US20140065744A1 - Method for manufacturing image display device - Google Patents

Method for manufacturing image display device Download PDF

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Publication number
US20140065744A1
US20140065744A1 US13/985,379 US201313985379A US2014065744A1 US 20140065744 A1 US20140065744 A1 US 20140065744A1 US 201313985379 A US201313985379 A US 201313985379A US 2014065744 A1 US2014065744 A1 US 2014065744A1
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Prior art keywords
light
image display
resin composition
photocurable resin
layer
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Abandoned
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US13/985,379
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English (en)
Inventor
Naoki Hayashi
Yoshihisa Shinya
Kouichi Ogawa
Tsukasa Nakamura
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Dexerials Corp
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Dexerials Corp
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Assigned to DEXERIALS CORPORATION reassignment DEXERIALS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAYASHI, NAOKI, NAKAMURA, Tsukasa, OGAWA, KOUICHI, SHINYA, YOSHIHISA
Publication of US20140065744A1 publication Critical patent/US20140065744A1/en
Priority to US16/122,488 priority Critical patent/US11404617B2/en
Priority to US17/866,920 priority patent/US20220352439A1/en
Abandoned legal-status Critical Current

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133512Light shielding layers, e.g. black matrix
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/86Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133331Cover glasses
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/28Adhesive materials or arrangements

Definitions

  • the present invention relates to a method for manufacturing an image display device including bonding and stacking an image display member such as a liquid crystal display panel and a light-transmitting cover member such as a transparent protective sheet disposed on the surface side of the image display member, through a light-transmitting cured resin layer.
  • An image display device such as a liquid crystal display panel used in a data terminal such as a smartphone has been manufactured by placing a photocurable resin composition between an image display member, such as a liquid crystal display panel and an organic EL display panel, and a light-transmitting cover member, irradiating the composition with ultraviolet rays, and curing the composition to form a light-transmitting cured resin layer, thereby bonding and stacking the image display member and the light-transmitting cover member (Patent Literature 1).
  • a light-shielding layer is provided in a peripheral portion of a surface on the image display member side of the light-transmitting cover member to enhance the luminance and contrast of a display image. For this reason, curing of the photocurable resin composition interposed between such a light-shielding layer and the image display member does not sufficiently proceed. Therefore, a sufficient adhesion force cannot be obtained. Accordingly, there have been concerns that positional error between the light-transmitting cover member and the image display member and peeling between them and the photocurable resin adhesion faces occur, and the uncured and remaining photocurable resin composition is impregnated into the light shielding layer to change the color.
  • thermosetting and photocurable resin composition it has been proposed that a thermal polymerization initiator is mixed in a photocurable resin composition to form a thermosetting and photocurable resin composition, the thermosetting and photocurable resin composition is applied to a surface of a light-transmitting cover member having a light-shielding layer to stack the applied surface on an image display member, the composition is irradiated with ultraviolet rays and thus cured by light, and the entire product is heated to thermally cure the thermosetting and photocurable resin composition interposed between the light-shielding layer and the image display member (Patent literature 2).
  • Patent literature 2 is expected to solve the problems concerned in Patent Literature 1.
  • a photopolymerization initiator is simultaneously used in combination with a thermal polymerization initiator, and a photopolymerization process and a thermal polymerization process need be applied to the whole image display device. Therefore, a facility for a photopolymerization process and a facility for a thermal polymerization process are required, and a manufacturing operation becomes complex.
  • thermosetting and photocurable resin composition layer be cured by light prior to the thermal polymerization process in order to suppress the occurrence of polymerization inhibition by oxygen during the thermal polymerization process.
  • Many image display devices have problems that the surface of the thermosetting and photocurable resin composition layer cannot be irradiated with ultraviolet rays in terms of the structure of the device and the thermosetting and photocurable resin composition layer cannot be thermally cured sufficiently during the thermal polymerization process.
  • It is an object of the present invention is to solve the problems in the conventional techniques, and to manufacture an image display device by stacking an image display member and a light-transmitting cover member disposed on the surface side of the image display member through a light-transmitting cured resin layer formed from a photocurable resin composition, wherein the light-transmitting cured resin layer between a light-shielding layer and the image display member is in such a cured state that adhesion strength can be maintained without use of a thermal polymerization process even under a heating environment.
  • the present inventors have found that when a liquid photocurable resin composition is irradiated with ultraviolet rays and a surface thereof is observed, uncured liquid regions are dotted. Accordingly, the present inventors have assumed that it is highly possible that such an uncured liquid region will exist on a bonding face of the light-transmitting cover member or the image display member.
  • a film of the photocurable resin composition is irradiated with ultraviolet rays under vacuum or a nitrogen atmosphere, or a material in which an inhibitor for inhibiting curing, such as an amine compound and a phosphorus-based compound, is mixed is used as the photocurable resin composition.
  • an inhibitor for inhibiting curing such as an amine compound and a phosphorus-based compound
  • the present inventors have found that when the image display member and the light-transmitting cover member are stacked through the thus obtained light-transmitting cured resin layer, the adhesion of the photocurable resin composition between the light-transmitting cover member and the image display member is not reduced even under a heating environment.
  • the present invention has been completed.
  • the present invention provides a method for manufacturing an image display device including the following steps (A) to (C), wherein an image display member and a light-transmitting cover member having a light-shielding layer formed in a peripheral portion are stacked through a light-transmitting cured resin layer formed from a liquid photocurable resin composition so that a light-shielding layer-forming face of the light-transmitting cover member is disposed on the image display member side.
  • step (B) one of specific examples of the step (B) is as follows.
  • the ultraviolet rays is irradiated so that the cure rate of the outermost surface of the light-transmitting cured resin layer between the light-shielding layer and the image display member and the cure rate of the entire layer are 90% or more. For this reason, the adhesion strength of the light-transmitting cured resin layer can be maintained even under a heating environment without use of a thermal polymerization process.
  • FIG. 1A is a view illustrating a step (A) in a method for manufacturing an image display device of the present invention.
  • FIG. 1B is a view illustrating the step (A) in the method for manufacturing an image display device of the present invention.
  • FIG. 1C is a view illustrating a step (B) in the method for manufacturing an image display device of the present invention.
  • FIG. 1D is a view illustrating the step (B) in the method for manufacturing an image display device of the present invention.
  • FIG. 1E is a view illustrating a step (C) in the method for manufacturing an image display device of the present invention.
  • FIG. 2A is a view illustrating a step (AA) in the method for manufacturing an image display device of the present invention.
  • FIG. 2B is a view illustrating a step (BB) in the method for manufacturing an image display device of the present invention.
  • FIG. 2C is a view illustrating the step (BB) in the method for manufacturing an image display device of the present invention.
  • FIG. 2D is a view illustrating a step (CC) in the method for manufacturing an image display device of the present invention.
  • FIG. 3 is a view illustrating a creep test of a light-transmitting cured resin layer.
  • FIG. 4 is a view illustrating an evaluation test of an adhesion state of a light-transmitting cured resin layer.
  • a light-transmitting cover member 2 having a light-shielding layer 1 formed in a peripheral portion of a single side is prepared.
  • a liquid photocurable resin composition 3 is applied to a surface of the light-transmitting cover member 2 .
  • the application of the photocurable resin composition 3 may be performed a plurality of times until a necessary thickness is achieved.
  • the light-transmitting cover member 2 is required to be light transmissive so that an image formed on the image display member can be visually recognized, and examples thereof may include a plate-shaped material and a sheet-shaped material, that are made of glass, an acrylic resin, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, and the like. These materials may be subjected to a single-side or double-side hard coating treatment, an antireflection treatment, or the like.
  • the physical properties such as thickness and elasticity of the light-transmitting cover member 2 can be appropriately determined depending on the purposes of use.
  • the light-shielding layer 1 is provided to increase the contrast of an image. Further, the light-shielding layer 1 is obtained by applying a paint colored black or the like through a screen printing method, followed by drying and curing. The thickness of the light-shielding layer 1 is generally 5 to 100 ⁇ m.
  • the nature of the photocurable resin composition 3 used in this step is liquid.
  • a step between the light-shielding layer 1 and a surface on the light-shielding layer-forming side of the light-transmitting cover member 2 can be canceled.
  • the term “liquid” used herein means those showing a viscosity of 0.01 to 100 Pa ⁇ s (cone-plate rheometer, 25° C., cone and plate: C35/2, rotation speed: 10 rpm).
  • Examples of such a photocurable resin composition 3 may include a composition containing a photo-radical polymerizable poly(meth)acrylate such as polyurethane-based (meth)acrylate and polyisoprene-based (meth)acrylate and a photopolymerization initiator as main components.
  • a photo-radical polymerizable poly(meth)acrylate such as polyurethane-based (meth)acrylate and polyisoprene-based (meth)acrylate
  • a photopolymerization initiator as main components.
  • (meth)acrylate” used herein includes acrylate and methacrylate.
  • the photo-radical polymerizable poly(meth)acrylate may include a (meth)acrylate-based oligomer having polyisoprene, polybutadiene, or polyurethane as a skeleton.
  • specific examples of a (meth)acrylate oligomer having a polyisoprene skeleton may include esterified compounds of maleic anhydride adduct of polyisoprene polymer and 2-hydroxyethyl methacrylate (UC102 (polystyrene equivalent molecular weight: 17,000), KURARAY CO., LTD.; UC203 (molecular weight in terms of polystyrene: 35,000), KURARAY CO., LTD.; and UC-1 (polystyrene equivalent molecular weight: 25,000), KURARAY CO., LTD.).
  • UC102 polystyrene equivalent molecular weight: 17,000
  • UC203 molecular weight in terms of polystyrene: 35,000
  • UC-1 polystyrene equivalent molecular weight: 25,000
  • a (meth)acrylate-based oligomer having a polyurethane skeleton may include an aliphatic urethane acrylate (EBECRYL230 (molecular weight: 5,000), DAICEL-CYTEC Company, Ltd.; and UA-1, Light Chemical Industries Co., Ltd.).
  • EBECRYL230 molecular weight: 5,000
  • DAICEL-CYTEC Company molecular weight: 5,000
  • UA-1 Light Chemical Industries Co., Ltd.
  • photopolymerization initiators may be used as the photopolymerization initiator.
  • examples thereof may include 1-hydroxycyclohexyl phenyl ketone (IRGACURE 184, BASF), 2-hydroxy-1- ⁇ 4-[4-(2-hydroxy-2-methyl-propionyl)benzyl]phenyl ⁇ -2-methyl-1-propan-1-one (IRGACURE 127, BASF), benzophenone, and acetophenone.
  • the amount of such a photopolymerization initiator added is too small relative to 100 parts by mass of photo-radical polymerizable poly(meth)acrylate, curing is insufficient during irradiation with ultraviolet rays.
  • it is preferably 0.1 to 5 parts by mass, and more preferably 0.2 to 3 parts by mass.
  • the liquid photocurable resin composition 3 may contain a known plasticizer compatible with a photo-radical polymerizable poly(meth)acrylate (flexibility-imparting agent), for example, a terpene-based hydrogenated resin, polybutadiene, and polyisoprene.
  • a plasticizer compatible with a photo-radical polymerizable poly(meth)acrylate (flexibility-imparting agent), for example, a terpene-based hydrogenated resin, polybutadiene, and polyisoprene.
  • the plasticizer can be used as a tackifier, as described below.
  • the photocurable resin composition 3 can contain a reactive diluent.
  • the reactive diluent may include 2-hydroxypropyl methacrylate, benzyl acrylate, and dicyclopentenyloxyethyl methacrylate.
  • the photocurable resin composition 3 can contain general additives including an adhesion improving agent such as a silane coupling agent and an antioxidant, if necessary.
  • the photocurable resin composition 3 can further contain a chain-transfer agent for adjustment of molecular weight.
  • a chain-transfer agent for adjustment of molecular weight. Examples thereof may include 2-mercaptoethanol, lauryl mercaptan, glycidyl mercaptan, mercaptoacetic acid, 2-ethylhexyl thioglycolate, 2,3-dimethylcapto-1-propanol, and ⁇ -methylstyrene dimer.
  • an amine-based compound such as dimethylaminoethyl acrylate or a phosphorus-based compound such as acid phosphoxy methacrylate, which suppresses curing inhibition, can be added to the photocurable resin composition 3 .
  • the photocurable resin composition 3 can contain a so-called tackifier to impart stickiness to a cured material thereof.
  • a so-called tackifier to impart stickiness to a cured material thereof.
  • terpene-based resins such as a terpene resin, a terpene-phenolic resin, and a hydrogenated terpene resin
  • rosin resins such as natural rosin, polymerized rosin, rosin esters, and hydrogenated rosins
  • petroleum resins such as polybutadiene and polyisoprene, or the like
  • the amount of the tackifier added is preferably 40 to 70 parts by mass relative to 100 parts by mass of photocurable resin composition.
  • a base material of the photocurable resin composition 3 is the photo-radical polymerizable poly(meth)acrylate described above.
  • the base material can also contain a material in which a photo-radical polymerizable poly(meth)acrylate has been polymerized in advance.
  • a polymerized material may include a copolymer of butyl acrylate, and 2-hexyl acrylate and acrylic acid, and a copolymer of cyclohexyl acrylate and methacrylic acid.
  • Step (B) (Curing Step)>
  • the photocurable resin composition 3 applied in the step (A) is preferably irradiated with ultraviolet rays, as shown FIG. 1C described below, and cured to form a light-transmitting cured resin layer 6 ( FIG. 1D ).
  • the reason for irradiation with ultraviolet rays, as shown in FIG. 1C is to prevent the occurrence of curing inhibition by oxygen in air.
  • ultraviolet rays may be irradiated under reduced pressure or an inert gas atmosphere.
  • ultraviolet rays be irradiated in a state in which the light-transmitting cover member 2 to which the photocurable resin composition 3 is applied is placed in a closed chamber 4 , and air in the chamber 4 is exhausted by a pump or replaced with an inert gas such as a nitrogen gas, to significantly decrease the oxygen concentration in the chamber 4 .
  • an inert gas such as a nitrogen gas
  • the cure rate of the outermost surface of the light-transmitting cured resin layer 6 can be increased.
  • a light-transmitting window 5 made of quartz glass, calcium fluoride, or the like be provided in the chamber 4 .
  • the cure rate of the outermost surface of the photocurable resin composition 3 is preferably 90% or more, and more preferably 95% or more, and the cure rate of the entire layer of the photocurable resin composition 3 is preferably 90% or more, and more preferably 95% or more.
  • the cure rate (gel fraction) is a value defined as a ratio (ratio of consumption) of the present amount of (meth)acryloyl group after irradiation with ultraviolet rays to that of (meth)acryloyl group in the photocurable resin composition 3 before the irradiation with ultraviolet rays, and an increased value indicates progression of curing.
  • the cure rate (gel fraction) can be calculated by substituting an absorption peak height (X) at 1640 to 1620-cm ⁇ 1 from a base line in a chart of FT-IR measurement of the photocurable resin composition layer before the irradiation with ultraviolet rays and an absorption peak height (Y) at 1640 to 1620 cm ⁇ 1 from a base line in a chart of FT-IR measurement of the photocurable resin composition layer after the irradiation with ultraviolet rays into the following formula (I).
  • Cure rate (%) ⁇ ( X ⁇ Y )/ X ⁇ 100 (1)
  • the kind, output, cumulative light amount of a light source are not particularly restricted as long as curing can be performed so that the cure rate (gel fraction) is 900 or more.
  • a photo-radical polymerization process condition for (meth)acrylate by the known irradiation with ultraviolet rays can be adopted.
  • the light-transmitting cover member 2 is bonded to an image display member 7 from the light-transmitting cured resin layer 6 side. Bonding can be performed by pressurization at 10° C. to 80° C. using a known compression bonding device. Thus, an image display device 10 in which the image display member 7 and the light-transmitting cover member 2 are stacked through the light-transmitting cured resin layer 6 is obtained.
  • Examples of the image display member 7 may include liquid crystal display panels, organic EL display panels, plasma display panels, and touch panels.
  • the touch panel used herein means an image display and input panel in which a display element such as a liquid crystal display panel and a position input device such as a touch pad are assembled.
  • the level of light transmission property of the light-transmitting cured resin layer 6 requires such a light transmission property that an image formed on the image display member 7 can be visually recognized, and the transmittance in the visible region (wavelength: 400 to 750 nm) is desirably 900 or more.
  • FIGS. 1A to 1E an example of applying a photocurable resin composition to a surface on a light-shielding layer side of a light-transmitting cover member has been described with reference to FIGS. 1A to 1E .
  • FIGS. 2A to 2D an example of applying a photocurable resin composition to a surface of an image display member will be described with reference to FIGS. 2A to 2D .
  • FIGS. 1A to 1E and 2 A to 2 D the same reference numerals denote the same components.
  • a photocurable resin composition 3 is applied to a surface of an image display member 7 .
  • the application of the photocurable resin composition 3 may be performed a plurality of times until a necessary thickness is achieved.
  • the photocurable resin composition 3 applied in the step (AA) is, for example, irradiated with ultraviolet rays, as shown FIG. 2B , and cured to form a light-transmitting cured resin layer 6 ( FIG. 2C ).
  • the reason for irradiation with ultraviolet rays, as shown in FIG. 2B is to prevent the occurrence of curing inhibition by oxygen in air.
  • ultraviolet rays may be irradiated under reduced pressure or an inert gas atmosphere.
  • ultraviolet rays be irradiated in a state in which the image display member 7 to which the photocurable resin composition 3 is applied is placed in a closed chamber 4 , and air in the chamber 4 is exhausted by a pump or replaced with an inert gas such as a nitrogen gas, to significantly decrease the oxygen concentration in the chamber 4 .
  • an inert gas such as a nitrogen gas
  • the cure rate of the outermost surface of a light-transmitting cured resin layer 6 can be increased.
  • a light-transmitting window 5 made of quartz glass, calcium fluoride, or the like be provided in the chamber 4 .
  • the cure rate of the outermost surface of the photocurable resin composition 3 be 90% or more, and preferably 95% or more, and the cure rate of the entire layer of the photocurable resin composition 3 be 90% or more, and preferably 95% or more.
  • a release film may be stacked on the photocurable resin composition 3 , irradiated with ultraviolet rays, and released before the next step.
  • the light-transmitting cover member 2 is bonded to the light-transmitting cured resin layer 6 of the image display member 7 from the light-shielding layer 1 side. Bonding can be performed by pressurization at 10 to 80° C. using a known compression bonding device. Thus, an image display device 10 ( FIG. 2D ) in which the image display member 7 and the light-transmitting cover member 2 are stacked through the light-transmitting cured resin layer 6 is obtained.
  • Examples of the image display member 7 may include liquid crystal display panels, organic EL display panels, plasma display panels, and touch panels.
  • the level of light transmission property of the light-transmitting cured resin layer 6 requires such a light transmission property that an image formed in the image display member 7 can be visually recognized.
  • polyisoprene methacrylate (UC102, KURARAY CO., LTD.) as a photocurable resin composition
  • 15 parts by weight of dicyclopentenyloxyethyl methacrylate and 5 parts by weight of lauryl methacrylate as reactive diluents 20 parts by weight of polybutadiene (Polyvest110, Evonik Degussa GmbH) as a plasticizer
  • 53 parts by weight of hydrogenated terpene resin (Clearon M105, YASUHARA CHEMICAL CO., LTD.) as a tackifier were uniformly mixed and prepared.
  • the viscosity of the photocurable resin composition (cone-plate rheometer, 25° C., cone and plate: C35/2, rotation speed: 10 rpm) was about 6 Pa ⁇ s.
  • Step (A) (Applying Step))
  • the photocurable resin composition was then discharged onto a glass plate having a light-shielding layer with a size of 40 (w) ⁇ 70 (1) ⁇ 0.4 (t) mm by a resin dispenser, to form a photocurable resin composition film with an average thickness of 200 ⁇ m.
  • the glass plate having a light-shielding layer in which the photocurable resin composition film was formed was placed in a chamber capable of vacuuming and the pressure inside the chamber was reduced by a vacuum pump. At this time, the degree of reduced pressure was 10 Pa. While the degree of reduced pressure was maintained, the photocurable resin composition film was irradiated with ultraviolet rays having a strength of 50 mW/cm 2 for 40 seconds by an UV irradiation apparatus (LC-8, Hamamatsu Photonics K.K.) so that the integrated light intensity was 2,000 mJ/cm 2 . Thus, the photocurable resin composition film was cured to form a light-transmitting cured resin layer. After then, the pressure inside the chamber was returned to atmospheric pressure.
  • LC-8 Hamamatsu Photonics K.K.
  • the cure rate was determined using the absorption peak height at 1640 to 1620 cm ⁇ 1 from a base line in a chart of FT-IR measurement of the photocurable resin composition layer obtained by curing as an index, and was found to be 99%.
  • the photocurable resin composition was applied to a glass substrate so that the thickness was 5 ⁇ m, and cured similarly. This cured material was used. The cure rate was similarly determined and was found to be 99%.
  • the glass plate having a light-shielding layer obtained in the step (B) was placed on a face on which a polarizing plate of a liquid crystal display element with a size of 35 (W) ⁇ 65 (L) mm was stacked so that the light-transmitting cured resin layer side was the polarizing plate side.
  • the glass plate was bonded by pressurization from the glass plate side with a rubber roller.
  • a liquid crystal display device was manufactured. When the liquid crystal display element was observed visually from the glass plate side, air bubbles were not confirmed between the polarizing plate and the light-transmitting cured resin layer.
  • Example 1 The liquid crystal display device obtained in Example 1 was subjected to a creep test under a heating environment, and the presence or absence of defect such as peeling and gap was observed visually as described below. Further, the strength of the light-transmitting cured resin layer under a heating environment was tested and evaluated as described below.
  • the liquid crystal display device 30 manufactured in Example 1 in which the glass plate 31 having a light-shielding layer and the liquid crystal display element 32 were stacked through the light-transmitting cured resin layer 6 , was fixed so that the liquid crystal display element 32 side was vertical.
  • the liquid crystal display device was allowed to stand for 72 hours under an environment of 85° C. while held in the state. After then, the liquid crystal display device was taken out under an environment of normal temperature, and evaluated by visual observation in accordance with the following criteria. The evaluation was “A.”
  • A a case where peeling due to air bubbles does not occur and a gap in a glass plate having a light-shielding layer is not generated.
  • a glass base 41 with a size of 40 (W) ⁇ 70 (L) mm was used instead of a liquid crystal display element as shown in FIG. 4 .
  • a glass plate 42 having a light-transmitting cured resin layer was bonded to the glass base 41 from the light-transmitting cured resin layer side in a cross shape to obtain a glass bonded body 40 .
  • the glass base 41 disposed at the lower side was fixed and the glass plate 42 disposed at the upper side was peeled immediately upward under an atmosphere of 85° C. The peeling state was observed visually, and the adhesion state was evaluated in accordance with the following criteria. The evaluation was “A.”
  • A a case where cohesive peeling occurs.
  • a liquid crystal display device and a glass bonded body for measurement of adhesion strength were manufactured in the same manner as in Example 1 except that the degree of reduced pressure inside the chamber was changed to 100 Pa in the step (B) (curing step) of Example 1.
  • the presence or absence of air bubbles was observed and the adhesion state was evaluated.
  • the cure rate of the outermost surface of the light-transmitting cured resin layer was 92% and the cure rate of the entire light-transmitting cured resin layer was 93%.
  • the evaluation of creep under a heating environment was “A,” and the evaluation of adhesion state under a heating environment was also “A.”
  • a liquid crystal display device and a glass bonded body for measurement of adhesion strength were manufactured in the same manner as in Example 1 except that the pressure inside the chamber was not reduced and the air inside the chamber was replaced with nitrogen in the step (B) (curing step) of Example 1.
  • the presence or absence of air bubbles was observed and the adhesion state was evaluated.
  • the cure rate of the outermost surface of the light-transmitting cured resin layer was 95% and the cure rate of the entire light-transmitting cured resin layer was 96%.
  • the evaluation of creep under a heating environment was “A,” and the evaluation of adhesion state under a heating environment was also “A.”
  • a liquid crystal display device and a glass bonded body for measurement of adhesion strength were manufactured in the same manner as in Example 1 except that the photocurable resin in Example 1 was used, the air inside the chamber was not purged, and the atmospheric pressure was used as it was an the step (B) (curing step) of Example 1.
  • the cure rate of the outermost surface of the light-transmitting cured resin layer was 75% and the cure rate of the entire layer was 90%.
  • the adhesion state of the liquid crystal display device and the glass bonded body was evaluated. As a result, the evaluation of creep under a heating environment was “C,” and the evaluation of adhesion state under a heating environment was also “C.”
  • a liquid crystal display device and a glass bonded body for measurement of adhesion strength were manufactured in the same manner as in Example 1 except that the photocurable resin composition of Example 1 was used and the degree of reduced pressure inside the chamber was changed to 1,000 Pa in the step (B) (curing step) of Example 1. At this time, the cure rate of the outermost surface of the light-transmitting cured resin layer was 82% and the cure rate of the entire layer was 90%.
  • the adhesion state of the liquid crystal display device and the glass bonded body was evaluated. As a result, the evaluation of creep under a heating environment was “C,” and the evaluation of adhesion state under a heating environment was also “C.”
  • a light-transmitting cured resin layer between a light-shielding layer and an image display member can be sufficiently cured by light, and a stacked body in which peeling due to insufficient adhesion and peeling and a gap under a heating environment do not occur can be produced.
  • the manufacturing method of the present invention is useful in industrial manufacturing of a data terminal such as a smartphone equipped with a touch panel and a touch pad.

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107075079A (zh) * 2014-10-27 2017-08-18 Ctech胶粘剂有限责任公司 使用紫外固化型压敏型粘合剂(psa)的装配方法或分阶段的psa系统
CN108508641A (zh) * 2017-02-27 2018-09-07 迪睿合株式会社 图像显示装置及其制造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
JP5304922B1 (ja) * 2012-05-09 2013-10-02 デクセリアルズ株式会社 画像表示装置の製造方法
JP5994618B2 (ja) * 2012-12-14 2016-09-21 デクセリアルズ株式会社 光硬化性樹脂組成物及びそれを用いた画像表示装置の製造方法
EP3087623B1 (en) 2013-12-26 2021-09-22 Kateeva, Inc. Thermal treatment of electronic devices
CN107611287A (zh) * 2014-01-21 2018-01-19 科迪华公司 用于电子装置封装的设备和技术
JP6271324B2 (ja) * 2014-03-31 2018-01-31 株式会社カネカ インプリント装置、インプリント方法、太陽電池の製造方法及び有機el装置の製造方法
KR20240119185A (ko) 2014-04-30 2024-08-06 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
JP6528103B2 (ja) * 2015-04-06 2019-06-12 協立化学産業株式会社 光硬化型接着組成物
JP6481167B2 (ja) 2015-04-09 2019-03-13 協立化学産業株式会社 光硬化型接着組成物
KR102443361B1 (ko) * 2015-09-03 2022-09-19 삼성디스플레이 주식회사 표시 장치
CN105045436A (zh) 2015-09-15 2015-11-11 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
JP7075109B2 (ja) * 2017-04-14 2022-05-25 協立化学産業株式会社 光硬化型接着剤組成物
JP6370967B1 (ja) * 2017-06-28 2018-08-08 デクセリアルズ株式会社 画像表示装置の製造方法、光硬化性樹脂組成物及び光透過性硬化樹脂層
JP2022135730A (ja) * 2021-03-05 2022-09-15 株式会社ブイ・テクノロジー 転写装置及び転写方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040089397A1 (en) * 2002-10-25 2004-05-13 Tung-Sheng Cheng FPD encapsulation apparatus and method for encapsulating the same
US20100003425A1 (en) * 2007-04-03 2010-01-07 Sony Chemical & Information Device Corporation Method for manufacturing image display device
US20100277684A1 (en) * 2007-10-22 2010-11-04 Hiroshi Fukushima Display device and method for production thereof
WO2011084405A1 (en) * 2009-12-17 2011-07-14 3M Innovative Properties Company Display panel assembly and methods of making same
WO2011148990A1 (ja) * 2010-05-26 2011-12-01 旭硝子株式会社 粘着層付き透明面材、表示装置およびそれらの製造方法
JP2012071281A (ja) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp 接着剤供給装置及び接着剤供給方法
US20140305582A1 (en) * 2012-05-09 2014-10-16 Dexerials Corporation Method of manufacturing image display apparatus

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0876134A (ja) * 1994-09-08 1996-03-22 Canon Inc 液晶用低抵抗基板の製造方法
TW493358B (en) * 2001-06-14 2002-07-01 Ritdisplay Corp Package method and apparatus of organic light-emitting diode display device
JP2003197366A (ja) * 2001-12-25 2003-07-11 Sanyo Electric Co Ltd 表示装置及びその製造方法
DE602006019317D1 (de) * 2005-11-29 2011-02-10 Seiko Instr Inc Prozess zur display-herstellung und laminationsverfahren
KR101253802B1 (ko) * 2005-12-05 2013-04-12 세이코 인스트루 가부시키가이샤 표시 기기 및 표시 기기의 제조 방법
JP5057137B2 (ja) * 2006-11-17 2012-10-24 日立化成工業株式会社 保護板付き画像表示装置の製造方法
CN101652803B (zh) * 2007-04-03 2015-02-04 迪睿合电子材料有限公司 图像显示装置的制造方法
JP2009186954A (ja) * 2007-04-04 2009-08-20 Sony Chemical & Information Device Corp 画像表示装置の製造方法
WO2008123611A1 (ja) 2007-04-04 2008-10-16 Sony Chemical & Information Device Corporation 画像表示装置の製造方法
JP2009186957A (ja) * 2007-04-09 2009-08-20 Sony Chemical & Information Device Corp 樹脂組成物及び表示装置
JP2009075576A (ja) * 2007-08-27 2009-04-09 Toray Ind Inc 反射防止フィルムの製造方法及び画像表示装置、塗料組成物
JP5115412B2 (ja) * 2007-09-12 2013-01-09 日立化成工業株式会社 画像表示装置の製造方法及び画像表示装置
JP5507858B2 (ja) * 2008-05-29 2014-05-28 日東電工株式会社 光学部材用粘着剤組成物、粘着型光学部材および画像表示装置
TWI485214B (zh) 2008-09-05 2015-05-21 Kyoritsu Chemical Co Ltd And a photohardenable resin composition for bonding an optical functional material
CN101504496A (zh) * 2009-03-04 2009-08-12 信利半导体有限公司 一种触摸屏和平板显示模块一体化组合模块及其制作方法
WO2013057958A1 (ja) * 2011-10-21 2013-04-25 日本化薬株式会社 光学部材の製造方法及びそのための紫外線硬化型樹脂組成物の使用
JP5138820B1 (ja) * 2012-01-25 2013-02-06 デクセリアルズ株式会社 画像表示装置の製造方法
JP5304922B1 (ja) * 2012-05-09 2013-10-02 デクセリアルズ株式会社 画像表示装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040089397A1 (en) * 2002-10-25 2004-05-13 Tung-Sheng Cheng FPD encapsulation apparatus and method for encapsulating the same
US20100003425A1 (en) * 2007-04-03 2010-01-07 Sony Chemical & Information Device Corporation Method for manufacturing image display device
US20100277684A1 (en) * 2007-10-22 2010-11-04 Hiroshi Fukushima Display device and method for production thereof
WO2011084405A1 (en) * 2009-12-17 2011-07-14 3M Innovative Properties Company Display panel assembly and methods of making same
WO2011148990A1 (ja) * 2010-05-26 2011-12-01 旭硝子株式会社 粘着層付き透明面材、表示装置およびそれらの製造方法
US20130029075A1 (en) * 2010-05-26 2013-01-31 Asahi Glass Company, Limited Transparent plate having adhesive layer, display device and processes for their production
JP2012071281A (ja) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp 接着剤供給装置及び接着剤供給方法
US20140305582A1 (en) * 2012-05-09 2014-10-16 Dexerials Corporation Method of manufacturing image display apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107075079A (zh) * 2014-10-27 2017-08-18 Ctech胶粘剂有限责任公司 使用紫外固化型压敏型粘合剂(psa)的装配方法或分阶段的psa系统
US20170247575A1 (en) * 2014-10-27 2017-08-31 Ctech Adhesives Llc Assembly processes using uv curable pressure sensitive adhesives (psa) or stageable psa systems
US11208575B2 (en) * 2014-10-27 2021-12-28 Illinois Tool Works Inc. Assembly processes using UV curable pressure sensitive adhesives (PSA) or stageable PSA systems
CN108508641A (zh) * 2017-02-27 2018-09-07 迪睿合株式会社 图像显示装置及其制造方法

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