CN210776724U - Optical fingerprint module and electronic equipment - Google Patents
Optical fingerprint module and electronic equipment Download PDFInfo
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- CN210776724U CN210776724U CN201922017402.3U CN201922017402U CN210776724U CN 210776724 U CN210776724 U CN 210776724U CN 201922017402 U CN201922017402 U CN 201922017402U CN 210776724 U CN210776724 U CN 210776724U
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Abstract
The utility model provides an optical fingerprint module, including base plate, circuit board and optical fingerprint chip, the circuit board sets up on the base plate, and the circuit board is equipped with the mounting hole to expose the base plate of below, optical fingerprint chip fixes on the base plate in the mounting hole, and the circuit board has the first surface and deviates from the second surface of first surface, and first surface is to the sunken concave part that forms of second surface, and the concave part is less than the holistic thickness of circuit board apart from the thickness on base plate surface, and optical fingerprint chip passes through wire electric connection on the concave part of circuit board. The utility model also provides an electronic equipment. The utility model provides an optics fingerprint module has reduced thickness to the complete machine thickness space that occupies has been reduced.
Description
Technical Field
The utility model relates to an optics technical field especially relates to an optics fingerprint module and electronic equipment.
Background
Along with the rapid development of the mobile internet era, the integrated functionality of the mobile phone is more complete, nowadays, the size of the screen has also developed to a critical point, and in order to pursue a better visual effect, another form of appearance innovation, namely 'full screen', is produced. The advent of full-face screens has necessarily led to a revolution in the updating of fingerprint identification technology.
At present, each mobile terminal adopts an optical fingerprint scheme to realize a full-screen scheme and a fingerprint scheme under a layout screen, namely, an optical fingerprint module is pasted on the back of a display module of the whole mobile terminal. However, the optical fingerprint module has a relatively thick thickness, so that the occupied thickness space of the whole machine is relatively large, which is not favorable for the development of light and thin electronic equipment.
As shown in fig. 1, an optical fingerprint module in the prior art includes a substrate 1, a circuit board 2, an optical fingerprint chip 3, and a frame-shaped support 50, wherein the circuit board 2 is disposed on the substrate 1, the optical fingerprint chip 3 is disposed on the circuit board 2, and the frame-shaped support 50 is fixed on the circuit board 2. Wherein, frame shape support 50 is independent structure, and it needs to be fixed on circuit board 2 through the viscose, and frame shape support 50 is the plastic material, and thickness is great, leads to optics fingerprint module thickness great. The reference surface that optics fingerprint chip 3 was laminated is on circuit board 2 upper surface, and the laminating is in circuit board 2 back, and optics fingerprint chip 3's relative position is higher, and the camber of binding connecting wire 4 is also higher relatively, and then causes the high increase of gluing of follow-up wire 4, is difficult to realize thin optics fingerprint module packaging structure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an optics fingerprint module and electronic equipment has reduced the thickness of optics fingerprint module to the complete machine thickness space that occupies has been reduced.
The utility model provides an optical fingerprint module, including base plate, circuit board and optical fingerprint chip, the circuit board set up in on the base plate, the circuit board is equipped with the mounting hole to expose the base plate of below, optical fingerprint chip fixes in the mounting hole on the base plate, the circuit board has the first surface and deviates from the second surface of first surface, first surface is to the sunken concave part that forms of second surface, the concave part distance the thickness on substrate surface is less than the holistic thickness of circuit board, optical fingerprint chip passes through wire electric connection be in the circuit board on the concave part.
Furthermore, the circuit board comprises a first single panel and a second single panel, the first single panel is arranged on the second single panel, the first single panel is provided with a first gap, the concave portion is formed in the area, corresponding to the first gap, of the second single panel, and the optical fingerprint chip is electrically connected to the concave portion through the wire.
Furthermore, a pad is arranged on the concave portion, the pad and the mounting hole are arranged adjacently, and the optical fingerprint chip is electrically connected to the pad through the lead.
Further, the circuit board is a double-sided board, the double-sided board includes a first copper layer, a second copper layer and a base material clamped between the first copper layer and the second copper layer, the first copper layer is disposed on the second copper layer, the second copper layer is provided with a second notch, one side of the first copper layer extends toward the substrate and covers the second notch, the first copper layer disposed on the substrate forms the concave portion, and the optical fingerprint chip is electrically connected to the concave portion through the wire.
Furthermore, a pad is arranged on the concave portion, the pad and the mounting hole are arranged adjacently, and the optical fingerprint chip is electrically connected to the pad through the lead.
Further, optics fingerprint module still includes the cover plate, the cover plate is fixed on the circuit board, just the cover plate centers on optics fingerprint chip and establishes, the cover plate is black cover plate.
Further, the cover plate is a steel plate, and the surface of the steel plate is subjected to black treatment; or the cover plate is made of black flexible material.
Further, the optics fingerprint module still includes sealed glue, the cover plate with the circuit board with be equipped with the clearance between the optics fingerprint chip, sealed glue fill in the clearance, just sealed glue will the wire parcel, and cover on the concave part with the edge of optics fingerprint chip, the cover plate with sealed glue parallel and level.
Furthermore, a micro lens is arranged on one side, away from the substrate, of the optical fingerprint chip.
The utility model also provides an electronic equipment, including foretell optics fingerprint module.
The utility model provides an optics fingerprint module and electronic equipment, through seting up the mounting hole at the circuit board, fix optics fingerprint chip on the base plate in the mounting hole, optics fingerprint chip's stationary plane is less than the top surface of circuit board, the mounting height of optics fingerprint chip has been reduced, and the first surface of circuit board is to the sunken concave part that forms of second surface, the concave part is less than the holistic thickness of circuit board apart from the thickness on substrate surface, the position of concave part is less than the position of circuit board peak promptly, optics fingerprint chip passes through wire electric connection on the concave part of circuit board, because the position of concave part is lower, so the arc height of the wire of connecting on the concave part also correspondingly reduces, thereby make the position of sealed glue reduce, so the thickness of optics fingerprint module has been reduced.
Drawings
FIG. 1 is a schematic diagram of an optical fingerprint module according to the prior art;
fig. 2 is a schematic structural diagram of an optical fingerprint module according to a first embodiment of the present invention;
fig. 3 is a schematic structural view of an optical fingerprint module according to a second embodiment of the present invention.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
Example one
As shown in fig. 2, the embodiment of the present invention provides an optical fingerprint module, including base plate 1, circuit board 2 and optical fingerprint chip 3, base plate 1 is the hard board, circuit board 2 sets up on base plate 1, circuit board 2 is equipped with mounting hole 20, base plate 1 in order to expose the below, optical fingerprint chip 3 fixes on base plate 1 in mounting hole 20, circuit board 2 has first surface 21 and the second surface 22 that deviates from first surface 21, first surface 21 is sunken to form concave part 23 towards second surface 22, concave part 23 is less than the holistic thickness of circuit board 2 apart from the thickness on base plate 1 surface, optical fingerprint chip 3 passes through wire 4 electric connection on concave part 23 of circuit board 2.
It can be understood that the first surface 21 is a surface of the circuit board 2 far from the substrate 1, the second surface 22 is a surface of the circuit board 2 attached to the substrate 1, and the first surface 21 is recessed toward the second surface 22 to form the recess 23, it can be known that the highest point of the recess 23 is certainly lower than the highest point of the circuit board 2, that is, the thickness of the recess 23 from the substrate 1 is smaller than the thickness of the entire circuit board 2 from the substrate 1, and then when the wire 4 is bound, the arc height of the wire 4 bound on the recess 23 is further reduced on the basis that the optical fingerprint chip 3 is fixed on the substrate 1 in the mounting hole 20 of the circuit board 2.
In the present embodiment, the substrate 1 is a steel plate, for example, a reinforced steel plate. More specifically, the substrate 1 is a stainless steel reinforcing plate. The steel plate is matched with the circuit board 2 for use, so that the circuit board 2 can be supported, the strength of the circuit board 2 is improved, and the product is convenient to assemble. It is understood that the substrate 1 may be other substrates 1 having high hardness and not easily deformed.
In the present embodiment, the wiring board 2 includes a first single panel 24 and a second single panel 25. Specifically, the first single-sided board 24 and the second single-sided board 25 are stacked and glued together to form a press-fit structure, so as to implement the dual-layer signal transmission of fingerprint identification. The first single-sided board 24 is arranged on the second single-sided board 25, the second single-sided board 25 is fixed on the substrate 1 through thermosetting adhesive, and the metal circuits of the first single-sided board 24 and the second single-sided board 25 are respectively positioned on one side far away from the substrate 1. The surface of the first single-sided board 24 away from the substrate 1 is a first surface 21, the surface of the second single-sided board 25 attached to the substrate 1 is a second surface 22, and the first surface 21 and the second surface 22 are two surfaces of the first single-sided board 24 opposite to the second single-sided board 25.
It should be noted that the first single panel 24 is provided with a first notch 241, and the second single panel 25 is provided with a concave portion 23 in a region corresponding to the first notch 241. Specifically, the first notch 241 is close to the optical fingerprint chip 3, and the first single panel 24 is cut away at a position corresponding to the first notch 241 to expose the concave portion 23 area of the second single panel 25 below. The thickness of the concave portion 23 is smaller than that of the pressing structure formed by the first single-sided board 24 and the second single-sided board 25, and the optical fingerprint chip 3 is electrically connected to the concave portion 23 through the wire 4. It will be appreciated that the location of the connection point of the wire 4 on the recess 23 will be lower due to the smaller thickness of the recess 23.
Specifically, the recess 23 is provided with a pad 231, and the pad 231 is disposed adjacent to the mounting hole 20. The bonding pad 231 is located on the top surface of the concave portion 23 near the optical fingerprint chip 3, and the optical fingerprint chip 3 is electrically connected to the bonding pad 231 with a preset metal circuit on the concave portion 23 through the wire 4, that is, one end of the wire 4 is connected to the optical fingerprint chip 3, and the other end is connected to the bonding pad 231 on the concave portion 23 of the second single-sided board 25. Preferably, gold wire is used as the wire 4.
Further, optics fingerprint module still includes cover plate 5, and cover plate 5 is fixed on circuit board 2. Specifically, the cover plate 5 is located the circuit board 2 and keeps away from one side of base plate 1, and the cover plate 5 is established around optics fingerprint chip 3, and the position that the cover plate 5 corresponds circuit board 2 mounting hole 20 sets up the periphery at optics fingerprint chip 3, and the cover plate 5 is black cover plate 5. In this embodiment, the cover 5 is fixed to the first single panel 24.
In this embodiment, the cover plate 5 is a steel plate, and black processing is done on the steel plate surface to form the black cover plate 5, the stray light around the optical fingerprint chip 3 can be absorbed by the black cover plate 5 to prevent diffuse reflection, and the identification precision is improved. Specifically, the cover plate 5 may be a stainless steel plate. It will be appreciated that the cover 5 may be made of other rigid, non-deformable sheet materials to provide good support. Preferably, the cover plate 5 and the circuit board 2 adopt an integrated into one piece technology, and the cover plate 5, the first single-sided board 24, the second single-sided board 25 and the substrate 1 constitute a press-fit structure, so that the optical fingerprint module structure is simpler, and compared with the plastic material frame-shaped support 50 in the traditional structure, the plastic material frame-shaped support 50 is adhered to the surface of the circuit board 2 through thermosetting adhesive, and the thickness of the cover plate 5 of the optical fingerprint module of the embodiment is smaller than the thickness of the frame-shaped support 50.
In some other embodiments, the cover plate 5 is made of black flexible material, and the stress of the display screen on the optical fingerprint module can be released in the fingerprint pressing process. Alternatively, the black flexible material is black Mylar (Mylar) or black Polyimide (PI).
Further, optics fingerprint module is still including sealed glue 6, is equipped with the clearance between 5 and circuit board 2 of cover plate and the optics fingerprint chip 3, and sealed glue 6 is filled in the clearance, and sealed glue 6 wraps up wire 4 to cover on concave part 23 and the edge of optics fingerprint chip 3. The sealant 6 can protect the lead 4 and prevent the lead 4 from being damaged or corroded to fail. In particular, the cover plate 5 is flush with the sealant 6.
It can be known that the corresponding first breach 241 department of first single-sided board 24 is amputated, and the length of first single-sided board 24 is less than the length of second single-sided board 25, and one side that first single-sided board 24 and second single-sided board 25 are close to optical fingerprint chip 3 forms a stair structure, covers this stair structure when sealed glue 6 parcel wire 4, more is favorable to sealed 6 parcel of glue, reaches better sealed effect.
One side that base plate 1 was kept away from to optics fingerprint chip 3 is equipped with microlens 31 (mirrolens) to assemble light, make the light of pressing the finger reflection sense by optics fingerprint chip 3 more, help improving the fingerprint imaging quality under the darker fingerprint collection environment of light. The micro lens 31 is disposed above a photosensitive layer (not shown) of the optical fingerprint chip 3, and the photosensitive layer includes a plurality of photosensitive elements distributed at intervals. Specifically, the microlens 31 includes a plurality of light-gathering portions and a plurality of spacing portions which are distributed at intervals, the light-gathering portions are convex spheres, the plurality of light-gathering portions of the microlens 31 and the plurality of photosensitive elements of the photosensitive layer are distributed in a one-to-one correspondence manner, one spacing portion is arranged between every two adjacent light-gathering portions, a photosensitive unit gap is formed between every two adjacent photosensitive elements, and the plurality of spacing portions and the plurality of photosensitive unit gaps are distributed in a one-to-one correspondence manner.
Specifically, the optical fingerprint chip 3 is provided with a hollow area (not shown) above the micro lens 31 to expose the effective area of the optical fingerprint chip 3, so as not to affect the precision of the optical fingerprint chip 3.
Example two
The present embodiment is the same as the first embodiment, and the description of the same parts is omitted here, except that: as shown in fig. 3, the circuit board 2 is a double-sided board, the circuit board 2 includes a first copper layer 26, a second copper layer 27, and a base material sandwiched between the first copper layer 26 and the second copper layer 27, the first copper layer 26 is disposed on the second copper layer 27, and the second copper layer 27 is fixed on the substrate 1. Specifically, the surface of the first copper layer 26 away from the substrate 1 is a first surface 21, the surface of the second copper layer 27 attached to the substrate 1 is a second surface 22, the first surface 21 and the second surface 22 are two opposite surfaces of a double-sided board, and the metal lines of the double-sided board are respectively distributed on the first surface 21 and the second surface 22.
It should be noted that the second copper layer 27 is provided with a second notch 271, one side of the first copper layer 26 extends toward the substrate 1 and covers the second notch 271 and is disposed on the substrate 1, and the first copper layer 26 disposed on the substrate 1 forms the recess 23, i.e., the recess 23 is a region of the first copper layer 26 corresponding to the second notch 271. Specifically, the second notch 271 is close to the optical fingerprint chip 3, and the position of the second copper layer 27 corresponding to the second notch 271 is cut away, so that one side of the first copper layer 26 located above extends toward the substrate 1 and covers the second notch 271 and is disposed on the substrate 1. The thickness of the concave portion 23 is smaller than the thickness of the whole double-sided board, and the optical fingerprint chip 3 is electrically connected to the concave portion 23 through the wire 4. It will be appreciated that since the recess 23 of the first copper layer 26 is provided on the substrate 1 and the thickness of the recess 23 is small, the position of the connection point of the wire 4 on the recess 23 will be low.
Specifically, the recess 23 is provided with a pad 231, and the pad 231 is disposed adjacent to the mounting hole 20. The bonding pad 231 is located on the top surface of the concave portion 23 near the optical fingerprint chip 3, and the optical fingerprint chip 3 is electrically connected to the bonding pad 231 with a preset metal circuit on the concave portion 23 through the wire 4, that is, one end of the wire 4 is connected to the optical fingerprint chip 3, and the other end is connected to the bonding pad 231 on the concave portion 23 of the first copper layer 26.
The optical fingerprint module further comprises a cover plate 5, and in this embodiment, the cover plate 5 is fixed on the first copper layer 26 of the circuit board 2. Preferably, the cover plate 5 and the circuit board 2 of the double-sided circuit adopt an integrated molding process, and a press fit structure is formed by the cover plate 5, the circuit board 2 and the substrate 1, so that the optical fingerprint module structure is simpler.
The embodiment of the utility model provides an electronic equipment is still provided, including foretell optics fingerprint module, its embodiment is as above, no longer gives unnecessary details here.
To sum up, the optical fingerprint module and the electronic device provided by the embodiment of the present invention, by forming the mounting hole 20 on the circuit board 2 of the optical fingerprint module, and adopting the structure that the circuit board 2 is hollowed out corresponding to the mounting hole 20, the optical fingerprint chip 3 is fixed on the substrate 1 in the mounting hole 20, the fixing surface of the optical fingerprint chip 3 is lower than the top surface of the circuit board 2, so as to reduce the mounting height of the optical fingerprint chip 3, and the first surface 21 of the circuit board 2 is recessed towards the second surface 22 to form the concave portion 23, the thickness of the concave portion 23 from the surface of the substrate 1 is smaller than the whole thickness of the circuit board 2, i.e. the position of the concave portion 23 is lower than the highest point of the circuit board 2, the optical fingerprint chip 3 is electrically connected to the concave portion 23 of the circuit board 2 through the wire 4, because the position of the concave portion 23 is lower, thereby make sealed position of gluing 6 reduce, so reduced the thickness of optics fingerprint module, reduced the complete machine thickness space that occupies, be favorable to electronic equipment's frivolous development.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides an optical fingerprint module, includes base plate, circuit board and optical fingerprint chip, the circuit board set up in on the base plate, its characterized in that, the circuit board is equipped with the mounting hole to expose the base plate of below, optical fingerprint chip fixes in the mounting hole on the base plate, the circuit board has the first surface and deviates from the second surface of first surface, first surface is to the sunken concave part that forms of second surface, the concave part distance the thickness on base plate surface is less than the holistic thickness of circuit board, optical fingerprint chip passes through wire electric connection the circuit board on the concave part.
2. The optical fingerprint module of claim 1, wherein the circuit board comprises a first single panel and a second single panel, the first single panel is disposed on the second single panel, the first single panel is provided with a first gap, the concave portion is formed in a region of the second single panel corresponding to the first gap, and the optical fingerprint chip is electrically connected to the concave portion through the conductive wire.
3. The optical fingerprint module of claim 2 wherein the recess has a pad disposed thereon, the pad being disposed adjacent to the mounting hole, the optical fingerprint chip being electrically connected to the pad through the conductive line.
4. The optical fingerprint module of claim 1, wherein the circuit board is a double-sided board, the double-sided board includes a first copper layer, a second copper layer, and a base material sandwiched between the first copper layer and the second copper layer, the first copper layer is disposed on the second copper layer, the second copper layer is disposed with a second gap, one side of the first copper layer and one side of the base material extend toward the substrate and cover the second gap, the first copper layer and the base material disposed on the substrate form the concave portion, and the optical fingerprint chip is electrically connected to the concave portion through the conductive wire.
5. The optical fingerprint module of claim 4 wherein the recess has a pad disposed thereon, the pad being disposed adjacent to the mounting hole, the optical fingerprint chip being electrically connected to the pad through the conductive line.
6. The optical fingerprint module of any one of claims 1 to 5 further comprising a cover plate, wherein the cover plate is fixed on the circuit board and disposed around the optical fingerprint chip, and the cover plate is a black cover plate.
7. The optical fingerprint module of claim 6 wherein the cover plate is a steel plate, and the surface of the steel plate is treated with black; or the cover plate is made of black flexible material.
8. The optical fingerprint module of claim 6 further comprising a sealant, wherein a gap is formed between the cover plate and the circuit board and between the optical fingerprint chip, the sealant is filled in the gap, the sealant wraps the wires and covers the concave portion and the edge of the optical fingerprint chip, and the cover plate is flush with the sealant.
9. The optical fingerprint module of claim 1 wherein a side of the optical fingerprint chip away from the substrate is provided with a microlens.
10. An electronic device comprising the optical fingerprint module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922017402.3U CN210776724U (en) | 2019-11-20 | 2019-11-20 | Optical fingerprint module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922017402.3U CN210776724U (en) | 2019-11-20 | 2019-11-20 | Optical fingerprint module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN210776724U true CN210776724U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922017402.3U Active CN210776724U (en) | 2019-11-20 | 2019-11-20 | Optical fingerprint module and electronic equipment |
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| CN (1) | CN210776724U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112183340A (en) * | 2020-09-28 | 2021-01-05 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
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2019
- 2019-11-20 CN CN201922017402.3U patent/CN210776724U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112183340A (en) * | 2020-09-28 | 2021-01-05 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
| CN112183340B (en) * | 2020-09-28 | 2024-04-26 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
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Effective date of registration: 20201208 Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshanqiu titanium biometric technology Co., Ltd Address before: 215300 No. 3 Rainbow Road, Kunshan hi tech Industrial Development Zone, Jiangsu, Suzhou Patentee before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |