substrate W.
- An angle ⁇ 3 formed by an injecting direction of the gas 52 and the upper surface S1 of the substrate W is set to be 45°, for example.
- the substrate processing apparatus 100 can prevent scattering, to the non-processing region S4, of the pollutant scraped off by the cleaning portion 10 or mist of the processing liquid 51 which is generated by the rotation of the cleaning portion 10 or the like and their adhesion to the non-processing region S4 through the flow of the gas 52 from the injecting target region 201 toward the cleaning portion 10 side.
- the gas injecting portion 30 injects a nitrogen gas or the like as the gas 52 , for example. It is also possible to inject a dry gas such as dry air or an inert gas other than a nitrogen gas in addition to the nitrogen gas.
- the substrate processing apparatus 100 is electrically connected to components provided in the substrate processing apparatus 100 and provided with the controller 161 for controlling the components.
- the controller 161 includes a computer or the like in which a CPU for carrying out various arithmetic processing, an ROM for storing a program or the like, an RAM serving as a work area for the arithmetic processing, a hard disk for storing a program, various data files and the like, a data communicating unit having a data communicating function through an LAN and the like are connected to each other by a bus or the like.
- the controller 161 is connected to an input portion including a display, a keyboard, a mouse and the like which perform various display operations. In the substrate processing apparatus 100 , predetermined processing is executed over the substrate W under control of the controller 161 .
- the substrate processing apparatus 100 may perform rinse processing which is not followed by the cleaning of the cleaning portion 10 , etching processing using an etchant as the processing liquid 51 or the like. In this case, the substrate processing apparatus 100 always needs neither the cleaning portion 10 nor the gas injecting portion 30 .
- FIG. 3 is a top view for explaining a region where the discharging portion 20 discharges the processing liquid 51 to the processing region S3.
- the discharging portion 20 discharges the processing liquid 51 toward a second region (a “main discharging region”) 72 which is predefined in a semicircular region M1 (which will be described below) at a downstream side in a rotating direction of the substrate W with respect to the cleaning portion 10 , and the semicircular region M1 is in a rotating track of the processing region S3.
- a second region a “main discharging region” 72 which is predefined in a semicircular region M1 (which will be described below) at a downstream side in a rotating direction of the substrate W with respect to the cleaning portion 10 , and the semicircular region M1 is in a rotating track of the processing region S3.
- the semicircular region M1 is provided on the downstream side in the rotating direction of the substrate W with respect to the cleaning portion 10 in two semicircular regions into which the rotating track of the processing region S3 is divided by a plane J1 passing through the cleaning portion 10 and the rotating axis a1 of the substrate W.
- the second region 72 is closer to the cleaning portion 10 in the rotating track of the processing region S3, a region where the processing liquid 51 is removed by the cleaning portion 10 and dried in the processing region S3 is reduced. Accordingly, it is more preferable that the second region 72 should be closer to the cleaning portion 10 at the downstream side in the rotating direction of the substrate W with respect to the cleaning portion 10 .
- the processing liquid 51 is directly discharged to the cleaning portion 10 , however, the processing liquid 51 splashes over an outer peripheral surface of the cleaning portion 10 so that the non-processing region S4 might be contaminated. For this reason, the second region 72 is previously defined in a different region from the region where the cleaning portion 10 abuts on the substrate W.
- FIGS. 4 and 5 are top and side views for explaining a discharging direction V1 in the discharge of the processing liquid 51 by the discharging portion 20 .
- the processing liquid 51 is discharged from the discharging port 21 of the discharging portion 20 .
- a passage 22 (see FIG. 12 ) is provided in the discharging portion 20 .
- the passage 22 causes the discharging port 21 and the piping arm 180 connected to an upper part of the discharging portion 20 to communicate with each other.
- the processing liquid 51 is discharged in the discharging direction V1 along a direction of an axis (a central axis) 23 in the discharging port 21 portion in the passage 22 .
- the discharging direction V1 is an oblique direction having a component V2 and a component V3.
- the component V2 is turned toward the downstream in the rotating direction of the substrate W along a tangential line 91 in a proximity part to the second region 72 in the peripheral edge E1 of the substrate W as seen in the direction of the rotating axis a1 of the substrate W from above the discharging portion 20 .
- the component V3 is turned from a central side (the rotating axis a1 side) of the substrate W in an orthogonal direction to the tangential line 91 toward the peripheral edge E1 side.
- An angle ⁇ 1 formed by the discharging direction V1 and the tangential line 91 is preferably set to be 30°, for example. If the angle ⁇ 1 is greater than 0° and is equal to or smaller than 90°, it does not need to be 30°. The angle ⁇ 1 may be slightly greater than 90°.
- an angle ⁇ 2 formed by the discharging direction V1 and the upper surface S1 is preferably set to be 30°, for example. If the angle ⁇ 2 is greater than 0° and is equal to or smaller than 90°, it does not need to be 30°. Moreover, the angle ⁇ 2 may be slightly greater than 90°.
- a height h1 of the discharging port 21 of the discharging portion 20 with respect to the upper surface S1 of the substrate W is set to be 1 mm to 3 mm, for example, and is preferably set to be 2 mm, for example.
- a flow rate of the processing liquid 51 is set to be 10 to 30 ml/min., for example, and is preferably set to be 20 ml/min, for example.
- the number of rotations of the substrate W is set to be 300 to 800 rpm, for example, and is preferably set to be 500 rpm, for example.
- FIGS. 7 to 10 are top views showing injecting ports 31 a and 31 c , and injecting ports 31 b and 31 d as an example of the injecting port 31 of the gas injecting portion 30 , respectively.
- the injecting ports 31 a to 31 d shown in FIGS. 7 to 10 are perspective images obtained by seeing through the injecting ports 31 a to 31 d in the direction of the rotating axis a1 of the substrate W from above the gas injecting portion 30 .
- the injecting port 31 a of the gas injecting portion 30 is slit-shaped and takes a long shape in a circumferential direction of the substrate W which is curved along a proximity part to the cleaning portion 10 (for example, a part surrounded by a broken line 111 ) which includes an abutting part on the cleaning portion 10 in the peripheral edge E1 of the substrate W as seen through in the direction of the rotating axis a1 (the Z direction) of the substrate W from above.
- respective distances L3 between respective parts of the slit-shaped injecting port 31 a and the proximity part can be made substantially equal to each other as compared with the case in which the perspective image of the injecting port 31 a is set along the tangential line 92 . Accordingly, a distribution along the tangential line 92 of the flow rate of the gas 52 in the proximity part can be made more uniform. In other words, the gas 52 can be supplied uniformly to the proximity part. Therefore, it is possible to prevent mist or the like from scattering from the proximity part and adhering to the non-processing region S4 of the upper surface S1 of the substrate W.
- the injecting ports 31 b of the gas injecting portion 30 are arranged apart from each other over a virtual line K1 curved along a proximity part to the cleaning portion 10 (a part surrounded by a broken line 111 , for example) including an abutting part on the cleaning portion 10 in the peripheral edge E1 of the substrate W as seen through in the direction of the rotating axis a1 of the substrate W from above the gas injecting portion 30 .
- the respective distances L3 between the injecting ports 31 b and the proximity part can be made substantially equal to each other as compared with the case in which respective perspective images of the injecting ports 31 b are arranged in the direction of the tangential line 92 in the abutting part on the cleaning portion 10 in the peripheral edge E1 of the substrate W. Accordingly, the distribution along the tangential line 92 of the flow rate of the gas 52 in the proximity part can be made more uniform. In other words, the gas 52 can be supplied uniformly to the proximity part. Therefore, it is possible to prevent mist or the like from scattering from the proximity part and adhering to the non-processing region S4 of the upper surface S1.
- the injecting port 31 c of the gas injecting portion 30 is slit-shaped and takes a long shape in the circumferential direction of the cleaning portion 10 which is curved along an opposed part (for example, a part surrounded by a broken line 112 ) to the peripheral edge E1 of the substrate W in an outer peripheral surface of the cleaning portion 10 as seen through in the direction of the rotating axis a1 from above the gas injecting portion 30 .
- respective distances L5 between respective parts of the slit-shaped injecting port 31 c and the opposed part in the outer peripheral surface of the cleaning portion 10 can be made substantially equal to each other as compared with the case in which the perspective image of the injecting port 31 c is long in the direction of the tangential line 92 in the abutting part on the cleaning portion 10 in the peripheral edge E1 of the substrate W. Accordingly, the gas 52 can be supplied uniformly to a contact position of the cleaning portion 10 with the substrate W from a periphery of the cleaning portion 10 . Therefore, it is possible to prevent mist or the like from scattering from the cleaning portion 10 and adhering to the non-processing region S4 of the upper surface S1.
- the injecting ports 31 d of the gas injecting portion 30 are arranged apart from each other over a virtual line K2 curved along the opposed part (the part surrounded by the broken line 112 , for example) to the peripheral edge E1 of the substrate W in the outer peripheral surface of the cleaning portion 10 as seen through in the direction of the rotating axis a1 from above the gas injecting portion 30 . Consequently, the respective distances L5 between the injecting ports 31 d and the opposed portion can be made substantially equal to each other as compared with the case in which the respective perspective images of the injecting ports 31 d are arranged in the direction of the tangential line 92 in the abutting part on the cleaning portion 10 in the peripheral edge E1.
- the gas 52 can be supplied uniformly to the contact position of the cleaning portion 10 with the substrate W from the periphery of the cleaning portion 10 . Therefore, mist generated from the cleaning portion 10 can be prevented from scattering to the non-processing region S4 of the upper surface S1.
- Hole diameters (diameters) of the injecting ports 31 b and 31 d are preferably set to be 0.5 mm to 1.0 mm.
- the numbers of the injecting ports 31 b and 31 d are set to be 5 to 10, respectively.
- the shapes of the injecting ports 31 b and 31 d are not restricted to a circle but a shape other than the circle, for example, a square may be employed, for example.
- Widths of the injecting ports 31 a and 31 c may be preferably set to be 0.5 mm to 1.0 mm, and lengths L2 and L4 of the injecting ports 31 a and 31 c along the tangential line 92 are preferably set to be approximately 40 mm.
- FIG. 11 is a bar graph showing an example of a relationship between the structure of the injecting port of the gas injecting portion 30 and the number of increase in particles adhering to the non-processing region S4 over the whole periphery of the substrate W. More specifically, an axis of abscissa of the graph shown in FIG. 11 indicates configurations of three types of injecting ports. An axis of ordinate indicates the number of increase in particles adhering to the non-processing region S4 over the whole periphery of the substrate W after the cleaning portion 10 performs the processing for cleaning the processing region S3 while the gas injecting portion 30 injects the gas 52 to each of the injecting ports shown in the axis of abscissa, respectively.
- the particle to be counted has a diameter of 40 nm or more.
- the injecting port takes a circular shape at a lower end of a pipe-shaped nozzle extended straight in a vertical direction with respect to the upper surface S1 of the substrate W.
- the injecting ports on a center and a right end of the axis of abscissa are the injecting ports 31 d and 31 a .
- the injecting ports 31 d and 31 a have the angle ⁇ 3 set to be 45° and the injecting port according to the comparative art has the angle ⁇ 3 set to be 90°, and all of the discharging ports have the heights h2 from the upper surface S1 set to be 25 mm.
- the flow rates of the gas 52 injected from the injecting port according to the comparative art and the injecting ports 31 d and 31 a are 100 NL/min., 170 NL/min. and 190 NL/min.
- the numbers of increase in particle for the injecting port according to the comparative art and the injecting ports 31 d and 31 a are 6136, 8 to 10, and 4 to 5, respectively. Even if any of the injecting port 31 a and the injecting ports 31 d is employed as the injecting port 31 of the gas injecting portion 30 according to the preferred embodiment, the number of increase in particles is considerably decreased as compared with the discharging port according to the comparative art.
- the injecting port 31 a In comparison between the injecting port 31 a and the injecting ports 31 d , the injecting port 31 a has the number of increase in particles improved to be an approximately half of the numbers of the injecting ports 31 d . Furthermore, a result of measurement for the injecting port 30 c which is not shown is improved, that is, the number is substantially equal to or slightly smaller than the numbers of the injecting ports 31 d . The reason is as follows. The injecting port 31 c is slit-shaped. For this reason, the flow of the gas 52 is made more uniform as compared with the injecting port 31 d provided discretely.
- the injecting ports 31 d are preferably employed as the injecting port 31 of the gas injecting portion 30 , the injecting port 31 c is more preferably employed, the injecting ports 31 b are further preferably employed, and the injecting port 31 a is further preferably employed.
- An injecting target region 201 of the gas injecting portion 30 shown in FIG. 6 (a line of the respective injecting target regions 201 corresponding to the injecting ports in the case in which the gas injecting portion 30 includes the injecting ports) is defined on the upper surface S1 of the substrate W so as to be opposed to the portion where the cleaning portion 10 in the processing region S3 of the substrate W abuts.
- the injecting target region 201 may include the inner peripheral edge E2 ( FIG. 2 ) of the rotating track of the processing region S3, may be defined on a central side (the rotating axis a1 side) of the substrate W from the inner peripheral edge E2 or may be defined on the peripheral edge (outer peripheral edge) E1 side from the inner peripheral edge E2.
- the injecting target region 201 is preferably defined to include the inner peripheral edge E2 of the rotating track of the processing region S3 and is more preferably defined in the vicinity of the rotating track of the processing region S3 at the central side of the substrate W from the inner peripheral edge E2.
- the gas flow of the gas 52 (the whole gas flow in the case of the injecting ports) is seen in the direction of the rotating axis a1 of the substrate W from above, it is preferable that the gas flow should include the whole cleaning portion 10 . If the whole cleaning portion 10 is included in the gas flow, it is possible to further prevent scattering, to the non-processing region, of mist generated from the cleaning portion 10 itself by the rotation of the cleaning portion 10 in addition to mist from the abutting part.
- a condition for including the whole cleaning portion 10 in the gas flow corresponds to the case in which the width in the direction of the tangential line 92 of the injecting port 31 (the width L2 in the case of the injecting port 31 a and the injecting ports 31 b , and the width L4 in the case of the injecting port 31 c and the injecting ports 31 d ) is greater than the diameter L1 of the cleaning portion 10 .
- the gas flow of the gas 52 should be the parallel flow because reduction in a flow velocity of the air flow can be prevented more greatly as compared with the case in which the gas flow spreads to be fan-shaped toward the cleaning portion 10 over the substrate W. Even if the gas flow is not the parallel flow, it is possible to prevent the scattering of the mist or the like to the non-processing region, and furthermore, to prevent spread of the gas flow by causing the gas injecting portion 30 to be closer to the cleaning portion 10 side. For this reason, the usability of the present invention is not damaged.
- the gas flow may be turned toward the rotating axis of the cleaning portion 10 .
- FIG. 12 is a side view showing an example of a schematic structure of the discharging portion 20 .
- the discharging portion 20 includes the discharging port 21 for discharging the processing liquid 51 and the passage 22 for causing the discharging port 21 and the piping arm 180 to communicate with each other, thereby supplying the processing liquid 51 to the discharging port 21 .
- a diameter ⁇ of the discharging port 21 is set to be 0.3 mm, for example.
- a section of the passage 22 in the discharging port 21 portion is projected onto a region 79 in the rotating track of the processing region S3 in the direction of the axis (“central axis”) 23 of the passage 22 in the discharge port 21 portion.
- the processing liquid 51 is discharged from the discharging port 21 in the direction of the axis 23 .
- the processing liquid 51 discharged from the discharging port 21 takes a shape of a liquid column having a substantially identical section to the section of the passage 22 and is discharged toward the region 79 .
- the inside diameter ⁇ of the discharging port 21 is substantially equal to a diameter of a section of the liquid column in the processing liquid 51 which is discharged.
- a sectional shape of a vicinal part of the discharging port 21 in the passage 22 should be constant in order to prevent more expansion of the section of the liquid column in the processing liquid 51 as the processing liquid 51 discharged from the discharging port 21 goes away from the discharging port 21 .
- the passage 22 in the discharging port 21 portion may take a sectional shape other than a circle, for example, a square.
- FIG. 13 is a view for explaining regions (a first region 71 for starting the discharge, a second region 72 for continuously carrying out the discharge, and a third region 73 for stopping the discharge) on the substrate W where the discharging portion 20 discharges the processing liquid 51 .
- FIG. 14 is a view showing, in time series, an example of change at a position of the discharging portion 20 in the discharging operation of the discharging portion 20 and a region where the processing liquid 51 is discharged onto the substrate W.
- the controller 161 controls the discharging portion 20 and the moving portion 155 in such a manner that the discharging portion 20 positioned at the first position 61 starts to discharge the processing liquid 51 and is moved to a second position (a “main discharging position”) 62 that is closer to the rotating axis a1 of the substrate W than a first position (a “discharge starting position”) 61 above the substrate W while discharging the processing liquid 51 , and continuously carries out the discharge of the processing liquid 51 at the second position 62 .
- the controller 161 controls the discharging portion 20 and the moving portion 155 in such a manner that the discharging portion 20 discharging the processing liquid 51 at the second position 62 is moved to a third position (a “discharge stopping position”) 63 which is more distant from the rotating axis a1 of the substrate W than the second position 62 while discharging the processing liquid 51 , and stops the discharge of the processing liquid 51 at the third position 63 .
- the controller 161 controls opening/closing of the opening/closing valve 171 , thereby controlling the discharging operation of the discharging portion 20 , and controls a rotating operation of a motor incorporated in the moving portion 155 , thereby controlling the moving portion 155 to move the discharging portion 20 .
- the first region 71 is a region in which the section of the passage 22 in the discharging port 21 portion of the discharging portion 20 positioned at the first position 61 is projected onto the rotating track of the processing region S3 in the direction of the axis 23 of the passage 22 in the discharging port 21 portion.
- the processing liquid 51 is discharged from the discharging portion 20 positioned at the first position 61 toward the first region 71 .
- the second region 72 is a region in which the section of the passage 22 in the discharging port 21 portion of the discharging portion 20 positioned at the second position 62 is projected onto the rotating track of the processing region S3 in the direction of the axis 23 of the passage 22 in the discharging port 21 portion.
- the processing liquid 51 is discharged from the discharging portion 20 positioned at the second position 62 toward the second region 72 .
- the third region 73 is a region in which the section of the passage 22 in the discharging port 21 portion of the discharging portion 20 positioned at the third position 63 is projected onto the rotating track of the processing region S3 in the direction of the axis 23 of the passage 22 in the discharging port 21 portion.
- the processing liquid 51 is discharged from the discharging portion 20 positioned at the third position 63 toward the third region 73 .
- the first region 71 and the third region 73 are provided on the peripheral edge E1 side of the substrate W from the second region 72 .
- the sectional shape of the passage 22 in the discharging port 21 portion is a circle and the angle ⁇ 2 ( FIGS. 5 and 12 ) is 90 degrees.
- the first region 71 (the third region 73 ) and the second region 72 take elliptical shapes and directions of major and minor axes are varied depending on the angle ⁇ 1.
- the sectional shape is not the circle, the first region 71 , the second region 72 and the third region 73 take various shapes depending on the sectional shape and the angles ⁇ 1 and ⁇ 2.
- the discharging portion 20 is positioned at the first position 61 (the third position 63 ) and the second position 62 , and is moved from the first position 61 (the third position 63 ) to the second position 62 , furthermore, is moved from the second position 62 to the third position 63 (the first position 61 ) by turning the piping arm 180 through the moving portion 155 controlled by the controller 161 .
- the width of the processing region S3 is 2 mm
- a moving distance from the first position 61 (the third position 63 ) to the second position 62 is remarkably reduced with respect to the length of the piping arm 180 for moving the discharging portion 20 .
- the size of the substrate W, the bore diameter ⁇ of the discharging port 21 , the first position 61 , the second position 62 , the third position 63 and a width L13 of the processing region S3 are preset and stored in a memory of the controller 161 or the like.
- the first position 61 and the third position 63 may be identical to each other or different from each other.
- the first region 71 and the third region 73 may be identical to each other or different from each other.
- the second position 62 is predetermined by an experiment or the like in such a manner that the processing liquid 51 discharged to the processing region S3 from the discharging portion 20 which is continuously performing the operation for discharging the processing liquid 51 in a stable shape of the liquid column at the second position 62 does not enter the non-processing region S4 but can carry out intended processing over the processing region S3 by using the processing liquid 51 .
- the second region 72 is a region where the discharged processing liquid 51 does not adhere to the non-processing region S4 when the discharging portion 20 continuously carries out the operation for discharging the processing liquid 51 toward the second region 72 in the stable shape of the liquid column, and is predetermined by an experiment or the like.
- a distance from the inner peripheral edge E2 of the processing region S3 to a center 82 of the second region 72 is set to be equal to or greater than the diameter ⁇ of the discharging port 21 as shown in FIG. 13 , for example. Consequently, when the discharging portion 20 discharges the processing liquid 51 at the second position 62 , it is possible to more reliably prevent the processing liquid 51 from entering the rotating axis a1 side of the substrate W from the processing region S3, that is, the non-processing region S4.
- the processing liquid 51 in the passage 22 of the discharging portion 20 is sucked back toward the processing liquid supplying source 131 side to reduce an amount of the processing liquid 51 discharged from the discharging portion 20 so that the splash of the processing liquid 51 can be restrained. Even if the discharge of the processing liquid 51 is stopped without the movement of the discharging portion 20 to the peripheral edge E1 side of the substrate W in a state in which the discharging portion 20 continuously discharges the processing liquid 51 in the second position 62 , accordingly, the usability of the present invention is not damaged.
- the discharging portion 20 starts the discharge of the processing liquid 51 toward the first region 71 in a state in which it is positioned at the first position 61 as shown in FIG. 14 .
- the discharging portion 20 is moved to the second position 62 along an arrow Y1 while discharging the processing liquid 51 , and continuously discharges the processing liquid 51 toward the second region 72 at the second position 62 .
- the discharging portion 20 is moved to the third position 63 along an arrow Y2 while discharging the processing liquid 51 .
- the discharging portion 20 is moved to the third position 63 , it discharges the processing liquid 51 toward the third region 73 .
- the substrate processing apparatus 100 may further include another discharging portion capable of discharging the processing liquid to the lower surface S2, and the discharging portion 20 discharges the processing liquid to the processing region S3 and another discharging portion may discharge the processing liquid to the lower surface S2.
- the discharge of the processing liquid to the processing region S3 and that of the processing liquid to the lower surface S2 may be carried out at the same time or sequentially.
- the processing liquid 51 is discharged from the discharging portion 20 at the first position 61 toward the first region 71 in the rotating track of the processing region S3, and is discharged from the discharging portion 20 at the second position 62 toward the second region 72 of the rotating track.
- the shape of the liquid column of the discharged processing liquid 51 is unstable as compared with the case in which the discharge is continuously carried out.
- the processing liquid 51 discharged toward the first region 71 is also discharged to the periphery of the first region 71 in some cases.
- the first region 71 is placed on the peripheral edge E1 side of the substrate W from the second region 72 .
- the discharging portion 20 continuously carries out the discharging operation.
- the processing liquid 51 is discharged in the stable shape of the liquid column. Accordingly, it is possible to prevent the adhesion of the processing liquid 51 to the non-processing region S4 due to the splash or the spread of the processing liquid 51 in the processing region S3 of the substrate W.
- the processing liquid 51 is discharged to the substrate W by the discharging portion 20 . As compared with the case in which the processing liquid leaking out of the sponge or the like is supplied to the substrate W, therefore, it is possible to supply the processing liquid in a larger amount. Thus, it is also possible to process the processing region S3 more reliably.
- the third region 73 is placed on the peripheral edge E1 side of the substrate W from the second region 72 . Accordingly, it is possible to restrain the adhesion of the processing liquid 51 to the non-processing region S4 due to the splash or the spread in the processing region S3 of the substrate W.
- FIG. 15 is a graph showing a distribution of a wetting range of the substrate W through the processing liquid 51 over the whole periphery of the substrate W after the discharging portion 20 carries out the processing for discharging the processing liquid 51 in order illustrated in FIG. 14 .
- the distribution of the wetting range is measured by variously changing the position of the first region 71 (that is, a distance L11 from the peripheral edge E1 of the substrate W to the center 81 of the first region 71 ).
- the first region 71 in the start of the discharge and the third region 73 in the end of the discharge are identical to each other.
- the first position 61 and the third position 63 of the discharging portion 20 are identical to each other, and the distance L11 is identical to a distance from the peripheral edge E1 of the substrate W to a center 83 of the third region 73 .
- each longitudinal bar shown for the distance L11 in an axis of abscissa indicates a minimum value of the wetting range measured over the whole periphery of the substrate W, and an upper end thereof indicates a maximum value of the wetting range. Moreover, a rhombic mark indicates an average value of the wetting range over the whole periphery of the substrate W.
- the width L13 (see FIG. 13 ) of the processing region S3 is set to be 2 mm and the position of the center 82 of the second region 72 is placed from the peripheral edge E1 of the substrate W by 1.7 mm. “Outside of wafer” described on a left end in the axis of abscissa in FIG.
- FIG. 16 is a graph showing an example of a distribution of the number of increase in particles adhering to the non-processing region S4 over the whole periphery of the substrate W with respect to each position (each distance L11 from the peripheral edge E1 of the substrate W to the center of each region) of the first region 71 (the third region 73 ) indicated by the axis of abscissa in FIG. 15 .
- the particle having a diameter of 40 nm or more is counted.
- the rhombic mark indicates an average value of the number of increase in particles over the whole periphery of the substrate W.
- the wetting range exceeds the width L13 of the processing region S3 so that the wetting region enters the non-processing region S4 in a part of the whole periphery of the substrate W so that the state of the wetting region with respect to each distance L11 is the worst in both an entering amount and the uniformity of the wetting range.
- the particle is also increased most greatly in the result of measurement with respect to the distance L11 when the distance L11 indicated by the axis of abscissa is “1.7 mm” (when the discharge of the processing liquid 51 is started and stopped at the second position 62 ).
- the wetting region reaches a last part of the inner peripheral edge E2 of the processing region S3 in a part of the whole periphery of the substrate W.
- the distribution width of the wetting range is increased. In other words, the uniformity of the wetting range is made poorer.
- the number of the particles is increased subsequently to the case in which the distance L11 is 1.7 mm (see FIG. 16 ).
- the uniformity of the wetting range is enhanced, and furthermore, the wetting range is included in the processing region S3 over the whole periphery of the substrate W.
- the number of increase in the particles is also included in a comparatively small value.
- the case in which the distance L11 is 0.15 mm in FIGS. 15 and 16 is equivalent to the case in which the distance L11 is 0.5 ⁇ , that is, the first region 71 (the third region 73 ) is surrounded by a broken line of FIG. 13 .
- the processing liquid 51 taking the unstable shape of the liquid column which is started to be discharged toward the first region 71 can be prevented from being discharged to the peripheral edge E1 of the substrate W if the distance L11 is equal to or greater than a half of the diameter ⁇ of the discharging port 21 . Accordingly, it is possible to prevent the adhesion of the processing liquid 51 to the non-processing region S4 from being caused by the splash in the peripheral edge E1.
- the distance L11 from the center 83 of the third region 73 to the peripheral edge E1 of the substrate W is equal to or greater than the half of the diameter ⁇ of the discharging port 21 . More specifically, the discharge of the processing liquid 51 to the peripheral edge E1 is prevented even if the shape of the liquid column is unstable in the process for stopping the discharge of the processing liquid 51 which is being continuously discharged toward the third region 73 . Accordingly, it is possible to prevent the adhesion to the non-processing region S4 from being caused by the splash in the peripheral edge E1 of the processing liquid 51 .
- the case in which the distance L11 is 1.55 mm is equivalent to the case in which the distance L12 from the center 81 of the first region 71 to the center 82 of the second region 72 is a half of the diameter ⁇ of the discharging port 21 , that is, the case in which the first region 71 is surrounded in a dashed line of FIG. 13 .
- the shape of the liquid column of the processing liquid 51 at the start of the discharge is unstable.
- the discharged processing liquid 51 might enter the non-processing region S4 in the case in which the distance L12, that is, a moving amount in the movement of the discharging portion 20 from the discharge starting position (the first position 61 ) of the processing liquid 51 to the discharge continuing position (the second position 62 ) thereof is small. For this reason, some length is required for the distance L12. More specifically, from the results of the measurement in FIGS. 15 and 16 , it is considered that the processing liquid 51 taking the unstable shape of the liquid column which is started to be discharged toward the first region 71 is prevented from entering the non-processing region S4 if the distance L12 is equal to or greater than the half of the diameter ⁇ of the discharging port 21 , for example.
- the distance L12 is set to be equal to or greater than the half of the diameter ⁇ of the discharging port 21 , for example, it is possible to restrain the adhesion to the non-processing region S4 of the processing liquid 51 started to be discharged toward the first region 71 equivalently or more as compared with the state in which the processing liquid 51 is being continuously discharged in the stable shape of the liquid column toward the second region 72 .
- the adhesion is due to the splash or the spread of the processing liquid 51 in the processing region S3 of the substrate W.
- the second region 72 is set to restrain the adhesion of the processing liquid 51 to the non-processing region S4 even if the processing liquid 51 is continuously discharged in the stable shape of the liquid column toward the second region 72 .
- FIGS. 17 and 18 are time charts showing an example of the cleaning operation of the substrate processing apparatus 100 .
- FIG. 17 is a time chart in the case in which the processing liquid is discharged during brush cleaning (during cleaning by the cleaning portion 10 )
- FIG. 18 is a time chart in the case in which the processing liquid is not discharged during the brush cleaning.
- the discharge of the processing liquid during the brush cleaning is mainly intended for wetting the brush with the processing liquid.
- FIG. 18 the processing liquid does not need to be discharged during the brush cleaning.
- FIG. 19 is a flowchart showing an example of the processing liquid discharging operation of the substrate processing apparatus 100 .
- FIG. 20 is a flowchart showing an example of the cleaning operation of the substrate processing apparatus 100 .
- the substrate processing apparatus 100 carries out previous rinse processing for discharging the processing liquid (cleaning solution) 51 from the discharging portion 20 to the processing region S3 of the substrate W prior to the cleaning through the cleaning portion 10 (brush) (step S 10 in FIG. 20 ).
- the position of the cleaning portion 10 is positioned at a separating position where the delivery of the substrate W to the spin chuck 5 is not disturbed. Moreover, the discharging portion 20 is also positioned at a retreating position where the delivery of the substrate W to the spin chuck 5 is not disturbed, and does not discharge the processing liquid (see FIGS. 17 and 18 ).
- the discharging portion 20 When the previous rinse processing in step S 10 is started in this state, the discharging portion 20 is first positioned at the first position 61 (the discharge starting position) by the moving portion 155 .
- the discharging portion 20 starts the discharge of the processing liquid 51 at the first position 61 ( FIGS. 17 , 18 and step S 110 in FIG. 19 ), and is moved to the second position 62 (the main discharging position) by the moving portion 155 while carrying out the discharge ( FIGS. 17 , 18 and step S 120 in FIG. 19 ).
- the discharging portion 20 continuously discharges the processing liquid 51 at the second position (step S 130 of FIG. 19 ) and the previous rinse processing is carried out.
- the discharging portion 20 is moved to the third position 63 (the discharge stopping position) by the moving portion 155 while discharging the processing liquid 51 , thereby ending the previous rinse processing ( FIGS. 17 , 18 and step S 140 in FIG. 19 ).
- the first position 61 and the third position 63 are equal to each other.
- the first position 61 and the third position 63 may be different from each other.
- the discharging portion 20 is disposed at the third position 63 ( FIGS. 17 and 18 ) and the discharge of the processing liquid 51 is stopped at the third position 63 ( FIGS. 17 , 18 and step S 150 in FIG. 19 ).
- step S 20 the brush cleaning processing is carried out by the cleaning portion 10 (brush) (step S 20 in FIG. 20 ).
- the cleaning portion 10 is moved to the abutting position on the processing region S3 of the substrate W from the separating position.
- the discharging portion 20 discharges the processing liquid 51 at the first position 61 (the third position 63 ) ( FIG. 17 ).
- the discharging portion 20 may start the discharge of the processing liquid 51 at the first position 61 and may be then moved to the second position 62 while discharging the processing liquid 51 , and may continuously discharge the processing liquid 51 at the second position 62 .
- the discharging portion 20 does not discharge the processing liquid 51 ( FIG. 18 ).
- the cleaning portion 10 is moved from the abutting position to the separating position, and the discharging portion 20 stops the discharge when it is discharging the processing liquid 51 ( FIG. 17 ). Consequently, the brush cleaning processing is ended.
- the discharging portion 20 is moved to the second position 62 while discharging the processing liquid 51 in the brush cleaning, thereby discharging the processing liquid 51 continuously, the discharging portion 20 is moved from the second position 62 to the third position 63 while discharging the processing liquid 51 in the end of the brush cleaning processing, and then ends the discharge of the processing liquid 51 .
- the substrate processing apparatus 100 carries out post rinse processing to be rinse processing after the brush cleaning (step S 30 in FIG. 20 ).
- the processing of steps S 110 to S 150 in FIG. 19 is carried out in the same manner as the previous rinse processing. Consequently, the post rinse processing is ended.
- the discharging portion 20 is retreated to the retreating position by the moving portion 155 ( FIGS. 17 and 18 ). Consequently, the cleaning operation of the substrate processing apparatus 100 is ended.
- the operations of the cleaning portion 10 , the discharging portion 20 and the moving portion 155 are controlled by the controller 161 .
- the discharging portion 20 starts to discharge the processing liquid 51 at the first position 61 and is moved to the second position 61 which is closer to the rotating axis a1 than the first position 61 while carrying out the discharge, and continuously performs the discharge at the second position 62 .
- the processing liquid 51 is discharged from the discharging port 21 in the direction of the axis 23 of the passage 22 in the discharging port 21 portion of the discharging portion 20 .
- the processing liquid 51 is discharged from the discharging portion 20 at the first position 61 toward the first region 71 in the rotating track of the processing region S3 and is discharged from the discharging portion 20 at the second position 62 toward the second region 72 of the rotating track.
- the shape of the liquid column of the discharged processing liquid 51 is more unstable than that in the case in which the discharge is continuously carried out. Therefore, the processing liquid 51 discharged toward the first region 71 is also discharged to the periphery of the first region 71 in some cases.
- the first region 71 is placed on the peripheral edge E1 side of the substrate W from the second region 72 .
- the discharging portion 20 continuously performs the discharging operation during the movement to the second position 62 and the discharging operation at the second position 62 . As compared with the start of the discharge, therefore, the processing liquid 51 is discharged in the more stable shape of the liquid column.
- the distance L11 from the peripheral edge E1 of the substrate W to the center 81 of the first region 71 is equal to or greater than the half of the diameter ⁇ of the discharging port 21 . Therefore, the processing liquid 51 taking the unstable shape of the liquid column which is started to be discharged toward the first region 71 is also prevented from being discharged to the peripheral edge E1 of the substrate W. Accordingly, it is possible to restrain the adhesion of the processing liquid 51 to the non-processing region S4 due to the splash at the peripheral edge E1.
- the distance L12 from the center 81 of the first region 71 to the center 82 of the second region 72 is equal to or greater than the half of the diameter ⁇ of the discharging port 21 . Accordingly, the processing liquid 51 taking the unstable shape of the liquid column which is started to be discharged toward the first region 71 is prevented from being discharged to the rotating axis a1 side of the substrate W from the second region 72 . Therefore, it is possible to restrain the adhesion to the non-processing region S4 of the processing liquid 51 equivalently or more as compared with the case in which the processing liquid 51 is continuously discharged toward the second region 72 . The adhesion is due to the splash or the spread in the processing region S3 of the substrate W caused by the processing liquid 51 started to be discharged toward the first region 71 .
- the discharging portion 20 discharging the processing liquid 51 at the second position 62 is moved to the third position 63 on the peripheral edge E1 side of the substrate W from the second position 62 while discharging the processing liquid 51 .
- the processing liquid 51 is discharged toward the third region 73 in the rotating track of the processing region S3 in the direction of the axis 23 of the passage 22 .
- the discharging portion 20 stops the discharge of the processing liquid 51 at the third position 63 .
- the processing liquid 51 is discharged consecutively. Therefore, the shape of the liquid column of the processing liquid 51 can be prevented from being unstable.
- the shape of the liquid column is unstable so that the processing liquid 51 is also discharged to the periphery of the third region 73 in some cases.
- the third region 73 is placed on the peripheral edge E1 side of the substrate W from the second region 72 . Accordingly, it is possible to restrain the adhesion of the processing liquid 51 to the non-processing region S4 due to the splash or the spread of the processing liquid 51 in the processing region S3 of the substrate W.
- the distance from the peripheral edge E1 of the substrate W to the center of the third region 73 is equal to or greater than the half of the diameter ⁇ of the discharging port 21 . Consequently, even if the discharge of the processing liquid 51 which is being consecutively discharged toward the third region 73 is stopped so that the shape of the liquid column is unstable, it is possible to prevent the processing liquid 51 from being discharged to the peripheral edge E1. Accordingly, it is possible to restrain the adhesion to the non-processing region S4 due to splash at the peripheral edge E1 of the processing liquid 51 which is being consecutively discharged toward the third region 73 and the processing liquid 51 of which discharge is stopped.
- the substrate processing apparatus in accordance with the present preferred embodiment further includes the cleaning portion 10 for cleaning the processing region S3 in abutment on the processing region S3 of the substrate W which is being rotated by the spin chuck 5 . Accordingly, it is possible to scrape off the pollutant of the processing region S3, thereby cleaning the processing region S3 through the cleaning portion 10 .
- the discharging portion 20 discharges the processing liquid 51 toward the second region (the main discharging region) 72 which is predefined in the semicircular region M1 at the downstream side in the rotating direction of the substrate W with respect to the cleaning portion 10 in the rotating track of the processing region S3. Accordingly, as compared with the case in which the processing liquid 51 is discharged to the upstream side in the rotating direction of the substrate W with respect to the cleaning portion 10 , for example, the processing liquid 51 is removed by the cleaning portion 10 in the processing region S3 so that a range brought into a dry state is reduced. Therefore, the processing region S3 of the upper surface S1 can be cleaned more reliably.
- the discharging direction V1 of the processing liquid 51 is the oblique direction having the component V2 and the component V3.
- the component V2 is turned toward the downstream side in the rotating direction of the substrate W along the tangential line 91 in the proximity part to the second region 72 in the peripheral edge E1 of the substrate W.
- the component V3 is turned from the central side (the rotating axis a1 side) of the substrate W in the orthogonal direction to the tangential line 91 toward the peripheral edge E1 side. Accordingly, the processing liquid 51 discharged to the processing region S3 can be prevented from adhering to the non-processing region S4 due to the splash or the spread up to the non-processing region S4.
- the gas injecting portion 30 generates, on the substrate W, the gas flow turned from the injecting target region 201 to the cleaning portion 10 side. Accordingly, the pollutant scraped off by the cleaning portion 10 or the mist of the processing liquid 51 generated by the rotation of the cleaning portion 10 or the like can be prevented from scattering to the non-processing region S4 and adhering to the non-processing region S4.
- the injecting port 31 a of the gas injecting portion 30 is slit-shaped and takes the long shape in the circumferential direction of the substrate W which is curved along the proximity part to the cleaning portion 10 including the abutting part on the cleaning portion 10 in the peripheral edge E1 of the substrate W as seen through in the direction of the rotating axis a1 of the substrate W from above.
- the respective distances L3 between the respective parts of the slit-shaped injecting port 31 a and the proximity part can be made substantially equal to each other. Accordingly, the gas 52 can be supplied uniformly to the proximity part. Therefore, it is possible to prevent mist or the like from scattering from the proximity part and adhering to the non-processing region S4 of the upper surface S1 of the substrate W.
- the injecting ports 31 b of the gas injecting portion 30 are arranged apart from each other over the virtual line K1 curved along the proximity part to the cleaning portion 10 including the abutting portion on the cleaning portion 10 in the peripheral edge E1 of the substrate W as seen through in the direction of the rotating axis a1 of the substrate W from above the gas injecting portion 30 . Consequently, the respective distances L3 between the injecting ports 31 b and the proximity part can be made substantially equal to each other as compared with the case in which the respective perspective images of the injecting ports 31 b are arranged in the direction of the tangential line 92 in the abutting part on the cleaning portion 10 in the peripheral edge E1 of the substrate W. Accordingly, the gas 52 can be supplied uniformly to the proximity part. Therefore, it is possible to prevent mist or the like from scattering from the proximity part and adhering to the non-processing region S4 of the upper surface S1.
- the injecting port 31 c of the gas injecting portion 30 is slit-shaped and takes the long shape in the circumferential direction of the cleaning portion 10 which is curved along the opposed part to the peripheral edge E1 of the substrate W in the outer peripheral surface of the cleaning portion 10 as seen through in the direction of the rotating axis a1 from above the gas injecting portion 30 .
- the respective distances L5 between the respective parts of the slit-shaped injecting port 31 c and the opposed part in the outer peripheral surface of the cleaning portion 10 can be made substantially equal to each other as compared with the case in which the perspective images of the injecting port 31 c are long in the direction of the tangential line 92 in the abutting part on the cleaning portion 10 in the peripheral edge E1 of the substrate W. Accordingly, the gas 52 can be supplied uniformly to the contact position of the cleaning portion 10 with the substrate W from the periphery of the cleaning portion 10 . Therefore, it is possible to prevent mist or the like from scattering from the cleaning portion 10 and adhering to the non-processing region S4 of the upper surface S1.
- the injecting ports 31 d of the gas injecting portion 30 are arranged apart from each other over the virtual line K2 curved along the opposed part to the peripheral edge E1 of the substrate W in the outer peripheral surface of the cleaning portion 10 as seen through in the direction of the rotating axis a1 from above the gas injecting portion 30 . Consequently, the respective distances L5 between the injecting ports 31 d and the opposed portion can be made substantially equal to each other as compared with the case in which the respective perspective images of the injecting ports 31 d are arranged in the direction of the tangential line 92 in the abutting part on the cleaning portion 10 in the peripheral edge E1.
- the gas 52 can be supplied uniformly to the contact position of the cleaning portion 10 with the substrate W from the periphery of the cleaning portion 10 . Therefore, the mist or the like generated from the cleaning portion 10 can be prevented from scattering to the non-processing region S4 of the upper surface S1.
- the discharging portion 20 at the first position 61 is caused to start the discharge of the processing liquid 51 toward the first region 71 in the rotating track of the processing region S3 of the substrate W which is being rotated, and consecutively, is caused to continuously discharge the processing liquid 51 , and at the same time, is moved to the second position 62 where the processing liquid 51 can be discharged toward the second region 72 in the rotating track.
- the discharging portion 20 is subsequently caused to continuously discharge the processing liquid 51 toward the second region 72 at the second position 62 .
- the shape of the liquid column of the discharged processing liquid 51 is more unstable as compared with the case in which the discharge is continuously carried out.
- the processing liquid 51 discharged toward the first region 71 is also discharged to the periphery of the first region 71 in some cases.
- the first region 71 is placed on the peripheral edge E1 side of the substrate W from the second region 72 .
- the discharging portion 20 continuously carries out the discharging operation. Therefore, the processing liquid 51 can be discharged in the more stable shape of the liquid column as compared with that at the start of the discharge. Accordingly, it is possible to prevent the adhesion of the processing liquid to the non-processing region S4 due to the splash of the processing liquid 51 in the processing region S3 of the substrate W or the spread of the processing liquid 51 in the processing region S3.
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Abstract
It is an object to prevent adhesion of a processing liquid to a non-processing region of a substrate. In order to achieve the object, a substrate processing apparatus includes a substrate rotating mechanism, a discharging portion for discharging a processing liquid to a substrate, a moving portion for moving a discharging portion, and a controller. The discharging portion starts to discharge the processing liquid at a first position and is moved to a second position. The first position is a position of the discharging portion where a section of a passage of the discharging portion is projected onto a first region, and the second position is a position of the discharging portion where the section of the passage is projected onto a second region. The first region is a region on the peripheral edge side of the substrate from the second region.
Description
- 1. Field of the Invention
- The present invention relates to a substrate processing technique for processing a peripheral edge part of a substrate.
- 2. Description of the Background Art
- As a substrate processing apparatus for performing such processing, for example, Japanese Patent Application Laid-Open No. 2006-278592 discloses an apparatus for causing a cylindrical brush to abut on a peripheral edge part of a substrate to carry out processing for cleaning the peripheral edge part while discharging a processing liquid onto a central part of an upper surface of the rotating substrate from above. For example, Japanese Patent Application Laid-Open No. 2009-164405 discloses a substrate processing apparatus for causing a sponge member impregnated with a processing liquid to abut on a peripheral edge part of a substrate, thereby supplying the processing liquid to the peripheral edge part, and at the same time, causing a blush to abut on the peripheral edge part, thereby cleaning the peripheral edge part at a position different from a position of the sponge member.
- However, the substrate processing apparatus disclosed in the Japanese Patent Application Laid-Open No. 2006-278592 has the following problem. More specifically, the processing liquid is supplied to a non-processing region other than the peripheral edge part on the upper surface of the substrate in addition to the peripheral edge part to be cleaned by the brush. For this reason, a device pattern formed in the non-processing region is damaged. This is a problem caused not only in the cleaning processing but in general processing to be performed in the peripheral edge part of the substrate by using the processing liquid. Furthermore, the substrate processing apparatus disclosed in the Japanese Patent Application Laid-Open No. 2009-164405 has the following problem. More specifically, the processing liquid is caused to leak out of the sponge member and is thus supplied to the peripheral edge part. For this reason, the processing liquid lacks so that the peripheral edge part is cleaned insufficiently and a pollutant scraped off by the brush cannot be sufficiently cleaned away.
- The present invention is directed to substrate processing for processing a peripheral edge part of a substrate.
- According to a first aspect of the present invention, a substrate processing apparatus includes the following members: a substrate rotating mechanism for holding and rotating a substrate; a discharging portion for discharging a processing liquid to an upper surface peripheral edge part in an upper surface of the substrate which is being rotated by the substrate rotating mechanism; a moving portion for moving the discharging portion; and a controller for controlling each of operations of the discharging portion and the moving portion. The discharging portion includes a discharging port for discharging the processing liquid and a passage for supplying the processing liquid to the discharging port in communication with the discharging port, the controller controls the discharging portion and the moving portion in such a manner that the discharging portion starts to discharge the processing liquid at a first position above the substrate and is moved to a second position which is closer to a rotating axis of the substrate than the first position while discharging the processing liquid, and continuously discharges the processing liquid at the second position, the first position is a position of the discharging portion where a section of the passage in a discharging port part of the discharging portion is projected onto a first region in a rotating track of the upper surface peripheral edge part in an axial direction of the passage in the discharging port part, the second position is a position of the discharging portion where the section of the passage is projected onto a second region in the rotating track in the axial direction of the passage, and the first region is a region on a peripheral edge side of the substrate from the second region.
- The discharging portion starts to discharge the processing liquid at the first position and is moved to the second position which is closer to the rotating axis of the substrate than the first position while carrying out the discharge, and continuously carries out the discharge at the second position. The processing liquid is discharged from the discharging port in the axial direction of the passage in the discharging port part of the discharging portion. For this reason, the processing liquid is discharged from the discharging portion at the first position toward the first region in the rotating track of the upper surface peripheral edge part, and is discharged from the discharging portion at the second position toward the second region of the rotating track. At the start of the discharge, a shape of a liquid column of the discharged processing liquid is more unstable as compared with that in the case in which the discharge is continuously carried out. For this reason, the processing liquid discharged toward the first region is also discharged to a periphery of the first region in some cases. The first region is a region on the peripheral edge side of the substrate from the second region. During the movement to the second position and the discharging operation at the second position, the discharging portion continuously carries out the discharging operation. Therefore, the processing liquid is discharged in a more stable shape of the liquid column than that at the start of the discharge. Accordingly, it is possible to restrain the adhesion of the processing liquid to the non-processing region due to the splash of the processing liquid on the upper surface of the substrate or the spread of the processing liquid on the upper surface of the substrate.
- According to another aspect of the present invention, the substrate processing apparatus includes the following members: a substrate rotating mechanism for holding and rotating a substrate; a discharging portion for discharging a processing liquid to an upper surface peripheral edge part in an upper surface of the substrate which is being rotated by the substrate rotating mechanism; and a cleaning portion for abutting on the upper surface peripheral edge part of the substrate which is being rotated by the substrate rotating mechanism, thereby cleaning the upper surface peripheral edge part, and the discharging portion discharges the processing liquid toward a main discharging region which is predefined in a semicircular region at a downstream side in a rotating direction of the substrate with respect to the cleaning portion in a rotating track of the upper surface peripheral edge part.
- The discharging portion discharges the processing liquid toward the main discharging region which is predefined in the semicircular region at the downstream side in the rotating direction of the substrate with respect to the cleaning portion in the rotating track of the upper surface peripheral edge part of the substrate. Accordingly, a range in which the processing liquid is removed to bring a dry state by the cleaning portion in the upper surface peripheral edge part is reduced as compared with the case in which the processing liquid is discharged to an upstream side in the rotating direction of the substrate with respect to the cleaning portion, for example. Accordingly, the upper surface peripheral edge part of the substrate can be cleaned more reliably.
- The present invention is also directed to a substrate processing method of processing a peripheral edge part of a substrate.
- Therefore, it is an object of the present invention to provide a substrate processing technique capable of preventing a processing liquid from adhering to a non-processing region other than an upper surface peripheral edge part of an upper surface of a substrate. Moreover, it is another object of the present invention to provide a cleaning technique capable of more reliably cleaning the upper surface peripheral edge part of the upper surface of the substrate.
- These and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
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FIG. 1 is a side view typically showing an example of a schematic structure of a substrate processing apparatus according to a preferred embodiment; -
FIG. 2 is a top view showing the substrate processing apparatus ofFIG. 1 ; -
FIG. 3 is a top view for explaining a region onto which a discharging portion discharges a processing liquid; -
FIG. 4 is a top view for explaining a discharging direction of the processing liquid through the discharging portion; -
FIG. 5 is a side view for explaining the discharging direction of the processing liquid through the discharging portion; -
FIG. 6 is a side view typically showing an example of a schematic structure of a gas injecting portion; -
FIGS. 7 , 8, 9, 10 are top views each showing an example of an injecting port of the gas injecting portion; -
FIG. 11 is a graph showing an example of a relationship between a structure of the injecting port and the number of increase in particles; -
FIG. 12 is a side view showing an example of a schematic structure of the discharging portion; -
FIG. 13 is a view for explaining a region on a substrate where the discharging portion discharges the processing liquid; -
FIG. 14 is a view for showing an example of change in a position of the discharging portion in time series; -
FIG. 15 is a graph showing an example of a relationship between a region on the substrate where discharging start (stop) is carried out and a wetting range distribution; -
FIG. 16 is a graph showing an example of a relationship between the region on the substrate where the discharging start (stop) is carried out and a distribution of the number of increase in particles; -
FIGS. 17 and 18 are time charts each showing an example of an operation for cleaning the substrate processing apparatus; -
FIG. 19 is a flowchart showing an example of a processing liquid discharging operation of the substrate processing apparatus; and -
FIG. 20 is a flowchart showing an example of the operation for cleaning the substrate processing apparatus. - A preferred embodiment according to the present invention will be described below with reference to the drawings. In the drawings, portions having the same structures and functions are indicated by the same designations, and repetitive explanation will be omitted in the following description. Moreover, each of the drawings is schematically shown. For easiness in understanding, dimensions or numbers of the respective portions are exaggerated or simplified for illustration in some cases. In a part of the drawings, furthermore, XYZ orthogonal coordinate axes are properly given to explain a direction. The Z axis in the coordinate axis indicates a vertical direction (a +Z side is an upper side) and an XY plane is a horizontal plane.
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FIG. 1 is a view typically showing an example of a schematic structure of asubstrate processing apparatus 100 according to a preferred embodiment.FIG. 2 is a top view showing thesubstrate processing apparatus 100. Thesubstrate processing apparatus 100 supplies aprocessing liquid 51 such as pure water to a processing region (which is also referred to as an “upper surface peripheral edge part”) S3 having a determined width from a peripheral edge (which is also referred to as an “end edge” or a “peripheral end edge”) E1 in an upper surface (which is also referred to as a “front surface”) S1 of a substrate W such as a semiconductor wafer and performs determined processing over the processing region S3 by using theprocessing liquid 51. - The pure water is used for the
processing liquid 51, for example. Theprocessing liquid 51 is not limited to the pure water, but may be functional water such as carbonated water, ion water, ozone water, reduced water (hydrogen water) or magnetic water, or chemicals such as ammonia water or a mixed solution of ammonia water and hydrogen peroxide water. The processing region S3 is a ring-shaped region having a width of 1.5 to 3.0 mm from the peripheral edge E1 of the substrate W in the upper surface S1 of the substrate W, for example. A lower surface S2 on an opposite side to the upper surface S1 is also referred to as a “back surface”. The substrate W takes an approximately circular surface shape which has a diameter of 300 mm, for example. A non-processing region S4 other than the processing region S3 of the upper surface S1 of the substrate W represents a device formation surface where a device pattern is formed. - The
substrate processing apparatus 100 includes a spin chuck (“a substrate rotating mechanism”) 5 for adsorbing and holding the substrate W in an approximately horizontal condition and rotating the substrate W in a direction of an arrow R1, a rotating spindle 6 which is provided on a lower surface of thespin chuck 5 and is rotatable with thespin chuck 5 supported, and a motor 7 which is coupled to the rotating spindle 6 and rotatively drives the rotating spindle 6, thereby rotatively driving thespin chuck 5 and the substrate W around a rotating axis a1. - Moreover, the
substrate processing apparatus 100 includes a dischargingportion 20 capable of discharging theprocessing liquid 51, a movingportion 155 for moving the dischargingportion 20, and a processingliquid supplying source 131 for supplying theprocessing liquid 51 to the dischargingportion 20. The dischargingportion 20 discharges theprocessing liquid 51 to the processing region S3 of the substrate W which is being rotated by thespin chuck 5. The movingportion 155 is provided with a motor at a side of the substrate W held on thespin chuck 5. Acylindrical piping arm 180 is connected to an upper end of the dischargingportion 20. Thepiping arm 180 has rigidity and can supply theprocessing liquid 51 to the dischargingportion 20. The other end side of thepiping arm 180 penetrates the movingportion 155 to reach a lower surface thereof. - The moving
portion 155 turns thepiping arm 180 in an approximately horizontal plane around the movingportion 155 by means of a motor, thereby retreating the dischargingportion 20 to an external retreating position of a conveyance passage in delivery of the substrate W to thespin chuck 5. When the dischargingportion 20 discharges the processing liquid to the processing region S3, the movingportion 155 turns thepiping arm 180, thereby positioning the dischargingportion 20 at a position above the substrate W where the dischargingportion 20 can discharge theprocessing liquid 51 to a predetermined region on the processing region S3. Furthermore, the movingportion 155 turns thepiping arm 180, thereby moving the dischargingportion 20 which is discharging theprocessing liquid 51 above the substrate W in order to move, over the processing region S3, the region to which theprocessing liquid 51 is to be discharged. The positioning and movement can be accurately carried out by servo control in the discharge of theprocessing liquid 51 through the dischargingportion 20. The servo control is carried out by acontroller 161. Therefore, it is possible to adjust the position of the dischargingportion 20 in accordance with a command sent from thecontroller 161. - One end of a
pipe 381 is connected to the other end of thepiping arm 180 penetrating the movingportion 155. Thepipe 381 is provided through the processingliquid supplying source 131. The other end of thepipe 381 is connected to the processingliquid supplying source 131 and an opening/closing valve 171 is provided in a middle part. The processingliquid supplying source 131 supplies the storedprocessing liquid 51 to the dischargingportion 20 through thepipe 381 and thepiping arm 180 by means of a pump or the like. The opening/closing operation of the opening/closing valve 171 is controlled by thecontroller 161. - Moreover, the
substrate processing apparatus 100 includes a cleaningportion 10 for cleaning the processing region S3 of the substrate W, agas injecting portion 30 for injecting agas 52 to an upper surface S1 of the substrate W, agas supplying source 132 for supplying the storedgas 52 to thegas injecting portion 30 by means of a pump or the like, and apipe 382 for connecting thegas injecting portion 30 and thegas supplying source 132 in communication. An opening/closing valve 172 is provided in a middle of thepipe 382. The opening/closing valve 172 is controlled to be opened/closed by thecontroller 161. The processingliquid supplying source 131 and thegas supplying source 132 may be provided on an outside of thesubstrate processing apparatus 100. - The cleaning
portion 10 scrapes off and removes an adhering substance (a “pollutant”) such as a particle or a processing liquid adhering to the processing region S3 of the substrate W in abutment on the processing region S3 of the substrate W which is being rotated by thespin chuck 5, thereby cleaning the processing region S3. The cleaningportion 10 is configured rotatably and has flexibility. The cleaningportion 10 is formed by a cylindrical brush or a porous member, for example, a member such as a sponge. The cleaningportion 10 abuts on the processing region S3 of the substrate W with an axial direction parallel with the rotating axis a1 of the substrate W. The cleaningportion 10 is rotated by a rotating mechanism not shown and is thus rotated around the axis of the cleaningportion 10. Moreover, the cleaningportion 10 is positioned by means of a moving mechanism not shown at an abutting position where the cleaningportion 10 abuts on the processing region S3 of the substrate W and a separating position where the cleaningportion 10 separates from the processing region S3, respectively. The cleaningportion 10 abuts on the substrate W in a state in which the cleaningportion 10 breaks into the peripheral edge E1 of the substrate W, which is illustrated with simplification for easiness in understanding inFIGS. 1 to 3 . Furthermore, the cleaningportion 10 can clean the processing region S3 in a state in which the dischargingportion 20 discharges theprocessing liquid 51 to the processing region S3, and furthermore, can clean the processing region S3 in a state in which theprocessing liquid 51 is not discharged. -
FIG. 6 is a side view typically showing an example of a schematic structure of thegas injecting portion 30. As shown inFIGS. 1 , 2 and 6, thegas injecting portion 30 is provided above a portion between the cleaningportion 10 and the rotating axis a1 of the substrate W in the upper surface S1 of the substrate W. Thegas injecting portion 30 includes a body taking a shape of a rectangular parallelepiped, an injectingport 31 provided on aside surface 36 opposed to the cleaningportion 10 in the body, and apassage 32 for causing the injectingport 31 and apipe 382 to communicate with each other. A height h2 of a lower end of thegas injecting portion 30 with respect to the upper surface S1 of the substrate W is set to be 25 mm, for example. The shape of thegas injecting portion 30 is not restricted to the rectangular parallelepiped but various shapes are employed. - The
gas injecting portion 30 injects thegas 52 onto the upper surface S1 of the substrate W from above the substrate W toward a predefinedinjecting target region 201 in an axial direction of thepassage 32 in the injectingport 31 portion. Consequently, a flow of the gas 52 (that is, a gas flow) from the injectingtarget region 201 toward the cleaningportion 10 side is generated on the substrate W. An angle θ3 formed by an injecting direction of thegas 52 and the upper surface S1 of the substrate W is set to be 45°, for example. - The
substrate processing apparatus 100 can prevent scattering, to the non-processing region S4, of the pollutant scraped off by the cleaningportion 10 or mist of theprocessing liquid 51 which is generated by the rotation of the cleaningportion 10 or the like and their adhesion to the non-processing region S4 through the flow of thegas 52 from the injectingtarget region 201 toward the cleaningportion 10 side. Thegas injecting portion 30 injects a nitrogen gas or the like as thegas 52, for example. It is also possible to inject a dry gas such as dry air or an inert gas other than a nitrogen gas in addition to the nitrogen gas. - As shown in
FIG. 1 , moreover, thesubstrate processing apparatus 100 is electrically connected to components provided in thesubstrate processing apparatus 100 and provided with thecontroller 161 for controlling the components. Specifically, thecontroller 161 includes a computer or the like in which a CPU for carrying out various arithmetic processing, an ROM for storing a program or the like, an RAM serving as a work area for the arithmetic processing, a hard disk for storing a program, various data files and the like, a data communicating unit having a data communicating function through an LAN and the like are connected to each other by a bus or the like. Moreover, thecontroller 161 is connected to an input portion including a display, a keyboard, a mouse and the like which perform various display operations. In thesubstrate processing apparatus 100, predetermined processing is executed over the substrate W under control of thecontroller 161. - The
substrate processing apparatus 100 may perform rinse processing which is not followed by the cleaning of the cleaningportion 10, etching processing using an etchant as theprocessing liquid 51 or the like. In this case, thesubstrate processing apparatus 100 always needs neither the cleaningportion 10 nor thegas injecting portion 30. - <2. Region where Discharging Portion Discharges Processing Liquid>
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FIG. 3 is a top view for explaining a region where the dischargingportion 20 discharges theprocessing liquid 51 to the processing region S3. As shown inFIG. 3 , the dischargingportion 20 discharges theprocessing liquid 51 toward a second region (a “main discharging region”) 72 which is predefined in a semicircular region M1 (which will be described below) at a downstream side in a rotating direction of the substrate W with respect to the cleaningportion 10, and the semicircular region M1 is in a rotating track of the processing region S3. Accordingly, as compared with the case in which theprocessing liquid 51 is discharged to an upstream side in the rotating direction of the substrate W with respect to the cleaningportion 10, for example, a range in which theprocessing liquid 51 is removed to bring a dry state by the cleaningportion 10 in the processing region S3 is reduced. Therefore, the processing region S3 of the upper surface S1 can be cleaned more reliably. The semicircular region M1 is provided on the downstream side in the rotating direction of the substrate W with respect to the cleaningportion 10 in two semicircular regions into which the rotating track of the processing region S3 is divided by a plane J1 passing through the cleaningportion 10 and the rotating axis a1 of the substrate W. - As the
second region 72 is closer to the cleaningportion 10 in the rotating track of the processing region S3, a region where theprocessing liquid 51 is removed by the cleaningportion 10 and dried in the processing region S3 is reduced. Accordingly, it is more preferable that thesecond region 72 should be closer to the cleaningportion 10 at the downstream side in the rotating direction of the substrate W with respect to the cleaningportion 10. When theprocessing liquid 51 is directly discharged to the cleaningportion 10, however, theprocessing liquid 51 splashes over an outer peripheral surface of the cleaningportion 10 so that the non-processing region S4 might be contaminated. For this reason, thesecond region 72 is previously defined in a different region from the region where the cleaningportion 10 abuts on the substrate W. -
FIGS. 4 and 5 are top and side views for explaining a discharging direction V1 in the discharge of theprocessing liquid 51 by the dischargingportion 20. Theprocessing liquid 51 is discharged from the dischargingport 21 of the dischargingportion 20. A passage 22 (seeFIG. 12 ) is provided in the dischargingportion 20. Thepassage 22 causes the dischargingport 21 and thepiping arm 180 connected to an upper part of the dischargingportion 20 to communicate with each other. Theprocessing liquid 51 is discharged in the discharging direction V1 along a direction of an axis (a central axis) 23 in the dischargingport 21 portion in thepassage 22. - As shown in
FIG. 4 , preferably, the discharging direction V1 is an oblique direction having a component V2 and a component V3. The component V2 is turned toward the downstream in the rotating direction of the substrate W along atangential line 91 in a proximity part to thesecond region 72 in the peripheral edge E1 of the substrate W as seen in the direction of the rotating axis a1 of the substrate W from above the dischargingportion 20. The component V3 is turned from a central side (the rotating axis a1 side) of the substrate W in an orthogonal direction to thetangential line 91 toward the peripheral edge E1 side. Accordingly, theprocessing liquid 51 discharged to the processing region S3 is prevented from adhering to the non-processing region S4 due to the splash or the spread up to the non-processing region S4. An angle θ1 formed by the discharging direction V1 and thetangential line 91 is preferably set to be 30°, for example. If the angle θ1 is greater than 0° and is equal to or smaller than 90°, it does not need to be 30°. The angle θ1 may be slightly greater than 90°. - When the discharging
portion 20 is seen from the side of the substrate W as shown inFIG. 5 , an angle θ2 formed by the discharging direction V1 and the upper surface S1 is preferably set to be 30°, for example. If the angle θ2 is greater than 0° and is equal to or smaller than 90°, it does not need to be 30°. Moreover, the angle θ2 may be slightly greater than 90°. - A height h1 of the discharging
port 21 of the dischargingportion 20 with respect to the upper surface S1 of the substrate W is set to be 1 mm to 3 mm, for example, and is preferably set to be 2 mm, for example. A flow rate of theprocessing liquid 51 is set to be 10 to 30 ml/min., for example, and is preferably set to be 20 ml/min, for example. The number of rotations of the substrate W is set to be 300 to 800 rpm, for example, and is preferably set to be 500 rpm, for example. -
FIGS. 7 to 10 are top views showing injectingports ports port 31 of thegas injecting portion 30, respectively. The injectingports 31 a to 31 d shown inFIGS. 7 to 10 are perspective images obtained by seeing through the injectingports 31 a to 31 d in the direction of the rotating axis a1 of the substrate W from above thegas injecting portion 30. - As shown in
FIG. 7 , the injectingport 31 a of thegas injecting portion 30 is slit-shaped and takes a long shape in a circumferential direction of the substrate W which is curved along a proximity part to the cleaning portion 10 (for example, a part surrounded by a broken line 111) which includes an abutting part on the cleaningportion 10 in the peripheral edge E1 of the substrate W as seen through in the direction of the rotating axis a1 (the Z direction) of the substrate W from above. Consequently, respective distances L3 between respective parts of the slit-shaped injectingport 31 a and the proximity part can be made substantially equal to each other as compared with the case in which the perspective image of the injectingport 31 a is set along thetangential line 92. Accordingly, a distribution along thetangential line 92 of the flow rate of thegas 52 in the proximity part can be made more uniform. In other words, thegas 52 can be supplied uniformly to the proximity part. Therefore, it is possible to prevent mist or the like from scattering from the proximity part and adhering to the non-processing region S4 of the upper surface S1 of the substrate W. - As shown in
FIG. 8 , the injectingports 31 b of thegas injecting portion 30 are arranged apart from each other over a virtual line K1 curved along a proximity part to the cleaning portion 10 (a part surrounded by abroken line 111, for example) including an abutting part on the cleaningportion 10 in the peripheral edge E1 of the substrate W as seen through in the direction of the rotating axis a1 of the substrate W from above thegas injecting portion 30. Consequently, the respective distances L3 between the injectingports 31 b and the proximity part can be made substantially equal to each other as compared with the case in which respective perspective images of the injectingports 31 b are arranged in the direction of thetangential line 92 in the abutting part on the cleaningportion 10 in the peripheral edge E1 of the substrate W. Accordingly, the distribution along thetangential line 92 of the flow rate of thegas 52 in the proximity part can be made more uniform. In other words, thegas 52 can be supplied uniformly to the proximity part. Therefore, it is possible to prevent mist or the like from scattering from the proximity part and adhering to the non-processing region S4 of the upper surface S1. - As shown in
FIG. 9 , the injectingport 31 c of thegas injecting portion 30 is slit-shaped and takes a long shape in the circumferential direction of the cleaningportion 10 which is curved along an opposed part (for example, a part surrounded by a broken line 112) to the peripheral edge E1 of the substrate W in an outer peripheral surface of the cleaningportion 10 as seen through in the direction of the rotating axis a1 from above thegas injecting portion 30. Consequently, respective distances L5 between respective parts of the slit-shaped injectingport 31 c and the opposed part in the outer peripheral surface of the cleaningportion 10 can be made substantially equal to each other as compared with the case in which the perspective image of the injectingport 31 c is long in the direction of thetangential line 92 in the abutting part on the cleaningportion 10 in the peripheral edge E1 of the substrate W. Accordingly, thegas 52 can be supplied uniformly to a contact position of the cleaningportion 10 with the substrate W from a periphery of the cleaningportion 10. Therefore, it is possible to prevent mist or the like from scattering from the cleaningportion 10 and adhering to the non-processing region S4 of the upper surface S1. - As shown in
FIG. 10 , the injectingports 31 d of thegas injecting portion 30 are arranged apart from each other over a virtual line K2 curved along the opposed part (the part surrounded by thebroken line 112, for example) to the peripheral edge E1 of the substrate W in the outer peripheral surface of the cleaningportion 10 as seen through in the direction of the rotating axis a1 from above thegas injecting portion 30. Consequently, the respective distances L5 between the injectingports 31 d and the opposed portion can be made substantially equal to each other as compared with the case in which the respective perspective images of the injectingports 31 d are arranged in the direction of thetangential line 92 in the abutting part on the cleaningportion 10 in the peripheral edge E1. Accordingly, thegas 52 can be supplied uniformly to the contact position of the cleaningportion 10 with the substrate W from the periphery of the cleaningportion 10. Therefore, mist generated from the cleaningportion 10 can be prevented from scattering to the non-processing region S4 of the upper surface S1. - Hole diameters (diameters) of the injecting
ports ports ports ports ports tangential line 92 are preferably set to be approximately 40 mm. -
FIG. 11 is a bar graph showing an example of a relationship between the structure of the injecting port of thegas injecting portion 30 and the number of increase in particles adhering to the non-processing region S4 over the whole periphery of the substrate W. More specifically, an axis of abscissa of the graph shown inFIG. 11 indicates configurations of three types of injecting ports. An axis of ordinate indicates the number of increase in particles adhering to the non-processing region S4 over the whole periphery of the substrate W after the cleaningportion 10 performs the processing for cleaning the processing region S3 while thegas injecting portion 30 injects thegas 52 to each of the injecting ports shown in the axis of abscissa, respectively. The particle to be counted has a diameter of 40 nm or more. - One of the three types of injecting ports shown in the axis of abscissa which is provided on a left end is the injecting port according to the comparative art. More specifically, the injecting port takes a circular shape at a lower end of a pipe-shaped nozzle extended straight in a vertical direction with respect to the upper surface S1 of the substrate W. The injecting ports on a center and a right end of the axis of abscissa are the injecting
ports ports gas 52 injected from the injecting port according to the comparative art and the injectingports ports 31 d, a total flow rate of thegas 52 injected from each of them) are 100 NL/min., 170 NL/min. and 190 NL/min. - As shown in
FIG. 11 , the numbers of increase in particle for the injecting port according to the comparative art and the injectingports port 31 a and the injectingports 31 d is employed as the injectingport 31 of thegas injecting portion 30 according to the preferred embodiment, the number of increase in particles is considerably decreased as compared with the discharging port according to the comparative art. - In comparison between the injecting
port 31 a and the injectingports 31 d, the injectingport 31 a has the number of increase in particles improved to be an approximately half of the numbers of the injectingports 31 d. Furthermore, a result of measurement for the injecting port 30 c which is not shown is improved, that is, the number is substantially equal to or slightly smaller than the numbers of the injectingports 31 d. The reason is as follows. The injectingport 31 c is slit-shaped. For this reason, the flow of thegas 52 is made more uniform as compared with the injectingport 31 d provided discretely. Moreover, a result of measurement for the injectingport 31 b which is not shown is substantially equal to or is slightly larger than the number of increase in particles of the injectingport 31 a. The reason is that the uniformity of the flow of thegas 52 in the injectingports 31 b is slightly deteriorated as compared with the injectingport 31 a. Accordingly, the injectingports 31 d are preferably employed as the injectingport 31 of thegas injecting portion 30, the injectingport 31 c is more preferably employed, the injectingports 31 b are further preferably employed, and the injectingport 31 a is further preferably employed. - An injecting
target region 201 of thegas injecting portion 30 shown inFIG. 6 (a line of the respective injectingtarget regions 201 corresponding to the injecting ports in the case in which thegas injecting portion 30 includes the injecting ports) is defined on the upper surface S1 of the substrate W so as to be opposed to the portion where the cleaningportion 10 in the processing region S3 of the substrate W abuts. The injectingtarget region 201 may include the inner peripheral edge E2 (FIG. 2 ) of the rotating track of the processing region S3, may be defined on a central side (the rotating axis a1 side) of the substrate W from the inner peripheral edge E2 or may be defined on the peripheral edge (outer peripheral edge) E1 side from the inner peripheral edge E2. The injectingtarget region 201 is preferably defined to include the inner peripheral edge E2 of the rotating track of the processing region S3 and is more preferably defined in the vicinity of the rotating track of the processing region S3 at the central side of the substrate W from the inner peripheral edge E2. - When the gas flow of the gas 52 (the whole gas flow in the case of the injecting ports) is seen in the direction of the rotating axis a1 of the substrate W from above, it is preferable that the gas flow should include the
whole cleaning portion 10. If thewhole cleaning portion 10 is included in the gas flow, it is possible to further prevent scattering, to the non-processing region, of mist generated from the cleaningportion 10 itself by the rotation of the cleaningportion 10 in addition to mist from the abutting part. In the case in which the gas flow (the whole gas flow in the case of the injecting ports) is a parallel flow which is symmetrical with a plane including the central axis (the rotating axis) of the cleaningportion 10 and the rotating axis a1 of the substrate W, a condition for including thewhole cleaning portion 10 in the gas flow corresponds to the case in which the width in the direction of thetangential line 92 of the injecting port 31 (the width L2 in the case of the injectingport 31 a and the injectingports 31 b, and the width L4 in the case of the injectingport 31 c and the injectingports 31 d) is greater than the diameter L1 of the cleaningportion 10. - It is more preferable that the gas flow of the
gas 52 should be the parallel flow because reduction in a flow velocity of the air flow can be prevented more greatly as compared with the case in which the gas flow spreads to be fan-shaped toward the cleaningportion 10 over the substrate W. Even if the gas flow is not the parallel flow, it is possible to prevent the scattering of the mist or the like to the non-processing region, and furthermore, to prevent spread of the gas flow by causing thegas injecting portion 30 to be closer to the cleaningportion 10 side. For this reason, the usability of the present invention is not damaged. For example, the gas flow may be turned toward the rotating axis of the cleaningportion 10. -
FIG. 12 is a side view showing an example of a schematic structure of the dischargingportion 20. As shown inFIG. 12 , the dischargingportion 20 includes the dischargingport 21 for discharging theprocessing liquid 51 and thepassage 22 for causing the dischargingport 21 and thepiping arm 180 to communicate with each other, thereby supplying theprocessing liquid 51 to the dischargingport 21. A diameter φ of the dischargingport 21 is set to be 0.3 mm, for example. A section of thepassage 22 in the dischargingport 21 portion is projected onto aregion 79 in the rotating track of the processing region S3 in the direction of the axis (“central axis”) 23 of thepassage 22 in thedischarge port 21 portion. - The
processing liquid 51 is discharged from the dischargingport 21 in the direction of theaxis 23. In the case in which the sectional shape of thepassage 22 in the dischargingport 21 portion is substantially constant, theprocessing liquid 51 discharged from the dischargingport 21 takes a shape of a liquid column having a substantially identical section to the section of thepassage 22 and is discharged toward theregion 79. In this case, the inside diameter φ of the dischargingport 21 is substantially equal to a diameter of a section of the liquid column in theprocessing liquid 51 which is discharged. It is preferable that a sectional shape of a vicinal part of the dischargingport 21 in thepassage 22 should be constant in order to prevent more expansion of the section of the liquid column in theprocessing liquid 51 as theprocessing liquid 51 discharged from the dischargingport 21 goes away from the dischargingport 21. Thepassage 22 in the dischargingport 21 portion may take a sectional shape other than a circle, for example, a square. -
FIG. 13 is a view for explaining regions (afirst region 71 for starting the discharge, asecond region 72 for continuously carrying out the discharge, and athird region 73 for stopping the discharge) on the substrate W where the dischargingportion 20 discharges theprocessing liquid 51.FIG. 14 is a view showing, in time series, an example of change at a position of the dischargingportion 20 in the discharging operation of the dischargingportion 20 and a region where theprocessing liquid 51 is discharged onto the substrate W. - The
controller 161 controls the dischargingportion 20 and the movingportion 155 in such a manner that the dischargingportion 20 positioned at thefirst position 61 starts to discharge theprocessing liquid 51 and is moved to a second position (a “main discharging position”) 62 that is closer to the rotating axis a1 of the substrate W than a first position (a “discharge starting position”) 61 above the substrate W while discharging theprocessing liquid 51, and continuously carries out the discharge of theprocessing liquid 51 at thesecond position 62. Furthermore, thecontroller 161 controls the dischargingportion 20 and the movingportion 155 in such a manner that the dischargingportion 20 discharging theprocessing liquid 51 at thesecond position 62 is moved to a third position (a “discharge stopping position”) 63 which is more distant from the rotating axis a1 of the substrate W than thesecond position 62 while discharging theprocessing liquid 51, and stops the discharge of theprocessing liquid 51 at thethird position 63. Thecontroller 161 controls opening/closing of the opening/closing valve 171, thereby controlling the discharging operation of the dischargingportion 20, and controls a rotating operation of a motor incorporated in the movingportion 155, thereby controlling the movingportion 155 to move the dischargingportion 20. - As shown in
FIGS. 13 and 14 , thefirst region 71 is a region in which the section of thepassage 22 in the dischargingport 21 portion of the dischargingportion 20 positioned at thefirst position 61 is projected onto the rotating track of the processing region S3 in the direction of theaxis 23 of thepassage 22 in the dischargingport 21 portion. Theprocessing liquid 51 is discharged from the dischargingportion 20 positioned at thefirst position 61 toward thefirst region 71. - Similarly, the
second region 72 is a region in which the section of thepassage 22 in the dischargingport 21 portion of the dischargingportion 20 positioned at thesecond position 62 is projected onto the rotating track of the processing region S3 in the direction of theaxis 23 of thepassage 22 in the dischargingport 21 portion. Theprocessing liquid 51 is discharged from the dischargingportion 20 positioned at thesecond position 62 toward thesecond region 72. - Similarly, the
third region 73 is a region in which the section of thepassage 22 in the dischargingport 21 portion of the dischargingportion 20 positioned at thethird position 63 is projected onto the rotating track of the processing region S3 in the direction of theaxis 23 of thepassage 22 in the dischargingport 21 portion. Theprocessing liquid 51 is discharged from the dischargingportion 20 positioned at thethird position 63 toward thethird region 73. Moreover, thefirst region 71 and thethird region 73 are provided on the peripheral edge E1 side of the substrate W from thesecond region 72. - In
FIG. 13 , the sectional shape of thepassage 22 in the dischargingport 21 portion is a circle and the angle θ2 (FIGS. 5 and 12 ) is 90 degrees. In the case in which the sectional shape is the circle and the angle θ2 is not 90 degrees, the first region 71 (the third region 73) and thesecond region 72 take elliptical shapes and directions of major and minor axes are varied depending on the angle θ1. If the sectional shape is not the circle, thefirst region 71, thesecond region 72 and thethird region 73 take various shapes depending on the sectional shape and the angles θ1 and θ2. - As described above, the discharging
portion 20 is positioned at the first position 61 (the third position 63) and thesecond position 62, and is moved from the first position 61 (the third position 63) to thesecond position 62, furthermore, is moved from thesecond position 62 to the third position 63 (the first position 61) by turning thepiping arm 180 through the movingportion 155 controlled by thecontroller 161. For example, if the width of the processing region S3 is 2 mm, a moving distance from the first position 61 (the third position 63) to thesecond position 62 is remarkably reduced with respect to the length of thepiping arm 180 for moving the dischargingportion 20. Consequently, in the case in which the movingportion 155 turns thepiping arm 180 to move the dischargingportion 20 from the first position 61 (the third position 63) to thesecond position 62 as shown inFIG. 1 , the dischargingportion 20 is moved almost linearly so that the angles θ1 and θ2 are maintained to be constant. - The size of the substrate W, the bore diameter φ of the discharging
port 21, thefirst position 61, thesecond position 62, thethird position 63 and a width L13 of the processing region S3 are preset and stored in a memory of thecontroller 161 or the like. Thefirst position 61 and thethird position 63 may be identical to each other or different from each other. In other words, thefirst region 71 and thethird region 73 may be identical to each other or different from each other. - The
second position 62 is predetermined by an experiment or the like in such a manner that theprocessing liquid 51 discharged to the processing region S3 from the dischargingportion 20 which is continuously performing the operation for discharging theprocessing liquid 51 in a stable shape of the liquid column at thesecond position 62 does not enter the non-processing region S4 but can carry out intended processing over the processing region S3 by using theprocessing liquid 51. In other words, thesecond region 72 is a region where the dischargedprocessing liquid 51 does not adhere to the non-processing region S4 when the dischargingportion 20 continuously carries out the operation for discharging theprocessing liquid 51 toward thesecond region 72 in the stable shape of the liquid column, and is predetermined by an experiment or the like. More specifically, a distance from the inner peripheral edge E2 of the processing region S3 to acenter 82 of thesecond region 72 is set to be equal to or greater than the diameter φ of the dischargingport 21 as shown inFIG. 13 , for example. Consequently, when the dischargingportion 20 discharges theprocessing liquid 51 at thesecond position 62, it is possible to more reliably prevent theprocessing liquid 51 from entering the rotating axis a1 side of the substrate W from the processing region S3, that is, the non-processing region S4. - When the discharge of the
processing liquid 51 is stopped, theprocessing liquid 51 in thepassage 22 of the dischargingportion 20 is sucked back toward the processingliquid supplying source 131 side to reduce an amount of theprocessing liquid 51 discharged from the dischargingportion 20 so that the splash of theprocessing liquid 51 can be restrained. Even if the discharge of theprocessing liquid 51 is stopped without the movement of the dischargingportion 20 to the peripheral edge E1 side of the substrate W in a state in which the dischargingportion 20 continuously discharges theprocessing liquid 51 in thesecond position 62, accordingly, the usability of the present invention is not damaged. - By the control of the discharging
portion 20 and the movingportion 155 through thecontroller 161, the dischargingportion 20 starts the discharge of theprocessing liquid 51 toward thefirst region 71 in a state in which it is positioned at thefirst position 61 as shown inFIG. 14 . Next, the dischargingportion 20 is moved to thesecond position 62 along an arrow Y1 while discharging theprocessing liquid 51, and continuously discharges theprocessing liquid 51 toward thesecond region 72 at thesecond position 62. Subsequently, the dischargingportion 20 is moved to thethird position 63 along an arrow Y2 while discharging theprocessing liquid 51. When the dischargingportion 20 is moved to thethird position 63, it discharges theprocessing liquid 51 toward thethird region 73. When the movement to thethird position 63 is completed, the dischargingportion 20 stops the discharge of theprocessing liquid 51. Thesubstrate processing apparatus 100 may further include another discharging portion capable of discharging the processing liquid to the lower surface S2, and the dischargingportion 20 discharges the processing liquid to the processing region S3 and another discharging portion may discharge the processing liquid to the lower surface S2. In this case, the discharge of the processing liquid to the processing region S3 and that of the processing liquid to the lower surface S2 may be carried out at the same time or sequentially. - As described above, the
processing liquid 51 is discharged from the dischargingportion 20 at thefirst position 61 toward thefirst region 71 in the rotating track of the processing region S3, and is discharged from the dischargingportion 20 at thesecond position 62 toward thesecond region 72 of the rotating track. At start of the discharge, the shape of the liquid column of the dischargedprocessing liquid 51 is unstable as compared with the case in which the discharge is continuously carried out. For this reason, theprocessing liquid 51 discharged toward thefirst region 71 is also discharged to the periphery of thefirst region 71 in some cases. Thefirst region 71 is placed on the peripheral edge E1 side of the substrate W from thesecond region 72. During the movement to thesecond position 62 and the discharging operation in thesecond position 62, the dischargingportion 20 continuously carries out the discharging operation. As compared with the start of the discharge, therefore, theprocessing liquid 51 is discharged in the stable shape of the liquid column. Accordingly, it is possible to prevent the adhesion of theprocessing liquid 51 to the non-processing region S4 due to the splash or the spread of theprocessing liquid 51 in the processing region S3 of the substrate W. Moreover, theprocessing liquid 51 is discharged to the substrate W by the dischargingportion 20. As compared with the case in which the processing liquid leaking out of the sponge or the like is supplied to the substrate W, therefore, it is possible to supply the processing liquid in a larger amount. Thus, it is also possible to process the processing region S3 more reliably. - In both a state in which the discharging
portion 20 continuously carries out the discharging operation at thesecond position 62 and a state in which the dischargingportion 20 is moved from thesecond position 62 to thethird position 63, furthermore, theprocessing liquid 51 is discharged consecutively. Therefore, the shape of the liquid column of theprocessing liquid 51 can be prevented from being unstable. When the discharge of theprocessing liquid 51 is stopped in a state in which theprocessing liquid 51 is discharged from the dischargingportion 20 at thethird position 63 toward thethird region 73, moreover, the shape of the liquid column is unstable so that theprocessing liquid 51 is also discharged to the periphery of thethird region 73 in some cases. However, thethird region 73 is placed on the peripheral edge E1 side of the substrate W from thesecond region 72. Accordingly, it is possible to restrain the adhesion of theprocessing liquid 51 to the non-processing region S4 due to the splash or the spread in the processing region S3 of the substrate W. -
FIG. 15 is a graph showing a distribution of a wetting range of the substrate W through theprocessing liquid 51 over the whole periphery of the substrate W after the dischargingportion 20 carries out the processing for discharging theprocessing liquid 51 in order illustrated inFIG. 14 . The distribution of the wetting range is measured by variously changing the position of the first region 71 (that is, a distance L11 from the peripheral edge E1 of the substrate W to thecenter 81 of the first region 71). In the example ofFIG. 15 , thefirst region 71 in the start of the discharge and thethird region 73 in the end of the discharge are identical to each other. In other words, thefirst position 61 and thethird position 63 of the dischargingportion 20 are identical to each other, and the distance L11 is identical to a distance from the peripheral edge E1 of the substrate W to acenter 83 of thethird region 73. - A lower end of each longitudinal bar shown for the distance L11 in an axis of abscissa indicates a minimum value of the wetting range measured over the whole periphery of the substrate W, and an upper end thereof indicates a maximum value of the wetting range. Moreover, a rhombic mark indicates an average value of the wetting range over the whole periphery of the substrate W. The width L13 (see
FIG. 13 ) of the processing region S3 is set to be 2 mm and the position of thecenter 82 of thesecond region 72 is placed from the peripheral edge E1 of the substrate W by 1.7 mm. “Outside of wafer” described on a left end in the axis of abscissa inFIG. 15 corresponds to a state in which the first region 71 (the third region 73) includes the peripheral edge E1. “1.7 mm” described on a right end of the axis of abscissa corresponds to a state in which the first region 71 (the third region 73) is coincident with thesecond region 72, that is, a state in which the discharge of theprocessing liquid 51 is started at thesecond position 62 and is exactly carried out continuously at thesecond position 62, and is then ended at thesecond position 62. -
FIG. 16 is a graph showing an example of a distribution of the number of increase in particles adhering to the non-processing region S4 over the whole periphery of the substrate W with respect to each position (each distance L11 from the peripheral edge E1 of the substrate W to the center of each region) of the first region 71 (the third region 73) indicated by the axis of abscissa inFIG. 15 . The particle having a diameter of 40 nm or more is counted. Moreover, the rhombic mark indicates an average value of the number of increase in particles over the whole periphery of the substrate W. - As shown in
FIG. 15 , when the distance L11 indicated by the axis of abscissa is “1.7 mm” (when the discharge of theprocessing liquid 51 is started and stopped at the second position 62), the wetting range exceeds the width L13 of the processing region S3 so that the wetting region enters the non-processing region S4 in a part of the whole periphery of the substrate W so that the state of the wetting region with respect to each distance L11 is the worst in both an entering amount and the uniformity of the wetting range. As shown inFIG. 16 , the particle is also increased most greatly in the result of measurement with respect to the distance L11 when the distance L11 indicated by the axis of abscissa is “1.7 mm” (when the discharge of theprocessing liquid 51 is started and stopped at the second position 62). - As shown in
FIG. 15 , when the distance L11 indicated by the axis of abscissa is “0 mm” (when a part of thefirst region 71 and thethird region 73 is placed on the outside of the wafer), the wetting region reaches a last part of the inner peripheral edge E2 of the processing region S3 in a part of the whole periphery of the substrate W. As compared with the case in which the distance L11 is 0.15 mm to 1.55 mm, the distribution width of the wetting range is increased. In other words, the uniformity of the wetting range is made poorer. Moreover, the number of the particles is increased subsequently to the case in which the distance L11 is 1.7 mm (seeFIG. 16 ). - As shown in
FIG. 15 , in the case in which the distance L11 is 0.15 mm to 1.55 mm, the uniformity of the wetting range is enhanced, and furthermore, the wetting range is included in the processing region S3 over the whole periphery of the substrate W. As shown inFIG. 16 , in the case in which the distance L11 is 0.15 mm to 1.55 mm, the number of increase in the particles is also included in a comparatively small value. - The case in which the distance L11 is 0.15 mm in
FIGS. 15 and 16 is equivalent to the case in which the distance L11 is 0.5φ, that is, the first region 71 (the third region 73) is surrounded by a broken line ofFIG. 13 . From the results of the measurement inFIGS. 15 and 16 , it is supposed that theprocessing liquid 51 taking the unstable shape of the liquid column which is started to be discharged toward thefirst region 71 can be prevented from being discharged to the peripheral edge E1 of the substrate W if the distance L11 is equal to or greater than a half of the diameter φ of the dischargingport 21. Accordingly, it is possible to prevent the adhesion of theprocessing liquid 51 to the non-processing region S4 from being caused by the splash in the peripheral edge E1. - If the distance L11 from the
center 83 of thethird region 73 to the peripheral edge E1 of the substrate W is equal to or greater than the half of the diameter φ of the dischargingport 21, the following is supposed. More specifically, the discharge of theprocessing liquid 51 to the peripheral edge E1 is prevented even if the shape of the liquid column is unstable in the process for stopping the discharge of theprocessing liquid 51 which is being continuously discharged toward thethird region 73. Accordingly, it is possible to prevent the adhesion to the non-processing region S4 from being caused by the splash in the peripheral edge E1 of theprocessing liquid 51. - In the axis of abscissa of
FIGS. 15 and 16 , the case in which the distance L11 is 1.55 mm is equivalent to the case in which the distance L12 from thecenter 81 of thefirst region 71 to thecenter 82 of thesecond region 72 is a half of the diameter φ of the dischargingport 21, that is, the case in which thefirst region 71 is surrounded in a dashed line ofFIG. 13 . The shape of the liquid column of theprocessing liquid 51 at the start of the discharge is unstable. For this reason, there is a possibility that the dischargedprocessing liquid 51 might enter the non-processing region S4 in the case in which the distance L12, that is, a moving amount in the movement of the dischargingportion 20 from the discharge starting position (the first position 61) of theprocessing liquid 51 to the discharge continuing position (the second position 62) thereof is small. For this reason, some length is required for the distance L12. More specifically, from the results of the measurement inFIGS. 15 and 16 , it is considered that theprocessing liquid 51 taking the unstable shape of the liquid column which is started to be discharged toward thefirst region 71 is prevented from entering the non-processing region S4 if the distance L12 is equal to or greater than the half of the diameter φ of the dischargingport 21, for example. In other words, if the distance L12 is set to be equal to or greater than the half of the diameter φ of the dischargingport 21, for example, it is possible to restrain the adhesion to the non-processing region S4 of theprocessing liquid 51 started to be discharged toward thefirst region 71 equivalently or more as compared with the state in which theprocessing liquid 51 is being continuously discharged in the stable shape of the liquid column toward thesecond region 72. The adhesion is due to the splash or the spread of theprocessing liquid 51 in the processing region S3 of the substrate W. Here, thesecond region 72 is set to restrain the adhesion of theprocessing liquid 51 to the non-processing region S4 even if theprocessing liquid 51 is continuously discharged in the stable shape of the liquid column toward thesecond region 72. -
FIGS. 17 and 18 are time charts showing an example of the cleaning operation of thesubstrate processing apparatus 100.FIG. 17 is a time chart in the case in which the processing liquid is discharged during brush cleaning (during cleaning by the cleaning portion 10) andFIG. 18 is a time chart in the case in which the processing liquid is not discharged during the brush cleaning. The discharge of the processing liquid during the brush cleaning is mainly intended for wetting the brush with the processing liquid. As shown inFIG. 18 , the processing liquid does not need to be discharged during the brush cleaning.FIG. 19 is a flowchart showing an example of the processing liquid discharging operation of thesubstrate processing apparatus 100.FIG. 20 is a flowchart showing an example of the cleaning operation of thesubstrate processing apparatus 100. - The
substrate processing apparatus 100 carries out previous rinse processing for discharging the processing liquid (cleaning solution) 51 from the dischargingportion 20 to the processing region S3 of the substrate W prior to the cleaning through the cleaning portion 10 (brush) (step S10 inFIG. 20 ). - Prior to the start of step S10, the position of the cleaning
portion 10 is positioned at a separating position where the delivery of the substrate W to thespin chuck 5 is not disturbed. Moreover, the dischargingportion 20 is also positioned at a retreating position where the delivery of the substrate W to thespin chuck 5 is not disturbed, and does not discharge the processing liquid (seeFIGS. 17 and 18 ). - When the previous rinse processing in step S10 is started in this state, the discharging
portion 20 is first positioned at the first position 61 (the discharge starting position) by the movingportion 155. The dischargingportion 20 starts the discharge of theprocessing liquid 51 at the first position 61 (FIGS. 17 , 18 and step S110 inFIG. 19 ), and is moved to the second position 62 (the main discharging position) by the movingportion 155 while carrying out the discharge (FIGS. 17 , 18 and step S120 inFIG. 19 ). Next, the dischargingportion 20 continuously discharges theprocessing liquid 51 at the second position (step S130 ofFIG. 19 ) and the previous rinse processing is carried out. Then, the dischargingportion 20 is moved to the third position 63 (the discharge stopping position) by the movingportion 155 while discharging theprocessing liquid 51, thereby ending the previous rinse processing (FIGS. 17 , 18 and step S140 inFIG. 19 ). Thefirst position 61 and thethird position 63 are equal to each other. Thefirst position 61 and thethird position 63 may be different from each other. The dischargingportion 20 is disposed at the third position 63 (FIGS. 17 and 18 ) and the discharge of theprocessing liquid 51 is stopped at the third position 63 (FIGS. 17 , 18 and step S150 inFIG. 19 ). - When the previous rinse processing is ended, the brush cleaning processing is carried out by the cleaning portion 10 (brush) (step S20 in
FIG. 20 ). In step S20, the cleaningportion 10 is moved to the abutting position on the processing region S3 of the substrate W from the separating position. In the case in which theprocessing liquid 51 is discharged in the brush cleaning, the dischargingportion 20 discharges theprocessing liquid 51 at the first position 61 (the third position 63) (FIG. 17 ). In the brush cleaning, the dischargingportion 20 may start the discharge of theprocessing liquid 51 at thefirst position 61 and may be then moved to thesecond position 62 while discharging theprocessing liquid 51, and may continuously discharge theprocessing liquid 51 at thesecond position 62. In the case in which the brush cleaning processing which is not followed by the discharge of theprocessing liquid 51 is performed, the dischargingportion 20 does not discharge the processing liquid 51 (FIG. 18 ). When the brush cleaning processing is ended, the cleaningportion 10 is moved from the abutting position to the separating position, and the dischargingportion 20 stops the discharge when it is discharging the processing liquid 51 (FIG. 17 ). Consequently, the brush cleaning processing is ended. In the case in which the dischargingportion 20 is moved to thesecond position 62 while discharging theprocessing liquid 51 in the brush cleaning, thereby discharging theprocessing liquid 51 continuously, the dischargingportion 20 is moved from thesecond position 62 to thethird position 63 while discharging theprocessing liquid 51 in the end of the brush cleaning processing, and then ends the discharge of theprocessing liquid 51. - When the brush cleaning processing is ended, the
substrate processing apparatus 100 carries out post rinse processing to be rinse processing after the brush cleaning (step S30 inFIG. 20 ). In the post rinse processing, the processing of steps S110 to S150 inFIG. 19 is carried out in the same manner as the previous rinse processing. Consequently, the post rinse processing is ended. - When the post rinse processing is ended, the discharging
portion 20 is retreated to the retreating position by the moving portion 155 (FIGS. 17 and 18 ). Consequently, the cleaning operation of thesubstrate processing apparatus 100 is ended. In each processing, the operations of the cleaningportion 10, the dischargingportion 20 and the movingportion 155 are controlled by thecontroller 161. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the discharging
portion 20 starts to discharge theprocessing liquid 51 at thefirst position 61 and is moved to thesecond position 61 which is closer to the rotating axis a1 than thefirst position 61 while carrying out the discharge, and continuously performs the discharge at thesecond position 62. Theprocessing liquid 51 is discharged from the dischargingport 21 in the direction of theaxis 23 of thepassage 22 in the dischargingport 21 portion of the dischargingportion 20. For this reason, theprocessing liquid 51 is discharged from the dischargingportion 20 at thefirst position 61 toward thefirst region 71 in the rotating track of the processing region S3 and is discharged from the dischargingportion 20 at thesecond position 62 toward thesecond region 72 of the rotating track. At the start of the discharge, the shape of the liquid column of the dischargedprocessing liquid 51 is more unstable than that in the case in which the discharge is continuously carried out. Therefore, theprocessing liquid 51 discharged toward thefirst region 71 is also discharged to the periphery of thefirst region 71 in some cases. Thefirst region 71 is placed on the peripheral edge E1 side of the substrate W from thesecond region 72. Moreover, the dischargingportion 20 continuously performs the discharging operation during the movement to thesecond position 62 and the discharging operation at thesecond position 62. As compared with the start of the discharge, therefore, theprocessing liquid 51 is discharged in the more stable shape of the liquid column. Accordingly, it is possible to restrain the adhesion of theprocessing liquid 51 to the non-processing region S4 due to the splash of theprocessing liquid 51 in the processing region S3 of the substrate W or the spread of theprocessing liquid 51 in the processing region S3. Moreover, theprocessing liquid 51 is discharged to the substrate W by the dischargingportion 20. For this reason, it is possible to supply the processing liquid in a larger amount as compared with the case in which the processing liquid leaking out of the sponge or the like is supplied to the substrate W. According to the present invention, therefore, it is also possible to process the processing region S3 more reliably. - According to the substrate processing apparatus in accordance with the present preferred embodiment described above, the distance L11 from the peripheral edge E1 of the substrate W to the
center 81 of thefirst region 71 is equal to or greater than the half of the diameter φ of the dischargingport 21. Therefore, theprocessing liquid 51 taking the unstable shape of the liquid column which is started to be discharged toward thefirst region 71 is also prevented from being discharged to the peripheral edge E1 of the substrate W. Accordingly, it is possible to restrain the adhesion of theprocessing liquid 51 to the non-processing region S4 due to the splash at the peripheral edge E1. - According to the substrate processing apparatus in accordance with the present preferred embodiment described above, furthermore, the distance L12 from the
center 81 of thefirst region 71 to thecenter 82 of thesecond region 72 is equal to or greater than the half of the diameter φ of the dischargingport 21. Accordingly, theprocessing liquid 51 taking the unstable shape of the liquid column which is started to be discharged toward thefirst region 71 is prevented from being discharged to the rotating axis a1 side of the substrate W from thesecond region 72. Therefore, it is possible to restrain the adhesion to the non-processing region S4 of theprocessing liquid 51 equivalently or more as compared with the case in which theprocessing liquid 51 is continuously discharged toward thesecond region 72. The adhesion is due to the splash or the spread in the processing region S3 of the substrate W caused by theprocessing liquid 51 started to be discharged toward thefirst region 71. - According to the substrate processing apparatus in accordance with the present preferred embodiment, furthermore, the discharging
portion 20 discharging theprocessing liquid 51 at thesecond position 62 is moved to thethird position 63 on the peripheral edge E1 side of the substrate W from thesecond position 62 while discharging theprocessing liquid 51. When the dischargingportion 20 is moved to thethird position 63, theprocessing liquid 51 is discharged toward thethird region 73 in the rotating track of the processing region S3 in the direction of theaxis 23 of thepassage 22. Then, the dischargingportion 20 stops the discharge of theprocessing liquid 51 at thethird position 63. In both a state in which the dischargingportion 20 continuously carries out the discharging operation at thesecond position 62 and a state in which the dischargingportion 20 is moved from thesecond position 62 to thethird position 63, theprocessing liquid 51 is discharged consecutively. Therefore, the shape of the liquid column of theprocessing liquid 51 can be prevented from being unstable. When the discharge of theprocessing liquid 51 is stopped in a state in which theprocessing liquid 51 is discharged toward thethird region 73, the shape of the liquid column is unstable so that theprocessing liquid 51 is also discharged to the periphery of thethird region 73 in some cases. However, thethird region 73 is placed on the peripheral edge E1 side of the substrate W from thesecond region 72. Accordingly, it is possible to restrain the adhesion of theprocessing liquid 51 to the non-processing region S4 due to the splash or the spread of theprocessing liquid 51 in the processing region S3 of the substrate W. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the distance from the peripheral edge E1 of the substrate W to the center of the
third region 73 is equal to or greater than the half of the diameter φ of the dischargingport 21. Consequently, even if the discharge of theprocessing liquid 51 which is being consecutively discharged toward thethird region 73 is stopped so that the shape of the liquid column is unstable, it is possible to prevent theprocessing liquid 51 from being discharged to the peripheral edge E1. Accordingly, it is possible to restrain the adhesion to the non-processing region S4 due to splash at the peripheral edge E1 of theprocessing liquid 51 which is being consecutively discharged toward thethird region 73 and theprocessing liquid 51 of which discharge is stopped. - In addition, the substrate processing apparatus in accordance with the present preferred embodiment further includes the cleaning
portion 10 for cleaning the processing region S3 in abutment on the processing region S3 of the substrate W which is being rotated by thespin chuck 5. Accordingly, it is possible to scrape off the pollutant of the processing region S3, thereby cleaning the processing region S3 through the cleaningportion 10. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the discharging
portion 20 discharges theprocessing liquid 51 toward the second region (the main discharging region) 72 which is predefined in the semicircular region M1 at the downstream side in the rotating direction of the substrate W with respect to the cleaningportion 10 in the rotating track of the processing region S3. Accordingly, as compared with the case in which theprocessing liquid 51 is discharged to the upstream side in the rotating direction of the substrate W with respect to the cleaningportion 10, for example, theprocessing liquid 51 is removed by the cleaningportion 10 in the processing region S3 so that a range brought into a dry state is reduced. Therefore, the processing region S3 of the upper surface S1 can be cleaned more reliably. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the discharging direction V1 of the
processing liquid 51 is the oblique direction having the component V2 and the component V3. The component V2 is turned toward the downstream side in the rotating direction of the substrate W along thetangential line 91 in the proximity part to thesecond region 72 in the peripheral edge E1 of the substrate W. The component V3 is turned from the central side (the rotating axis a1 side) of the substrate W in the orthogonal direction to thetangential line 91 toward the peripheral edge E1 side. Accordingly, theprocessing liquid 51 discharged to the processing region S3 can be prevented from adhering to the non-processing region S4 due to the splash or the spread up to the non-processing region S4. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the
gas injecting portion 30 generates, on the substrate W, the gas flow turned from the injectingtarget region 201 to the cleaningportion 10 side. Accordingly, the pollutant scraped off by the cleaningportion 10 or the mist of theprocessing liquid 51 generated by the rotation of the cleaningportion 10 or the like can be prevented from scattering to the non-processing region S4 and adhering to the non-processing region S4. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the injecting
port 31 a of thegas injecting portion 30 is slit-shaped and takes the long shape in the circumferential direction of the substrate W which is curved along the proximity part to the cleaningportion 10 including the abutting part on the cleaningportion 10 in the peripheral edge E1 of the substrate W as seen through in the direction of the rotating axis a1 of the substrate W from above. Consequently, as compared with the case in which the perspective image of the injectingport 31 a is long in the direction of thetangential line 92 of the abutting part on the cleaningportion 10 in the peripheral edge E1, the respective distances L3 between the respective parts of the slit-shaped injectingport 31 a and the proximity part can be made substantially equal to each other. Accordingly, thegas 52 can be supplied uniformly to the proximity part. Therefore, it is possible to prevent mist or the like from scattering from the proximity part and adhering to the non-processing region S4 of the upper surface S1 of the substrate W. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the injecting
ports 31 b of thegas injecting portion 30 are arranged apart from each other over the virtual line K1 curved along the proximity part to the cleaningportion 10 including the abutting portion on the cleaningportion 10 in the peripheral edge E1 of the substrate W as seen through in the direction of the rotating axis a1 of the substrate W from above thegas injecting portion 30. Consequently, the respective distances L3 between the injectingports 31 b and the proximity part can be made substantially equal to each other as compared with the case in which the respective perspective images of the injectingports 31 b are arranged in the direction of thetangential line 92 in the abutting part on the cleaningportion 10 in the peripheral edge E1 of the substrate W. Accordingly, thegas 52 can be supplied uniformly to the proximity part. Therefore, it is possible to prevent mist or the like from scattering from the proximity part and adhering to the non-processing region S4 of the upper surface S1. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the injecting
port 31 c of thegas injecting portion 30 is slit-shaped and takes the long shape in the circumferential direction of the cleaningportion 10 which is curved along the opposed part to the peripheral edge E1 of the substrate W in the outer peripheral surface of the cleaningportion 10 as seen through in the direction of the rotating axis a1 from above thegas injecting portion 30. Consequently, the respective distances L5 between the respective parts of the slit-shaped injectingport 31 c and the opposed part in the outer peripheral surface of the cleaningportion 10 can be made substantially equal to each other as compared with the case in which the perspective images of the injectingport 31 c are long in the direction of thetangential line 92 in the abutting part on the cleaningportion 10 in the peripheral edge E1 of the substrate W. Accordingly, thegas 52 can be supplied uniformly to the contact position of the cleaningportion 10 with the substrate W from the periphery of the cleaningportion 10. Therefore, it is possible to prevent mist or the like from scattering from the cleaningportion 10 and adhering to the non-processing region S4 of the upper surface S1. - According to the substrate processing apparatus in accordance with the present preferred embodiment, the injecting
ports 31 d of thegas injecting portion 30 are arranged apart from each other over the virtual line K2 curved along the opposed part to the peripheral edge E1 of the substrate W in the outer peripheral surface of the cleaningportion 10 as seen through in the direction of the rotating axis a1 from above thegas injecting portion 30. Consequently, the respective distances L5 between the injectingports 31 d and the opposed portion can be made substantially equal to each other as compared with the case in which the respective perspective images of the injectingports 31 d are arranged in the direction of thetangential line 92 in the abutting part on the cleaningportion 10 in the peripheral edge E1. Accordingly, thegas 52 can be supplied uniformly to the contact position of the cleaningportion 10 with the substrate W from the periphery of the cleaningportion 10. Therefore, the mist or the like generated from the cleaningportion 10 can be prevented from scattering to the non-processing region S4 of the upper surface S1. - According to the substrate processing method in accordance with the present preferred embodiment, furthermore, the discharging
portion 20 at thefirst position 61 is caused to start the discharge of theprocessing liquid 51 toward thefirst region 71 in the rotating track of the processing region S3 of the substrate W which is being rotated, and consecutively, is caused to continuously discharge theprocessing liquid 51, and at the same time, is moved to thesecond position 62 where theprocessing liquid 51 can be discharged toward thesecond region 72 in the rotating track. In addition, the dischargingportion 20 is subsequently caused to continuously discharge theprocessing liquid 51 toward thesecond region 72 at thesecond position 62. At the start of the discharge, the shape of the liquid column of the dischargedprocessing liquid 51 is more unstable as compared with the case in which the discharge is continuously carried out. For this reason, theprocessing liquid 51 discharged toward thefirst region 71 is also discharged to the periphery of thefirst region 71 in some cases. Thefirst region 71 is placed on the peripheral edge E1 side of the substrate W from thesecond region 72. During the movement to thesecond position 62 and the discharging operation at thesecond position 62, the dischargingportion 20 continuously carries out the discharging operation. Therefore, theprocessing liquid 51 can be discharged in the more stable shape of the liquid column as compared with that at the start of the discharge. Accordingly, it is possible to prevent the adhesion of the processing liquid to the non-processing region S4 due to the splash of theprocessing liquid 51 in the processing region S3 of the substrate W or the spread of theprocessing liquid 51 in the processing region S3. - While the invention has been shown and described in detail, the foregoing description is in all aspects illustrative and not restrictive. It is therefore understood that numerous modifications and variations can be devised without departing from the scope of the invention.
Claims (19)
1. A substrate processing apparatus for processing a peripheral edge part of a substrate, comprising:
a substrate rotating mechanism for holding and rotating a substrate;
a discharging portion for discharging a processing liquid to an upper surface peripheral edge part in an upper surface of said substrate which is being rotated by said substrate rotating mechanism;
a moving portion for moving said discharging portion; and
a controller for controlling each of operations of said discharging portion and said moving portion,
said discharging portion including a discharging port for discharging said processing liquid and a passage for supplying said processing liquid to said discharging port in communication with said discharging port,
wherein said controller controls said discharging portion and said moving portion in such a manner that said discharging portion starts to discharge said processing liquid at a first position above said substrate and is moved to a second position which is closer to a rotating axis of said substrate than said first position while discharging said processing liquid, and continuously discharges said processing liquid at said second position,
said first position is a position of said discharging portion where a section of said passage in a discharging port part of said discharging portion is projected onto a first region in a rotating track of said upper surface peripheral edge part in an axial direction of said passage in said discharging port part,
said second position is a position of said discharging portion where said section of said passage is projected onto a second region in said rotating track in said axial direction of said passage; and
said first region is a region on a peripheral edge side of said substrate from said second region.
2. The substrate processing apparatus according to claim 1 , wherein a distance from a peripheral edge of said substrate to a center of said first region is equal to or greater than a half of a diameter of said discharging port.
3. The substrate processing apparatus according to claim 1 , wherein a distance from a center of said first region to a center of said second region is equal to or greater than a half of a diameter of said discharging port.
4. The substrate processing apparatus according to claim 1 , wherein said controller further controls said discharging portion and said moving portion in such a manner that said discharging portion discharging said processing liquid at said second position is moved to a third position which is more distant from a rotating axis of said substrate than said second position while discharging said processing liquid and stops the discharge of said processing liquid at said third position,
said third position is a position of said discharging portion where said section of said passage is projected onto a third region in said rotating track in said axial direction of said passage, and
said third region is a region on an peripheral edge side of said substrate from said second region.
5. The substrate processing apparatus according to claim 1 , wherein a distance from a peripheral edge of said substrate to a center of said third region is equal to or greater than a half of a diameter of said discharging port.
6. The substrate processing apparatus according to claim 1 , further comprising:
a cleaning portion for abutting on said upper surface peripheral edge part of said substrate which is being rotated by said substrate rotating mechanism, thereby cleaning said upper surface peripheral edge part.
7. A substrate processing apparatus for processing a peripheral edge part of a substrate, comprising:
a substrate rotating mechanism for holding and rotating a substrate;
a discharging portion for discharging a processing liquid to an upper surface peripheral edge part in an upper surface of said substrate which is being rotated by said substrate rotating mechanism; and
a cleaning portion for abutting on said upper surface peripheral edge part of said substrate which is being rotated by said substrate rotating mechanism, thereby cleaning said upper surface peripheral edge part,
said discharging portion discharging said processing liquid toward a main discharging region which is predefined in a semicircular region at a downstream side in a rotating direction of said substrate with respect to said cleaning portion, said semicircular region being a part of a rotating track of said upper surface peripheral edge part.
8. The substrate processing apparatus according to claim 7 , wherein a discharging direction in discharge of said processing liquid by said discharging portion is an oblique direction having a component turned toward a downstream side in a rotating direction of said substrate along a tangential line in a proximity part to said main discharging region in a peripheral edge of said substrate as seen in a rotating axis direction of said substrate from above said discharging portion and a component turned from a central side of said substrate toward a peripheral edge side in an orthogonal direction to said tangential line.
9. The substrate processing apparatus according to claim 7 , further comprising:
a gas injecting portion provided above a part between said cleaning portion and a rotating axis of said substrate in said upper surface of said substrate,
said gas injecting portion injecting a gas from above said substrate toward an injecting target region which is predefined on said upper surface of said substrate, thereby generating, on said substrate, a gas flow turned from said injecting target region toward said cleaning portion side.
10. The substrate processing apparatus according to claim 9 , wherein said gas injecting portion further comprises:
an injecting port for injecting said gas to said injecting target region,
said injecting port being a slit-shaped injecting port which is curved along a proximity part to said cleaning portion including an abutting part on said cleaning portion in a peripheral edge of said substrate and takes a long shape in a circumferential direction of said substrate as seen through in a rotating axis direction of said substrate from above said gas injecting portion.
11. The substrate processing apparatus according to claim 9 , wherein said gas injecting portion further comprises:
a plurality of injecting ports for injecting said gas to said injecting target region,
said plurality of injecting ports being arranged apart from each other on a virtual line which is curved along a proximity part to said cleaning portion including an abutting part on said cleaning portion in a peripheral edge of said substrate as seen through in a rotating axis direction of said substrate from above said gas injecting portion.
12. The substrate processing apparatus according to claim 9 , wherein said gas injecting portion further comprises:
an injecting port for injecting said gas to said injecting target region,
said injecting port being a slit-shaped injecting port which is curved along an opposed part to said peripheral edge of said substrate in an outer peripheral surface of said cleaning portion and takes a long shape in a circumferential direction of said cleaning portion as seen through in a rotating axis direction of said substrate from above said gas injecting portion.
13. The substrate processing apparatus according to claim 9 , wherein said gas injecting portion further comprises:
a plurality of injecting ports for injecting said gas to said injecting target region,
said plurality of injecting ports being arranged apart from each other on a virtual line which is curved along an opposed part to said peripheral edge of said substrate in an outer peripheral surface of said cleaning portion as seen through in a rotating axis direction of said substrate from above said gas injecting portion.
14. A substrate processing method of processing a peripheral edge part of a substrate, comprising:
a substrate rotating step of holding and rotating a substrate; and
a discharging step of discharging a processing liquid to an upper surface peripheral edge part in an upper surface of said substrate by a discharging portion including a discharging port capable of discharging the processing liquid simultaneously with the substrate rotating step;
said discharging step including:
a first step of causing said discharging portion to start discharge of said processing liquid toward a first region in a rotating track in said upper surface peripheral edge part at a first position where said discharging portion can discharge said processing liquid toward said first region;
a second step of moving said discharging portion discharging said processing liquid toward said first region at said first position to a second position where said processing liquid can be discharged toward a second region in said rotating track while causing said discharging portion to continuously discharge said processing liquid; and
a third step of causing said discharging portion to continuously discharge said processing liquid toward said second region at said second position,
said first region being a region on a peripheral edge side of said substrate from said second region.
15. The substrate processing method according to claim 14 , wherein a distance from a peripheral edge of said substrate to a center of said first region is equal to or greater than a half of a diameter of said discharging port.
16. The substrate processing method according to claim 14 , wherein a distance from a center of said first region to a center of said second region is equal to or greater than a half of a diameter of said discharging port.
17. The substrate processing method according to claim 14 , wherein said discharging step comprises:
a fourth step of moving said discharging portion to a third position while causing said discharging portion discharging said processing liquid toward said second region at said second position to continuously discharge said processing liquid subsequently to said third step; and
a fifth step of causing said discharging portion to stop said discharge of said processing liquid at said third position,
said third position being a position where said discharging portion can discharge said processing liquid toward a third region in said rotating track, and
said third region being a region on a peripheral edge side of said substrate from said second region.
18. The substrate processing method according to claim 14 , wherein a distance from a peripheral edge of said substrate to a center of said third region is equal to or greater than a half of a diameter of said discharging port.
19. The substrate processing method according to claim 14 , further comprising:
a cleaning step of cleaning said upper surface peripheral edge part by a cleaning portion simultaneously with at least said substrate rotating step in said substrate rotating step and said discharging step,
said cleaning portion being capable of abutting on said upper surface peripheral edge part of said substrate to which said discharging portion discharges said processing liquid, thereby cleaning said upper surface peripheral edge part.
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US15/905,067 US10835932B2 (en) | 2013-12-03 | 2018-02-26 | Substrate processing apparatus and substrate processing method |
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JP2013-249735 | 2013-12-03 | ||
JP2013249734A JP6298277B2 (en) | 2013-12-03 | 2013-12-03 | Substrate processing equipment |
JP2013249735A JP6211910B2 (en) | 2013-12-03 | 2013-12-03 | Substrate processing apparatus and substrate processing method |
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US15/905,067 Active 2035-08-16 US10835932B2 (en) | 2013-12-03 | 2018-02-26 | Substrate processing apparatus and substrate processing method |
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JP2017005030A (en) * | 2015-06-05 | 2017-01-05 | 東京エレクトロン株式会社 | Substrate processing method, substrate processing apparatus, and storage medium |
CN107785293A (en) * | 2016-08-25 | 2018-03-09 | 株式会社斯库林集团 | Peripheral part processing unit and peripheral part processing method |
CN108364886A (en) * | 2017-01-26 | 2018-08-03 | 东京毅力科创株式会社 | Coated film removal device, coated film minimizing technology and storage medium |
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JP7024307B2 (en) * | 2017-01-26 | 2022-02-24 | 東京エレクトロン株式会社 | Coating film removing device, coating film removing method and storage medium |
JP6842952B2 (en) * | 2017-02-28 | 2021-03-17 | 株式会社Screenホールディングス | Substrate processing equipment and substrate processing method |
KR20200094449A (en) | 2019-01-30 | 2020-08-07 | 메이크솔루션 주식회사 | Method and system for guiding exercise for pregnant woman |
TW202120198A (en) * | 2019-08-13 | 2021-06-01 | 日商東京威力科創股份有限公司 | Substrate processing apparatus, nozzle inspection method, and storage medium |
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Also Published As
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KR101673061B1 (en) | 2016-11-04 |
KR20150064685A (en) | 2015-06-11 |
TWI524400B (en) | 2016-03-01 |
TW201535490A (en) | 2015-09-16 |
US10835932B2 (en) | 2020-11-17 |
US20180185885A1 (en) | 2018-07-05 |
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