US20120222444A1 - Remote radio unit - Google Patents
Remote radio unit Download PDFInfo
- Publication number
- US20120222444A1 US20120222444A1 US13/411,130 US201213411130A US2012222444A1 US 20120222444 A1 US20120222444 A1 US 20120222444A1 US 201213411130 A US201213411130 A US 201213411130A US 2012222444 A1 US2012222444 A1 US 2012222444A1
- Authority
- US
- United States
- Prior art keywords
- rru
- radiating pipes
- evaporator
- shell body
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a communication device, and in particular, to a Remote Radio Unit (RRU).
- RRU Remote Radio Unit
- An RRU is a novel disposed network coverage mode, in the mode, high-capacity macro cell base stations are centrally placed in an accessible central equipment room, baseband parts are processed centrally, and radio frequency modules in a base station is pulled to the RRU by adopting optical fibers, and are separately placed on stations determined by the network planning, thereby saving a large quantity of equipment rooms required by the regular solution; and meanwhile, by adopting a high-capacity macro base station to support pulling a large quantity of optical fibers far away, the conversion between the capacity and the coverage may be achieved. Because of the foregoing advantages of the RRU, the RRU is widely applied.
- An existing RRU having a shell includes an RRU radiator structural member and a shell; the RRU radiator structural member includes an RRU and a radiator, a radiating portion of the RRU is connected to the radiator, the radiating portion of the RRU specifically may be a power amplifier module, a duplexer module, or a transceiver module of the RRU, and the radiator includes radiating fins configured to exchange heat with the air so as to achieve radiating.
- the shell surrounds the RRU and the radiator, and the shell is made of a plastic material, and is connected to the RRU radiator structural member through screws, which functions to be aesthetic and prevent solar radiation.
- the inventors find that: the existing RRU only uses the radiating fins of the radiator to perform heat exchange with the air to achieve radiating, and therefore, overall system radiating efficiency is not high.
- An embodiment of the present invention provides an RRU, which is capable of improving radiating efficiency.
- An RRU includes an RRU radiator structural member and a shell, the shell includes an evaporator, radiating pipes and a shell body, the inside of the evaporator is in communication with the radiating pipes to form a loop for holding a phase change medium, and the radiating pipes are disposed on the shell body;
- the evaporator is connected to a radiator of the RRU radiator structural member.
- the evaporator included by the shell in the RRU is connected to the radiator of the RRU radiator structural member, so the heat of the radiator can be transferred to the evaporator, and the heat may be further transferred to the shell through the radiating pipes since the evaporator is connected to the radiating pipes, so that the shell participates in the radiating, thereby improving the radiating efficiency and improving the work stability of the RRU.
- FIG. 1 is a structural diagram of an RRU according to an embodiment of the present invention.
- FIG. 2 is a structural diagram of a shell in the RRU according to the embodiment of the present invention.
- FIG. 1 describes an RRU according to an embodiment of the present invention, which includes an RRU radiator structural member 101 and a shell 102 .
- the structure of the shell 102 is shown in FIG. 2 , and the shell 102 includes an evaporator 1021 , radiating pipes 1022 and a shell body 1023 .
- the inside of the evaporator 1021 is in communication with the radiating pipes 1022 , and the radiating pipes 1022 are disposed on a surface of the shell body 1023 .
- the radiating pipes 1022 may be made of a metal material, for example, metal with good heat conducting performance such as copper and aluminum; and may also be made of a plastic material, such as heat conducting plastic.
- the material of the shell body 1023 may be the same as the material of the radiating pipes 1022 , and may also be different from the material of the radiating pipes 1022 .
- the length and the shape of the radiating pipes 1022 may be designed or assembled as required.
- the evaporator 1021 may be fixed on the shell body 1023 ; for example, the evaporator 1021 may be fixed on the shell body 1023 by adopting screws or buckles, thereby ensuring that the evaporator 1021 is tightly connected to the shell body 1023 .
- the evaporator 1021 is connected to a radiator of the RRU radiator structural member 101 .
- the evaporator included by the shell in the RRU according to the embodiment of the present invention is connected to the radiator of the RRU radiator structural member, so that the heat of the radiator can be transferred to the evaporator, and the heat may be further transferred through the radiating pipes since the evaporator is connected to the radiating pipes, thereby improving the radiating efficiency and improving the work stability of the RRU.
- the evaporator in order to enable the evaporator to maintain the position fixed after the evaporator is connected to the radiator, the evaporator may be locked through screws, thereby ensuring that the heat of the radiator can be transferred to the evaporator.
- a groove is disposed in the evaporator 1021 , so that the groove may be in communication with the radiating pipes 1022 to form a loop, thereby further improving the heat conduction efficiency.
- a phase changeable medium may be filled in the radiating pipes 1022 , and the medium may be a medium having an efficient phase change heat exchange capability such as water, ammonia, or Freon.
- the heat may be transferred in the radiating pipes through the phase changeable medium, and then the radiating is performed through the radiating pipes; further, when the radiating pipes are in communication with the groove of the evaporator to form the loop, the heat may be transferred more quickly between the evaporator and the radiating pipes through the phase changeable medium, thereby improving the radiating efficiency.
- the radiating pipes 1022 may be embedded in the shell body 1023 , so the radiating pipes 1022 and the shell body 1023 may be manufactured through integral molding; for example, when the shell body 1023 is made of the plastic material, the blow-up process may be performed on the shell body 1023 to form the radiating pipes 1022 , and in this case, the radiating pipes 1022 is also made of the plastic material; or when the shell body 1023 is made of the plastic material, and the radiating pipes 1022 is made of the metal material, the injection molding may be performed on the radiating pipes 1022 .
- the radiating pipes 1022 may not be embedded in the shell body 1023 , and in this case, the radiating pipes 1022 and the evaporator 1021 may be located at two sides of a surface of the shell body 1023 respectively.
- the radiating pipes 1022 and the shell body 1023 maybe respectively machined, and then are assembled with the evaporator 1021 to form the shell 102 ; compared with the practice that the radiating pipes 1022 and the shell body 1023 are manufactured through the integral molding, the foregoing practice may reduce the machining difficulty and the manufacturing cost, and meanwhile the design flexibility may also be improved.
- a ventilation hole may be opened on the shell body 1023 , thereby satisfying requirements of the RRU for the ventilation quantity under different environments.
- the horizontal position of the radiator is not higher than that of the radiating pipes, that is to say, the horizontal position of the radiator is lower than or horizontal to that of the radiating pipes.
- the gasified medium generated by the evaporator can provide a sufficient acting force to enable the phase change medium to flow in the loop formed by the evaporator and the radiating pipes, or additional power elements are mounted in the radiating pipes, the evaporator may also be higher than the radiating pipes.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101701525A CN101645714B (zh) | 2009-09-03 | 2009-09-03 | 一种远端射频模块 |
CN200910170152.5 | 2009-09-03 | ||
PCT/CN2010/076593 WO2011026436A1 (zh) | 2009-09-03 | 2010-09-03 | 一种远端射频模块 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2010/076593 Continuation WO2011026436A1 (zh) | 2009-09-03 | 2010-09-03 | 一种远端射频模块 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120222444A1 true US20120222444A1 (en) | 2012-09-06 |
Family
ID=41657446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/411,130 Abandoned US20120222444A1 (en) | 2009-09-03 | 2012-03-02 | Remote radio unit |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120222444A1 (de) |
EP (1) | EP2467006B1 (de) |
CN (1) | CN101645714B (de) |
BR (1) | BR112012004821A2 (de) |
WO (1) | WO2011026436A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9167712B2 (en) | 2012-08-13 | 2015-10-20 | Huawei Technologies Co., Ltd. | Radio remote unit device and assembly thereof |
US20170223868A1 (en) * | 2014-10-16 | 2017-08-03 | Huawei Technologies Co., Ltd. | Remote radio unit and active antenna system |
US9872416B2 (en) | 2014-08-21 | 2018-01-16 | Huawei Technologies Co., Ltd. | Communications product and base station system |
US10219406B2 (en) | 2013-03-06 | 2019-02-26 | Huawei Technologies Co., Ltd. | Radio remote unit and communications device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101645714B (zh) * | 2009-09-03 | 2012-12-12 | 华为技术有限公司 | 一种远端射频模块 |
CN204392480U (zh) * | 2015-02-05 | 2015-06-10 | 中兴通讯股份有限公司 | 一种底板、底板组件以及底板安装系统 |
CN104768355B (zh) * | 2015-03-24 | 2017-11-17 | 华为技术有限公司 | 散热装置、射频拉远模块、基站模块、通信基站及系统 |
CN106714504B (zh) * | 2015-07-31 | 2019-11-05 | 中兴通讯股份有限公司 | 射频拉远单元、安装件及射频通信系统 |
CN106455431B (zh) * | 2016-10-12 | 2018-06-08 | 上海交通大学 | 板式环路热虹吸均温板 |
Citations (25)
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US3035419A (en) * | 1961-01-23 | 1962-05-22 | Westinghouse Electric Corp | Cooling device |
US3209062A (en) * | 1963-01-25 | 1965-09-28 | Westinghouse Electric Corp | Mounting and coolant system for semiconductor heat generating devices |
US3717009A (en) * | 1971-04-26 | 1973-02-20 | Gen Motors Corp | Refrigeration evaporator assembly |
US4452051A (en) * | 1980-08-27 | 1984-06-05 | Commissariat A L'energie Atomique | Modular cold generating apparatus |
US5383340A (en) * | 1994-03-24 | 1995-01-24 | Aavid Laboratories, Inc. | Two-phase cooling system for laptop computers |
US6069791A (en) * | 1997-08-14 | 2000-05-30 | Fujikura Ltd. | Cooling device for notebook personal computer |
US6097597A (en) * | 1998-06-30 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus |
US6164368A (en) * | 1996-08-29 | 2000-12-26 | Showa Aluminum Corporation | Heat sink for portable electronic devices |
US20010037880A1 (en) * | 1999-12-30 | 2001-11-08 | Max Aaron Solondz | Valved heat pipe and adaptive cooling system including the same |
US20010040022A1 (en) * | 2000-01-04 | 2001-11-15 | Hao Li Jia | Bubble cycling heat exchanger |
US6725908B2 (en) * | 2002-02-08 | 2004-04-27 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant with effective performance in a tilted position |
US6748755B2 (en) * | 2000-03-09 | 2004-06-15 | Fujitsu Limited | Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator |
US20040250994A1 (en) * | 2002-11-05 | 2004-12-16 | Lalit Chordia | Methods and apparatuses for electronics cooling |
US20050083647A1 (en) * | 2002-02-08 | 2005-04-21 | Hitachi, Ltd. | Electric device with liquid cooling system and method of manufacturing thereof |
US6935412B2 (en) * | 2001-05-25 | 2005-08-30 | Agilent Technologies, Inc. | Cooler for electrical and/ or electronic components, linked to present cooling needs |
US20050257532A1 (en) * | 2004-03-11 | 2005-11-24 | Masami Ikeda | Module for cooling semiconductor device |
US6972365B2 (en) * | 2001-06-27 | 2005-12-06 | Thermal Corp. | Thermal management system and method for electronics system |
US20050274120A1 (en) * | 1999-06-08 | 2005-12-15 | Tony Quisenberry | Heat pipe connection system and method |
US20060000582A1 (en) * | 2003-07-28 | 2006-01-05 | Phillips Alfred L | Flexible loop thermosyphon |
US7031158B2 (en) * | 2002-10-30 | 2006-04-18 | Charles Industries, Ltd. | Heat pipe cooled electronics enclosure |
US7131484B2 (en) * | 2002-10-03 | 2006-11-07 | Alcatel | Modular architecture for thermal control in a spacecraft |
US20070289313A1 (en) * | 2006-06-15 | 2007-12-20 | Mohinder Singh Bhatti | Thermosiphon with thermoelectrically enhanced spreader plate |
US7460367B2 (en) * | 2007-03-05 | 2008-12-02 | Tracewell Systems, Inc. | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology |
US8125078B2 (en) * | 2007-01-11 | 2012-02-28 | Toyota Jidosha Kabushiki Kaisha | Semiconductor element cooling structure |
US8493735B2 (en) * | 2009-11-12 | 2013-07-23 | Fujitsu Limited | Liquid cooling arrangement for electronic apparatus |
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US6388882B1 (en) * | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
SE524204C2 (sv) * | 2001-07-19 | 2004-07-06 | Denso Corp | Värmeansamlare med ett membran vilket tar emot ett fluidtryck |
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CN100370890C (zh) * | 2005-06-27 | 2008-02-20 | 中山大学 | 一种平板式回路热管装置 |
JP4863843B2 (ja) * | 2006-04-28 | 2012-01-25 | 株式会社フジクラ | 蒸発器及びこの蒸発器を使用したループヒートパイプ |
CN101013011A (zh) * | 2007-02-05 | 2007-08-08 | 中山大学 | 一种多通道自调节回路热管装置 |
CN201197257Y (zh) * | 2007-12-27 | 2009-02-18 | 华为技术有限公司 | 一种远端射频模块的散热装置 |
CN101645714B (zh) * | 2009-09-03 | 2012-12-12 | 华为技术有限公司 | 一种远端射频模块 |
-
2009
- 2009-09-03 CN CN2009101701525A patent/CN101645714B/zh not_active Expired - Fee Related
-
2010
- 2010-09-03 BR BR112012004821A patent/BR112012004821A2/pt not_active Application Discontinuation
- 2010-09-03 EP EP10813358.8A patent/EP2467006B1/de not_active Not-in-force
- 2010-09-03 WO PCT/CN2010/076593 patent/WO2011026436A1/zh active Application Filing
-
2012
- 2012-03-02 US US13/411,130 patent/US20120222444A1/en not_active Abandoned
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US3035419A (en) * | 1961-01-23 | 1962-05-22 | Westinghouse Electric Corp | Cooling device |
US3209062A (en) * | 1963-01-25 | 1965-09-28 | Westinghouse Electric Corp | Mounting and coolant system for semiconductor heat generating devices |
US3717009A (en) * | 1971-04-26 | 1973-02-20 | Gen Motors Corp | Refrigeration evaporator assembly |
US4452051A (en) * | 1980-08-27 | 1984-06-05 | Commissariat A L'energie Atomique | Modular cold generating apparatus |
US5383340A (en) * | 1994-03-24 | 1995-01-24 | Aavid Laboratories, Inc. | Two-phase cooling system for laptop computers |
US6164368A (en) * | 1996-08-29 | 2000-12-26 | Showa Aluminum Corporation | Heat sink for portable electronic devices |
US6069791A (en) * | 1997-08-14 | 2000-05-30 | Fujikura Ltd. | Cooling device for notebook personal computer |
US6097597A (en) * | 1998-06-30 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus |
US20050274120A1 (en) * | 1999-06-08 | 2005-12-15 | Tony Quisenberry | Heat pipe connection system and method |
US20010037880A1 (en) * | 1999-12-30 | 2001-11-08 | Max Aaron Solondz | Valved heat pipe and adaptive cooling system including the same |
US20010040022A1 (en) * | 2000-01-04 | 2001-11-15 | Hao Li Jia | Bubble cycling heat exchanger |
US6748755B2 (en) * | 2000-03-09 | 2004-06-15 | Fujitsu Limited | Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator |
US6935412B2 (en) * | 2001-05-25 | 2005-08-30 | Agilent Technologies, Inc. | Cooler for electrical and/ or electronic components, linked to present cooling needs |
US6972365B2 (en) * | 2001-06-27 | 2005-12-06 | Thermal Corp. | Thermal management system and method for electronics system |
US20050083647A1 (en) * | 2002-02-08 | 2005-04-21 | Hitachi, Ltd. | Electric device with liquid cooling system and method of manufacturing thereof |
US6725908B2 (en) * | 2002-02-08 | 2004-04-27 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant with effective performance in a tilted position |
US7131484B2 (en) * | 2002-10-03 | 2006-11-07 | Alcatel | Modular architecture for thermal control in a spacecraft |
US7031158B2 (en) * | 2002-10-30 | 2006-04-18 | Charles Industries, Ltd. | Heat pipe cooled electronics enclosure |
US20040250994A1 (en) * | 2002-11-05 | 2004-12-16 | Lalit Chordia | Methods and apparatuses for electronics cooling |
US20060000582A1 (en) * | 2003-07-28 | 2006-01-05 | Phillips Alfred L | Flexible loop thermosyphon |
US20050257532A1 (en) * | 2004-03-11 | 2005-11-24 | Masami Ikeda | Module for cooling semiconductor device |
US20070289313A1 (en) * | 2006-06-15 | 2007-12-20 | Mohinder Singh Bhatti | Thermosiphon with thermoelectrically enhanced spreader plate |
US8125078B2 (en) * | 2007-01-11 | 2012-02-28 | Toyota Jidosha Kabushiki Kaisha | Semiconductor element cooling structure |
US7460367B2 (en) * | 2007-03-05 | 2008-12-02 | Tracewell Systems, Inc. | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology |
US8493735B2 (en) * | 2009-11-12 | 2013-07-23 | Fujitsu Limited | Liquid cooling arrangement for electronic apparatus |
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Title |
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eSpacenet EPO; Machine Translation of CN 201197257 Heat Radiating device of far-end radio frequency module; 2009-2-18, EPO, all * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9167712B2 (en) | 2012-08-13 | 2015-10-20 | Huawei Technologies Co., Ltd. | Radio remote unit device and assembly thereof |
US20150373871A1 (en) * | 2012-08-13 | 2015-12-24 | Huawei Technologies Co., Ltd. | Radio remote unit device and assembly thereof |
US9642284B2 (en) * | 2012-08-13 | 2017-05-02 | Huawei Technologies Co., Ltd. | Radio remote unit device and assembly thereof |
US10219406B2 (en) | 2013-03-06 | 2019-02-26 | Huawei Technologies Co., Ltd. | Radio remote unit and communications device |
US10757832B2 (en) | 2013-03-06 | 2020-08-25 | Huawei Technologies Co., Ltd. | Radio remote unit and communications device |
US9872416B2 (en) | 2014-08-21 | 2018-01-16 | Huawei Technologies Co., Ltd. | Communications product and base station system |
US20170223868A1 (en) * | 2014-10-16 | 2017-08-03 | Huawei Technologies Co., Ltd. | Remote radio unit and active antenna system |
US10506736B2 (en) * | 2014-10-16 | 2019-12-10 | Huawei Technologies Co., Ltd. | Remote radio unit and active antenna system |
US10806049B2 (en) | 2014-10-16 | 2020-10-13 | Huawei Technologies Co., Ltd. | Remote radio unit and active antenna system |
Also Published As
Publication number | Publication date |
---|---|
BR112012004821A2 (pt) | 2017-05-30 |
EP2467006B1 (de) | 2015-01-07 |
WO2011026436A1 (zh) | 2011-03-10 |
EP2467006A4 (de) | 2012-08-01 |
EP2467006A1 (de) | 2012-06-20 |
CN101645714B (zh) | 2012-12-12 |
CN101645714A (zh) | 2010-02-10 |
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