US20140242264A1 - Formaldehyde-free electroless copper plating solution - Google Patents

Formaldehyde-free electroless copper plating solution Download PDF

Info

Publication number
US20140242264A1
US20140242264A1 US14/350,153 US201214350153A US2014242264A1 US 20140242264 A1 US20140242264 A1 US 20140242264A1 US 201214350153 A US201214350153 A US 201214350153A US 2014242264 A1 US2014242264 A1 US 2014242264A1
Authority
US
United States
Prior art keywords
acid
copper plating
copper
plating solution
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/350,153
Other languages
English (en)
Inventor
Edith Stenhäuser
Sandra Röseler
Stefanie Wiese
Tang Cam Lai Nguyen
Lutz Stamp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of US20140242264A1 publication Critical patent/US20140242264A1/en
Assigned to ATOTECH DEUTSCHLAND GMBH reassignment ATOTECH DEUTSCHLAND GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STAMP, LUTZ, NGUYEN, Tang Cam Lai, ROSELER, SANDRA, WIESE, Stefanie, STEINHAUSER, EDITH
Assigned to BARCLAYS BANK PLC, AS COLLATERAL AGENT reassignment BARCLAYS BANK PLC, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ATOTECH DEUTSCHLAND GMBH, ATOTECH USA INC
Assigned to ATOTECH DEUTSCHLAND GMBH, ATOTECH USA, LLC reassignment ATOTECH DEUTSCHLAND GMBH RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
US14/350,153 2011-10-05 2012-10-01 Formaldehyde-free electroless copper plating solution Abandoned US20140242264A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11183991.6 2011-10-05
EP11183991 2011-10-05
PCT/EP2012/069388 WO2013050332A2 (en) 2011-10-05 2012-10-01 Formaldehyde-free electroless copper plating solution

Publications (1)

Publication Number Publication Date
US20140242264A1 true US20140242264A1 (en) 2014-08-28

Family

ID=46963736

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/350,153 Abandoned US20140242264A1 (en) 2011-10-05 2012-10-01 Formaldehyde-free electroless copper plating solution

Country Status (7)

Country Link
US (1) US20140242264A1 (zh)
EP (1) EP2764135A2 (zh)
JP (1) JP6180419B2 (zh)
KR (1) KR101953940B1 (zh)
CN (1) CN104040026B (zh)
TW (1) TWI557271B (zh)
WO (1) WO2013050332A2 (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160053379A1 (en) * 2013-03-27 2016-02-25 Atotech Deutschland Gmbh Electroless copper plating solution
US20170250141A1 (en) * 2014-11-14 2017-08-31 Toppan Printing Co., Ltd. Wiring circuit board, semiconductor device, method of manufacturing wiring circuit board, and method of manufacturing semiconductor device
US10151980B2 (en) 2014-12-16 2018-12-11 Atotech Deutschland Gmbh Method for fine line manufacturing
US20190162905A1 (en) * 2017-11-24 2019-05-30 Lg Display Co., Ltd. Optical fiber capable of converting wavelength and backlight unit using the same
US10975474B2 (en) 2016-05-04 2021-04-13 Atotech Deutschland Gmbh Process for depositing a metal or metal alloy on a surface of a substrate including its activation
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
US11396706B2 (en) 2018-06-08 2022-07-26 Atotech Deutschland Gmbh Electroless copper or copper alloy plating bath and method for plating
CN115679305A (zh) * 2023-01-03 2023-02-03 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102165629B1 (ko) * 2013-09-25 2020-10-15 아토테크더치랜드게엠베하 배리어 층에 구리 시드 층을 증착하기 위한 방법 및 구리 도금 욕
JP6024044B2 (ja) * 2014-01-27 2016-11-09 奥野製薬工業株式会社 導電性皮膜形成浴
US20160145745A1 (en) * 2014-11-24 2016-05-26 Rohm And Haas Electronic Materials Llc Formaldehyde-free electroless metal plating compositions and methods
EP3035375B1 (en) * 2014-12-19 2017-05-03 ATOTECH Deutschland GmbH Treating module of an apparatus for horizontal wet-chemical treatment of large-scale substrates
EP3670698B1 (en) 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof
SG11202109533QA (en) 2019-04-04 2021-10-28 Atotech Deutschland Gmbh A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization
EP3839092A1 (en) 2019-12-20 2021-06-23 ATOTECH Deutschland GmbH Method for activating at least one surface, activation composition, and use of the activation composition to activate a surface for electroless plating
TW202208681A (zh) 2020-08-27 2022-03-01 德商德國艾托特克公司 活化用於金屬化之非導電或含碳纖維基材之表面的方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3632704A (en) * 1967-12-04 1972-01-04 Stauffer Chemical Co Method for modifying electrically nonconductive surfaces for electroless plating
US4315045A (en) * 1978-12-19 1982-02-09 Crown City Plating Co. Conditioning of polyamides for electroless plating
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
JPH0949084A (ja) * 1995-05-31 1997-02-18 Nitto Chem Ind Co Ltd ジアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
US5738914A (en) * 1994-11-11 1998-04-14 The Associated Octel Company Limited Electroless metal plating solution
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US20020011176A1 (en) * 2000-06-19 2002-01-31 Murata Manufacturing Co., Ltd. Electroless copper plating bath, electroless copper plating method and electronic part
US20060251800A1 (en) * 2005-03-18 2006-11-09 Weidman Timothy W Contact metallization scheme using a barrier layer over a silicide layer
US20070036888A1 (en) * 2003-11-14 2007-02-15 Bridgestone Corporation Electromagnetic-wave-shielding light-transmitting window member and method for producing the same
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
US20070134912A1 (en) * 2005-12-09 2007-06-14 Dongbu Electronics Co., Ltd. Method for fabricating semiconductor device
US20080223253A1 (en) * 2007-03-13 2008-09-18 Samsung Electronics Co., Ltd. Electroless copper plating solution, method of producing the same and electroless copper plating method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2761874A (en) 1954-09-30 1956-09-04 Dow Chemical Co Amino derivatives of n-alkyl substituted aspartic acids and their functional derivatives
US3158635A (en) 1959-03-18 1964-11-24 Stauffer Chemical Co Bis-adduction products and methods of preparing same
JPS57116031A (en) 1981-01-13 1982-07-19 Tokyo Organ Chem Ind Ltd N-substituted polyamine and its preparation
US5733858A (en) * 1995-08-30 1998-03-31 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thererof
JPH11513058A (ja) * 1995-08-30 1999-11-09 ザ ダウ ケミカル カンパニー 琥珀酸誘導体分解性キレート化剤、その使用及びその組成物
US20020064592A1 (en) 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
KR100529371B1 (ko) * 2003-07-29 2005-11-21 주식회사 엘지화학 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법
KR100767943B1 (ko) * 2003-10-17 2007-10-17 닛코킨조쿠 가부시키가이샤 무전해 구리도금액 및 무전해 구리도금방법
TW200813255A (en) * 2006-07-07 2008-03-16 Rohm & Haas Elect Mat Environmentally friendly electroless copper compositions
CN102191491A (zh) * 2010-03-10 2011-09-21 比亚迪股份有限公司 一种化学镀铜液及一种化学镀铜方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3632704A (en) * 1967-12-04 1972-01-04 Stauffer Chemical Co Method for modifying electrically nonconductive surfaces for electroless plating
US4315045A (en) * 1978-12-19 1982-02-09 Crown City Plating Co. Conditioning of polyamides for electroless plating
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US5738914A (en) * 1994-11-11 1998-04-14 The Associated Octel Company Limited Electroless metal plating solution
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
JPH0949084A (ja) * 1995-05-31 1997-02-18 Nitto Chem Ind Co Ltd ジアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
US20020011176A1 (en) * 2000-06-19 2002-01-31 Murata Manufacturing Co., Ltd. Electroless copper plating bath, electroless copper plating method and electronic part
US20070036888A1 (en) * 2003-11-14 2007-02-15 Bridgestone Corporation Electromagnetic-wave-shielding light-transmitting window member and method for producing the same
US20060251800A1 (en) * 2005-03-18 2006-11-09 Weidman Timothy W Contact metallization scheme using a barrier layer over a silicide layer
US20070134912A1 (en) * 2005-12-09 2007-06-14 Dongbu Electronics Co., Ltd. Method for fabricating semiconductor device
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
US20080223253A1 (en) * 2007-03-13 2008-09-18 Samsung Electronics Co., Ltd. Electroless copper plating solution, method of producing the same and electroless copper plating method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Chemical Book, "Glyoxylic Acid", chemicalbook.com, copyright 2010, pages 1-3. *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160053379A1 (en) * 2013-03-27 2016-02-25 Atotech Deutschland Gmbh Electroless copper plating solution
US9650718B2 (en) * 2013-03-27 2017-05-16 Atotech Deutschland Gmbh Electroless copper plating solution
US20170250141A1 (en) * 2014-11-14 2017-08-31 Toppan Printing Co., Ltd. Wiring circuit board, semiconductor device, method of manufacturing wiring circuit board, and method of manufacturing semiconductor device
US10151980B2 (en) 2014-12-16 2018-12-11 Atotech Deutschland Gmbh Method for fine line manufacturing
US10975474B2 (en) 2016-05-04 2021-04-13 Atotech Deutschland Gmbh Process for depositing a metal or metal alloy on a surface of a substrate including its activation
US20190162905A1 (en) * 2017-11-24 2019-05-30 Lg Display Co., Ltd. Optical fiber capable of converting wavelength and backlight unit using the same
US10459167B2 (en) * 2017-11-24 2019-10-29 Lg Display Co., Ltd. Optical fiber capable of converting wavelength and backlight unit using the same
US11396706B2 (en) 2018-06-08 2022-07-26 Atotech Deutschland Gmbh Electroless copper or copper alloy plating bath and method for plating
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
CN115679305A (zh) * 2023-01-03 2023-02-03 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺

Also Published As

Publication number Publication date
WO2013050332A8 (en) 2013-07-11
TWI557271B (zh) 2016-11-11
JP6180419B2 (ja) 2017-08-16
KR20140090145A (ko) 2014-07-16
TW201323654A (zh) 2013-06-16
EP2764135A2 (en) 2014-08-13
WO2013050332A2 (en) 2013-04-11
KR101953940B1 (ko) 2019-03-04
JP2014528517A (ja) 2014-10-27
CN104040026A (zh) 2014-09-10
CN104040026B (zh) 2019-01-01
WO2013050332A3 (en) 2014-03-13

Similar Documents

Publication Publication Date Title
US20140242264A1 (en) Formaldehyde-free electroless copper plating solution
EP2784181B1 (en) Electroless copper plating solution
JP2018119209A (ja) 無電解銅めっき組成物
JP6138892B2 (ja) ホルムアルデヒド不含無電解金属メッキ組成物及び方法
EP3034650B1 (en) Plating bath compositions for electroless plating of metals and metal alloys
TWI582266B (zh) 用於鈷合金無電沈積之鹼性鍍浴
US11512394B2 (en) Electroless gold plating bath
US11396706B2 (en) Electroless copper or copper alloy plating bath and method for plating
TW202210660A (zh) 高伸長率無電銅程序

Legal Events

Date Code Title Description
AS Assignment

Owner name: ATOTECH DEUTSCHLAND GMBH, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:STEINHAUSER, EDITH;ROSELER, SANDRA;WIESE, STEFANIE;AND OTHERS;SIGNING DATES FROM 20140424 TO 20140513;REEL/FRAME:037922/0528

AS Assignment

Owner name: BARCLAYS BANK PLC, AS COLLATERAL AGENT, NEW YORK

Free format text: SECURITY INTEREST;ASSIGNORS:ATOTECH DEUTSCHLAND GMBH;ATOTECH USA INC;REEL/FRAME:041590/0001

Effective date: 20170131

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: ATOTECH USA, LLC, SOUTH CAROLINA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC, AS COLLATERAL AGENT;REEL/FRAME:055653/0714

Effective date: 20210318

Owner name: ATOTECH DEUTSCHLAND GMBH, GERMANY

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC, AS COLLATERAL AGENT;REEL/FRAME:055653/0714

Effective date: 20210318