US20140355387A1 - Ultrasonic receiver with coated piezoelectric layer - Google Patents

Ultrasonic receiver with coated piezoelectric layer Download PDF

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Publication number
US20140355387A1
US20140355387A1 US14/175,876 US201414175876A US2014355387A1 US 20140355387 A1 US20140355387 A1 US 20140355387A1 US 201414175876 A US201414175876 A US 201414175876A US 2014355387 A1 US2014355387 A1 US 2014355387A1
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United States
Prior art keywords
pixel
array
ultrasonic
polymer
piezoelectric layer
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Abandoned
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US14/175,876
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English (en)
Inventor
II Jack Conway Kitchens
John Keith Schneider
Stephen Michael Gojevic
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Qualcomm Inc
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Qualcomm Inc
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Publication date
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Priority to US14/175,876 priority Critical patent/US20140355387A1/en
Assigned to QUALCOMM INCORPORATED reassignment QUALCOMM INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KITCHENS, JACK CONWAY, II, GOJEVIC, STEPHEN MICHAEL, SCHNEIDER, JOHN KEITH
Priority to EP14736093.7A priority patent/EP3005229A1/en
Priority to PCT/US2014/039985 priority patent/WO2014197274A1/en
Priority to JP2016516812A priority patent/JP2016526165A/ja
Priority to BR112015030409-5A priority patent/BR112015030409B1/pt
Priority to KR1020157037151A priority patent/KR102220830B1/ko
Priority to CN201480031627.1A priority patent/CN105264545B/zh
Publication of US20140355387A1 publication Critical patent/US20140355387A1/en
Priority to US15/925,636 priority patent/US10341782B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/117—Identification of persons
    • A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
    • A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing

Definitions

  • This disclosure relates generally to an ultrasonic receiver.
  • an ultrasonic transmitter may be used to send an ultrasonic wave through an ultrasonically transmissive medium or media and towards an object to be detected.
  • the transmitter may be operatively coupled with an ultrasonic sensor configured to detect portions of the ultrasonic wave that are reflected from the object.
  • an ultrasonic pulse may be produced by starting and stopping the transmitter during a very short interval of time. At each material interface encountered by the ultrasonic pulse, a portion of the ultrasonic pulse is reflected.
  • the ultrasonic wave may travel through a platen on which a person's finger may be placed to obtain a fingerprint image. After passing through the platen, some portions of the ultrasonic wave encounter skin that is in contact with the platen, e.g., fingerprint ridges, while other portions of the ultrasonic wave encounter air, e.g., valleys between adjacent ridges of a fingerprint, and may be reflected with different intensities back towards the ultrasonic sensor.
  • the reflected signals associated with the finger may be processed and converted to a digital value representing the signal strength of the reflected signal.
  • the digital values of such signals may be used to produce a graphical display of the signal strength over the distributed area, for example by converting the digital values to an image, thereby producing an image of the fingerprint.
  • an ultrasonic sensor system may be used as a fingerprint imager or other type of biometric scanner.
  • the detected signal strength may be mapped into a contour map of the finger that is representative of the depth of the ridge structure detail.
  • the ultrasonic receiver includes an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit.
  • the ultrasonic receiver is fabricated by forming a piezoelectric layer so as to be in electrical contact with the pixel input electrodes. Forming the piezoelectric layer includes coating a solution containing a polymer onto the array of pixel circuits, crystallizing the polymer to form a crystallized polymer layer and poling the crystallized polymer layer.
  • the pixel input electrode may be formed from a conductive film.
  • forming the piezoelectric layer may include coating an adhesion promoter onto the array of pixel circuits.
  • coating the solution containing the polymer may be performed by spin coating, slot coating, dipping, dispensing, spraying, or another coating process.
  • the polymer may include a ferroelectric polymer.
  • the polymer may have a characteristic Curie temperature and a melting point, and crystallizing the polymer may include baking the polymer at a temperature between the Curie temperature and the melting point for at least one hour.
  • a conductive material may be applied to electrically short terminals of the pixel circuits to ground prior to the poling.
  • the conductive material may be a conductive rubber or a conductive ink.
  • the apparatus may include a receiver bias electrode deposited on the piezoelectric layer.
  • the receiver bias electrode may include a first sublayer of copper and a second sublayer of nickel.
  • the first sublayer may be about 150 angstroms thick and the second sublayer of nickel may be about 850 angstroms thick.
  • a method for fabricating an ultrasonic receiver configured to detect ultrasonic energy received at a first surface of the ultrasonic receiver includes forming a piezoelectric layer so as to be in electrical contact with pixel input electrodes, where the ultrasonic receiver includes an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit.
  • Forming the piezoelectric layer includes coating a solution containing a polymer onto the array of pixel circuits, crystallizing the polymer to form a crystallized polymer layer and poling the crystallized polymer layer. Poling may include applying an electric field with a field strength between 150 and 200 volts per micron through the polymer layer.
  • an apparatus includes an ultrasonic transmitter, a platen and an ultrasonic receiver disposed between the ultrasonic transmitter and the platen, the ultrasonic receiver including an array of pixel circuits disposed on a substrate, each pixel circuit in the array including a thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit, the ultrasonic receiver being configured to detect ultrasonic energy reflected from an object in contact with the platen, the reflected ultrasonic energy resulting from interaction of ultrasonic energy emitted by the ultrasonic transmitter and the object, the ultrasonic receiver including a piezoelectric layer disposed between the array of pixel circuits and the platen. The piezoelectric layer is in electrical contact with the pixel input electrodes.
  • the piezoelectric layer is formed by: coating a solution containing a polymer onto the array of pixel circuits, crystallizing the polymer to form a crystallized polymer layer, and poling the crystallized polymer coating.
  • an apparatus in an implementation, includes an ultrasonic receiver for detecting ultrasonic energy received at a first surface of the ultrasonic sensor.
  • the ultrasonic sensor includes an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit, and a piezoelectric layer in electrical contact with the pixel input electrodes.
  • the piezoelectric layer includes a poled crystallized polymer layer.
  • FIGS. 1A-1C show an example of a schematic diagram of an ultrasonic sensor system.
  • FIG. 2 shows an example of an exploded view of an ultrasonic sensor system.
  • FIG. 3A shows an example of a 4 ⁇ 4 pixel array of pixels for an ultrasonic sensor.
  • FIG. 3B shows an example of a high-level block diagram of an ultrasonic sensor system.
  • FIG. 4 shows several views of an example of an ultrasonic sensor system according to an implementation.
  • FIG. 5 shows an example of a process flow for fabricating an ultrasonic receiver, according to an implementation.
  • FIG. 7 illustrates an example implementation of a coating and crystallization process.
  • FIG. 8 illustrates an example implementation of a poling process.
  • FIG. 9 illustrates an example implementation of a metallization process.
  • the described implementations may be included in or associated with a variety of electronic devices such as, but not limited to: mobile telephones, multimedia Internet enabled cellular telephones, mobile television receivers, wireless devices, smartphones, Bluetooth® devices, personal data assistants (PDAs), wireless electronic mail receivers, hand-held or portable computers, netbooks, notebooks, smartbooks, tablets, printers, copiers, scanners, facsimile devices, global positioning system (GPS) receivers/navigators, cameras, digital media players (such as MP3 players), camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, electronic reading devices (e.g., e-readers), computer monitors, auto displays (including odometer and speedometer displays, etc.), cockpit controls and/or displays, camera view displays (such as the display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, microwaves, refrigerators, stereo systems, cassette recorders or players, DVD players
  • PDAs personal data assistant
  • a thin film transistor (TFT) substrate having addressable sensing elements is coated with a piezoelectric film, to create an area array ultrasonic sensor. More particularly, a piezoelectric layer is formed so as to be in electrical contact with elements of the TFT substrate. Particular techniques are described for forming the piezoelectric layer so as to avoid damage to sensitive elements of the TFT substrate.
  • TFT thin film transistor
  • FIGS. 1A-1C show an example of a schematic diagram of an ultrasonic sensor system.
  • ultrasonic sensor system 10 includes an ultrasonic transmitter 20 and an ultrasonic receiver 30 under a platen 40 .
  • the ultrasonic transmitter 20 may be a piezoelectric transmitter that can generate ultrasonic waves 21 (see FIG. 1B ).
  • the ultrasonic receiver 30 includes a piezoelectric material and an array of pixel circuits disposed on a substrate. In operation, the ultrasonic transmitter 20 generates an ultrasonic wave 21 that travels through the ultrasonic receiver 30 to the exposed surface 42 of the platen 40 .
  • the ultrasonic energy may either be absorbed or scattered by an object 25 that is in contact with the platen 40 , such as the skin of a fingerprint ridge 28 , or reflected back.
  • an object 25 that is in contact with the platen 40 , such as the skin of a fingerprint ridge 28
  • Control electronics 50 may be coupled to the ultrasonic transmitter 20 and ultrasonic receiver 30 and may supply timing signals that cause the ultrasonic transmitter 20 to generate one or more ultrasonic waves 21 .
  • the first and second transmitter electrodes 24 and 26 may be metallized electrodes, for example, metal layers that coat opposing sides of the piezoelectric transmitter layer 22 .
  • a receiver bias electrode 39 is disposed on a side of the piezoelectric receiver layer 36 proximal to platen 40 .
  • the receiver bias electrode 39 may be a metallized electrode and may be grounded or biased to control which signals are passed to the TFT array.
  • Ultrasonic energy that is reflected from the exposed (top) surface of the platen 40 is converted into localized electrical charges by the piezoelectric receiver layer 36 .
  • These localized charges are collected by the pixel input electrodes 38 and are passed on to the underlying pixel circuits 32 .
  • the charges are amplified by the pixel circuits 32 and then provided to the control electronics, which processes the amplified signals.
  • a simplified schematic of an example pixel circuit 32 is shown in FIG. 3A , however one of ordinary skill in the art will appreciate that many variations of and modifications to the example pixel circuit 32 shown in the simplified schematic may be contemplated.
  • Control electronics 50 may be electrically connected with the first transmitter electrode 24 and the second transmitter electrode 26 , as well as with the receiver bias electrode 39 and the pixel circuits 32 on the substrate 34 .
  • the control electronics 50 may operate substantially as discussed previously with respect to FIGS. 1A-1C .
  • the platen 40 can be any appropriate material that can be acoustically coupled to the receiver, with examples including plastic, ceramic and glass.
  • the platen 40 can be a cover plate, e.g., a cover glass or a lens glass for a display. Detection and imaging can be performed through relatively thick platens if desired, e.g., 3 mm and above.
  • piezoelectric materials examples include piezoelectric polymers having appropriate acoustic properties, for example, an acoustic impedance between about 2.5 MRayls and 5 MRayls.
  • piezoelectric materials that may be employed include ferroelectric polymers such as polyvinylidene fluoride (PVDF) and polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE) copolymers.
  • PVDF copolymers examples include 60:40 (molar percent) PVDF-TrFE, 70:30 PVDF-TrFE, 80:20 PVDF-TrFE, and 90:10 PVDR-TrFE.
  • each of the piezoelectric transmitter layer 22 and the piezoelectric receiver layer 36 may be selected so as to be suitable for generating and receiving ultrasonic waves.
  • a PVDF piezoelectric transmitter layer 22 is approximately 28 ⁇ m thick and a PVDF-TrFE receiver layer 36 is approximately 12 ⁇ m thick.
  • Example frequencies of the ultrasonic waves are in the range of 5 MHz to 30 MHz, with wavelengths on the order of a quarter of a millimeter or less.
  • FIGS. 1A through 1C and 2 show example arrangements of ultrasonic transmitters and receivers in an ultrasonic sensor system, with other arrangements possible.
  • the ultrasonic transmitter 20 may be above the ultrasonic receiver 30 , i.e., closer to the object of detection.
  • the ultrasonic sensor system may include an acoustic delay layer.
  • an acoustic delay layer can be incorporated into the ultrasonic sensor system 10 between the ultrasonic transmitter 20 and the ultrasonic receiver 30 .
  • An acoustic delay layer can be employed to adjust the ultrasonic pulse timing, and at the same time electrically insulate the ultrasonic receiver 30 from the ultrasonic transmitter 20 .
  • the delay layer may have a substantially uniform thickness, with the material used for the delay layer and/or the thickness of the delay layer selected to provide a desired delay in the time for reflected ultrasonic energy to reach the ultrasonic receiver 30 . In doing so, the range of time during which an energy pulse that carries information about the object by virtue of having been reflected by the object may be made to arrive at the ultrasonic receiver 30 during a time range when it is unlikely that energy reflected from other parts of the ultrasonic sensor system 10 is arriving at the ultrasonic receiver 30 .
  • the TFT substrate 34 and/or the platen 40 may serve as an acoustic delay layer.
  • FIG. 3A depicts a 4 ⁇ 4 pixel array of pixels for an ultrasonic receiver.
  • Each pixel may, for example, be associated with a local region of piezoelectric sensor material, a peak detection diode and a readout transistor; many or all of these elements may be formed on or in the backplane to form the pixel circuit.
  • the local region of piezoelectric sensor material of each pixel may transduce received ultrasonic energy into electrical charges.
  • the peak detection diode may register the maximum amount of charge detected by the local region of piezoelectric sensor material.
  • Each row of the pixel array may then be scanned, e.g., through a row select mechanism, a gate driver, or a shift register, and the readout transistor for each column may be triggered to allow the magnitude of the peak charge for each pixel to be read by additional circuitry, e.g., a multiplexer and an A/D converter.
  • the pixel circuit may include one or more TFTs to allow gating, addressing, and resetting of the pixel.
  • Each pixel circuit 32 may provide information about a small portion of the object detected by the ultrasonic sensor system 10 . While, for convenience of illustration, the example shown in FIG. 3A is of a relatively coarse resolution, ultrasonic sensor systems having a resolution on the order of 500 pixels per inch or higher that are configured with a layered structure substantially similar to that shown in FIG. 2 have been demonstrated by the present inventors.
  • the detection area of the ultrasonic sensor system 10 may be selected depending on the intended object of detection. For example, the detection area may range from 5 mm ⁇ 5 mm for a single finger to 3 inches ⁇ 3 inches for four fingers. Smaller and larger areas may be used as appropriate for the object.
  • FIG. 3B shows an example of a high-level block diagram of an ultrasonic sensor system. Many of the elements shown may form part of control electronics 50 (see FIG. 2 ).
  • a sensor controller may include a control unit that is configured to control various aspects of the sensor system, e.g., ultrasonic transmitter timing and excitation waveforms, bias voltages for the ultrasonic receiver and pixel circuitry, pixel addressing, signal filtering and conversion, readout frame rates, and so forth.
  • the sensor controller may also include a data processor that receives data from the ultrasonic sensor circuit pixel array. The data processor may translate the digitized data into image data of a fingerprint or format the data for further processing.
  • the digitized data is translated into image data of one or more objects other than a finger or for purposes other than obtaining a fingerprint.
  • image data of one or more objects other than a finger For example, an image of a palm, an ear, a face, an inanimate object, or one or more other objects may be obtained and/or processed.
  • control unit may send a transmitter (Tx) excitation signal to a Tx driver at regular intervals to cause the Tx driver to excite the ultrasonic transmitter and produce planar ultrasonic waves.
  • the control unit may send level select input signals through a receiver (Rx) bias driver to bias the receiver bias electrode and allow gating of acoustic signal detection by the pixel circuitry.
  • a demultiplexer may be used to turn on and off gate drivers that cause a particular row or column of sensor pixel circuits to provide output signals.
  • Output signals from the pixels may be sent through a charge amplifier, a filter such as an RC filter or an anti-aliasing filter, and a digitizer to the data processor. Note that portions of the system may be included on the TFT backplane and other portions may be included in an associated integrated circuit.
  • FIG. 4 shows several views of an example of an ultrasonic receiver, according to an implementation.
  • Ultrasonic receiver 430 may be configured to detect ultrasonic energy received at a proximal (input) surface of the receiver.
  • the receiver 430 may include an array of pixel circuits 432 disposed on a substrate 434 .
  • the receiver 430 has a rectangular form factor; in other implementations, square or ovoid form factors may be contemplated.
  • the array of pixels may be configured as a 1500 ⁇ 1600 pixel array, and corresponding lateral dimensions of the sensor may be approximately 3.0 ⁇ 3.2 inches.
  • the array of pixel circuits 432 may be disposed on a top surface of substrate 434 .
  • Each pixel circuit 432 may include one or more TFT elements and may include a pixel input electrode 438 in electrical contact with an input to the pixel circuit 432 .
  • the pixel input electrode 438 may include a transparent conductive film made, for example, of indium tin oxide (ITO) or indium zinc oxide (IZO).
  • the ultrasonic receiver 430 may be fabricated by forming a piezoelectric layer 436 over the array of pixel circuits 432 and the top surface of the substrate 434 .
  • the piezoelectric layer 436 may be formed by coating a solution containing a copolymer onto the pixel circuits 432 , crystallizing the copolymer to form a crystallized copolymer layer, and poling the resulting crystallized copolymer layer to form the piezoelectric layer 436 .
  • a receiver bias electrode such as a conductive layer that is deposited or otherwise affixed onto a top surface 401 of piezoelectric layer 436 , as well as details of pixel circuits 432 , have been omitted.
  • FIG. 5 shows an example of a process flow for fabricating an ultrasonic receiver, according to an implementation.
  • Process 500 may begin at block 501 with coating a solution containing a copolymer onto an array of pixel circuits, for example pixel circuit array 432 .
  • the coating may be applied by spin coating, slot coating, dipping, dispensing, spraying, or any other suitable coating process.
  • a coating process may include or be preceded by application of an adhesion promoter to the array of pixel circuits.
  • the coating process may include or be followed by a drying process.
  • the coating process may include coating a solution containing a copolymer onto the TFT backplane.
  • the copolymer may be crystallized.
  • a crystallization process may include a baking procedure.
  • the pixel circuit array 432 and substrate 438 after being coated with the copolymer, are raised to a temperature above the Curie temperature of the copolymer, but below the melting point of the copolymer.
  • a copolymer is held at such a temperature for a sufficient length of time, crystallization of the copolymer will result.
  • the crystallized copolymer may be poled so as to form the piezoelectric layer.
  • a poling process may include applying a strong electric field across the material so as to align dipoles of the copolymer in a desired orientation.
  • a desired strength of the electric field may vary with the thickness of the crystallized copolymer coating. For example, in some implementations, an electric field strength of approximately 150-200 volts per micron of coating thickness has been found to be effective in forming a piezoelectric layer.
  • a surface of the piezoelectric layer may be metallized so as to form a receiver bias electrode.
  • the receiver bias electrode may include a metallized layer such as a first sublayer of copper upon which a second sublayer of nickel is deposited.
  • a layer of silver ink may be disposed on the surface of the piezoelectric layer.
  • FIG. 6 illustrates an example implementation of an adhesion promoter application process that may precede or be included in the process 501 for coating a copolymer onto a pixel circuit array and substrate.
  • Adhesion promoter application process 600 may be advisable taking into account that fluorinated compounds such as many of the copolymers contemplated by the present disclosure have very poor adhesive characteristics.
  • An assembly 601 including a pixel circuit array and a substrate, may enter the process 600 by way of baking operation 602 .
  • Baking operation 602 may be performed to help ensure that there are no oils or moisture left from prior processing that may impede good results in coating operation 605 .
  • Baking operation 602 may be performed under a partial or substantially total vacuum.
  • a coating operation 605 may be performed. Coating operation 605 may result in application of an adhesion promoter 603 to selected surfaces of assembly 601 .
  • the adhesion promoter 603 may be a solution of silane or hexamethyldisilazane (HMDS) in methanol 604 .
  • HMDS hexamethyldisilazane
  • a 0.25% solution of HMDS has been found to be effective in increasing a bond strength between surfaces of assembly 601 and the copolymer.
  • the adhesion promoter 603 may be applied by spin coating or other means.
  • process 600 may continue with a drying operation 606 to evaporate the methanol 604 and otherwise prepare assembly 601 for subsequent processes.
  • water is a curing agent for the adhesion promoter, and the drying operation may be performed in a humid environment, for example at a relative humidity above 60%.
  • FIG. 7 illustrates an example implementation of a coating and crystallization process.
  • Process 700 may be performed in connection with or instead of coating process 501 and crystallization process 502 , for example.
  • a copolymer layer is applied to assembly 601 .
  • the copolymer may include PVDF-TrFE at a molar percent ratio of about 80-20, 70-30 or 90-10.
  • a measurement of the thickness of the copolymer coating may be performed.
  • a thickness of a sublayer deposited by coating operation 701 may be 3-4 ⁇ m for example, whereas a total coating thickness of about 10-12 ⁇ m may be desired.
  • crystallization process 700 contemplates that a determination made at decision block 702 will result in repeating coating operation 701 one or more times.
  • a partial crystallization operation 703 may be performed.
  • the partial crystallization operation 703 may include raising the temperature of assembly 601 to a temperature above the Curie temperature of the copolymer, but below the melting point of the copolymer. In some implementations, the Curie temperature of the copolymer may be 135° C.
  • assembly 601 may be held at a temperature of 135° C. for a period of time sufficient to achieve partial, but not complete, crystallization.
  • the partial crystallization causes a preceding sublayer deposited by coating operation 701 to be relatively insoluble during a subsequent coating operation 701 .
  • a sufficient period of time for partial crystallization will depend, inter alia, on the composition of the copolymer. In some implementations, for a molar percent ratio of 70-30, for example, thirty minutes has been found to be sufficient, whereas for a molar percent ratio of 80-20, one hour may be preferable.
  • process 700 may proceed to block 704 and finish crystallization of the copolymer by raising the temperature of assembly 601 to a temperature above the Curie temperature of the copolymer, but below the melting point of the copolymer for a period of time sufficient to allow crystallization to reach a point at which the copolymer is capable of becoming a piezoelectric material.
  • Operation 704 may complete the transformation of the copolymer from an amorphous material to a crystalline material that was initiated at block 703 . Details of operation 704 may depend upon the exact copolymer used (molar ratio of PVDF to TrFE, for example). For the 70-30 copolymer, 135 C for 3 hours has been found to be effective, whereas for the 80-20 copolymer 135 C for 12 hours has been found to be effective.
  • operation 704 results in achieving a crystallization state such that the average crystal size is greater than a dipole domain length and less than a size that will not be able to orient in an electric field.
  • the optimum time and temperature conditions may be determined in a laboratory using, for example, differential scanning calorimetry to plot phase changes versus time for a constantly increasing (or decreasing) temperature.
  • FIG. 8 illustrates an example implementation of a poling process 800 that may be applied to the copolymer so as to form a piezoelectric layer.
  • Process 800 may be performed in connection with or instead of process 503 , for example.
  • a poling process may include applying a strong electric field across the material so as to align dipoles of the copolymer in a desired orientation.
  • poling process 800 may include precautions that protect the voltage-sensitive components.
  • a conductive material 801 may be applied to electrically short input and output terminals of the pixel circuits to ground.
  • Conductive material 801 may be a conductive rubber or silver ink compound, for example.
  • the conductive material may be approximately coplanar with and extend circumferentially around pixel circuit array 432 .
  • a guard ring and/or a shorting bar of conductive rubber or silver ink may be provided.
  • a poling operation is executed.
  • a field strength of approximately 150-200 volts per micron of coating thickness is applied in a dry partial vacuum with an array of needles and a copper grid.
  • the guard ring and/or shorting bar may be removed.
  • the silver ink compound may be removed by application of a reagent such as isopropyl alcohol or other reagent in which the silver ink is soluble.
  • the guard ring is removed during a dicing process, for example by cutting the ring off when cutting the TFT glass.
  • FIG. 9 illustrates an example implementation of a metallization process 900 that may be applied to the piezoelectric layer so as to form the receiver bias electrode.
  • Process 900 may be performed in connection with or instead of process 504 , for example.
  • a masking operation may be executed to prevent metallization from occurring in undesired areas.
  • an active area of the piezoelectric layer may be metallized at block 903 by depositing a sputtered metal 902 through a shadow mask, which occludes portions of the pixel circuit array and/or the substrate to avoid depositing metal on the occluded portions.
  • the resulting receiver bias electrode may include a first sublayer of copper, upon which a second sublayer of nickel is deposited.
  • the copper sublayer may have a thickness of about 150 ⁇ whereas the nickel sublayer may have a thickness of about 850 ⁇ .
  • one or more sublayers of copper/nickel, aluminum, titanium, chromium/nickel, chromium/molybdenum, and gold have been combined in various thicknesses.
  • One or more operations of the fabrication methods described in this disclosure can be implemented in apparatus including one or more stations or modules for placing one or more components, bonding two or more components together, preparing and applying coatings, and/or dispensing conductive inks or epoxies, and a controller including program instructions for conducting the fabrication methods.
  • a controller may include one or more memory devices and one or more processors configured to execute the program instructions so that the apparatus can perform a method in accordance with the disclosed implementations.
  • the processor may include a central processing unit (CPU) or a computer, analog and/or digital input/output connections, motor controller boards, and other like components.
  • Program instructions for implementing appropriate process operations may be executed on or by the processor. These program instructions may be stored on the memory devices or other machine-readable media associated with the controller or they may be provided over a network.
  • the controller may control all, most, or a subset of the operations of an apparatus.
  • the controller may control all or most the operations of an associated with dispensing of a conductive ink or laminating an adhesive.
  • the controller may execute system control software including sets of instructions for controlling the timing of the process operations, pressure levels, temperature levels and other parameters of particular manufacturing processes further described with respect to FIGS. 5 through 9 .
  • other computer programs, scripts, or routines stored on memory devices associated with the controller may be employed.
  • a user interface may be associated with the controller.
  • the user interface may include a display screen, graphical software to display process conditions, and user input devices such as pointing devices, keyboards, touch screens, microphones, and other like components.
  • the program instructions for controlling the operations of an apparatus may include computer program code written in any conventional computer readable programming language, such as, for example, assembly language, C, C++, Pascal, FORTRAN, or others. Compiled object code or script may be executed by the processor of the controller to perform the tasks identified in the program instructions.
  • signals for monitoring a manufacturing process may be provided by analog and/or digital input connections of the controller.
  • Signals for controlling a manufacturing process may be output on analog and/or digital output connections of the controller.
  • the hardware and data processing apparatus used to implement the various illustrative logics, logical blocks, modules and circuits described in connection with the aspects disclosed herein may be implemented or performed with a general purpose single- or multi-chip processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein.
  • a general purpose processor may be a microprocessor, or, any conventional processor, controller, microcontroller, or state machine.
  • a processor also may be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. In some implementations, particular steps and methods may be performed by circuitry that is specific to a given function.
  • the functions described may be implemented in hardware, digital electronic circuitry, computer software, firmware, including the structures disclosed in this specification and their structural equivalents thereof, or in any combination thereof. Implementations of the subject matter described in this specification also can be implemented as one or more computer programs, i.e., one or more modules of computer program instructions, encoded on a computer storage media for execution by, or to control the operation of, apparatus.
  • Computer-readable media includes both computer storage media and communication media including any medium that can be enabled to transfer a computer program from one place to another.
  • a storage media may be any available media that may be accessed by a computer.
  • such computer-readable media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that may be used to store desired program code in the form of instructions or data structures and that may be accessed by a computer.
  • Disk and disc includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and blue-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above also may be included within the scope of computer-readable media. Additionally, the operations of a method or algorithm may reside as one or any combination or set of codes and instructions on a machine readable medium and computer-readable medium, which may be incorporated into a computer program product.
  • a phrase referring to “at least one of” a list of items refers to any combination of those items, including single members.
  • “at least one of: a, b, or c” is intended to cover: a, b, c, a-b, a-c, b-c, and a-b-c.

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  • Solid State Image Pick-Up Elements (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
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US14/175,876 US20140355387A1 (en) 2013-06-03 2014-02-07 Ultrasonic receiver with coated piezoelectric layer
EP14736093.7A EP3005229A1 (en) 2013-06-03 2014-05-29 Ultrasonic receiver with coated piezoelectric layer
PCT/US2014/039985 WO2014197274A1 (en) 2013-06-03 2014-05-29 Ultrasonic receiver with coated piezoelectric layer
JP2016516812A JP2016526165A (ja) 2013-06-03 2014-05-29 コーティングされた圧電層を有する超音波受信機
BR112015030409-5A BR112015030409B1 (pt) 2013-06-03 2014-05-29 Receptor ultrassônico com camada piezoelétrica revestida
KR1020157037151A KR102220830B1 (ko) 2013-06-03 2014-05-29 압전 층을 갖는 초음파 수신기
CN201480031627.1A CN105264545B (zh) 2013-06-03 2014-05-29 具有涂布的压电层的超声波接收器
US15/925,636 US10341782B2 (en) 2013-06-03 2018-03-19 Ultrasonic receiver with coated piezoelectric layer

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US14/175,876 US20140355387A1 (en) 2013-06-03 2014-02-07 Ultrasonic receiver with coated piezoelectric layer

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