US20120055531A1 - Solar cell module and method of manufacturing the same, and mobile apparatus with the solar cell module - Google Patents
Solar cell module and method of manufacturing the same, and mobile apparatus with the solar cell module Download PDFInfo
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- US20120055531A1 US20120055531A1 US13/015,079 US201113015079A US2012055531A1 US 20120055531 A1 US20120055531 A1 US 20120055531A1 US 201113015079 A US201113015079 A US 201113015079A US 2012055531 A1 US2012055531 A1 US 2012055531A1
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- solar cell
- adhesive film
- cell module
- transmitting plate
- light transmitting
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell module and a method of manufacturing the same, and a mobile apparatus with the solar cell module, and more particularly, to a solar cell module capable of improving bonding reliability of solar cells and reliability of electrical connection between the solar cells and a method of manufacturing the same, and a mobile apparatus with the solar cell module.
- General silicon solar cells can be classified into front and rear electrode structures according to the structure of electrodes.
- Solar cell modules having these front and rear electrode structures generally may have a chip on board (COB) or chip on glass (COG) type solar cell bonding structure.
- COB chip on board
- COG chip on glass
- FIG. 1 is a view showing an example of a mobile apparatus with a solar cell module in accordance with the prior art.
- a mobile apparatus 10 may include a case 20 and a solar cell module 30 embedded in the case 20 .
- Transparent glass 22 through which light is incident on the solar cell module 30 , may be disposed at one side of the case 20 .
- a display unit 24 may be disposed at the other side of the case 20 to display information to the outside.
- the solar cell module 30 may be attached so that a light receiving surface thereof faces the transparent glass 22 .
- the solar cell module 30 may have a COB or COG type solar cell module structure.
- the solar cell module 30 has a structure with a printed circuit board (PCB) 32 , solar cells 34 attached to one surface of the PCB 32 , a bonding wire 36 connecting the solar cells 34 and the PCB 32 , and a transparent molding film 38 covering the above components.
- PCB printed circuit board
- the mobile apparatus 10 having the above structure has a structure in which the transparent glass 22 and the solar cells 34 are bonded to each other with the transparent molding film 38 interposed therebetween.
- An adhesive (not shown) may be further interposed between the transparent glass 22 and the transparent molding film 38 .
- the adhesive is usually formed only in some regions between the transparent glass 22 and the transparent molding film 38 to prevent light transmission loss. Accordingly, the mobile apparatus 10 having the above structure has a problem that bonding reliability of the solar cells 34 is low since adhesive strength of the solar cells 34 to the transparent glass 22 is low.
- the mobile apparatus 10 having the above structure has a structure in which the solar cells 34 are electrically connected by a connection means such as the bonding wire 36 .
- a connection means such as the bonding wire 36 .
- the bonding wire 36 since the bonding wire 36 has a structure weak to external shocks, the bonding wires 36 , which are bent to be adjacent to each other, may be connected and shorted to each other when the transparent molding film 38 is formed. Therefore, the mobile apparatus 10 has a structure in which electrical connection between the solar cells 34 is low.
- it since it requires a relatively large space to bend the bonding wire 36 , in case of using the bonding wire 36 , there is a limit to improvement of integration of the solar cells 34 .
- the mobile apparatus 10 having the above structure has a structure in which external light is incident on the solar cells 34 after sequentially passing through the transparent glass 22 and the transparent molding film 38 .
- the external light may be lost through at least three steps.
- the mobile apparatus 10 has a structure in which light transmittance to the solar cells 34 is low. This loss of incident light may be greatly generated in a process of passing through the transparent molding film 38 . For example, in case of using a transparent epoxy resin as the transparent molding film 38 , transmittance of the incident light may be reduced to less than 90%.
- a total thickness of the solar cells 34 may be a total sum of thicknesses of the PCB 32 , the solar cells 34 , and the transparent molding film 38 .
- a total thickness of the solar cells 34 may be a total sum of thicknesses of the PCB 32 , the solar cells 34 , and the transparent molding film 38 .
- the present invention has been invented in order to overcome the above-described problems and it is, therefore, an object of the present invention to provide a solar cell module capable of bonding reliability of solar cells to a light transmitting plate and a mobile apparatus with the same.
- It is still another object of the present invention is to provide a solar cell module capable of improving light incidence on solar cells and a mobile apparatus with the same.
- It is still another object of the present invention is to provide a solar cell module with improved integration and a mobile apparatus with the same.
- It is still another object of the present invention is to provide a method of manufacturing a solar cell module capable of improving bonding reliability of solar cells.
- It is still another object of the present invention is to provide a method of manufacturing a solar cell module capable of improving reliability of electrical connection between solar cells.
- It is still another object of the present invention is to provide a method of manufacturing a solar cell module capable of improving light incidence on solar cells.
- It is still another object of the present invention is to provide a method of manufacturing a solar cell module with improved integration.
- a solar cell module including: a light transmitting plate having light transmittance; solar cells having bonding pads and conductive bumps bonded to the bonding pads; an adhesive film disposed between the light transmitting plate and the solar cells to bond the light transmitting plate and the solar cells; and a conductive pad disposed by being inserted in the adhesive film and surrounding and electrically connecting the conductive bumps of the adjacent solar cells.
- the bonding pad may include a first bonding pad connected to a positive electrode of one of the solar cells and a second bonding pad connected to a negative electrode of the other solar cell adjacent to the one solar cell
- the conductive bumps may include a first conductive bump bonded to the first bonding pad and a second conductive bump bonded to the second bonding pad, and the conductive pad may electrically connect the first conductive bump and the second conductive bump.
- the conductive bump may include a stud bump.
- the conductive bump may have a shape of one of a column and a horn whose cross section becomes smaller as going away from the solar cell.
- the conductive bump may be used as a spacer for maintaining an interval between the light transmitting plate and the solar cells at a predetermined interval.
- a total height of the conductive bump and the bonding pad may be equal to the predetermined interval between the light transmitting plate and the solar cell.
- the solar cell may include a light receiving surface which receives light through the light transmitting plate and a non-light receiving surface opposite to the light receiving surface, and the solar cell module may further include a light reflective film which covers the non-light receiving surface.
- the light transmitting plate may include an exposed surface exposed to the outside and an unexposed surface facing the light receiving surfaces of the solar cells, and the solar cell module may further include a molding film which covers the unexposed surface.
- the molding film may be made of an opaque material.
- a mobile apparatus including: a case having an opening at one side; a display unit disposed at the other side of the case and displaying information to the outside; and a solar cell module disposed in the case and receiving and converting the external light into electric energy, wherein the solar cell module includes: a light transmitting plate disposed in the opening to seal the opening and having light transmittance; solar cells having bonding pads and conductive bumps bonded to the bonding pads; an adhesive film disposed between the light transmitting plate and the solar cells to bond the light transmitting plate and the solar cells; and a conductive pad disposed by being inserted in the adhesive film and surrounding and electrically connecting the conductive bumps of the adjacent solar cells.
- the light transmitting plate may include transparent glass which is exposed outside the case and introduces external light into the solar cells.
- the bonding pad may include a first bonding pad connected to a positive electrode of one of the solar cells and a second bonding pad connected to a negative electrode of the other solar cell adjacent to the one solar cell
- the conductive bumps may include a first conductive bump bonded to the first bonding pad and a second conductive bump bonded to the second bonding pad, and the conductive pad may electrically connect the first conductive bump and the second conductive bump.
- the conductive bump may have a shape of one of a column and a horn whose cross section becomes smaller as going away from the solar cell.
- the conductive bump may be used as a spacer for maintaining an interval between the light transmitting plate and the solar cells at a predetermined interval.
- a method of manufacturing a solar cell module including the steps of: preparing a light transmitting plate having light transmittance; preparing a film structure with an adhesive film having a conductive pad; preparing solar cells having bonding pads to which conductive bumps are bonded; attaching the adhesive film to the light transmitting plate while exposing the conductive pad; and bonding the solar cells to the light transmitting plate with the adhesive film interposed therebetween while pressing the conductive pad by the conductive bump to be inserted in the adhesive film.
- the step of preparing the film structure may include the steps of disposing the conductive pad on a first adhesive film and attaching a second adhesive film to the first adhesive film to seal the conductive pad.
- the step of preparing the film structure may include the steps of attaching a first protective film to one surface of the adhesive film and attaching a second protective film to the other surface of the adhesive film.
- the step of preparing the film structure may include the steps of disposing the conductive pad on the first adhesive film, attaching the second adhesive film to the first adhesive film to seal the conductive pad; attaching the first protective film to one surface of the adhesive film, and attaching the second protective film to the other surface of the adhesive film, and the step of attaching the adhesive film to the light transmitting plate may include the steps of separating the first protective film from the first adhesive film, attaching the first adhesive film to the light transmitting plate, and separating the second adhesive film from the first adhesive film while leaving the conductive pad on the first adhesive film.
- the step of separating the second adhesive film from the first adhesive film may be performed by increasing adhesive strength between the second adhesive film and the second protective film in comparison with adhesive strength between the first adhesive film and the second adhesive film so that the second adhesive film is separated from the first adhesive film together with the second protective film in a process of separating the second protective film from the film structure.
- the adhesive strength between the first adhesive film and the second adhesive film may be adjusted to be greater than adhesive strength between the first protective film and the first adhesive film.
- the step of bonding the solar cells to the light transmitting plate may include the step of relatively moving the light transmitting plate and the solar cells, and the conductive bump may be used as a stopper for stopping the relative movement of the light transmitting plate and the solar cells.
- a stud bump may be used as the conductive bump.
- the solar cell may include a light receiving surface which receives light through the light transmitting plate and a non-light receiving surface opposite to the light receiving surface, and the method of manufacturing a solar cell module may further include the step of forming a light reflective film which covers the non-light receiving surface.
- the method of manufacturing a solar cell module may further include the step of forming a molding film of a non-light transmitting material which covers the solar cells.
- FIG. 1 is a view showing a mobile apparatus in accordance with the prior art
- FIG. 2 is a view showing a solar cell module in accordance with an embodiment of the present invention.
- FIG. 3 is a flow chart showing a method of manufacturing a solar cell module in accordance with an embodiment of the present invention
- FIGS. 4 to 8 are views for explaining a process of manufacturing a solar cell module in accordance with an embodiment of the present invention.
- FIG. 9 is view showing a mobile apparatus with a solar cell module in accordance with an embodiment of the present invention.
- FIG. 2 is a view showing a solar cell module in accordance with an embodiment of the present invention.
- a solar cell module 100 may include a light transmitting plate 110 , solar cells 120 , a first adhesive film 133 , and a molding film 140 .
- the light transmitting plate 110 may be made of a light transmitting material.
- the light transmitting plate 110 may include transparent glass having light transmittance.
- the transparent glass may be tempered glass.
- the light transmitting plate 110 may have an exposed surface 112 and an unexposed surface 114 opposite to the exposed surface 112 when being provided in an electronic device such as a mobile device.
- the light transmitting plate 110 is exposed outside the electronic device to be used as a medium for introducing external light into the solar cells 120 as well as to protect the solar cell module 100 from external environment.
- the solar cells 120 may be bonded to the light transmitting plate 110 with the first adhesive film 133 interposed therebetween.
- Each of the solar cells 120 may have a light receiving surface 122 and a non-light receiving surface 124 .
- the light receiving surface 122 may be a surface which receives light.
- the non-light receiving surface 124 may be a surface opposite to the light receiving surface 122 .
- a bonding pad 126 may be disposed in an edge region of the light receiving surface 122 .
- the bonding pad 126 may be a metal pad which is electrically connected to a positive or negative electrode of the solar cell 120 .
- the solar cell 120 may further include a conductive bump 128 bonded to the bonding pad 126 .
- the conductive bump 128 may be a metal body for electrically connecting the solar cells 120 .
- a stud bump may be used as the conductive bump 128 .
- the conductive bump 128 may have a shape of a column or a horn whose cross section becomes smaller as going away from the solar cell 120 .
- a solder ball may be used as the conductive bump 128 .
- the conductive bumps 128 having the above structure may have a structure inserted in the first adhesive film 133 .
- the conductive bumps 128 may be provided in the first adhesive film 133 by being forcibly inserted in the first adhesive film 133 with a conductive pad 134 a interposed therebetween.
- the conductive bumps 128 are surrounded by the conductive pad 134 a as well as embedded in the first adhesive film 133 . Accordingly, since the conductive pad 134 a is configured to surround all exposed portions of the conductive bumps 128 , a bonding area between the conductive pad 134 a and the conductive bumps 128 can be increased.
- the conductive pad 134 a may be made of a material having high electrical conductivity for effective electrical connection of the conductive bumps 128 .
- the conductive pad 134 a may be made of at least one metal material among Au, Ag, Ni, In, Zn, Ti, Cu, Cr, Ta, W, Pt, Fe, and Co.
- the solar cells 120 may be disposed on the light transmitting plate 110 to be electrically connected to each other in series.
- the bonding pad 126 may include a first bonding pad 126 a connected to a positive electrode of one of the solar cells 120 and a second bonding pad 126 b connected to a negative electrode of the other solar cell 120 adjacent to the one solar cell 120 .
- the solar cells 120 may be disposed so that the first bonding pad 126 a and the second bonding pad 126 b are alternately positioned on the light transmitting plate 110 .
- the conductive bumps 128 may include a first conductive bump 128 a bonded to the first bonding pad 126 a and a second conductive bump 128 b bonded to the second bonding pad 126 b.
- the conductive pad 134 a may be configured to surround the first and second conductive bumps 128 a and 128 b so that the first bonding pad 126 a and the second bonding pad 126 b are electrically connected to each other. Accordingly, the solar cells 120 may be electrically connected in series by connecting the first conductive bump 128 a and the second conductive bump 128 b provided in the adjacent solar cells 120 through the conductive pad 134 a.
- the first adhesive film 133 may bond the light transmitting plate 110 and the solar cells 120 .
- the first adhesive film 133 is made of a material having high light transmittance to introduce external light, which is incident through the light transmitting plate 110 , into the solar cells 120 while minimizing loss of the external light.
- the molding film 140 may protect the solar cells 120 and a conductive bonding film 132 .
- the molding film 140 may cover the unexposed surface 114 of the light transmitting plate 110 to seal the solar cells 120 .
- the solar cells 120 may be sealed and protected from external environment.
- the molding film 140 since the molding film 140 is disposed on the non-light receiving surfaces 124 of the solar cells 120 , the molding film 140 may not be required to be configured to transmit external light. Accordingly, the molding film 140 may be made of an opaque epoxy resin.
- a light reflective film 150 may be interposed between the solar cells 120 and the molding film 140 .
- the solar cell module 100 in accordance with an embodiment of the present invention includes the conductive pad 134 a which electrically connects the conductive bumps 128 of the adjacent solar cells 120 , and the conductive pad 134 a may have a structure surrounding the adjacent conductive bumps 128 .
- the conductive pad 134 a which electrically connects the conductive bumps 128 of the different solar cells 120 , has a structure surrounding the conductive bumps 128 , the bonding area between the conductive bumps 128 and the conductive pad 134 a can be increased.
- the solar cell module 100 in accordance with the present invention can improve reliability of electrical connection of the solar cells 120 and bonding reliability of the light transmitting plate 110 and the solar cells 120 by increasing the bonding area between the conductive bumps 128 and the conductive pad 134 a which electrically connects the conductive bumps 128 of the solar cells 120 .
- the solar cell module 100 in accordance with an embodiment of the present invention may have a structure in which the light transmitting plate 110 and the solar cells 120 are bonded to each other with the thin film type first adhesive film 133 interposed therebetween. Accordingly, the solar cell module 100 in accordance with the present invention may have a structure with improved integration by minimizing an interval between the light transmitting plate 110 and the solar cells 120 .
- the solar cell module 100 in accordance with an embodiment of the present invention may have a structure in which the conductive bumps 128 bonded to the solar cells 120 are electrically connected by using the conductive pad 134 a disposed on the first adhesive film 133 . Accordingly, the solar cell module 100 in accordance with the present invention can have a structure with improved integration by minimizing an installation space of a component for electrically connecting the solar cells 120 in comparison with a case using a component such as a bonding wire.
- FIG. 3 is a flow chart showing a method of manufacturing a solar cell module in accordance with an embodiment of the present invention.
- FIGS. 4 to 8 are views for explaining a process of manufacturing a solar cell module in accordance with an embodiment of the present invention.
- a film structure 130 having a conductive pad 134 may be prepared S 110 .
- an adhesive film 132 may be prepared.
- the step of preparing the adhesive film 132 may include the steps of preparing a first adhesive film 133 having light transmittance, disposing a conductive pad 134 on the first adhesive film 133 , and attaching a second adhesive film 135 on the first adhesive film 133 to seal the conductive pad 134 .
- the first adhesive film 133 may be a transparent film having high light transmittance.
- the conductive pad 134 may be a metal pattern made of a material selected from various kinds of metal.
- the conductive pad 134 may be made of a metal material including at least one of Cu, Ni, W, Co, Ag, and Au.
- the adhesive film 132 may be covered and protected by a protective film 136 .
- the adhesive film 132 may be sealed from external environment by covering the first adhesive film 133 exposed to the outside with a first protective film 137 and covering the second adhesive film 135 exposed to the outside with a second protective film 138 .
- the film structure 130 which consists of the adhesive film 132 and the protective film 136 covering the outside of the adhesive film 132 , can be manufactured.
- the first adhesive film 133 , the second adhesive film 135 , the first protective film 137 , and the second protective film 138 may be provided to have different adhesive strengths.
- adhesive strength between the second adhesive film 135 and the second protective film 138 may be greater than adhesive strength between the first adhesive film 133 and the second adhesive film 135 .
- the second adhesive film 135 can be selectively separated from the first adhesive film 133 by separating the second protective film 138 from the film structure 130 .
- the adhesive force between the first adhesive film 133 and the second adhesive film 135 may be greater than adhesive strength between the first adhesive film 133 and the first protective film 137 . Accordingly, in case of separating the first protective film 137 from the film structure 130 , only the first protective film 137 can be separated from the first adhesive film 133 without separation of the first adhesive film 133 and the second adhesive film 135 .
- the adhesive film 132 may be attached to a light transmitting plate 110 so that a conductive pad 134 is exposed S 120 .
- the first adhesive film 133 may be attached to the light transmitting plate 110 after separating the first protective film 137 from the film structure 130 to expose the first adhesive film 133 .
- the second adhesive film 135 may be separated from the first adhesive film 133 to expose the conductive pad 134 .
- the step of separating the second adhesive film 135 may be performed by separating the second protective film 138 from the film structure 130 .
- the first adhesive film 133 and the conductive pad 134 disposed on the first adhesive film 133 can be disposed on the light transmitting plate 110 .
- solar cells 120 having conductive bumps 128 may be prepared S 130 .
- the solar cells 120 having bonding pads 126 may be manufactured.
- the bonding pad 126 may consist of a first bonding pad 126 a connected to a positive electrode of one of the solar cells 120 and a second bonding pad 126 b connected to a negative electrode of the other solar cell 120 adjacent to the one solar cell 120 .
- the bonding pad 126 may include a circuit pattern of the solar cell 120 such as a bus-bar.
- a first conductive bump 128 a may be bonded to the first bonding pad 126 a
- a second conductive bump 128 b may be bonded to the second bonding pad 126 b.
- Various kinds of bumps may be used as the conductive bump 128 .
- a stud bump may be used as the conductive bump 128 .
- a solar ball may be used as the conductive bump 128 .
- the solar cell 120 may be bonded to the light transmitting plate 110 while pressing the conductive pad 134 by the conductive bump 128 to be forcibly inserted in the adhesive film 132 S 140 .
- a plurality of solar cells 120 may be disposed on the same plane in parallel.
- the solar cells 120 may be aligned so that the first conductive bump 128 a bonded to the first bonding pad 126 a of one solar cell 120 is adjacent to the second conductive bump 128 b bonded to the second bonding pad 126 b of the other solar cell 120 .
- the solar cells 120 may be aligned so that the adjacent first and second conductive bumps 128 a and 128 b face one conductive pad 134 .
- the solar cells 120 may be attached to the light transmitting plate 110 while forcibly inserting the first and second conductive bumps 128 a and 128 b in one conductive pad 134 . Accordingly, the light transmitting plate 110 and the solar cells 120 may be bonded to each other with the first adhesive film 133 interposed therebetween. In addition, the adjacent first and second conductive bumps 128 a and 128 b may be forcibly inserted in the first adhesive film 133 while pressing one conductive pad 134 .
- the conductive pad 134 can be formed into a conductive pad 134 a having a structure for electrically connecting the adjacent first and second conductive bumps 128 a and 128 b while surrounding all exposed portions of the adjacent first and second first and second conductive bumps 128 a and 128 b.
- a shape of the conductive bumps 128 may be adjusted so that the conductive bumps 128 can be easily forcibly inserted in the first adhesive film 133 .
- stud bumps can be used as the conductive bumps 128 .
- the conductive bumps 128 may have a shape of at least one of a column and a horn whose cross section becomes smaller as going away from the solar cell 120 . The conductive bumps 128 having this column or horn shape can be easily inserted in the first adhesive film 133 .
- the conductive bumps 128 may be used as stoppers for stopping relative movement of the light transmitting plate 110 and the solar cells 120 .
- the light transmitting plate 110 and the solar cells 120 are closely adhered to each other with the first adhesive film 133 interposed therebetween, and the relative movement of the light transmitting plate 110 and the solar cells 120 may have to be limited so that an interval between the light transmitting plate 110 and the solar cells 120 is equal to a thickness of the first adhesive film 133 . Accordingly, a total height of the conductive bumps 128 and the conductive pad 134 a can be adjusted to be substantially equal to a predetermined interval between the light transmitting plate 110 and the solar cells 120 .
- the conductive bumps 128 can stop the relative movement of the light transmitting plate 110 and the solar cells 120 at a time when the interval between the light transmitting plate 110 and the solar cells 120 is equal to the predetermined interval.
- a solar cell module 100 in which the plurality of solar cells 120 connected in series by the conductive pad 134 a are disposed on the light transmitting plate 110 can be manufactured.
- a molding film 140 may be formed to cover the solar cells 120 S 140 .
- the step of forming the molding film 140 may include the step of forming a resin film to cover non-light receiving surfaces 124 of the solar cells 120 .
- an opaque epoxy resin may be used as the molding film 140 .
- the step of forming a light reflective film 150 which covers the non-light receiving surfaces 124 of the solar cells 120 may be further added.
- the method of manufacturing a solar cell module in accordance with an embodiment of the present invention can attach the solar cell 120 to the light transmitting plate 110 with the first adhesive film 133 interposed therebetween while forcibly inserting the conductive bump 128 bonded to the solar cell 120 in the conductive pad 134 a after attaching the first adhesive film 133 to the light transmitting plate 110 so that the conductive pad 134 a is exposed. Accordingly, the method of manufacturing a solar cell module in accordance with the present invention can manufacture the solar cell module 100 capable of improving reliability of electrical connection between the solar cells 120 since one conductive pad 134 a surrounds and electrically connects the adjacent conductive bumps 128 .
- the method of manufacturing a solar cell module in accordance with an embodiment of the present invention can manufacture the solar cell module 100 having a structure in which the light transmitting plate 110 and the solar cells 120 are bonded to each other with the thin film type first adhesive film 133 disposed on the light transmitting plate 110 . Accordingly, the method of manufacturing a solar cell module can manufacture the solar cell module 100 capable of improving bonding reliability of the solar cell 120 to the light transmitting plate 110 by closely bonding the entire surface of the film structure 130 of the light transmitting plate 110 and the non-light receiving surface 124 of the solar cell 120 .
- the method of manufacturing a solar cell module in accordance with an embodiment of the present invention can manufacture the solar cell module 100 having a structure in which the light transmitting plate 110 and the solar cells 120 are bonded to each other with the thin film type first adhesive film 133 interposed therebetween. Accordingly, the method of manufacturing a solar cell module in accordance with an embodiment of the present invention can manufacture the solar cell module 100 with improved integration by minimizing the interval between the light transmitting plate 110 and the solar cells 120 .
- FIG. 9 is a view showing a mobile apparatus with a solar cell module in accordance with an embodiment of the present invention.
- a mobile apparatus 200 may include a case 210 in which the above-described solar cell module 100 is disposed and a display unit 220 which displays images to the outside.
- An opening 212 may be provided at one side of the case 210 to install the solar cell module 100 therein.
- the opening 212 may mount and fix a light transmitting plate 110 of the solar cell module 100 .
- the solar cell module can be mounted to the case 210 by inserting the light transmitting plate 110 in the opening 212 .
- the light transmitting plate 110 is exposed to the outside, and external light can be incident on solar cells 120 through the light transmitting plate 110 .
- the light transmitting plate 110 since the light transmitting plate 110 is exposed to the outside, it may be provided to have enough strength to protect the solar cell module 100 from external shocks.
- the light transmitting plate 110 introduces the external light into the solar cells 120 while minimizing loss of the external light.
- the display unit 220 may be disposed at the other side of the case 210 .
- the display unit 220 may be configured to display electronic information to the outside so that a user of the mobile apparatus 200 can recognize the electronic information.
- the display unit 220 may include one of various kinds of flat panel display devices.
- the mobile apparatus 200 having the above structure may include the case 210 having the opening 212 through which light is incident and the solar cell module 100 having the light transmitting plate 110 which seals the opening 212 . Accordingly, the mobile apparatus 200 in accordance with the present invention can manufacture the mobile apparatus 200 only by components of the solar cell module 100 without separate tempered glass by directly mounting the light transmitting plate 110 of the solar cell module 100 to the case 210 of the mobile apparatus 200 and using the light transmitting plate 110 as a protective film for protection from external environment.
- a method of manufacturing a mobile apparatus in accordance with an embodiment of the present invention may include the steps of preparing a case 210 having an opening 212 , preparing a solar cell module 100 having solar cells 120 attached to a light transmitting plate 110 with a first adhesive film 133 of FIG. 2 interposed therebetween, and mounting the solar cell module 100 to the opening 212 of the case 210 so that the opening 212 is sealed by the light transmitting plate 110 .
- the method of manufacturing a mobile apparatus in accordance with the present invention can improve integration and manufacturing efficiency of the mobile apparatus 200 by directly mounting the light transmitting plate 110 of the solar cell module 100 to the case 210 of the mobile apparatus 200 and using the light transmitting plate 110 as a protective film for protection from external environment.
- a solar cell module and a mobile apparatus with the same in accordance with the present invention may include a conductive pad which electrically connects conductive bumps of adjacent solar cells, and the conductive pad may have a structure surrounding the conductive bumps. Accordingly, the solar cell module and the mobile apparatus with the same in accordance with the present invention can improve reliability of electrical connection between the solar cells by increasing a bonding area between the adjacent conductive bumps and the conductive pad.
- the solar cell module and the mobile apparatus with the same in accordance with the present invention may bond a light transmitting plate and the solar cells with an adhesive film interposed therebetween, and light receiving surfaces of the solar cells are attached to the entire surface of the adhesive film. Accordingly, the solar cell module and the mobile apparatus with the same in accordance with the present invention can improve bonding reliability of the solar cells to the light transmitting plate.
- the solar cell module and the mobile apparatus with the same in accordance with an embodiment of the present invention may bond the light transmitting plate and the solar cells with the thin film type adhesive film interposed therebetween. Accordingly, the solar cell module and the mobile apparatus with the same in accordance with the present invention can have a structure with improved integration by minimizing an interval between the light transmitting plate and the solar cells.
- a method of manufacturing a solar cell module in accordance with an embodiment of the present invention may attach solar cells to a light transmitting plate with an adhesive film interposed therebetween while forcibly inserting conductive bumps bonded to the solar cells in a conductive pad after attaching the adhesive film to the light transmitting plate so that the conductive pad is exposed. Accordingly, the method of manufacturing a solar cell module in accordance with the present invention can manufacture a solar cell module capable of improving reliability of electrical connection between the solar cells by surrounding and electrically connecting the adjacent conductive bumps through one conductive pad.
- the method of manufacturing a solar cell module in accordance with the present invention can manufacture the solar cell module in which the light transmitting plate and the solar cells are bonded to each other with the thin film type adhesive film disposed on the light transmitting plate. Accordingly, the method of manufacturing a solar cell module in accordance with the present invention can manufacture a solar cell module capable of improving bonding reliability of the solar cell to the light transmitting plate.
- the method of manufacturing a solar cell module in accordance with an embodiment of the present invention can manufacture the solar cell module in which the light transmitting plate and the solar cells are bonded to each other with the thin film type adhesive film disposed therebetween. Accordingly, the method of manufacturing a solar cell module in accordance with the present invention can manufacture a solar cell module with improved integration by minimizing an interval between the light transmitting plate and the solar cells.
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Abstract
Description
- This application claims the benefit under 35 U.S.C. Section 119 of Korean Patent Application Serial No. 10-2010-0087122, entitled SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME, AND MOBILE APPARATUS WITH THE SOLAR CELL MODULE filed on Sep. 6, 2010, which is hereby incorporated by reference in its entirety into this application.
- 1. Field of the Invention
- The present invention relates to a solar cell module and a method of manufacturing the same, and a mobile apparatus with the solar cell module, and more particularly, to a solar cell module capable of improving bonding reliability of solar cells and reliability of electrical connection between the solar cells and a method of manufacturing the same, and a mobile apparatus with the solar cell module.
- 2. Description of the Related Art
- General silicon solar cells can be classified into front and rear electrode structures according to the structure of electrodes. Solar cell modules having these front and rear electrode structures generally may have a chip on board (COB) or chip on glass (COG) type solar cell bonding structure.
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FIG. 1 is a view showing an example of a mobile apparatus with a solar cell module in accordance with the prior art. Referring toFIG. 1 , a mobile apparatus 10 may include acase 20 and asolar cell module 30 embedded in thecase 20.Transparent glass 22, through which light is incident on thesolar cell module 30, may be disposed at one side of thecase 20. Adisplay unit 24 may be disposed at the other side of thecase 20 to display information to the outside. - The
solar cell module 30 may be attached so that a light receiving surface thereof faces thetransparent glass 22. Thesolar cell module 30 may have a COB or COG type solar cell module structure. For example, thesolar cell module 30 has a structure with a printed circuit board (PCB) 32,solar cells 34 attached to one surface of thePCB 32, abonding wire 36 connecting thesolar cells 34 and thePCB 32, and atransparent molding film 38 covering the above components. - The mobile apparatus 10 having the above structure has a structure in which the
transparent glass 22 and thesolar cells 34 are bonded to each other with thetransparent molding film 38 interposed therebetween. An adhesive (not shown) may be further interposed between thetransparent glass 22 and thetransparent molding film 38. At this time, the adhesive is usually formed only in some regions between thetransparent glass 22 and thetransparent molding film 38 to prevent light transmission loss. Accordingly, the mobile apparatus 10 having the above structure has a problem that bonding reliability of thesolar cells 34 is low since adhesive strength of thesolar cells 34 to thetransparent glass 22 is low. - The mobile apparatus 10 having the above structure has a structure in which the
solar cells 34 are electrically connected by a connection means such as thebonding wire 36. In general, since thebonding wire 36 has a structure weak to external shocks, thebonding wires 36, which are bent to be adjacent to each other, may be connected and shorted to each other when thetransparent molding film 38 is formed. Therefore, the mobile apparatus 10 has a structure in which electrical connection between thesolar cells 34 is low. In addition, since it requires a relatively large space to bend thebonding wire 36, in case of using thebonding wire 36, there is a limit to improvement of integration of thesolar cells 34. - The mobile apparatus 10 having the above structure has a structure in which external light is incident on the
solar cells 34 after sequentially passing through thetransparent glass 22 and thetransparent molding film 38. At this time, in case that a predetermined adhesive is interposed between thetransparent glass 22 and thetransparent molding film 38, the external light may be lost through at least three steps. Accordingly, the mobile apparatus 10 has a structure in which light transmittance to thesolar cells 34 is low. This loss of incident light may be greatly generated in a process of passing through thetransparent molding film 38. For example, in case of using a transparent epoxy resin as thetransparent molding film 38, transmittance of the incident light may be reduced to less than 90%. - Further, there is a limit to the integration of the
solar cells 34 having the above structure. For example, a total thickness of thesolar cells 34 may be a total sum of thicknesses of thePCB 32, thesolar cells 34, and thetransparent molding film 38. However, since it is difficult to further improve the integration of thesolar cells 34 having the above structure, it is difficult to meet a recent demand for the integration of the solar cell module. - The present invention has been invented in order to overcome the above-described problems and it is, therefore, an object of the present invention to provide a solar cell module capable of bonding reliability of solar cells to a light transmitting plate and a mobile apparatus with the same.
- It is another object of the present invention to provide a solar cell module capable of improving reliability of electrical connection between solar cells and a mobile apparatus with the same.
- It is still another object of the present invention is to provide a solar cell module capable of improving light incidence on solar cells and a mobile apparatus with the same.
- It is still another object of the present invention is to provide a solar cell module with improved integration and a mobile apparatus with the same.
- It is still another object of the present invention is to provide a method of manufacturing a solar cell module capable of improving bonding reliability of solar cells.
- It is still another object of the present invention is to provide a method of manufacturing a solar cell module capable of improving reliability of electrical connection between solar cells.
- It is still another object of the present invention is to provide a method of manufacturing a solar cell module capable of improving light incidence on solar cells.
- It is still another object of the present invention is to provide a method of manufacturing a solar cell module with improved integration.
- In accordance with one aspect of the present invention to achieve the object, there is provided a solar cell module including: a light transmitting plate having light transmittance; solar cells having bonding pads and conductive bumps bonded to the bonding pads; an adhesive film disposed between the light transmitting plate and the solar cells to bond the light transmitting plate and the solar cells; and a conductive pad disposed by being inserted in the adhesive film and surrounding and electrically connecting the conductive bumps of the adjacent solar cells.
- In accordance with an embodiment of the present invention, the bonding pad may include a first bonding pad connected to a positive electrode of one of the solar cells and a second bonding pad connected to a negative electrode of the other solar cell adjacent to the one solar cell, the conductive bumps may include a first conductive bump bonded to the first bonding pad and a second conductive bump bonded to the second bonding pad, and the conductive pad may electrically connect the first conductive bump and the second conductive bump.
- In accordance with an embodiment of the present invention, the conductive bump may include a stud bump.
- In accordance with an embodiment of the present invention, the conductive bump may have a shape of one of a column and a horn whose cross section becomes smaller as going away from the solar cell.
- In accordance with an embodiment of the present invention, the conductive bump may be used as a spacer for maintaining an interval between the light transmitting plate and the solar cells at a predetermined interval.
- In accordance with an embodiment of the present invention, a total height of the conductive bump and the bonding pad may be equal to the predetermined interval between the light transmitting plate and the solar cell.
- In accordance with an embodiment of the present invention, the solar cell may include a light receiving surface which receives light through the light transmitting plate and a non-light receiving surface opposite to the light receiving surface, and the solar cell module may further include a light reflective film which covers the non-light receiving surface.
- In accordance with an embodiment of the present invention, the light transmitting plate may include an exposed surface exposed to the outside and an unexposed surface facing the light receiving surfaces of the solar cells, and the solar cell module may further include a molding film which covers the unexposed surface.
- In accordance with an embodiment of the present invention, the molding film may be made of an opaque material.
- In accordance with another aspect of the present invention to achieve the object, there is provided a mobile apparatus including: a case having an opening at one side; a display unit disposed at the other side of the case and displaying information to the outside; and a solar cell module disposed in the case and receiving and converting the external light into electric energy, wherein the solar cell module includes: a light transmitting plate disposed in the opening to seal the opening and having light transmittance; solar cells having bonding pads and conductive bumps bonded to the bonding pads; an adhesive film disposed between the light transmitting plate and the solar cells to bond the light transmitting plate and the solar cells; and a conductive pad disposed by being inserted in the adhesive film and surrounding and electrically connecting the conductive bumps of the adjacent solar cells.
- In accordance with an embodiment of the present invention, the light transmitting plate may include transparent glass which is exposed outside the case and introduces external light into the solar cells.
- In accordance with an embodiment of the present invention, the bonding pad may include a first bonding pad connected to a positive electrode of one of the solar cells and a second bonding pad connected to a negative electrode of the other solar cell adjacent to the one solar cell, the conductive bumps may include a first conductive bump bonded to the first bonding pad and a second conductive bump bonded to the second bonding pad, and the conductive pad may electrically connect the first conductive bump and the second conductive bump.
- In accordance with an embodiment of the present invention, the conductive bump may have a shape of one of a column and a horn whose cross section becomes smaller as going away from the solar cell.
- In accordance with an embodiment of the present invention, the conductive bump may be used as a spacer for maintaining an interval between the light transmitting plate and the solar cells at a predetermined interval.
- In accordance with still another aspect of the present invention to achieve the object, there is provided a method of manufacturing a solar cell module including the steps of: preparing a light transmitting plate having light transmittance; preparing a film structure with an adhesive film having a conductive pad; preparing solar cells having bonding pads to which conductive bumps are bonded; attaching the adhesive film to the light transmitting plate while exposing the conductive pad; and bonding the solar cells to the light transmitting plate with the adhesive film interposed therebetween while pressing the conductive pad by the conductive bump to be inserted in the adhesive film.
- In accordance with an embodiment of the present invention, the step of preparing the film structure may include the steps of disposing the conductive pad on a first adhesive film and attaching a second adhesive film to the first adhesive film to seal the conductive pad.
- In accordance with an embodiment of the present invention, the step of preparing the film structure may include the steps of attaching a first protective film to one surface of the adhesive film and attaching a second protective film to the other surface of the adhesive film.
- In accordance with an embodiment of the present invention, the step of preparing the film structure may include the steps of disposing the conductive pad on the first adhesive film, attaching the second adhesive film to the first adhesive film to seal the conductive pad; attaching the first protective film to one surface of the adhesive film, and attaching the second protective film to the other surface of the adhesive film, and the step of attaching the adhesive film to the light transmitting plate may include the steps of separating the first protective film from the first adhesive film, attaching the first adhesive film to the light transmitting plate, and separating the second adhesive film from the first adhesive film while leaving the conductive pad on the first adhesive film.
- In accordance with an embodiment of the present invention, the step of separating the second adhesive film from the first adhesive film may be performed by increasing adhesive strength between the second adhesive film and the second protective film in comparison with adhesive strength between the first adhesive film and the second adhesive film so that the second adhesive film is separated from the first adhesive film together with the second protective film in a process of separating the second protective film from the film structure.
- In accordance with an embodiment of the present invention, the adhesive strength between the first adhesive film and the second adhesive film may be adjusted to be greater than adhesive strength between the first protective film and the first adhesive film.
- In accordance with an embodiment of the present invention, the step of bonding the solar cells to the light transmitting plate may include the step of relatively moving the light transmitting plate and the solar cells, and the conductive bump may be used as a stopper for stopping the relative movement of the light transmitting plate and the solar cells.
- In accordance with an embodiment of the present invention, a stud bump may be used as the conductive bump.
- In accordance with an embodiment of the present invention, the solar cell may include a light receiving surface which receives light through the light transmitting plate and a non-light receiving surface opposite to the light receiving surface, and the method of manufacturing a solar cell module may further include the step of forming a light reflective film which covers the non-light receiving surface.
- In accordance with an embodiment of the present invention, the method of manufacturing a solar cell module may further include the step of forming a molding film of a non-light transmitting material which covers the solar cells.
- These and/or other aspects and advantages of the present general inventive concept will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
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FIG. 1 is a view showing a mobile apparatus in accordance with the prior art; -
FIG. 2 is a view showing a solar cell module in accordance with an embodiment of the present invention; -
FIG. 3 is a flow chart showing a method of manufacturing a solar cell module in accordance with an embodiment of the present invention; -
FIGS. 4 to 8 are views for explaining a process of manufacturing a solar cell module in accordance with an embodiment of the present invention; and -
FIG. 9 is view showing a mobile apparatus with a solar cell module in accordance with an embodiment of the present invention. - Advantages and features of the present invention and methods of accomplishing the same will be apparent with reference to the following embodiments described in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the following embodiments but may be embodied in various other forms. The embodiments are provided to complete the disclosure of the present invention and to completely inform a person with average knowledge in the art of the scope of the present invention. Like reference numerals refer to like elements throughout the specification.
- Terms used herein are provided to explain embodiments, not limiting the present invention. Throughout this specification, the singular form includes the plural form unless the context clearly indicates otherwise. The terms “comprise” and/or “comprising” do not exclude the existence or addition of one or more different components, steps, operations, and/or elements.
- Hereinafter, a solar cell module and a mobile apparatus with the same, and methods of manufacturing the solar cell module and the mobile apparatus in accordance with embodiments of the present invention will be described in detail with reference to the accompanying drawings.
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FIG. 2 is a view showing a solar cell module in accordance with an embodiment of the present invention. Referring toFIG. 2 , asolar cell module 100 may include alight transmitting plate 110,solar cells 120, a firstadhesive film 133, and amolding film 140. - The
light transmitting plate 110 may be made of a light transmitting material. As one example, thelight transmitting plate 110 may include transparent glass having light transmittance. The transparent glass may be tempered glass. Thelight transmitting plate 110 may have an exposedsurface 112 and anunexposed surface 114 opposite to the exposedsurface 112 when being provided in an electronic device such as a mobile device. Thelight transmitting plate 110 is exposed outside the electronic device to be used as a medium for introducing external light into thesolar cells 120 as well as to protect thesolar cell module 100 from external environment. - The
solar cells 120 may be bonded to thelight transmitting plate 110 with the firstadhesive film 133 interposed therebetween. Each of thesolar cells 120 may have alight receiving surface 122 and anon-light receiving surface 124. Thelight receiving surface 122 may be a surface which receives light. Thenon-light receiving surface 124 may be a surface opposite to thelight receiving surface 122. Abonding pad 126 may be disposed in an edge region of thelight receiving surface 122. Thebonding pad 126 may be a metal pad which is electrically connected to a positive or negative electrode of thesolar cell 120. - The
solar cell 120 may further include aconductive bump 128 bonded to thebonding pad 126. Theconductive bump 128 may be a metal body for electrically connecting thesolar cells 120. As one example, a stud bump may be used as theconductive bump 128. In case that theconductive bump 128 is a stud bump, theconductive bump 128 may have a shape of a column or a horn whose cross section becomes smaller as going away from thesolar cell 120. As another example, a solder ball may be used as theconductive bump 128. - The
conductive bumps 128 having the above structure may have a structure inserted in the firstadhesive film 133. For example, theconductive bumps 128 may be provided in the firstadhesive film 133 by being forcibly inserted in the firstadhesive film 133 with aconductive pad 134 a interposed therebetween. In this case, theconductive bumps 128 are surrounded by theconductive pad 134 a as well as embedded in the firstadhesive film 133. Accordingly, since theconductive pad 134 a is configured to surround all exposed portions of theconductive bumps 128, a bonding area between theconductive pad 134 a and theconductive bumps 128 can be increased. - Here, the
conductive pad 134 a may be made of a material having high electrical conductivity for effective electrical connection of theconductive bumps 128. As one example, theconductive pad 134 a may be made of at least one metal material among Au, Ag, Ni, In, Zn, Ti, Cu, Cr, Ta, W, Pt, Fe, and Co. - Meanwhile, the
solar cells 120 may be disposed on thelight transmitting plate 110 to be electrically connected to each other in series. For example, thebonding pad 126 may include afirst bonding pad 126 a connected to a positive electrode of one of thesolar cells 120 and asecond bonding pad 126 b connected to a negative electrode of the othersolar cell 120 adjacent to the onesolar cell 120. At this time, thesolar cells 120 may be disposed so that thefirst bonding pad 126 a and thesecond bonding pad 126 b are alternately positioned on thelight transmitting plate 110. Theconductive bumps 128 may include a firstconductive bump 128 a bonded to thefirst bonding pad 126 a and a secondconductive bump 128 b bonded to thesecond bonding pad 126 b. And, theconductive pad 134 a may be configured to surround the first and secondconductive bumps first bonding pad 126 a and thesecond bonding pad 126 b are electrically connected to each other. Accordingly, thesolar cells 120 may be electrically connected in series by connecting the firstconductive bump 128 a and the secondconductive bump 128 b provided in the adjacentsolar cells 120 through theconductive pad 134 a. - The first
adhesive film 133 may bond thelight transmitting plate 110 and thesolar cells 120. Here, it may be preferred that the firstadhesive film 133 is made of a material having high light transmittance to introduce external light, which is incident through thelight transmitting plate 110, into thesolar cells 120 while minimizing loss of the external light. - The
molding film 140 may protect thesolar cells 120 and aconductive bonding film 132. For example, themolding film 140 may cover theunexposed surface 114 of thelight transmitting plate 110 to seal thesolar cells 120. By themolding film 140, thesolar cells 120 may be sealed and protected from external environment. Meanwhile, since themolding film 140 is disposed on the non-light receiving surfaces 124 of thesolar cells 120, themolding film 140 may not be required to be configured to transmit external light. Accordingly, themolding film 140 may be made of an opaque epoxy resin. Here, a lightreflective film 150 may be interposed between thesolar cells 120 and themolding film 140. - As described above, the
solar cell module 100 in accordance with an embodiment of the present invention includes theconductive pad 134 a which electrically connects theconductive bumps 128 of the adjacentsolar cells 120, and theconductive pad 134 a may have a structure surrounding the adjacentconductive bumps 128. In this case, since theconductive pad 134 a, which electrically connects theconductive bumps 128 of the differentsolar cells 120, has a structure surrounding theconductive bumps 128, the bonding area between theconductive bumps 128 and theconductive pad 134 a can be increased. Accordingly, thesolar cell module 100 in accordance with the present invention can improve reliability of electrical connection of thesolar cells 120 and bonding reliability of thelight transmitting plate 110 and thesolar cells 120 by increasing the bonding area between theconductive bumps 128 and theconductive pad 134 a which electrically connects theconductive bumps 128 of thesolar cells 120. - Further, the
solar cell module 100 in accordance with an embodiment of the present invention may have a structure in which thelight transmitting plate 110 and thesolar cells 120 are bonded to each other with the thin film type firstadhesive film 133 interposed therebetween. Accordingly, thesolar cell module 100 in accordance with the present invention may have a structure with improved integration by minimizing an interval between thelight transmitting plate 110 and thesolar cells 120. - Further, the
solar cell module 100 in accordance with an embodiment of the present invention may have a structure in which theconductive bumps 128 bonded to thesolar cells 120 are electrically connected by using theconductive pad 134 a disposed on the firstadhesive film 133. Accordingly, thesolar cell module 100 in accordance with the present invention can have a structure with improved integration by minimizing an installation space of a component for electrically connecting thesolar cells 120 in comparison with a case using a component such as a bonding wire. - Continuously, a method of manufacturing a solar cell module in accordance with an embodiment of the present invention will be described in detail. Here, a repeated description of the above-described
solar cell module 100 will be omitted or simplified. -
FIG. 3 is a flow chart showing a method of manufacturing a solar cell module in accordance with an embodiment of the present invention. And,FIGS. 4 to 8 are views for explaining a process of manufacturing a solar cell module in accordance with an embodiment of the present invention. - Referring to
FIGS. 3 and 4 , a film structure 130 having aconductive pad 134 may be prepared S110. First, anadhesive film 132 may be prepared. The step of preparing theadhesive film 132 may include the steps of preparing a firstadhesive film 133 having light transmittance, disposing aconductive pad 134 on the firstadhesive film 133, and attaching a secondadhesive film 135 on the firstadhesive film 133 to seal theconductive pad 134. Here, the firstadhesive film 133 may be a transparent film having high light transmittance. And, theconductive pad 134 may be a metal pattern made of a material selected from various kinds of metal. For example, theconductive pad 134 may be made of a metal material including at least one of Cu, Ni, W, Co, Ag, and Au. - And, the
adhesive film 132 may be covered and protected by aprotective film 136. For example, theadhesive film 132 may be sealed from external environment by covering the firstadhesive film 133 exposed to the outside with a firstprotective film 137 and covering the secondadhesive film 135 exposed to the outside with a secondprotective film 138. Accordingly, the film structure 130, which consists of theadhesive film 132 and theprotective film 136 covering the outside of theadhesive film 132, can be manufactured. - Meanwhile, the first
adhesive film 133, the secondadhesive film 135, the firstprotective film 137, and the secondprotective film 138 may be provided to have different adhesive strengths. For example, adhesive strength between the secondadhesive film 135 and the secondprotective film 138 may be greater than adhesive strength between the firstadhesive film 133 and the secondadhesive film 135. Accordingly, the secondadhesive film 135 can be selectively separated from the firstadhesive film 133 by separating the secondprotective film 138 from the film structure 130. Further, the adhesive force between the firstadhesive film 133 and the secondadhesive film 135 may be greater than adhesive strength between the firstadhesive film 133 and the firstprotective film 137. Accordingly, in case of separating the firstprotective film 137 from the film structure 130, only the firstprotective film 137 can be separated from the firstadhesive film 133 without separation of the firstadhesive film 133 and the secondadhesive film 135. - Referring to
FIGS. 3 and 5 , theadhesive film 132 may be attached to alight transmitting plate 110 so that aconductive pad 134 is exposed S120. For example, the firstadhesive film 133 may be attached to thelight transmitting plate 110 after separating the firstprotective film 137 from the film structure 130 to expose the firstadhesive film 133. And, the secondadhesive film 135 may be separated from the firstadhesive film 133 to expose theconductive pad 134. At this time, the step of separating the secondadhesive film 135 may be performed by separating the secondprotective film 138 from the film structure 130. - Through the above process, the first
adhesive film 133 and theconductive pad 134 disposed on the firstadhesive film 133 can be disposed on thelight transmitting plate 110. - Referring to
FIGS. 3 and 6 ,solar cells 120 havingconductive bumps 128 may be prepared S130. First, thesolar cells 120 havingbonding pads 126 may be manufactured. At this time, thebonding pad 126 may consist of afirst bonding pad 126 a connected to a positive electrode of one of thesolar cells 120 and asecond bonding pad 126 b connected to a negative electrode of the othersolar cell 120 adjacent to the onesolar cell 120. Thebonding pad 126 may include a circuit pattern of thesolar cell 120 such as a bus-bar. - And, a first
conductive bump 128 a may be bonded to thefirst bonding pad 126 a, and a secondconductive bump 128 b may be bonded to thesecond bonding pad 126 b. Various kinds of bumps may be used as theconductive bump 128. As one example, a stud bump may be used as theconductive bump 128. As another example, a solar ball may be used as theconductive bump 128. - Referring to
FIGS. 3 and 7 , thesolar cell 120 may be bonded to thelight transmitting plate 110 while pressing theconductive pad 134 by theconductive bump 128 to be forcibly inserted in theadhesive film 132 S140. For example, a plurality ofsolar cells 120 may be disposed on the same plane in parallel. At this time, thesolar cells 120 may be aligned so that the firstconductive bump 128 a bonded to thefirst bonding pad 126 a of onesolar cell 120 is adjacent to the secondconductive bump 128 b bonded to thesecond bonding pad 126 b of the othersolar cell 120. And, thesolar cells 120 may be aligned so that the adjacent first and secondconductive bumps conductive pad 134. - And, the
solar cells 120 may be attached to thelight transmitting plate 110 while forcibly inserting the first and secondconductive bumps conductive pad 134. Accordingly, thelight transmitting plate 110 and thesolar cells 120 may be bonded to each other with the firstadhesive film 133 interposed therebetween. In addition, the adjacent first and secondconductive bumps adhesive film 133 while pressing oneconductive pad 134. Accordingly, theconductive pad 134 can be formed into aconductive pad 134 a having a structure for electrically connecting the adjacent first and secondconductive bumps conductive bumps - Meanwhile, a shape of the
conductive bumps 128 may be adjusted so that theconductive bumps 128 can be easily forcibly inserted in the firstadhesive film 133. For this, stud bumps can be used as theconductive bumps 128. In case that theconductive bumps 128 are stud bumps, theconductive bumps 128 may have a shape of at least one of a column and a horn whose cross section becomes smaller as going away from thesolar cell 120. Theconductive bumps 128 having this column or horn shape can be easily inserted in the firstadhesive film 133. - Further, in a process of bonding the
solar cells 120 to thelight transmitting plate 110, theconductive bumps 128 may be used as stoppers for stopping relative movement of thelight transmitting plate 110 and thesolar cells 120. For example, thelight transmitting plate 110 and thesolar cells 120 are closely adhered to each other with the firstadhesive film 133 interposed therebetween, and the relative movement of thelight transmitting plate 110 and thesolar cells 120 may have to be limited so that an interval between thelight transmitting plate 110 and thesolar cells 120 is equal to a thickness of the firstadhesive film 133. Accordingly, a total height of theconductive bumps 128 and theconductive pad 134 a can be adjusted to be substantially equal to a predetermined interval between thelight transmitting plate 110 and thesolar cells 120. In this case, in the process of bonding thelight transmitting plate 110 and thesolar cells 120, theconductive bumps 128 can stop the relative movement of thelight transmitting plate 110 and thesolar cells 120 at a time when the interval between thelight transmitting plate 110 and thesolar cells 120 is equal to the predetermined interval. - Through the above processes, a
solar cell module 100 in which the plurality ofsolar cells 120 connected in series by theconductive pad 134 a are disposed on thelight transmitting plate 110 can be manufactured. - Referring to
FIGS. 3 and 8 , amolding film 140 may be formed to cover thesolar cells 120 S140. The step of forming themolding film 140 may include the step of forming a resin film to cover non-light receiving surfaces 124 of thesolar cells 120. At this time, an opaque epoxy resin may be used as themolding film 140. Here, before forming themolding film 140, the step of forming a lightreflective film 150 which covers thenon-light receiving surfaces 124 of thesolar cells 120 may be further added. - As described above, the method of manufacturing a solar cell module in accordance with an embodiment of the present invention can attach the
solar cell 120 to thelight transmitting plate 110 with the firstadhesive film 133 interposed therebetween while forcibly inserting theconductive bump 128 bonded to thesolar cell 120 in theconductive pad 134 a after attaching the firstadhesive film 133 to thelight transmitting plate 110 so that theconductive pad 134 a is exposed. Accordingly, the method of manufacturing a solar cell module in accordance with the present invention can manufacture thesolar cell module 100 capable of improving reliability of electrical connection between thesolar cells 120 since oneconductive pad 134 a surrounds and electrically connects the adjacentconductive bumps 128. - The method of manufacturing a solar cell module in accordance with an embodiment of the present invention can manufacture the
solar cell module 100 having a structure in which thelight transmitting plate 110 and thesolar cells 120 are bonded to each other with the thin film type firstadhesive film 133 disposed on thelight transmitting plate 110. Accordingly, the method of manufacturing a solar cell module can manufacture thesolar cell module 100 capable of improving bonding reliability of thesolar cell 120 to thelight transmitting plate 110 by closely bonding the entire surface of the film structure 130 of thelight transmitting plate 110 and thenon-light receiving surface 124 of thesolar cell 120. - The method of manufacturing a solar cell module in accordance with an embodiment of the present invention can manufacture the
solar cell module 100 having a structure in which thelight transmitting plate 110 and thesolar cells 120 are bonded to each other with the thin film type firstadhesive film 133 interposed therebetween. Accordingly, the method of manufacturing a solar cell module in accordance with an embodiment of the present invention can manufacture thesolar cell module 100 with improved integration by minimizing the interval between thelight transmitting plate 110 and thesolar cells 120. - Hereinafter, a mobile apparatus and a method of manufacturing the same will be described in detail. Here, repeated descriptions of the above-described solar cell module and the method of manufacturing the same will be omitted or simplified.
-
FIG. 9 is a view showing a mobile apparatus with a solar cell module in accordance with an embodiment of the present invention. Referring toFIG. 9 , a mobile apparatus 200 may include acase 210 in which the above-describedsolar cell module 100 is disposed and adisplay unit 220 which displays images to the outside. - An
opening 212 may be provided at one side of thecase 210 to install thesolar cell module 100 therein. For example, theopening 212 may mount and fix alight transmitting plate 110 of thesolar cell module 100. Accordingly, the solar cell module can be mounted to thecase 210 by inserting thelight transmitting plate 110 in theopening 212. - The
light transmitting plate 110 is exposed to the outside, and external light can be incident onsolar cells 120 through thelight transmitting plate 110. Here, since thelight transmitting plate 110 is exposed to the outside, it may be provided to have enough strength to protect thesolar cell module 100 from external shocks. In addition, thelight transmitting plate 110 introduces the external light into thesolar cells 120 while minimizing loss of the external light. - The
display unit 220 may be disposed at the other side of thecase 210. Thedisplay unit 220 may be configured to display electronic information to the outside so that a user of the mobile apparatus 200 can recognize the electronic information. For this, thedisplay unit 220 may include one of various kinds of flat panel display devices. - The mobile apparatus 200 having the above structure may include the
case 210 having theopening 212 through which light is incident and thesolar cell module 100 having thelight transmitting plate 110 which seals theopening 212. Accordingly, the mobile apparatus 200 in accordance with the present invention can manufacture the mobile apparatus 200 only by components of thesolar cell module 100 without separate tempered glass by directly mounting thelight transmitting plate 110 of thesolar cell module 100 to thecase 210 of the mobile apparatus 200 and using thelight transmitting plate 110 as a protective film for protection from external environment. - Meanwhile, one example of a method of manufacturing the mobile apparatus 200 is as follows. A method of manufacturing a mobile apparatus in accordance with an embodiment of the present invention may include the steps of preparing a
case 210 having anopening 212, preparing asolar cell module 100 havingsolar cells 120 attached to alight transmitting plate 110 with a firstadhesive film 133 ofFIG. 2 interposed therebetween, and mounting thesolar cell module 100 to theopening 212 of thecase 210 so that theopening 212 is sealed by thelight transmitting plate 110. Accordingly, the method of manufacturing a mobile apparatus in accordance with the present invention can improve integration and manufacturing efficiency of the mobile apparatus 200 by directly mounting thelight transmitting plate 110 of thesolar cell module 100 to thecase 210 of the mobile apparatus 200 and using thelight transmitting plate 110 as a protective film for protection from external environment. - As can be seen from the foregoing, a solar cell module and a mobile apparatus with the same in accordance with the present invention may include a conductive pad which electrically connects conductive bumps of adjacent solar cells, and the conductive pad may have a structure surrounding the conductive bumps. Accordingly, the solar cell module and the mobile apparatus with the same in accordance with the present invention can improve reliability of electrical connection between the solar cells by increasing a bonding area between the adjacent conductive bumps and the conductive pad.
- The solar cell module and the mobile apparatus with the same in accordance with the present invention may bond a light transmitting plate and the solar cells with an adhesive film interposed therebetween, and light receiving surfaces of the solar cells are attached to the entire surface of the adhesive film. Accordingly, the solar cell module and the mobile apparatus with the same in accordance with the present invention can improve bonding reliability of the solar cells to the light transmitting plate.
- The solar cell module and the mobile apparatus with the same in accordance with an embodiment of the present invention may bond the light transmitting plate and the solar cells with the thin film type adhesive film interposed therebetween. Accordingly, the solar cell module and the mobile apparatus with the same in accordance with the present invention can have a structure with improved integration by minimizing an interval between the light transmitting plate and the solar cells.
- A method of manufacturing a solar cell module in accordance with an embodiment of the present invention may attach solar cells to a light transmitting plate with an adhesive film interposed therebetween while forcibly inserting conductive bumps bonded to the solar cells in a conductive pad after attaching the adhesive film to the light transmitting plate so that the conductive pad is exposed. Accordingly, the method of manufacturing a solar cell module in accordance with the present invention can manufacture a solar cell module capable of improving reliability of electrical connection between the solar cells by surrounding and electrically connecting the adjacent conductive bumps through one conductive pad.
- The method of manufacturing a solar cell module in accordance with the present invention can manufacture the solar cell module in which the light transmitting plate and the solar cells are bonded to each other with the thin film type adhesive film disposed on the light transmitting plate. Accordingly, the method of manufacturing a solar cell module in accordance with the present invention can manufacture a solar cell module capable of improving bonding reliability of the solar cell to the light transmitting plate.
- The method of manufacturing a solar cell module in accordance with an embodiment of the present invention can manufacture the solar cell module in which the light transmitting plate and the solar cells are bonded to each other with the thin film type adhesive film disposed therebetween. Accordingly, the method of manufacturing a solar cell module in accordance with the present invention can manufacture a solar cell module with improved integration by minimizing an interval between the light transmitting plate and the solar cells.
- The foregoing description illustrates the present invention. Additionally, the foregoing description shows and explains only the preferred embodiments of the present invention, but it is to be understood that the present invention is capable of use in various other combinations, modifications, and environments and is capable of changes and modifications within the scope of the inventive concept as expressed herein, commensurate with the above teachings and/or the skill or knowledge of the related art. The embodiments described hereinabove are further intended to explain best modes known of practicing the invention and to enable others skilled in the art to utilize the invention in such, or other, embodiments and with the various modifications required by the particular applications or uses of the invention. Accordingly, the description is not intended to limit the invention to the form disclosed herein. Also, it is intended that the appended claims be construed to include alternative embodiments.
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2010-0087122 | 2010-09-06 | ||
KR1020100087122A KR101128546B1 (en) | 2010-09-06 | 2010-09-06 | Solar cell module and method for manufacturing the same, and mobile apparatus with the solar cell module |
Publications (2)
Publication Number | Publication Date |
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US20120055531A1 true US20120055531A1 (en) | 2012-03-08 |
US8692109B2 US8692109B2 (en) | 2014-04-08 |
Family
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Family Applications (1)
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US13/015,079 Expired - Fee Related US8692109B2 (en) | 2010-09-06 | 2011-01-27 | Solar cell module and method of manufacturing the same, and mobile apparatus with the solar cell module |
Country Status (3)
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US (1) | US8692109B2 (en) |
KR (1) | KR101128546B1 (en) |
CN (1) | CN102386241A (en) |
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TWI514602B (en) * | 2013-03-28 | 2015-12-21 | Zenith Materials Technology Corp | Can be a combination of two-way combination of solar modules |
US9335589B2 (en) | 2014-01-10 | 2016-05-10 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
EP3142156A1 (en) * | 2015-09-08 | 2017-03-15 | Lg Electronics Inc. | Solar cell module and method for manufacturing the same |
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Also Published As
Publication number | Publication date |
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KR20120024286A (en) | 2012-03-14 |
CN102386241A (en) | 2012-03-21 |
KR101128546B1 (en) | 2012-03-27 |
US8692109B2 (en) | 2014-04-08 |
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