US20130306274A1 - Heat dissipation structure for heat dissipation unit - Google Patents

Heat dissipation structure for heat dissipation unit Download PDF

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Publication number
US20130306274A1
US20130306274A1 US13/472,124 US201213472124A US2013306274A1 US 20130306274 A1 US20130306274 A1 US 20130306274A1 US 201213472124 A US201213472124 A US 201213472124A US 2013306274 A1 US2013306274 A1 US 2013306274A1
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United States
Prior art keywords
heat dissipation
nanoscale
chamber
threadlike bodies
threadlike
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Abandoned
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US13/472,124
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Hsiu-Wei Yang
Chih-Yeh Lin
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Asia Vital Components Co Ltd
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Individual
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Priority to US13/472,124 priority Critical patent/US20130306274A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, CHIH-YEH, YANG, HSIU-WEI
Publication of US20130306274A1 publication Critical patent/US20130306274A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipation structure for heat dissipation unit, and more particularly to a heat dissipation structure that enables a working fluid in a heat dissipation unit to have upgraded vapor/liquid cycling efficiency.
  • Such heat transfer components have excellent heat transfer rate several times to several tens times as high as that of copper, aluminum and the like, and are therefore used in various electronic apparatuses as cooling components.
  • heat pipes they can be divided according to their shapes into circular heat pipes, flat heat pipes and D-shaped heat pipes.
  • a vapor chamber, a flat heat pipe or a thin-type heat exchanger as the heat transfer or cooling component in view of the easy installation and large contact area thereof.
  • heat pipes therefor must also be extremely thin to adapt to the very limited internal space in the cooling mechanism.
  • capillary structures with capillary force are also provided in the heat transfer components to help the working fluid to carry on the vapor/liquid cycling smoothly.
  • the heat transfer components For using in a narrow space, the heat transfer components must be manufactured to be very thin. However, other than the thickness of the heat transfer component, the capillary structures inside the heat transfer component form another major obstacle in further thinning the heat transfer component.
  • the capillary force of the thinned capillary structures will degrade to adversely affect the vapor/liquid cycling efficiency of the working fluid to thereby largely reduce the heat transfer efficiency of the heat transfer component. Therefore, the conventional heat transfer components have the following disadvantages: (1) poor heat transfer efficiency; and (2) unable to be effectively thinned.
  • Another object of the present invention is to provide a heat dissipation structure for heat dissipation unit that enables a working fluid in a thin-type heat dissipation unit to have enhanced vapor/liquid cycling efficiency.
  • the heat dissipation structure for heat dissipation unit includes a heat dissipation unit main body that internally defines a chamber.
  • the chamber is internally provided with at least a layer of nanoscale threadlike bodies and a working fluid, and the layer of nanoscale threadlike-bodies is continuously provided on an inner wall surface of the chamber.
  • the heat dissipation unit main body can be any one of a heat pipe, a loop heat pipe, a flat heat pipe, a vapor chamber, and a heat exchanger.
  • the layer of nanoscale threadlike bodies is able to largely upgrade the vapor/liquid cycling efficiency of the working fluid in the heat dissipation unit main body because it has a dense structure to maintain a capillary force even in a thin-type heat dissipation unit, and can therefore help the working fluid to carry on vapor/liquid cycling smoothly.
  • FIG. 1 is a perspective view of a heat dissipation structure for heat dissipation unit according to a first embodiment of the present invention
  • FIG. 2 is a sectional view taken along line A-A of FIG. 1 ;
  • FIG. 2A is an enlarged view of the circled area of FIG. 2 ;
  • FIG. 3 is a sectional view of a heat dissipation structure for heat dissipation unit according to a second embodiment of the present invention
  • FIG. 4 is a sectional view of a heat dissipation structure for heat dissipation unit according to a third embodiment of the present invention.
  • FIG. 5 is a sectional view of a heat dissipation structure for heat dissipation unit according to a fourth embodiment of the present invention.
  • FIG. 6 is a sectional view of a heat dissipation structure for heat dissipation unit according to a fifth embodiment of the present invention.
  • FIG. 7 is a sectional view of a heat dissipation structure for heat dissipation unit according to a sixth embodiment of the present invention.
  • FIG. 8 is a sectional view of a heat dissipation structure for heat dissipation unit according to a seventh embodiment of the present invention.
  • FIG. 9 is a sectional view of a heat dissipation structure for heat dissipation unit according to an eighth embodiment of the present invention.
  • FIG. 10 is a sectional view of a heat dissipation structure for heat dissipation unit according to a ninth embodiment of the present invention.
  • FIG. 11 is a sectional view of a heat dissipation structure for heat dissipation unit according to a tenth embodiment of the present invention.
  • FIG. 12 is a sectional view of a heat dissipation structure for heat dissipation unit according to an eleventh embodiment of the present invention.
  • FIG. 1 is a perspective view of a heat dissipation structure for heat dissipation unit according to a first embodiment of the present invention
  • FIGS. 2 and 2A are respectively a sectional view taken along line A-A of FIG. 1 and an enlarged view of the circled area of FIG. 2 .
  • the heat dissipation structure for heat dissipation unit includes a heat dissipation unit main body 1 that internally defines a chamber 11 , in which at least a layer of nanoscale threadlike bodies 111 and a working fluid 112 are provided.
  • the layer of nanoscale threadlike bodies 111 is continuously provided on a whole or part of the inner wall surface of the chamber 11 , and is formed of a plurality of individual nanoscale threadlike bodies.
  • the individual nanoscale threadlike bodies respectively have an end fixedly located on the inner wall surface of the chamber 11 and referred to as a fixed connecting end herein, and another opposite end extending toward an interior of the chamber 11 and being a free end.
  • the free ends of the individual nanoscale threadlike bodies can be sharp free ends or blunt free ends, or a combination thereof.
  • the main body 1 can be any one of a vapor chamber, a flat heat pipe, a loop heat pipe, and a heat exchanger.
  • the main body 1 is a flat heat pipe without being limited thereto.
  • the chamber 11 has a smooth inner wall surface.
  • FIG. 3 is a sectional view of a heat dissipation structure for heat dissipation unit according to a second embodiment of the present invention.
  • the heat dissipation unit main body 1 is also illustrated as a heat pipe but not necessarily limited thereto, and the layer of nanoscale threadlike bodies 111 axially extends along the inner surface of the chamber 11 of the heat pipe.
  • FIG. 4 is a sectional view of a heat dissipation structure for heat dissipation unit according to a third embodiment of the present invention.
  • the heat dissipation unit main body 1 is also illustrated as a heat pipe but not necessarily limited thereto, and the chamber 11 includes at least a first section 113 , a second section 114 and a third section 115 connected to and communicable with one another.
  • the layer of nanoscale threadlike bodies 111 can be selectively provided in any one of the first, the second and the third section 113 , 114 , 115 .
  • the layer of nanoscale threadlike bodies 111 is provided only in the second section 114 but not necessarily restricted thereto.
  • FIG. 5 is a sectional view of a heat dissipation structure for heat dissipation unit according to a fourth embodiment of the present invention.
  • the fourth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the fourth embodiment is further internally provided with a coating 2 , which has both super-hydrophilic and super-hydrophobic properties.
  • the coating 2 is selectively provided in any one of the first, the second and the third section 113 , 114 , 115 . In the illustrated fourth embodiment, the coating 2 is provided in the third section 115 .
  • FIG. 6 is a sectional view of a heat dissipation structure for heat dissipation unit according to a fifth embodiment of the present invention.
  • the fifth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the fifth embodiment is further internally provided with a coating 2 , and the coating 2 is provided in the first and the third section 113 , 115 of the chamber 11 .
  • FIG. 7 is a sectional view of a heat dissipation structure for heat dissipation unit according to a sixth embodiment of the present invention.
  • the sixth embodiment is generally structurally similar to the second embodiment, except that, in the sixth embodiment, a wick structure 3 is further provided between the inner wall surface of the chamber 11 and the layer of nanoscale threadlike bodies 111 .
  • the wick structure 3 can be any one of a sintered powder structure, a mesh structure, a fibrous structure, a porous structure, a grooved structure, and any combinations thereof.
  • the wick structure is illustrated as a grooved structure without being limited thereto.
  • the grooved structure includes a plurality of grooves formed on and sunken from the inner wall surface of the chamber 11 ; and the layer of nanoscale threadlike bodies 111 covers both the grooves and the inner wall surface of the chamber 11 .
  • FIG. 8 is a sectional view of a heat dissipation structure for heat dissipation unit according to a seventh embodiment of the present invention.
  • the seventh embodiment is generally structurally similar to the second embodiment, except that, in the seventh embodiment, a coating 2 is further provided between the inner wall surface of the chamber 11 and the layer of nanoscale threadlike bodies 111 .
  • FIG. 9 is a sectional view of a heat dissipation structure for heat dissipation unit according to an eighth embodiment of the present invention.
  • the eighth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the eighth embodiment further includes at least a first section 113 , a second section 114 and a third section 115 that are connected to and communicable with one another, and a portion of the layer of nanoscale threadlike bodies 111 provided in the second section 114 has a density higher than that of other portions of the layer of nanoscale threadlike bodies 111 provided in the first and the third section.
  • FIG. 10 is a sectional view of a heat dissipation structure for heat dissipation unit according to a ninth embodiment of the present invention.
  • the ninth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the ninth embodiment further includes at least a first section 113 , a second section 114 and a third section 115 that are connected to and communicable with one another, and a portion of the layer of nanoscale threadlike bodies 111 provided in the second section 114 has a density lower than that of other portions of the layer of nanoscale threadlike bodies 111 provided in the first and the third section.
  • FIG. 11 is a sectional view of a heat dissipation structure for heat dissipation unit according to a tenth embodiment of the present invention.
  • the tenth embodiment is generally structurally similar to the first embodiment, except that the heat dissipation unit main body 1 in the tenth embodiment is a vapor chamber that internally defines a chamber 11 , and the chamber 11 is provided on an inner wall surface with a layer of nanoscale threadlike bodies 111 .
  • FIG. 12 is a sectional view of a heat dissipation structure for heat dissipation unit according to an eleventh embodiment of the present invention.
  • the eleventh embodiment is generally structurally similar to the tenth embodiment, except that, in the eleventh embodiment, a coating 2 is further provided between the inner wall surface of the chamber 11 of the vapor chamber and the layer of nanoscale threadlike bodies 111 .
  • the layer of nanoscale threadlike bodies 111 is able to change the surface tension of the working fluid 112 in the chamber 11 , so that the working fluid 112 can flow back at an increased speed to provide excellent vapor/liquid cycling efficiency for the heat dissipation unit to have largely upgraded heat transfer performance.

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Abstract

A heat dissipation structure for heat dissipation unit includes a heat dissipation unit main body that internally defines a chamber, and the chamber is internally provided with at least a layer of nanoscale threadlike bodies and a working fluid. The layer of nanoscale threadlike bodies is provided on an inner wall surface of the chamber. By providing the layer of nanoscale threadlike bodies in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation unit, enabling the latter to have upgraded heat transfer performance.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat dissipation structure for heat dissipation unit, and more particularly to a heat dissipation structure that enables a working fluid in a heat dissipation unit to have upgraded vapor/liquid cycling efficiency.
    • BACKGROUND OF THE INVENTION
  • It is known that various heat transfer components, such as heat pipes, vapor chambers, loop heat pipes and heat exchangers, are currently widely employed in electronic apparatuses for transferring and dissipating heat at high efficiency.
  • Such heat transfer components have excellent heat transfer rate several times to several tens times as high as that of copper, aluminum and the like, and are therefore used in various electronic apparatuses as cooling components. Regarding heat pipes, they can be divided according to their shapes into circular heat pipes, flat heat pipes and D-shaped heat pipes. For cooling an electronic component in an electronic apparatus that produces heat during operation or working, such as a CPU or an executing component, it is preferable to use a vapor chamber, a flat heat pipe or a thin-type heat exchanger as the heat transfer or cooling component in view of the easy installation and large contact area thereof. Meanwhile, due to the demands for a miniaturized cooling mechanism, heat pipes therefor must also be extremely thin to adapt to the very limited internal space in the cooling mechanism.
  • Further, for a working fluid provided in the above-mentioned heat transfer components to cyclically convert between vapor phase and liquid phase, capillary structures with capillary force, such as grooved structures, metal mesh structures or sintered structures, are also provided in the heat transfer components to help the working fluid to carry on the vapor/liquid cycling smoothly.
  • For using in a narrow space, the heat transfer components must be manufactured to be very thin. However, other than the thickness of the heat transfer component, the capillary structures inside the heat transfer component form another major obstacle in further thinning the heat transfer component.
  • Moreover, the capillary force of the thinned capillary structures will degrade to adversely affect the vapor/liquid cycling efficiency of the working fluid to thereby largely reduce the heat transfer efficiency of the heat transfer component. Therefore, the conventional heat transfer components have the following disadvantages: (1) poor heat transfer efficiency; and (2) unable to be effectively thinned.
    • SUMMARY OF THE INVENTION
  • To overcome the above-mentioned drawbacks in the prior art heat transfer components, it is a primary object of the present invention to provide a heat dissipation structure for heat dissipation unit that enables upgraded heat transfer and heat dissipation efficiency.
  • Another object of the present invention is to provide a heat dissipation structure for heat dissipation unit that enables a working fluid in a thin-type heat dissipation unit to have enhanced vapor/liquid cycling efficiency.
  • To achieve the above and other objects, the heat dissipation structure for heat dissipation unit according to the present invention includes a heat dissipation unit main body that internally defines a chamber. The chamber is internally provided with at least a layer of nanoscale threadlike bodies and a working fluid, and the layer of nanoscale threadlike-bodies is continuously provided on an inner wall surface of the chamber.
  • According to the present invention, the heat dissipation unit main body can be any one of a heat pipe, a loop heat pipe, a flat heat pipe, a vapor chamber, and a heat exchanger.
  • The layer of nanoscale threadlike bodies is able to largely upgrade the vapor/liquid cycling efficiency of the working fluid in the heat dissipation unit main body because it has a dense structure to maintain a capillary force even in a thin-type heat dissipation unit, and can therefore help the working fluid to carry on vapor/liquid cycling smoothly.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
  • FIG. 1 is a perspective view of a heat dissipation structure for heat dissipation unit according to a first embodiment of the present invention;
  • FIG. 2 is a sectional view taken along line A-A of FIG. 1;
  • FIG. 2A is an enlarged view of the circled area of FIG. 2;
  • FIG. 3 is a sectional view of a heat dissipation structure for heat dissipation unit according to a second embodiment of the present invention;
  • FIG. 4 is a sectional view of a heat dissipation structure for heat dissipation unit according to a third embodiment of the present invention;
  • FIG. 5 is a sectional view of a heat dissipation structure for heat dissipation unit according to a fourth embodiment of the present invention;
  • FIG. 6 is a sectional view of a heat dissipation structure for heat dissipation unit according to a fifth embodiment of the present invention;
  • FIG. 7 is a sectional view of a heat dissipation structure for heat dissipation unit according to a sixth embodiment of the present invention;
  • FIG. 8 is a sectional view of a heat dissipation structure for heat dissipation unit according to a seventh embodiment of the present invention;
  • FIG. 9 is a sectional view of a heat dissipation structure for heat dissipation unit according to an eighth embodiment of the present invention;
  • FIG. 10 is a sectional view of a heat dissipation structure for heat dissipation unit according to a ninth embodiment of the present invention;
  • FIG. 11 is a sectional view of a heat dissipation structure for heat dissipation unit according to a tenth embodiment of the present invention; and
  • FIG. 12 is a sectional view of a heat dissipation structure for heat dissipation unit according to an eleventh embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
  • Please refer to FIG. 1 that is a perspective view of a heat dissipation structure for heat dissipation unit according to a first embodiment of the present invention, and to FIGS. 2 and 2A that are respectively a sectional view taken along line A-A of FIG. 1 and an enlarged view of the circled area of FIG. 2. As shown, in the first embodiment thereof, the heat dissipation structure for heat dissipation unit includes a heat dissipation unit main body 1 that internally defines a chamber 11, in which at least a layer of nanoscale threadlike bodies 111 and a working fluid 112 are provided. The layer of nanoscale threadlike bodies 111 is continuously provided on a whole or part of the inner wall surface of the chamber 11, and is formed of a plurality of individual nanoscale threadlike bodies. The individual nanoscale threadlike bodies respectively have an end fixedly located on the inner wall surface of the chamber 11 and referred to as a fixed connecting end herein, and another opposite end extending toward an interior of the chamber 11 and being a free end. The free ends of the individual nanoscale threadlike bodies can be sharp free ends or blunt free ends, or a combination thereof.
  • The main body 1 can be any one of a vapor chamber, a flat heat pipe, a loop heat pipe, and a heat exchanger. In the illustrated first embodiment of the present invention, the main body 1 is a flat heat pipe without being limited thereto. Further, the chamber 11 has a smooth inner wall surface.
  • Please refer to FIG. 3 that is a sectional view of a heat dissipation structure for heat dissipation unit according to a second embodiment of the present invention. As shown, in the second embodiment, the heat dissipation unit main body 1 is also illustrated as a heat pipe but not necessarily limited thereto, and the layer of nanoscale threadlike bodies 111 axially extends along the inner surface of the chamber 11 of the heat pipe.
  • FIG. 4 is a sectional view of a heat dissipation structure for heat dissipation unit according to a third embodiment of the present invention. As shown, in the third embodiment, the heat dissipation unit main body 1 is also illustrated as a heat pipe but not necessarily limited thereto, and the chamber 11 includes at least a first section 113, a second section 114 and a third section 115 connected to and communicable with one another. The layer of nanoscale threadlike bodies 111 can be selectively provided in any one of the first, the second and the third section 113, 114, 115. In the illustrated third embodiment, the layer of nanoscale threadlike bodies 111 is provided only in the second section 114 but not necessarily restricted thereto.
  • FIG. 5 is a sectional view of a heat dissipation structure for heat dissipation unit according to a fourth embodiment of the present invention. As shown, the fourth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the fourth embodiment is further internally provided with a coating 2, which has both super-hydrophilic and super-hydrophobic properties. The coating 2 is selectively provided in any one of the first, the second and the third section 113, 114, 115. In the illustrated fourth embodiment, the coating 2 is provided in the third section 115.
  • Please refer to FIG. 6 that is a sectional view of a heat dissipation structure for heat dissipation unit according to a fifth embodiment of the present invention. As shown, the fifth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the fifth embodiment is further internally provided with a coating 2, and the coating 2 is provided in the first and the third section 113, 115 of the chamber 11.
  • Please refer to FIG. 7 that is a sectional view of a heat dissipation structure for heat dissipation unit according to a sixth embodiment of the present invention. As shown, the sixth embodiment is generally structurally similar to the second embodiment, except that, in the sixth embodiment, a wick structure 3 is further provided between the inner wall surface of the chamber 11 and the layer of nanoscale threadlike bodies 111. The wick structure 3 can be any one of a sintered powder structure, a mesh structure, a fibrous structure, a porous structure, a grooved structure, and any combinations thereof. In the sixth embodiment, the wick structure is illustrated as a grooved structure without being limited thereto. The grooved structure includes a plurality of grooves formed on and sunken from the inner wall surface of the chamber 11; and the layer of nanoscale threadlike bodies 111 covers both the grooves and the inner wall surface of the chamber 11.
  • FIG. 8 is a sectional view of a heat dissipation structure for heat dissipation unit according to a seventh embodiment of the present invention. As shown, the seventh embodiment is generally structurally similar to the second embodiment, except that, in the seventh embodiment, a coating 2 is further provided between the inner wall surface of the chamber 11 and the layer of nanoscale threadlike bodies 111.
  • FIG. 9 is a sectional view of a heat dissipation structure for heat dissipation unit according to an eighth embodiment of the present invention. As shown, the eighth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the eighth embodiment further includes at least a first section 113, a second section 114 and a third section 115 that are connected to and communicable with one another, and a portion of the layer of nanoscale threadlike bodies 111 provided in the second section 114 has a density higher than that of other portions of the layer of nanoscale threadlike bodies 111 provided in the first and the third section.
  • FIG. 10 is a sectional view of a heat dissipation structure for heat dissipation unit according to a ninth embodiment of the present invention. As shown, the ninth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the ninth embodiment further includes at least a first section 113, a second section 114 and a third section 115 that are connected to and communicable with one another, and a portion of the layer of nanoscale threadlike bodies 111 provided in the second section 114 has a density lower than that of other portions of the layer of nanoscale threadlike bodies 111 provided in the first and the third section.
  • Please refer to FIG. 11 that is a sectional view of a heat dissipation structure for heat dissipation unit according to a tenth embodiment of the present invention. As shown, the tenth embodiment is generally structurally similar to the first embodiment, except that the heat dissipation unit main body 1 in the tenth embodiment is a vapor chamber that internally defines a chamber 11, and the chamber 11 is provided on an inner wall surface with a layer of nanoscale threadlike bodies 111.
  • FIG. 12 is a sectional view of a heat dissipation structure for heat dissipation unit according to an eleventh embodiment of the present invention. As shown, the eleventh embodiment is generally structurally similar to the tenth embodiment, except that, in the eleventh embodiment, a coating 2 is further provided between the inner wall surface of the chamber 11 of the vapor chamber and the layer of nanoscale threadlike bodies 111.
  • In brief, by providing the layer of nanoscale threadlike bodies 111 in the heat pipe, the vapor chamber, the flat heat pipe and the loop heat pipe, the layer of nanoscale threadlike bodies 111 is able to change the surface tension of the working fluid 112 in the chamber 11, so that the working fluid 112 can flow back at an increased speed to provide excellent vapor/liquid cycling efficiency for the heat dissipation unit to have largely upgraded heat transfer performance.
  • The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (30)

What is claimed is:
1. A heat dissipation structure for heat dissipation unit, comprising a heat dissipation unit main body internally defining a chamber, the chamber being internally provided with at least a layer of nanoscale threadlike bodies and a working fluid, and the layer of nanoscale threadlike bodies being continuously provided on an inner wall surface of the chamber.
2. The heat dissipation structure for heat dissipation unit as claimed in claim 1, wherein the heat dissipation unit main body is a heat pipe, and the chamber includes at least a first, a second and a third section, which are connected to and communicable with one another; and the layer of nanoscale threadlike bodies being provided in one of or each of the first, the second, and the third section.
3. The heat dissipation structure for heat dissipation unit as claimed in claim 1, wherein the inner wall surface of the chamber is a smooth wall surface.
4. The heat dissipation structure for heat dissipation unit as claimed in claim 2, wherein the chamber is further internally provided with a coating, and the coating being selectively provided in any one of the first, the second, and the third section.
5. The heat dissipation structure for heat dissipation unit as claimed in claim 1, wherein the heat dissipation unit main body is selected from the group consisting of a vapor chamber, a heat pipe, a loop heat pipe, and a heat exchanger.
6. The heat dissipation structure for heat dissipation unit as claimed in claim 1, wherein the chamber is further internally provided between the inner wall surface and the layer of nanoscale threadlike bodies with a wick structure.
7. The heat dissipation structure for heat dissipation unit as claimed in claim 6, wherein the wick structure is selected from the group consisting of a sintered powder structure, a mesh structure, a fibrous structure, a porous structure, and a grooved structure.
8. The heat dissipation structure for heat dissipation unit as claimed in claim 1, wherein the heat dissipation unit main body is a heat pipe, and the layer of nanoscale threadlike bodies being axially extended over the inner wall surface of the chamber of the heat pipe.
9. The heat dissipation structure for heat dissipation unit as claimed in claim 2, wherein a portion of the layer of nanoscale threadlike bodies provided in the second section of the chamber has a density higher than that of other portions of the layer of nanoscale threadlike bodies provided in the first and the third section.
10. The heat dissipation structure for heat dissipation unit as claimed in claim 2, wherein a portion of the layer of nanoscale threadlike bodies provided in the second section of the chamber has a density lower than that of other portions of the layer of nanoscale threadlike bodies provided in the first and the third section.
11. The heat dissipation structure for heat dissipation unit as claimed in claim 1, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
12. The heat dissipation structure for heat dissipation unit as claimed in claim 2, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
13. The heat dissipation structure for heat dissipation unit as claimed in claim 3, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
14. The heat dissipation structure for heat dissipation unit as claimed in claim 4, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
15. The heat dissipation structure for heat dissipation unit as claimed in claim 5, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
16. The heat dissipation structure for heat dissipation unit as claimed in claim 6, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
17. The heat dissipation structure for heat dissipation unit as claimed in claim 7, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
18. The heat dissipation structure for heat dissipation unit as claimed in claim 8, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
19. The heat dissipation structure for heat dissipation unit as claimed in claim 9, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
20. The heat dissipation structure for heat dissipation unit as claimed in claim 10, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being sharp ends.
21. The heat dissipation structure for heat dissipation unit as claimed in claim 1, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
22. The heat dissipation structure for heat dissipation unit as claimed in claim 2, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
23. The heat dissipation structure for heat dissipation unit as claimed in claim 3, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
24. The heat dissipation structure for heat dissipation unit as claimed in claim 4, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
25. The heat dissipation structure for heat dissipation unit as claimed in claim 5, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
26. The heat dissipation structure for heat dissipation unit as claimed in claim 6, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
27. The heat dissipation structure for heat dissipation unit as claimed in claim 7, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
28. The heat dissipation structure for heat dissipation unit as claimed in claim 8, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
29. The heat dissipation structure for heat dissipation unit as claimed in claim 9, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
30. The heat dissipation structure for heat dissipation unit as claimed in claim 10, wherein the layer of nanoscale threadlike bodies is formed of a plurality of individual nanoscale threadlike bodies; the individual nanoscale threadlike bodies respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual nanoscale threadlike bodies being a combination of sharp free ends and blunt free ends.
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