CN216054687U - Electric connection wire with chip - Google Patents
Electric connection wire with chip Download PDFInfo
- Publication number
- CN216054687U CN216054687U CN202122446526.0U CN202122446526U CN216054687U CN 216054687 U CN216054687 U CN 216054687U CN 202122446526 U CN202122446526 U CN 202122446526U CN 216054687 U CN216054687 U CN 216054687U
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- chip
- thin film
- flexible circuit
- circuit board
- connection wire
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Abstract
An electric connection wire with a chip comprises a flexible circuit board, a chip and a glass carrier plate, wherein the glass carrier plate is provided with a thin film circuit; one end part of the flexible circuit board is adhered to the glass carrier plate to form electric connection with the thin film circuit; the chip is also pasted on the glass carrier plate and is electrically connected with the thin film circuit. The chip of the electric connection wire does not need to be subjected to ball planting treatment, the volume of the chip can be reduced, and the cost is lower.
Description
Technical Field
The utility model relates to an electrical connection line, in particular to an electrical connection line with a chip.
Background
The electric connection wire with the chip generally adopts a flexible circuit board, the chip is welded on the flexible circuit board, and an input electric signal can be processed by the chip and then output, so that the electric connection wire can bear certain electric signal processing function, and an electric appliance using the electric connection wire can have more reasonable internal device arrangement.
However, in order to solder the chip of the electrical connection wire to the flexible circuit board, the leads of the chip are generally processed by a ball-mounting process, which requires the leads to have a larger pitch, so that the volume of the chip is difficult to be reduced, and the cost of the chip is increased.
Disclosure of Invention
The utility model aims to provide an electric connection wire with a chip, the chip does not need to be subjected to ball mounting treatment, the volume of the chip can be reduced, the cost is lower, and the adopted design scheme is as follows:
an electrical connection wire with a chip comprising a flexible circuit board and a chip, characterized in that:
the glass substrate is provided with a thin film circuit; one end part of the flexible circuit board is adhered to the glass carrier plate to form electric connection with the thin film circuit; the chip is also pasted on the glass carrier plate and is electrically connected with the thin film circuit.
Preferably, the flexible circuit board and the chip may be adhered on a glass carrier by an Anisotropic Conductive Film (ACF) to form an electrical connection with the thin film circuit. The ACF is adhesive paper with conductive balls (such as gold balls), the flexible circuit board and the chip are adhered on the glass carrier plate through the ACF, and the flexible circuit board and the chip can be connected with the thin film circuit on the glass carrier plate through the conductive balls on the ACF, so that welding is replaced, the chip does not need to be processed by a ball planting process, the space between pins of the chip and the volume of the chip are reduced, and the cost is lower.
Preferably, the glass carrier is a single-layer glass substrate, and has a thickness of 0.5 mm-2.0 mm.
Preferably, the thin film circuit is a patterned conductive thin film that is lithographically.
Preferably, the glass carrier plate is formed by bonding a first glass substrate and a second glass substrate, the thin film circuit is arranged on the inner side surface of the first glass substrate (namely, the side bonded with the second glass substrate), the first glass substrate is provided with a protruding edge area relative to the second glass substrate, the flexible circuit board and the chip are bonded on the edge area, so that the thin film circuit on the glass carrier plate can be covered and protected by the second glass substrate, and when the flexible circuit board and the chip are bonded, the second glass substrate can be used for holding or adsorbing a machine without damaging the thin film circuit on the first glass substrate. Preferably, the edge region is also covered with a sealing compound, thereby protecting the thin-film circuit thereon.
Preferably, the flexible circuit boards include a first flexible circuit board and a second flexible circuit board, and end portions of the first flexible circuit board and the second flexible circuit board are respectively adhered to two sides of the glass carrier plate, so that the first flexible circuit board and the second flexible circuit board can be generally used as an input line and an output line of an electric connection line respectively, and the structure is more reasonable.
Compared with the existing electric connection wire with the chip, the chip can be a bare chip IC, and the pins of the chip do not need to be subjected to ball mounting treatment, so that the pin spacing and the volume of the chip are reduced, and the cost is lower.
The technical solution of the present invention is further explained by the accompanying drawings and the detailed description.
Drawings
FIG. 1 is a schematic structural diagram of an electrical connection wire according to a first embodiment;
fig. 2 is a schematic structural diagram of an electrical connection wire according to a second embodiment.
Detailed Description
Example one
The electrical connection line with chip 100 includes a first flexible circuit board 10, a second flexible circuit board 20, a glass carrier 30 and a chip 40.
The glass carrier 30 is a single-layer glass substrate having a thickness of 0.5 mm-2.0 mm, and has a thin film circuit 50 formed on one surface thereof, and the thin film circuit 50 is a magnetron sputtering conductive thin film (e.g., a conductive oxide thin film such as silver, aluminum film metal or alloy film or ITO) patterned by photolithography.
The ends of the first flexible circuit board 20 and the second flexible circuit board 30 are respectively adhered to two sides of the glass carrier 30 by an anisotropic conductive adhesive (not shown) to form an electrical connection with the thin film circuit 50.
The chip 40 is a bare chip IC, the leads of which do not need to be subjected to ball mounting, and the chip 40 is attached to the glass carrier 30 by anisotropic conductive adhesive to form an electrical connection with the thin film circuit 50.
Example two
On the basis of the first embodiment, the glass carrier 30 is formed by bonding a first glass substrate 31 and a second glass substrate 32, the thin film circuit 50 is disposed on the inner side surface of the first glass substrate 31 (i.e. the surface bonded to the second glass substrate 32), the first glass substrate 31 has a protruding edge area 33 relative to the second glass substrate 32, and the first and second flexible circuit boards 10 and 20 and the chip 40 are bonded on the edge area 33, so that a part of the thin film circuit 50 can be covered and protected by the second glass substrate 32, and when the first and second flexible circuit boards 10 and 20 and the chip 40 are bonded, the second glass substrate 32 can be used for holding or adsorbing by a machine without damaging the thin film circuit 50 on the first glass substrate 31.
The edge region 33 is also covered with a sealant 60, which also protects the thin-film circuit 50.
In addition, it should be noted that the names of the parts and the like of the embodiments described in the present specification may be different, and the equivalent or simple change of the structure, the characteristics and the principle described in the present patent idea is included in the protection scope of the present patent. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the utility model as defined in the accompanying claims.
Claims (8)
1. An electrical connection wire with a chip comprising a flexible circuit board and a chip, characterized in that:
the glass substrate is provided with a thin film circuit; one end part of the flexible circuit board is adhered to the glass carrier plate to form electric connection with the thin film circuit; the chip is also pasted on the glass carrier plate and is electrically connected with the thin film circuit.
2. An electrical connection wire as claimed in claim 1, wherein: the flexible circuit board and the chip are pasted on the glass carrier plate through anisotropic conductive glue so as to form electric connection with the thin film circuit.
3. An electrical connection wire as claimed in claim 1, wherein: the glass carrier plate is a single-layer glass substrate.
4. An electrical connection wire as claimed in claim 3, wherein: the thickness of the glass carrier plate is 0.5 mm-2.0 mm.
5. An electrical connection wire as claimed in claim 1, wherein: the glass carrier plate is formed by bonding a first glass substrate and a second glass substrate, the thin film circuit is arranged on the inner side surface of the first glass substrate, the first glass substrate is provided with a protruding edge area relative to the second glass substrate, and the flexible circuit board and the chip are adhered to the edge area.
6. An electrical connection wire as in claim 5 wherein: the edge area is also covered with a sealant.
7. An electrical connection wire as claimed in claim 1, wherein: the thin film circuit is a patterned conductive thin film that is subjected to photolithography.
8. An electrical connection wire as claimed in claim 1, wherein: the flexible circuit boards comprise a first flexible circuit board and a second flexible circuit board, and end parts of the first flexible circuit board and the second flexible circuit board are respectively adhered to two sides of the glass carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122446526.0U CN216054687U (en) | 2021-10-12 | 2021-10-12 | Electric connection wire with chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122446526.0U CN216054687U (en) | 2021-10-12 | 2021-10-12 | Electric connection wire with chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216054687U true CN216054687U (en) | 2022-03-15 |
Family
ID=80548470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122446526.0U Active CN216054687U (en) | 2021-10-12 | 2021-10-12 | Electric connection wire with chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216054687U (en) |
-
2021
- 2021-10-12 CN CN202122446526.0U patent/CN216054687U/en active Active
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