US20130105135A1 - CMOS Compatible Microchannel Heat Sink for Electronic Cooling and Its Fabrication - Google Patents

CMOS Compatible Microchannel Heat Sink for Electronic Cooling and Its Fabrication Download PDF

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Publication number
US20130105135A1
US20130105135A1 US13/808,591 US201013808591A US2013105135A1 US 20130105135 A1 US20130105135 A1 US 20130105135A1 US 201013808591 A US201013808591 A US 201013808591A US 2013105135 A1 US2013105135 A1 US 2013105135A1
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Prior art keywords
heat sink
polymer
microchannel
microchannels
micro
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Abandoned
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US13/808,591
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English (en)
Inventor
Haluk Kulah
Aziz Koyuncuoglu
Tuba Ozyurt Okutucu
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention is a microchannel heat sink for electronic cooling applications.
  • the heat sink is fabricated using CMOS compatible materials and surface micromachining techniques.
  • microchannel heat sinks In order to remove higher heat fluxes from the electronic chip surfaces, several new techniques have been introduced. Among them microchannel heat sinks have attracted significant attention for the last three decades [5]. Microchannel heat sinks are basically very compact heat exchangers with enormous area to volume ratios. This ratio provides a very large heat transfer area over the chip surface therefore the heat removal rates of those heat exchangers are much higher than their macro scale versions. Moreover, the small hydraulic diameters of microchannels provide higher heat transfer coefficients, increasing the heat removal rate even further. There are various fabrication methods for manufacturing microchannel heat sinks such as, micromilling [6], silicon etching [7], or metal electroplating [8].
  • Micromilling process requires thick metal substrates and the heat sink is manufactured separately from the microchip. Both factors increase the overall thermal resistance of the cooling system.
  • the heat sink is manufactured along with the circuit by using microfabrication techniques such as silicon etching and electroplating. This provides lower thermal resistance since the junction-to-fluid distance is much shorter compared to that in separate heat sinks.
  • silicon etching processes have some drawbacks such as the difficulty of back side etching of finished CMOS wafers which may cause reduced fabrication yield [9], or the need for a design change of the circuit to create area for coolant inlet and outlets [7].
  • electroplated channels can be fabricated directly on top of the circuits without a need for a design change of the underneath circuitry.
  • Joo et al. investigated electroplated metal microchannels for electronic cooling applications [8]. Their electroplated, radially diverging microchannel heat sinks were able to extract 35 W/cm 2 with air as the coolant. In this heat sink the top of the channels were covered with the electroplated overhangs extended from the sidewalls, therefore the largest channel width was limited to fewer than 50 microns. On the other hand, the channel height was defined by sacrificial layer thickness which is 70 microns at most. Microchannels with such small dimensions and hydraulic diameters cause enormous pressure drop when used with liquid coolants, therefore the working fluid should be a gas such as air. Since heat transfer coefficient in air cooling is quite low compared to liquid cooling, the maximum heat removal capacity of those microchannel heat sinks were expected to be limited less than 50 W/cm 2 .
  • the present invention makes use of a polymer top wall instead of electroplated overhangs for covering the microchannels.
  • This design enables fabrication of microchannels that are several hundred microns wide. Therefore higher hydraulic diameter microchannels can be fabricated as well as smeller ones.
  • polymer coating is a simple and CMOS compatible low temperature process.
  • the proposed metal-polymer microchannel heat sinks can be used with various coolants, including gaseous fluids like air, refrigerant, liquid coolants like water, ethylene glycol, or liquid-solid suspensions like nanofluids. With this flexibility, it is possible to obtain much higher heat removal rates from the chip surface.
  • CMOS compatible surface micromachined metal-polymer microchannel heat sink it is aimed to obtain a high heat transfer capacity, light weight, monolithic heat sink structure which can be fabricated easily with standard CMOS compatible surface micromachining techniques and can be operated with gaseous or liquid coolants, or nanofluids.
  • FIG. 1 Perspective view of microchannels on top of electronic chip with microchannel walls exposed.
  • FIG. 2 Top view of microchannel heat sink with polymer top wall removed.
  • FIG. 3 Cross sectional view of the microchannels along flow direction.
  • FIG. 4 Fabrication flow of microchannel heat sink.
  • the present invention is composed of mainly four elements namely;
  • the electrical insulation layer is deposited on the microelectronic circuit with electrical insulation layer ( 2 ) by means of standard vapor deposition techniques, in order to prevent any electrical interaction between the electronic chip and the coolant.
  • the insulation layer can be made of either silicon dioxide, silicon nitride or a polymer film.
  • Microchannels lay on top of the metal seed layer ( 8 ) which is deposited over the insulation layer. Microchannels are formed by metal seed layer ( 8 ) at the bottom wall and electroplated metal (e.g. Copper, Nickel or Gold) on the microchannel side walls ( 3 ) and polymer top wall ( 6 ).
  • Thin polymer layers can be coated on inner surface of the microchannels, including the metal surface on the microchannel side walls ( 3 ), metal seed layer ( 8 ) and polymer top wall ( 6 ) as the final step in the fabrication process to prevent corrosion due to contact of coolant and metal.
  • Fabrication method of the microchannel heat sink is shown in FIG. 4 schematically. Fabrication is a two-mask process. Microchannel heat sink is fabricated directly on top of the microelectronic circuit with electrical insulation layer ( 2 ). First a thin metal seed layer is coated on top of the insulation layer for electroplating process (FIG. 4 - a ). Seed layer is patterned by using Mask- 1 with UV-lithography and wet metal etching, in order to prevent electroplating on top of contact pads of the underneath circuitry. By using Mask- 2 a sacrificial thick photoresist layer is patterned, forming the microchannels and inlet-outlet reservoirs (FIG. 4 - b ). Microchannel dimensions are defined by Mask- 2 layout and photoresist thickness.
  • microchannel thicknesses can be obtained.
  • employing the polymer top wall ( 6 ) not only narrow microchannels, but also larger channels, as wide as several hundred microns can be fabricated.
  • different working fluids gas, liquid, nanofluid
  • the overall electronic cooling system is composed of the metal-polymer microchannel heat sink ( FIG. 1 ), inlet and outlet microfluidic interconnection ports (not shown), piping (not shown), pump/compressor (not shown) and external heat exchanger (not shown). Parts other than the microchannel heat sink are standard cooling system components which are already commercially available.
  • the metal-polymer microchannel heat sink provides cooling by means of steady state flow of a working fluid inside the microchannels.
  • the working fluid can be either water or some other coolant, based on the operation conditions and cooling requirements of the chip.
  • the working fluid is pumped in the closed loop cooling system by a pump. Then the fluid flows through the pipes and reaches the inlet reservoir ( 4 ) of the polymer microchannel heat sink. In the inlet reservoir the working fluid is distributed to microchannels and flows through microchannels. During the flow the working fluid is heated by the heat flux coming from the microelectronic circuit with electrical insulation layer ( 2 ) under the metal seed layer ( 8 ). The temperature of the working fluid increases while flowing down the microchannels. The hot working fluid is collected in the outlet reservoir ( 7 ) of the heat sink and leaves the microchannel heat sink through the microfluidic interconnection ports.
  • the hot working fluid then flows through pipes and radiator (not shown) where it is cooled by ambient air by means of natural or forced convection.
  • the cooled down working fluid flows thorough pipes and reaches pump (not shown) completing the one cooling cycle.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/808,591 2010-07-07 2010-07-07 CMOS Compatible Microchannel Heat Sink for Electronic Cooling and Its Fabrication Abandoned US20130105135A1 (en)

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PCT/TR2010/000142 WO2012005706A1 (en) 2010-07-07 2010-07-07 Cmos compatible microchannel heat sink for electronic cooling and its fabrication

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US20130105135A1 true US20130105135A1 (en) 2013-05-02

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US (1) US20130105135A1 (ko)
EP (1) EP2591500B1 (ko)
JP (1) JP5818889B2 (ko)
KR (1) KR101675028B1 (ko)
WO (1) WO2012005706A1 (ko)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140167296A1 (en) * 2012-12-14 2014-06-19 Intel Corporation Methods of forming configurable microchannels in package structures
US9041193B2 (en) 2013-09-17 2015-05-26 Hamilton Sundstrand Corporation Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel
WO2015095068A1 (en) * 2013-12-16 2015-06-25 The Texas A&M University System Systems and methods for in-situ formation of nanoparticles and nanofins
US9953899B2 (en) 2015-09-30 2018-04-24 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
CN111029895A (zh) * 2019-12-12 2020-04-17 上海交通大学 一种微通道散热器及其制作方法
US20200409398A1 (en) * 2019-06-25 2020-12-31 Intel Corporation Device, system and method for providing microchannels with porous sidewall structures
US11152281B2 (en) * 2018-11-07 2021-10-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material
CN113629024A (zh) * 2021-06-24 2021-11-09 武汉高芯科技有限公司 微流制冷通道的制作方法以及芯片

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102645117B (zh) * 2012-05-02 2013-08-28 西安交通大学 微细通道冷却器
FR3030112B1 (fr) 2014-12-12 2018-02-02 Stmicroelectronics (Crolles 2) Sas Assemblage d'une puce de circuits integres et d'une plaque
KR101940912B1 (ko) 2017-06-30 2019-01-22 주식회사 포스코 액상금속취화 균열 저항성이 우수한 강판 및 그 제조방법
CN108802089B (zh) * 2018-06-22 2020-08-04 内蒙古工业大学 一种微通道纳米流体强化换热试验测试方法
US10964625B2 (en) 2019-02-26 2021-03-30 Google Llc Device and method for direct liquid cooling via metal channels
CN115863183B (zh) * 2023-02-03 2023-06-09 之江实验室 用于三维集成晶圆系统散热的流量可测的微流道制造方法
CN115799194B (zh) * 2023-02-03 2023-05-09 之江实验室 晶圆散热微流道、制备方法及三维集成方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057908A (en) * 1990-07-10 1991-10-15 Iowa State University Research Foundation, Inc. High power semiconductor device with integral heat sink
US20030213693A1 (en) * 2002-01-18 2003-11-20 The Regents Of The University Of Michigan Microscale electrophoresis devices for biomolecule separation and detection
US6919231B1 (en) * 2004-03-24 2005-07-19 Intel Corporation Methods of forming channels on an integrated circuit die and die cooling systems including such channels
US7524434B2 (en) * 2001-02-12 2009-04-28 Dober Chemical Corporation Controlled release cooling additive composition
US7699916B1 (en) * 2008-05-28 2010-04-20 The United States Of America As Represented By The United States Department Of Energy Corrosion-resistant, electrically-conductive plate for use in a fuel cell stack
US20120276343A1 (en) * 2006-07-07 2012-11-01 University Of Central Florida Research Foundation, Inc. Article having closed microchannels

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450472A (en) 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
JP2001215736A (ja) * 2000-02-04 2001-08-10 Jsr Corp フォトレジスト用剥離液組成物、剥離方法及び回路基板
US7139172B2 (en) 2004-07-01 2006-11-21 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
DE102005008271A1 (de) * 2005-02-22 2006-08-24 Behr Gmbh & Co. Kg Mikrowärmeübertrager
KR100772381B1 (ko) * 2005-09-29 2007-11-01 삼성전자주식회사 히트싱크
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
JP2009067640A (ja) * 2007-09-14 2009-04-02 Casio Comput Co Ltd 表面凹凸状構造体、放熱フィン、流路構造体、燃料電池装置、電子機器及び表面凹凸状構造体の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057908A (en) * 1990-07-10 1991-10-15 Iowa State University Research Foundation, Inc. High power semiconductor device with integral heat sink
US7524434B2 (en) * 2001-02-12 2009-04-28 Dober Chemical Corporation Controlled release cooling additive composition
US20030213693A1 (en) * 2002-01-18 2003-11-20 The Regents Of The University Of Michigan Microscale electrophoresis devices for biomolecule separation and detection
US6919231B1 (en) * 2004-03-24 2005-07-19 Intel Corporation Methods of forming channels on an integrated circuit die and die cooling systems including such channels
US20120276343A1 (en) * 2006-07-07 2012-11-01 University Of Central Florida Research Foundation, Inc. Article having closed microchannels
US7699916B1 (en) * 2008-05-28 2010-04-20 The United States Of America As Represented By The United States Department Of Energy Corrosion-resistant, electrically-conductive plate for use in a fuel cell stack

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Apparent fluid slip at hydrophobic microchannel walls, Derek C. Tretheway and Carl D. Meinhart") Department of Mechanical Engineering, University of California, Santa Barbara, California 93106, PHYSICS OF FLUIDS, VOLUME 14, NUMBER 3, MARCH 2002 *
DATABASE INSPEC [Online]THE INSTITUTION OF ELECTRICAL ENGINEERS,STEVENAGE, GB; February 2006 (2006-02),DANG B ET AL: "Integrated thermal-fluidic 1/0 interconnects foran on-chip microchannel heat sink",Database accession no. 8840706 ; -& IEEE ELECTRON DEVICELETTERS IEEE USA,vol. 27, no. 2 , pages 117-119,ISSN: 0741-3106,001: DOI:10.1109/LED. *
DATABASE INSPEC [Online]THE INSTITUTION OF ELECTRICAL ENGINEERS,STEVENAGE, GB; November 2008 (2008-11),YOUNGCHEOL JOO ET AL: "Air cooling of a microelectronic chipwith diverging metal microchannels monolithically processedusing a single mask",Database accession no. 10308693 ; -& JOURNAL OFMICROMECHANICS AND MICROENGINEERING lOPPUBLISHING LT *
PHOTO-POLYMER MICROCHANNEL TECHNOLOGIES AND APPLICATIONS; Philippe Renaud, Harald van Lintel, Marc Heuschkel and Louis Guerin; Institute of Microsystems, EPFL DMT-IMS, EPFL, CH-1015 Lausanne, Switzerland;D. J. Harrison et al. (eds.), Micro Total Analysis Systems ’98 *
Wafer bonding using microwave heating of parylene intermediate layers; Hong-seok Noh1, Kyoung-sik Moon2, Andrew Cannon1, Peter J Hesketh1 and C PWong2; J. Micromech. Microeng. 14 (2004) 625–631; JOURNAL OF MICROMECHANICS AND MICROENGINEERING *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9997377B2 (en) * 2012-12-14 2018-06-12 Intel Corporation Methods of forming configurable microchannels in package structures
US20140167296A1 (en) * 2012-12-14 2014-06-19 Intel Corporation Methods of forming configurable microchannels in package structures
US9041193B2 (en) 2013-09-17 2015-05-26 Hamilton Sundstrand Corporation Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel
US9312202B2 (en) 2013-09-17 2016-04-12 Hamilton Sundstrand Corporation Method of forming a semiconductor substrate including a cooling channel
US10220410B2 (en) 2013-12-16 2019-03-05 The Texas A&M University System Systems and methods for in-situ formation of nanoparticles and nanofins
WO2015095068A1 (en) * 2013-12-16 2015-06-25 The Texas A&M University System Systems and methods for in-situ formation of nanoparticles and nanofins
US9953899B2 (en) 2015-09-30 2018-04-24 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US10665530B2 (en) 2015-09-30 2020-05-26 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US10957624B2 (en) 2015-09-30 2021-03-23 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US11456235B1 (en) 2015-09-30 2022-09-27 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US11152281B2 (en) * 2018-11-07 2021-10-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material
US20200409398A1 (en) * 2019-06-25 2020-12-31 Intel Corporation Device, system and method for providing microchannels with porous sidewall structures
CN111029895A (zh) * 2019-12-12 2020-04-17 上海交通大学 一种微通道散热器及其制作方法
CN113629024A (zh) * 2021-06-24 2021-11-09 武汉高芯科技有限公司 微流制冷通道的制作方法以及芯片

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Publication number Publication date
JP5818889B2 (ja) 2015-11-18
EP2591500A1 (en) 2013-05-15
WO2012005706A1 (en) 2012-01-12
KR20130120438A (ko) 2013-11-04
EP2591500B1 (en) 2015-09-30
KR101675028B1 (ko) 2016-11-10
JP2013534053A (ja) 2013-08-29

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