US20120043059A1 - Loop heat pipe - Google Patents
Loop heat pipe Download PDFInfo
- Publication number
- US20120043059A1 US20120043059A1 US12/911,005 US91100510A US2012043059A1 US 20120043059 A1 US20120043059 A1 US 20120043059A1 US 91100510 A US91100510 A US 91100510A US 2012043059 A1 US2012043059 A1 US 2012043059A1
- Authority
- US
- United States
- Prior art keywords
- liquid
- heat pipe
- main body
- separator
- loop heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure generally relates to heat transfer apparatuses, and particularly to a loop heat pipe with a high heat transfer efficiency.
- Loop heat pipes are widely used for heat dissipation purposes because of their excellent heat transfer efficiency.
- a commonly used loop heat pipe includes an evaporator thermally attached to a heat-generating electronic component, a condenser, and a vapor line and a liquid line respectively interconnected between the evaporator and the condenser.
- a predetermined quantity of bi-phase working medium is contained in the closed loop. The working medium conveys heat from the evaporator to the condenser.
- a wick structure, lining an inner surface of the evaporator draws the working medium back to the evaporator after it condenses at the condenser.
- the vapor cannot be condensed fully to a liquid state working medium at the condenser.
- the condensate adjacent to the condenser is a mixture of a vapor state working medium and a liquid state working medium.
- the vapor state working medium entering the liquid line will obstruct the liquid state working medium flowing back to the evaporator.
- the liquid state working medium may not move towards the evaporator in a timely manner, and the evaporator may be prone to dry out.
- FIG. 1 is an isometric view of a loop heat pipe according to a first embodiment of the present disclosure.
- FIG. 2 is a bottom view of the loop heat pipe of FIG. 1 .
- FIG. 3 is an isometric view of a loop heat pipe according to a second embodiment of the present disclosure.
- a loop heat pipe 10 includes an evaporator 11 , a condenser 12 , a separator 15 , and a vapor line 13 and a liquid line 14 connecting the evaporator 11 , the condenser 12 , and the separator 15 to form a closed loop.
- the separator 15 is part of the liquid line 14 .
- a predetermined quantity of bi-phase working medium (not shown) is filled in the closed loop.
- the working medium is a liquid, which has a low boiling point such as water, methanol, or alcohol. Thus, the working medium can easily evaporate to vapor when it absorbs the heat transferred to the evaporator 11 and condenses to liquid when heat is transferred to the atmosphere at the condenser 12 .
- the evaporator 11 can be rectangular and have a flat shape, and include a liquid inlet 110 connected to the liquid line 14 and a vapor outlet 112 connected to the vapor line 13 .
- a wick structure (not shown) consists of a porous structure, such as a screen mesh, fiber inserted into the evaporator 11 and held against an inner surface of the evaporator 11 , or sintered powder combined to the inner surface of the evaporator 11 using a sintering process.
- the evaporator 11 thermally connects a heat-generating electronic component to absorb heat generated therefrom.
- Each of the condenser 12 , the vapor line 13 , and the liquid line 14 is an elongated hollow tube.
- the condenser 12 can be parallel to the evaporator 11 , and includes a vapor inlet 121 connected to the vapor line 13 , and a liquid outlet 123 connected to the liquid line 14 .
- a heat dissipation component (not shown) thermally contacts an outer surface of the condenser 12 to dissipate heat to the atmosphere.
- the heat dissipation component can be a fin-type heat sink. Although not shown, the heat dissipation component can include fins for increasing the heat dissipation efficiency thereof.
- the vapor line 13 and the liquid line 14 can be parallel to each other.
- the diameter of the vapor line 13 is substantially equal to that of the liquid line 14 .
- the diameter of the vapor line 13 and the diameter of the liquid line 14 can vary, only to ensure that the diameter of the liquid inlet 110 is no larger than the diameter of the liquid outlet 123 .
- the separator 15 is located at a middle portion of the liquid line 14 .
- the separator 15 includes an elongated hollow cylindrical main body 150 , and a tapered entrance 151 and a reverse tapered exit 153 respectively located at two opposite ends of the main body 150 .
- the entrance 151 is located adjacent to the liquid outlet 123 of the condenser 12 .
- the exit 153 is located adjacent to the liquid inlet 110 of the evaporator 11 .
- the separator 15 separates the liquid line 14 into a first portion 141 connected between the liquid outlet 123 and the entrance 151 , and a second portion 142 connected between the exit 153 and the liquid inlet 110 .
- the entrance 151 can have a trapezoid cross-section, with a diameter gradually increasing from the first portion 141 of the liquid line 14 towards the main body 150 .
- a diameter of the main body 150 of the separator 15 is larger than that of the liquid line 14 .
- a capacitance of the separator 15 is larger than that of a portion of the liquid line 14 , which has substantially the same length as the separator 15 .
- the diameter of the main body 150 is about twice as large as the liquid line 14 .
- the exit 153 has a similar cross-section as the entrance 151 but only differs in orientation, with the diameter gradually decreasing from the main body 153 towards the second portion 142 of the liquid line 14 .
- the working medium in the evaporator 11 absorbs heat from the heat-generating electronic component and vaporizes to a vapor state working medium.
- the vapor pressure of the vapor state working medium expels the vapor state working medium, carrying heat with it, to flow through the vapor line 13 by the vapor outlet 112 of the evaporator 11 .
- the vapor state working medium enters into the condenser 12 by the vapor inlet 121 .
- the vapor state working medium dissipates the heat to ambient environment and condenses to a condensed working medium.
- the condensed working medium flowing out of the liquid outlet 123 of the condenser 12 is then propelled through the first portion 141 of the liquid line 14 , the separator 15 , and the second portion 142 of the liquid line 14 in that order, and moves into the evaporator 11 by the liquid inlet 110 thereof.
- the condensed working medium at the evaporator 10 then evaporates into vapor again to start another heat transfer cycle.
- the vapor state working medium may not be thoroughly condensed to a liquid state working medium at the condenser 12 . That is, during each heat transfer cycle, some of the vapor state working medium is not condensed to a liquid state working medium at the condenser 12 , resulting in the condensed working medium flowing out of the liquid outlet 123 of the condenser 12 and forming a mixture of a liquid state working medium and a vapor state working medium.
- the separator 15 Due to the presence of the separator 15 , when the condensed working medium flows from the condenser 12 towards the evaporator 11 by the liquid line 14 , the separator 15 separates the liquid state working medium from the vapor state working medium flowing therethrough and then supplies the liquid state working medium to the evaporator 11 continuously.
- the separator 15 can separate the liquid state working medium from the vapor state working medium when the working medium flows therethrough, to allow the liquid state working medium to flow smoothly to the evaporator 11 without obstruction of the vapor state working medium.
- the diameter of the exit 153 gradually decreases from the main body 150 towards the second portion 142 of the liquid inlet 14 . This connects the liquid inlet 110 of the evaporator 11 , such that the speed of the liquid state working medium flowing out of the separator 15 towards the liquid inlet 110 of the evaporator 11 , is properly controlled.
- FIG. 3 shows a loop heat pipe 20 according to a second embodiment.
- the loop heat pipe 20 differs from the loop heat pipe 10 of the first embodiment only in the shape of the separator 25 thereof.
- the separator 25 includes a tapered main body 251 connected to the first portion 141 of the liquid line 14 and a reverse tapered exit 252 connected to the second portion 142 of the liquid line 14 .
- the diameter of the main body 251 gradually increases from the first portion 141 of the liquid line 14 towards the exit 252 .
- the largest diameter of the main body 251 is much larger than the diameter of the liquid line 14 , which makes a capacitance of the separator 25 larger than that of a portion of the liquid line 14 , which has the same length as the separator 25 .
- the largest diameter of the main body 251 is about three times as large as the liquid line 14 .
- the exit 252 has a diameter gradually decreasing from the entrance towards the second portion 142 of the liquid line 14 .
- the separator 25 can separate the liquid state working medium from the vapor state working medium in the same manner of the loop heat pipe 10 .
Abstract
Description
- This application claims all benefits accruing under 35 U.S.C. §119 from China Patent Application No. 201010258764.2, filed on Aug. 20, 2010, in the China Intellectual Property Office, the contents of which are hereby incorporated by reference.
- 1. Technical Field
- The disclosure generally relates to heat transfer apparatuses, and particularly to a loop heat pipe with a high heat transfer efficiency.
- 2. Description of Related Art
- Loop heat pipes are widely used for heat dissipation purposes because of their excellent heat transfer efficiency. A commonly used loop heat pipe includes an evaporator thermally attached to a heat-generating electronic component, a condenser, and a vapor line and a liquid line respectively interconnected between the evaporator and the condenser. A predetermined quantity of bi-phase working medium is contained in the closed loop. The working medium conveys heat from the evaporator to the condenser. A wick structure, lining an inner surface of the evaporator, draws the working medium back to the evaporator after it condenses at the condenser.
- However, in the operation of the loop heat pipe, the vapor cannot be condensed fully to a liquid state working medium at the condenser. Instead, the condensate adjacent to the condenser is a mixture of a vapor state working medium and a liquid state working medium. The vapor state working medium entering the liquid line will obstruct the liquid state working medium flowing back to the evaporator. Thus, the liquid state working medium may not move towards the evaporator in a timely manner, and the evaporator may be prone to dry out.
- What is needed, therefore, is a means which can overcome the described limitations.
-
FIG. 1 is an isometric view of a loop heat pipe according to a first embodiment of the present disclosure. -
FIG. 2 is a bottom view of the loop heat pipe ofFIG. 1 . -
FIG. 3 is an isometric view of a loop heat pipe according to a second embodiment of the present disclosure. - Reference will now be made to the figures to describe the present loop heat pipe in detail.
- Referring to
FIGS. 1 and 2 , aloop heat pipe 10 according to a first embodiment of the present disclosure includes anevaporator 11, acondenser 12, aseparator 15, and avapor line 13 and aliquid line 14 connecting theevaporator 11, thecondenser 12, and theseparator 15 to form a closed loop. Theseparator 15 is part of theliquid line 14. A predetermined quantity of bi-phase working medium (not shown) is filled in the closed loop. The working medium is a liquid, which has a low boiling point such as water, methanol, or alcohol. Thus, the working medium can easily evaporate to vapor when it absorbs the heat transferred to theevaporator 11 and condenses to liquid when heat is transferred to the atmosphere at thecondenser 12. - The
evaporator 11 can be rectangular and have a flat shape, and include aliquid inlet 110 connected to theliquid line 14 and avapor outlet 112 connected to thevapor line 13. A wick structure (not shown) consists of a porous structure, such as a screen mesh, fiber inserted into theevaporator 11 and held against an inner surface of theevaporator 11, or sintered powder combined to the inner surface of theevaporator 11 using a sintering process. Theevaporator 11 thermally connects a heat-generating electronic component to absorb heat generated therefrom. - Each of the
condenser 12, thevapor line 13, and theliquid line 14 is an elongated hollow tube. Thecondenser 12 can be parallel to theevaporator 11, and includes avapor inlet 121 connected to thevapor line 13, and aliquid outlet 123 connected to theliquid line 14. A heat dissipation component (not shown) thermally contacts an outer surface of thecondenser 12 to dissipate heat to the atmosphere. The heat dissipation component can be a fin-type heat sink. Although not shown, the heat dissipation component can include fins for increasing the heat dissipation efficiency thereof. - The
vapor line 13 and theliquid line 14 can be parallel to each other. The diameter of thevapor line 13 is substantially equal to that of theliquid line 14. Alternatively, the diameter of thevapor line 13 and the diameter of theliquid line 14 can vary, only to ensure that the diameter of theliquid inlet 110 is no larger than the diameter of theliquid outlet 123. - The
separator 15 is located at a middle portion of theliquid line 14. Theseparator 15 includes an elongated hollow cylindricalmain body 150, and atapered entrance 151 and a reversetapered exit 153 respectively located at two opposite ends of themain body 150. Theentrance 151 is located adjacent to theliquid outlet 123 of thecondenser 12. Theexit 153 is located adjacent to theliquid inlet 110 of theevaporator 11. Theseparator 15 separates theliquid line 14 into afirst portion 141 connected between theliquid outlet 123 and theentrance 151, and asecond portion 142 connected between theexit 153 and theliquid inlet 110. Theentrance 151 can have a trapezoid cross-section, with a diameter gradually increasing from thefirst portion 141 of theliquid line 14 towards themain body 150. A diameter of themain body 150 of theseparator 15 is larger than that of theliquid line 14. Thus, a capacitance of theseparator 15 is larger than that of a portion of theliquid line 14, which has substantially the same length as theseparator 15. In this embodiment, the diameter of themain body 150 is about twice as large as theliquid line 14. Theexit 153 has a similar cross-section as theentrance 151 but only differs in orientation, with the diameter gradually decreasing from themain body 153 towards thesecond portion 142 of theliquid line 14. - During operation of the
loop heat pipe 10, the working medium in theevaporator 11 absorbs heat from the heat-generating electronic component and vaporizes to a vapor state working medium. The vapor pressure of the vapor state working medium expels the vapor state working medium, carrying heat with it, to flow through thevapor line 13 by thevapor outlet 112 of theevaporator 11. Then, the vapor state working medium enters into thecondenser 12 by thevapor inlet 121. At thecondenser 12, the vapor state working medium dissipates the heat to ambient environment and condenses to a condensed working medium. The condensed working medium flowing out of theliquid outlet 123 of thecondenser 12 is then propelled through thefirst portion 141 of theliquid line 14, theseparator 15, and thesecond portion 142 of theliquid line 14 in that order, and moves into theevaporator 11 by theliquid inlet 110 thereof. The condensed working medium at theevaporator 10 then evaporates into vapor again to start another heat transfer cycle. - In each heat transfer cycle described above, the vapor state working medium may not be thoroughly condensed to a liquid state working medium at the
condenser 12. That is, during each heat transfer cycle, some of the vapor state working medium is not condensed to a liquid state working medium at thecondenser 12, resulting in the condensed working medium flowing out of theliquid outlet 123 of thecondenser 12 and forming a mixture of a liquid state working medium and a vapor state working medium. Due to the presence of theseparator 15, when the condensed working medium flows from thecondenser 12 towards theevaporator 11 by theliquid line 14, theseparator 15 separates the liquid state working medium from the vapor state working medium flowing therethrough and then supplies the liquid state working medium to theevaporator 11 continuously. - More specifically, when the condensed working medium flows through the
separator 15, the liquid state working medium contained in the condensed working medium directly drips down from a centre of theentrance 151 towards theexit 153, while the vapor state working medium circumfuses to accumulate in the interior of themain body 150. Further, the vapor state working medium contained in the interior of theseparator 15 dissipates the heat to the ambient environment at theseparator 15 and condenses to a liquid state working medium to flow to theevaporator 11 by theexit 153. Thus, theseparator 15 can separate the liquid state working medium from the vapor state working medium when the working medium flows therethrough, to allow the liquid state working medium to flow smoothly to theevaporator 11 without obstruction of the vapor state working medium. The diameter of theexit 153 gradually decreases from themain body 150 towards thesecond portion 142 of theliquid inlet 14. This connects theliquid inlet 110 of theevaporator 11, such that the speed of the liquid state working medium flowing out of theseparator 15 towards theliquid inlet 110 of theevaporator 11, is properly controlled. -
FIG. 3 shows aloop heat pipe 20 according to a second embodiment. Theloop heat pipe 20 differs from theloop heat pipe 10 of the first embodiment only in the shape of theseparator 25 thereof. Theseparator 25 includes a taperedmain body 251 connected to thefirst portion 141 of theliquid line 14 and a reversetapered exit 252 connected to thesecond portion 142 of theliquid line 14. The diameter of themain body 251 gradually increases from thefirst portion 141 of theliquid line 14 towards theexit 252. The largest diameter of themain body 251 is much larger than the diameter of theliquid line 14, which makes a capacitance of theseparator 25 larger than that of a portion of theliquid line 14, which has the same length as theseparator 25. In this embodiment, the largest diameter of themain body 251 is about three times as large as theliquid line 14. Theexit 252 has a diameter gradually decreasing from the entrance towards thesecond portion 142 of theliquid line 14. In this embodiment, theseparator 25 can separate the liquid state working medium from the vapor state working medium in the same manner of theloop heat pipe 10. - It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102587642A CN102374803A (en) | 2010-08-20 | 2010-08-20 | Loop heat pipe |
CN201010258764.2 | 2010-08-20 |
Publications (1)
Publication Number | Publication Date |
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US20120043059A1 true US20120043059A1 (en) | 2012-02-23 |
Family
ID=45593147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/911,005 Abandoned US20120043059A1 (en) | 2010-08-20 | 2010-10-25 | Loop heat pipe |
Country Status (2)
Country | Link |
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US (1) | US20120043059A1 (en) |
CN (1) | CN102374803A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160011635A1 (en) * | 2014-07-11 | 2016-01-14 | Fujitsu Limited | Cooling system and electronic device |
US20190339022A1 (en) * | 2018-05-04 | 2019-11-07 | Tai-Sol Electronics Co., Ltd. | Loop vapor chamber |
US11320210B2 (en) * | 2018-07-11 | 2022-05-03 | Shinko Electric Industries Co., Ltd. | Loop heat pipe where porous body is in contact with pipe wall of liquid pipe |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103851939A (en) * | 2012-12-07 | 2014-06-11 | 林唯耕 | Loop-type heat transfer structure |
CN103217034B (en) * | 2013-03-29 | 2015-08-26 | 瞿红 | Heat exchange of heat pipe assembly |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1602354A (en) * | 1925-03-05 | 1926-10-05 | Fowler Charles | Separator |
US2482137A (en) * | 1945-02-13 | 1949-09-20 | Lummus Co | Process and apparatus for converting hydrocarbons |
US6530420B1 (en) * | 1999-09-17 | 2003-03-11 | Sanyo Electric Co., Ltd. | Heat carrier |
US6582500B1 (en) * | 2000-08-15 | 2003-06-24 | University Of Maryland | Electrohydrodynamic liquid-vapor separator |
US6810946B2 (en) * | 2001-12-21 | 2004-11-02 | Tth Research, Inc. | Loop heat pipe method and apparatus |
US20080078530A1 (en) * | 2006-10-02 | 2008-04-03 | Foxconn Technology Co., Ltd. | Loop heat pipe with flexible artery mesh |
US20090284926A1 (en) * | 2008-05-14 | 2009-11-19 | Abb Research Ltd | Two-phase cooling circuit |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0415434A (en) * | 1990-05-10 | 1992-01-20 | Matsushita Electric Ind Co Ltd | Heat conveyor |
US5948556A (en) * | 1997-10-22 | 1999-09-07 | Space Systems/Loral, Inc. | Massively parallel spacecraft battery cell module design |
CN2472782Y (en) * | 2001-04-24 | 2002-01-23 | 中国石油化工股份有限公司 | Gas/liquid separator of acrylonitrile |
CN100386587C (en) * | 2006-06-12 | 2008-05-07 | 北京科技大学 | Pump-free self-circulation non-vacuum split type gravity heat pipe |
-
2010
- 2010-08-20 CN CN2010102587642A patent/CN102374803A/en active Pending
- 2010-10-25 US US12/911,005 patent/US20120043059A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1602354A (en) * | 1925-03-05 | 1926-10-05 | Fowler Charles | Separator |
US2482137A (en) * | 1945-02-13 | 1949-09-20 | Lummus Co | Process and apparatus for converting hydrocarbons |
US6530420B1 (en) * | 1999-09-17 | 2003-03-11 | Sanyo Electric Co., Ltd. | Heat carrier |
US6582500B1 (en) * | 2000-08-15 | 2003-06-24 | University Of Maryland | Electrohydrodynamic liquid-vapor separator |
US6810946B2 (en) * | 2001-12-21 | 2004-11-02 | Tth Research, Inc. | Loop heat pipe method and apparatus |
US20080078530A1 (en) * | 2006-10-02 | 2008-04-03 | Foxconn Technology Co., Ltd. | Loop heat pipe with flexible artery mesh |
US20090284926A1 (en) * | 2008-05-14 | 2009-11-19 | Abb Research Ltd | Two-phase cooling circuit |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160011635A1 (en) * | 2014-07-11 | 2016-01-14 | Fujitsu Limited | Cooling system and electronic device |
US9625962B2 (en) * | 2014-07-11 | 2017-04-18 | Fujitsu Limited | Cooling system and electronic device |
US20190339022A1 (en) * | 2018-05-04 | 2019-11-07 | Tai-Sol Electronics Co., Ltd. | Loop vapor chamber |
US11320210B2 (en) * | 2018-07-11 | 2022-05-03 | Shinko Electric Industries Co., Ltd. | Loop heat pipe where porous body is in contact with pipe wall of liquid pipe |
Also Published As
Publication number | Publication date |
---|---|
CN102374803A (en) | 2012-03-14 |
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Legal Events
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AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XU, CHAO;HU, JIANG-JUN;WANG, DE-YU;AND OTHERS;REEL/FRAME:025187/0173 Effective date: 20101012 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XU, CHAO;HU, JIANG-JUN;WANG, DE-YU;AND OTHERS;REEL/FRAME:025187/0173 Effective date: 20101012 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |