US20130105131A1 - Flattened heat pipe - Google Patents
Flattened heat pipe Download PDFInfo
- Publication number
- US20130105131A1 US20130105131A1 US13/349,813 US201213349813A US2013105131A1 US 20130105131 A1 US20130105131 A1 US 20130105131A1 US 201213349813 A US201213349813 A US 201213349813A US 2013105131 A1 US2013105131 A1 US 2013105131A1
- Authority
- US
- United States
- Prior art keywords
- annular wall
- wick
- wick structure
- attached
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to heat pipes, particularly to flattened heat pipes used for transferring heat from a heat source.
- Heat pipes which are used for heat sources such as CPUs, can effectively overcome more and more heat generated from electronic heat sources.
- heat pipes have become necessary for heat sinks with high efficiency of heat dissipation.
- portable electronic devices are very popular around the world. As a result, heat sinks must be continuously improved to satisfy their requirements.
- a typical heat pipe includes a circular tube, a wick structure and a working fluid.
- a chamber is formed in the circular tube.
- the wick structure is attached on an inner side of the tube.
- the working fluid is filled in the chamber and contained in the wick structure.
- the circular tube is not suitable for thinned electronic devices.
- the wick structure is of a single type, so it will make the internal heated vapor flows too fast when its density is large. This will cause dryout easily. When the density of the wick structure is small, the heated vapor flows too slowly. This will decrease the efficiency of heat transfer.
- An object of the invention is to provide a flattened heat pipe, which can increase flowing speed of the internal vapor and liquid and improve efficiency of heat transfer.
- the flattened heat pipe of the invention includes a flattened tube, a first wick structure, a second wick structure and a working fluid.
- the flattened tube has an annular wall and a chamber formed within the annular wall.
- the first wick structure is disposed on a portion of the annular wall.
- the second wick structure is disposed on another portion of the annular wall, and not overlapping with each other.
- the working fluid is filled in the chamber.
- the flattened heat pipe of the invention includes a flattened tube, a first wick structure, a second wick structure and a working fluid.
- the flattened tube has an annular wall and a chamber formed within the annular wall.
- the first wick structure is disposed on a portion of the annular wall and continuously over a front half and a rear half of the flattened tube.
- the second wick structure is disposed on another portion of the annular wall and continuously over a front half and a rear half of the flattened tube, and not overlapping with each other and not overlapping with each other.
- the working fluid is filled in the chamber.
- the invention arranges two layers of wick structures with different density. This can promote the vapor to flow fast and add volume of the internal liquid contained in the wick structure for preventing from dryouting.
- FIG. 1 is a perspective view of the invention
- FIG. 2 is a sectional view of the first embodiment of the invention
- FIG. 3 is a sectional view of the second embodiment of the invention.
- FIG. 4 is a sectional view of the third embodiment of the invention.
- FIG. 5 is a sectional view of the fourth embodiment of the invention.
- FIG. 6 is a sectional view of the fifth embodiment of the invention.
- FIG. 7 is a sectional view of the sixth embodiment of the invention.
- FIG. 8 is a sectional view of the seventh embodiment of the invention.
- the flatten heat pipe of the invention includes a flattened tube 10 , a first wick structure 20 , a second wick structure 30 and a working fluid 40 .
- the flattened tube 10 is made of copper, aluminum or their alloys with great thermo-conductivity and tractility.
- the tube 10 of the shown embodiment is of a strip shape and composed of an upper sheet 11 , a lower sheet 12 and two arcked sheets 13 connecting therebetween. These sheets 11 , 12 , 13 constitute an annular wall 10 a. Two ends of the tube 10 are sealed by welding.
- a chamber 14 is formed within the sheets 11 , 12 , 13 .
- the overall height of the upper sheet 11 , the lower sheet 12 and the chamber 14 is less than 2 mm.
- the first wick structure 20 is a plurality of grooves 201 formed on the right area of the upper sheet 11 and the lower sheet 12 and the right arcked sheet 13 .
- the first wick structure 20 continuously covers the front half and the rear half of the tube 10 along an axis of the tube 10 .
- the second wick structure 30 is attached on the left area of the upper sheet 11 and the lower sheet 12 and the left arcked sheet 13 .
- the second wick structure 30 continuously covers the front half and the rear half of the tube 10 along an axis of the tube 10 .
- the second wick structure 30 is sintered metal powder and does not overlap with the first wick structure 20 .
- edges of the first and second wick structures 20 , 30 may be in contact with each other as shown in the figures or may be out of contact with each other.
- the working fluid 40 may be pure water or alcohol filled in the chamber 14 . At a room temperature, the working fluid 40 is liquid and contained in the wick structures 20 , 30 . The working fluid 40 will be evaporated to transfer a large amount of heat to an area with lower temperature when it is heated.
- the first wick structure 20 is a plurality of grooves 201 formed on the right area of the upper sheet 11 and the lower sheet 12 and the right arcked sheet 13 .
- the second wick structure 30 a is attached on the left area of the upper sheet 11 and the lower sheet 12 and the left arcked sheet 13 .
- the second wick structure 30 a is a mesh structure woven by metal wires. The mesh structure does not overlap with the grooves 201 as the first wick structure 20 .
- the first wick structure 20 is a plurality of grooves 201 formed on the right area of the upper sheet 11 and the lower sheet 12 and the right arcked sheet 13 .
- the second wick structure 30 b is a bundle of fibers attached on the left area of the upper sheet 11 and the lower sheet 12 and the left arcked sheet 13 . The bundle of fibers does not overlap with the grooves 201 as the first wick structure 20 .
- FIG. 5 shows the fourth embodiment of the invention.
- the first wick structure 20 a is attached on the right area of the upper sheet 11 and the lower sheet 12 and the right arcked sheet 13 .
- the first wick structure 20 a is formed by sintered metal powder with a plurality of grooves 201 a.
- the second wick structure 30 is the same as the first embodiment.
- FIG. 6 shows the fifth embodiment of the invention.
- the first wick structure 20 b is attached on the right area of the upper sheet 11 and the lower sheet 12 , the right arcked sheet 13 and the right portion of the chamber 14 .
- the first wick structure 20 b is formed by sintered metal powder.
- the second wick structure 30 a is the same as the second embodiment, thereby volume of the liquid contained in the wick structures 20 b, 30 a can be increased.
- FIG. 7 shows the sixth embodiment of the invention.
- the first wick structure 20 c is attached on the right area of the upper sheet 11 and the lower sheet 12 and the right arcked sheet 13 .
- the first wick structure 20 c is a mesh structure.
- the second wick structure 30 c is attached on the left area of the upper sheet 11 and the lower sheet 12 and the left arcked sheet 13 .
- the second wick structure 30 c is a mesh structure, too.
- a pair of third wick structures 50 are separately disposed on the middle portions of the upper and lower sheets 11 , 12 .
- the pair of third wick structures 50 are made of sintered metal powder and in contact with each other. Other arrangements and shapes are available.
- the two third wick structures 50 may be out of contact with each other (not shown).
- the third wick structures 50 can increase volume of the liquid contained therein to prevent from dryouting.
- the first wick structure 20 is a plurality of grooves 201 formed on the right area of the upper sheet 11 and the lower sheet 12 and the right arcked sheet 13 .
- the second wick structure 30 d is attached on the left area of the upper sheet 11 and the lower sheet 12 and the left arcked sheet 13 .
- the second wick structure 30 d is sintered metal powder.
- the middle portion of the upper sheet 11 is formed with a smooth surface 60 for increasing vapor flow space and reducing vapor flow resistance.
Abstract
The flattened heat pipe includes a flattened tube, a first wick structure, a second wick structure and a working fluid. The flattened tube has an annular wall and a chamber formed within the annular wall. The first wick structure is disposed on a portion of the annular wall. The second wick structure is disposed on another portion of the annular wall, and not overlapping with each other. The working fluid is filled in the chamber.
Description
- 1. Technical Field
- The invention relates to heat pipes, particularly to flattened heat pipes used for transferring heat from a heat source.
- 2. Related Art
- Heat pipes, which are used for heat sources such as CPUs, can effectively overcome more and more heat generated from electronic heat sources. Thus heat pipes have become necessary for heat sinks with high efficiency of heat dissipation. In recent years, portable electronic devices are very popular around the world. As a result, heat sinks must be continuously improved to satisfy their requirements.
- A typical heat pipe includes a circular tube, a wick structure and a working fluid. A chamber is formed in the circular tube. The wick structure is attached on an inner side of the tube. The working fluid is filled in the chamber and contained in the wick structure.
- However, the circular tube is not suitable for thinned electronic devices. Further, the wick structure is of a single type, so it will make the internal heated vapor flows too fast when its density is large. This will cause dryout easily. When the density of the wick structure is small, the heated vapor flows too slowly. This will decrease the efficiency of heat transfer.
- An object of the invention is to provide a flattened heat pipe, which can increase flowing speed of the internal vapor and liquid and improve efficiency of heat transfer.
- To accomplish the above object, the flattened heat pipe of the invention includes a flattened tube, a first wick structure, a second wick structure and a working fluid. The flattened tube has an annular wall and a chamber formed within the annular wall. The first wick structure is disposed on a portion of the annular wall. The second wick structure is disposed on another portion of the annular wall, and not overlapping with each other. The working fluid is filled in the chamber.
- To accomplish the above object, the flattened heat pipe of the invention includes a flattened tube, a first wick structure, a second wick structure and a working fluid. The flattened tube has an annular wall and a chamber formed within the annular wall. The first wick structure is disposed on a portion of the annular wall and continuously over a front half and a rear half of the flattened tube. The second wick structure is disposed on another portion of the annular wall and continuously over a front half and a rear half of the flattened tube, and not overlapping with each other and not overlapping with each other. The working fluid is filled in the chamber.
- The invention arranges two layers of wick structures with different density. This can promote the vapor to flow fast and add volume of the internal liquid contained in the wick structure for preventing from dryouting.
-
FIG. 1 is a perspective view of the invention; -
FIG. 2 is a sectional view of the first embodiment of the invention; -
FIG. 3 is a sectional view of the second embodiment of the invention; -
FIG. 4 is a sectional view of the third embodiment of the invention; -
FIG. 5 is a sectional view of the fourth embodiment of the invention; -
FIG. 6 is a sectional view of the fifth embodiment of the invention; -
FIG. 7 is a sectional view of the sixth embodiment of the invention; and -
FIG. 8 is a sectional view of the seventh embodiment of the invention. - Please refer to
FIGS. 1 and 2 . The flatten heat pipe of the invention includes aflattened tube 10, afirst wick structure 20, asecond wick structure 30 and a workingfluid 40. - The
flattened tube 10 is made of copper, aluminum or their alloys with great thermo-conductivity and tractility. Thetube 10 of the shown embodiment is of a strip shape and composed of anupper sheet 11, alower sheet 12 and twoarcked sheets 13 connecting therebetween. Thesesheets annular wall 10 a. Two ends of thetube 10 are sealed by welding. Achamber 14 is formed within thesheets upper sheet 11, thelower sheet 12 and thechamber 14 is less than 2 mm. - The
first wick structure 20 is a plurality ofgrooves 201 formed on the right area of theupper sheet 11 and thelower sheet 12 and the right arckedsheet 13. Thefirst wick structure 20 continuously covers the front half and the rear half of thetube 10 along an axis of thetube 10. Thesecond wick structure 30 is attached on the left area of theupper sheet 11 and thelower sheet 12 and the left arckedsheet 13. Also, thesecond wick structure 30 continuously covers the front half and the rear half of thetube 10 along an axis of thetube 10. Thesecond wick structure 30 is sintered metal powder and does not overlap with thefirst wick structure 20. However, edges of the first andsecond wick structures - The working
fluid 40 may be pure water or alcohol filled in thechamber 14. At a room temperature, the workingfluid 40 is liquid and contained in thewick structures fluid 40 will be evaporated to transfer a large amount of heat to an area with lower temperature when it is heated. - Please refer to
FIG. 3 , which shows the second embodiment of the invention. In this embodiment, thefirst wick structure 20 is a plurality ofgrooves 201 formed on the right area of theupper sheet 11 and thelower sheet 12 and the right arckedsheet 13. Thesecond wick structure 30 a is attached on the left area of theupper sheet 11 and thelower sheet 12 and the left arckedsheet 13. Thesecond wick structure 30 a is a mesh structure woven by metal wires. The mesh structure does not overlap with thegrooves 201 as thefirst wick structure 20. - Please refer to
FIG. 4 , which shows the third embodiment of the invention. In this embodiment, thefirst wick structure 20 is a plurality ofgrooves 201 formed on the right area of theupper sheet 11 and thelower sheet 12 and theright arcked sheet 13. Thesecond wick structure 30 b is a bundle of fibers attached on the left area of theupper sheet 11 and thelower sheet 12 and theleft arcked sheet 13. The bundle of fibers does not overlap with thegrooves 201 as thefirst wick structure 20. - Please refer to
FIG. 5 , which shows the fourth embodiment of the invention. In this embodiment, thefirst wick structure 20 a is attached on the right area of theupper sheet 11 and thelower sheet 12 and theright arcked sheet 13. Thefirst wick structure 20 a is formed by sintered metal powder with a plurality ofgrooves 201 a. Thesecond wick structure 30 is the same as the first embodiment. - Please refer to
FIG. 6 , which shows the fifth embodiment of the invention. In this embodiment, thefirst wick structure 20 b is attached on the right area of theupper sheet 11 and thelower sheet 12, theright arcked sheet 13 and the right portion of thechamber 14. Thefirst wick structure 20 b is formed by sintered metal powder. Thesecond wick structure 30 a is the same as the second embodiment, thereby volume of the liquid contained in thewick structures - Please refer to
FIG. 7 , which shows the sixth embodiment of the invention. In this embodiment, thefirst wick structure 20 c is attached on the right area of theupper sheet 11 and thelower sheet 12 and theright arcked sheet 13. Thefirst wick structure 20 c is a mesh structure. Thesecond wick structure 30 c is attached on the left area of theupper sheet 11 and thelower sheet 12 and theleft arcked sheet 13. Thesecond wick structure 30 c is a mesh structure, too. A pair ofthird wick structures 50 are separately disposed on the middle portions of the upper andlower sheets third wick structures 50 are made of sintered metal powder and in contact with each other. Other arrangements and shapes are available. The twothird wick structures 50 may be out of contact with each other (not shown). Thethird wick structures 50 can increase volume of the liquid contained therein to prevent from dryouting. - Please refer to
FIG. 8 , which shows the seventh embodiment of the invention. In this embodiment, thefirst wick structure 20 is a plurality ofgrooves 201 formed on the right area of theupper sheet 11 and thelower sheet 12 and theright arcked sheet 13. Thesecond wick structure 30 d is attached on the left area of theupper sheet 11 and thelower sheet 12 and theleft arcked sheet 13. Thesecond wick structure 30 d is sintered metal powder. Additionally, the middle portion of theupper sheet 11 is formed with asmooth surface 60 for increasing vapor flow space and reducing vapor flow resistance. - It will be appreciated by persons skilled in the art that the above embodiments have been described by way of example only and not in any limitative sense, and that various alterations and modifications are possible without departure from the scope of the invention as defined by the appended claims.
Claims (20)
1. A flattened heat pipe comprising:
a flattened tube, having an annular wall and a chamber formed within the annular wall;
a first wick structure, disposed on a portion of the annular wall;
a second wick structure, disposed on another portion of the annular wall, and not overlapping with each other; and
a working fluid filled in the chamber.
2. The flattened heat pipe of claim 1 , wherein the flattened tube has two parallel sheets, and an overall height of the two sheets and the chamber is less than 2 mm.
3. The flattened heat pipe of claim 1 , wherein the first wick structure is a plurality of grooves formed on the annular wall, and the second wick structure is sintered metal powder attached on the annular wall.
4. The flattened heat pipe of claim 1 , wherein the first wick structure is a plurality of grooves formed on the annular wall, and the second wick structure is a mesh structure attached on the annular wall.
5. The flattened heat pipe of claim 1 , wherein the first wick structure is a plurality of grooves formed on the annular wall, and the second wick structure is a bundle of fibers attached on the annular wall.
6. The flattened heat pipe of claim 1 , wherein the first wick structure is sintered metal powder attached on the annular wall, and the second wick structure is sintered metal powder attached on the annular wall and formed with a plurality of grooves.
7. The flattened heat pipe of claim 1 , wherein the first wick structure is a mesh structure attached on the annular wall, and the second wick structure is sintered metal powder attached on the annular wall.
8. The flattened heat pipe of claim 1 , further comprising a pair of third wick structures, wherein the first wick structure is a mesh structure attached on the annular wall, the second wick structure is a mesh structure attached on the annular wall, and the third wick structures are separately attached on a remaining area of the annular wall, are out of contact with each other and do not overlap with the first and second wick structures.
9. The flattened heat pipe of claim 1 , further comprising a pair of third wick structures, wherein the first wick structure is a mesh structure attached on the annular wall, the second wick structure is a mesh structure attached on the annular wall, and the third wick structures are separately attached on a remaining area of the annular wall, are in contact with each other and do not overlap with the first and second wick structures.
10. The flattened heat pipe of claim 1 , wherein the first wick structure is a plurality of grooves formed on the annular wall, the second wick structure is sintered metal powder attached on the annular wall, and a remaining portion of the annular wall is formed with a smooth surface.
11. A flattened heat pipe comprising:
a flattened tube, having an annular wall and a chamber formed within the annular wall;
a first wick structure, disposed on a portion of the annular wall and continuously over a front half and a rear half of the flattened tube;
a second wick structure, disposed on another portion of the annular wall and continuously over a front half and a rear half of the flattened tube, and not overlapping with each other; and
a working fluid filled in the chamber.
12. The flattened heat pipe of claim 11 , wherein the flattened tube has two parallel sheets, and an overall height of the two sheets and the chamber is less than 2 mm.
13. The flattened heat pipe of claim 11 , wherein the first wick structure is a plurality of grooves formed on the annular wall, and the second wick structure is sintered metal powder attached on the annular wall.
14. The flattened heat pipe of claim 11 , wherein the first wick structure is a plurality of grooves formed on the annular wall, and the second wick structure is a mesh structure attached on the annular wall.
15. The flattened heat pipe of claim 11 , wherein the first wick structure is a plurality of grooves formed on the annular wall, and the second wick structure is a bundle of fibers attached on the annular wall.
16. The flattened heat pipe of claim 11 , wherein the first wick structure is sintered metal powder attached on the annular wall, and the second wick structure is sintered metal powder attached on the annular wall and formed with a plurality of grooves.
17. The flattened heat pipe of claim 11 , wherein the first wick structure is a mesh structure attached on the annular wall, and the second wick structure is sintered metal powder attached on the annular wall.
18. The flattened heat pipe of claim 11 , further comprising a pair of third wick structures, wherein the first wick structure is a mesh structure attached on the annular wall, the second wick structure is a mesh structure attached on the annular wall, and the third wick structures are separately attached on a remaining area of the annular wall, are out of contact with each other and do not overlap with the first and second wick structures.
19. The flattened heat pipe of claim 11 , further comprising a pair of third wick structures, wherein the first wick structure is a mesh structure attached on the annular wall, the second wick structure is a mesh structure attached on the annular wall, and the third wick structures are separately attached on a remaining area of the annular wall, are in contact with each other and do not overlap with the first and second wick structures.
20. The flattened heat pipe of claim 11 , wherein the first wick structure is a plurality of grooves formed on the annular wall, the second wick structure is sintered metal powder attached on the annular wall, and a remaining portion of the annular wall is formed with a smooth surface.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100220210 | 2011-10-27 | ||
TW100220210U TWM426988U (en) | 2011-10-27 | 2011-10-27 | Thin type heat pipe |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130105131A1 true US20130105131A1 (en) | 2013-05-02 |
Family
ID=46464096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/349,813 Abandoned US20130105131A1 (en) | 2011-10-27 | 2012-01-13 | Flattened heat pipe |
Country Status (2)
Country | Link |
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US (1) | US20130105131A1 (en) |
TW (1) | TWM426988U (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160010927A1 (en) * | 2014-07-14 | 2016-01-14 | Fujikura Ltd. | Heat transport device |
EP3131376A4 (en) * | 2014-06-04 | 2017-04-26 | Huawei Technologies Co., Ltd. | Electronic device |
WO2018235936A1 (en) * | 2017-06-23 | 2018-12-27 | 古河電気工業株式会社 | Heat pipe |
US10371458B2 (en) * | 2016-04-07 | 2019-08-06 | Cooler Master Co., Ltd. | Thermal conducting structure |
US11320211B2 (en) * | 2017-04-11 | 2022-05-03 | Cooler Master Co., Ltd. | Heat transfer device |
US11448470B2 (en) | 2018-05-29 | 2022-09-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI733272B (en) * | 2019-12-12 | 2021-07-11 | 國立清華大學 | Vapor chamber device |
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US20070267178A1 (en) * | 2006-05-19 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat pipe |
US20090173475A1 (en) * | 2008-01-07 | 2009-07-09 | Compal Electronics, Inc. | Heat pipe structure and flattened heat pipe structure |
US20120111540A1 (en) * | 2010-11-08 | 2012-05-10 | Foxconn Technology Co., Ltd. | Flat type heat pipe and method for manufacturing the same |
-
2011
- 2011-10-27 TW TW100220210U patent/TWM426988U/en not_active IP Right Cessation
-
2012
- 2012-01-13 US US13/349,813 patent/US20130105131A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070267178A1 (en) * | 2006-05-19 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat pipe |
US20090173475A1 (en) * | 2008-01-07 | 2009-07-09 | Compal Electronics, Inc. | Heat pipe structure and flattened heat pipe structure |
US20120111540A1 (en) * | 2010-11-08 | 2012-05-10 | Foxconn Technology Co., Ltd. | Flat type heat pipe and method for manufacturing the same |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11144101B2 (en) | 2014-06-04 | 2021-10-12 | Huawei Technologies Co., Ltd. | Electronic device |
EP3131376A4 (en) * | 2014-06-04 | 2017-04-26 | Huawei Technologies Co., Ltd. | Electronic device |
US11789504B2 (en) | 2014-06-04 | 2023-10-17 | Huawei Technologies Co., Ltd. | Electronic device |
US10409340B2 (en) | 2014-06-04 | 2019-09-10 | Huawei Technologies Co., Ltd. | Electronic device |
US20160010927A1 (en) * | 2014-07-14 | 2016-01-14 | Fujikura Ltd. | Heat transport device |
US10371458B2 (en) * | 2016-04-07 | 2019-08-06 | Cooler Master Co., Ltd. | Thermal conducting structure |
US10935326B2 (en) * | 2016-04-07 | 2021-03-02 | Cooler Master Co., Ltd. | Thermal conducting structure |
US11313628B2 (en) * | 2016-04-07 | 2022-04-26 | Cooler Master Co., Ltd. | Thermal conducting structure |
US11320211B2 (en) * | 2017-04-11 | 2022-05-03 | Cooler Master Co., Ltd. | Heat transfer device |
US11313627B2 (en) * | 2017-06-23 | 2022-04-26 | Furukawa Electric Co., Ltd. | Heat pipe |
WO2018235936A1 (en) * | 2017-06-23 | 2018-12-27 | 古河電気工業株式会社 | Heat pipe |
US11448470B2 (en) | 2018-05-29 | 2022-09-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11680752B2 (en) | 2018-05-29 | 2023-06-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
Also Published As
Publication number | Publication date |
---|---|
TWM426988U (en) | 2012-04-11 |
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